TWI612080B - Transparent resin for encapsulation material and encapsulation material and electronic device including the same - Google Patents

Transparent resin for encapsulation material and encapsulation material and electronic device including the same Download PDF

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TWI612080B
TWI612080B TW100149817A TW100149817A TWI612080B TW I612080 B TWI612080 B TW I612080B TW 100149817 A TW100149817 A TW 100149817A TW 100149817 A TW100149817 A TW 100149817A TW I612080 B TWI612080 B TW I612080B
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unsubstituted
substituted
polyoxyalkylene
transparent resin
group
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TW201231507A (en
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車承桓
高尚蘭
金龍國
金佑翰
金哈娜
安治垣
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第一毛織股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract

本發明公開了一種用於封裝材料的透明樹脂、封裝材料和包含其的電子元件，所述透明樹脂包含第一聚矽氧烷和第二聚矽氧烷，所述第一聚矽氧烷在其末端包含與矽鍵結的氫(Si-H)，所述第二聚矽氧烷在其末端包含與矽鍵結的烯基基團(Si-Vi)，其中所述與矽鍵結的氫(Si-H)和所述與矽鍵結的烯基基團(Si-Vi)以約1至約1.2的比率(Si-H/Si-Vi)存在。The present invention discloses a transparent resin for encapsulating materials, an encapsulating material, and an electronic component comprising the same, the transparent resin comprising a first polyoxyalkylene oxide and a second polyoxyalkylene oxide, wherein the first polyoxyalkylene oxide is The end thereof contains hydrogen (Si-H) bonded to ruthenium, and the second polyoxy siloxane contains an oxime-bonded alkenyl group (Si-Vi) at its end, wherein the bond with ruthenium Hydrogen (Si-H) and the oxime-bonded alkenyl group (Si-Vi) are present in a ratio of from about 1 to about 1.2 (Si-H/Si-Vi).

Description

封裝材料用透明樹脂以及包含該樹脂之封裝材料與電子元件Transparent resin for packaging material and packaging material and electronic component containing the same 發明領域Field of invention

本申請公開了用於封裝材料的透明樹脂、包含其的封裝材料和電子元件(電子裝置)。The present application discloses a transparent resin for encapsulating materials, an encapsulating material including the same, and an electronic component (electronic device).

發明背景Background of the invention

發光元件如發光二極體(LED)、有機發光元件(OLED)、光致發光(PL)元件等已經多樣地應用於家用電動裝置、照明裝置、顯示裝置、各種自動裝置等中。Light-emitting elements such as light-emitting diodes (LEDs), organic light-emitting elements (OLEDs), photoluminescence (PL) elements, and the like have been variously used in household electric devices, lighting devices, display devices, various automatic devices, and the like.

發光元件可以使用發光體(光發射器，light emitter)顯示發光材料的固有顏色如藍、紅和綠，或者可以通過將顯示不同顏色的發光體結合而顯示白色。The light-emitting element may display an intrinsic color of the light-emitting material such as blue, red, and green using a light emitter, or may display white by combining light-emitting bodies that display different colors.

這種發光元件通常可以具有包裝或封裝結構。Such a light-emitting element can generally have a package or package structure.

這種包裝或封裝結構可以由包含透明樹脂的封裝材料製成，所述透明樹脂能夠從外部通過由發光體發射的光。由於將透明樹脂定位在其中通過光的位置中，所以透明樹脂的特性如透光率和耐熱性可能影響光效率。另外，該透明樹脂係設置於覆蓋該發光體的結構中，所以其可被設置在發光元件的表面上。由此，在加工(處理，工藝)期間可能將其暴露。Such a package or package structure may be made of an encapsulating material containing a transparent resin that can pass light emitted from the illuminant from the outside. Since the transparent resin is positioned in a position in which light passes, the characteristics of the transparent resin such as light transmittance and heat resistance may affect light efficiency. Further, the transparent resin is provided in a structure covering the illuminant, so that it can be provided on the surface of the illuminating element. Thus, it may be exposed during processing (processing, process).

發明概要Summary of invention

本發明的一個實施方式提供了一種用於封裝材料的透明樹脂，其藉由提高透明樹脂的物理性能而增強了加工性以及防止了光效率的劣化。One embodiment of the present invention provides a transparent resin for an encapsulating material which enhances workability and prevents deterioration of light efficiency by improving physical properties of the transparent resin.

本發明的另一個實施方式提供了包含所述透明樹脂的封裝材料。Another embodiment of the present invention provides an encapsulating material comprising the transparent resin.

本發明的又一個實施方式提供了包含所述封裝材料的電子元件。Yet another embodiment of the present invention provides an electronic component including the encapsulating material.

根據一個實施方式，提供了一種用於封裝材料的透明樹脂，所述透明樹脂包含第一聚矽氧烷和第二聚矽氧烷，所述第一聚矽氧烷在其末端包含與矽鍵結的氫(Si-H)，所述第二聚矽氧烷在其末端包含與矽鍵結的烯基基團(Si-Vi)，其中所述與矽鍵結的氫(Si-H)和所述與矽鍵結的烯基基團(Si-Vi)以約1至約1.2的比率(Si-H/Si-Vi)存在。According to one embodiment, there is provided a transparent resin for a packaging material, the transparent resin comprising a first polyoxyalkylene oxide and a second polyoxyalkylene oxide, the first polyoxyalkylene oxide comprising a hydrazone bond at an end thereof a hydrogen (Si-H) comprising a fluorene-bonded alkenyl group (Si-Vi) at its end, wherein the hydrazine-bonded hydrogen (Si-H) The alkenyl group (Si-Vi) bonded to the oxime is present in a ratio of from about 1 to about 1.2 (Si-H/Si-Vi).

所述第一聚矽氧烷可以由以下化學式1表示。The first polyoxyalkylene can be represented by the following Chemical Formula 1.

[化學式1][Chemical Formula 1]

(R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6SiO3/2)T1(SiO4/2)Q1 (R 1 R 2 R 3 SiO 1/2 ) M1 (R 4 R 5 SiO 2/2 ) D1 (R 6 SiO 3/2 ) T1 (SiO 4/2 ) Q1

在化學式1中，R1至R6各自獨立地為氫、取代或未取代的C1至C30烷基、取代或未取代的C3至C30環烷基、取代或未取代的C6至C30芳基、取代或未取代的C7至C30芳烷基、取代或未取代的C1至C30雜烷基、取代或未取代的C2至C30雜環烷基、取代或未取代的C2至C30炔基、取代或未取代的C1至C30烷氧基、取代或未取代的C1至C30羰基、羥基、或它們的組合，R1至R6中的至少一個包括氫，0<M1<1，0<D1<1，0

Figure TWI612080BD00001
T1<1，0
Figure TWI612080BD00002
Q1<1，且M1+D1+T1+Q1=1。In Chemical Formula 1, R 1 to R 6 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, Substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkynyl, substituted or Unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30 carbonyl, hydroxy, or a combination thereof, at least one of R 1 to R 6 includes hydrogen, 0 < M1 < 1, 0 < D1 < 1 ,0
Figure TWI612080BD00001
T1<1,0
Figure TWI612080BD00002
Q1 < 1, and M1 + D1 + T1 + Q1 = 1.

所述第二聚矽氧烷可以由以下化學式2表示。The second polyoxyalkylene can be represented by the following Chemical Formula 2.

[化學式2][Chemical Formula 2]

(R7R8R9SiO1/2)M2(R10R11SiO2/2)D2(R12SiO3/2)T2(SiO4/2)Q2 (R 7 R 8 R 9 SiO 1/2 ) M2 (R 10 R 11 SiO 2/2 ) D2 (R 12 SiO 3/2 ) T2 (SiO 4/2 ) Q2

在化學式2中，R7至R12各自獨立地為取代或未取代的C1至C30烷基、取代或未取代的C3至C30環烷基、取代或未取代的C6至C30芳基、取代或未取代的C7至C30芳烷基、取代或未取代的C1至C30雜烷基、取代或未取代的C2至C30雜環烷基、取代或未取代的C2至C30烯基、取代或未取代的C2至C30炔基、取代或未取代的C1至C30烷氧基、取代或未取代的C1至C30羰基、羥基、或它們的組合，R7至R12中的至少一個包括取代或未取代的C2至C30烯基，0<M2<1，0<D2<1，0<T2<1，0

Figure TWI612080BD00003
Q2<1，且M2+D2+T2+Q2=1。In Chemical Formula 2, R 7 to R 12 are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substitution or Unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkenyl, substituted or unsubstituted a C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxyl group, or a combination thereof, at least one of R 7 to R 12 including a substituted or unsubstituted group C2 to C30 alkenyl, 0 < M2 < 1, 0 < D2 < 1, 0 < T2 < 1, 0
Figure TWI612080BD00003
Q2<1, and M2+D2+T2+Q2=1.

所述與矽鍵結的氫(Si-H)和所述與矽鍵結的烯基基團(Si-Vi)可以以約1.05至約1.15的比率(Si-H/Si-Vi)存在。The hydrazine-bonded hydrogen (Si-H) and the fluorene-bonded alkenyl group (Si-Vi) may be present in a ratio of from about 1.05 to about 1.15 (Si-H/Si-Vi).

基於所述透明樹脂的總量，所述第一聚矽氧烷可以以小於約50 wt%被包括，並且基於所述透明樹脂的總量，所述第二聚矽氧烷可以以大於約50 wt%被包括。The first polyoxyalkylene oxide may be included in less than about 50% by weight based on the total amount of the transparent resin, and the second polyoxyalkylene oxide may be greater than about 50 based on the total amount of the transparent resin. Wt% is included.

所述透明樹脂還可以包含矽氫化催化劑。The transparent resin may further comprise a ruthenium hydrogenation catalyst.

根據另一個實施方式，提供了藉由將上述用於封裝材料的透明樹脂固化所製備的封裝材料。According to another embodiment, an encapsulating material prepared by curing the above-described transparent resin for encapsulating material is provided.

所述封裝材料可在約450 nm波長處具有約80%至100%的透光率(light transmittance)(T)。The encapsulating material can have a light transmittance (T) of about 80% to 100% at a wavelength of about 450 nm.

在約120℃下加熱約500小時之後，所述封裝材料可以具有小於約15%的透光率下降率(△T)。After heating at about 120 ° C for about 500 hours, the encapsulating material can have a light transmittance reduction rate (ΔT) of less than about 15%.

在約180℃下加熱約150小時之後，所述封裝材料可以具有小於約15%的透光率下降率(△T)。After heating at about 180 ° C for about 150 hours, the encapsulating material may have a light transmittance reduction rate (ΔT) of less than about 15%.

所述封裝材料可以具有小於約100 kgf的黏性(黏度，tackiness)。The encapsulating material can have a tackiness of less than about 100 kgf.

根據又一個實施方式，提供了包含所述封裝材料的電子元件。According to yet another embodiment, an electronic component comprising the encapsulating material is provided.

所述電子元件可以包括發光二極體、有機發光元件、光致發光元件和太陽能電池。The electronic component may include a light emitting diode, an organic light emitting element, a photoluminescent element, and a solar cell.

耐熱性和黏性可以被顯著改善。Heat resistance and viscosity can be significantly improved.

詳細說明Detailed description

在下文中將對本發明的示例性實施方式進行詳細描述。然而，這些實施方式僅是示例性的且不限制本發明。如本領域的技術人員應理解的，可以在均不背離本發明的精神或範圍的情況下，以各種不同的方式對所描述的實施方式進行修改。Exemplary embodiments of the invention are described in detail below. However, these embodiments are merely exemplary and do not limit the invention. The described embodiments may be modified in various different ways, without departing from the spirit or scope of the invention.

如本文中所使用的，當沒有另外提供定義時，術語“取代的”是指用選自由以下所構成之群組中至少一種取代基來取代化合物的氫：鹵素(F、Br、Cl或I)、羥基、烷氧基、硝基、氰基、胺基、疊氮基、脒基、肼基、亞肼基、羰基、胺甲醯基、硫醇基、酯基、羧基或其鹽、磺酸基或其鹽、磷酸基或其鹽、C1至C30烷基、C2至C20烯基、C2至C20炔基、C6至C30芳基、C7至C30芳烷基、C1至C30烷氧基、C1至C20雜烷基、C3至C20雜芳烷基、C3至C30環烷基、C3至C15環烯基、C6至C15環炔基、C3至C30雜環烷基、以及它們的組合。As used herein, when a definition is not otherwise provided, the term "substituted" refers to hydrogen substituted with a compound selected from at least one substituent selected from the group consisting of halogen (F, Br, Cl or I). a hydroxyl group, an alkoxy group, a nitro group, a cyano group, an amine group, an azide group, a fluorenyl group, a fluorenyl group, a fluorenylene group, a carbonyl group, an amine carbaryl group, a thiol group, an ester group, a carboxyl group or a salt thereof, Sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1 to C30 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C30 aryl group, a C7 to C30 aralkyl group, a C1 to C30 alkoxy group C1 to C20 heteroalkyl, C3 to C20 heteroarylalkyl, C3 to C30 cycloalkyl, C3 to C15 cycloalkenyl, C6 to C15 cycloalkynyl, C3 to C30 heterocycloalkyl, and combinations thereof.

如本文中所使用的，當沒有另外提供定義時，詞頭“雜”是指包含選自N、O、S和P的1至3個雜原子。As used herein, when a definition is not otherwise provided, the prefix "hetero" refers to comprising from 1 to 3 heteroatoms selected from N, O, S and P.

在下文中，對根據一個實施方式的用於封裝材料的透明樹脂進行描述。Hereinafter, a transparent resin for an encapsulating material according to one embodiment will be described.

根據一個實施方式的用於封裝材料的透明樹脂包含第一聚矽氧烷和第二聚矽氧烷，所述第一聚矽氧烷在其末端包含與矽鍵結的氫(Si-H)，所述第二聚矽氧烷在其末端包含與矽鍵結的烯基基團(Si-Vi)。The transparent resin for encapsulating material according to one embodiment comprises a first polyoxyalkylene oxide and a second polyoxyalkylene oxide, the first polyoxyalkylene oxide comprising hydrogen (Si-H) bonded to the oxime at its end The second polyoxyalkylene contains an alkenyl group (Si-Vi) bonded to the oxime at its end.

所述第一聚矽氧烷可以由以下化學式1表示。The first polyoxyalkylene can be represented by the following Chemical Formula 1.

[化學式1][Chemical Formula 1]

(R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6SiO3/2)T1(SiO4/2)Q1 (R 1 R 2 R 3 SiO 1/2 ) M1 (R 4 R 5 SiO 2/2 ) D1 (R 6 SiO 3/2 ) T1 (SiO 4/2 ) Q1

在化學式1中，R1至R6各自獨立地為氫、取代或未取代的C1至C30烷基、取代或未取代的C3至C30環烷基、取代或未取代的C6至C30芳基、取代或未取代的C7至C30芳烷基、取代或未取代的C1至C30雜烷基、取代或未取代的C2至C30雜環烷基、取代或未取代的C2至C30炔基、取代或未取代的C1至C30烷氧基、取代或未取代的C1至C30羰基、羥基、或它們的組合，R1至R6中的至少一個是氫，0<M1<1，0<D1<1，0

Figure TWI612080BD00004
T1<1，0
Figure TWI612080BD00005
Q1<1，且M1+D1+T1+Q1=1。In Chemical Formula 1, R 1 to R 6 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, Substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkynyl, substituted or Unsubstituted C1 to C30 alkoxy, substituted or unsubstituted C1 to C30 carbonyl, hydroxy, or a combination thereof, at least one of R 1 to R 6 is hydrogen, 0 < M1 < 1, 0 < D1 < 1 ,0
Figure TWI612080BD00004
T1<1,0
Figure TWI612080BD00005
Q1 < 1, and M1 + D1 + T1 + Q1 = 1.

M1、D1、T1和Q1各自表示莫耳比。M1, D1, T1 and Q1 each represent a molar ratio.

所述第二聚矽氧烷可以由以下化學式2表示。The second polyoxyalkylene can be represented by the following Chemical Formula 2.

[化學式2][Chemical Formula 2]

(R7R8R9SiO1/2)M2(R10R11SiO2/2)D2(R12SiO3/2)T2(SiO4/2)Q2 (R 7 R 8 R 9 SiO 1/2 ) M2 (R 10 R 11 SiO 2/2 ) D2 (R 12 SiO 3/2 ) T2 (SiO 4/2 ) Q2

在化學式2中，R7至R12各自獨立地為取代或未取代的C1至C30烷基、取代或未取代的C3至C30環烷基、取代或未取代的C6至C30芳基、取代或未取代的C7至C30芳烷基、取代或未取代的C1至C30雜烷基、取代或未取代的C2至C30雜環烷基、取代或未取代的C2至C30烯基、取代或未取代的C2至C30炔基、取代或未取代的C1至C30烷氧基、取代或未取代的C1至C30羰基、羥基、或它們的組合，R7至R12中的至少一個是取代或未取代的C2至C30烯基，0<M2<1，0<D2<1，0<T2<1，0

Figure TWI612080BD00006
Q2<1，且M2+D2+T2+Q2=1。In Chemical Formula 2, R 7 to R 12 are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substitution or Unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkyl, substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkenyl, substituted or unsubstituted a C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxyl group, or a combination thereof, at least one of R 7 to R 12 being substituted or unsubstituted C2 to C30 alkenyl, 0 < M2 < 1, 0 < D2 < 1, 0 < T2 < 1, 0
Figure TWI612080BD00006
Q2<1, and M2+D2+T2+Q2=1.

M2、D2、T2和Q2各自為莫耳比。M2, D2, T2 and Q2 are each a molar ratio.

所述透明樹脂的交聯鍵結和固化程度可以藉由包含第一聚矽氧烷和第二聚矽氧烷兩者來控制，所述第一聚矽氧烷在其末端包含與矽鍵結的氫(Si-H)，所述第二聚矽氧烷在其末端包含與矽鍵結的烯基基團(Si-Vi)。The degree of crosslinking bonding and curing of the transparent resin can be controlled by including both a first polyoxyalkylene oxide and a second polyoxyalkylene oxide, the first polyoxyalkylene oxide having a bond with the oxime at its end Hydrogen (Si-H), which contains an oxime-bonded alkenyl group (Si-Vi) at its end.

所述透明樹脂具有約1至1.2的與矽鍵結的氫(Si-H)和與矽鍵結的烯基基團(Si-Vi)的比率(Si-H/Si-Vi)。在所述範圍內，所述與矽鍵結的氫(Si-H)和所述與矽鍵結的烯基基團(Si-Vi)以約1.05至1.15，例如約1.10的比率(Si-H/Si-Vi)存在。The transparent resin has a ratio of 矽-bonded hydrogen (Si-H) and fluorene-bonded alkenyl group (Si-Vi) of about 1 to 1.2 (Si-H/Si-Vi). Within the range, the hydrazine-bonded hydrogen (Si-H) and the hydrazone-bonded alkenyl group (Si-Vi) are at a ratio of about 1.05 to 1.15, for example about 1.10 (Si- H/Si-Vi) exists.

通過以所述範圍內的比率(Si-H/Si-Vi)存在所述與矽鍵結的氫(Si-H)和所述與矽鍵結的烯基基團(Si-Vi)，可以提高固化的透明樹脂的耐熱性和黏性以及保持其透光率。By the presence of the hydrazine-bonded hydrogen (Si-H) and the hydrazone-bonded alkenyl group (Si-Vi) in a ratio within the range (Si-H/Si-Vi) Improve the heat resistance and viscosity of the cured transparent resin and maintain its light transmittance.

例如，包含在所述範圍內的所述與矽鍵結的氫(Si-H)和所述與矽鍵結的烯基基團(Si-Vi)的比率(Si-H/Si-Vi)的透明樹脂在固化後相對於約450 nm的波長可以具有約80%至約100%的透光率，並且即使當在高溫下長時間暴露時，也可以具有小於約15%的透光率下降率(△T)。換句話說，所述透明樹脂確保了耐熱性，因此即使當在高溫下長時間暴露時，其也可以防止因變黃而造成的透光率的顯著劣化。For example, the ratio of the europium-bonded hydrogen (Si-H) and the europium-bonded alkenyl group (Si-Vi) contained in the range (Si-H/Si-Vi) The transparent resin may have a light transmittance of about 80% to about 100% with respect to a wavelength of about 450 nm after curing, and may have a light transmittance of less than about 15% even when exposed for a long time at a high temperature. Rate (△T). In other words, the transparent resin ensures heat resistance, so that even when exposed to a high temperature for a long time, it can prevent significant deterioration of light transmittance due to yellowing.

另外，以限定範圍之比率(Si-H/Si-Vi)包含與矽鍵結之氫(Si-H)和與矽鍵結之烯基基團(Si-Vi)的透明樹脂，在固化後可以具有小於約100 kgf的黏性。所述黏性是指在固化的透明樹脂表面上的黏附程度。當黏性強時，由於在製備通過將透明樹脂固化而提供的封裝材料期間，相鄰的封裝材料相互黏著，所以可能造成加工困難。In addition, a transparent resin containing a ruthenium-bonded hydrogen (Si-H) and a ruthenium-bonded alkenyl group (Si-Vi) in a defined ratio (Si-H/Si-Vi) after curing It may have a viscosity of less than about 100 kgf. The tackiness refers to the degree of adhesion on the surface of the cured transparent resin. When the viscosity is strong, since the adjacent encapsulating materials adhere to each other during preparation of the encapsulating material provided by curing the transparent resin, processing difficulty may be caused.

根據一個實施方式，在包括在末端包含與矽鍵結的烯基基團(Si-Vi)的第二聚矽氧烷和在末端包含與矽鍵結的氫(Si-H)的第一聚矽氧烷的透明樹脂中，證實了藉由將與矽鍵結的氫(Si-H)和與矽鍵結的烯基基團(Si-Vi)的比率(Si-H/Si-Vi)控制在所述範圍內，顯著提高了耐熱性和黏性。According to one embodiment, the first polyfluorene comprising an alkenyl group (Si-Vi) bonded to a fluorene at the end and the first poly comprising a hydrogen (Si-H) bonded to the oxime at the end In the transparent resin of decane, the ratio of hydrogen (Si-H) bonded to hydrazine to the olefin group bonded to hydrazine (Si-Vi) (Si-H/Si-Vi) was confirmed. Control within this range significantly improves heat resistance and viscosity.

所述第一聚矽氧烷可以具有約100 g/mol至約10,000 g/mol，具體地約100 g/mol至約3,000 g/mol的重均分子量。The first polyoxyalkylene oxide may have a weight average molecular weight of from about 100 g/mol to about 10,000 g/mol, specifically from about 100 g/mol to about 3,000 g/mol.

基於透明樹脂的總量，所述第一聚矽氧烷可以以小於約50 wt%，例如以約1 wt%至35 wt%被包括。The first polyoxyalkylene oxide may be included in less than about 50 wt%, such as from about 1 wt% to 35 wt%, based on the total amount of the transparent resin.

所述第二聚矽氧烷具有約1,000 g/mol至約100,000 g/mol，具體地約1,000 g/mol至約20,000 g/mol的重均分子量。The second polyoxyalkylene has a weight average molecular weight of from about 1,000 g/mol to about 100,000 g/mol, specifically from about 1,000 g/mol to about 20,000 g/mol.

基於透明樹脂的總量，所述第二聚矽氧烷可以以大於約50 wt%，例如以約65 wt%至約99 wt%被包括。The second polyoxyalkylene can be included at greater than about 50 wt%, such as from about 65 wt% to about 99 wt%, based on the total amount of the transparent resin.

在所述第一聚矽氧烷和所述第二聚矽氧烷分別在所述重均分子量和所述量的範圍內的情況下，可以控制樹脂的反應性。In the case where the first polyoxyalkylene oxide and the second polyoxyalkylene oxide are respectively in the range of the weight average molecular weight and the amount, the reactivity of the resin can be controlled.

所述透明樹脂還可以包含矽氫化催化劑。所述矽氫化催化劑可以促進第一聚矽氧烷的與矽鍵結的氫(Si-H)部分和第二聚矽氧烷的與矽鍵結的烯基基團(Si-Vi)部分之間的矽氫化反應，並且其可以包括例如鉑、銠、鈀、釕、銥、或它們的組合。The transparent resin may further comprise a ruthenium hydrogenation catalyst. The hydrazine hydrogenation catalyst may promote a hydrazine-bonded hydrogen (Si-H) moiety of the first polyoxyalkylene and a fluorene-bonded alkenyl group (Si-Vi) moiety of the second polyoxyalkylene oxide. An hydrazine hydrogenation reaction, and it may include, for example, platinum, rhodium, palladium, iridium, osmium, or a combination thereof.

基於透明樹脂的總量，所述矽氫化催化劑可以以約0.1 ppm至約1000 ppm的量被包括。The rhodium hydrogenation catalyst may be included in an amount of from about 0.1 ppm to about 1000 ppm based on the total amount of the transparent resin.

所述樹脂還可以包含催化劑抑制劑。基於樹脂的總量，所述催化劑抑制劑可以以約0.001 wt%至約1 wt%的量被包括。The resin may also comprise a catalyst inhibitor. The catalyst inhibitor may be included in an amount of from about 0.001 wt% to about 1 wt%, based on the total amount of the resin.

除了上述成分之外，所述封裝材料還可以包含黏合促進劑(增黏劑)，並且所述黏合促進劑可以包括例如縮水甘油氧基丙基三甲氧基矽烷、乙烯基三乙氧基矽烷、縮水甘油氧基丙基三乙氧基矽烷等。In addition to the above ingredients, the encapsulating material may further comprise a adhesion promoter (tackifier), and the adhesion promoter may include, for example, glycidoxypropyl trimethoxy decane, vinyl triethoxy decane, Glycidoxypropyltriethoxydecane, and the like.

將所述透明樹脂固化以用作電子元件的封裝材料。。例如，所述固化可以通過以下進行：以約0.01 mm至3 mm的厚度將樹脂塗布在基板上，然後，在約100℃至300℃的溫度下對所塗布的樹脂進行熱處理持續約1至10小時。所述電子元件可以包括例如發光二極體、有機發光元件、光致發光元件和太陽能電池，但不限於此。The transparent resin is cured to be used as an encapsulating material for electronic components. . For example, the curing may be performed by coating a resin on a substrate at a thickness of about 0.01 mm to 3 mm, and then heat-treating the coated resin at a temperature of about 100 ° C to 300 ° C for about 1 to 10 hour. The electronic component may include, for example, a light emitting diode, an organic light emitting element, a photoluminescent element, and a solar cell, but is not limited thereto.

利用所述透明樹脂製備的封裝材料當在高溫下長時間暴露時可以防止變黃現象或劣化，且具有高透光率，從而確保了耐熱性並由於低黏性而提高了加工性。The encapsulating material prepared using the transparent resin can prevent yellowing or deterioration when exposed to a high temperature for a long period of time, and has high light transmittance, thereby ensuring heat resistance and improving workability due to low viscosity.

下列實施例更詳細地說明了本發明。然而，它們是本發明的示例性實施方式而不是限制性的。The following examples illustrate the invention in more detail. However, they are exemplary embodiments of the invention and are not limiting.

第一聚矽氧烷的合成Synthesis of the first polyoxyalkylene

以5:5的重量比將水和甲苯混合以製備混合溶劑。將1 kg的混合溶劑置於3頸燒瓶中，並在將燒瓶保持在23℃下的同時，向其中滴加莫耳比為40:60的二苯基二氯矽烷和四甲基二矽氧烷。當完成滴加之後，在50℃下對混合物進行加熱並回流以進行縮聚反應並持續3小時。將所得的反應物質冷卻至室溫，並將其中的水層除去，從而製備了其中聚合物溶於甲苯中的溶液。利用水來清洗聚合物溶液以除去反應副產物氯。然後，在減壓下對中和的聚合物溶液進行蒸餾以除去甲苯，從而製備液體聚矽氧烷。Water and toluene were mixed at a weight ratio of 5:5 to prepare a mixed solvent. 1 kg of the mixed solvent was placed in a 3-necked flask, and while maintaining the flask at 23 ° C, diphenyldichlorodecane and tetramethyldioxane having a molar ratio of 40:60 were added thereto. alkyl. After the completion of the dropwise addition, the mixture was heated and refluxed at 50 ° C to carry out a polycondensation reaction for 3 hours. The resulting reaction mass was cooled to room temperature, and the aqueous layer was removed therefrom to prepare a solution in which the polymer was dissolved in toluene. The polymer solution is washed with water to remove the reaction by-product chlorine. Then, the neutralized polymer solution was distilled under reduced pressure to remove toluene, thereby preparing a liquid polyoxyalkylene.

通過凝膠滲透色譜來測量聚矽氧烷的重均分子量並將折算成聚苯乙烯的分子量計確定為750 g/mol。使用H-NMR、Si-NMR和元素分析儀識別出所述聚矽氧烷具有化學式A的結構。此處，“Me”表示甲基基團，“Ph”表示苯基基團，“Si”表示矽，且“H”表示氫。The weight average molecular weight of the polyoxyalkylene was measured by gel permeation chromatography and the molecular weight converted to polystyrene was determined to be 750 g/mol. The polysiloxane was identified to have the structure of Chemical Formula A using H-NMR, Si-NMR, and an elemental analyzer. Here, "Me" represents a methyl group, "Ph" represents a phenyl group, "Si" represents hydrazine, and "H" represents hydrogen.

[化學式A][Chemical Formula A]

(Me2HSiO1/2)2(Ph2SiO2/2)(Me 2 HSiO 1/2 ) 2 (Ph 2 SiO 2/2 )

第二聚矽氧烷的合成Synthesis of second polyoxyalkylene oxide

將1 kg通過以5:5的重量比混合水和甲苯而製備的混合溶劑置於3頸燒瓶中，然後使其在23℃下靜置。隨後，以27:55:18的莫耳比混合苯基三氯矽烷、苯基甲基二氯矽烷和乙烯基二甲基氯矽烷。在90℃下對混合物進行加熱並回流以進行縮聚反應並持續3小時。將所得的反應物質冷卻至室溫，並將其中的水層除去，從而製備了其中聚合物溶於甲苯中的溶液。利用水來清洗聚合物溶液以除去反應副產物氯。隨後，在減壓下對中和的聚合物溶液進行蒸餾以除去甲苯並獲得液體聚矽氧烷。A mixed solvent prepared by mixing 1 kg of water and toluene in a weight ratio of 5:5 was placed in a 3-necked flask, and then allowed to stand at 23 °C. Subsequently, phenyl trichlorodecane, phenylmethyl dichlorodecane and vinyl dimethyl chlorodecane were mixed at a molar ratio of 27:55:18. The mixture was heated and refluxed at 90 ° C to carry out a polycondensation reaction for 3 hours. The resulting reaction mass was cooled to room temperature, and the aqueous layer was removed therefrom to prepare a solution in which the polymer was dissolved in toluene. The polymer solution is washed with water to remove the reaction by-product chlorine. Subsequently, the neutralized polymer solution was distilled under reduced pressure to remove toluene and obtain a liquid polyoxyalkylene.

通過凝膠滲透色譜來測量獲得的聚矽氧烷的重均分子量並確定為具有2,500 g/mol的折算成聚苯乙烯的分子量。使用H-NMR、Si-NMR和元素分析儀測定出所述聚矽氧烷具有由化學式B表示的結構。此處，“Me”表示甲基基團，“Ph”表示苯基基團；“Vi”表示乙烯基基團，且“Si”表示矽。The weight average molecular weight of the obtained polyoxymethane was measured by gel permeation chromatography and determined to have a molecular weight of 2,500 g/mol converted into polystyrene. The polysiloxane was determined to have a structure represented by Chemical Formula B using H-NMR, Si-NMR, and an elemental analyzer. Here, "Me" represents a methyl group, "Ph" represents a phenyl group; "Vi" represents a vinyl group, and "Si" represents oxime.

[化學式B][Chemical Formula B]

(Me2ViSiO1/2)0.13(PhSiO3/2)0.3(PhMeSiO2/2)0.57 (Me 2 ViSiO 1/2 ) 0.13 (PhSiO 3/2 ) 0.3 (PhMeSiO 2/2 ) 0.57

透明樹脂的製備Preparation of transparent resin 實施例1Example 1

將13.6 wt%的由化學式A表示的第一聚矽氧烷、以及86.4 wt%的由化學式B表示的第二聚矽氧烷混合，並添加作為矽氫化催化劑的PS-CS-2.0CS(由Unicore製造)以提供2 ppm的Pt量。而且，向其中添加0.002 wt%的作為催化劑抑制劑的Surfynol(由TCl製造)。矽-氫鍵(Si-H)和矽-烯基基團鍵(Si-Vi)以約1.00的比率(Si-H/Si-Vi)存在。13.6 wt% of the first polyoxyalkylene represented by the chemical formula A, and 86.4 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS as a hydrogenation catalyst was added (by Unicore manufacture) to provide a Pt amount of 2 ppm. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present at a ratio of about 1.00 (Si-H/Si-Vi).

以1 mm的厚度將混合溶液塗布在基板上，並且在150℃下加熱2小時並固化以提供固化的試樣。The mixed solution was coated on the substrate at a thickness of 1 mm, and heated at 150 ° C for 2 hours and cured to provide a cured sample.

實施例2Example 2

將14.2 wt%的由化學式A表示的第一聚矽氧烷、以及85.8 wt%的由化學式B表示的第二聚矽氧烷混合，並添加PS-CS-2.0CS(由Unicore製造)以提供2 ppm的Pt量。而且，向其中添加0.002 wt%的作為催化劑抑制劑的Surfynol(由TCl製造)。矽-氫鍵(Si-H)和矽-烯基基團鍵(Si-Vi)以約1.05的比率(Si-H/Si-Vi)存在。14.2 wt% of the first polyoxyalkylene represented by the chemical formula A, and 85.8 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present in a ratio of about 1.05 (Si-H/Si-Vi).

以1 mm的厚度將混合溶液塗布在基板上，並且在150℃下加熱2小時並固化以提供固化的試樣。The mixed solution was coated on the substrate at a thickness of 1 mm, and heated at 150 ° C for 2 hours and cured to provide a cured sample.

實施例3Example 3

將14.8 wt%的由化學式A表示的第一聚矽氧烷、以及85.2 wt%的由化學式B表示的第二聚矽氧烷混合，並添加PS-CS-2.0CS(由Unicore製造)以提供2 ppm的Pt量。而且，向其中添加0.002 wt%的作為催化劑抑制劑的Surfynol(由TCl製造)。矽-氫鍵(Si-H)和矽-烯基基團鍵(Si-Vi)以約1.10的比率(Si-H/Si-Vi)存在。14.8 wt% of the first polyoxyalkylene represented by the chemical formula A, and 85.2 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present at a ratio of about 1.10 (Si-H/Si-Vi).

以1 mm的厚度將混合溶液塗布在基板上，並且在150℃下加熱2小時並固化以提供固化的試樣。The mixed solution was coated on the substrate at a thickness of 1 mm, and heated at 150 ° C for 2 hours and cured to provide a cured sample.

實施例4Example 4

將15.3 wt%的由化學式A表示的第一聚矽氧烷、以及84.7 wt%的由化學式B表示的第二聚矽氧烷混合，並添加PS-CS-2.0CS(由Unicore製造)以提供2 ppm的Pt量。而且，向其中添加0.002 wt%的作為催化劑抑制劑的Surfynol(由TCl製造)。矽-氫鍵(Si-H)和矽-烯基基團鍵(Si-Vi)以約1.15的比率(Si-H/Si-Vi)存在。15.3 wt% of the first polyoxyalkylene represented by the chemical formula A, and 84.7 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present in a ratio of about 1.15 (Si-H/Si-Vi).

以1 mm的厚度將混合溶液塗布在基板上，並且在150℃下加熱並固化2小時以提供固化的試樣。The mixed solution was coated on the substrate at a thickness of 1 mm, and heated and cured at 150 ° C for 2 hours to provide a cured sample.

實施例5Example 5

將15.9 wt%的由化學式A表示的第一聚矽氧烷、以及84.1 wt%的由化學式B表示的第二聚矽氧烷混合，並添加PS-CS-2.0CS(由Unicore製造)以提供2 ppm的Pt量。而且，向其中添加0.002 wt%的作為催化劑抑制劑的Surfynol(由TCl製造)。矽-氫鍵(Si-H)和矽-烯基基團鍵(Si-Vi)以約1.20的比率(Si-H/Si-Vi)存在。15.9 wt% of the first polyoxyalkylene represented by the chemical formula A, and 84.1 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present at a ratio of about 1.20 (Si-H/Si-Vi).

以1 mm的厚度將混合溶液塗布在基板上，並且在150℃下加熱並固化2小時以提供固化的試樣。The mixed solution was coated on the substrate at a thickness of 1 mm, and heated and cured at 150 ° C for 2 hours to provide a cured sample.

比較例1Comparative example 1

將11.2 wt%的由化學式A表示的第一聚矽氧烷、以及88.8 wt%的由化學式B表示的第二聚矽氧烷混合，並添加PS-CS-2.0CS(由Unicore製造)以提供2 ppm的Pt量。而且，向其中添加0.002 wt%的作為催化劑抑制劑的Surfynol(由TCl製造)。矽-氫鍵(Si-H)和矽-烯基基團鍵(Si-Vi)以約0.8的比率(Si-H/Si-Vi)存在。11.2 wt% of the first polyoxyalkylene represented by the chemical formula A, and 88.8 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present in a ratio of about 0.8 (Si-H/Si-Vi).

以1 mm的厚度將混合溶液塗布在基板上，並且在150℃下加熱並固化2小時以提供固化的試樣。The mixed solution was coated on the substrate at a thickness of 1 mm, and heated and cured at 150 ° C for 2 hours to provide a cured sample.

比較例2Comparative example 2

將19.1 wt%的由化學式A表示的第一聚矽氧烷、以及80.9 wt%的由化學式B表示的第二聚矽氧烷混合，並添加PS-CS-2.0CS(由Unicore製造)以提供2 ppm的Pt量。而且，向其中添加0.002 wt%的作為催化劑抑制劑的Surfynol(由TCl製造)。矽-氫鍵(Si-H)和矽-烯基基團鍵(Si-Vi)以約15.00的比率(Si-H/Si-Vi)存在。19.1 wt% of the first polyoxyalkylene represented by the chemical formula A, and 80.9 wt% of the second polyoxyalkylene represented by the chemical formula B were mixed, and PS-CS-2.0CS (manufactured by Unicore) was added to provide 2 ppm Pt amount. Further, 0.002 wt% of Surfynol (manufactured by TCl) as a catalyst inhibitor was added thereto. The hydrazine-hydrogen bond (Si-H) and the fluorenyl-alkenyl group bond (Si-Vi) are present in a ratio of about 15.00 (Si-H/Si-Vi).

以1 mm的厚度將混合溶液塗布在基板上，並且在150℃下加熱並固化2小時以提供固化的試樣。The mixed solution was coated on the substrate at a thickness of 1 mm, and heated and cured at 150 ° C for 2 hours to provide a cured sample.

評價-1Evaluation-1

對由實施例1至5以及比較例1和2獲得的各種固化的透明樹脂的初始透光率和耐熱性進行測量。The initial light transmittance and heat resistance of the various cured transparent resins obtained from Examples 1 to 5 and Comparative Examples 1 and 2 were measured.

初始透光率通過使用UV-分光光度計(Shimadzu，UV-3600)，在450 nm的波長中測量所述固化的透明樹脂來確定。The initial light transmittance was determined by measuring the cured transparent resin at a wavelength of 450 nm using a UV-spectrophotometer (Shimadzu, UV-3600).

耐熱性通過將所述固化的透明樹脂在120℃下加熱500小時並根據相同方法測量透光率而確定。The heat resistance was determined by heating the cured transparent resin at 120 ° C for 500 hours and measuring the light transmittance according to the same method.

參考表1對所述結果進行描述。The results are described with reference to Table 1.

Figure TWI612080BD00007
Figure TWI612080BD00007

參考表1，可以證實，根據實施例1至5的透明樹脂在初始透光率與在120℃下加熱500小時之後的透光率之間的透光率差在約15%以內。Referring to Table 1, it was confirmed that the transmittance of the transparent resin according to Examples 1 to 5 between the initial light transmittance and the light transmittance after heating at 120 ° C for 500 hours was within about 15%.

另外，在示例性實施方式中，根據實施例2、3和4的透明樹脂具有約7%以下的優異的透光率下降率；且根據實施例3的透明樹脂具有約1.3%的最優異的透光率下降率。In addition, in an exemplary embodiment, the transparent resins according to Examples 2, 3, and 4 have an excellent light transmittance reduction rate of about 7% or less; and the transparent resin according to Example 3 has the most excellent properties of about 1.3%. Light transmittance reduction rate.

另一方面，在120℃下加熱500小時之後，根據比較例1和2的透明樹脂具有約20%以上的透光率下降率。On the other hand, after heating at 120 ° C for 500 hours, the transparent resins according to Comparative Examples 1 and 2 had a light transmittance lowering ratio of about 20% or more.

根據所述結果可以證實，根據實施例1至5的透明樹脂改善了耐熱性。From the results, it was confirmed that the transparent resins according to Examples 1 to 5 improved the heat resistance.

評價-2Evaluation-2

在更高的溫度條件下，再次對根據實施例1至5以及比較例1和2的固化的透明樹脂的耐熱性進行測量。The heat resistance of the cured transparent resins according to Examples 1 to 5 and Comparative Examples 1 and 2 was measured again under higher temperature conditions.

根據與上述相同的程式對初始透光率進行測量。The initial transmittance was measured according to the same procedure as above.

在180℃下將所述固化的透明樹脂加熱150小時之後，通過根據相同方法測量透光率而確定了耐熱性。After the cured transparent resin was heated at 180 ° C for 150 hours, heat resistance was determined by measuring the light transmittance according to the same method.

參考表2對所述結果進行描述。The results are described with reference to Table 2.

Figure TWI612080BD00008
Figure TWI612080BD00008

參考表2可以證實，根據實施例1至5的透明樹脂在初始透光率與在180℃下加熱150小時之後的透光率之間的透光率差在約15%以內。另外，在示例性實施方式中，根據實施例2、3和4的透明樹脂具有約7%以下的更優異的透光率下降率，且根據實施例3的透明樹脂具有約1.9%的最優異的透光率下降率。Referring to Table 2, it was confirmed that the transmittance of the transparent resin according to Examples 1 to 5 between the initial light transmittance and the light transmittance after heating at 180 ° C for 150 hours was within about 15%. In addition, in the exemplary embodiment, the transparent resins according to Examples 2, 3, and 4 have a more excellent light transmittance reduction rate of about 7% or less, and the transparent resin according to Example 3 has the highest excellentness of about 1.9%. The rate of decrease in light transmittance.

另一方面，在180℃下加熱150小時之後，根據比較例1的透明樹脂具有約23%的透光率下降率。On the other hand, after heating at 180 ° C for 150 hours, the transparent resin according to Comparative Example 1 had a light transmittance reduction rate of about 23%.

根據所述結果可以證實，根據實施例1至5的透明樹脂改善了耐熱性。From the results, it was confirmed that the transparent resins according to Examples 1 to 5 improved the heat resistance.

評價-3Evaluation-3

對根據實施例1至5以及比較例1和2的固化的透明樹脂的黏性進行測量。The tackiness of the cured transparent resins according to Examples 1 to 5 and Comparative Examples 1 and 2 was measured.

黏性通過使用TopTac 2000A對所述固化的透明樹脂施加恒定負荷(載荷)並對除去所述負荷期間的力進行測量而確定。Viscosity was determined by applying a constant load (load) to the cured transparent resin using TopTac 2000A and measuring the force during removal of the load.

細節如下：Details as follow:

-　裝置：TopTac 2000A- Device: TopTac 2000A

-　Zig試驗(Test Zig)：1英寸半球，SS，壓縮載荷300.00 gf- Zig test: 1 inch hemisphere, SS, compression load 300.00 gf

-　試驗速度：目標位移10.00 mm- Test speed: target displacement 10.00 mm

落下0.08 mm/秒Drop 0.08 mm / sec

保持300 gf，10秒Keep 300 gf for 10 seconds

上升0.1 mm/秒Rise by 0.1 mm/sec

參考表3對所述結果進行描述。The results are described with reference to Table 3.

Figure TWI612080BD00009
Figure TWI612080BD00009

參考表3，根據實施例1至5的固化的透明樹脂具有約100 kgf以下的黏性，這是令人滿意的。Referring to Table 3, the cured transparent resin according to Examples 1 to 5 had a viscosity of about 100 kgf or less, which is satisfactory.

另外，在示例性實施方式中，根據實施例2、3和4的透明樹脂具有顯著低的黏性，且根據實施例3的透明樹脂具有約21 kgf的最低黏性。Further, in the exemplary embodiment, the transparent resins according to Examples 2, 3, and 4 have remarkably low viscosity, and the transparent resin according to Example 3 has a minimum viscosity of about 21 kgf.

另一方面，根據比較例1和2的透明樹脂具有高黏性。On the other hand, the transparent resins according to Comparative Examples 1 and 2 have high viscosity.

根據所述結果可以證實，根據實施例1至5的透明樹脂顯著改善了黏性。From the results, it was confirmed that the transparent resins according to Examples 1 to 5 remarkably improved the viscosity.

從這些結果可理解，通過將第一聚矽氧烷和第二聚矽氧烷的矽-氫鍵(Si-H)和矽-烯基基團鍵(Si-Vi)的比率(Si-H/Si-Vi)調節在預定範圍內，顯著改善了耐熱性和黏性。From these results, it is understood that the ratio of the 矽-hydrogen bond (Si-H) and the 矽-alkenyl group bond (Si-Vi) of the first polyoxyalkylene and the second polyoxyalkylene (Si-H) /Si-Vi) The adjustment is markedly improved in heat resistance and viscosity.

雖然已經結合目前被認為是實用的示例性實施方式描述了本發明，但應當理解，本發明並不限於所披露的實施方式，而且，相反，用來涵蓋包括在所附申請專利範圍的精神和範圍內的各種改進和等同安排。Although the present invention has been described in connection with the exemplary embodiments of the present invention, it is understood that the invention is not limited to the disclosed embodiments, and, instead, Various improvements and equivalent arrangements within the scope.

Claims (9)

一種用於封裝材料的透明樹脂，包含：第一聚矽氧烷，在所述第一聚矽氧烷的末端包含與矽鍵結的氫(Si-H)，基於所述透明樹脂的總量，所述第一聚矽氧烷以小於約50wt%但大於0%被包括，第二聚矽氧烷，在所述第二聚矽氧烷的末端包含與矽鍵結的烯基基團(Si-Vi)，基於所述透明樹脂的總量，所述第二聚矽氧烷以大於約50wt%但低於100%被包括，一矽氫化催化劑，及一黏合促進劑，其中，所述與矽鍵結的氫(Si-H)和所述與矽鍵結的烯基基團(Si-Vi)以約1.05至約1.15的比率(Si-H/Si-Vi)存在，且該透明樹脂形成一封裝材料，該封裝材料具有在450nm波長下80%至100%的範圍內的透光率(T)。 A transparent resin for encapsulating material, comprising: a first polyoxyalkylene, comprising hydrogen (Si-H) bonded to ruthenium at the end of the first polyoxyalkylene, based on the total amount of the transparent resin The first polyoxyalkylene is included in less than about 50% by weight but greater than 0%, and the second polyoxyalkylene contains an oxime-bonded alkenyl group at the end of the second polyoxyalkylene ( Si-Vi), based on the total amount of the transparent resin, the second polyoxyalkylene is included in more than about 50% by weight but less than 100%, a hydrogenation catalyst, and an adhesion promoter, wherein The hydrogen (Si-H) bonded to the oxime and the oxime-bonded alkenyl group (Si-Vi) are present at a ratio of about 1.05 to about 1.15 (Si-H/Si-Vi), and the transparency The resin forms an encapsulating material having a light transmittance (T) in the range of 80% to 100% at a wavelength of 450 nm. 如申請專利範圍第1項所述的用於封裝材料的透明樹脂，其中，所述第一聚矽氧烷由以下化學式1表示：[化學式1](R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6SiO3/2)T1(SiO4/2)Q1其中，在化學式1中，R1至R6各自獨立地為氫、取代或未取代的C1至C30烷基、取代或未取代的C3至C30環烷基、取代或未取代的C6至C30芳基、取代或未取代的C7至C30芳烷基、取 代或未取代的C1至C30雜烷基、取代或未取代的C2至C30雜環烷基、取代或未取代的C2至C30炔基、取代或未取代的C1至C30烷氧基、取代或未取代的C1至C30羰基、羥基、或它們的組合，R1至R6中的至少一個包括氫，0<M1<1，0<D1<1，0T1<1，0Q1<1，並且M1+D1+T1+Q1=1。 The transparent resin for encapsulating material according to claim 1, wherein the first polyoxyalkylene is represented by the following Chemical Formula 1: [Chemical Formula 1] (R 1 R 2 R 3 SiO 1/2 ) M1 (R 4 R 5 SiO 2/2 ) D1 (R 6 SiO 3/2 ) T1 (SiO 4/2 ) Q1 wherein, in Chemical Formula 1, R 1 to R 6 are each independently hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 a heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxyl group, or a combination thereof, at least one of R 1 to R 6 includes hydrogen, 0 < M1 < 1, 0 < D1 < 1, 0 T1<1,0 Q1 < 1, and M1 + D1 + T1 + Q1 = 1. 如申請專利範圍第1項所述的用於封裝材料的透明樹脂，其中，所述第二聚矽氧烷由以下化學式2表示：[化學式2](R7R8R9SiO1/2)M2(R10R11SiO2/2)D2(R12SiO3/2)T2(SiO4/2)Q2其中，在化學式2中，R7至R12各自獨立地為取代或未取代的C1至C30烷基、取代或未取代的C3至C30環烷基、取代或未取代的C6至C30芳基、取代或未取代的C7至C30芳烷基、取代或未取代的C1至C30雜烷基、取代或未取代的C2至C30雜環烷基、取代或未取代的C2至C30烯基、取代或未取代的C2至C30炔基、取代或未取代的C1至C30烷氧基、取代或未取代的C1至C30羰基、羥基、或它們的組合，R7至R12中的至少一個包括取代或未取代的C2至C30烯基，0<M2<1，0<D2<1，0<T2<1，0Q2<1，並且 M2+D2+T2+Q2=1。 The transparent resin for encapsulating material according to claim 1, wherein the second polyoxyalkylene is represented by the following Chemical Formula 2: [Chemical Formula 2] (R 7 R 8 R 9 SiO 1/2 ) M2 (R 10 R 11 SiO 2/2 ) D2 (R 12 SiO 3/2 ) T2 (SiO 4/2 ) Q2 wherein, in Chemical Formula 2, R 7 to R 12 are each independently a substituted or unsubstituted C1 To C30 alkyl, substituted or unsubstituted C3 to C30 cycloalkyl, substituted or unsubstituted C6 to C30 aryl, substituted or unsubstituted C7 to C30 aralkyl, substituted or unsubstituted C1 to C30 heteroalkane , substituted or unsubstituted C2 to C30 heterocycloalkyl, substituted or unsubstituted C2 to C30 alkenyl, substituted or unsubstituted C2 to C30 alkynyl, substituted or unsubstituted C1 to C30 alkoxy, substituted Or an unsubstituted C1 to C30 carbonyl group, a hydroxyl group, or a combination thereof, at least one of R 7 to R 12 includes a substituted or unsubstituted C 2 to C 30 alkenyl group, 0 < M 2 < 1, 0 < D 2 < 1, 0 <T2<1,0 Q2<1, and M2+D2+T2+Q2=1. 一種封裝材料，其係藉由固化如申請專利範圍第1項所述的用於封裝材料的透明樹脂而製備者。 An encapsulating material prepared by curing a transparent resin for encapsulating materials as described in claim 1 of the patent application. 如申請專利範圍第4項所述的封裝材料，其中，在約120℃下加熱約500小時之後，透光率下降率(△T)小於約15%。 The encapsulating material according to claim 4, wherein the light transmittance reduction rate (ΔT) is less than about 15% after heating at about 120 ° C for about 500 hours. 如申請專利範圍第4項所述的封裝材料，其中，在約180℃下加熱約150小時之後，透光率下降率(△T)小於約15%。 The encapsulating material of claim 4, wherein the light transmittance reduction rate (ΔT) is less than about 15% after heating at about 180 ° C for about 150 hours. 如申請專利範圍第4項所述的封裝材料，所述封裝材料具有小於約100kgf的黏性。 The encapsulating material of claim 4, wherein the encapsulating material has a viscosity of less than about 100 kgf. 一種電子元件，其包括如申請專利範圍第4項所述的封裝材料。 An electronic component comprising the encapsulating material as described in claim 4 of the patent application. 如申請專利範圍第8項所述的電子元件，所述電子元件包括發光二極體、有機發光元件、光致發光元件和太陽能電池。The electronic component according to claim 8, wherein the electronic component comprises a light emitting diode, an organic light emitting element, a photoluminescent element, and a solar cell.
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