TWI612271B - Heat dissipating module capable of enhancing heat dissipating efficiency - Google Patents
Heat dissipating module capable of enhancing heat dissipating efficiency Download PDFInfo
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Abstract
一種散熱模組，其用以散逸一電子元件所產生的熱量，該電子元件耦接於一電路板，該散熱模組包含一散熱鰭片、一支架結構以及一彈性件，該散熱鰭片耦接於該電子元件上且具有一鰭片固接部，該支架結構包含一主架體、一第一固持部以及一第二固持部，該主架體設置於該散熱鰭片上方且具有對應該鰭片固接部之一架體固接部，該第一固持部用以固接於該電路板，該第二固持部用以固接於該電路板，該彈性件的兩端分別抵接該鰭片固接部與該架體固接部且彈性下壓該散熱鰭片。A heat dissipation module for dissipating heat generated by an electronic component coupled to a circuit board, the heat dissipation module comprising a heat dissipation fin, a support structure and an elastic member, the heat dissipation fin coupling Connected to the electronic component and having a fin fixing portion, the bracket structure includes a main frame body, a first holding portion and a second holding portion, the main frame body is disposed above the heat dissipation fin and has a pair The first fixing portion is for fixing to the circuit board, and the second holding portion is for fixing to the circuit board, and the two ends of the elastic member are respectively abutted Connecting the fin fixing portion and the frame fixing portion and elastically pressing the heat dissipation fins.
Description
本發明關於一種散熱模組，尤指一種可用以散熱具有不同尺寸之電子元件、可減少用以螺固之螺絲數量並可增加散熱效率的散熱模組。 The invention relates to a heat dissipation module, in particular to a heat dissipation module which can be used for dissipating electronic components having different sizes, reducing the number of screws for screwing and increasing heat dissipation efficiency.
近來，隨著電腦裝置的效能日益提升，對於運算處理晶片(例如中央處理晶片(Central Processing Unit,CPU))及記憶晶片(例如雙倍數據傳輸記憶體(Double Data Rate,DDR))的散熱要求也日益重要。習知的散熱模組係將用於散逸運算處理晶片所產生的熱量的散熱鰭片加大，以涵蓋記憶晶片的範圍，並將該散熱鰭片同時貼附於運算處理晶片及記憶晶片。 Recently, as the performance of computer devices has increased, heat dissipation requirements for arithmetic processing chips (such as central processing units (CPUs)) and memory chips (such as double data transfer memory (DDR)) have recently been required. It is also increasingly important. The conventional heat dissipation module enlarges the heat dissipation fins for dissipating the heat generated by the wafer to cover the range of the memory wafer, and simultaneously attaches the heat dissipation fins to the operation processing chip and the memory wafer.
然而，運算處理晶片及記憶晶片的厚度尺寸及製造公差皆不同，致使運算處理晶片的上頂面及記憶晶片的上頂面間具有高度差，而上述之高度差會影響散熱鰭片同時相對處理晶片與記憶晶片的貼附，即上述之高度差會致使散熱鰭片無法同時平貼處理晶片與記憶晶片。再者，為確保散熱鰭片與運算處理晶片間的接觸，係於散熱鰭片對稱運算處理晶片的幾何中心處設置複數個螺絲，並將散熱鰭片經由複數個螺絲螺附於電路板上，上述方式需於電路板上開設複數個螺孔，不利於電路板上線路的佈線設計。 However, the thickness and manufacturing tolerances of the arithmetic processing chip and the memory wafer are different, such that the upper top surface of the arithmetic processing wafer and the upper top surface of the memory wafer have a height difference, and the above-mentioned height difference affects the heat dissipation fin while being relatively processed. The attachment of the wafer to the memory wafer, i.e., the height difference described above, may cause the heat sink fins to not simultaneously align the handle wafer with the memory wafer. Furthermore, in order to ensure contact between the heat dissipation fins and the processing wafer, a plurality of screws are disposed at the geometric center of the heat dissipation fin symmetrical processing wafer, and the heat dissipation fins are attached to the circuit board via a plurality of screws. In the above manner, a plurality of screw holes need to be opened on the circuit board, which is not conducive to the wiring design of the circuit on the circuit board.
因此，本發明提供一種可用以散熱具有不同尺寸之電子元件、可減少用以螺固之螺絲數量並可增加散熱效率的散熱模組，以解決上述問題。 Therefore, the present invention provides a heat dissipation module that can be used to dissipate electronic components having different sizes, reduce the number of screws for screwing, and increase heat dissipation efficiency to solve the above problems.
為了達成上述目的，本發明揭露一種散熱模組，其用以散逸一第一 電子元件所產生的熱量，該第一電子元件耦接於一電路板，該電路板組裝於一殼體上，該散熱模組包含一第一散熱鰭片、一支架結構以及至少一彈性件，該第一散熱鰭片具有一鰭片固接部，該支架結構包含一主架體、一第一固持部以及一第二固持部，該主架體設置於該第一散熱鰭片上方且具有對應該鰭片固接部之一架體固接部，該第一固持部設置於該主架體上並用以固接於該電路板或該殼體，該第二固持部設置於該主架體上並用以固接於該電路板或該殼體，該至少一彈性件的兩端分別抵接該鰭片固接部與該架體固接部。 In order to achieve the above object, the present invention discloses a heat dissipation module for dissipating a first The first electronic component is coupled to a circuit board, and the circuit board is assembled on a casing. The heat dissipation module includes a first heat dissipation fin, a bracket structure and at least one elastic component. The first heat dissipation fin has a fin fixing portion, and the bracket structure includes a main frame body, a first holding portion and a second holding portion. The main frame body is disposed above the first heat dissipation fin and has Corresponding to a frame fixing portion of the fin fixing portion, the first holding portion is disposed on the main frame body and is fixed to the circuit board or the housing, and the second holding portion is disposed on the main frame And the two ends of the at least one elastic member respectively abut the fin fixing portion and the frame fixing portion, and are respectively fixed to the circuit board or the housing.
根據本發明之其中之一實施方式，本發明另揭露該散熱模組另包含一第二散熱鰭片，可拆卸地安裝於該第一散熱鰭片上且用以散逸該複數個第二電子元件所產生的熱量。 According to another embodiment of the present invention, the heat dissipation module further includes a second heat dissipation fin detachably mounted on the first heat dissipation fin and configured to dissipate the plurality of second electronic components. The heat generated.
根據本發明之其中之一實施方式，本發明另揭露該散熱模組另包含一第三散熱鰭片，可拆卸地安裝於該第一散熱鰭片上且用以散逸該複數個第三電子元件所產生的熱量。 According to another embodiment of the present invention, the heat dissipation module further includes a third heat dissipation fin detachably mounted on the first heat dissipation fin for dissipating the plurality of third electronic components. The heat generated.
綜上所述，本發明散熱模組的第一散熱鰭片、第二散熱鰭片與第三散熱鰭片係分別獨立設置，以分別調整第一散熱鰭片、第二散熱鰭片與第三散熱鰭片於具有不同尺寸之電子元件間的接觸狀況，例如當本發明散熱模組用以散熱具有不同高度的電子元件時，即本發明散熱模組用以散熱的電子元件間具有高度差時，由於第一散熱鰭片、第二散熱鰭片與第三散熱鰭片是分別獨立設置，因此第一散熱鰭片、第二散熱鰭片與第三散熱鰭片可調整其相對位置，藉此本發明散熱模組的第一散熱鰭片、第二散熱鰭片與第三散熱鰭片便可平貼於上述具有高度差之該些電子元件並可增加對該些具有不同尺寸之電子元的散熱效率。此外，本發明散熱模組的支架結構僅在第一固持部與第二固持部具有鎖固螺絲，可減少用以螺固散熱模組之螺絲的數量。有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之實施例的詳細說明中，將可清楚 的呈現。 In summary, the first heat dissipation fin, the second heat dissipation fin, and the third heat dissipation fin of the heat dissipation module of the present invention are separately disposed to respectively adjust the first heat dissipation fin, the second heat dissipation fin, and the third When the heat dissipating fins of the present invention are used for dissipating electronic components having different heights, that is, when the heat dissipating module of the present invention is used to dissipate electronic components having different heights, that is, when the heat dissipating module of the present invention has a height difference between the electronic components for dissipating heat Since the first heat dissipation fin, the second heat dissipation fin, and the third heat dissipation fin are separately disposed, the first heat dissipation fin, the second heat dissipation fin, and the third heat dissipation fin can adjust the relative positions thereof. The first heat dissipating fins, the second heat dissipating fins and the third heat dissipating fins of the heat dissipating module of the present invention can be flatly attached to the electronic components having the height difference and can increase the electronic components having different sizes. Cooling efficiency. In addition, the bracket structure of the heat dissipation module of the present invention has locking screws only in the first holding portion and the second holding portion, which can reduce the number of screws for screwing the heat dissipation module. The foregoing and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. Presentation.
1000、1000'、1000"‧‧‧散熱模組 1000, 1000', 1000"‧‧‧ Thermal Module
1‧‧‧第一電子元件 1‧‧‧First electronic component
t1‧‧‧第一厚度 T1‧‧‧first thickness
2‧‧‧第二電子元件 2‧‧‧Second electronic components
t2‧‧‧第二厚度 T2‧‧‧second thickness
h1‧‧‧第一高度差 H1‧‧‧first height difference
3‧‧‧第三電子元件 3‧‧‧ Third electronic component
t3‧‧‧第三厚度 T3‧‧‧ third thickness
h2‧‧‧第二高度差 H2‧‧‧second height difference
4‧‧‧第一散熱鰭片 4‧‧‧First heat sink fin
40‧‧‧鰭片固接部 40‧‧‧Fin fixation
401‧‧‧鰭片固接部上表面 401‧‧‧Face fixing surface
41‧‧‧孔洞 41‧‧‧ hole
42‧‧‧第一側邊 42‧‧‧ first side
43‧‧‧第一卡合結構 43‧‧‧First engagement structure
44‧‧‧第二側邊 44‧‧‧Second side
45‧‧‧第二卡合結構 45‧‧‧Second snap-in structure
5、5'‧‧‧第二散熱鰭片 5, 5'‧‧‧second heat sink fins
50‧‧‧第二散熱鰭片穿孔 50‧‧‧Second heat sink fin perforation
51‧‧‧端邊 51‧‧‧End
52‧‧‧卡配結構 52‧‧‧ card structure
6、6'‧‧‧第三散熱鰭片 6, 6'‧‧‧ Third heat sink fin
60‧‧‧第三散熱鰭片穿孔 60‧‧‧ Third heat sink fin perforation
61‧‧‧邊緣 61‧‧‧ edge
62‧‧‧卡制結構 62‧‧‧Card structure
7‧‧‧電路板 7‧‧‧ boards
70‧‧‧第一螺孔 70‧‧‧First screw hole
71‧‧‧第二螺孔 71‧‧‧Second screw hole
8、8'、8"‧‧‧支架結構 8, 8', 8" ‧ ‧ bracket structure
80、80'‧‧‧主架體 80, 80'‧‧‧ main frame
801‧‧‧架體固接部 801‧‧‧ frame body fixing
802‧‧‧穿孔 802‧‧‧ perforation
803‧‧‧架體上表面 803‧‧‧The upper surface of the frame
804‧‧‧架體下表面 804‧‧‧ Lower surface of the frame
81、81'、81"‧‧‧第一固持部 81, 81', 81" ‧ ‧ first holding department
810‧‧‧第一固持穿孔 810‧‧‧First holding perforation
82、82'、82"‧‧‧第二固持部 82, 82', 82" ‧ ‧ second holding department
820‧‧‧第二固持穿孔 820‧‧‧Second holding perforation
9‧‧‧彈性件 9‧‧‧Flexible parts
A‧‧‧連接件 A‧‧‧Connecting parts
A1‧‧‧桿部 A1‧‧‧ pole
A2‧‧‧頭部 A2‧‧‧ head
A3‧‧‧端部 A3‧‧‧ end
B‧‧‧第一固定件 B‧‧‧First fixture
B0‧‧‧第一連接桿部 B0‧‧‧First connecting rod
B1‧‧‧第一螺絲頭 B1‧‧‧First screw head
B2‧‧‧第一螺紋部 B2‧‧‧First thread
C‧‧‧第二固定件 C‧‧‧Second fixture
C0‧‧‧第二連接桿部 C0‧‧‧Second connecting rod
C1‧‧‧第二螺絲頭 C1‧‧‧Second screw head
C2‧‧‧第二螺紋部 C2‧‧‧Second thread
D‧‧‧第一散熱墊片 D‧‧‧First heat sink
E‧‧‧第二散熱墊片 E‧‧‧Second heat sink
F‧‧‧殼體 F‧‧‧shell
X-X、Y-Y、Z-Z‧‧‧剖面線 X-X, Y-Y, Z-Z‧‧‧ hatching
第1圖為本發明第一實施例散熱模組的外觀示意圖。 FIG. 1 is a schematic view showing the appearance of a heat dissipation module according to a first embodiment of the present invention.
第2圖為本發明第一實施例散熱模組的***示意圖。 FIG. 2 is a schematic exploded view of a heat dissipation module according to a first embodiment of the present invention.
第3圖為本發明第一實施例散熱模組的正視示意圖。 FIG. 3 is a front elevational view showing the heat dissipation module of the first embodiment of the present invention.
第4圖為第3圖所示散熱模組沿剖面線X-X的剖面示意圖。 Figure 4 is a cross-sectional view of the heat dissipation module shown in Figure 3 along section line X-X.
第5圖為第3圖所示散熱模組沿剖面線Y-Y的剖面示意圖。 Figure 5 is a cross-sectional view of the heat dissipation module shown in Figure 3 along section line Y-Y.
第6圖為本發明第二實施例散熱模組的外觀示意圖。 FIG. 6 is a schematic diagram of the appearance of a heat dissipation module according to a second embodiment of the present invention.
第7圖為本發明第二實施例散熱模組的***示意圖。 FIG. 7 is a schematic exploded view of a heat dissipation module according to a second embodiment of the present invention.
第8圖為本發明第三實施例散熱模組的外觀示意圖。 FIG. 8 is a schematic diagram of the appearance of a heat dissipation module according to a third embodiment of the present invention.
第9圖為本發明第三實施例散熱模組的正視示意圖。 FIG. 9 is a front elevational view showing a heat dissipation module according to a third embodiment of the present invention.
第10圖為第9圖所示散熱模組沿剖面線Z-Z的剖面示意圖。 Figure 10 is a cross-sectional view of the heat dissipation module taken along line Z-Z of Figure 9.
以下實施例中所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明並非用來限制本發明。請參閱第1圖至第3圖，第1圖為本發明第一實施例一散熱模組1000的外觀示意圖，第2圖為本發明第一實施例散熱模組1000的***示意圖，第3圖為本發明第一實施例散熱模組1000的正視示意圖。散熱模組1000用以散逸一第一電子元件1、複數個第二電子元件2及複數個第三電子元件3所產生的熱量，第一電子元件1、第二電子元件2及第三電子元件3皆設置於一電路板7上。於此實施例中，電路板7可為一電腦裝置的一主機板，第一電子元件1可為該主機板的一中央處理晶片(Central Processing Unit,CPU)，且第二電子元件2及第三電子元件3可分別為該主機板的一雙倍數據傳輸記憶體(Double Data Rate,DDR)，但本發明 不受此限。 The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation. 1 to 3, FIG. 1 is a schematic view showing the appearance of a heat dissipation module 1000 according to a first embodiment of the present invention, and FIG. 2 is a schematic exploded view of the heat dissipation module 1000 according to the first embodiment of the present invention, FIG. A front view of the heat dissipation module 1000 of the first embodiment of the present invention. The heat dissipation module 1000 is configured to dissipate heat generated by a first electronic component 1, a plurality of second electronic components 2, and a plurality of third electronic components 3, and the first electronic component 1, the second electronic component 2, and the third electronic component 3 are all disposed on a circuit board 7. In this embodiment, the circuit board 7 can be a motherboard of a computer device, and the first electronic component 1 can be a central processing unit (CPU) of the motherboard, and the second electronic component 2 and the The three electronic components 3 can respectively be a double data transfer memory (DDR) of the motherboard, but the present invention Not limited to this.
如第1圖至第3圖所示，散熱模組1000包含一第一散熱鰭片4、一第二散熱鰭片5、一第三散熱鰭片6、一支架結構8以及一彈性件9。第一散熱鰭片4係貼附於第一電子元件1，於實務上第一電子元件1用以與第一散熱鰭片4貼附的上表面可塗佈散熱膏，散熱膏用以黏合第一散熱鰭片4與第一電子元件1，藉此第一散熱鰭片4便可耦接於第一電子元件1，以將第一電子元件1所產生的熱量傳導至第一散熱鰭片4，進而使第一散熱鰭片4散逸第一電子元件1所產生的熱量。此外，散熱模組1000另包含複數個第一散熱墊片D及複數個第二散熱墊片E，第一散熱墊片D用以貼附第二電子元件2與第二散熱鰭片5，藉此第二散熱鰭片5便可耦接於複數個第二電子元件2，以使第二散熱鰭片5散逸複數個第二電子元件2所產生的熱量。第二散熱墊片E用以貼附第三電子元件3與第三散熱鰭片6，藉此第三散熱鰭片6便可耦接於複數個第三電子元件3，以使第三散熱鰭片6散逸複數個第三電子元件3所產生的熱量。 As shown in FIG. 1 to FIG. 3 , the heat dissipation module 1000 includes a first heat dissipation fin 4 , a second heat dissipation fin 5 , a third heat dissipation fin 6 , a bracket structure 8 , and an elastic member 9 . The first heat dissipating fins 4 are attached to the first electronic component 1 . In practice, the upper surface of the first electronic component 1 for attaching to the first heat dissipating fins 4 can be coated with a thermal grease, and the thermal grease is used for bonding. a heat sink fin 4 and the first electronic component 1 , whereby the first heat sink fin 4 can be coupled to the first electronic component 1 to conduct heat generated by the first electronic component 1 to the first heat sink fin 4 In turn, the first heat dissipation fins 4 dissipate the heat generated by the first electronic component 1. In addition, the heat dissipation module 1000 further includes a plurality of first heat dissipation pads D and a plurality of second heat dissipation pads E. The first heat dissipation pads D are used to attach the second electronic component 2 and the second heat dissipation fins 5, The second heat dissipation fins 5 can be coupled to the plurality of second electronic components 2 such that the second heat dissipation fins 5 dissipate heat generated by the plurality of second electronic components 2 . The second heat dissipating pad E is used to attach the third electronic component 3 and the third heat dissipating fin 6 , so that the third heat dissipating fin 6 can be coupled to the plurality of third electronic components 3 to enable the third heat dissipating fin The sheet 6 dissipates the heat generated by the plurality of third electronic components 3.
進一步地，第一散熱鰭片4具有一第一側邊42及一第二側邊44，其中第一側邊42相鄰於第二側邊44，第二散熱鰭片5具有抵接於第一側邊42的端邊51，第一散熱鰭片4的第一側邊42上包含一第一卡合結構43，第二散熱鰭片5的端邊51包含一卡配結構52。第三散熱鰭片6具有抵接於第一散熱鰭片4的第二側邊44的一邊緣61，第一散熱鰭片4的第二側邊44包含一第二卡合結構45，第三散熱鰭片6的邊緣61包含一卡制結構62。 Further, the first heat dissipation fins 4 have a first side 42 and a second side 44, wherein the first side 42 is adjacent to the second side 44, and the second heat sink 5 has abutting The first side edge 42 of the first heat dissipation fin 4 includes a first engaging structure 43 , and the end edge 51 of the second heat dissipation fin 5 includes a latching structure 52 . The third heat dissipation fin 6 has an edge 61 that abuts the second side 44 of the first heat dissipation fin 4 , and the second side 44 of the first heat dissipation fin 4 includes a second engagement structure 45 , and a third The edge 61 of the heat sink fin 6 includes a snap structure 62.
在一實施例中，組裝第一散熱鰭片4與第二散熱鰭片5時，可將第一卡合結構43可移動地卡配於卡配結構52，藉此第二散熱鰭片5便可相對第一散熱鰭片4移動，以調整第一散熱鰭片4與第二散熱鰭片5的相對位置，即藉由第一散熱鰭片4的第一卡合結構43可相對第二散熱鰭片5的卡配結構52移動的卡配設置，本發明第一散熱鰭片4與第二散熱鰭片5間的相對位置係為可調，且第二散 熱鰭片5係可拆卸地安裝於第一散熱鰭片4上。同理，上述卡配設置可應用於組裝第一散熱鰭片4與第三散熱鰭片6，即藉由第一散熱鰭片4的第二卡合結構45可相對第三散熱鰭片6的卡制結構62移動的卡配設置，本發明第一散熱鰭片4與第三散熱鰭片6間的相對位置係為可調。 In an embodiment, when the first heat dissipation fins 4 and the second heat dissipation fins 5 are assembled, the first engagement structure 43 can be movably engaged with the card structure 52, whereby the second heat dissipation fins 5 are The first heat dissipating fins 4 are movable relative to the first heat dissipating fins 4 to adjust the relative positions of the first heat dissipating fins 4 and the second heat dissipating fins 5, that is, the first engaging structure 43 of the first heat dissipating fins 4 can be dissipated relative to the second heat dissipating fins The arrangement of the card-fitting structure 52 of the fin 5 is arranged, and the relative position between the first heat-dissipating fin 4 and the second heat-dissipating fin 5 of the present invention is adjustable, and the second is dispersed. The heat fins 5 are detachably mounted on the first heat dissipation fins 4. For the same reason, the above-mentioned card arrangement can be applied to the first heat dissipation fin 4 and the third heat dissipation fin 6 , that is, the second fastening structure 45 of the first heat dissipation fin 4 can be opposite to the third heat dissipation fin 6 . The card assembly structure moves the card arrangement, and the relative position between the first heat dissipation fin 4 and the third heat dissipation fin 6 of the present invention is adjustable.
值得一提的是，當第二散熱鰭片5組裝於第一散熱鰭片4上後，第一卡合結構43與卡配結構52的卡配係可將第二散熱鰭片5定位於第一散熱鰭片4上且可防止第二散熱鰭片5相對第一散熱鰭片4轉動，此外當第二散熱鰭片5組裝於第一散熱鰭片4上後，第二散熱鰭片5的端邊51係抵接於第一散熱鰭片4的第一側邊42，以進一步限制第二散熱鰭片5相對第一散熱鰭片4轉動。同理，當第三散熱鰭片6組裝於第一散熱鰭片4上後，第三散熱鰭片6的邊緣61係抵接於第一散熱鰭片4的第二側邊44，以限制第三散熱鰭片6相對第一散熱鰭片4轉動。於此實施例中，第二散熱鰭片5的卡配結構52與第三散熱鰭片6的卡制結構62可分別為一卡合塊，且卡配結構52與卡制結構62實質上為一梯形結構，而第一散熱鰭片4的第一卡合結構43與第二卡合結構45可分別為一卡合槽，且第一卡合結構43與第二卡合結構45的形狀實質上對應卡配結構52的形狀與卡制結構62的形狀。 It is to be noted that after the second heat dissipation fins 5 are assembled on the first heat dissipation fins 4, the first engagement structure 43 and the card structure of the card structure 52 can position the second heat dissipation fins 5 The heat dissipation fins 4 prevent the second heat dissipation fins 5 from rotating relative to the first heat dissipation fins 4, and when the second heat dissipation fins 5 are assembled on the first heat dissipation fins 4, the second heat dissipation fins 5 The end edge 51 is abutted against the first side edge 42 of the first heat dissipation fin 4 to further restrict the rotation of the second heat dissipation fin 5 relative to the first heat dissipation fin 4 . Similarly, after the third heat dissipation fins 6 are assembled on the first heat dissipation fins 4 , the edge 61 of the third heat dissipation fins 6 abuts against the second side 44 of the first heat dissipation fins 4 to limit the number. The three heat dissipation fins 6 rotate relative to the first heat dissipation fins 4. In this embodiment, the engaging structure 52 of the second heat dissipating fins 5 and the locking structure 62 of the third heat dissipating fins 6 are respectively an engaging block, and the engaging structure 52 and the engaging structure 62 are substantially The first engaging structure 43 and the second engaging structure 45 of the first heat dissipating fins 4 are respectively an engaging groove, and the shapes of the first engaging structure 43 and the second engaging structure 45 are substantially The upper portion corresponds to the shape of the card-fit structure 52 and the shape of the card structure 62.
如第1圖至第3圖所示，支架結構8包含一主架體80、一第一固持部81以及一第二固持部82，主架體80設置於第一散熱鰭片4上方，第一固持部81設置於主架體80的一端，且第二固持部82設置於主架體80的另一端。第一固持部81包含一第一固持穿孔810，第二散熱鰭片5包含對應第一固持穿孔810的一第二散熱鰭片穿孔50，第二固持部82包含一第二固持穿孔820，第三散熱鰭片6包含對應第二固持穿孔820的一第三散熱鰭片穿孔60。此外，主架體80具有一架體上表面803及相反於架體上表面803之一架體下表面804，散熱模組1000另包含一第一固定件B與一第二固定件C，第一固定件B用以連接第一固持部81與電路板7，第二固定件C用以連接第二固持部82與電路板7。 As shown in FIG. 1 to FIG. 3 , the bracket structure 8 includes a main frame body 80 , a first holding portion 81 , and a second holding portion 82 . The main frame body 80 is disposed above the first heat dissipation fins 4 . One holding portion 81 is disposed at one end of the main frame body 80 , and the second holding portion 82 is disposed at the other end of the main frame body 80 . The first holding portion 81 includes a first holding hole 810, the second fixing portion 82 includes a second fixing hole 820, and the second holding portion 82 includes a second fixing hole 820. The three heat dissipation fins 6 include a third heat dissipation fin perforation 60 corresponding to the second holding through hole 820. In addition, the main frame body 80 has a body upper surface 803 and a frame lower surface 804 opposite to the frame upper surface 803. The heat dissipation module 1000 further includes a first fixing member B and a second fixing member C. A fixing member B is used to connect the first holding portion 81 and the circuit board 7 , and the second fixing member C is used for connecting the second holding portion 82 and the circuit board 7 .
進一步地，電路板7上包含一第一螺孔70及一第二螺孔71，且於此實施例中，第一固定件B與第二固定件C分別為一螺絲結構，第一固定件B具有一第一連接桿部B0、一第一螺絲頭B1及一第一螺紋部B2，第一螺絲頭B1連接於第一連接桿部B0的一端，第一螺紋部B2連接於第一連接桿部B0的另一端，第二固定件C具有一第二連接桿部C0、一第二螺絲頭C1及一第二螺紋部C2，第二螺絲頭C1連接於第二連接桿部C0的一端，第二螺紋部C2連接於第二連接桿部C0的另一端。於組裝支架結構8時，首先，可將支架結構8設置於第二散熱鰭片5與第三散熱鰭片6上，使第一固持部81的第一固持穿孔810、第二散熱鰭片5的第二散熱鰭片穿孔50與電路板7的第一螺孔70彼此對齊，且使第二固持部82的第二固持穿孔820、第三散熱鰭片6的第三散熱鰭片穿孔60與電路板7的第二螺孔71彼此對齊。 Further, the circuit board 7 includes a first screw hole 70 and a second screw hole 71. In this embodiment, the first fixing member B and the second fixing member C are respectively a screw structure, and the first fixing member B has a first connecting rod portion B0, a first screw head B1 and a first threaded portion B2, the first screw head B1 is connected to one end of the first connecting rod portion B0, and the first threaded portion B2 is connected to the first connecting portion The other end of the rod portion B0, the second fixing member C has a second connecting rod portion C0, a second screw head C1 and a second thread portion C2, and the second screw head C1 is connected to one end of the second connecting rod portion C0. The second threaded portion C2 is coupled to the other end of the second connecting rod portion C0. When the bracket structure 8 is assembled, the bracket structure 8 can be disposed on the second heat dissipation fin 5 and the third heat dissipation fin 6 to make the first holding hole 810 and the second heat dissipation fin 5 of the first holding portion 81. The second heat dissipation fin perforations 50 and the first screw holes 70 of the circuit board 7 are aligned with each other, and the second holding holes 820 of the second holding portion 82 and the third heat dissipation fin holes 60 of the third heat dissipation fins 6 are The second screw holes 71 of the circuit board 7 are aligned with each other.
接著，將第一固定件B的第一連接桿部B0穿設於第一固持部81的第一固持穿孔810與第二散熱鰭片5的第二散熱鰭片穿孔50，此時第一螺絲頭B1卡設於主架體80的架體上表面803，且可利用一鎖附工具(例如一螺絲起子)旋轉第一螺絲頭B1，使第一螺紋部B2鎖附於電路板7上的第一螺孔70，藉此第一固定件B之一端(即第一螺紋部B2)便可固定於電路板7上。接著，將第二固定件C的第二連接桿部C0穿設於第二固持部82的第二固持穿孔820與第二散熱鰭片6的第二散熱鰭片穿孔60，此時第二螺絲頭C1卡設於主架體80的架體上表面803，且第二螺紋部C2亦鎖附於電路板7上的第二螺孔71，藉此第二固定件C之一端(即第二螺紋部C2)便可固定於電路板7上。如此一來，第一固持部81與第二固持部82便可支撐主架體80於第一散熱鰭片4、第二散熱鰭片5及第三散熱鰭片6上方，且支架結構8的第一固持部81與第二固持部82分別經由第一固定件B與第二固定件C固定於電路板7上。而當支架結構8的第一固持部81與第二固持部82分別經由第一固定件B與第二固定件C固接於電路板7時，支架結構8係無法相對電路板7移動。於 此實施例中，第一固持部81與第二固持部82可分別為一柱體，但本發明不受此限，例如第一固持部81與第二固持部82可分別為一板體，至於採用上述何者設計，端視實際需求而定。 Then, the first connecting rod portion B0 of the first fixing member B is disposed through the first fixing through hole 810 of the first holding portion 81 and the second heat dissipation fin through hole 50 of the second heat dissipation fin 5, and the first screw The head B1 is disposed on the upper surface 803 of the frame body of the main frame body 80, and the first screw head B1 can be rotated by a locking tool (for example, a screwdriver) to lock the first threaded portion B2 on the circuit board 7. The first screw hole 70 is thereby fixed to the circuit board 7 by one end of the first fixing member B (ie, the first thread portion B2). Then, the second connecting rod portion C0 of the second fixing member C is disposed through the second fixing hole 820 of the second holding portion 82 and the second heat dissipation fin hole 60 of the second heat dissipation fin 6 , and the second screw The head C1 is disposed on the upper surface 803 of the main frame body 80, and the second threaded portion C2 is also locked to the second screw hole 71 on the circuit board 7, whereby one end of the second fixing member C (ie, the second The threaded portion C2) can be fixed to the circuit board 7. In this manner, the first holding portion 81 and the second holding portion 82 can support the main frame body 80 above the first heat dissipation fins 4, the second heat dissipation fins 5, and the third heat dissipation fins 6, and the structure of the bracket structure 8 The first holding portion 81 and the second holding portion 82 are respectively fixed to the circuit board 7 via the first fixing member B and the second fixing member C. When the first holding portion 81 and the second holding portion 82 of the bracket structure 8 are respectively fixed to the circuit board 7 via the first fixing member B and the second fixing member C, the bracket structure 8 cannot move relative to the circuit board 7. to In this embodiment, the first holding portion 81 and the second holding portion 82 are respectively a cylinder, but the present invention is not limited thereto. For example, the first holding portion 81 and the second holding portion 82 may each be a plate body. As for which of the above designs is adopted, it depends on actual needs.
除此之外，第一散熱鰭片4具有一鰭片固接部40，且主架體80具有對應鰭片固接部40的一架體固接部801。鰭片固接部40包含一孔洞41，孔洞41可以是一盲孔或一通孔，且鰭片固接部40具有一鰭片固接部上表面401，架體固接部801包含一穿孔802，散熱模組1000另包含一連接件A，連接件A用以連接鰭片固接部40與架體固接部801且包含一桿部A1、一頭部A2以及一端部A3，頭部A2連接於桿部A1的一端，且端部A3連接於桿部A1的另一端。當支架結構8的第一固持部81與第二固持部82分別經由第一固定件B與第二固定件C固定於電路板7上時，架體固接部801的穿孔802係對齊鰭片固接部40的孔洞41。接著，可將連接件A依序穿過架體固接部801的穿孔802與彈性件9後固定於鰭片固接部40的孔洞41，以完成支架結構8、第一散熱鰭片4、第二散熱鰭片5與第三散熱鰭片6的組裝，此時連接件A的桿部A1係穿設於架體固接部801上的穿孔802與彈性件9，連接件A的頭部A2卡設於主架體80的架體上表面803，且連接件A的端部A3固定於孔洞41，避免連接件A脫離支架結構8。其中，孔洞41與連接件A的端部A3的固定方式可使用螺紋結構或卡合結構，但不以此為限。值得一提的是，當第一固持部81與第二固持部82分別經由第一固定件B與第二固定件C固接於電路板7時，本發明的支架結構8無法相對電路板7移動，即當第一固持部81與第二固持部82分別固接於電路板7時，由於支架結構8無法相對電路板7移動，因此主架體80的架體固接部801與電路板7的距離可保持一預定值。 In addition, the first heat dissipation fin 4 has a fin fixing portion 40 , and the main frame body 80 has a frame fixing portion 801 corresponding to the fin fixing portion 40 . The fin fixing portion 40 includes a hole 41, the hole 41 may be a blind hole or a through hole, and the fin fixing portion 40 has a fin fixing portion upper surface 401, and the frame fixing portion 801 includes a through hole 802. The heat dissipation module 1000 further includes a connecting member A for connecting the fin fixing portion 40 and the frame fixing portion 801 and including a rod portion A1, a head portion A2 and an end portion A3, the head portion A2 It is connected to one end of the rod portion A1, and the end portion A3 is connected to the other end of the rod portion A1. When the first holding portion 81 and the second holding portion 82 of the bracket structure 8 are respectively fixed to the circuit board 7 via the first fixing member B and the second fixing member C, the through holes 802 of the frame fixing portion 801 are aligned with the fins. The hole 41 of the fixing portion 40. Then, the connector A can be sequentially passed through the through hole 802 of the frame fixing portion 801 and the elastic member 9 to be fixed to the hole 41 of the fin fixing portion 40 to complete the bracket structure 8 and the first heat dissipation fin 4, The assembly of the second heat dissipating fins 5 and the third heat dissipating fins 6 is such that the rod portion A1 of the connecting member A passes through the through hole 802 and the elastic member 9 on the frame fixing portion 801, and the head of the connecting member A The A2 card is disposed on the upper surface 803 of the frame body 80, and the end A3 of the connector A is fixed to the hole 41 to prevent the connector A from being separated from the bracket structure 8. The fixing manner of the hole 41 and the end portion A3 of the connecting member A may be a thread structure or a snapping structure, but is not limited thereto. It should be noted that when the first holding portion 81 and the second holding portion 82 are fixed to the circuit board 7 via the first fixing member B and the second fixing member C, respectively, the bracket structure 8 of the present invention cannot be opposite to the circuit board 7 When the first holding portion 81 and the second holding portion 82 are respectively fixed to the circuit board 7, since the bracket structure 8 cannot move relative to the circuit board 7, the frame fixing portion 801 of the main frame 80 and the circuit board The distance of 7 can be maintained at a predetermined value.
值得一提的是，於另一實施例中，連接件A的頭部A2卡設於主架體80的架體上表面803的方式可以是連接件A藉由頭部A2固定於主架體80的架體上表面803的結構配置而固定於支架結構8上，以防止連接件A於散熱模組1000 被倒置時脫離支架結構8。而本發明用以固定連接件A與支架結構8的結構設計可不侷限於此實施例所述，端視實際需求而定。 It is to be noted that, in another embodiment, the head A2 of the connector A is engaged with the upper surface 803 of the frame body 80 of the main frame 80. The connector A can be fixed to the main frame by the head A2. The structure of the upper surface 803 of the frame 80 is fixed to the bracket structure 8 to prevent the connector A from being disposed on the heat dissipation module 1000. When it is inverted, it is separated from the bracket structure 8. However, the structural design of the present invention for fixing the connecting member A and the bracket structure 8 is not limited to that described in this embodiment, and depends on actual needs.
於此實施例中，彈性件9可為一壓簧，於支架結構8、第一散熱鰭片4、第二散熱鰭片5與第三散熱鰭片6的組裝過程中，該壓簧(即彈性件9)可套設於連接件A的桿部A1而位於支架結構8的主架體80的架體固接部801與第一散熱鰭片4的鰭片固接部40之間，且該壓簧(即彈性件9)的兩端分別抵接主架體80的架體下表面804與鰭片固接部40的鰭片固接部上表面401，以使該壓簧(即彈性件9)彈性下壓第一散熱鰭片4，使第一散熱鰭片4平貼於第一電子元件1。值得一提的是，由於本發明支架結構8係經由第一固持部81與第二固持部82固接於電路板7，使得主架體80的架體固接部801與電路板7的距離可保持該預定值。即本發明支架結構8的固定式設計使主架體80的架體固接部801與電路板7的距離保持該預定值的結構設計，當彈性件9安裝定位而位於架體固接部801與鰭片固接部40之間後，該壓簧(即彈性件9)的壓縮量保持一定值，從而使該壓簧(即彈性件9)能對第一散熱鰭片4產生一穩定的下壓力，從而使第一散熱鰭片4與第一電子元件1間能因該壓簧(即彈性件9)所產生的該穩定的下壓力，保持穩定的接觸，進而提升第一散熱鰭片4的散熱效率。 In this embodiment, the elastic member 9 can be a compression spring. During the assembly process of the bracket structure 8 , the first heat dissipation fin 4 , the second heat dissipation fin 5 and the third heat dissipation fin 6 , the pressure spring (ie, The elastic member 9) can be sleeved between the frame fixing portion 801 of the main frame body 80 of the bracket structure 8 and the fin fixing portion 40 of the first heat dissipation fin 4, and The two ends of the compression spring (ie, the elastic member 9) respectively abut the upper surface 804 of the frame body of the main frame body 80 and the upper surface 401 of the fin fixing portion of the fin fixing portion 40 to make the compression spring (ie, elastic) The first heat dissipation fin 4 is elastically pressed down to make the first heat dissipation fin 4 flat on the first electronic component 1. It is to be noted that, since the bracket structure 8 of the present invention is fixed to the circuit board 7 via the first holding portion 81 and the second holding portion 82, the distance between the frame fixing portion 801 of the main frame body 80 and the circuit board 7 is made. This predetermined value can be maintained. That is, the fixed design of the bracket structure 8 of the present invention is such that the distance between the frame fixing portion 801 of the main frame body 80 and the circuit board 7 is maintained at the predetermined value. When the elastic member 9 is mounted and positioned, it is located at the frame fixing portion 801. After being between the fin fixing portion 40, the compression amount of the compression spring (ie, the elastic member 9) is maintained at a certain value, so that the compression spring (ie, the elastic member 9) can generate a stable stability to the first heat dissipation fin 4. Lowering pressure, so that the first heat dissipation fin 4 and the first electronic component 1 can maintain stable contact due to the stable downward pressure generated by the compression spring (ie, the elastic member 9), thereby lifting the first heat dissipation fin 4 heat dissipation efficiency.
請參閱第4圖，第4圖為第3圖所示散熱模組1000沿一剖面線X-X的剖面示意圖。如第4圖所示，第一電子元件1(即該中央處理晶片)具有一第一厚度t1，第二電子元件2(即該雙倍數據傳輸記憶體)具有一第二厚度t2，其中第一厚度t1大於第二厚度t2。因此，當第一電子元件1與第二電子元件2設置於電路板7上時，第一電子元件1與第二電子元件2間具有一第一高度差h1。承上所述，本發明散熱模組1000的第一散熱鰭片4與第二散熱鰭片5為兩獨立元件且第二散熱鰭片5可相對第一散熱鰭片4沿平行於彈性件9之一長軸方向移動移動，因此第一散熱鰭片4與第二散熱鰭片5可獨立調整與第一電子元件1及第二電子元件2間的 相對位置，以使第一散熱鰭片4與第二散熱鰭片5可分別配合於該長軸方向具有第一高度差h1的第一電子元件1及第二電子元件2，藉此第一散熱鰭片4與第二散熱鰭片5便可同時平貼於第一電子元件1與第二電子元件2。 Please refer to FIG. 4, which is a cross-sectional view of the heat dissipation module 1000 along a section line X-X shown in FIG. As shown in FIG. 4, the first electronic component 1 (ie, the central processing chip) has a first thickness t1, and the second electronic component 2 (ie, the double data transfer memory) has a second thickness t2, wherein A thickness t1 is greater than the second thickness t2. Therefore, when the first electronic component 1 and the second electronic component 2 are disposed on the circuit board 7, the first electronic component 1 and the second electronic component 2 have a first height difference h1. As described above, the first heat dissipation fins 4 and the second heat dissipation fins 5 of the heat dissipation module 1000 of the present invention are two independent components, and the second heat dissipation fins 5 can be parallel to the elastic member 9 with respect to the first heat dissipation fins 4. One of the first heat dissipation fins 4 and the second heat dissipation fins 5 can be independently adjusted between the first electronic component 1 and the second electronic component 2 The first heat dissipating fins 4 and the second heat dissipating fins 5 are respectively engageable with the first electronic component 1 and the second electronic component 2 having the first height difference h1 in the long axis direction, thereby using the first heat dissipation The fins 4 and the second heat dissipation fins 5 can be simultaneously affixed to the first electronic component 1 and the second electronic component 2.
於此實施例中，係將第一散熱墊片D設置於第二散熱鰭片5與第二電子元件2之間，使第二散熱鰭片5與第二電子元件2可透過第一散熱墊片D形成熱傳導。於實務上，當第一固定件B的該端(即第一螺紋部B2)鎖固定於電路板7上後，第二散熱鰭片5與第二電子元件2係共同擠壓第一散熱墊片D，以形成第二散熱鰭片5與第二電子元件2間的支架結構8的熱傳導，換句話說，第一散熱墊片D係可作為第二散熱鰭片5與第二電子元件2間熱傳導的媒介，使第二電子元件2所產生的熱量可經由第一散熱墊片D傳導至第二散熱鰭片5。 In this embodiment, the first heat dissipation pad D is disposed between the second heat dissipation fin 5 and the second electronic component 2, so that the second heat dissipation fin 5 and the second electronic component 2 can pass through the first heat dissipation pad. Sheet D forms heat conduction. In practice, after the end of the first fixing member B (ie, the first threaded portion B2) is locked and fixed on the circuit board 7, the second heat dissipating fin 5 and the second electronic component 2 are co-extruded with the first cooling pad. The sheet D is formed to form heat conduction of the bracket structure 8 between the second heat dissipation fin 5 and the second electronic component 2, in other words, the first heat dissipation pad D can serve as the second heat dissipation fin 5 and the second electronic component 2 The heat conduction medium allows the heat generated by the second electronic component 2 to be conducted to the second heat dissipation fin 5 via the first heat dissipation pad D.
請參閱第5圖，第5圖為第3圖所示散熱模組1000沿一剖面線Y-Y的剖面示意圖。如第5圖所示，第一電子元件1(即該中央處理晶片)具有第一厚度t1，第三電子元件3(即該雙倍數據傳輸記憶體)具有一第三厚度t3，其中第一厚度t1大於第三厚度t3。因此，當第一電子元件1與第三電子元件3設置於電路板7上時，第一電子元件1與第三電子元件3間具有一第二高度差h2。承上所述，本發明散熱模組1000的第一散熱鰭片4與第三散熱鰭片6為兩獨立元件且第三散熱鰭片6可相對第一散熱鰭片4沿平行於彈性件9之該長軸方向移動，因此第一散熱鰭片4與第三散熱鰭片6可獨立調整與第一電子元件1及第三電子元件3間的相對位置，以使第一散熱鰭片4與第三散熱鰭片6可分別配合於該長軸方向具有第二高度差h2的第一電子元件1及第三電子元件3，藉此第一散熱鰭片4與第三散熱鰭片6便可同時平貼於第一電子元件1與第三電子元件3 Please refer to FIG. 5, which is a cross-sectional view of the heat dissipation module 1000 along a section line Y-Y shown in FIG. As shown in FIG. 5, the first electronic component 1 (ie, the central processing chip) has a first thickness t1, and the third electronic component 3 (ie, the double data transmission memory) has a third thickness t3, wherein the first The thickness t1 is greater than the third thickness t3. Therefore, when the first electronic component 1 and the third electronic component 3 are disposed on the circuit board 7, the first electronic component 1 and the third electronic component 3 have a second height difference h2. As described above, the first heat dissipation fins 4 and the third heat dissipation fins 6 of the heat dissipation module 1000 of the present invention are two independent components, and the third heat dissipation fins 6 can be parallel to the elastic member 9 with respect to the first heat dissipation fins 4. The longitudinal direction of the first heat dissipation fin 4 and the third heat dissipation fin 6 can be independently adjusted to the relative position between the first electronic component 1 and the third electronic component 3, so that the first heat dissipation fin 4 and the first heat dissipation fin 4 The first heat dissipating fins 6 and the third electronic components 3 having the second height difference h2 in the long axis direction can be respectively matched, thereby the first heat dissipating fins 4 and the third heat dissipating fins 6 Simultaneously attached to the first electronic component 1 and the third electronic component 3
於此實施例中，係將第二散熱墊片E設置於第三散熱鰭片6與第三電子元件3之間，使第三散熱鰭片6與第三電子元件3可透過第二散熱墊片E形成熱傳導。於實務上，本發明可利用第一散熱鰭片4與第三散熱鰭片6為分離設置且 可相對移動之結構設計調整第三散熱鰭片6與第三電子元件3間的相對位置，使第三散熱鰭片6與第三電子元件3共同擠壓第二散熱墊片E，藉此第二散熱墊片E便可分別緊密接觸於第三散熱鰭片6與第三電子元件3，以達到較佳之熱傳導效果。 In this embodiment, the second heat dissipation pad E is disposed between the third heat dissipation fin 6 and the third electronic component 3, so that the third heat dissipation fin 6 and the third electronic component 3 can pass through the second heat dissipation pad. Sheet E forms heat conduction. In practice, the present invention can utilize the first heat dissipation fin 4 and the third heat dissipation fin 6 to be separated and The relative position between the third heat dissipation fin 6 and the third electronic component 3 can be adjusted by the relative movement structure, so that the third heat dissipation fin 6 and the third electronic component 3 jointly press the second heat dissipation pad E, thereby The two heat dissipating pads E can be in close contact with the third heat dissipating fins 6 and the third electronic component 3 respectively to achieve better heat conduction.
值得一提的是，於實務上，第一電子元件1、第二電子元件2與第三電子元件3因生產製造的限制，使第一電子元件1的尺寸、第二電子元件2的尺寸、第三電子元件3的尺寸與支架結構8的尺寸皆具有尺寸公差，該些尺寸公差會對支架結構8的主架體80的架體固接部801與第一散熱鰭片4的鰭片固接部40間的距離造成極限狀況，即一最大極限距離或一最小極限距離，而由於本發明散熱模組1000的第一散熱鰭片4、第二散熱鰭片5與第三散熱鰭片6係彼此分離設置，因此第一散熱鰭片4、第二散熱鰭片5與第三散熱鰭片6可分別獨立移動。換句話說，當架體固接部801與鰭片固接部40間的距離因該些尺寸公差而產生該最大極限距離或該最小極限距離時，第一散熱鰭片4可不受第二散熱鰭片5與第三散熱鰭片6影響，使得本發明散熱模組1000可利用彈性件9下壓第一散熱鰭片4而調整第一散熱鰭片4與第一電子元件1的貼附狀況。 It is worth mentioning that, in practice, the size of the first electronic component 1, the size of the second electronic component 2, and the size of the first electronic component 2, the first electronic component 1, the second electronic component 2, and the third electronic component 3 are limited by manufacturing constraints. Both the size of the third electronic component 3 and the size of the bracket structure 8 have dimensional tolerances which are fixed to the frame fixing portion 801 of the main frame body 80 of the bracket structure 8 and the fins of the first heat dissipation fin 4. The distance between the contacts 40 causes a limit condition, that is, a maximum limit distance or a minimum limit distance, and the first heat dissipation fins 4, the second heat dissipation fins 5 and the third heat dissipation fins 6 of the heat dissipation module 1000 of the present invention The first heat dissipation fins 4, the second heat dissipation fins 5, and the third heat dissipation fins 6 are independently movable. In other words, when the distance between the frame fixing portion 801 and the fin fixing portion 40 is the maximum limit distance or the minimum limit distance due to the dimensional tolerances, the first heat dissipation fin 4 is not subject to the second heat dissipation. The fins 5 and the third heat dissipating fins 6 are affected, so that the heat dissipating module 1000 of the present invention can press the first heat dissipating fins 4 to adjust the attaching condition of the first heat dissipating fins 4 and the first electronic component 1 . .
換句話說，因第一散熱鰭片4、第二散熱鰭片5與第三散熱鰭片6可分別獨立運動，第一散熱鰭片4與第一電子元件1間的相對位置可不受第二散熱鰭片5與第二電子元件2間的相對位置的影響以及不受第三散熱鰭片6與第三電子元件3間的相對位置的影響，因此本發明的彈性件9不會受到第二散熱鰭片5與第三散熱鰭片6的結構反力的影響，於實務上，僅需針對彈性件9作設計，使彈性件9在該極限狀況(即該最大極限距離及該最小極限距離)時皆能對第一散熱鰭片4提供足夠的下壓力，使第一散熱鰭片4可平貼於第一電子元件1，即能確保第一散熱鰭片4與第一電子元件1間的熱傳導。 In other words, since the first heat dissipation fins 4, the second heat dissipation fins 5, and the third heat dissipation fins 6 can move independently, the relative position between the first heat dissipation fins 4 and the first electronic component 1 can be prevented from being second. The influence of the relative position between the heat sink fin 5 and the second electronic component 2 is not affected by the relative position between the third heat sink fin 6 and the third electronic component 3, so the elastic member 9 of the present invention is not subjected to the second The influence of the structural reaction force of the heat dissipation fins 5 and the third heat dissipation fins 6 is practically only required to design the elastic member 9 so that the elastic member 9 is at the limit condition (ie, the maximum limit distance and the minimum limit distance). The first heat-dissipating fins 4 can be provided with a sufficient downward pressure, so that the first heat-dissipating fins 4 can be affixed to the first electronic component 1, that is, the first heat-dissipating fins 4 and the first electronic component 1 can be ensured. Heat transfer.
於實務上，彈性件9(即該壓簧)具有一初始長度，而該初始長度係大 於主架體80的架體下表面804與第一散熱鰭片4的鰭片固接部40的鰭片固接部上表面401的距離，以使彈性件9(即該壓簧)於安裝定位後可提供第一散熱鰭片4的鰭片固接部40一彈性下壓力，使第一散熱鰭片4可平貼於第一電子元件1。值得一的是，彈性件9(即該壓簧)的該始初長度係可設計大於架體下表面804與鰭片固接部上表面401的距離因公差堆疊而產生的最大值，即因零件間的製造公差係可經由公差堆疊而得知架體下表面804與鰭片固接部上表面401的距離的極限狀況，因此彈性件9(即該壓簧)的該始初長度可於設計時克服上述之極限狀況，使得彈性件9(即該壓簧)仍可於上述之極限狀況時提供第一散熱鰭片4的鰭片固接部40足夠的一彈性下壓力，以使第一散熱鰭片4平貼於第一電子元件1。 In practice, the elastic member 9 (ie, the compression spring) has an initial length, and the initial length is large. The distance between the lower surface 804 of the frame body 80 of the main frame body 80 and the upper surface 401 of the fin fixing portion of the fin fixing portion 40 of the first heat dissipation fin 4 is such that the elastic member 9 (ie, the compression spring) is mounted. After the positioning, the fin fixing portion 40 of the first heat dissipation fin 4 can be provided with an elastic downward pressure, so that the first heat dissipation fin 4 can be flatly attached to the first electronic component 1. It is worth noting that the initial length of the elastic member 9 (ie, the compression spring) can be designed to be greater than the maximum value of the distance between the lower surface 804 of the frame body and the upper surface 401 of the fin fixing portion due to tolerance stacking, that is, The manufacturing tolerance between the parts is a limit condition of the distance between the lower surface 804 of the frame and the upper surface 401 of the fin fixing portion through the tolerance stacking, so the initial length of the elastic member 9 (ie, the compression spring) can be In the design, the above-mentioned limit condition is overcome, so that the elastic member 9 (ie, the compression spring) can provide sufficient elastic downward pressure of the fin fixing portion 40 of the first heat dissipation fin 4 when the above-mentioned limit condition is satisfied. A heat dissipation fin 4 is flatly attached to the first electronic component 1.
於此實施例中，第一散熱鰭片4僅包含一個孔洞41，設置於第一散熱鰭片4的一幾何中心，支架結構8的主架體80亦僅包含一穿孔802，對應孔洞41，即該穿孔802係形成於主架體80的架體固接部801對應第一散熱鰭片4的該幾何中心處以及對應第一電子元件1的幾何中心處。如此一來，當彈性件9設置於第一散熱鰭片4上時，彈性件9對第一散熱鰭片4所產生的該下壓力係可施於第一散熱鰭片4以及第一電子元件1的幾何中心處，使第一散熱鰭片4於受第一散熱鰭片4所產生的該下壓力時不會產生翻轉力矩，有助第一散熱鰭片4平貼於第一電子元件1。值得一提的是，本發明孔洞41、穿孔802、彈性件9及連接件A的數量及設置位置可不侷限於此實施例圖式所繪示，舉例來說，第一散熱鰭片4亦可包含複數個孔洞41，對稱於第一散熱鰭片4的該幾何對稱中心，支架結構8的主架體80亦可包含複數個穿孔802，分別對應複數個孔洞41，即複數個穿孔802亦對稱於第一散熱鰭片4的該幾何對稱中心，支架結構8可包含有複數個彈性件9及連接件A，分別對應複數個孔洞41，即支架結構8包含至少一彈性件9及至少一連接件A、第一散熱鰭片4包含至少一孔洞41及支架結構8的主架體80包含至少一穿孔802的結構設計，均在本發明所保護的範疇內。 In this embodiment, the first heat dissipating fins 4 only include a hole 41 disposed in a geometric center of the first heat dissipating fin 4 , and the main frame body 80 of the bracket structure 8 also includes a through hole 802 corresponding to the hole 41 . That is, the through hole 802 is formed at the geometric center of the main heat dissipation fin 4 of the main frame body 80 and corresponding to the geometric center of the first electronic component 1 . In this way, when the elastic member 9 is disposed on the first heat dissipation fin 4, the downward pressure generated by the elastic member 9 on the first heat dissipation fin 4 can be applied to the first heat dissipation fin 4 and the first electronic component. The first heat dissipation fin 4 does not generate a turning moment when the first heat dissipation fin 4 is subjected to the downward pressure generated by the first heat dissipation fin 4, and helps the first heat dissipation fin 4 to be flat on the first electronic component 1 . It is to be noted that the number and arrangement positions of the holes 41, the through holes 802, the elastic members 9 and the connecting members A of the present invention are not limited to those illustrated in the drawings of the embodiment. For example, the first heat dissipation fins 4 may also be The plurality of holes 41 are symmetric with respect to the geometric symmetry center of the first heat dissipation fins 4. The main frame body 80 of the support structure 8 can also include a plurality of holes 802 corresponding to the plurality of holes 41, that is, the plurality of holes 802 are also symmetric. The bracket structure 8 can include a plurality of elastic members 9 and a connecting member A corresponding to the plurality of holes 41, that is, the bracket structure 8 includes at least one elastic member 9 and at least one connection. The structural design of the member A, the first heat dissipating fin 4 including at least one hole 41 and the main frame body 80 of the bracket structure 8 including at least one through hole 802 are all within the scope of protection of the present invention.
請參閱第6圖以及第7圖，第6圖為本發明第二實施例一散熱模組1000'的外觀示意圖，第7圖為本發明第二實施例散熱模組1000'的***示意圖。如第6圖以及第7圖所示，散熱模組1000'與上述散熱模組1000的主要不同處在於，散熱模組1000'的一支架結構8'(即一主架體80'、一第一固持部81'與一第二固持部82')、一第二散熱鰭片5'與一第三散熱鰭片6'為一體成型。而此實施例與上述實施例中具有相同標號之元件，其具有相同之結構設計與作用原理，為求簡潔，於此不再贅述。 Referring to FIG. 6 and FIG. 7 , FIG. 6 is a schematic diagram of the appearance of a heat dissipation module 1000 ′ according to a second embodiment of the present invention, and FIG. 7 is an exploded view of the heat dissipation module 1000 ′ according to the second embodiment of the present invention. As shown in FIG. 6 and FIG. 7, the main difference between the heat dissipation module 1000' and the heat dissipation module 1000 is that a support structure 8' of the heat dissipation module 1000' (ie, a main frame 80', a first A holding portion 81' and a second holding portion 82'), a second heat sink fin 5' and a third heat sink fin 6' are integrally formed. The components of the embodiment having the same reference numerals as in the above embodiments have the same structural design and function principle, and are not described herein for brevity.
請參閱第8圖至第10圖，第8圖為本發明第三實施例一散熱模組1000"的外觀示意圖，第9圖為本發明第三實施例散熱模組1000"的正視示意圖，第10圖為第9圖所示散熱模組1000"沿一剖面線Z-Z的剖面示意圖。如第8圖至第10圖所示，散熱模組1000"與上述散熱模組1000的主要不同處在於，散熱模組1000"的一支架結構8"可與一殼體F為一體成型，而殼體F可為該電腦裝置的一殼體的一部份，例如一肋片、一牆體等。而此實施例與上述實施例中具有相同標號之元件，其具有相同之結構設計與作用原理，為求簡潔，於此不再贅述。 Please refer to FIG. 8 to FIG. 10 , FIG. 8 is a schematic diagram of the appearance of a heat dissipation module 1000 ′ according to a third embodiment of the present invention, and FIG. 9 is a front view of the heat dissipation module 1000 ′′ according to a third embodiment of the present invention. 10 is a cross-sectional view of the heat dissipation module 1000" along a section line ZZ shown in FIG. 9. As shown in FIGS. 8 to 10, the main difference between the heat dissipation module 1000" and the above-described heat dissipation module 1000 is that A bracket structure 8" of the heat dissipation module 1000" may be integrally formed with a casing F, and the casing F may be a part of a casing of the computer device, such as a rib, a wall, or the like. The components of the embodiment having the same reference numerals as in the above embodiments have the same structural design and function principle, and are not described herein for brevity.
相較於先前技術，本發明散熱模組的第一散熱鰭片、第二散熱鰭片與第三散熱鰭片係分別獨立設置，以分別調整第一散熱鰭片、第二散熱鰭片與第三散熱鰭片於具有不同尺寸之電子元件間的接觸狀況，例如當本發明散熱模組用以散熱具有不同高度的電子元件時，即本發明散熱模組用以散熱的電子元件間具有高度差時，由於第一散熱鰭片、第二散熱鰭片與第三散熱鰭片是分別獨立設置，因此第一散熱鰭片、第二散熱鰭片與第三散熱鰭片可調整其相對位置，藉此本發明散熱模組的第一散熱鰭片、第二散熱鰭片與第三散熱鰭片便可平貼於上述具有高度差之該些電子元件並可增加對該些具有不同尺寸之電子元的散熱效率。此外，本發明散熱模組的支架結構僅在第一固持部與第二固持部具有鎖固螺絲，可減少用以螺固散熱模組之螺絲的數量。以上所述僅為本發明 之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 Compared with the prior art, the first heat dissipation fin, the second heat dissipation fin and the third heat dissipation fin of the heat dissipation module of the present invention are separately disposed to respectively adjust the first heat dissipation fin, the second heat dissipation fin and the first The heat dissipation module of the present invention is used for dissipating the electronic components of different sizes, for example, when the heat dissipation module of the present invention is used for dissipating electronic components having different heights, that is, the height difference between the electronic components for dissipating heat of the heat dissipation module of the present invention The first heat dissipating fin, the second heat dissipating fin, and the third heat dissipating fin can adjust the relative positions of the first heat dissipating fin, the second heat dissipating fin, and the third heat dissipating fin, respectively. The first heat dissipating fin, the second heat dissipating fin and the third heat dissipating fin of the heat dissipating module of the present invention can be flatly attached to the electronic components having the height difference and can add the electronic elements having different sizes. Cooling efficiency. In addition, the bracket structure of the heat dissipation module of the present invention has locking screws only in the first holding portion and the second holding portion, which can reduce the number of screws for screwing the heat dissipation module. The above is only the present invention The preferred embodiments of the present invention are intended to be within the scope of the present invention.
1000‧‧‧散熱模組 1000‧‧‧ Thermal Module
1‧‧‧第一電子元件 1‧‧‧First electronic component
2‧‧‧第二電子元件 2‧‧‧Second electronic components
3‧‧‧第三電子元件 3‧‧‧ Third electronic component
4‧‧‧第一散熱鰭片 4‧‧‧First heat sink fin
40‧‧‧鰭片固接部 40‧‧‧Fin fixation
401‧‧‧鰭片固接部上表面 401‧‧‧Face fixing surface
41‧‧‧孔洞 41‧‧‧ hole
42‧‧‧第一側邊 42‧‧‧ first side
43‧‧‧第一卡合結構 43‧‧‧First engagement structure
44‧‧‧第二側邊 44‧‧‧Second side
45‧‧‧第二卡合結構 45‧‧‧Second snap-in structure
5‧‧‧第二散熱鰭片 5‧‧‧Second heat sink fins
50‧‧‧第二散熱鰭片穿孔 50‧‧‧Second heat sink fin perforation
51‧‧‧端邊 51‧‧‧End
52‧‧‧卡配結構 52‧‧‧ card structure
6‧‧‧第三散熱鰭片 6‧‧‧ Third heat sink fin
60‧‧‧第三散熱鰭片穿孔 60‧‧‧ Third heat sink fin perforation
61‧‧‧邊緣 61‧‧‧ edge
62‧‧‧卡制結構 62‧‧‧Card structure
7‧‧‧電路板 7‧‧‧ boards
70‧‧‧第一螺孔 70‧‧‧First screw hole
71‧‧‧第二螺孔 71‧‧‧Second screw hole
8‧‧‧支架結構 8‧‧‧Support structure
80‧‧‧主架體 80‧‧‧Main frame
801‧‧‧架體固接部 801‧‧‧ frame body fixing
802‧‧‧穿孔 802‧‧‧ perforation
803‧‧‧架體上表面 803‧‧‧The upper surface of the frame
804‧‧‧架體下表面 804‧‧‧ Lower surface of the frame
81‧‧‧第一固持部 81‧‧‧First Holding Department
810‧‧‧第一固持穿孔 810‧‧‧First holding perforation
82‧‧‧第二固持部 82‧‧‧Second holding unit
820‧‧‧第二固持穿孔 820‧‧‧Second holding perforation
9‧‧‧彈性件 9‧‧‧Flexible parts
A‧‧‧連接件 A‧‧‧Connecting parts
A1‧‧‧桿部 A1‧‧‧ pole
A2‧‧‧頭部 A2‧‧‧ head
A3‧‧‧端部 A3‧‧‧ end
B‧‧‧第一固定件 B‧‧‧First fixture
B0‧‧‧第一連接桿部 B0‧‧‧First connecting rod
B1‧‧‧第一螺絲頭 B1‧‧‧First screw head
B2‧‧‧第一螺紋部 B2‧‧‧First thread
C‧‧‧第二固定件 C‧‧‧Second fixture
C0‧‧‧第二連接桿部 C0‧‧‧Second connecting rod
C1‧‧‧第二螺絲頭 C1‧‧‧Second screw head
C2‧‧‧第二螺紋部 C2‧‧‧Second thread
D‧‧‧第一散熱墊片 D‧‧‧First heat sink
E‧‧‧第二散熱墊片 E‧‧‧Second heat sink
Claims (15)
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| TW104131081A TWI612271B (en) | 2015-09-21 | 2015-09-21 | Heat dissipating module capable of enhancing heat dissipating efficiency |
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| Application Number | Priority Date | Filing Date | Title |
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| TW104131081A TWI612271B (en) | 2015-09-21 | 2015-09-21 | Heat dissipating module capable of enhancing heat dissipating efficiency |
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| Publication Number | Publication Date |
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| TW201712290A TW201712290A (en) | 2017-04-01 |
| TWI612271B true TWI612271B (en) | 2018-01-21 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6462951B2 (en) * | 2000-04-10 | 2002-10-08 | Alcatal Canada Inc. | Securing heat sinks to electronic components |
| TWM280498U (en) * | 2005-04-08 | 2005-11-11 | Adlink Technology Inc | Heat-dissipation module |
| TWI292525B (en) * | 2006-02-17 | 2008-01-11 | Foxconn Tech Co Ltd | Heat dissipation device |
| US7375963B2 (en) * | 2006-04-11 | 2008-05-20 | International Business Machines Corporation | System and method for cooling a module |
| CN101460038A (en) * | 2007-12-14 | 2009-06-17 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| TWI334531B (en) * | 2007-12-05 | 2010-12-11 | Wistron Corp | Heat sink and electronic apparatus using the same |
| CN203814120U (en) * | 2014-04-28 | 2014-09-03 | 周庆芬 | Heat radiation assembly |
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- 2015-09-21 TW TW104131081A patent/TWI612271B/en active
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|---|---|---|---|---|
| US6462951B2 (en) * | 2000-04-10 | 2002-10-08 | Alcatal Canada Inc. | Securing heat sinks to electronic components |
| TWM280498U (en) * | 2005-04-08 | 2005-11-11 | Adlink Technology Inc | Heat-dissipation module |
| TWI292525B (en) * | 2006-02-17 | 2008-01-11 | Foxconn Tech Co Ltd | Heat dissipation device |
| US7375963B2 (en) * | 2006-04-11 | 2008-05-20 | International Business Machines Corporation | System and method for cooling a module |
| TWI334531B (en) * | 2007-12-05 | 2010-12-11 | Wistron Corp | Heat sink and electronic apparatus using the same |
| CN101460038A (en) * | 2007-12-14 | 2009-06-17 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| CN203814120U (en) * | 2014-04-28 | 2014-09-03 | 周庆芬 | Heat radiation assembly |
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