TWI620638B - Resin forming mold and resin forming device - Google Patents
Resin forming mold and resin forming device Download PDFInfo
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- TWI620638B TWI620638B TW105136420A TW105136420A TWI620638B TW I620638 B TWI620638 B TW I620638B TW 105136420 A TW105136420 A TW 105136420A TW 105136420 A TW105136420 A TW 105136420A TW I620638 B TWI620638 B TW I620638B
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- ejector pin
- mold
- side end
- strain
- resin
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/7626—Measuring, controlling or regulating the ejection or removal of moulded articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
樹脂成形模具，具備頂出銷及脫模力測定機構。脫模力測定機構，具備將負載轉換為應變之應變產生體、及貼附於應變產生體之應變部位之應變計，應變產生體具有：無法相對移動地固定於樹脂成形模具之固定側端部、以與頂出銷之基端部接觸之方式設置之可動側端部、以及自固定側端部跨及可動側端部而沿與頂出銷之軸方向交叉之方向延伸之上下一對平行梁部，上下一對平行梁部分別於與固定側端部之邊界部分及與可動側端部之邊界部分形成有成為應變部位之薄壁部，應變計分別貼附於上下一對平行梁部之薄壁部。 The resin molding die is equipped with ejection pin and demoulding force measuring mechanism. The demoulding force measuring mechanism is provided with a strain generating body that converts the load into strain, and a strain gauge attached to the strain part of the strain generating body. The strain generating body has: a fixed side end portion that cannot be relatively moved and fixed to a resin molding die 、 The movable side end set in contact with the base end of the ejector pin, and from the fixed side end span and the movable side end extend in a direction crossing the axis direction of the ejector pin up and down a pair of parallel For the beam part, a pair of upper and lower parallel beam parts are respectively formed with thin-walled parts as strain parts at the boundary part with the fixed side end and the movable side end part, and the strain gauges are respectively attached to the upper and lower pair of parallel beam parts The thin-walled part.
Description
本發明係關於一種樹脂成形品之成形使用之樹脂成形模具及樹脂成形裝置。 The invention relates to a resin molding die and a resin molding device used for molding a resin molded product.
以往，作為樹脂成形品之成形使用之樹脂成形模具，廣泛使用如下構成者，即，內置有能夠自形成空腔之模面突出之頂出銷，利用該頂出銷使空腔內成形之樹脂成形品自模面脫模。此種樹脂成形模具中，若殘存樹脂等污漬附著於模面，則樹脂成形品會牢固地黏接於模面，因而藉由頂出銷使樹脂成形品脫模時之力(脫模力)會變得過大，而有引起樹脂成形品或頂出銷之破損之虞。尤其，於為將半導體元件等進行樹脂密封而成之樹脂成形品(電子零件)之情形時，可能會因過大之脫模力而導致產生龜裂進入至內部之半導體元件等重大不良。 Conventionally, as a resin molding die used for molding a resin molded product, a structure is widely used in which an ejector pin that can protrude from a mold surface forming a cavity is built in, and the resin formed in the cavity is molded by the ejector pin The molded product is released from the mold surface. In this type of resin molding die, if residual resin and other stains adhere to the mold surface, the resin molded product will firmly adhere to the mold surface, so the force when the resin molded product is demolded by the ejector pin (molding force) It may become too large and may cause damage to the resin molded product or ejection pin. In particular, in the case of a resin molded product (electronic component) in which a semiconductor element or the like is resin-sealed, the semiconductor element such as a crack that enters the inside due to excessive release force may cause significant defects.
因此，近年來，提出有如下之脫模力測定裝置(專利文獻1及2)，即，於頂出銷之基端設置水晶壓電式負載墊圈(負載單元之一形態)，藉由該水晶壓電式負載墊圈測定於樹脂成形品之脫模時賦予至頂出銷之負載，將經測定之負載之最大值視作脫模力，由此能夠測定脫模力。根據此種脫模力測定裝置，理論上而言，因容易進行脫模力是否異常之判別，故能夠容易地判斷有無發生成形異常。 Therefore, in recent years, there has been proposed a demolding force measuring device (Patent Documents 1 and 2) in which a crystal piezoelectric load washer (a form of a load unit) is provided at the base end of an ejector pin, and the crystal The piezoelectric load washer measures the load given to the ejector pin when the resin molded product is demolded, and the maximum value of the measured load is regarded as the demolding force, whereby the demolding force can be measured. According to such a mold-releasing force measuring device, in theory, since it is easy to determine whether the mold-releasing force is abnormal, it is possible to easily determine whether a molding abnormality has occurred.
[專利文獻1]日本特開2003-236898號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2003-236898
[專利文獻2]日本特開2009-96120號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2009-96120
然而，專利文獻1及2中所提出之脫模力測定裝置因使用水晶壓電式負載墊圈作為負載測定手段，故存在實現困難或缺乏通用性之問題。 However, since the mold release force measuring devices proposed in Patent Documents 1 and 2 use a crystal piezoelectric load washer as a load measuring means, there is a problem of difficulty in realization or lack of versatility.
即，為了藉由水晶壓電式負載墊圈測定賦予至頂出銷之負載，而必須於模具內之頂出銷之正下方(或正上方)，以與頂出銷同軸之方式埋設水晶壓電式負載墊圈。一般而言，於使用例如具有1mm左右之直徑之頂出銷之情形時，為了確保能耐受得住脫模時之負荷之性能，而需要使用至少具有10mm左右之直徑之水晶壓電式負載墊圈。因此，專利文獻1及2所提出之脫模力測定裝置中，係將直徑大於頂出銷之水晶壓電式負載墊圈埋設於模具內。然而，需要根據樹脂成形品之形狀等，針對一個空腔密集地配置複數個頂出銷，此種複數個頂出銷密集配置而成之樹脂成形模具中，水晶壓電式負載墊圈會與鄰接之頂出銷發生干涉，因而存在無法採用專利文獻1及2中提出之脫模力測定裝置之問題。 That is, in order to measure the load given to the ejector pin by the crystal piezoelectric load washer, the crystal piezoelectric must be embedded directly (or directly above) the ejector pin in the mold coaxially with the ejector pin Load washer. In general, when using ejector pins with a diameter of about 1 mm, for example, in order to ensure the ability to withstand the load during demolding, it is necessary to use a crystal piezoelectric load with a diameter of at least about 10 mm washer. Therefore, in the mold release force measuring devices proposed in Patent Documents 1 and 2, a crystal piezoelectric load washer having a diameter larger than the ejector pin is buried in the mold. However, it is necessary to densely arrange a plurality of ejection pins for a cavity according to the shape of the resin molded product, etc. In such a resin molding die in which the plurality of ejection pins are densely arranged, the crystal piezoelectric load washer will be adjacent to Since the ejection pin interferes, there is a problem that the ejection force measuring device proposed in Patent Documents 1 and 2 cannot be used.
因此，本發明之目的在於提供能夠測定脫模力、能夠實現且通用性優異之樹脂成形模具及樹脂成形裝置。 Therefore, an object of the present invention is to provide a resin molding die and a resin molding apparatus that can measure a mold release force, can be realized, and has excellent versatility.
為了達成上述目的，本發明之樹脂成形模具係具有用以形成 樹脂成形用之空腔之模面，上述樹脂成形模具之特徵在於具備：頂出銷，構成為能夠自上述模面突出，使藉由上述空腔成形之樹脂成形品自上述模面脫模；以及脫模力測定機構，以與上述頂出銷之基端部接觸之方式設置，能夠測定於上述樹脂成形品之脫模時經由上述頂出銷而承受之負載，上述脫模力測定機構具備將上述負載轉換為應變之應變產生體、及貼附於上述應變產生體之應變部位之應變計，上述應變產生體具有：無法相對移動地固定於上述樹脂成形模具之固定側端部，以與上述頂出銷之基端部接觸之方式設置之可動側端部，以及自上述固定側端部跨及上述可動側端部而沿與上述頂出銷之軸方向交叉之方向延伸之上下一對平行梁部，上述上下一對平行梁部分別於與上述固定側端部之邊界部分及與上述可動側端部之邊界部分，形成有成為上述應變部位之薄壁部，上述應變計分別貼附於上述上下一對平行梁部之上述薄壁部。 In order to achieve the above object, the resin molding die of the present invention is used to form The mold surface of the cavity for resin molding, the resin molding mold is characterized by comprising: an ejector pin configured to protrude from the mold surface, and to release the resin molded product formed by the cavity from the mold surface; And a demolding force measuring mechanism provided in contact with the base end of the ejection pin, capable of measuring the load received by the ejection pin when the resin molded product is demolded, the demolding force measuring mechanism A strain generating body that converts the load into a strain, and a strain gauge attached to the strain portion of the strain generating body The movable-side end portion provided in such a manner that the base end portion of the ejector pin contacts, and the next pair extending from the fixed-side end portion to the movable-side end portion in a direction crossing the axial direction of the ejector pin The parallel beam part, the pair of upper and lower parallel beam parts are formed at the boundary part with the fixed side end part and the boundary part with the movable side end part Portion of the thin portion, the strain gauge are respectively attached to the upper and lower portions of the thin-walled portion of the parallel beam.
本發明之樹脂成形模具較佳為進而具備：模具本體，於表面具有上述模面，自背面跨及上述模面而形成有能夠供上述頂出銷插通之貫通孔；底板，與上述模具本體之背面側隔開設置；頂出銷保持具，於上述模具本體與上述底板之間以能夠相對於該模具本體之背面進退移動之方式設置，於與上述貫通孔對準之位置配置有上述頂出銷；以及傳熱構件，以將上述模具本體與上述底板連結之方式設置，能夠將上述底板之熱傳遞至上述模具本體，較佳為上述應變產生體之上述固定側端部固定於上述頂出銷保持具，上述頂出銷保持具及上述應變產生體與上述底板隔開設置。 The resin molding die of the present invention preferably further includes: a die body having the die surface on the surface, and a through hole through which the ejector pin can be inserted across the die surface from the back; a bottom plate and the die body The back side is spaced apart; the ejector pin holder is provided between the mold body and the bottom plate so as to move forward and backward relative to the back surface of the mold body, and the top is arranged at a position aligned with the through hole A pin; and a heat transfer member provided in such a manner as to connect the mold body with the bottom plate, capable of transferring heat from the bottom plate to the mold body, preferably the fixed side end of the strain generating body is fixed to the top The pin-out holder, the ejector pin holder and the strain generating body are spaced apart from the bottom plate.
本發明之樹脂成形模具中，較佳為上述頂出銷保持具於與上述模具本體之上述貫通孔對準之位置，形成有自表面跨及背面而貫通且能 夠收容上述頂出銷之基端部之貫通孔，上述應變產生體之上述固定側端部固定於上述頂出銷保持具之背面，上述應變產生體之上述可動側端部於上述頂出銷保持具之上述貫通孔內與上述頂出銷之基端部接觸。 In the resin molding die of the present invention, it is preferable that the ejector pin holder is aligned with the through hole of the die body, and is formed so as to penetrate from the front and back A through hole sufficient to accommodate the base end of the ejector pin, the fixed side end of the strain generating body is fixed to the back of the ejector pin holder, and the movable side end of the strain generating body is on the ejector pin The through hole of the holder contacts the base end of the ejector pin.
而且，本發明之樹脂成形模具中，較佳為上述頂出銷針對一個上述空腔設置有複數個，上述應變產生體及上述應變計設置於針對一個上述空腔而設置之上述複數個頂出銷中之至少兩個以上。 Furthermore, in the resin molding die of the present invention, it is preferable that the ejector pin is provided in plural for one cavity, and the strain generating body and the strain gauge are provided in the plurality of ejectors provided for one cavity At least two of the sales.
本發明之樹脂成形裝置之特徵在於具備：上述樹脂成形模具；以及轉移機構，對上述空腔供給樹脂。 The resin molding apparatus of the present invention is characterized by comprising: the above-mentioned resin molding die; and a transfer mechanism that supplies resin to the cavity.
根據本發明，可提供能夠測定脫模力、能夠實現且通用性優異之樹脂成形模具及樹脂成形裝置。 According to the present invention, it is possible to provide a resin molding die and a resin molding device that can measure a mold release force, can be realized, and have excellent versatility.
1‧‧‧樹脂密封系統 1‧‧‧resin sealing system
10‧‧‧樹脂成形裝置 10‧‧‧Resin molding device
22‧‧‧轉移機構 22‧‧‧ Transfer agency
26‧‧‧樹脂成形模具 26‧‧‧Resin Mold
28‧‧‧上模 28‧‧‧ Upper die
30‧‧‧下模 30‧‧‧die
32‧‧‧模具本體 32‧‧‧Mould body
32a‧‧‧模面 32a‧‧‧mold surface
32b‧‧‧模具本體之貫通孔 32b‧‧‧Through hole of mold body
34‧‧‧底板 34‧‧‧Bottom plate
36‧‧‧傳熱構件 36‧‧‧heat transfer member
42‧‧‧頂出銷保持具 42‧‧‧Ejection pin holder
43‧‧‧頂出銷保持具之貫通孔 43‧‧‧Push through hole of pin holder
44‧‧‧頂出銷 44‧‧‧ Selling
44b‧‧‧頂出銷之基端部 44b‧‧‧Push out the base end
50‧‧‧脫模力測定機構 50‧‧‧Release force measuring mechanism
52‧‧‧應變產生體 52‧‧‧Strain generator
52a‧‧‧固定側端部 52a‧‧‧Fixed end
52b‧‧‧可動側端部 52b‧‧‧Moveable side end
52c、52d‧‧‧平行梁部 52c, 52d ‧‧‧ parallel beam
53a~53d‧‧‧薄壁部 53a ~ 53d
54a~54d‧‧‧應變計 54a ~ 54d‧‧‧strain gauge
C‧‧‧空腔 C‧‧‧ Cavity
P‧‧‧樹脂成形品 P‧‧‧Resin molded product
W‧‧‧引線框架 W‧‧‧Lead frame
圖1係表示本發明之一實施形態之樹脂密封系統之概略構成之前視立體圖。 FIG. 1 is a front perspective view showing a schematic configuration of a resin sealing system according to an embodiment of the present invention.
圖2係概略地表示本實施形態之樹脂成形裝置之前視圖。 FIG. 2 is a schematic front view of the resin molding apparatus of this embodiment.
圖3係概略地表示本實施形態之下模(樹脂成形模具)之前視圖。 FIG. 3 is a schematic front view of the lower mold (resin molding mold) of this embodiment.
圖4係將沿著圖3之A-A'線之剖面之概略構成放大而表示之放大剖面圖。 FIG. 4 is an enlarged cross-sectional view showing an enlarged schematic configuration of the cross-section taken along line AA ′ of FIG. 3.
圖5係將沿著圖3之B-B'線之剖面之概略構成放大而表示之放大剖面圖。 FIG. 5 is an enlarged cross-sectional view showing an enlarged schematic configuration of a cross-section taken along line BB ′ of FIG. 3.
圖6(a)係表示通常時之應變產生體之概略構成圖，圖6(b)係表示 脫模時之應變產生體之概略構成圖。 Fig. 6 (a) is a schematic configuration diagram showing a strain generating body in a normal state, and Fig. 6 (b) is a diagram showing A schematic configuration diagram of the strain generating body during demolding.
圖7(a)係表示樹脂密封成形後使上模開模之狀態之概略剖面圖，圖7(b)係表示自圖7(a)之狀態起使樹脂成形品脫模之狀態之概略剖面圖。 7 (a) is a schematic cross-sectional view showing a state in which the upper mold is opened after resin sealing molding, and FIG. 7 (b) is a schematic cross-sectional view showing a state in which the resin molded product is demolded from the state in FIG. 7 (a) Figure.
以下，使用圖式對用以實施本發明之較佳之實施形態進行說明。另外，以下之實施形態並非限定各申請專利範圍之發明者，而且，實施形態中說明之特徵之組合之全部並未限於發明之解決手段所必須。 Hereinafter, preferred embodiments for implementing the present invention will be described using drawings. In addition, the following embodiments do not limit the inventors of each patent application, and all combinations of features described in the embodiments are not limited to the means of solving the invention.
本實施形態之樹脂密封系統1如圖1所示，具備：進行樹脂密封成形之樹脂密封裝置(樹脂成形裝置)10，對樹脂密封裝置10供給工件(本實施形態中之引線框架W)及樹脂輸入板之工件輸入板供給機構60，以及自樹脂密封裝置10回收樹脂密封後之樹脂成形品P之樹脂成形品回收機構70，且構成為能夠自動且連續地執行自引線框架W及樹脂輸入板對樹脂密封裝置10之供給至樹脂密封後之樹脂成形品P之回收。 As shown in FIG. 1, the resin sealing system 1 of this embodiment includes a resin sealing device (resin molding device) 10 that performs resin sealing and molding, and supplies a workpiece (lead frame W in this embodiment) and resin to the resin sealing device 10 The workpiece input board supply mechanism 60 of the input board, and the resin molded product recovery mechanism 70 that recovers the resin molded product P after resin sealing from the resin sealing device 10, and is configured to automatically and continuously execute the lead frame W and the resin input board The resin molded product P supplied to the resin sealing device 10 is collected after resin sealing.
工件輸入板供給機構60及樹脂成形品回收機構70設置於沿樹脂密封裝置10之兩側面方向延伸之長條之基底80上，樹脂密封裝置10收容於形成在基底80之大致中央部分之收容空間內。而且，本實施形態之樹脂密封系統1中，係以樹脂密封裝置10為中心，於樹脂密封裝置10之一側面側(圖1之左側)配置有工件輸入板供給機構60，於樹脂密封裝置10之另一側面側(圖1之右側)配置有樹脂成形品回收機構70。即，本實施形態之樹脂密封系統1中，構成為如下，即，自基底80之一端部側之區域(圖1之左端部側之區域)供給引線框架W及樹脂輸入板，於基底80之長度方向之大致中央之區域進行樹脂密封成形後，於基底80之另一端部側之 區域(圖1之左端部側之區域)進行無用樹脂(挑選、流槽及澆口部分處硬化之模具部分)之去除(澆口切斷)及樹脂成形品P之回收。 The workpiece input plate supply mechanism 60 and the resin molded product recovery mechanism 70 are provided on a long base 80 extending in the direction of both side surfaces of the resin sealing device 10, and the resin sealing device 10 is accommodated in a housing space formed at a substantially central portion of the base 80 Inside. Furthermore, in the resin sealing system 1 of the present embodiment, the workpiece input plate supply mechanism 60 is disposed on one side of the resin sealing device 10 (left side in FIG. 1) centering on the resin sealing device 10, and the resin sealing device 10 On the other side (right side in FIG. 1), a resin molded product recovery mechanism 70 is arranged. That is, in the resin sealing system 1 of the present embodiment, the configuration is as follows. The lead frame W and the resin input plate are supplied from an area on one end side of the base 80 (the area on the left end side in FIG. 1). After the resin seal molding is performed at the approximate center of the longitudinal direction, at the other end side of the base 80 In the area (the area on the left end side in FIG. 1), useless resin (selection, mold part hardened at the runner and gate part) is removed (gate cut) and the resin molded product P is recovered.
樹脂密封裝置10如圖1及圖2所示，具備：矩形板狀之下平台12，載置於底面上；4根連桿14，自下平台12之四角朝向上方延伸；矩形板狀之上平台16，四角連結於4根連桿14之上端部；矩形板狀之移動平台18，四角供4根連桿14貫通而於下平台12及上平台16之間以能夠沿連桿14升降之方式設置；升降鎖模機構20，設置於下平台12與移動平台18之間且使移動平台18升降；報告手段(未圖示)，於樹脂密封裝置10中發生異常等時或預知異常之發生時發出警報；以及控制部(未圖示)，執行樹脂密封裝置10之各種控制。升降鎖模機構20能夠採用油壓式或電動式鎖模氣缸、或者油壓式或電動式肘節桿鎖模機構等各種鎖模機構。另外，本實施形態之樹脂密封裝置10中，該等下平台12、連桿14、上平台16、移動平台18及升降鎖模機構20因能夠採用各種公知之構成，故省略其詳細說明。 As shown in FIGS. 1 and 2, the resin sealing device 10 includes: a rectangular plate-shaped lower platform 12 placed on the bottom surface; four connecting rods 14 extending upward from the four corners of the lower platform 12; a rectangular plate-shaped upper The platform 16, the four corners are connected to the upper ends of the four connecting rods 14; the rectangular plate-shaped mobile platform 18, the four corners for the four connecting rods 14 to penetrate between the lower platform 12 and the upper platform 16 to be able to rise and fall along the connecting rod 14 Mode setting; lifting mold clamping mechanism 20, which is installed between the lower platform 12 and the mobile platform 18 and raises and lowers the mobile platform 18; reporting means (not shown), when an abnormality occurs in the resin sealing device 10, or when an abnormality is predicted An alarm is issued; and a control unit (not shown) executes various controls of the resin sealing device 10. As the lifting mold clamping mechanism 20, various types of mold clamping mechanisms such as hydraulic or electric mold clamping cylinders, or hydraulic or electric toggle lever mold clamping mechanisms can be used. In addition, in the resin sealing device 10 of the present embodiment, the lower platform 12, the link 14, the upper platform 16, the moving platform 18, and the lifting and clamping mechanism 20 can adopt various well-known configurations, and therefore detailed descriptions thereof are omitted.
而且，樹脂密封裝置10如圖2所示，進而具備：設置於移動平台18之上表面之轉移機構22，以及設置於上平台16與轉移機構2之間之樹脂成形模具26。另外，本實施形態之樹脂密封裝置10中，轉移機構22如圖4及圖5所示，能夠採用具備如下各部之各種公知之轉移機構，即，複數個(本實施形態中為5個)收容罐形成孔部24a，與樹脂成形模具26之空腔C連通且能夠收容樹脂輸入板(未圖示)；柱塞24b，針對每個收容罐形成孔部24a而配置，將收容於收容罐形成孔部24a內之樹脂輸入板朝向空腔C擠壓；以及加熱手段(未圖示)，對樹脂成形模具26及收容罐形成 孔部24a進行加熱，因而省略其詳細說明。 Furthermore, as shown in FIG. 2, the resin sealing device 10 further includes a transfer mechanism 22 provided on the upper surface of the moving platform 18, and a resin molding die 26 provided between the upper platform 16 and the transfer mechanism 2. In addition, in the resin sealing device 10 of the present embodiment, as shown in FIGS. 4 and 5, the transfer mechanism 22 can employ various known transfer mechanisms including the following parts, that is, a plurality of (five in this embodiment) housing The can-forming hole 24a communicates with the cavity C of the resin molding die 26 and can accommodate a resin input plate (not shown); the plunger 24b is arranged for each holding can-forming hole 24a and is formed in the holding can The resin input plate in the hole 24a is pressed toward the cavity C; and heating means (not shown) is formed for the resin molding die 26 and the storage tank The hole portion 24a is heated, so a detailed description thereof is omitted.
樹脂成形模具26為所謂多罐方式之成形模具，如圖2所示，具備：安裝於上平台16之下表面之上模28，以及安裝於轉移機構22之上部而與上模28一併形成空腔C(參照圖4)之下模30。另外，圖2~圖7中，為了容易理解，省略覆蓋下模30之周圍之保持具區塊31a~31c(參照圖1)之圖示。而且，本實施形態之樹脂成形模具26中，上模28除於模具本體28a之下表面(模面)形成用以使樹脂流動之挑選部29a、流槽部29b、澆口部29c及空腔部29d之方面等規格上的輕微差異(參照圖4)外，具有基本上與下模30上下對稱之構造，因而省略其說明及內部構造之圖示。 The resin molding die 26 is a so-called multi-pot molding die. As shown in FIG. 2, it includes: an upper die 28 mounted on the lower surface of the upper platform 16 and an upper part of the transfer mechanism 22 to be formed together with the upper die 28 Cavity C (refer to FIG. 4) lower mold 30. In addition, in FIGS. 2 to 7, for ease of understanding, illustrations of the retainer blocks 31 a to 31 c (see FIG. 1) covering the periphery of the lower mold 30 are omitted. Further, in the resin molding die 26 of this embodiment, the upper die 28 is divided by the lower surface (mold surface) of the die body 28a to form a selection portion 29a, a runner portion 29b, a gate portion 29c and a cavity for flowing resin In addition to the slight difference in the specifications of the part 29d (see FIG. 4), it has a structure that is substantially symmetrical with the lower mold 30 in the vertical direction, and therefore its description and illustration of the internal structure are omitted.
下模30如圖3及圖4所示，具備：模具本體32，與上模28之模具本體28a對向配置且與上模28之模具本體28a之間能夠形成樹脂成形用之空腔C；底板34，與模具本體32之背面(下表面)側隔開設置；頂出機構40，於模具本體32與底板34之間以能夠相對於模具本體32之背面進退移動之方式設置；傳熱構件(支持柱)36，以將模具本體32與底板34連結固定之方式設置而於壓製鎖模時支持模具本體32，且構成為能夠將底板34之熱傳遞至模具本體32；以及脫模力測定機構50，安裝於頂出機構40，且構成為能夠測定樹脂成形品P之脫模時之脫模力。 As shown in FIGS. 3 and 4, the lower mold 30 includes a mold body 32 that is disposed opposite to the mold body 28a of the upper mold 28 and that a cavity C for resin molding can be formed between the mold body 28a of the upper mold 28; The bottom plate 34 is spaced apart from the back surface (lower surface) side of the mold body 32; the ejection mechanism 40 is provided between the mold body 32 and the bottom plate 34 so as to move forward and backward relative to the back surface of the mold body 32; the heat transfer member (Support column) 36, which is provided in such a manner that the mold body 32 and the bottom plate 34 are connected and fixed, and supports the mold body 32 during pressing and clamping, and is configured to be able to transfer the heat of the bottom plate 34 to the mold body 32; The mechanism 50 is attached to the ejection mechanism 40, and is configured to be able to measure the mold release force when the resin molded product P is demolded.
模具本體32如圖4所示為矩形板狀之金屬構件，其於表面(上表面)具有能夠與上模28之模具本體28a之空腔部29d一併形成空腔C之模面32a。於模具本體32中與頂出機構40之後述之頂出銷44對準之位置，自背面遍及模面32a而形成有能夠供頂出銷44插通之貫通孔32b。 As shown in FIG. 4, the mold body 32 is a rectangular plate-shaped metal member having a mold surface 32 a on the surface (upper surface) that can form a cavity C together with the cavity portion 29 d of the mold body 28 a of the upper mold 28. A through hole 32b through which the ejector pin 44 can be inserted is formed in the mold body 32 at a position aligned with the ejector pin 44 described later of the ejector mechanism 40 from the back surface over the die surface 32a.
底板34由矩形板狀之金屬構件形成，載置於轉移機構22之 上表面。該底板34構成為如下，即，經由傳熱構件36而支持模具本體32，並且將自轉移機構22受到之熱經由傳熱構件36傳遞至模具本體32，而使模具本體32加熱。另外，本實施形態之樹脂密封裝置10中，已說明於轉移機構22設置有加熱手段，且該加熱手段之熱被傳遞至底板34，但不限於此，亦可設為於底板34之內部或模具本體32之內部設置加熱手段(未圖示)之構成。 The bottom plate 34 is formed of a rectangular plate-shaped metal member and is placed on the transfer mechanism 22 Upper surface. The bottom plate 34 is configured to support the mold body 32 via the heat transfer member 36 and transfer heat received from the transfer mechanism 22 to the mold body 32 via the heat transfer member 36 to heat the mold body 32. In addition, in the resin sealing device 10 of the present embodiment, it has been described that the transfer mechanism 22 is provided with heating means, and the heat of the heating means is transferred to the bottom plate 34, but it is not limited to this, and may be set inside the bottom plate 34 or The mold body 32 is provided with heating means (not shown).
傳熱構件36為由圓筒狀之金屬構件形成之支持柱，構成為一端部(下端部)固定於底板34之上表面，並且另一端部(上端部)固定於模具本體32之背面，由此以與底板34隔開之位置支持模具本體32。而且，傳熱構件36構成為將由加熱手段加熱之底板34之熱傳遞至模具本體32，而將模具本體32加熱至既定溫度。傳熱構件36如圖3~圖5所示，構成為針對一個空腔C設置有複數根(本實施形態中為6根)，該等複數根傳熱構件36以包圍各空腔C之周圍之方式配置，由此抑制各空腔C之周圍之模具本體32之撓曲，而抑制毛刺之發生等。 The heat transfer member 36 is a support column formed of a cylindrical metal member, and is configured such that one end (lower end) is fixed to the upper surface of the bottom plate 34, and the other end (upper end) is fixed to the back of the mold body 32 by This supports the mold body 32 at a position separated from the bottom plate 34. Furthermore, the heat transfer member 36 is configured to transfer the heat of the bottom plate 34 heated by the heating means to the mold body 32 and heat the mold body 32 to a predetermined temperature. As shown in FIGS. 3 to 5, the heat transfer member 36 is configured to provide a plurality of cavities (six in the present embodiment) for one cavity C, and the plurality of heat transfer members 36 surround the cavities C In this way, the deflection of the mold body 32 around each cavity C is suppressed, and the occurrence of burrs is suppressed.
頂出機構40如圖3及圖4所示，具備：頂出銷保持具42，於模具本體32與底板34之間以能夠相對於模具本體32之背面進退移動之方式設置；頂出銷44，配置於與模具本體32之貫通孔32b對準之位置；以及驅動手段(未圖示)，使頂出銷保持具42相對於模具本體32之背面進退移動，且上述頂出機構40構成為藉由使頂出銷保持具42相對於模具本體32之背面前進，而使頂出銷44自模具本體32之模面32a突出，使藉由空腔C成形之樹脂成形品P自模具本體32之模面32a脫模。驅動手段構成為，於頂出銷保持具42及安裝於其之後述之應變產生體52與底板32隔開之位 置支持頂出銷保持具42，並且於樹脂成形品P之脫模時使頂出銷保持具42朝向模具本體32前進。另外，本實施形態之頂出機構40中，驅動手段例如能夠採用利用電動馬達驅動或壓製之下降動作而進行之頂出桿上推等各種公知之構成，因而省略其說明。 As shown in FIGS. 3 and 4, the ejection mechanism 40 is provided with an ejection pin holder 42 that is provided between the mold body 32 and the bottom plate 34 so as to move forward and backward relative to the back of the mold body 32; the ejection pin 44 , Arranged at a position aligned with the through-hole 32b of the mold body 32; and driving means (not shown) to move the ejector pin holder 42 forward and backward relative to the back surface of the mold body 32, and the ejection mechanism 40 is configured as By advancing the ejector pin holder 42 with respect to the back surface of the mold body 32, the ejector pin 44 protrudes from the mold surface 32a of the mold body 32, and the resin molded product P formed by the cavity C is removed from the mold body 32 The mold surface 32a is demolded. The driving means is configured at a position where the ejection pin holder 42 and the strain generating body 52 described later are separated from the bottom plate 32 The ejector pin holder 42 is supported, and the ejector pin holder 42 is advanced toward the mold body 32 when the resin molded product P is demolded. In addition, in the ejection mechanism 40 of the present embodiment, the driving means can adopt various well-known configurations such as the ejection lever push-up performed by the electric motor driving or pressing down operation, and therefore, the description thereof is omitted.
頂出銷保持具42具備：朝向模具本體32而突出設置有頂出銷44之頂板42a，以及藉由緊固件而安裝於頂板42a之背面從而增強頂板42a之背襯板42b。頂出銷保持具42如圖4所示，於與模具本體32之貫通孔32b對準之位置形成有自表面跨及背面而貫通之貫通孔43。貫通孔43構成為具有頂板42a之表面側之開口徑小於背襯板42b之背面側之開口徑之台階形狀，且於其內部能夠收容頂出銷44之基端部44b。而且，於頂出銷保持具42中，於與傳熱構件36對準之位置形成有供傳熱構件36貫通之傳熱構件用貫通孔(未圖示)。傳熱構件用貫通孔為了不與傳熱構件36之周面接觸而具有大於傳熱構件36之外徑之開口徑。 The ejector pin holder 42 includes a top plate 42a with an ejector pin 44 protruding toward the mold body 32, and a backing plate 42b that is attached to the back of the top plate 42a by fasteners to reinforce the top plate 42a. As shown in FIG. 4, the ejector pin holder 42 is formed with a through hole 43 penetrating from the front surface to the back surface at a position aligned with the through hole 32 b of the mold body 32. The through-hole 43 has a stepped shape having an opening diameter on the front side of the top plate 42a smaller than that on the back side of the backing plate 42b, and can accommodate the base end portion 44b of the ejector pin 44 inside. Furthermore, in the ejector pin holder 42, a through hole (not shown) for a heat transfer member through which the heat transfer member 36 penetrates is formed at a position aligned with the heat transfer member 36. The through hole for the heat transfer member has an opening diameter larger than the outer diameter of the heat transfer member 36 so as not to contact the peripheral surface of the heat transfer member 36.
頂出銷44如圖4所示，為由朝向模具本體32延伸之銷部44a、及形成為直徑大於銷部44a之基端部44b構成之台階之銷構件。銷部44a具有於頂出銷保持具42位於待機位置(圖4所示之位置)之狀態下，與模具本體32之模面32a為大致同一平面之軸方向之長度。而且，銷部44a具有小於頂出銷保持具42之貫通孔43之表面側之開口徑、且與模具本體32之貫通孔32b之開口徑大致相等之外徑。基端部44b具有大於頂出銷保持具42之貫通孔43之表面側之開口徑、且小於頂出銷保持具42之貫通孔43之背面側之開口徑之外徑。頂出銷44於基端部44b收容於頂出銷保持具42之貫通孔43內、且銷部44a經由貫通孔43而朝向模具本體32突出之狀 態下，藉由頂出銷保持具42之貫通孔43之階差部與脫模力測定機構50之後述之應變產生體52之可動側端部52b而夾持基端部44b，由此安裝於頂出銷保持具42。頂出銷44構成為針對一個空腔C設置有複數個(本實施形態中為兩個)，藉由該等複數個頂出銷44而均等地使樹脂成形品P脫模。 As shown in FIG. 4, the ejector pin 44 is a pin member formed by a pin portion 44 a extending toward the mold body 32 and a step formed to have a diameter larger than the base end portion 44 b of the pin portion 44 a. The pin portion 44a has a length in the axial direction that is approximately the same plane as the die surface 32a of the die body 32 in a state where the ejector pin holder 42 is at the standby position (the position shown in FIG. 4). Moreover, the pin portion 44a has an outer diameter smaller than the opening diameter of the through hole 43 of the ejector pin holder 42 on the surface side, and is substantially equal to the opening diameter of the through hole 32b of the mold body 32. The base end portion 44b has an outer diameter larger than the opening diameter of the front side of the through hole 43 of the ejector pin holder 42 and smaller than the opening diameter of the rear side of the through hole 43 of the ejector pin holder 42. The ejector pin 44 is accommodated in the through hole 43 of the ejector pin holder 42 at the base end portion 44b, and the pin portion 44a protrudes toward the mold body 32 through the through hole 43 In this state, the stepped portion of the through hole 43 of the ejector pin holder 42 and the movable-side end portion 52b of the strain generating body 52 described later are clamped to clamp the base end portion 44b.于 顶 出 销 持 器 42。 42 in the ejection pin holder. The ejector pins 44 are configured to provide a plurality of cavities C (two in the present embodiment), and the plurality of ejector pins 44 equally demold the resin molded product P.
脫模力測定機構50為所謂的羅伯瓦(Roberval)型負載單元，如圖4所示，具備與自頂出銷44承受之負載成比例地變形之應變產生體52、及檢測應變產生體52之變形量之應變計54a~54d。應變產生體52以與頂出銷44之基端部44b接觸之方式安裝於頂出銷保持具42，應變計54a~54d分別貼附於應變產生體52之四個應變部位(後述薄壁部53a~53d)。脫模力測定機構50針對每個頂出銷44而配置，本實施形態中，如圖4及圖5所示，針對一個空腔C而各配置有兩個。各脫模力測定機構50如圖5所示，為了不與鄰接之其他脫模力測定機構50及傳熱構件36發生干涉，而設置於複數個傳熱構件36之間隙內。以下，對應變產生體52及應變計54a~54d之具體構成進行說明。 The demoulding force measuring mechanism 50 is a so-called Roberval type load unit, as shown in FIG. 4, it has a strain generating body 52 deformed in proportion to the load received from the ejector pin 44 and a detection strain generating body Strain gauges 54a to 54d for the amount of deformation of 52. The strain generator 52 is attached to the ejector pin holder 42 in contact with the base end portion 44b of the ejector pin 44, and the strain gauges 54a to 54d are attached to the four strain parts of the strain generator 52 (thin-walled part to be described later) 53a ~ 53d). The mold release force measuring mechanism 50 is arranged for each ejector pin 44. In this embodiment, as shown in FIGS. 4 and 5, two are arranged for each cavity C. As shown in FIG. 5, each demolding force measuring mechanism 50 is provided in the gap between a plurality of heat transfer members 36 so as not to interfere with other adjacent demolding force measuring mechanisms 50 and heat transfer members 36. Hereinafter, specific configurations of the strain generating body 52 and the strain gauges 54a to 54d will be described.
應變產生體52如圖6(a)所示，為以相對於頂出銷保持具42之下表面垂直之方式而豎立設置之鉛垂剖面為大致L字狀之板狀構件，於L字之沿水平方向延伸之部位形成有鐵啞鈴狀之切口，並且，L字之沿鉛垂方向延伸之部位以於頂出銷保持具42之貫通孔43內與頂出銷44之基端部44b接觸之方式，且將L字之沿水平方向延伸之部位之端部附近以於頂出銷保持具42之背面成為懸臂之方式得到固定。具體而言，應變產生體52具有：固定於頂出銷保持具42之背面之固定側端部52a，以與頂出銷44之基端部44b接觸之方式設置之可動側端部52b，以及自固定側端部52a跨 及可動側端部52b而沿與頂出銷44之軸方向交叉之方向延伸之上下一對平行梁部52c、52d。該應變產生體52形成為如下形狀，即，大致L字狀：可動側端部52b自頂出銷44之基端部44b之下表面沿頂出銷44之軸方向延伸，上下一對平行梁部52c、52d自可動側端部52b之下端附近沿與頂出銷44之軸方向正交之方向延伸，固定側端部52a與上下一對平行梁部52c、52d相連而沿同方向延伸。 As shown in FIG. 6 (a), the strain generating body 52 is a plate-like member whose vertical cross section is substantially L-shaped and is vertically arranged with respect to the lower surface of the ejector pin holder 42. An iron dumbbell-shaped cut is formed in a portion extending in the horizontal direction, and a portion of the L shape extending in the vertical direction is in contact with the base end portion 44b of the ejector pin 44 in the through hole 43 of the ejector pin holder 42 And the vicinity of the end of the L-shaped portion extending in the horizontal direction is fixed so as to be a cantilever on the back of the ejector pin holder 42. Specifically, the strain generating body 52 has a fixed side end 52a fixed to the back of the ejector pin holder 42, a movable side end 52b provided so as to contact the base end 44b of the ejector pin 44, and Self-fixing side end 52a spans And the movable-side end portion 52b extends in the direction crossing the axial direction of the ejector pin 44 above and next to the pair of parallel beam portions 52c, 52d. The strain generating body 52 is formed in a substantially L-shaped shape: the movable side end 52b extends from the lower surface of the base end 44b of the ejector pin 44 in the axial direction of the ejector pin 44, and a pair of upper and lower parallel beams The portions 52c and 52d extend from the vicinity of the lower end of the movable-side end portion 52b in a direction orthogonal to the axial direction of the ejector pin 44, and the fixed-side end portion 52a is connected to the pair of upper and lower parallel beam portions 52c and 52d and extends in the same direction.
固定側端部52a如圖4及圖6(a)所示，為了相對於下模30整體無法相對移動，而藉由緊固件固定於頂出銷保持具42之背面。可動側端部52b構成為其上端部與頂出銷44之基端部44b之下表面接觸，其下端部側與上下一對平行梁部52c、52d之一端部相連。上下一對平行梁部52c、52d分別於與固定側端部52a之邊界部分及與可動側端部52b之邊界部分，形成有成為伴隨來自頂出銷44之負載而變形之部位(應變部位)之半圓狀之薄壁部53a~53d，由此，構成為藉由上下一對平行梁部52c、52d、固定側端部52a、及可動側端部52b，劃定鐵啞鈴狀之切口。構成為於上下一對平行梁部52c、52d之薄壁部53a~53d中之應變計54a~54d所貼附之部位，分別加工出於製造過程時用以特定應變計54a~54d之貼附位置(中心位置)之標誌線(未圖示)，而提高應變計54a~54d之貼附作業之作業性及精確性。 As shown in FIGS. 4 and 6 (a), the fixed-side end 52 a is fixed to the back of the ejector pin holder 42 by fasteners so that the entire lower mold 30 cannot move relatively. The movable side end 52b is configured such that its upper end is in contact with the lower surface of the base end 44b of the ejector pin 44, and its lower end is connected to one end of the pair of upper and lower parallel beams 52c and 52d. A pair of upper and lower parallel beam portions 52c and 52d are respectively formed at the boundary portion with the fixed side end portion 52a and the movable side end portion 52b at a boundary portion (strain portion) that becomes deformed by the load from the ejector pin 44 The semi-circular thin-walled portions 53a-53d are thus configured to define iron dumbbell-shaped cutouts by a pair of upper and lower parallel beam portions 52c, 52d, fixed-side end portions 52a, and movable-side end portions 52b. The parts attached to the strain gauges 54a to 54d in the thin-walled sections 53a to 53d of the pair of upper and lower parallel beams 52c and 52d are processed separately for the attachment of the specific strain gauges 54a to 54d during the manufacturing process The marking line (not shown) of the position (center position) improves the workability and accuracy of the attaching operation of the strain gauges 54a to 54d.
應變產生體52藉由如上述般構成，而構成為當於脫模時經由頂出銷44附加負載時，如圖6(b)所示，上側之平行梁部52c之可動側端部52b側之薄壁部53a及下側之平行梁部52d之固定側端部52a側之薄壁部53d於壓縮方向上應變，上側之平行梁部52c之固定側端部52a側之薄壁 部53b及下側之平行梁部52d之可動側端部52b側之薄壁部53c於延伸方向上應變。 The strain generating body 52 is configured as described above, and when the load is added via the ejector pin 44 during demolding, as shown in FIG. 6 (b), the movable side end 52b side of the upper parallel beam portion 52c The thin-walled portion 53a and the thin-walled portion 53d on the fixed side end 52a side of the lower parallel beam portion 52d are strained in the compression direction, and the thin-walled portion on the fixed side end 52a side of the upper parallel beam portion 52c The thin portion 53c on the movable-side end portion 52b side of the portion 53b and the lower parallel beam portion 52d is strained in the extending direction.
應變計54a~54d構成為相應於應變而電阻發生變化，且如圖6(a)及圖6(b)所示，由如下所構成：第1應變計5a，貼附於上側之平行梁部52c之可動側端部52b側之薄壁部53a；第2應變計54b，貼附於上側之平行梁部52c之固定側端部52a側之薄壁部53b；第3應變計54c，貼附於下側之平行梁部52d之可動側端部52b側之薄壁部53c；以及第4應變計54d，貼附於下側之平行梁部52d之固定側端部52a側之薄壁部53d。該等四個應變計54a~54d以構成惠斯登電橋(Wheatstone bridge)電路(未圖示)之方式相互連接。 The strain gauges 54a to 54d are configured so that the resistance changes according to the strain, and as shown in FIGS. 6 (a) and 6 (b), they are composed of the following: The first strain gauge 5a is attached to the upper parallel beam portion The thin wall portion 53a on the movable side end 52b side of 52c; the second strain gauge 54b, attached to the thin wall portion 53b on the fixed side end 52a side of the upper parallel beam portion 52c; the third strain gauge 54c, attached The thin wall portion 53c on the movable side end 52b side of the lower parallel beam portion 52d; and the fourth strain gauge 54d attached to the thin wall portion 53d on the fixed side end portion 52a side of the lower parallel beam portion 52d . The four strain gauges 54a-54d are connected to each other in such a way as to constitute a Wheatstone bridge circuit (not shown).
針對每個脫模力測定機構50而形成之惠斯登電橋電路分別經由放大器(未圖示)及A/D轉換器(未圖示)而與資料收集解析手段(未圖示)電性連接。本實施形態中，藉由複數個脫模力測定機構50、放大器及A/D轉換器、及共用之資料收集解析手段，構成能夠統一測定所有空腔C中之脫模時之脫模力之脫模力測定裝置。 The Wheatstone bridge circuit formed for each demolding force measuring mechanism 50 is electrically connected to the data collection and analysis means (not shown) via an amplifier (not shown) and an A / D converter (not shown) connection. In this embodiment, by a plurality of demolding force measuring mechanisms 50, amplifiers and A / D converters, and a common data collection and analysis means, it is possible to uniformly measure the demolding force during demolding in all cavities C Release force measuring device.
資料收集解析手段構成為如下，即，例如由個人電腦等構成，基於應變計54a~54d之電阻值而算出應變值，且基於該應變值，測定經由頂出銷44而附加至應變產生體52之可動側端部52b之負載，即，脫模時之脫模力。 The data collection and analysis means is configured as follows. For example, it is constituted by a personal computer or the like, the strain value is calculated based on the resistance values of the strain gauges 54a to 54d, and based on the strain value, the measurement is added to the strain generating body 52 via the ejector pin 44. The load of the movable side end 52b, that is, the demoulding force at the time of demolding.
而且，資料收集解析手段構成為基於所測定之負載(脫模力)判定脫模不良，於判定為脫模不良之情形時，對報告手段輸出報告訊號。具體而言，資料收集解析手段構成為於例如(1)所測定之負載(脫模力) 之單獨值、(2)既定週期或既定時間內測定出之負載(脫模力)之即時平均值、(3)所測定出之負載(脫模力)之值與前一個平均值之差、(4)所測定出之負載(脫模力)之上升率、(5)即時算出之平均值之上升率、或(6)藉由複數個脫模力測定機構50而測定之負載(脫模力)之不均(差)等超過了預先既定之設定值(閾值)之情形時，判定為脫模不良。尤其，根據上述(6)之判定方法，能夠檢測一個空腔C內之局部之污漬，並且能夠預測或特定該污漬部位，而且，亦能夠進行污漬容易附著之部位等之傾向分析等。 Furthermore, the data collection and analysis means is configured to determine the mold release failure based on the measured load (mold release force), and output a report signal to the report means when it is determined that the mold release is defective. Specifically, the data collection and analysis means is configured to load (ejection force) measured in, for example, (1) The individual value, (2) the instantaneous average value of the load (molding force) measured in a given period or time, (3) the difference between the measured load (molding force) and the previous average value, (4) Rate of increase of the measured load (mold release force), (5) Rate of increase of the average value calculated in real time, or (6) Load (mold release) measured by a plurality of mold release force measuring mechanisms 50 When the unevenness (difference) of force) exceeds a predetermined set value (threshold value), it is judged as a mold release failure. In particular, according to the determination method of (6) above, it is possible to detect the local stains in one cavity C, and to predict or specify the stained parts, and also to perform a tendency analysis of the parts where the stains are easily attached and the like.
報告手段構成為若自資料收集解析手段接收報告訊號，則發出警報。作為此種報告手段之警報之形態，除能夠採用藉由發出警報音而進行聽覺報告之形態外，亦能夠適當採用例如使燈等點燈之形態、或於設置於樹脂密封裝置10之顯示畫面或連接於樹脂密封裝置10之個人電腦等之顯示畫面上顯示訊息之形態、或使顯示畫面之一部分或整體閃爍或以既定之顏色點燈之形態等進行視覺報告之形態等。藉由由此種報告手段發出之警報，作業人員能夠認識到模面32a中之污漬之產生(有清洗之必要性)，並且能夠預測由脫模不良引起之樹脂成形品P之破損或外觀不良。 The report means is configured to issue an alarm if the report signal is received from the data collection and analysis means. As the form of the alarm of such a reporting means, in addition to the form of making an audible report by sounding an alarm sound, it is also possible to appropriately use a form such as lighting a lamp or the like, or a display screen provided in the resin sealing device 10 Or, a form of displaying a message on a display screen of a personal computer or the like connected to the resin sealing device 10, or a form of making a visual report such as blinking a part or the whole of the display screen or lighting in a predetermined color, etc. With the alarm issued by this reporting method, the operator can recognize the generation of stains on the mold surface 32a (necessary for cleaning), and can predict the breakage or defective appearance of the resin molded product P caused by poor mold release. .
具備以上構成之本實施形態之樹脂密封裝置10如圖4所示，構成為於藉由上模28及下模30夾住引線框架W之狀態下，藉由柱塞24b加壓經熔融之模具材料，按照上模28之挑選部29a→流槽部29b→澆口部29c→空腔部29d之順序流動，並使其熱硬化，由此將配置於空腔C內之電子零件進行鑄模，從而製造樹脂成形品P。而且，本實施形態之樹脂密封裝置10構成為於電子零件之模具完成後，藉由使移動平台18下降而使下模 30離開上模28，並且與其並行或同步地，藉由內置於上模28之頂出機構(未圖示)使樹脂成形品P自上模28之模面脫模。進而，本實施形態之樹脂密封裝置10構成為如圖7(a)所示，於使下模30離開上模28後，如圖7(b)所示，藉由頂出機構40使樹脂成形品P自下模30之模面32a脫模。而且，本實施形態之樹脂密封裝置10藉由脫模力測定機構50(脫模力測定裝置)即時地測定或監視使樹脂成形品P自上模28之模面脫模時及使樹脂成形品P自下模30之模面32a脫模時之脫模力，於檢測到脫模不良時，藉由報告手段發出警報。 As shown in FIG. 4, the resin sealing device 10 of the present embodiment having the above configuration is configured to press the melted mold with the plunger 24 b in a state where the lead frame W is sandwiched between the upper mold 28 and the lower mold 30. The material flows in the order of the picking part 29a → the runner part 29b → the gate part 29c → the cavity part 29d of the upper mold 28, and is thermally hardened, thereby casting the electronic parts arranged in the cavity C, Thus, a resin molded product P is manufactured. Moreover, the resin sealing device 10 of the present embodiment is configured to lower the lower mold by lowering the moving platform 18 after the mold of the electronic component is completed 30 leaves the upper mold 28, and in parallel or synchronously with it, the resin molded product P is released from the mold surface of the upper mold 28 by an ejection mechanism (not shown) built into the upper mold 28. Further, the resin sealing device 10 of the present embodiment is configured as shown in FIG. 7 (a). After the lower mold 30 is separated from the upper mold 28, as shown in FIG. 7 (b), the resin is molded by the ejection mechanism 40 The product P is released from the die surface 32a of the lower die 30. Furthermore, the resin sealing device 10 of the present embodiment measures or monitors in real time the demolding force measuring mechanism 50 (molding force measuring device) to demold the resin molded product P from the mold surface of the upper mold 28 and to mold the resin molded product P The mold release force when the mold surface 32a of the lower mold 30 is demolded, and when a bad demolding is detected, an alarm is issued by means of reporting.
工件輸入板供給機構60如圖1所示，具備：工件．輸入板搬送裝置62，將引線框架W(工件)及樹脂輸入板於樹脂密封裝置10之上模28及下模30之間進行搬送；支架64，收容複數個引線框架W；工件供給裝置(推進器)66，將收容於支架64之引線框架W逐片地送出至工件．輸入板搬送裝置62；輸入板供給裝置68，對工件．輸入板搬送裝置62供給樹脂輸入板；驅動部(未圖示)，分別設置於工件．輸入板搬送裝置62、工件供給裝置66及輸入板供給裝置68；以及控制部(未圖示)，以同步或非同步狀態控制各驅動部。工件輸入板供給機構60構成為藉由控制部之控制，能夠自動地執行引線框架W及樹脂輸入板對樹脂密封裝置10之供給。 The workpiece input plate supply mechanism 60 is shown in FIG. 1 and includes: a workpiece. The input plate conveying device 62 conveys the lead frame W (workpiece) and the resin input plate between the upper mold 28 and the lower mold 30 of the resin sealing device 10; the holder 64 accommodates a plurality of lead frames W; the workpiece supply device (advancing Device) 66, the lead frame W housed in the holder 64 is sent out to the workpiece piece by piece. Input plate transport device 62; input plate supply device 68, for the workpiece. The input plate conveying device 62 supplies the resin input plate; the driving section (not shown) is provided on the workpiece. The input plate conveying device 62, the workpiece supply device 66, and the input plate supply device 68; and a control unit (not shown), which controls each drive unit in a synchronous or asynchronous state. The workpiece input plate supply mechanism 60 is configured to be able to automatically execute the supply of the lead frame W and the resin input plate to the resin sealing device 10 under the control of the control unit.
樹脂成形品回收機構70如圖1所示，具備：搬出裝置72，自樹脂密封裝置10搬出附無用樹脂之樹脂成形品P；澆口切斷裝置74，藉由自上方按壓與樹脂成形品P一體成形之無用樹脂而使無用樹脂與樹脂成形品P分離；回收容器76，回收被分離而落下之無用樹脂；樹脂成形品回收裝置78，回收去除了無用樹脂之樹脂成形品P；驅動部(未圖示)，分別 設置於搬出裝置72、澆口切斷裝置74及樹脂成形品回收裝置78；以及控制部(未圖示)，以同步或非同步狀態控制各驅動部。樹脂成形品回收裝置78具備：搬送裝置78a，於澆口切斷位置與樹脂成形品回收位置之間以能夠往復移動之方式設置；支架78b，回收樹脂成形品P；以及送出裝置(推進器)78c，將已到達樹脂成形品回收位置之搬送裝置78a中所搭載之樹脂成形品P送出至支架78b。樹脂成形品回收機構70構成為藉由控制部之控制，自動地執行附無用樹脂之樹脂成形品P自樹脂密封裝置10之搬出、無用樹脂自樹脂成形品P之去除及去除了無用樹脂之樹脂成形品P之回收。 As shown in FIG. 1, the resin molded product recovery mechanism 70 is provided with: a carrying-out device 72 that carries out the resin molded product P with useless resin from the resin sealing device 10; a gate cutting device 74, which presses the resin molded product P from above The useless resin integrally formed to separate the useless resin from the resin molded product P; the recovery container 76 to collect the separated and fallen useless resin; the resin molded product recovery device 78 to collect the resin molded product P from which the useless resin has been removed; (Not shown), respectively It is provided in the carrying-out device 72, the gate cutting device 74, and the resin molded product recovery device 78; and a control unit (not shown) to control each driving unit in a synchronous or asynchronous state. The resin molded product recovery device 78 includes: a conveying device 78a, which is provided between the gate cutting position and the resin molded product recovery position so as to be able to move back and forth; a holder 78b, which recovers the resin molded product P; 78c, the resin molded product P mounted on the conveying device 78a that has reached the resin molded product collection position is sent out to the holder 78b. The resin molded product recovery mechanism 70 is configured to automatically carry out the removal of the resin molded product P with useless resin from the resin sealing device 10, the removal of the useless resin from the resin molded product P, and the removal of the resin with useless resin under the control of the control unit Recovery of molded product P.
其次，對本實施形態之樹脂密封系統1之動作進行說明。另外，以下之樹脂密封系統1之動作藉由基於預先記憶於記憶部之程式驅動控制各構成要素而執行。 Next, the operation of the resin sealing system 1 of this embodiment will be described. In addition, the following operation of the resin sealing system 1 is performed by driving and controlling each constituent element based on a program stored in advance in the memory section.
首先，藉由工件供給裝置66自支架64朝向工件．輸入板搬送裝置62逐片地送出引線框架W。而且，與其並行地，複數個(本實施形態中為5個)樹脂輸入板自輸入板供給裝置68交付至工件．輸入板搬送裝置62。若引線框架W及樹脂輸入板被交付至工件．輸入板搬送裝置62，則工件．輸入板搬送裝置62以保持所收置之引線框架W及樹脂輸入板之狀態而移動至樹脂密封裝置10內，使引線框架W載置於下模30之模具本體32上，並且使樹脂輸入板分別投放至轉移機構22之收容罐形成孔部24a。 First, by the workpiece supply device 66 from the bracket 64 toward the workpiece. The input board conveying device 62 sends out the lead frame W piece by piece. Moreover, in parallel with it, a plurality of (five in this embodiment) resin input plates are delivered from the input plate supply device 68 to the workpiece. Input board conveying device 62. If the lead frame W and the resin input board are delivered to the workpiece. Input plate transport device 62, the workpiece. The input plate conveying device 62 moves into the resin sealing device 10 while maintaining the lead frame W and the resin input plate stored therein, the lead frame W is placed on the mold body 32 of the lower mold 30, and the resin input plate The storage tanks respectively put into the transfer mechanism 22 form holes 24a.
若引線框架W及樹脂輸入板被交付至樹脂密封裝置10，則樹脂密封裝置10執行樹脂密封成形。具體而言，樹脂密封裝置10於以電子零件位於空腔C內之方式並藉由上模28及下模3夾住引線框架W之狀態下，藉由柱塞24b使收容罐形成孔部24a內熔融之模具材料朝向空腔C內流 動，藉由使流入至空腔C內之模具材料熱硬化，而將樹脂成形品P轉移成形。而且，樹脂密封裝置10於電子零件之模具完成後，藉由使移動平台18下降而使下模30離開上模28，並且與其並行或同步地，藉由內置於上模28之頂出機構使樹脂成形品P自上模28之模面脫模。進而，本實施形態之樹脂密封裝置10於使下模30離開上模28後，藉由頂出機構40使樹脂成形品P自下模30之模面32a脫模。此時，樹脂密封裝置10藉由脫模力測定機構50(脫模力測定裝置)即時地測定或監視使樹脂成形品P脫模時之脫模力，於檢測到脫模不良時，藉由報告手段發出警報。 When the lead frame W and the resin input plate are delivered to the resin sealing device 10, the resin sealing device 10 performs resin sealing molding. Specifically, the resin sealing device 10 forms a hole 24a in the housing can by the plunger 24b in a state where the electronic component is located in the cavity C and the lead frame W is sandwiched between the upper mold 28 and the lower mold 3 The internally molten mold material flows into the cavity C Then, by thermosetting the mold material flowing into the cavity C, the resin molded product P is transfer-molded. Moreover, after the mold of the electronic parts is completed, the resin sealing device 10 lowers the moving platform 18 to move the lower mold 30 away from the upper mold 28, and in parallel or synchronously with the ejection mechanism built into the upper mold 28 The resin molded product P is released from the mold surface of the upper mold 28. Furthermore, in the resin sealing device 10 of the present embodiment, after the lower mold 30 is separated from the upper mold 28, the resin molded product P is released from the mold surface 32a of the lower mold 30 by the ejection mechanism 40. At this time, the resin sealing device 10 measures or monitors the demolding force at the time of demolding the resin molded product P by the demoulding force measuring mechanism 50 (mold releasing force measuring device), and when a demolding defect is detected, by Report means to issue an alarm.
搬出裝置72回收樹脂密封裝置10內之附無用樹脂之樹脂成形品P，並朝向澆口切斷裝置74搬送。若藉由搬出裝置72而附無用樹脂之樹脂成形品P到達澆口切斷裝置74，則澆口切斷裝置74藉由自上方按壓附著於樹脂成形品P之無用樹脂而使其與樹脂成形品P分離，由此而落下之無用樹脂被收集容器76收集。然後，藉由樹脂成形品回收裝置78，回收去除了無用樹脂之樹脂成形品P。 The carrying-out device 72 collects the resin molded product P with unnecessary resin in the resin sealing device 10 and conveys it toward the gate cutting device 74. If the resin-molded product P with useless resin reaches the gate cutting device 74 by the carrying-out device 72, the gate-cutting device 74 presses the useless resin attached to the resin molded product P from above to form it with the resin The product P is separated, and the useless resin dropped thereby is collected by the collection container 76. Then, the resin molded product P from which the unnecessary resin has been removed is recovered by the resin molded product recovery device 78.
而且，藉由重複執行以上步驟，可自動且連續地製造樹脂成形品P。 Moreover, by repeating the above steps, the resin molded product P can be manufactured automatically and continuously.
如以上說明般，本實施形態之樹脂成形模具26係具有用以形成樹脂成形用之空腔C之模面32a之樹脂成形模具，且具備：頂出銷44，構成為能夠自模面32a突出，使藉由空腔C成形之樹脂成形品P自模面32a脫模；以及脫模力測定機構50，以與頂出銷44之基端部44b接觸之方式設置，能夠測定於樹脂成形品P之脫模時經由頂出銷44而承受之負載；脫模力測定機構50具備將負載轉換為應變之應變產生體52、及貼附於應變產生 體52之應變部位(薄壁部53a~53d)之應變計54a~54d，應變產生體52具有：無法相對移動地固定於樹脂成形模具26之固定側端部52a，以與頂出銷44之基端部44b接觸之方式設置之可動側端部52b，以及自固定側端部52a跨及可動側端部52b而沿與頂出銷44之軸方向交叉之方向延伸之上下一對平行梁部52c、52d，上下一對平行梁部52c、52d分別於與固定側端部52a之邊界部分及與可動側端部52b之邊界部分，形成有成為應變部位之薄壁部53a~53d，應變計54a~54d分別貼附於上下一對平行梁部52c、52d之薄壁部53a~53d。 As described above, the resin molding die 26 of this embodiment has a resin molding die for forming the mold surface 32a of the cavity C for resin molding, and is provided with an ejector pin 44 configured to protrude from the mold surface 32a , The resin molded product P formed by the cavity C is demolded from the mold surface 32a; and the demolding force measuring mechanism 50 is provided in contact with the base end portion 44b of the ejector pin 44 and can be measured on the resin molded product The load received by the ejector pin 44 during demolding of P; the demolding force measuring mechanism 50 includes a strain generating body 52 that converts the load into strain, and is attached to the strain generating The strain gauges 54a to 54d of the strain portion of the body 52 (thin-walled portions 53a to 53d), the strain generating body 52 has: a fixed side end 52a that is immovably fixed to the resin molding die 26 to match the ejection pin 44 The movable side end 52b provided in such a way that the base end 44b contacts, and the pair of parallel beams extending from the fixed side end 52a across the movable side end 52b in a direction crossing the axial direction of the ejector pin 44 52c, 52d, a pair of upper and lower parallel beam portions 52c, 52d are formed at the boundary portion with the fixed-side end portion 52a and the boundary portion with the movable-side end portion 52b, respectively, forming thin-walled portions 53a to 53d as strained portions, strain gauges 54a-54d are attached to the thin-walled portions 53a-53d of the pair of upper and lower parallel beam portions 52c, 52d, respectively.
如此，本實施形態之樹脂成形模具26藉由具備脫模力測定機構50而能夠檢測脫模不良，因而對於作業人員而言，能夠認識到模面32a之污漬之產生(有清洗之必要性)、或由脫模不良引起之樹脂成形品P之破損及外觀不良等之可能性。上述優點於如本實施形態之樹脂密封系統1般的自動且連續地執行自引線框架W及樹脂輸入板對樹脂密封裝置10之供給至樹脂密封後之樹脂成形品P之回收之全自動系統中尤其有效。 In this way, the resin molding die 26 of the present embodiment can detect the mold release failure by having the mold release force measuring mechanism 50, so that the worker can recognize the occurrence of stains on the mold surface 32a (necessary for cleaning) Or, the possibility of breakage and poor appearance of the resin molded product P due to poor mold release. The above-mentioned advantages are in a fully automated system that automatically and continuously performs the supply of the resin sealing device 10 from the lead frame W and the resin input plate to the resin sealing device 10 as in the resin sealing system 1 of the present embodiment. Especially effective.
而且，本實施形態之樹脂成形模具26構成為藉由主要沿與頂出銷44之軸方向交叉之方向延伸之脫模力測定機構50(羅伯瓦型負載單元)測定頂出銷44之負載，因而與使用必須埋設於頂出銷44之正下方之大徑之水晶壓電式負載墊圈之情形相比，可提高脫模力測定機構50之設置個數及配置之自由度。即，根據本實施形態之樹脂成形模具26，能夠以鄰接之脫模力測定機構50彼此不相互干涉之方式，將各脫模力測定機構50之延伸方向錯開而配置，因而能夠實現例如於密集設置之複數個頂出銷44之全部設置脫模力測定機構50之構成等。 Moreover, the resin molding die 26 of the present embodiment is configured to measure the load of the ejector pin 44 by a demolding force measuring mechanism 50 (Robois type load unit) extending mainly in a direction crossing the axial direction of the ejector pin 44 Therefore, as compared with the case of using a large-diameter crystal piezoelectric load washer that must be buried directly under the ejector pin 44, the number of installations and the freedom of arrangement of the demolding force measuring mechanism 50 can be increased. That is, according to the resin molding die 26 of this embodiment, it is possible to dispose and extend the direction of extension of each of the ejection force measuring mechanisms 50 so that the adjacent ejection force measuring mechanisms 50 do not interfere with each other. All of the plurality of ejector pins 44 are provided with a demoulding force measuring mechanism 50 and the like.
而且，本實施形態之樹脂成形模具26如上述般，進而具備：模具本體32，於表面具有模面32a，自背面跨及模面32a而形成有能夠供頂出銷44插通之貫通孔32b；底板34，與模具本體32之背面側隔開設置；頂出銷保持具42，於模具本體32與底板34之間以能夠相對於模具本體32之背面進退移動之方式設置，且於與貫通孔32b對準之位置配置有頂出銷44；以及傳熱構件36，以將模具本體32與底板34連結之方式設置，能夠將底板34之熱傳遞至模具本體32，應變產生體52之固定側端部52a固定於頂出銷保持具42，頂出銷保持具42及應變產生體52係與底板34隔開設置。 As described above, the resin molding die 26 of this embodiment further includes a die body 32 having a die surface 32a on the surface, and a through hole 32b through which the ejector pin 44 can be inserted across the die surface 32a from the back The bottom plate 34 is spaced apart from the back side of the mold body 32; the ejector pin holder 42 is provided between the mold body 32 and the bottom plate 34 in such a manner that it can move forward and backward relative to the back surface of the mold body 32, and between and The ejector pin 44 is arranged at the position where the hole 32b is aligned; and the heat transfer member 36 is provided in such a manner that the mold body 32 and the bottom plate 34 are connected, and the heat of the bottom plate 34 can be transferred to the mold body 32, and the strain generating body 52 is fixed The side end 52 a is fixed to the ejector pin holder 42, and the ejector pin holder 42 and the strain generating body 52 are spaced apart from the bottom plate 34.
根據此種樹脂成形模具26，能夠降低熱對脫模力測定機構50之影響。即，專利文獻1及2所提出之脫模力測定裝置中，必須將水晶壓電式負載墊圈埋設於高溫之模具內，而容易受到模具之熱之影響，因而存在測定值之可靠性不充分，而且，容易引起脫模力測定裝置之劣化之問題。與此相對，本實施形態之樹脂成形模具26中，設置有應變計54a~54d之應變產生體52及設置有該應變產生體52之頂出銷保持具42係與高熱之底板34隔開設置，由此，與使用必須埋設於頂出銷44之正下方之習知之水晶壓電式負載墊圈之情形相比，能夠減小熱對脫模力測定機構50之影響。尤其，本實施形態之脫模力測定機構50中，應變產生體52由垂直地豎立設置於頂出銷保持具42之下表面之板狀構件構成，由此能夠減小與頂出銷保持具42之接觸面積(傳熱面積)，且，增大散熱面積，因而進一步具有散熱性優異之優點。 According to such a resin molding die 26, the influence of heat on the mold release force measuring mechanism 50 can be reduced. That is, in the mold-releasing force measuring devices proposed in Patent Documents 1 and 2, the crystal piezoelectric load washer must be buried in a high-temperature mold, and it is easily affected by the heat of the mold, so there is insufficient reliability of the measured value And, it is easy to cause the problem of deterioration of the demoulding force measuring device. In contrast, in the resin molding die 26 of the present embodiment, the strain generating body 52 provided with the strain gauges 54a to 54d and the ejector pin holder 42 provided with the strain generating body 52 are spaced apart from the high-heat bottom plate 34 This makes it possible to reduce the influence of heat on the demolding force measuring mechanism 50 compared to the case where a conventional crystal piezoelectric load washer must be buried directly under the ejector pin 44. In particular, in the demoulding force measuring mechanism 50 of the present embodiment, the strain generating body 52 is composed of a plate-shaped member that is vertically provided on the lower surface of the ejector pin holder 42, thereby reducing the amount of contact with the ejector pin holder The contact area (heat transfer area) of 42 and the heat dissipation area are increased, which further has the advantage of excellent heat dissipation.
進而，專利文獻1及2所提出之脫模力測定裝置中，必須將水晶壓電式負載墊圈埋設於模具內，因而難以將脫模力測定裝置之配線空 間確保於模具內。與此相對，本實施形態之樹脂成形模具26中，能夠將模具本體32與底板34之間之空間用作配線空間，因而能夠充分確保配線空間。 Furthermore, in the mold-releasing force measuring devices proposed in Patent Documents 1 and 2, it is necessary to embed the crystal piezoelectric load washer in the mold, so it is difficult to empty the wiring of the mold-releasing force measuring device. Keep in the mold. On the other hand, in the resin molding die 26 of the present embodiment, the space between the die body 32 and the bottom plate 34 can be used as the wiring space, and therefore the wiring space can be sufficiently secured.
以上，已對本發明之較佳之實施形態進行了說明，但本發明之技術範圍不限定於上述實施形態所記載之範圍。能夠於上述各實施形態中添加多種變更或改良。 The preferred embodiments of the present invention have been described above, but the technical scope of the present invention is not limited to the scope described in the above embodiments. Various changes or improvements can be added to the above embodiments.
例如，上述實施形態中，已說明以樹脂密封裝置10為中心，於樹脂密封裝置10之一側面側配置有工件輸入板供給機構60，於樹脂密封裝置10之另一側面側配置有樹脂成形品回收機構70，但不限於此，該等樹脂密封裝置10、工件輸入板供給機構60及樹脂成形品回收機構70之配置關係能夠適當變更。而且，關於工件輸入板供給機構60之內部及樹脂成形品回收機構70之內部之各構成要素之構成或配置，亦能夠適當地加以變更。 For example, in the above-described embodiment, it has been described that the resin sealing device 10 is the center, the workpiece input plate supply mechanism 60 is disposed on one side of the resin sealing device 10, and the resin molded product is disposed on the other side of the resin sealing device 10 The recovery mechanism 70 is not limited to this, and the arrangement relationship of the resin sealing device 10, the workpiece input plate supply mechanism 60, and the resin molded product recovery mechanism 70 can be appropriately changed. In addition, the configuration or arrangement of each component inside the workpiece input plate supply mechanism 60 and the resin molded product recovery mechanism 70 can also be appropriately changed.
上述實施形態中，已說明樹脂成形裝置進行樹脂密封成形之樹脂密封裝置10，但不限於此，例如亦可為射出形成裝置。 In the above embodiment, the resin sealing device 10 that performs resin sealing molding by the resin molding device has been described, but it is not limited to this, and may be an injection forming device, for example.
上述實施形態中，已說明作為樹脂密封對象之工件為引線框架W，但不限於此，亦可為安裝有電子零件之電子零件基板。該情形時，亦可僅於上模及下模中的與電子零件基板之間形成空腔之模具中，設置本實施形態之脫模力測定機構50。 In the above embodiment, the work to be resin-sealed has been described as the lead frame W, but it is not limited to this, and may be an electronic component board mounted with electronic components. In this case, the mold release force measuring mechanism 50 of this embodiment may be provided only in the mold that forms a cavity between the upper mold and the lower mold and the electronic component substrate.
上述實施形態中，已說明頂出銷44針對一個空腔C設置有兩個，但不限於此，亦可為僅設置一個之構成，還可為設置有三個以上之構成。 In the above embodiment, it has been explained that two ejection pins 44 are provided for one cavity C, but it is not limited to this, and it may be configured to provide only one, or may be configured to provide more than three.
上述實施形態中，已說明對全部頂出銷44設置脫模力測定機構50(應變產生體52及應變計54a~54d)，但不限於此，對一個或複數 個空腔C設置至少一個脫模力測定機構50即可，亦可為存在未設置脫模力測定機構50之頂出銷44之構成。即，可為脫模力測定機構50(應變產生體52及應變計54a~54d)設置於針對一個空腔C而設置的一個或複數個頂出銷44之全部之構成，亦可為設置於針對一個空腔C而設置的兩個以上之頂出銷44中之一個之構成，還可為設置於針對一個空腔C而設置的三個以上之頂出銷44中之兩個以上之構成。而且，不限定為針對樹脂成形模具26內之所有空腔C設置脫模力測定機構50之構成，亦可為存在未設置脫模力測定機構50之空腔C之構成。即便於如此存在未設置脫模力測定機構50之空腔C之情形時，亦能夠進行脫模力之取樣。另外，於該等情形時，未設置有脫模力測定機構50(應變產生體52及應變計54a~54d)之頂出銷44可設為基端部4b埋設於頂出銷保持具42之構成。 In the above-mentioned embodiment, it has been explained that the ejection force measuring mechanism 50 (strain generating body 52 and strain gauges 54a to 54d) is provided for all the ejection pins 44, but it is not limited to this. Each cavity C only needs to be provided with at least one demolding force measuring mechanism 50, or it may be configured to have an ejector pin 44 without the demolding force measuring mechanism 50. That is, the demoulding force measuring mechanism 50 (the strain generating body 52 and the strain gauges 54a to 54d) may be provided in all of one or a plurality of ejection pins 44 provided for one cavity C, or may be provided in The configuration of one of two or more ejection pins 44 provided for one cavity C may be a configuration of two or more of three or more ejection pins 44 provided for one cavity C . In addition, the configuration is not limited to the configuration in which the demolding force measuring mechanism 50 is provided for all the cavities C in the resin molding die 26, and the configuration in which the cavity C in which the demolding force measuring mechanism 50 is not provided may be present. That is, it is convenient to sample the demolding force even when the cavity C of the demolding force measuring mechanism 50 is not provided in this way. In addition, in such cases, the ejector pin 44 that is not provided with the demolding force measuring mechanism 50 (strain generating body 52 and strain gauges 54a to 54d) can be set as the base end portion 4b buried in the ejector pin holder 42 Pose.
上述實施形態中，已說明應變產生體52之薄壁部53a~53d形成為半圓狀，藉此於應變產生體52劃定鐵啞鈴狀(以細槽連結真圓狀之兩端開口而成之形狀)之切口，但形成於應變產生體52之切口之形狀不作特別限定，能夠採用例如將以細槽連結橢圓形狀或四邊形狀之兩端開口而成之形狀(杠鈴形狀)等各種形狀。即，應變產生體52於上下一對平行梁部52c、52d之與固定側端部52a之邊界部分及與可動側端部52b之邊界部分，分別形成有成為應變部位之薄壁部53a~53d即可，薄壁部53a~53d之形狀不作特別限定。 In the above-mentioned embodiment, it has been described that the thin-walled portions 53a to 53d of the strain generating body 52 are formed in a semicircular shape, whereby the strain generating body 52 is divided into an iron dumbbell shape (which is formed by connecting both ends of a true circle with thin grooves Shape), but the shape of the cut formed in the strain generating body 52 is not particularly limited, and various shapes such as a shape (barbell shape) formed by connecting both ends of an oval shape or a quadrangular shape with thin grooves can be adopted. That is, the strain generating body 52 is formed with thin portions 53a to 53d as strain portions at the boundary portion between the pair of upper and lower parallel beam portions 52c and 52d and the fixed side end portion 52a and the movable side end portion 52b That is, the shape of the thin-walled portions 53a to 53d is not particularly limited.
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| JP7102238B2 (en) * | 2018-06-08 | 2022-07-19 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
| CN111251564A (en) * | 2020-03-20 | 2020-06-09 | 金发科技股份有限公司 | System, method and application for measuring demolding force of polymer injection molding |
| JP7114127B1 (en) | 2021-10-28 | 2022-08-08 | アサヒ・エンジニアリング株式会社 | Predictive maintenance system for resin encapsulation device and its molding die, and automatic cleaning method for molding die |
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| TW504448B (en) * | 1998-08-28 | 2002-10-01 | Futaba Denshi Kogyo Kk | Abnormal mold detector |
| TW200914239A (en) * | 2007-09-21 | 2009-04-01 | Komatsu Ind Corp | Thermoforming apparatus and mold system used thereby |
| JP2014119371A (en) * | 2012-12-18 | 2014-06-30 | A & D Co Ltd | Roberval type load cell |
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