TWM280498U - Heat-dissipation module - Google Patents

Description

M280498 四、創作說明（1) 【新型所屬之技術領域】 本創作係提供一種散熱模組，尤指可配合電子產品的 Μ處理器型式做活動抵持貼合之散熱模組，以利用散熱器 於基座之槽孔處活動位移，而達到輔助微處理器快速散埶 之目的。 ” 【先前技術】 按，目前電子元件封裝之密度愈來愈高，體積也朝著 愈來愈小的趨勢發展，且作用時所需之功率也日漸增加， 於疋其所產生出來之熱量也會愈來愈多，為了要有效地移 除t熱元件所產生出來的熱量，因此就必須使用到具有更 问政熱效能的散熱片，而使用散熱片做為散熱工具時，由 於具有較大底部基座面積的散熱片，可以具有更大的散熱 面積、’所以具有較好的散熱能力，而由於目前市面上的散 ^片為了符合所需要的散熱能力，其設計大部分皆為改變 月欠熱片的底部面積或是散熱片的長度、高度、厚度以及間 距、表面積等等，來達到散熱的效果，但除了上述之因素 1卜政熱片與電路板的結合穩固與否，亦將影響散熱片的 ，熱效果及效率；而一般工業電腦之電路板因使用狀態不 二、’除了電路板上固定設置的複數晶片之外，並依使用狀 了 ^裝Λ不同的微處理器’但不同型式的微處理器具有不 2的運作功能，其外形之厚度、高度、體積等也會有不同 言臭化，=因為微處理器厚度、高度在電路板上也會產生 =、低的落差，而欲使用於微處理器上的散熱片，亦必須 b整與電路板鎖固之距離，即產生必須配合電路板上微處M280498 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is to provide a heat sink module, especially a heat sink module that can cooperate with the M processor type of electronic products to resist the fit, in order to use the heat sink. Moving and displacing at the slot of the base to achieve the purpose of assisting the microprocessor to quickly disperse. [Previous technology] According to the current, the density of electronic component packages is getting higher and higher, and the volume is becoming smaller and smaller, and the power required during operation is increasing, and the heat generated by it is also increasing. There will be more and more. In order to effectively remove the heat generated by the thermal element, it is necessary to use a heat sink with more thermal management efficiency. When using a heat sink as a cooling tool, it has a large The heat sink on the bottom base area can have a larger heat sink area, so it has better heat dissipation capacity, and because the current heat sink on the market is in order to meet the required heat dissipation capacity, most of its design is to change the month The bottom area of the underheat sheet or the length, height, thickness, spacing, surface area, etc. of the heat sink, to achieve the effect of heat dissipation, but in addition to the above factors 1 whether the combination of the political heat sheet and the circuit board is stable or not, Affects the heat sink, thermal effect and efficiency; while the general industrial computer circuit board is in a different state of use, 'except for the plurality of chips fixed on the circuit board, and according to Different types of microprocessors are used, but different types of microprocessors have different operating functions. The thickness, height, and volume of the external shape will also be different, because the thickness of the microprocessor, The height will also produce a low drop on the circuit board, and the heat sink to be used on the microprocessor must also be locked to the circuit board, that is, it must match the micro-point on the circuit board.

M280498 、創作說明（2) 理器之型式而選擇適合的散熱片， ，且衍生許多的麻煩與困擾。 放熱片之使用不便 習用之散熱器Α (請參閱第六 鎖固於電路板C上，而使散熱器A 係利用螺釘ΒM280498, creation instructions (2) the type of processor and select the appropriate heat sink, and it has caused many troubles and problems. The heat sink is inconvenient to use. The conventional heat sink A (see section 6. Locking on the circuit board C, so that the heat sink A uses screws B.

之微處理器c 1頂部，即可利舳。卩可抵貼於電路板C 1散熱，然該螺針Β係鎖入散熱；= 理器CThe top of the microprocessor c 1 can be used.卩 It can be dissipated against the circuit board C 1 to dissipate heat, but the screw pin B is locked into the dissipated heat; = processor C

=路板c之螺孔C2，而散熱器再鎖 度為固定，所以螺釘B可以脾々為〇倣慝理态c 1之高 1上，則使用時存在諸多的缺H A鎖固於微處理器C 1、ϊί=⑵Γΐ型式之微處理器時，則散熱器 2 公微！理螺釘即無法將散熱器鎖固 _ D ，以致散熱器的使用受到極大的限制。 y 丁貞固於散熱器與微處理器時，即因螺釘的長短 =同，使政熱器與微處理器間容易產生空隙，亦或者 f ^器過度緊貼於微處理器上，均會影響微處理器 散熱功能。 3 ，路板上設有複數微處理器時，必須逐一將散熱器固 Ο 叹=t微處理器上，不僅耗時、費工，且相鄰之微處 理益若間距過小，亦會造成散熱器安裝的不便。 、 上述對於散熱片之使用所存在的諸多問題，實有待予 以改善’此即為本創作者及從事此行業者所亟欲改良之方 向所在。 【新型内容】 故創作人有鑑於上述缺失，乃搜集相關資料，經由 M280498 四、創作說明（3) 多方評估及考量，並以從事於此行業累積之多 由不斷試作及修改，始設計出此種散熱裝置可做；二； 以配合微處理器的高度位置之散熱模組的新型專利者。 本創作之主要目的係在於該基座上為固設有 於複數散熱片間設有槽孔，以及於週緣設 ^ 孔供散熱器之抵持部嵌…散熱器上複 ‘、曰片及軸孔，再於軸孔處穿設有固定裝置，且將固 孔週緣之各固…即可供散熱器利用固定ΐ 置於槽孔内做活動㈣’俾冑基座固設於電路板$ 於槽孔處活動位移，並可達到完全貼合於微處： 裔’而辅助快速散熱之目的。 【實施方式】 幻盖巧士述㈣及功*，本創作戶斤採用《技術手段及 :力-:;鉍t圖就本創作之較佳實施例詳加說明其特徵與 力月匕如下，俾利完全瞭解。 '二 '三圖所示，係為本創作之立體外觀 太鈿ϊ ”圖：侧視剖面圖’由圖中所示可以清楚看* 所相* 熱模組係包括基座1、風扇2及散熱器3等 戶厅組烕，其中： ]玉上為具有複數散熱片1 1，而複數散熱片1 置空間12 ’並於容置空間12-側設有槽 今其广"貝槽孔121週緣設有複數固定孔122，且 底部設有複數支樓柱13，且各支樓柱" 中並可供螺柃1 3 1鎖入。= The screw hole C2 of the circuit board c, and the re-locking degree of the radiator is fixed, so the screw B can have a spleen of 0, i.e. the height 1 of the morphological state c 1, and there are many lacks of HA locked in use when it is used for microprocessing. Device C 1. When ϊί = ⑵Γΐ type microprocessor, the heat sink is 2 micrometers! The screws cannot lock the heat sink _ D, so the use of the heat sink is greatly restricted. y Ding Zhen is fixed to the heat sink and the microprocessor, that is, the length of the screw = the same, which makes it easy to create a gap between the heater and the microprocessor, or the f ^ device is too close to the microprocessor. Affects the cooling function of the microprocessor. 3, when there are multiple microprocessors on the board, the heat sinks must be fixed one by one. The t microprocessor is not only time-consuming and labor-intensive, but if the adjacent micro-processing benefits are too small, it will also cause heat dissipation. Installation is inconvenient. Many problems mentioned above regarding the use of heat sinks need to be improved. This is the direction that creators and practitioners in this industry want to improve. [New content] Therefore, in view of the above-mentioned shortcomings, the creator collected relevant information and passed M280498 IV. Creation Instructions (3) Multi-party evaluation and consideration, and continued to make trials and modifications based on the accumulated experience in this industry. This kind of heat dissipation device can be made; two; the new patentee of the heat dissipation module to match the height position of the microprocessor. The main purpose of this creation is that the base is fixedly provided with slot holes between a plurality of heat sinks, and ^ holes are provided on the periphery for the resisting part of the heat sink to be embedded ... Hole, and then a fixing device is passed through the shaft hole, and the peripheral edges of the fixing hole are fixed. The heat sink can be used for fixing. It can be placed in the slot for activities. The base is fixed on the circuit board. The slot hole can be moved and displaced, and it can completely fit in the micro place: to assist the rapid heat dissipation. [Embodiment] The magician describes the skills and skills *, and the author uses the "technical means and: force- :; bismuth t chart to explain the characteristics and force moon of the preferred embodiment of this creation in detail as follows, Tong Li fully understands. The 'two' and three pictures are the three-dimensional appearance of this creation. The picture is: "Side view of the side view." It can be clearly seen from the picture * The phase * The thermal module system includes the base 1, the fan 2, and Radiator 3 and other household halls, among them:] Yushang has a plurality of heat sinks 1 1, and the plurality of heat sinks 1 is provided with a space 12 'and a groove is provided on the 12-side of the accommodation space. A plurality of fixing holes 122 are provided on the periphery of 121, and a plurality of building pillars 13 are provided at the bottom, and each of the building pillars can be locked in by screws 131.

第7頁 M280498 四、創作說明（4) 该風扇2為側吹式，其一側為設有出風口 ::熱：3底部為具有抵持部3丄，頂部 :片3 2 ，並於複數鰭片3 2外側設有複數 稷數軸孔3 3中均活動穿設有固定裝置3 4， 3 4係具有定位元件3 4 1，並於定位元件3 有螺接部341 i，再於定位元件 ：： 件3 4 2。 上奮 上述各構件於組裴時，係於基座1之 供風扇2固設，且使風扇2之出風口 2 1朝向 2之槽孔121，而於該槽孔121處則供散 之抵持部3 1嵌入，再利用$敎％ q ^ 丹利用政熱益3的軸孔3 裝置3 4 ’以疋位元件3 4 1之螺接部3 4 孔121週緣之各固定孔122，俾將散熱器 於槽孔1 2 1處，而容置空間工2之風扇 口 21吹送冷風至散熱器3 ’俾輔助散熱器3 熱。 該散熱器3係藉由複數固定裝置3 4辦# 槽孔1 2 1處’且散熱器3上之複數軸孔 定裝置34之定位元件341穿過，且各定： 上套設之各彈性元件3 4 2則抵持於散熱器3 散熱器3於基座1之槽孔"i處活動位移： 定位兀件3 4 1限制散熱器3之位移方向，並 件3 4 2彈性抵持散熱n 3保持向下抵壓，且 產生活動位移後，即使彈性元件3 4 2產生彈 2 1° 則設有複數 孔3 3 ，而 且固定裝置 4 1底部設 設有彈性元 空間1 2處 容置空間1 熱3底部 3中之固定 1鎖固於槽 3活動嵌設 則可由出風 可更快速散 於基座1之 係供複數固 元件3 4 1 週緣，俾當 ，即藉由各 利用彈性元 當散熱器3 性位移（壓Page 7 M280498 IV. Creation instructions (4) The fan 2 is a side-blow type, and one side is provided with an air outlet :: heat: 3 at the bottom is a supporting part 3 丄, and at the top: a piece 3 2, and the plural A plurality of shaft holes 3 are provided on the outside of the fins 3 2 and a fixing device 3 4 is provided in each of the three movements. The positioning device 3 4 1 has a positioning element 3 4 1 and a screw connection portion 341 i on the positioning element 3. :: Pieces 3 4 2. When the above components are assembled, the fan 2 of the base 1 is fixedly installed, and the air outlet 21 of the fan 2 is directed toward the slot 121 of 2, and at the slot 121, the supply is scattered. The holding part 31 is inserted, and then reused $ 敎% q ^ Dan uses the shaft hole 3 of the Zhengre 3 device 3 4 'to position the screw connection part 3 4 1 of each of the fixing holes 122 of the hole 121, 俾Place the radiator in the slot 1 2 1, and the fan port 21 of the space worker 2 blows cold air to the radiator 3 ′, and the auxiliary radiator 3 is hot. The radiator 3 is provided by a plurality of fixing devices 3 4 to # slot holes 1 2 1 'and the positioning elements 341 of the plurality of shaft hole fixing devices 34 on the radiator 3 are passed through, and each setting: each elasticity of the upper set Element 3 4 2 resists the heat sink 3's slot in the base 1 " i's movable displacement: The positioning element 3 4 1 restricts the displacement direction of the heat sink 3, and the joint 3 4 2 elastically resists The heat radiation n 3 keeps pressing downward, and after the movement displacement occurs, even if the elastic element 3 4 2 generates a spring 2 1 °, a plurality of holes 3 3 are provided, and the bottom of the fixing device 4 1 is provided with an elastic element space 12 places. Place space 1 Hot 3 Bottom 3 Fixed 1 Locked in slot 3 Movable embedding can be dispersed by the wind more quickly to the base 1 for multiple solid components 3 4 1 Peripheral, when appropriate, that is, by each use Elastic element when the radiator is 3 displacement (pressure

Hi 第8頁 M280498 四、創作說明（5) 細：m 3 :2可再利用彈性元件3 4 2之彈性回復力 肝戚热裔3抵持於原位。 面圖再:! ί Ϊ ?三、四、五圖所示，係' 為本創作之側視剖 圖:由^ Φ只鈿例之侧視剖面圖、另一實施例之側視剖面 二其广θ可以清楚看出，本創作之散熱模組使用時，係 ί 2 =支撐柱1 3架設於電子產品之電路板4上 丄 "之螺桿131鎖固於電路板4上之螺 孔4，而將基幻固設於電路板4上， ^ 熱器3即對位於雷政把1 L 版各 度丄上之政 之抵持邻U 微處理器4 2，並藉由底部 處理器42上，則散熱器3係可配 :槽孔1 以使散熱器3底部之抵持部3 1 孔“則叁要中作上、T活動位移，並藉由散熱器3之軸 固定裝置3 4的定位元件3 4 i外部，亦 作亡下的活動位移，且固定裝置3 4之彈性元件3 4 9 f::熱器3之位移而產生彈性壓縮位移，並以彈性 3 4 2之彈性伸張力抵壓散熱器3， 完全貼合於微處理器4=到：以 ”處理器42間不致產生間隙，俾能藉由 快”熱…；同時，可藉：基！：： 置二間12處之風扇2由出風口21吹送工收、 =熱器3，俾輔助散熱器3可更快‘散執；且：： 板4上其他所設之複數晶片4 3，則可貼合於^ 2 預設之各襯墊i 4 ’而達到藉由 將 二 3之熱源導引至基座i，再由基座= 以 第9頁 M280498 g、創作說明（6) 熱，即可將複數晶 而一般工業用 3，並 理器4 的落差 器3仍 面，該 位置， 熱器3 面間的 4以定 位移， 移，並 使散熱 不受微 制0 片4 3 之電路 所使用 同型式 1固設 抵持部 則於槽 裝置3 熱器3 間隙， 1、彈 3之抵 板4上 部3 1 型式不 之熱源排 板4上會 狀況不同 的微處理 於電路板 3 1完全 孔1 2 1 4之彈性 之抵持部 即可藉由 性元件3 持部3 1 不同型式 完全貼合 同，即產 依電路板4 2時，則不 ’俾於基座 可藉底部之 抵持部3 1 並利用固定 ’以確保散 貼合不產生 位元件3 4 而使散熱器 可配合電路 器3之抵持 處理器4 2 固定設置有 而裝設不同 器4 2之高 4時，基座 貼合於微處 中活動位移 元件3 4 2 3 1與微處 散熱器3之 4 2所產生 在槽孔1 2 之微處理器 於微處理器 生之高度落 複數晶片4 型式的微處 度即有高低 1上之散熱 理器4 2表 至適當高度 彈性抵壓散 理器4 2表 固定裝置3 的彈性活動 1中活動位 4 2，均可 4 2表面， 差而有所限 上述本創作之 列之優點，如： (一） 散熱模組之 路板上微處 之抵持部完 理器表面間 快速散熱。 (二） 散熱模組之 散熱模組，於實際使用時，為可具有下 移，配合電 散熱底部 持部與微處 助微處理器 嵌設於基座 散熱器可於基座上做活動位 理器之型式與高度，即可使 全貼合於微處理器，而於底 不產生間隙，讓散熱器可輔 散熱器係利用固定裝置活動Hi Page 8 M280498 IV. Creation instructions (5) Fine: m 3: 2 resilience of the elastic restoring force of the elastic element 3 4 2 The liver Qi heat descent 3 resists in situ.面 图 再:! Ί Ϊ? As shown in three, four, and five, the system is a side cross-sectional view of this creation: ^ Φ only a side sectional view of the example, a side sectional view of another embodiment It can be clearly seen from the wide θ that when the heat dissipation module of this creation is used, it is ί 2 = support post 1 3 mounted on the circuit board 4 of the electronic product 丄 " the screw 131 is locked to the screw hole 4 on the circuit board 4 And the basic magic is fixed on the circuit board 4, ^ Heater 3 is against the government located on the 1L version of Lei Zheng, adjacent to the U microprocessor 4 2 and through the bottom processor 42 Then, the radiator 3 can be equipped with: slot 1 to make the abutment portion 3 1 at the bottom of the radiator 3, and then the upper and middle positions of the radiator 3 are moved, and the shaft fixing device 3 4 of the radiator 3 is used. The position of the positioning element 3 4 i also acts as a moving displacement of the dead, and the elastic element 3 4 9 f: of the fixed device 3 4 generates an elastic compression displacement by the displacement of the heater 3 and uses the elastic extension tension of the elastic 3 4 2 Press the heat sink 3 and fit the microprocessor 4 completely. To: With "there is no gap between the processors 42, you can quickly heat"; at the same time, you can borrow: the base! :: put two rooms 12 The fan 2 is blown and received by the air outlet 21, = heater 3, and the auxiliary radiator 3 can be faster spread; and :: The other multiple chips 4 3 on the board 4 can be attached to ^ 2 The preset pads i 4 ′ are achieved by directing the heat source of two 3 to the base i, and then by the base = by heating on page 9 with M280498 g, creation instructions (6), the multiple crystals can be changed into For general industrial use, the drop device 3 of the parallel device 4 is still at this position. At this position, the 4 between the surfaces of the heat device 3 is moved to position and move, and the heat dissipation is not affected by microfabrication. The fixed abutment part is in the gap between the heat device 3 and the heat sink 3, 1. The upper part of the abutment plate 4 of the spring 3 1 The heat source row board 4 of a different type is micro-processed on the circuit board 3 1 Complete hole 1 2 1 The elastic resisting part of 4 can be completely contracted by the different types of holding parts 3 1, that is, when the circuit board 4 2 is produced, it can be used without the resisting part 3 1 at the bottom. Use fixed to ensure that the loose bonding does not generate the bit element 3 4 so that the heat sink can cooperate with the circuit 3 to resist the processor 4 2 is fixedly installed and installed differently When the height of the device 4 2 is 4, the base is attached to the movable displacement element 3 4 2 3 1 and the heat sink 3 4 2 of the micro place. The microprocessor in the slot 1 2 is produced by the microprocessor. The height of the complex chip 4 type has a slight degree of heat dissipation device 4 on the high and low 1 table 2 to a suitable height to elastically dissipate the diffuser 4 2 table to the elastic activity of the fixture 3 1 in the movable position 4 2 can be 4 2 surface, the difference is limited to the advantages of the above-mentioned creations, such as: (1) heat dissipation between the surface of the processor in the micro-bearing part of the heat sink module. (2) The heat dissipation module of the heat dissipation module, in actual use, can have a downward movement, cooperate with the bottom part of the electric heat dissipation and the micro place to help the microprocessor be embedded in the base. The heat sink can be used as a movable position on the base. The type and height of the processor can make the whole fit to the microprocessor without creating a gap at the bottom, so that the radiator can assist the radiator to use the fixed device to move

M280498 創作說明（7) 上’藉由固定裝置之定位元件穿設於散熱器之軸孔 、、彈性元件則抵壓於散熱器，俾當散熱器在基座上 =動位移時，藉由彈性元件抵壓散熱器，則使散熱 一，保持向下的抵持效果。 ()政熱模組可配合不同型式之電路板及微處理器使用 達到使用範圍廣、限制少之特色，使散熱模組之 ^用性增加，可方便組設於各種電路板上。 板上因使用狀態不同，而採用不同型式之微處 Φ 理器時，散熱模組之散熱器可於基座上做位移調整 以配合微處理器之高度而方便安裝。 即侷·:本二 較佳實施例而已，非因此 式内宏所么Γ ί ί 舉凡運用本創作說明書及圖 本創作之飾i等效結構變化，均應同理包含於 j邗之寻利範圍内，合予陳明。 能達：i戶:t本創作上述之散熱模組於使用時，為確實 月匕運到其功效及目的， ^ ^ ，為#人# _ A y +創作喊為一實用性優異之創作 匈付合新型專利之申諳要杜 ^ 委早日腺％ i & 、/月要件羑依法提出申請，盼審 文干曰賜准本案，以保障創你人 货 審委有杯打接Μ 4 之辛苦創作’倘乡鈞局 赞女頁任何稽疑，請不吝爽了扣- ； ，實感公便。 吝來“不，創作人定當竭力配合 第11頁 M280498 圖式簡單說明 【圖 式簡單 說明】 第一圖 係為本創作之立體外觀圖。 第二圖 係為本創作之立體分解圖。 第三圖 係為本創作之側視剖面圖。 第四圖 係為本創作較佳實施例之側視剖面圖。 第五圖 係為本創作另一實施例之側視剖面圖。 第六圖 係為習用散熱器之立體分解圖。 【主 要元 件符號 說明】 1、基座 11、散熱片 13、支撐柱 1 2、容置空間 1 3 1 、螺桿 121、槽孔 14、襯墊 1 2 2 、固定孔M280498 Creative Instructions (7) On the 'the positioning element of the fixing device is penetrated through the shaft hole of the radiator, and the elastic element is pressed against the radiator, when the radiator on the base = dynamic displacement, the elasticity When the component presses against the heat sink, it will dissipate heat and maintain the downward resistance effect. () The political thermal module can be used with different types of circuit boards and microprocessors to achieve a wide range of use and less restrictions, which increases the usefulness of the heat dissipation module and can be easily assembled on various circuit boards. Due to the different use conditions on the board, when different types of micro processors are used, the heat sink of the cooling module can be adjusted on the base to adjust the height of the microprocessor to facilitate installation. That is the Bureau: This is the second preferred embodiment, is it not for this type of inner macro? Γ ί ί Any changes in the equivalent structure of the decoration using this creative description and illustrations should be included in the profit of j 邗Within the scope, joint Chen Ming. Nengda: i household: When the above-mentioned cooling module was used, in order to ensure its effectiveness and purpose, ^ ^, for # 人 # _ A y + creation is a creative hunger with excellent practicality The application of Fuhe's new patent must be submitted to the Commission as soon as possible. The application of the law will be submitted in accordance with the law, and I hope that the case will be approved in order to ensure that you have a cup to answer the M 4 Hard work 'If the Xiangjun Bureau praises the female page for any suspicion, please don't let it go.-;吝 来 “No, the creator must try his best to cooperate with the M280498 diagram on page 11 [Simplified diagram] The first picture is the three-dimensional appearance of the creation. The second picture is the three-dimensional exploded view of the creation. The third The picture is a side sectional view of the creation. The fourth picture is a side sectional view of a preferred embodiment of the creation. The fifth picture is a side sectional view of another embodiment of the creation. The sixth picture is Three-dimensional exploded view of the conventional radiator. [Description of the main component symbols] 1. Base 11, heat sink 13, support column 1, 2, accommodation space 1 3 1, screw 121, slot hole 14, gasket 1 2 2, fixed hole

第12頁 M280498 圖式簡單說明 3 4 、固定裝置Page 12 M280498 Brief description of the drawings 3 4, Fixing device

BB

CC

C 器板理路孔處電螺微 片 晶 f 3 4 器熱孔 散螺 釘螺 器板理路處 電微 1^11 第13頁C. Electromechanical microchip at the circuit board hole f 3 4 Device hot hole Loose screw Oncomel electromechanical unit at the circuit board electric micro 1 ^ 11 Page 13

Claims (1)

M280498 五、申請專利範圍 1 、一種散熱模組，尤指可配合電子產品的微處理器做活 動抵持貼合之散熱模組，其係包括基座、風扇、散熱 器等所組成，該基座上為成型有複數散熱片，且固設 有風扇及散熱器，而散熱器上為設有複數鰭片，其改 良在於： 該基座上為設有週緣具複數固定孔之槽孔，並藉由槽 孔供散熱器之抵持部嵌入，而散熱器上則活動設置複 數可定位於固定孔之固定裝置。 2、 如申請專利範圍第1項所述之散熱模組，其中該散熱 器之複數鰭片外側為設有複數軸孔，並可藉由軸孔供 複數固定裝置活動穿設。 3、 如申請專利範圍第1項所述之散熱模組，其中該固定 裝置為具有定位元件，並於定位元件上套設有彈性元 件0M280498 5. Scope of patent application 1. A heat dissipation module, especially a heat dissipation module that can cooperate with the microprocessor of electronic products for activity and fit. It consists of a base, a fan, a radiator, etc. The seat is formed with a plurality of radiating fins, and a fan and a radiator are fixedly arranged. The radiator is provided with a plurality of fins. The improvement is that: the base is provided with a slot with a plurality of fixing holes on the periphery, and A slot is provided for the resisting portion of the radiator to be embedded, and a plurality of fixing devices that can be positioned on the fixing hole are movably arranged on the radiator. 2. The heat dissipation module according to item 1 of the scope of patent application, wherein the plurality of fins of the heat sink are provided with a plurality of shaft holes on the outside, and the plurality of fixing devices can be moved through the shaft holes. 3. The heat dissipation module according to item 1 of the scope of patent application, wherein the fixing device has a positioning element, and an elastic element is sleeved on the positioning element. 第14頁Page 14