TWI616332B - 保護膜形成用複合膜片、保護膜形成用複合膜片之製造方法以及具有保護膜之晶片的製造方法 - Google Patents

保護膜形成用複合膜片、保護膜形成用複合膜片之製造方法以及具有保護膜之晶片的製造方法 Download PDF

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Publication number
TWI616332B
TWI616332B TW103108595A TW103108595A TWI616332B TW I616332 B TWI616332 B TW I616332B TW 103108595 A TW103108595 A TW 103108595A TW 103108595 A TW103108595 A TW 103108595A TW I616332 B TWI616332 B TW I616332B
Authority
TW
Taiwan
Prior art keywords
film
adhesive layer
protective film
adhesive
forming
Prior art date
Application number
TW103108595A
Other languages
English (en)
Chinese (zh)
Other versions
TW201505832A (zh
Inventor
Ken Takano
Akio Kabuto
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW201505832A publication Critical patent/TW201505832A/zh
Application granted granted Critical
Publication of TWI616332B publication Critical patent/TWI616332B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
TW103108595A 2013-03-13 2014-03-12 保護膜形成用複合膜片、保護膜形成用複合膜片之製造方法以及具有保護膜之晶片的製造方法 TWI616332B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013050864 2013-03-13

Publications (2)

Publication Number Publication Date
TW201505832A TW201505832A (zh) 2015-02-16
TWI616332B true TWI616332B (zh) 2018-03-01

Family

ID=51536802

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108595A TWI616332B (zh) 2013-03-13 2014-03-12 保護膜形成用複合膜片、保護膜形成用複合膜片之製造方法以及具有保護膜之晶片的製造方法

Country Status (3)

Country Link
JP (1) JP6262717B2 (ja)
TW (1) TWI616332B (ja)
WO (1) WO2014142151A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016182767A (ja) * 2015-03-26 2016-10-20 東洋紡株式会社 紫外線透過性帯電防止離型フィルム、及びそれと粘着材層が貼り合わされた粘着シート
JP2016221469A (ja) * 2015-06-01 2016-12-28 関西ペイント株式会社 複層塗膜形成方法
KR102509165B1 (ko) * 2015-06-05 2023-03-10 린텍 가부시키가이샤 보호막 형성용 복합 시트
KR102456771B1 (ko) * 2016-04-28 2022-10-20 린텍 가부시키가이샤 보호막 형성용 필름 및 보호막 형성용 복합 시트

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201207081A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101058659B1 (ko) * 2006-10-06 2011-08-22 스미토모 베이클리트 컴퍼니 리미티드 반도체용 필름, 반도체용 필름의 제조 방법 및 반도체 장치
JP5744434B2 (ja) * 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201207081A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Also Published As

Publication number Publication date
JP6262717B2 (ja) 2018-01-17
JPWO2014142151A1 (ja) 2017-02-16
TW201505832A (zh) 2015-02-16
WO2014142151A1 (ja) 2014-09-18

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