TWI621209B - 卡盤裝置 - Google Patents

卡盤裝置 Download PDF

Info

Publication number
TWI621209B
TWI621209B TW103111409A TW103111409A TWI621209B TW I621209 B TWI621209 B TW I621209B TW 103111409 A TW103111409 A TW 103111409A TW 103111409 A TW103111409 A TW 103111409A TW I621209 B TWI621209 B TW I621209B
Authority
TW
Taiwan
Prior art keywords
workpiece
chuck
layer
chuck device
attached
Prior art date
Application number
TW103111409A
Other languages
English (en)
Chinese (zh)
Other versions
TW201503284A (zh
Inventor
鈴木隆太
辰巳良昭
Original Assignee
創意科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 創意科技股份有限公司 filed Critical 創意科技股份有限公司
Publication of TW201503284A publication Critical patent/TW201503284A/zh
Application granted granted Critical
Publication of TWI621209B publication Critical patent/TWI621209B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
TW103111409A 2013-03-29 2014-03-27 卡盤裝置 TWI621209B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013071679 2013-03-29
JP2013-071679 2013-03-29

Publications (2)

Publication Number Publication Date
TW201503284A TW201503284A (zh) 2015-01-16
TWI621209B true TWI621209B (zh) 2018-04-11

Family

ID=51623991

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103111409A TWI621209B (zh) 2013-03-29 2014-03-27 卡盤裝置

Country Status (3)

Country Link
JP (1) JP6281825B2 (ja)
TW (1) TWI621209B (ja)
WO (1) WO2014157014A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6132957B2 (ja) * 2015-10-13 2017-05-24 ヤス カンパニー リミテッド 帯電処理による基板チャッキング方法及びシステム
US11597672B2 (en) 2016-03-09 2023-03-07 Corning Incorporated Cold forming of complexly curved glass articles
EP3475237A1 (en) 2016-06-28 2019-05-01 Corning Incorporated Laminating thin strengthened glass to curved molded plastic surface for decorative and display cover application
KR102434980B1 (ko) 2016-07-05 2022-08-22 코닝 인코포레이티드 냉간-형성 유리 물품 및 그의 조립 방법
US10186446B2 (en) * 2016-09-30 2019-01-22 Axcelis Technology, Inc. Adjustable circumference electrostatic clamp
US9911636B1 (en) 2016-09-30 2018-03-06 Axcelis Technologies, Inc. Multiple diameter in-vacuum wafer handling
US11384001B2 (en) 2016-10-25 2022-07-12 Corning Incorporated Cold-form glass lamination to a display
JP2018078132A (ja) * 2016-11-07 2018-05-17 信越ポリマー株式会社 精密部品用の保持治具及びその製造方法
TWI771357B (zh) 2017-01-03 2022-07-21 美商康寧公司 具有彎曲的覆蓋玻璃以及顯示器或觸控面板的車輛內部系統及其形成方法
US11016590B2 (en) 2017-01-03 2021-05-25 Corning Incorporated Vehicle interior systems having a curved cover glass and display or touch panel and methods for forming the same
US11685684B2 (en) 2017-05-15 2023-06-27 Corning Incorporated Contoured glass articles and methods of making the same
EP3655282B1 (en) 2017-07-18 2023-02-15 Corning Incorporated Vehicle interior system comprising a cold formed complexly curved glass article
KR102564868B1 (ko) 2017-09-12 2023-08-09 코닝 인코포레이티드 장식용 유리 상에 터치 패널을 포함하는 디스플레이용 데드프론트 및 관련 방법
TWI806897B (zh) 2017-09-13 2023-07-01 美商康寧公司 用於顯示器的基於光導器的無電面板、相關的方法及載具內部系統
US11065960B2 (en) 2017-09-13 2021-07-20 Corning Incorporated Curved vehicle displays
CN117341302A (zh) 2017-10-10 2024-01-05 康宁股份有限公司 具有改进的可靠性的弯曲覆盖玻璃的交通工具内部***及其形成方法
CN111758063B (zh) 2017-11-21 2022-08-09 康宁公司 用于抬头显示器***的非球面镜及其形成方法
CN111656254B (zh) 2017-11-30 2023-06-02 康宁公司 用于真空成形非球面镜的***与方法
JP7274480B2 (ja) 2017-11-30 2023-05-16 コーニング インコーポレイテッド 曲面ミラーを成形する真空成形装置、システム及び方法
JP7078407B2 (ja) * 2018-01-24 2022-05-31 株式会社アルバック 粘着式基板保持装置
JP7361705B2 (ja) 2018-03-13 2023-10-16 コーニング インコーポレイテッド 亀裂抵抗性の湾曲したカバーガラスを有する乗物内装システムおよびその形成方法
EP3823825A1 (en) 2018-07-16 2021-05-26 Corning Incorporated Vehicle interior systems having a cold-bent glass substrate and methods for forming the same
KR102636428B1 (ko) * 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치를 세정하는 방법
EP3771695A1 (en) * 2019-07-31 2021-02-03 Corning Incorporated Method and system for cold-forming glass
JP7390889B2 (ja) * 2019-12-26 2023-12-04 エイブリック株式会社 吸着保持装置
US11772361B2 (en) 2020-04-02 2023-10-03 Corning Incorporated Curved glass constructions and methods for forming same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162422A (ja) * 1990-10-24 1992-06-05 Fujitsu Ltd 半導体装置の製造装置
JP2001291763A (ja) * 2000-04-06 2001-10-19 Nec Corp 静電チャック及び静電チャックにおける被吸着物離脱方法
JP2003520416A (ja) * 1998-11-10 2003-07-02 セムコ エンジニアリング エス．アー． 静電保持装置
JP2007121474A (ja) * 2005-10-26 2007-05-17 Hitachi Plant Technologies Ltd 基板貼合装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0663943B2 (ja) * 1986-09-29 1994-08-22 株式会社島津製作所 試料台
JP4671817B2 (ja) * 2005-09-08 2011-04-20 信越ポリマー株式会社 部品保持具
JP4126084B1 (ja) * 2007-07-23 2008-07-30 信越エンジニアリング株式会社 静電チャックの表面電位制御方法
JP2013033850A (ja) * 2011-08-02 2013-02-14 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162422A (ja) * 1990-10-24 1992-06-05 Fujitsu Ltd 半導体装置の製造装置
JP2003520416A (ja) * 1998-11-10 2003-07-02 セムコ エンジニアリング エス．アー． 静電保持装置
JP2001291763A (ja) * 2000-04-06 2001-10-19 Nec Corp 静電チャック及び静電チャックにおける被吸着物離脱方法
JP2007121474A (ja) * 2005-10-26 2007-05-17 Hitachi Plant Technologies Ltd 基板貼合装置

Also Published As

Publication number Publication date
WO2014157014A1 (ja) 2014-10-02
JP6281825B2 (ja) 2018-02-21
JPWO2014157014A1 (ja) 2017-02-16
TW201503284A (zh) 2015-01-16

Similar Documents

Publication Publication Date Title
TWI621209B (zh) 卡盤裝置
KR20160018401A (ko) 점착 테이프 박리 방법 및 점착 테이프 박리 장치
JP6730879B2 (ja) 剥離方法及び剥離装置
JP2015204362A (ja) チップ間隔維持方法
KR102365660B1 (ko) 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
TW200414336A (en) Adhesive sheet expansion method and device
KR102549278B1 (ko) 디바이스 칩의 제조 방법 및 픽업 장치
KR20180121365A (ko) 웨이퍼의 가공 방법
JP2018186217A5 (ja)
JP2019054209A5 (ja)
TWI663644B (zh) 磨削裝置及保護膠帶貼著方法
JP2012216606A (ja) 基板転写方法および基板転写装置
JP5203827B2 (ja) 保持装置
JP2015029088A5 (ja)
KR101569970B1 (ko) 웨이퍼 에지 연마 장치
JP2018029152A (ja) 保持テーブル
JP2009094126A (ja) チップのピックアップ方法
JP5995497B2 (ja) ウェーハ吸着装置およびウェーハ吸着方法
JP6779576B2 (ja) 粘着テープ、被加工物の加工方法、及び粘着テープ貼着装置
CN107452643B (zh) 基板压平设备与使用所述基板压平设备的半导体制造方法
TW201903874A (zh) 晶圓之加工方法
KR20130103962A (ko) 반도체 소자들을 픽업하기 위한 장치
KR101403850B1 (ko) 대면적 기판 홀딩 장치
JP7250485B2 (ja) 保持装置および保持方法
KR102361476B1 (ko) 반도체 소자들을 픽업하기 위한 장치 및 방법