CN107530915B - Resin molding mold and resin molding apparatus - Google Patents
Resin molding mold and resin molding apparatus Download PDFInfo
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- CN107530915B CN107530915B CN201680018903.XA CN201680018903A CN107530915B CN 107530915 B CN107530915 B CN 107530915B CN 201680018903 A CN201680018903 A CN 201680018903A CN 107530915 B CN107530915 B CN 107530915B
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- knock pin
- strain
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- side end
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/7626—Measuring, controlling or regulating the ejection or removal of moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Resin molding mold has knock pin and knockout press measuring means.Knockout press measuring means, have and the strain that load transfer is strain is generated into body, and it is attached at the strain gauge that strain generates the strain position of body, strain generates body and includes the fixation side end that can not be relatively movably fixed on resin molding mold, the movable side end being arranged in a manner of being contacted by the base end part with knock pin, and self-retaining side end bridgees across the parallel beam portion a pair of up and down of movable side end and edge and the direction extension that the axis direction of knock pin is intersected, a pair of parallel girder portion is formed with respectively at the boundary part of fixed side end and with the boundary part of movable side end as the thinner wall section for straining position up and down, strain gauge is attached at the thinner wall section of a pair of parallel beam portion up and down respectively.
Description
Technical field
The present invention is the resin molding mold and resin molding apparatus for being related to a kind of forming of resin forming product and using.
Background technique
In the past, the resin molding mold used as the forming of resin forming product, is widely used following constitutor, that is, interior
It is equipped with the die face knock pin outstanding for capableing of self-forming cavity, makes the resin forming product of cavity internal shaping from mould using the knock pin
Emaciated face mould.In such resin molding mold, if the spots such as remaining resin are attached to die face, resin forming product can be bonded securely
Power (knockout press) in die face, thus when demoulding resin forming product by knock pin can become excessive, and have cause resin at
The damaged possibility of shape product or knock pin.In particular, in for by semiconductor element etc. carry out resin seal made of resin forming product
When the situation of (electronic component), it may cause to generate the semiconductor element etc. that cracking enters to inside because of excessive knockout press
It is great bad.
Therefore, in recent years, propose there be following knockout press measurement device (patent document 1 and 2), that is, in the base of knock pin
End setting crystal piezoelectric type loads washer (form of load unit), loads washer measurement in tree by the crystal piezoelectric type
It is assigned when the demoulding of resin-formed product to the load of knock pin, the maximum value of load after measured is regarded as knockout press, thus, it is possible to
Measure knockout press.According to such knockout press measurement device, theoretically for, because be easy carry out knockout press whether Yi Chang differentiation,
Therefore it is abnormal easily to determine whether generation forming.
[background technology document]
[patent document]
[patent document 1] Japanese Unexamined Patent Publication 2003-236898 bulletin
[patent document 2] Japanese Unexamined Patent Publication 2009-96120 bulletin.
Summary of the invention
[the invention project to be solved]
However, knockout press measurement device proposed in patent document 1 and 2 because use crystal piezoelectric type load washer as
Mensuration means are loaded, therefore there are problems that realizing difficult or shortage versatility.
That is, assign to load washer measurement by crystal piezoelectric type to the load of knock pin, and must be in mold
The underface (or surface) of knock pin loads washer to bury crystal piezoelectric type with the coaxial mode of knock pin.In general,
When using such as situation of the knock pin of the diameter with 1mm or so, in order to ensure being resistant to live load when demoulding
Performance, and need to load washer using the crystal piezoelectric type of the diameter at least with 10mm or so.Therefore, patent document 1 and 2 institutes
It is that the crystal piezoelectric type load washer by diameter greater than knock pin is embedded in mold in the knockout press measurement device of proposition.So
And the shape etc. according to resin forming product is needed, multiple knock pins, such multiple knock pins are densely configured for a cavity
In resin molding mold made of intensive configuration, crystal piezoelectric type load washer can be interfered with adjacent knock pin, thus
There are problems that the knockout press measurement device proposed in patent document 1 and 2 can not be used.
Therefore, the purpose of the present invention is to provide can measure knockout press, can be realized and resin that versatility is excellent at
Shape mold and resin molding apparatus.
[technical means to solve problem]
In order to achieve the above objectives, resin molding mold of the invention is with the cavity to form ester moulding
Die face, above-mentioned resin molding mold are characterized in that having: knock pin, are configured to protrude from above-mentioned die face, make by upper
The resin forming product for stating cavity forming is demoulded from above-mentioned die face；And knockout press measuring means, with the cardinal extremity with above-mentioned knock pin
The mode of portion's contact is arranged, and can measure the load born when the demoulding of above-mentioned resin forming product via above-mentioned knock pin,
Above-mentioned knockout press measuring means, which has to generate body and be attached at above-mentioned strain the strain that above-mentioned load transfer is strain, generates body
Strain position strain gauge, above-mentioned strain, which generates body and includes, can not relatively movably be fixed on above-mentioned resin molding mold
Fixed side end, the movable side end being arranged in a manner of being contacted with the base end part of above-mentioned knock pin, and from above-mentioned affixed side
End bridgees across above-mentioned movable side end and along the parallel girder a pair of of up and down of the direction that the axis direction with above-mentioned knock pin is intersected extension
Portion, above-mentioned parallel girder portion a pair of of up and down is respectively at the side with the boundary part of above-mentioned fixed side end and with above-mentioned movable side end
Boundary part, is formed with the thinner wall section as above-mentioned strain position, and above-mentioned strain gauge is attached at above-mentioned parallel girder a pair of of up and down respectively
The above-mentioned thinner wall section in portion.
Resin molding mold of the invention preferably has in turn: die ontology, has above-mentioned die face in surface, from the back side
It bridgees across above-mentioned die face and is formed with the through hole that can be inserted for above-mentioned knock pin；Bottom plate, the back side with above-mentioned die ontology
It is spaced apart；Knock pin keeps tool, with can be relative to the back of the die ontology between Yu Shangshu die ontology and above-mentioned bottom plate
The mode that face moves forward and backward is arranged, and is configured with above-mentioned knock pin in the position being aligned with above-mentioned through hole；And heat transfer member, with
The mode that above-mentioned die ontology links with above-mentioned bottom plate is arranged, the heat of above-mentioned bottom plate can be transferred to above-mentioned die ontology,
The above-mentioned fixed side end that preferably above-mentioned strain generates body is fixed on above-mentioned knock pin and keeps tool, above-mentioned knock pin keep tool and
Above-mentioned strain generates body and is spaced apart with above-mentioned bottom plate.
In resin molding mold of the invention, preferably above-mentioned knock pin keeps tool to pass through in the above-mentioned of above-mentioned die ontology
The position of through-hole alignment is formed with the perforation for bridgeing across the back side from surface and penetrating through and can accommodate the base end part of above-mentioned knock pin
The back side that above-mentioned knock pin keeps tool is fixed in hole, the above-mentioned fixed side end that above-mentioned strain generates body, and above-mentioned strain generates body
Above-mentioned movable side end contact in the above-mentioned through hole that above-mentioned knock pin keeps tool with the base end part of above-mentioned knock pin.
Moreover, preferably above-mentioned knock pin is provided with more for an above-mentioned cavity in resin molding mold of the invention
A, above-mentioned strain generates body and above-mentioned strain gauge is set in the above-mentioned multiple knock pins being arranged for an above-mentioned cavity
It is at least two.
Resin molding apparatus of the invention is characterized in that having: above-mentioned resin molding mold；And transfer device, to upper
State cavity supply resin.
[The effect of invention]
According to the present invention, it is possible to provide knockout press can be measured, can be realized and resin molding mold that versatility is excellent and
Resin molding apparatus.
Detailed description of the invention
Fig. 1 is the main parallax stereogram for indicating the schematic configuration of resin sealing systems of one embodiment of the invention.
Fig. 2 is the main view that outlined the resin molding apparatus of the present embodiment.
Fig. 3 is the main view that outlined the lower die (resin molding mold) of the present embodiment.
Fig. 4 is the enlarged cross-sectional view that will amplify along the schematic configuration of the section of the A-A' line of Fig. 3 and indicate.
Fig. 5 is the enlarged cross-sectional view that will amplify along the schematic configuration of the section of the B-B' line of Fig. 3 and indicate.
Fig. 6 (a) is the schematic configuration diagram of strain generation body when indicating usual, and Fig. 6 (b) is should sell of one's property when indicating demoulding
The schematic configuration diagram of raw body.
Fig. 7 (a) is the summary section for the state for being opened upper mold after indicating resin-seal molding, and Fig. 7 (b) is to indicate certainly
The state of Fig. 7 (a) acts the summary section for the state for demoulding resin forming product.
Specific embodiment
Hereinafter, being illustrated using attached drawing to implement preferable embodiment of the invention.In addition, implementation below
Scheme and non-limiting each scope of protection of the claims, moreover, the whole of the combination of the feature illustrated in embodiment does not limit
It is necessary in the solution institute of invention.
The resin sealing systems 1 of the present embodiment are as shown in Figure 1, have: carrying out the resin seal dress of resin-seal molding
(resin molding apparatus) 10 is set, workpiece (the lead frame W in the present embodiment) is supplied to resin sealing apparatus 10 and resin is defeated
Enter the workpiece input board feed mechanism 60 of plate, and from the resin forming product P's after the recycling resin seal of resin sealing apparatus 10
Resin forming product recovering mechanism 70, and be configured to automatically and continuously execute from lead frame W and resin input board to tree
The recycling of resin forming product P after the supply to resin seal of rouge sealing device 10.
Workpiece input board feed mechanism 60 and resin forming product recovering mechanism 70 are set to two along resin sealing apparatus 10
In the substrate 80 for the strip that side surface direction extends, resin sealing apparatus 10 is contained in the substantial middle part for being formed in substrate 80
In accommodating space.Moreover, in the resin sealing systems 1 of the present embodiment, be centered on resin sealing apparatus 10, it is close in resin
The side surface side (left side of Fig. 1) of seal apparatus 10 is configured with workpiece input board feed mechanism 60, in the another of resin sealing apparatus 10
Side surface side (right side of Fig. 1) is configured with resin forming product recovering mechanism 70.That is, in the resin sealing systems 1 of the present embodiment,
It is configured to as follows, that is, supply lead frame W and tree from the region (region of the left part side of Fig. 1) of the one end side of substrate 80
Rouge input board, after the region of the substantial middle of the length direction of substrate 80 carries out resin-seal molding, in the another of substrate 80
The region (region of the left part side of Fig. 1) of end side carries out the useless resin (mold selected, hardened at chute and gate portions
Part) removal (gate cutting) and resin forming product P recycling.
As shown in Figures 1 and 2, have: the lower platform 12 of rectangular plate-like is placed on bottom surface resin sealing apparatus 10；4
Connecting rod 14 extends upward from the quadrangle of lower platform 12；The upper mounting plate 16 of rectangular plate-like, quadrangle are linked to 4 connecting rods 14
Upper end；The mobile platform 18 of rectangular plate-like, quadrangle is for 4 perforations of connecting rod 14 and with energy between lower platform 12 and upper mounting plate 16
It is enough to be arranged along the mode that connecting rod 14 is gone up and down；Clamping mechanism 20 is gone up and down, is set between lower platform 12 and mobile platform 18 and makes to move
Moving platform 18 is gone up and down；Report means (not shown) are abnormal the generation that whens waiting or precognition is abnormal in resin sealing apparatus 10
When sound an alarm；And control unit (not shown), execute the various controls of resin sealing apparatus 10.Going up and down clamping mechanism 20 can
Using hydraulic type or the various clamping mechanisms such as electrodynamic type mode locking cylinder or hydraulic type or electrodynamic type angle lever clamping mechanism.Separately
Outside, in the resin sealing apparatus 10 of the present embodiment, the lower platform 12, connecting rod 14, upper mounting plate 16, mobile platform 18 and lifting
Clamping mechanism 20 because can use it is various well known to composition, therefore description is omitted.
Moreover, resin sealing apparatus 10 as shown in Fig. 2, have in turn: being set to the transfer of the upper surface of mobile platform 18
Mechanism 22, and the resin molding mold 26 being set between upper mounting plate 16 and transfer device 2.In addition, the tree of the present embodiment
In rouge sealing device 10, transfer device 22 as shown in Figures 4 and 5, can be using the various well known transfers for having following each portion
Mechanism, that is, multiple (being 5 in the present embodiment) receiving tanks form hole portion 24a, are connected to the cavity C of resin molding mold 26
And resin input board (not shown) can be accommodated；Plunger 24b forms hole portion 24a for each receiving tank and configures, will be contained in
The resin input board that tank is formed in hole portion 24a is accommodated to squeeze towards cavity C；And heating means (not shown), to ester moulding
Mold 26 and receiving tank form hole portion 24a and are heated, thus description is omitted.
Resin molding mold 26 is the shaping dies of so-called multiple tank mode, as shown in Fig. 2, having: being installed on upper mounting plate 16
Lower surface upper mold 28, and be installed on the top of transfer device 22 and form cavity C (referring to Fig. 4) together with upper mold 28
Lower die 30.In addition, for easy understanding, the holding omitted around covering lower die 30 has block 31a~31c in Fig. 2~Fig. 7
(referring to Fig.1) diagram.Moreover, upper mold 28 is removed in the following table of die ontology 28a in the resin molding mold 26 of the present embodiment
Face (die face) formed to make resin stream it is dynamic select portion 29a, chute portion 29b, aspect of gate part 29c and cavity portion 29d etc.
Light Difference (referring to Fig. 4) in specification outside, has the substantially construction symmetrical above and below with lower die 30, thus the description thereof will be omitted and
In-built diagram.
Lower die 30 as shown in Figures 3 and 4, have: die ontology 32, it is oppositely disposed with the die ontology 28a of upper mold 28 and
The cavity C of ester moulding is capable of forming between the die ontology 28a of upper mold 28；Bottom plate 34, the back side with die ontology 32
(lower surface) side is spaced apart；Ejecting mechanism 40, with can be relative to die ontology 32 between die ontology 32 and bottom plate 34
The mode that moves forward and backward of the back side be arranged；Die ontology 32 and bottom plate 34 are linked fixation by heat transfer member (supporting pillar) 36
Mode be arranged and when suppressing mode locking support die ontology 32, and be configured to the heat of bottom plate 34 being transferred to die ontology
32；And knockout press measuring means 50, when being installed on ejecting mechanism 40, and being configured to the demoulding of measurement resin forming product P
Knockout press.
Die ontology 32 is illustrated in figure 4 the metal component of rectangular plate-like, in surface (upper surface) have can with it is upper
The cavity portion 29d of the die ontology 28a of mould 28 forms the die face 32a of cavity C together.In die ontology 32 with ejecting mechanism 40
Aftermentioned knock pin 44 be aligned position, from the back side throughout die face 32a and be formed with can for knock pin 44 insert perforation
Hole 32b.
Bottom plate 34 is formed by the metal component of rectangular plate-like, is placed in the upper surface of transfer device 22.The bottom plate 34 is constituted
It is as follows, that is, the support die ontology 32 via heat transfer member 36, and by the heat being subject to from transfer device 22 via heat transfer structure
Part 36 is transferred to die ontology 32, and heats die ontology 32.In addition, in the resin sealing apparatus 10 of the present embodiment,
It is illustrated in transfer device 22 and is provided with heating means, and the heat of the heating means is passed to bottom plate 34, but not limited to this, also may be used
It is set as in the composition of inside setting heating means (not shown) of the inside or die ontology 32 of bottom plate 34.
Heat transfer member 36 is the supporting pillar formed by cylindric metal component, is configured to one end (lower end) and is fixed on
The upper surface of bottom plate 34, and the other end (upper end) is fixed on the back side of die ontology 32, thus to be separated with bottom plate 34
Position support die ontology 32.Moreover, the heat that heat transfer member 36 is configured to the bottom plate 34 that will be heated by heating means is transferred to
Die ontology 32, and die ontology 32 is heated to determined temperature.Heat transfer member 36 is configured to as shown in Fig. 3~Fig. 5 for one
A cavity C is provided with more (being 6 in the present embodiment), and the more heat transfer members 36 are to surround around each cavity C
Mode configures, and thus inhibits the flexure of the die ontology 32 around each cavity C, and inhibits the generation etc. of burr.
Ejecting mechanism 40 as shown in Figures 3 and 4, has: knock pin keeps tool 42, between die ontology 32 and bottom plate 34
It is arranged in a manner of it can be moved forward and backward relative to the back side of die ontology 32；Knock pin 44 is configured at and die ontology 32
The position of through hole 32b alignment；And driving means (not shown), so that knock pin is kept back of the tool 42 relative to die ontology 32
Before face moves forward and backward, and above-mentioned ejecting mechanism 40 is configured to by making knock pin keep the back side of the tool 42 relative to die ontology 32
Into, and keep knock pin 44 prominent from the die face 32a of die ontology 32, make the resin forming product P shaped by cavity C from mold sheet
The die face 32a of body 32 is demoulded.Driving means are configured to, and keep tool 42 in knock pin and are installed on its aftermentioned strain generation body
52 support knock pin to keep tool 42 with the position that bottom plate 32 separates, and keep knock pin when the demoulding of resin forming product P
Tool 42 advances towards die ontology 32.In addition, driving means for example can be using utilization in the ejecting mechanism 40 of the present embodiment
Electrical motor driven or the lowering action of compacting and the knock-pin carried out above push away etc. it is various it is well known constitute, thus omit its and say
It is bright.
Knock pin keeps tool 42 to have: being provided projectingly the top plate 42a, Yi Jitong of knock pin 44 towards die ontology 32
It crosses fastener and is installed on the back side of top plate 42a to enhance the backer board 42b of top plate 42a.Knock pin keeps 42 such as Fig. 4 institutes of tool
Show, is formed with the through hole 43 for bridgeing across the back side from surface and penetrating through in the position that the through hole 32b with die ontology 32 is aligned.It passes through
Through-hole 43 is configured to the step of the opening diameter for the back side for having the opening diameter of the surface side of top plate 42a less than backer board 42b
Shape, and portion can accommodate the base end part 44b of knock pin 44 in the inner.Moreover, in knock pin keep tool 42 in, in heat transfer member
The position of 36 alignments is formed with the heat transfer member through hole (not shown) penetrated through for heat transfer member 36.Heat transfer member through hole
There is the opening diameter of the outer diameter greater than heat transfer member 36 in order not to all face contacts with heat transfer member 36.
Knock pin 44 is as shown in figure 4, by the pin portion 44a that extends towards die ontology 32 and to be formed as diameter greater than pin
The pin component for the step that the base end part 44b of portion 44a is constituted.Pin portion 44a has keeps tool 42 to be located at position of readiness (figure in knock pin
Position shown in 4) in the state of, the die face 32a with die ontology 32 is the length of substantially conplane axis direction.Moreover,
Pin portion 44a has the opening diameter for the surface side for being less than the through hole 43 that knock pin keeps tool 42 and the perforation with die ontology 32
The roughly equal outer diameter of the opening diameter of hole 32b.Base end part 44b has the surface side for being greater than the through hole 43 that knock pin keeps tool 42
Opening diameter and be less than knock pin keep tool 42 through hole 43 back side opening diameter outer diameter.Knock pin 44 is in cardinal extremity
Portion 44b is contained in the through hole 43 of knock pin holding tool 42 and pin portion 44a is prominent towards die ontology 32 via through hole 43
In the state of out, the order difference part of the through hole 43 of tool 42 and the aftermentioned strain of knockout press measuring means 50 are kept by knock pin
It generates the movable side end 52b of body 52 and clamps base end part 44b, be thus installed on knock pin and keep tool 42.Knock pin 44 is constituted
To be provided with multiple (being two in the present embodiment) for a cavity C, equably made by the multiple knock pin 44
Resin forming product P demoulding.
Knockout press measuring means 50 be so-called Luo Baiwa (ロ バ ー バ Le) type load unit, as shown in figure 4, have with
The strain that the load born from knock pin 44 proportionally deforms generates body 52 and detection strains answering for the deflection for generating body 52
Become meter 54a~54d.Strain, which generates, is installed on knock pin holding tool in a manner of body 52 is contacted by the base end part 44b with knock pin 44
42, strain gauge 54a~54d are attached at four strain positions (aftermentioned thinner wall section 53a~53d) that strain generates body 52 respectively.It is de-
Mould power measuring means 50 is configured for each knock pin 44, in the present embodiment, as shown in Figures 4 and 5, for a cavity
C and there are two respectively configuring.Each knockout press measuring means 50 as shown in figure 5, in order not to other adjacent knockout press measuring means
50 and heat transfer member 36 interfere, and be set in the gap of multiple heat transfer members 36.Hereinafter, correspondence sells of one's property raw body 52 and answers
The specific composition for becoming meter 54a~54d is illustrated.
Strain generates body 52 such as shown in Fig. 6 (a), in the mode for keeping the lower surface of tool 42 vertical relative to knock pin
The vertical section for erectting setting is the tabular component of substantially L-shaped, and it is mute to be formed with iron in the horizontally extending position of L word
The notch of bell-shaped, also, L word along vertical direction extend position in knock pin keep tool 42 through hole 43 in ejection
Pin 44 base end part 44b contact mode, and by near the end at the horizontally extending position of L word to be protected in knock pin
The back side for holding tool 42 is fixed as the mode of cantilever.Specifically, strain, which generates body 52 and includes, is fixed on knock pin holding
The fixation side end 52a at the back side of tool 42, the movable side end being arranged in a manner of being contacted by the base end part 44b with knock pin 44
52b and self-retaining side end 52a bridgees across movable side end 52b and extends along the direction that the axis direction with knock pin 44 is intersected
Beam portion 52c, 52d a pair of parallel up and down.The strain generates body 52 and is formed as following shape, that is, substantially L-shaped: movable side
The lower surface of portion 52b from the base end part 44b of knock pin 44 extend along the axis direction of knock pin 44, upper and lower a pair of parallel beam portion 52c,
52d extends from the lower end of movable side end 52b along the direction orthogonal with the axis direction of knock pin 44, fixed side end 52a
Beam portion 52c, 52d parallel with upper and lower a pair be connected and along equidirectional extension.
Shown in fixed side end 52a such as Fig. 4 and Fig. 6 (a), in order to be relatively moved relative to 30 entirety of lower die, and lead to
It crosses fastener and is fixed on the back side that knock pin keeps tool 42.Movable side end 52b is configured to the base of end and knock pin 44 thereon
The following table face contact of end 44b, lower end side are connected with the one end of upper and lower a pair of parallel beam portion 52c, 52d.It is a pair of up and down
Parallel beam portion 52c, 52d is respectively at the boundary part with the boundary part of fixed side end 52a and with movable side end 52b, shape
At the thinner wall section 53a~53d for having the semicircle shape for becoming the position (strain position) deformed with the load from knock pin 44,
It is configured to that it is mute to delimit iron by a pair of parallel beam portion 52c, 52d, fixed side end 52a and movable side end 52b up and down as a result,
The notch of bell-shaped.Strain gauge 54a~the 54d being configured in thinner wall section 53a~53d of upper and lower a pair of parallel beam portion 52c, 52d
The position attached, to the sticking position (center) of specific strain meter 54a~54d when processed respectively for manufacturing process
Markings (not shown), and improve strain gauge 54a~54d attaching operation workability and accuracy.
Strain generates body 52 by as above constituting, and is configured to when in demoulding via 44 additional load of knock pin
When, as shown in Fig. 6 (b), the thinner wall section 53a of the side movable side end 52b of the parallel beam portion 52c of upside and the parallel beam portion of downside
The thinner wall section 53d of the fixation side end side 52a of 52d on compression direction in straining, the fixation side end of the parallel beam portion 52c of upside
The thinner wall section 53c of the side movable side end 52b of the parallel beam portion 52d of the thinner wall section 53b and downside of the side 52a on extending direction in answering
Become.
Strain gauge 54a~54d is configured to correspond to strain and resistance changes, and as shown in Fig. 6 (a) and Fig. 6 (b),
By being constituted as follows: the 1st strain gauge 5a is attached at the thinner wall section 53a of the side movable side end 52b of the parallel beam portion 52c of upside；
2nd strain gauge 54b is attached at the thinner wall section 53b of the fixation side end side 52a of the parallel beam portion 52c of upside；3rd strain gauge
54c is attached at the thinner wall section 53c of the side movable side end 52b of the parallel beam portion 52d of downside；And the 4th strain gauge 54d, it attaches
Thinner wall section 53d in the fixation side end side 52a of the parallel beam portion 52d of downside.Four stress gauges 54a~the 54d is to constitute
Wheatstone bridge (ホ イ ー ト ス ト Application Block リ ッ ジ) mode of circuit (not shown) is connected with each other.
The Wheatstone bridge circuit formed for each knockout press measuring means 50 is respectively via amplifier (not shown)
And A/D converter (not shown) and with data collection parsing means it is (not shown) be electrically connected.In the present embodiment, by multiple
Knockout press measuring means 50, amplifier and A/D converter and shared data collection parsing means, are configured to uniformly measure
The knockout press measurement device of knockout press when demoulding in all cavity Cs.
Data collection parsing means are configured to as follows, that is, such as constituting by PC, are based on strain gauge 54a~54d
Resistance value and calculate strain value, and be based on the strain value, measurement be attached to via knock pin 44 strain generate body 52 can
The load of dynamic side end 52b, that is, knockout press when demoulding.
Moreover, data collection parsing means are configured to determine that demoulding is bad based on the load (knockout press) that is measured, in sentencing
When being set to the undesirable situation of demoulding, to report means reporting signal.Specifically, data collection parsing means be configured in
Such as load (the demoulding that the single value of the load (knockout press) that (1) is measured, (2) both determine in fixed cycle or given time
Power) instant average value, the difference of the value of load (knockout press) that (3) are determined and previous average value, (4) are determined
It loads the climbing of (knockout press), the climbing for the average value that (5) calculate immediately or (6) and passes through multiple knockout press measuring means
50 and the unevenness (poor) of load (knockout press) etc. that measures is determined as when being more than the situation of preparatory set setting value (threshold value)
It demoulds bad.In particular, being able to detect the spot of the part in a cavity C, and can according to the determination method of above-mentioned (6)
Prediction or the specific spot position, moreover, being also able to carry out the trend analysis etc. at spot position easy to attach etc..
If report means are configured to parse means reception report signal from data collection, sound an alarm.As such report
The form of the alarm of announcement means also can be appropriate in addition to it can use and carry out the form of auditory report and sounding an alarm sound
Using the form for for example making the lightings such as lamp or in the display picture for being set to resin sealing apparatus 10 or it is connected to resin seal dress
Set the form of information is shown on the display picture of 10 PC etc. or make a part for showing picture or whole flashing or with
The form etc. of the progress visual report such as set form of color lighting.By thus planting the alarm of report means sending, operation
The generation (having the necessity of cleaning) for the spot that personnel are able to recognize that in die face 32a, and can predict by demoulding bad draw
The breakage or bad order of the resin forming product P risen.
Has the resin sealing apparatus 10 of the present embodiment of the above composition as shown in figure 4, being configured in by upper mold 28
And in the state that lower die 30 clamps lead frame W, by mold materials of the plunger 24b pressurization through melting, according to choosing for upper mold 28
Portion 29a → chute portion 29b → gate part 29c → cavity portion 29d sequential flowing is selected, and makes its thermmohardening, thus will be configured at
Electronic component in cavity C carries out mold, to manufacture resin forming product P.Moreover, the resin sealing apparatus 10 of the present embodiment
It is configured to after the completion of the mold of electronic component, so that lower die 30 is left upper mold 28 and declining mobile platform 18, and with
Its parallel or synchronously, the ejecting mechanism (not shown) by being built in upper mold 28 makes resin forming product P from the die face of upper mold 28
Demoulding.In turn, the resin sealing apparatus 10 of the present embodiment is configured to as shown in Fig. 7 (a), in making lower die 30 leave upper mold 28
Afterwards, as shown in Fig. 7 (b), demould resin forming product P from the die face 32a of lower die 30 by ejecting mechanism 40.Moreover, this implementation
The resin sealing apparatus 10 of scheme, which is immediately measured or monitored by knockout press measuring means 50 (knockout press measurement device), to be made to set
Knockout press when resin-formed product P is demoulded from the die face of upper mold 28 and when demoulding resin forming product P from the die face 32a of lower die 30,
When detecting that demoulding is bad, sounded an alarm by report means.
Workpiece input board feed mechanism 60 is as shown in Figure 1, have: workpiece input board carrying device 62, by lead frame W
(workpiece) and resin input board are transported between the upper mold 28 and lower die 30 of resin sealing apparatus 10；Bracket 64 accommodates more
A lead frame W；The lead frame W for being contained in bracket 64 is sent to work by Workpiece supplier (propeller) 66 piecewise
Part input board carrying device 62；Input board feedway 68 supplies resin input board to workpiece input board carrying device 62；
Driving portion (not shown) is respectively arranged at workpiece input board carrying device 62, Workpiece supplier 66 and input board supply dress
Set 68；And control unit (not shown), each driving portion is controlled with synchronous or asynchronous regime.60 structure of workpiece input board feed mechanism
As the control by control unit, the confession of lead frame W and resin input board to resin sealing apparatus 10 can be automatically carried out
It gives.
Resin forming product recovering mechanism 70 is as shown in Figure 1, have: conveyance device 72, moves out from resin sealing apparatus 10 attached
The resin forming product P of useless resin；Pouring-head cutting device 74, by being pressed and resin forming product P integrally formed nothing from top
Separate useless resin with resin forming product P；Returnable 76 recycles the useless resin for being separated and being fallen；Tree
Resin-formed product recyclable device 78, recycling eliminate the resin forming product P of useless resin；Driving portion (not shown), is respectively arranged at
Conveyance device 72, pouring-head cutting device 74 and resin forming product recyclable device 78；And control unit (not shown), with synchronous or non-
Synchronous regime controls each driving portion.Resin forming product recyclable device 78 has: carrying device 78a, in gate cutting position and tree
It is arranged in a manner of it can move back and forth between resin-formed product recovery position；Bracket 78b recycles resin forming product P；And it sends out
Device (propeller) 78c, by resin forming product P mounted in the carrying device 78a that arrived resin forming product recovery position
It is sent to bracket 78b.Resin forming product recovering mechanism 70 is configured to the control by control unit, automatically carries out attached useless resin
Resin forming product P from the removal of resin forming product P and eliminate useless tree from the moving out of resin sealing apparatus 10, useless resin
The recycling of the resin forming product P of rouge.
Secondly, being illustrated to the movement of the resin sealing systems 1 of the present embodiment.In addition, resin seal system below
The movement of system 1 based on preparatory memory in the formula drive control each component in memory portion by being executed.
Draw firstly, being sent out piecewise by Workpiece supplier 66 from bracket 64 towards workpiece input board carrying device 62
Wire frame W.Moreover, being parallel with, multiple (being 5 in the present embodiment) resin input boards are handed over from input board feedway 68
It pays to workpiece input board carrying device 62.If lead frame W and resin input board are delivered to workpiece input plate conveying dress
62 are set, then workpiece input board carrying device 62 is moved to keep the state of retractd lead frame W and resin input board
It to resin sealing apparatus 10, is placed in lead frame W on the die ontology 32 of lower die 30, and distinguishes resin input board
The receiving tank for being thrown to transfer device 22 forms hole portion 24a.
If lead frame W and resin input board are delivered to resin sealing apparatus 10, resin sealing apparatus 10 executes tree
Rouge seal molding.Specifically, resin sealing apparatus 10 in the mode being located in cavity C with electronic component and by upper mold 28 and
In the state that lower die 3 clamps lead frame W, make to accommodate the mold materials direction melted in tank formation hole portion 24a by plunger 24b
Flowing in cavity C by making to flow into the mold materials thermmohardening in cavity C, and resin forming product P is shifted and is shaped.Moreover,
Resin sealing apparatus 10 makes lower die 30 leave upper mold after the completion of the mold of electronic component and declining mobile platform 18
28, and it is in parallel or synchronously, and the ejecting mechanism by being built in upper mold 28 makes resin forming product P from the die face of upper mold 28
Demoulding.In turn, the resin sealing apparatus 10 of the present embodiment makes to set after making lower die 30 leave upper mold 28 by ejecting mechanism 40
Resin-formed product P is demoulded from the die face 32a of lower die 30.At this point, resin sealing apparatus 10 passes through 50 (knockout press of knockout press measuring means
Measurement device) immediately measure or monitor that knockout press when demoulding resin forming product P passes through when detecting that demoulding is bad
Report means sound an alarm.
Conveyance device 72 recycles the resin forming product P of the attached useless resin in resin sealing apparatus 10, and cuts towards cast gate
Disconnected device 74 transports.If the resin forming product P by the attached useless resin of conveyance device 72 reaches pouring-head cutting device 74, pour
Mouth disconnecting device 74 separates it with resin forming product P and being attached to the useless resin of resin forming product P from top pressing,
The useless resin fallen therefrom is collected the collection of container 76.Then, by resin forming product recyclable device 78, recycling is eliminated
The resin forming product P of useless resin.
Moreover, can automatically and continuously manufacture resin forming product P by repeating above step.
As described above, the resin molding mold 26 of the present embodiment is with the cavity to form ester moulding
The resin molding mold of the die face 32a of C, and have: knock pin 44 is configured to protrude from die face 32a, makes to pass through cavity C
The resin forming product P of forming is demoulded from die face 32a；And knockout press measuring means 50, it is connect with the base end part 44b with knock pin 44
The mode of touching is arranged, and can measure the load born when the demoulding of resin forming product P via knock pin 44；Knockout press measurement
Mechanism 50, which has, to be generated body 52 for the strain that load transfer is strain and is attached at the strain position (thin-walled of strain generation body 52
Portion 53a~53d) strain gauge 54a~54d, strain generates body 52 and includes and can not relatively movably be fixed on resin molding mold
26 fixation side end 52a, the movable side end 52b being arranged in a manner of being contacted by the base end part 44b with knock pin 44, and from
Fixed side end 52a bridgees across movable side end 52b and extends along the direction that the axis direction with knock pin 44 is intersected a pair of up and down
Parallel beam portion 52c, 52d, up and down a pair of parallel beam portion 52c, 52d respectively at the boundary part of fixed side end 52a and with can
The boundary part of dynamic side end 52b, is formed with the thinner wall section 53a~53d for becoming strain position, and strain gauge 54a~54d is pasted respectively
Invest thinner wall section 53a~53d of a pair of parallel beam portion 52c, 52d up and down.
In this way, the resin molding mold 26 of the present embodiment is able to detect demoulding and having knockout press measuring means 50
It is bad, thus for operating personnel, it can be appreciated that the generation (having the necessity of cleaning) of the spot of die face 32a or by
A possibility that demoulding breakage and the bad order etc. of bad caused resin forming product P.Above-mentioned advantage is in such as the present embodiment
The confession automatically and continuously executed from lead frame W and resin input board to resin sealing apparatus 10 as resin sealing systems 1
To being particularly effective in the fully automatic system to the recycling of the resin forming product P after resin seal.
Moreover, the resin molding mold 26 of the present embodiment is configured to intersect by the main axis direction along with knock pin 44
The knockout press measuring means 50 (the primary tile-type load unit of sieve) that extends of direction measure the load of knock pin 44, thus must with using
The situation that the crystal piezoelectric type load washer of the major diameter of the underface of knock pin 44 must be embedded in is compared, and knockout press measurement can be improved
The setting number of mechanism 50 and the freedom degree of configuration.That is, according to the resin molding mold 26 of the present embodiment, it can be with adjacent
The extending direction of each knockout press measuring means 50 is staggered and matches by the mode that knockout press measuring means 50 does not interfere each other
It sets, it is thus possible to realize for example in the composition of the whole setting knockout press measuring means 50 for the multiple knock pins 44 being intensively arranged
Deng.
Moreover, the resin molding mold 26 of the present embodiment is as above, and then have: die ontology 32 has in surface
There is die face 32a, bridgees across die face 32a from the back side and be formed with the through hole 32b that can be inserted for knock pin 44；Bottom plate 34, with mould
The back side of tool ontology 32 is spaced apart；Knock pin keeps tool 42, with can be relative between die ontology 32 and bottom plate 34
The mode that the back side of die ontology 32 moves forward and backward is arranged, and is configured with knock pin 44 in the position being aligned with through hole 32b；With
And heat transfer member 36, it is arranged in a manner of linking die ontology 32 with bottom plate 34, the heat of bottom plate 34 can be transferred to mold
Ontology 32, the fixation side end 52a that strain generates body 52 are fixed on knock pin and keep tool 42, and knock pin keeps tool 42 and should sell of one's property
Raw body 52 is spaced apart with bottom plate 34.
According to such resin molding mold 26, influence of the heat to knockout press measuring means 50 can reduce.That is, patent document
In the 1 and 2 knockout press measurement devices proposed, it is necessary to crystal piezoelectric type load washer is embedded in the mold of high temperature, and held
The influence of heat vulnerable to mold, thus there are the reliability of measured value is insufficient, moreover, easily causing knockout press measurement device
Deterioration the problem of.In contrast, in the resin molding mold 26 of the present embodiment, it is provided with the strain of strain gauge 54a~54d
Generating body 52 and being provided with the strain to generate the knock pin holding tool 42 of body 52 is spaced apart with the bottom plate 34 of high fever, as a result,
Compared with using the existing crystal piezoelectric type for the underface that must be embedded in knock pin 44 to load the situation of washer, it can reduce
Influence of the heat to knockout press measuring means 50.In particular, in the knockout press measuring means 50 of the present embodiment, strain generate body 52 by
Vertically standing up knock pin keeps the tabular component of the lower surface of tool 42 to constitute, and thus, it is possible to reduce to keep with knock pin
The contact area (heat transfer area) of tool 42, and, increasing heat radiation area, thus further have the advantages that thermal diffusivity is excellent.
In turn, in the knockout press measurement device that patent document 1 and 2 is proposed, it is necessary to bury crystal piezoelectric type load washer
In mold, thus it is difficult to ensure the wiring space of knockout press measurement device in mold.In contrast, the present embodiment
Resin molding mold 26 in, can by the space between die ontology 32 and bottom plate 34 be used as wiring space, it is thus possible to fill
Dividing ensures wiring space.
More than, preferable embodiment of the invention is illustrated, but technical scope of the invention is not limited to
Range documented by the embodiment above.Numerous variations or improvement can be added in above-mentioned each embodiment.
For example, in the embodiment above, it is stated that centered on resin sealing apparatus 10, in the one of resin sealing apparatus 10
Side is configured with workpiece input board feed mechanism 60, is configured with resin forming product in the other side surface side of resin sealing apparatus 10
Recovering mechanism 70, but not limited to this, the resin sealing apparatus 10, workpiece input board feed mechanism 60 and resin forming product recycling
The configuration pass of mechanism 70 is can to suitably change.Moreover, inside and resin forming product about workpiece input board feed mechanism 60
The composition or configuration of each component of the inside of recovering mechanism 70, also can suitably be changed.
In the embodiment above, it is stated that resin molding apparatus carries out the resin sealing apparatus 10 of resin-seal molding, but
It is without being limited thereto, such as also device can be formed to project.
In the embodiment above, it is stated that the workpiece as resin seal object is lead frame W, but not limited to this, also
It can be the electronic component substrate for being equipped with electronic component.When the situation, also can only in upper mold and lower die with electronic component base
It is formed between plate in the mold of cavity, the knockout press measuring means 50 of the present embodiment is set.
In the embodiment above, it is stated that knock pin 44 is directed to there are two a cavity C settings, but not limited to this, also may be used
It can be also above composition there are three settings for the composition for being only arranged one.
In the embodiment above, it is stated that (strain generates body 52 to whole knock pins 44 setting knockout press measuring means 50
And strain gauge 54a~54d), but not limited to this, at least one knockout press measuring means 50 is arranged i.e. to one or more cavity Cs
Can, it also can be that there are the compositions of the knock pin 44 of not set knockout press measuring means 50.That is, can be knockout press measuring means 50
(strain generates body 52 and strain gauge 54a~54d) is set to the one or more knock pins 44 being arranged for a cavity C
Whole compositions, also can be one composition being set in the more than two knock pins 44 being arranged for a cavity C,
It can also be the more than two compositions being set in three or more knock pins 44 being arranged for a cavity C.Moreover, not
It is limited to the composition for all cavity Cs setting knockout press measuring means 50 in resin molding mold 26, it also can be in the presence of not
The composition of the cavity C of knockout press measuring means 50 is set.It is convenient for the cavity C that so there is not set knockout press measuring means 50
Situation when, be also able to carry out the sampling of knockout press.In addition, being not provided with knockout press measuring means 50 when the situation and (answering
Sell of one's property raw body 52 and strain gauge 54a~54d) knock pin 44 can be set as base end part 4b be embedded in knock pin keep tool 42 structure
At.
In the embodiment above, it is stated that strain generate body 52 thinner wall section 53a~53d be formed as semicircle shape, thus in
Strain generates body 52 and delimit the notch of iron dumbbell shaped (with shape made of the both ends open of stria connection proper circle shape), but is formed in
The shape that strain generates the notch of body 52 is not particularly limited, and can use for example will link elliptical shape or quadrangle with stria
The various shapes such as shape made of the both ends open of shape (barbell-shaped).That is, strain generates body 52 in upper and lower a pair of parallel beam portion
The boundary part with the boundary part of fixed side end 52a and with movable side end 52b of 52c, 52d, being respectively formed with becomes
Thinner wall section 53a~the 53d at position is strained, the shape of thinner wall section 53a~53d is not particularly limited.
Symbol description:
1 resin sealing systems
10 resin molding apparatus
22 transfer devices
26 resin molding molds
28 upper molds
30 lower dies
32 die ontologies
32a die face
The through hole of 32b die ontology
34 bottom plates
36 heat transfer members
42 knock pins keep tool
43 knock pins keep the through hole of tool
44 knock pins
The base end part of 44b knock pin
50 knockout press measuring means
52 strains generate body
52a fixes side end
The movable side end 52b
The parallel beam portion of 52c, 52d
53a~53d thinner wall section
54a~54d strain gauge
C cavity
P resin forming product
W lead frame.
Claims (4)
1. a kind of resin molding mold has the die face to form the cavity of ester moulding, which is characterized in that have:
Knock pin is configured to protrude from above-mentioned die face, makes the resin forming product shaped by above-mentioned cavity from above-mentioned die face
Demoulding；
Knockout press measuring means is arranged in a manner of contacting with the base end part of above-mentioned knock pin, can measure in above-mentioned resin at
The load born when the demoulding of shape product via above-mentioned knock pin；
Die ontology, in surface have above-mentioned die face, from the back side bridge across above-mentioned die face and be formed with can for above-mentioned knock pin insert
Logical through hole；
Bottom plate is spaced apart with the back side of above-mentioned die ontology；
Knock pin keeps tool, can retreat relative to the back side of the die ontology between Yu Shangshu die ontology and above-mentioned bottom plate
Mobile mode is arranged, and is configured with above-mentioned knock pin in the position being aligned with above-mentioned through hole；And
Heat transfer member is arranged in a manner of by above-mentioned die ontology and the connection of above-mentioned bottom plate, can transmit the heat of above-mentioned bottom plate
Extremely above-mentioned die ontology,
Above-mentioned knockout press measuring means has that the strain that above-mentioned load transfer is strain is generated body and is attached at and above-mentioned should sell of one's property
The strain gauge at the strain position of raw body,
Above-mentioned strain generate body include can not relatively movably be fixed on above-mentioned resin molding mold fixation side end, with
The movable side end and bridgeed across from above-mentioned fixed side end above-mentioned movable that the mode of the base end part contact of above-mentioned knock pin is arranged
The parallel beam portion a pair of up and down of side end and edge and the direction extension that the axis direction of above-mentioned knock pin is intersected,
Above-mentioned parallel girder portion a pair of of up and down respectively at the boundary part of above-mentioned fixed side end and with above-mentioned movable side end
Boundary part is formed with the thinner wall section as above-mentioned strain position,
Above-mentioned strain gauge is attached at the above-mentioned thinner wall section of above-mentioned parallel beam portion a pair of up and down respectively,
The above-mentioned fixed side end that above-mentioned strain generates body is fixed on above-mentioned knock pin and keeps tool,
Above-mentioned knock pin keeps tool and above-mentioned strain generation body to be spaced apart with above-mentioned bottom plate.
2. resin molding mold according to claim 1, wherein
Above-mentioned knock pin keeps tool in the position that the above-mentioned through hole with above-mentioned die ontology is aligned, and is formed with from surface and bridgees across back
Face and the through hole that penetrates through and can accommodate the base end part of above-mentioned knock pin,
The back side that above-mentioned knock pin keeps tool is fixed in the above-mentioned fixed side end that above-mentioned strain generates body,
Above-mentioned strain generate the above-mentioned movable side end of body in the above-mentioned through hole that above-mentioned knock pin keeps tool with above-mentioned ejection
The base end part of pin contacts.
3. resin molding mold according to claim 1 or 2, wherein
Above-mentioned knock pin for an above-mentioned cavity be provided with it is multiple,
Above-mentioned strain generates body and above-mentioned strain gauge is set in the above-mentioned multiple knock pins being arranged for an above-mentioned cavity
It is at least two.
4. a kind of resin molding apparatus, which is characterized in that have:
Resin molding mold described in any one of claims 1 to 3 item；And
Transfer device supplies resin to above-mentioned cavity.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015252609A JP6067832B1 (en) | 2015-12-24 | 2015-12-24 | Resin molding die and resin molding equipment |
| JP2015-252609 | 2015-12-24 | ||
| PCT/JP2016/081349 WO2017110230A1 (en) | 2015-12-24 | 2016-10-21 | Resin molding mold and resin molding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107530915A CN107530915A (en) | 2018-01-02 |
| CN107530915B true CN107530915B (en) | 2019-11-08 |
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| CN201680018903.XA Active CN107530915B (en) | 2015-12-24 | 2016-10-21 | Resin molding mold and resin molding apparatus |
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|---|---|
| JP (1) | JP6067832B1 (en) |
| KR (2) | KR102426984B1 (en) |
| CN (1) | CN107530915B (en) |
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| WO (1) | WO2017110230A1 (en) |
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| JP6869010B2 (en) * | 2016-11-16 | 2021-05-12 | 大和化成工業株式会社 | Molding machine maintenance management system and maintenance management method |
| JP7017368B2 (en) * | 2017-10-27 | 2022-02-08 | エムテックスマツムラ株式会社 | Plunger for resin molding equipment and resin molding equipment |
| JP7102238B2 (en) * | 2018-06-08 | 2022-07-19 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
| CN111251564A (en) * | 2020-03-20 | 2020-06-09 | 金发科技股份有限公司 | System, method and application for measuring demolding force of polymer injection molding |
| JP7114127B1 (en) | 2021-10-28 | 2022-08-08 | アサヒ・エンジニアリング株式会社 | Predictive maintenance system for resin encapsulation device and its molding die, and automatic cleaning method for molding die |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW504448B (en) * | 1998-08-28 | 2002-10-01 | Futaba Denshi Kogyo Kk | Abnormal mold detector |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09117941A (en) * | 1995-10-25 | 1997-05-06 | Hitachi Ltd | Mold release force measuring device |
| JP4042430B2 (en) | 2002-02-21 | 2008-02-06 | 日立化成工業株式会社 | Method and apparatus for detecting mold release force of molded product |
| JP5073430B2 (en) * | 2007-09-21 | 2012-11-14 | コマツ産機株式会社 | Hot press molding apparatus and mold system for the same |
| JP2009096120A (en) | 2007-10-18 | 2009-05-07 | Toshiba Corp | Mold releasing force measuring device, mold releasing force measuring method, resin molding device and manufacturing method of resin molded article |
| US8002532B2 (en) * | 2009-08-11 | 2011-08-23 | Milacron Llc | Apparatus for ejector actuation |
| JP6037440B2 (en) * | 2012-12-18 | 2016-12-07 | 株式会社エー・アンド・デイ | ROBERVAL type load cell |
| JP6125405B2 (en) * | 2012-12-25 | 2017-05-10 | 住友重機械工業株式会社 | Injection molding machine |
| TWM504448U (en) * | 2015-04-14 | 2015-07-11 | Everraise Entpr Co Ltd | Remote shearing tool |
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2015
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- 2016-10-21 WO PCT/JP2016/081349 patent/WO2017110230A1/en active Application Filing
- 2016-10-21 KR KR1020187015404A patent/KR102219399B1/en active IP Right Grant
- 2016-10-21 CN CN201680018903.XA patent/CN107530915B/en active Active
- 2016-11-09 TW TW105136420A patent/TWI620638B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW504448B (en) * | 1998-08-28 | 2002-10-01 | Futaba Denshi Kogyo Kk | Abnormal mold detector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6067832B1 (en) | 2017-01-25 |
| JP2017114014A (en) | 2017-06-29 |
| KR20180078289A (en) | 2018-07-09 |
| KR102426984B1 (en) | 2022-07-28 |
| TWI620638B (en) | 2018-04-11 |
| CN107530915A (en) | 2018-01-02 |
| TWI745535B (en) | 2021-11-11 |
| TW201722672A (en) | 2017-07-01 |
| KR102219399B1 (en) | 2021-02-23 |
| KR20200037455A (en) | 2020-04-08 |
| TW201817572A (en) | 2018-05-16 |
| WO2017110230A1 (en) | 2017-06-29 |
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