TWI627886B - 一種超薄金屬層的印刷線路板的製備方法 - Google Patents
一種超薄金屬層的印刷線路板的製備方法 Download PDFInfo
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Abstract
本發明公開了一種超薄金屬層的印刷線路板的製備方法,該方法利用鹼性的脂肪胺類的氣體和經硫酸銅溶液鼓泡的氮氣進行真空電容耦合放電產生低溫等離子體,對聚醯亞胺薄膜和玻璃纖維布塗布的環氧樹脂板進行刻蝕與接枝活性基團的表面處理,增加表面粗糙度和化學活性,然後直接進行濺射鍍或化學鍍銅膜,再進行電鍍加厚到所需要的銅膜厚度。本發明的方法不僅不需要粘接劑(無膠),而且剝離強度高,可以實現超薄金屬層的軟、硬印刷線路板、多層板和軟硬複合板等的製作。
Description
本發明屬於微電子基材的設計和製作技術領域,具體涉及一種超薄金屬層軟板及硬板基材的製備工藝以及單面、雙面、多層、軟式印刷電路板、軟硬複合板及多層高密度互連印刷電路板盲孔、埋孔和填孔的工藝方法。
按,印刷線路板(PCB-Printed Circuit Board)是電子元器件電氣連接的載體。印刷線路板分為硬質印刷電路板( RPC-Rigid Printed Circuits)、軟式印刷電路板(FPC-Flexible Printed Circuits)和軟硬複合板(RFPC-Rigid-Flex Printed Circuits)。印刷線路板層面構造上可分成單面板、雙面板和多層板(3 層以上)。硬質印刷電路板具有耐熱制程不變形的特點,具有更好的平整度;軟式印刷電路板具有高曲折性的優點;軟硬複合板兼備硬板及軟板的功能與特性,大量應用於通信控制模組(CCM)、攝像模組,如筆電、平板電腦、智慧型手機、可穿戴式電子手環等。單面板因為高曲折性和低成本的特點而被廣泛應用在硬碟驅動器 (HDD)及光學讀取頭等地方。雙面板的電路設計比單面板的電路更為複雜,其厚度也略為增加。3 層以上的多層板由於層面數增加,其電路設計擁有較多彈性。
現今的電子產品如液晶顯示幕(LCD)、等離子體顯示幕(PDP),貼裝裸露晶片(COF)的基板等都要求線路的細線化、高密度化、高尺寸安定、耐高溫及可靠性。在電子產品逐漸走向輕薄短小的趨勢發展下,要求印刷電路板具有更薄的金屬層和介質層。超薄無膠電路板將成為市場的主流,逐步取代三層(介質層/接著劑/銅箔)有膠基材。超薄(<5 微米)意味著需要更薄的銅箔,但目前工業中能做到最薄的銅箔是12 微米左右,難以實現超薄。另外一個原因是銅箔太薄導致其力學強度低,覆銅困難。實現無膠超薄的方法是在介質層上直接化學(或濺射)鍍銅膜。但因介質層(聚醯亞胺、環氧樹脂等)表面光滑和親水性差(表面能低),沉積的銅膜容易從介質層上脫落,必須設法對介質層表面進行改性處理,使介質層與沉積的銅膜有較好的結合力,其剝離強度要高於7N/cm(行業標準)。
近十幾年來國際上積極開展超薄無膠軟式印刷電路板介質材料聚醯亞胺膜(PI)的表面改性處理的研究,主要處理方法有:酸鹼處理,等離子體處理,離子束處理和表面接枝法。
1988 年Ruoff 等利用反應性氧離子束蝕刻PI 薄膜,考察了調整不同能量、離子流密度和蝕刻時間等因素來提高其與銅的粘接性能(Improvement of adhesion of copper on polyimide by reactive ion-beam etching [J]. IBM Journal of Research and Development,1988, 32:5),其在最優條件下處理後的粘接強度為6.9N/cm。相比較未處理的PI 薄膜,雖然提高了近25 倍,但也未達到使用標準。2006年Ju Hi Hong 等利用PSII(Plasma source ion implantation)技術在PI 膜表面沉積Cu 膜,結果表明Cu 膜和聚醯亞胺膜層的結合力也有大幅提高,但也未能滿足使用要求(Improvement of adhesion properties for Cu films on the polyimide by plasma source ion implantation[J]. Surface & Coatings Technology. 2006, 201:197)。專利文獻CN101684554A 公開了一種聚醯亞胺薄膜的化學鍍銅液及其表面化學鍍銅的方法,其也未提及到聚醯亞胺薄膜與銅膜的結合力這一關鍵問題,未能突破超薄無膠印刷電路板基材製造的技術瓶頸。專利文獻CN 102196904 A 公開了疊層體及其製造方法,該專利文獻是通過電離放射線照射對含熱塑性環狀烯烴樹脂的樹脂膜的表面的進行部分改性。
有鑑於此,吾等發明人乃潛心進一步研究,並著手進行研發及改良,期以一較佳發明以解決上述問題,且在經過不斷試驗及修改後而有本發明之問世。
爰是,本發明基於介質層材料表面光滑、表面能低的性質,根據結合力的種類及機理,提供了一種等離子體技術實現超薄金屬層印刷線路板製備的方法。
影響印刷電路板的介質層與金屬層的剝離強度的關鍵因素是介質表面的粗糙度和表面的化學活性,本發明基於此提供了一種超薄金屬層的印刷線路板的製備方法。
本發明的製備方法首先對介質層進行等離子體表面改性處理,然後進行化學鍍(也稱化學沉銅)或真空濺射鍍,鍍上緻密的厚度100奈米以下的銅膜,最後對銅膜進行電鍍加厚到所需要的銅膜厚度,其可以用於製造剝離強度高的超薄金屬層印刷電路板基材。
本發明提供的方法具體包括:
(1)於真空電容耦合放電等離子體的腔室中放置待刻蝕的材料,分別利用第一等離子體和第二等離子體對待刻蝕的材料表面進行改性處理;所述第一等離子體為氣態脂肪胺經真空電容耦合放電而產生,所述第二等離子體為經硫酸銅溶液鼓泡後的氮氣氣體經真空電容耦合放電而產生。所述改性處理為在待處理材料的表面接枝氨基、羥基和/或磺酸根;
(2)通過化學沉積銅或濺射沉積銅在刻蝕後的材料的表面選擇性或全部的形成銅膜。
較佳者,所述方法進一步包括如下步驟:
(3)通過電鍍的方式加厚步驟(2)得到的銅膜,或選擇性的保護步驟(2)得到的銅膜,並通過電鍍的方式加厚未被保護而露出的銅膜。具體的厚度依據產品而決定。
較佳者,所述第一等離子體和第二等離子體對待刻蝕的材料表面進行改性處理時,真空電容耦合放電的氣壓範圍為30-80Pa。
較佳者,所述脂肪胺為碳原子數低於7 的甲胺、伯胺或仲胺,此類型脂肪胺一般為氣態脂肪胺,所述第一等離子體處理的時間為5-20s。
較佳者,所述硫酸銅溶液中硫酸銅和水的比例大於1:2,所述第二等離子體的處理時間為10-30s。
較佳者,所述待刻蝕的材料表面為聚醯亞胺(PI)材質或環氧樹脂材質(PP)。所述聚醯亞胺材質可以是聚醯亞胺薄膜或聚醯亞胺保護膠層,所述環氧樹脂材質可以是玻璃纖維布塗布環氧樹脂板。
當處理的材料為玻璃纖維布塗布環氧樹脂板或者聚醯亞胺(PI)薄膜時,在對其表面處理後進行化學沉銅和電鍍加厚,可以分別得到超薄金屬層的印刷電路板的硬板基材和軟板基材,用於製備單面、雙面印刷電路板、多層電路板、軟硬複合板和多層高密度互連印刷電路板,並應用到盲孔、埋孔以及填孔等工藝中。
本發明的一個典型實施例中包括了如下的處理方式:
將印刷電路板基材的介質材料,聚醯亞胺(PI)薄膜或玻璃纖維織物塗布環氧樹脂板(PP)置於真空電容耦合放電等離子體的腔室中,利用具有鹼性的含氨基化學基團的脂肪胺類的氣態物質和經硫酸銅溶液鼓泡後的氮氣氣體分別進行真空電容耦合放電產生等離子體,對介質層表面同時進行物理與化學刻蝕及表面接枝氨基、羥基、磺酸根等活性基團的改性處理。
將處理後的介質材料進行化學沉銅或濺射鍍銅。
電鍍加厚到所需要的金屬銅層厚度。完成超薄金屬層印刷電路板基材的製備。
利用超薄金屬層印刷電路板基材製備印刷電路板基板。基板覆介質層,進行步驟(1)、(2)的處理,進行增層法製備多層板、軟硬複合板。利用步驟(1)、(2)進行盲孔、埋孔、填孔、選鍍的流程。
本發明的方法既適用於以聚醯亞胺薄膜為介質的柔性印刷電路板(簡稱軟板)基材的製備,也適用於以環氧樹脂為介質的硬質電路板(簡稱硬板)基材的製備,同時該技術還可應用於多層印刷電路板增層法製備多層板、軟硬複合板的工藝中,免去了覆銅箔的工藝。本發明在電解電鍍銅層厚度上可實現自由控制,實現超薄金屬層的印刷電路板的製備,在高密度線路應用上更具優勢,且節省銅箔和油墨的使用,本發明能有效的降低成本進而提升產品的競爭力。
如下為本發明的實施例,其僅用作對本發明的解釋而並非限制。
方案一
請參閱第1圖所示,本發明採用如下方法製備PI 基底的印刷電路板單面或雙面基材:
(1)將聚醯亞胺(PI)薄膜卷安裝到低真空等離子體發生器的等離子體腔體11中的收卷裝置中,抽真空低於20Pa 後通入脂肪胺類的氣體(如甲胺、乙胺、伯胺、仲胺等),放電產生等離子體對聚醯亞胺薄膜12進行刻蝕與接枝處理,控制收卷機轉速,保證聚醯亞胺薄膜12經過等離子體放電區的處理時間5~20s。利用等離子體刻蝕作用提高聚醯亞胺薄膜12表面的粗糙度,同時在聚醯亞胺薄膜12表面接枝上氨基NH2
。
(2)停止氣體脂肪胺供給,繼續抽氣到真空度低於20Pa,注入經硫酸銅溶液(硫酸銅:去離子水≧1:2)鼓泡的氮氣進行等離子體放電處理10~30s。停機進空氣,取出聚醯亞胺薄膜12。
(3)通過化學沉銅或濺射沉銅在基體表面形成銅膜使之導電,滿足電鍍條件。
(4)電鍍加厚銅膜,完成柔性印刷電路板單面或雙面基材的製備。
(5)印刷電路板的製作。
續請參閱第2圖所示,本發明採用如下方法製備PP基底印刷電路板單面或雙面基材:
將玻璃纖維織物塗布環氧樹脂(PP)板22材懸掛安裝到低真空等離子體腔體21中的正電極23及負電極24之間,按方案一中的步驟製備PP 基底的印刷電路板單面或雙面基材。
實施例一:參見第3圖,本實施例主要涉及兩層軟板選鍍方法,其具體包括:
A、製備由聚醯亞胺(PI)薄膜31和雙面電鍍銅膜32構成的雙層軟板基材;
B、雷射或機械鑽通孔33;
C、曝光顯影刻蝕線路34;
D、等離子體強化除膠、刻蝕增加粗糙度及PI表面活性基團後進行化學沉積銅35;
E、壓合乾膜36、曝光顯影;
F、選擇性只在通孔33處實施電鍍;
G、微蝕/化學銅38,進下一製程。
選鍍的目的是導通孔鍍銅37,軟板基材上不鍍銅,使軟板區更耐撓折。
實施例二:參見第4圖,本實施例主要涉及增層法製備四層柔性印刷線路板(FPCB)。
A、製備由聚醯亞胺(PI)薄膜41和雙面電鍍銅膜42構成的雙層軟板基材;
B、曝光顯影印刷雙層線路並刻蝕,形成刻蝕線槽43;
C、壓合保護膠片(cover layer)44,不覆銅箔加熱真空壓合;
D、鑽通孔45並清除通孔45膠渣,等離子體刻蝕增加表面粗糙度及活性基團;
E、化學鍍沉銅,形成化學沉積膜46;
F、電鍍加厚銅層,以形成電鍍銅膜47;
G、曝光顯影印刷線路並刻蝕形成刻蝕線槽48,完成四層柔性印刷電路板的製作,進入檢測製程。
實施例三:參見第5圖,該實施例為通過增層法製備四層硬質印刷線路板(RPC-Rigid Printed)的方法。
A 製備由玻璃纖維織物塗布環氧樹脂(PP)為介質之玻璃纖維布塗布環氧樹脂板51和雙面電鍍銅膜52構成的雙層硬板基材;
B、曝光顯影印刷雙層線路並刻蝕形成刻蝕線槽53;
C、不覆銅箔加熱真空壓合玻璃纖維布塗布的環氧樹脂(PP)54;
D、鑽通孔55並清除通孔55膠渣,等離子體刻蝕增加表面粗糙度及活性基團;
E、通過化學鍍沉銅的方式形成化學沉積銅膜56;
F、電鍍加厚前一步驟得到的銅膜,以形成電鍍銅模57;
G、曝光顯影印刷線路並刻蝕形成刻蝕線槽58,完成四層硬質印刷電路板的製作,進入檢測製程。
實施例四:參見第6圖,該實施例為增層法製備軟硬複合印刷電路板及選鍍的方法。
A、利用本發明技術方案一製備的由聚醯亞胺(PI)薄膜60和雙面電鍍銅膜61構成的雙層軟板基材(統稱雙面銅箔基板CCL — Copper Clad Laminate);
B、曝光顯影線路刻蝕形成刻蝕槽62;
C、不用銅箔高溫真空直接壓合保護膠片(CL—Cover Layer)64和玻璃纖維布塗布環氧樹脂(PP—Prepreg)63;
D、雷射或機械鑽通孔65;
E、對通孔進行等離子體強化除膠渣、增加粗糙度、PI 表面接枝活性基團後形成表面沉銅66;
F、電鍍加厚銅層形成電鍍銅模67;
G、壓合乾膜68;
H、曝光、顯影,暴露刻蝕面69;
I、刻蝕、去膜形成刻蝕線槽70,完成軟硬複合印刷電路板的製作,進入檢測製程。
實施例五:參見第7圖,本實施例主要涉及增層法製備軟硬高密度板(HDI—High Density Interconnection)及選鍍新方法。
A、利用本發明技術方案一製備的由聚醯亞胺(PI)薄膜71和雙面電鍍銅膜72構成的雙層軟板基材;
B、將刻槽73曝光顯影刻蝕線路;
C、不用銅箔,高溫高壓真空壓合保護膠片74和環氧樹脂(PP)75;
D、雷射鑽盲孔76;
E、機械鑽通孔77;
F、等離子體強化除膠渣、增加粗糙度及表面接枝活性基團後進行化學沉銅,形成表面沉銅78;
G、電鍍填盲孔76 及加厚銅層形成電鍍銅模79;
H、貼乾膜80;
I、曝光顯影暴露刻蝕面81:
J、刻蝕去膜形成刻蝕線槽82,完成軟硬高密度板的製作,進入檢測製程。
採用本發明的方法可生產超薄聚醯亞胺(PI)無膠柔性印刷線路板(FPCB)基材和超薄金屬層無膠硬質印刷電路板(RPC-Rigid Printed Circuits)基材,其也可以同時在增層法製備多層印刷電路板及盲孔、埋孔和選鍍工藝中得到應用,得到的增層的電鍍銅層薄,可用於生產更細的線路。
綜上所述,本發明所揭露之技術手段確能有效解決習知等問題,並達致預期之目的與功效,且申請前未見諸於刊物、未曾公開使用且具長遠進步性,誠屬專利法所稱之發明無誤,爰依法提出申請,懇祈 鈞上惠予詳審並賜准發明專利,至感德馨。
惟以上所述者,僅為本發明之數種較佳實施例,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明書內容所作之等效變化與修飾,皆應仍屬本發明專利涵蓋之範圍內。
11‧‧‧等離子體腔體
12‧‧‧聚醯亞胺薄膜
13‧‧‧放卷
14‧‧‧收卷
15‧‧‧陽電極
16‧‧‧陰電極
21‧‧‧等離子體腔體
22‧‧‧環氧樹脂板
23‧‧‧正電極
24‧‧‧負電極
31‧‧‧聚醯亞胺薄膜
32‧‧‧銅膜
33‧‧‧通孔
34‧‧‧刻蝕線路
35‧‧‧化學沉積銅
36‧‧‧壓合乾膜
37‧‧‧通孔鍍銅
38‧‧‧微蝕/化學銅
41‧‧‧聚醯亞胺薄膜
42‧‧‧銅膜
43‧‧‧刻蝕線槽
44‧‧‧膠片
45‧‧‧通孔
46‧‧‧化學沉積膜
47‧‧‧電鍍銅膜
48‧‧‧刻蝕線槽
51‧‧‧玻璃纖維布塗布環氧樹脂板
52‧‧‧雙面電鍍銅膜
53‧‧‧刻蝕線槽
54‧‧‧環氧樹脂
55‧‧‧通孔
56‧‧‧化學沉積銅膜
57‧‧‧電鍍銅膜
58‧‧‧刻蝕線槽
60‧‧‧聚醯亞胺膜
61‧‧‧電鍍銅膜
62‧‧‧刻蝕槽
63‧‧‧環氧樹脂
64‧‧‧膠片
65‧‧‧通孔
66‧‧‧表面沉銅
67‧‧‧電鍍銅膜
68‧‧‧乾膜
69‧‧‧刻蝕面
70‧‧‧刻蝕線槽
71‧‧‧聚醯亞胺薄膜
72‧‧‧雙面電鍍銅膜
73‧‧‧刻槽
74‧‧‧膠片
75‧‧‧環氧樹脂
76‧‧‧盲孔
77‧‧‧通孔
78‧‧‧表面沉銅
79‧‧‧電鍍銅膜
80‧‧‧乾膜
81‧‧‧刻蝕面
82‧‧‧刻蝕線槽
第1圖係本發明的PI 薄膜處理的技術方案示意圖。 第2圖係本發明同時處理多個PP 膜的技術方案示意圖。 第3圖係兩層軟板選鍍新工藝示意圖。 第4圖係增層法製備四層柔性印刷線路板(FPCB)的示意圖。 第5圖係增層法製備四層硬質印刷電路板的示意圖。 第6圖係增層法製備軟硬複合印刷電路板及選鍍新工藝示意圖。 第7圖係軟硬高密度板(HDI—High Density Interconnection)製備及選鍍新工藝。
Claims (7)
- 一種超薄金屬層的印刷線路板的製備方法,其步驟包含: (1)於真空電容耦合放電等離子體的腔室中放置待刻蝕的材料,分別利用第一等離子體和第二等離子體對待刻蝕的材料表面進行改性處理後得到刻蝕後的材料;所述第一等離子體為氣態脂肪胺經真空電容耦合放電而產生,所述第二等離子體為經硫酸銅溶液鼓泡後的氮氣經真空電容耦合放電而產生;所述改性處理為在待處理材料的表面進行刻蝕及接枝氨基、羥基和/或磺酸根等活性基團; (2)通過化學沉積銅或濺射沉積銅在刻蝕後的材料的表面全部或局部形成銅膜。
- 如申請專利範圍第1項所述之一種超薄金屬層的印刷線路板的製備方法,其特徵在於,該方法進一步包括如下步驟: (3)通過電鍍的方式加厚步驟(2)得到的銅膜,或選擇性的保護步驟(2)得到的銅膜,並通過電鍍的方式加厚未被保護的銅膜。
- 如申請專利範圍第2項所述之一種超薄金屬層的印刷線路板的製備方法,其特徵在於,所述步驟(3)的具體過程為:通過向步驟(2)中得到的銅膜上壓合保護膠片,僅使部分銅膜露出,通過電鍍的方式加厚未被保護的銅膜。
- 如申請專利範圍第1或2項所述之一種超薄金屬層的印刷線路板的製備方法,其特徵在於,第一等離子體和第二等離子體對待刻蝕的材料表面進行改性處理時,真空電容耦合放電的氣壓範圍為30-80Pa。
- 如申請專利範圍第1或2項所述之一種超薄金屬層的印刷線路板的製備方法,其特徵在於,所述脂肪胺為碳原子數低於7 的甲胺、伯胺或仲胺,所述第一等離子體處理的時間為5-20s。
- 如申請專利範圍第1或2項所述之一種超薄金屬層的印刷線路板的製備方法,其特徵在於,所述硫酸銅溶液中硫酸銅和水的比例大於1:2,所述第二等離子體的處理時間為10-30s。
- 如申請專利範圍第1或2項所述之一種超薄金屬層的印刷線路板的製備方法,其特徵在於,所述待刻蝕的材料表面為聚醯亞胺材質或環氧樹脂材質。
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US20180124923A1 (en) | 2018-05-03 |
KR102034363B1 (ko) | 2019-10-18 |
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EP3288352A4 (en) | 2019-03-13 |
CN107371338A (zh) | 2017-11-21 |
US10187999B2 (en) | 2019-01-22 |
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