TWI609440B

TWI609440B - Chip inspection device

Info

Publication number: TWI609440B
Application number: TW106117328A
Authority: TW
Inventors: 曾聖為; 邱文忠
Original assignee: 力成科技股份有限公司
Priority date: 2017-05-25
Filing date: 2017-05-25
Publication date: 2017-12-21
Also published as: TW201901826A

Description

晶片檢驗裝置Wafer inspection device

本發明關於一種晶片檢驗裝置，尤指一種可有效檢驗晶片是否擺放正常之晶片檢驗裝置。The present invention relates to a wafer inspection apparatus, and more particularly to a wafer inspection apparatus which can effectively check whether a wafer is placed normally.

在晶片生產製造的過程中，通常會將晶片擺放於晶片承載盤中來進行運送。晶片承載盤具有複數個用來容置晶片之承載格。一般而言，晶片係密集地排列於晶片承載盤中。當晶片於晶片承載格中的擺放方式發生異常時（例如，疊料及/或反向），便會影響晶片的生產製造。目前，檢驗人員係以肉眼檢驗晶片是否擺放正常。然而，以肉眼檢驗的方式並不容易檢驗出所有擺放異常的晶片。因此，如何有效檢驗晶片是否擺放正常，便成為晶片生產製造上的一大課題。During wafer fabrication, wafers are typically placed in a wafer carrier for shipping. The wafer carrier has a plurality of carriers for receiving the wafers. In general, the wafers are densely arranged in the wafer carrier. When the placement of the wafer in the wafer carrier is abnormal (for example, stacking and/or reversing), the wafer fabrication is affected. At present, the inspector visually inspects whether the wafer is placed properly. However, it is not easy to visually inspect all the wafers that are placed abnormally by visual inspection. Therefore, how to effectively check whether the wafer is placed properly is a major issue in wafer manufacturing.

本發明提供一種可有效檢驗晶片是否擺放正常之晶片檢驗裝置，以解決上述問題。The present invention provides a wafer inspection apparatus that can effectively check whether a wafer is placed properly to solve the above problems.

根據一實施例，本發明之晶片檢驗裝置包含一架體以及複數個檢驗模組。架體設置於一晶片承載盤上。晶片承載盤具有複數個承載格。架體具有複數個檢驗格。每一個檢驗格對應承載格的其中之一。每一個檢驗模組設置於檢驗格的其中之一中。檢驗模組包含一支架、一移動件以及一提示件。移動件與提示件設置於支架上。當一晶片容置於承載格中時，移動件與晶片之間存在一間隙。當至少二晶片容置於承載格中時，至少二晶片推動移動件，使得提示件顯示一提示。According to an embodiment, the wafer inspection apparatus of the present invention comprises a frame and a plurality of inspection modules. The frame body is disposed on a wafer carrier tray. The wafer carrier tray has a plurality of carrier cells. The frame has a plurality of test cells. Each check box corresponds to one of the bearing grids. Each inspection module is placed in one of the inspection cells. The inspection module includes a bracket, a moving member and a reminder. The moving piece and the prompting piece are disposed on the bracket. When a wafer is received in the carrier, there is a gap between the moving member and the wafer. When at least two wafers are received in the carrier, at least two wafers push the moving member such that the prompt displays a prompt.

綜上所述，欲檢驗晶片是否擺放正常時，可將本發明之晶片檢驗裝置之架體設置於晶片承載盤上。當只有一個晶片容置於承載格中時，移動件與晶片之間存在間隙。此時，提示件不會顯示提示，表示承載格中的晶片沒有重疊。當有至少二晶片容置於承載格中時，由於晶片的垂直高度較高，因此，晶片會推動移動件，使得提示件顯示提示（例如，顏色片之顏色、光線、聲音等）。當提示件顯示提示時，即可判定承載格中的晶片發生重疊。In summary, when the wafer is to be inspected for normality, the frame of the wafer inspection apparatus of the present invention can be placed on the wafer carrier. When only one wafer is housed in the carrier, there is a gap between the moving member and the wafer. At this point, the prompt does not display a prompt indicating that the wafers in the carrier do not overlap. When at least two wafers are accommodated in the carrier, since the vertical height of the wafer is high, the wafer will push the moving member so that the prompt displays a prompt (for example, color, light, sound, etc.). When the prompt displays a prompt, it can be determined that the wafers in the carrier overlap.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

請參閱第1圖以及第2圖，第1圖為根據本發明一實施例之晶片檢驗裝置1的俯視圖，第2圖為第1圖中的晶片檢驗裝置1設置於晶片承載盤3上的局部剖面圖。Referring to FIG. 1 and FIG. 2, FIG. 1 is a plan view of a wafer inspection apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a partial portion of the wafer inspection apparatus 1 disposed on the wafer carrier 3 in FIG. Sectional view.

如第1圖與第2圖所示，晶片檢驗裝置1包含一架體10以及複數個檢驗模組12。架體10設置於一晶片承載盤3上。於此實施例中，晶片承載盤3具有複數個承載格30，且架體10具有複數個檢驗格100，其中每一個檢驗格100對應承載格30的其中之一。As shown in FIGS. 1 and 2, the wafer inspection apparatus 1 includes a frame 10 and a plurality of inspection modules 12. The frame body 10 is disposed on a wafer carrier tray 3. In this embodiment, the wafer carrier disk 3 has a plurality of carrier cells 30, and the frame body 10 has a plurality of test cells 100, wherein each of the test cells 100 corresponds to one of the carrier cells 30.

每一個檢驗模組12設置於檢驗格100的其中之一中。於此實施例中，檢驗模組12包含一支架120、一移動件122、一提示件124、一遮擋件126以及一彈性件128。移動件122與提示件124設置於支架120上。遮擋件126與彈性件128設置於移動件122上，其中遮擋件126與彈性件128分別位於支架120的相對二側。於此實施例中，支架120可為十字形，但不以此為限。移動件122可具有螺紋，使得移動件122可透過螺紋在支架120中轉動且上下移動。於此實施例中，提示件124可為一顏色片，其中顏色片之顏色可根據實際應用而決定。遮擋件126可為一不透明塑膠片。遮擋件126可隨著移動件122的轉動而遮擋提示件124或使提示件124暴露出來。Each inspection module 12 is disposed in one of the test cells 100. In this embodiment, the inspection module 12 includes a bracket 120, a moving member 122, a prompting member 124, a shielding member 126, and an elastic member 128. The moving member 122 and the prompting member 124 are disposed on the bracket 120. The shielding member 126 and the elastic member 128 are disposed on the moving member 122, wherein the shielding member 126 and the elastic member 128 are respectively located on opposite sides of the bracket 120. In this embodiment, the bracket 120 may be a cross shape, but is not limited thereto. The moving member 122 can have a thread such that the moving member 122 can be rotated in the bracket 120 through the thread and moved up and down. In this embodiment, the prompt 124 can be a color piece, wherein the color of the color piece can be determined according to the actual application. The shutter 126 can be an opaque plastic sheet. The shutter 126 can block the prompt member 124 or expose the prompt member 124 as the moving member 122 rotates.

如第2圖之左半部所示，當一晶片5容置於晶片承載盤3之承載格30中時，移動件122上的彈性件128與晶片5之間存在一間隙G。此時，遮擋件126遮擋提示件124。由於提示件124之顏色隱藏於遮擋件126下方，不會顯示出來，因此，表示承載格30中的晶片5沒有重疊。As shown in the left half of Fig. 2, when a wafer 5 is received in the carrier 30 of the wafer carrier 3, a gap G exists between the elastic member 128 on the moving member 122 and the wafer 5. At this time, the shutter 126 blocks the prompting member 124. Since the color of the cue 124 is hidden under the visor 126, it is not displayed, and therefore, the wafers 5 in the carrier 30 are not overlapped.

如第2圖之右半部所示，當至少二晶片5容置於晶片承載盤3之承載格30中時，至少二晶片5會推動移動件122，使得提示件124顯示一提示（亦即，提示件124之顏色）。進一步來說，當二晶片5相互重疊而容置於晶片承載盤3之承載格30中時，由於重疊的二晶片5的垂直高度較高，因此，重疊的二晶片5會推動移動件122轉動且朝遠離承載格30的方向移動。同時，移動件122會帶動遮擋件126遠離提示件124，亦即，遮擋件126會隨著移動件122的轉動而使提示件124之顏色暴露出來而作為上述之提示。因此，當提示件124之顏色暴露出來時，即可判定承載格30中的晶片5發生重疊。As shown in the right half of FIG. 2, when at least two wafers 5 are received in the carrier 30 of the wafer carrier 3, at least two wafers 5 will push the moving member 122, so that the prompt 124 displays a prompt (ie, , the color of the prompt 124). Further, when the two wafers 5 overlap each other and are accommodated in the carrier 30 of the wafer carrier 3, since the vertical heights of the overlapped two wafers 5 are high, the overlapping two wafers 5 will push the moving member 122 to rotate. And moving away from the carrier 30. At the same time, the moving member 122 will drive the shielding member 126 away from the prompting member 124, that is, the shielding member 126 will expose the color of the prompting member 124 as the moving member 122 rotates. Therefore, when the color of the prompt member 124 is exposed, it can be determined that the wafers 5 in the carrier 30 overlap.

當承載格30中的晶片5發生重疊時，本發明係利用設置於移動件122上的彈性件128與晶片5接觸，以避免刮傷晶片5。於此實施例中，彈性件128可為橡膠塊或其它彈性體。When the wafers 5 in the carrier 30 are overlapped, the present invention contacts the wafer 5 with the elastic members 128 disposed on the moving member 122 to avoid scratching the wafer 5. In this embodiment, the elastic member 128 can be a rubber block or other elastomer.

請參閱第3圖，第3圖為根據本發明另一實施例之晶片檢驗裝置1'設置於晶片承載盤3上的局部剖面圖。晶片檢驗裝置1'與上述之晶片檢驗裝置1的主要不同之處在於，晶片檢驗裝置1'之檢驗模組12'另包含一開關130。如第3圖所示，開關130設置於支架120上且電性連接提示件124。於此實施例中，提示件124可為一光源或一揚聲器。此外，晶片檢驗裝置1'不需設置上述之遮擋件126。再者，移動件122可不具有螺紋。Referring to FIG. 3, FIG. 3 is a partial cross-sectional view showing the wafer inspection apparatus 1' disposed on the wafer carrier 3 in accordance with another embodiment of the present invention. The wafer inspection apparatus 1' is mainly different from the wafer inspection apparatus 1 described above in that the inspection module 12' of the wafer inspection apparatus 1' further includes a switch 130. As shown in FIG. 3, the switch 130 is disposed on the bracket 120 and electrically connected to the prompt 124. In this embodiment, the prompt 124 can be a light source or a speaker. Further, the wafer inspection apparatus 1' does not need to provide the above-described shutter 126. Furthermore, the moving member 122 may have no threads.

如第3圖之右半部所示，當至少二晶片5容置於晶片承載盤3之承載格30中時，至少二晶片5會推動移動件122朝遠離承載格30的方向移動。接著，移動件122即會觸發開關130，使得提示件124發出一光線或一聲音而作為上述之提示。因此，當提示件124發出光線或聲音時，即可判定承載格30中的晶片5發生重疊。反之，當提示件124未發出光線或聲音時，表示承載格30中的晶片5沒有重疊。As shown in the right half of Figure 3, when at least two wafers 5 are received in the carrier 30 of the wafer carrier 3, at least two wafers 5 will urge the moving member 122 to move away from the carrier 30. Then, the moving member 122 triggers the switch 130, so that the prompting member 124 emits a light or a sound as the above prompt. Therefore, when the prompting member 124 emits light or sound, it can be determined that the wafers 5 in the carrier 30 overlap. On the other hand, when the prompting member 124 does not emit light or sound, it means that the wafers 5 in the carrier 30 do not overlap.

請參閱第4圖以及第5圖，第4圖為複數個晶片5容置於晶片承載盤3中的俯視圖，第5圖為根據本發明另一實施例之晶片檢驗裝置1''設置於第4圖中的晶片承載盤3上的俯視圖。Referring to FIG. 4 and FIG. 5, FIG. 4 is a plan view of a plurality of wafers 5 housed in the wafer carrier 3, and FIG. 5 is a diagram showing a wafer inspection apparatus 1'' according to another embodiment of the present invention. 4 is a top view of the wafer carrier tray 3 in the drawing.

如第4圖所示，每一個晶片5具有一標記50。於此實施例中，標記50可為雷射蓋印點。由於晶片5係密集地排列於晶片承載盤3中，因此，不容易辨識每一個晶片5的擺放方向是否正確。如第5圖所示，晶片檢驗裝置1''之架體10之檢驗格100具有至少一遮擋部102以及一鏤空部104。當晶片檢驗裝置1''設置於第4圖中的晶片承載盤3上時，晶片5之標記50即會被遮擋部102遮擋或自鏤空部104暴露出來。於此實施例中，假設晶片5之標記50被遮擋部102遮擋時，表示晶片5的擺放方向正確，且晶片5之標記50自鏤空部104暴露出來時，表示晶片5的擺放方向錯誤。因此，檢驗人員可根據晶片5之標記50是否自鏤空部104暴露出來，輕易地辨識是否有擺放方向錯誤的晶片5。如第5圖所示，有兩個晶片5之標記50自鏤空部104暴露出來，因此，有兩個晶片5的擺放方向錯誤。As shown in Fig. 4, each wafer 5 has a mark 50. In this embodiment, the indicia 50 can be a laser stamping point. Since the wafers 5 are densely arranged in the wafer carrier 3, it is not easy to recognize whether or not the orientation of each of the wafers 5 is correct. As shown in FIG. 5, the test grid 100 of the frame 10 of the wafer inspection apparatus 1'' has at least one shielding portion 102 and a hollow portion 104. When the wafer inspection apparatus 1'' is disposed on the wafer carrier 3 in FIG. 4, the mark 50 of the wafer 5 is blocked by the shutter 102 or exposed from the hollow portion 104. In this embodiment, it is assumed that when the mark 50 of the wafer 5 is blocked by the shielding portion 102, indicating that the wafer 5 is placed in the correct direction, and the mark 50 of the wafer 5 is exposed from the hollow portion 104, it indicates that the wafer 5 is placed in the wrong direction. . Therefore, the inspector can easily recognize whether or not the wafer 5 having the wrong orientation is present, depending on whether or not the mark 50 of the wafer 5 is exposed from the hollow portion 104. As shown in Fig. 5, the marks 50 of the two wafers 5 are exposed from the hollow portion 104, and therefore, the orientation of the two wafers 5 is incorrect.

綜上所述，欲檢驗晶片是否擺放正常時，可將本發明之晶片檢驗裝置之架體設置於晶片承載盤上。當只有一個晶片容置於承載格中時，移動件與晶片之間存在間隙。此時，提示件不會顯示提示，表示承載格中的晶片沒有重疊。當有至少二晶片容置於承載格中時，由於晶片的垂直高度較高，因此，晶片會推動移動件，使得提示件顯示提示（例如，顏色片之顏色、光線、聲音等）。當提示件顯示提示時，即可判定承載格中的晶片發生重疊。此外，本發明可利用檢驗格之遮擋部與鏤空部來辨識是否有擺放方向錯誤的晶片。以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。In summary, when the wafer is to be inspected for normality, the frame of the wafer inspection apparatus of the present invention can be placed on the wafer carrier. When only one wafer is housed in the carrier, there is a gap between the moving member and the wafer. At this point, the prompt does not display a prompt indicating that the wafers in the carrier do not overlap. When at least two wafers are accommodated in the carrier, since the vertical height of the wafer is high, the wafer will push the moving member so that the prompt displays a prompt (for example, color, light, sound, etc.). When the prompt displays a prompt, it can be determined that the wafers in the carrier overlap. In addition, the present invention can utilize the shielding portion and the hollow portion of the inspection grid to identify whether there is a wafer in the wrong orientation. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1、1'、1''‧‧‧晶片檢驗裝置
3‧‧‧晶片承載盤
5‧‧‧晶片
10‧‧‧架體
12、12'‧‧‧檢驗模組
30‧‧‧承載格
50‧‧‧標記
100‧‧‧檢驗格
102‧‧‧遮擋部
104‧‧‧鏤空部
120‧‧‧支架
122‧‧‧移動件
124‧‧‧提示件
126‧‧‧遮擋件
128‧‧‧彈性件
130‧‧‧開關
G‧‧‧間隙1, 1', 1''‧‧‧ wafer inspection device
3‧‧‧ wafer carrier
5‧‧‧chip
10‧‧‧ ‧ body
12, 12'‧‧‧ inspection module
30‧‧‧ Carrying grid
50‧‧‧ mark
100‧‧‧ test grid
102‧‧‧ occlusion
104‧‧‧镂空部
120‧‧‧ bracket
122‧‧‧Mobile parts
124‧‧‧Reminder
126‧‧‧ Shield
128‧‧‧Flexible parts
130‧‧‧ switch
G‧‧‧ gap

第1圖為根據本發明一實施例之晶片檢驗裝置的俯視圖。第2圖為第1圖中的晶片檢驗裝置設置於晶片承載盤上的局部剖面圖。第3圖為根據本發明另一實施例之晶片檢驗裝置設置於晶片承載盤上的局部剖面圖。第4圖為複數個晶片容置於晶片承載盤中的俯視圖。第5圖為根據本發明另一實施例之晶片檢驗裝置設置於第4圖中的晶片承載盤上的俯視圖。1 is a plan view of a wafer inspection apparatus in accordance with an embodiment of the present invention. Fig. 2 is a partial cross-sectional view showing the wafer inspection apparatus of Fig. 1 disposed on a wafer carrier. Figure 3 is a partial cross-sectional view showing a wafer inspection apparatus disposed on a wafer carrier in accordance with another embodiment of the present invention. Figure 4 is a top plan view of a plurality of wafers housed in a wafer carrier. Fig. 5 is a plan view showing a wafer inspection apparatus according to another embodiment of the present invention, which is disposed on the wafer carrier tray of Fig. 4.

1‧‧‧晶片檢驗裝置 1‧‧‧ wafer inspection device

3‧‧‧晶片承載盤 3‧‧‧ wafer carrier

5‧‧‧晶片 5‧‧‧chip

10‧‧‧架體 10‧‧‧ ‧ body

12‧‧‧檢驗模組 12‧‧‧Test module

30‧‧‧承載格 30‧‧‧ Carrying grid

100‧‧‧檢驗格 100‧‧‧ test grid

120‧‧‧支架 120‧‧‧ bracket

122‧‧‧移動件 122‧‧‧Mobile parts

124‧‧‧提示件 124‧‧‧Reminder

126‧‧‧遮擋件 126‧‧‧ Shield

128‧‧‧彈性件 128‧‧‧Flexible parts

G‧‧‧間隙 G‧‧‧ gap

Claims

一種晶片檢驗裝置，包含：一架體，設置於一晶片承載盤上，該晶片承載盤具有複數個承載格，該架體具有複數個檢驗格，每一該檢驗格對應該等承載格的其中之一；以及複數個檢驗模組，每一該檢驗模組設置於該等檢驗格的其中之一中，該檢驗模組包含一支架、一移動件以及一提示件，該移動件與該提示件設置於該支架上；其中，當一晶片容置於該承載格中時，該移動件與該晶片之間存在一間隙；當至少二晶片容置於該承載格中時，該至少二晶片推動該移動件，使得該提示件顯示一提示。A wafer inspection apparatus comprising: a frame disposed on a wafer carrier disk, the wafer carrier disk having a plurality of carrier cells, the frame body having a plurality of test cells, each of the test cells corresponding to a carrier And a plurality of inspection modules, each of the inspection modules being disposed in one of the inspection cells, the inspection module comprising a bracket, a moving component and a prompting component, the moving component and the prompting The device is disposed on the bracket; wherein, when a wafer is received in the carrier, a gap exists between the moving member and the wafer; and when at least two wafers are received in the carrier, the at least two wafers Pushing the moving member causes the prompt to display a prompt.

如請求項1所述之晶片檢驗裝置，其中該檢驗模組另包含一遮擋件，該遮擋件設置於該移動件上，該提示件為一顏色片；當該晶片容置於該承載格中時，該遮擋件遮擋該提示件；當該至少二晶片容置於該承載格中時，該至少二晶片推動該移動件轉動且朝遠離該承載格的方向移動，且該移動件帶動該遮擋件遠離該提示件，使得該提示件之一顏色暴露出來而作為該提示。The wafer inspection device of claim 1, wherein the inspection module further comprises a shielding member, the shielding member is disposed on the moving member, the prompting member is a color piece; and when the wafer is received in the carrier The shielding member blocks the prompting member; when the at least two wafers are received in the carrier, the at least two wafers push the moving member to rotate and move away from the carrier, and the moving member drives the shielding The piece is away from the prompting member such that one of the prompting members is exposed in color as the prompt.

如請求項1所述之晶片檢驗裝置，其中該檢驗模組另包含一開關，該開關設置於該支架上且電性連接該提示件，該提示件為一光源；當該至少二晶片容置於該承載格中時，該至少二晶片推動該移動件朝遠離該承載格的方向移動，且該移動件觸發該開關，使得該提示件發出一光線而作為該提示。The wafer inspection device of claim 1, wherein the inspection module further comprises a switch, the switch is disposed on the bracket and electrically connected to the prompting member, the prompting member is a light source; and when the at least two wafers are received In the carrier, the at least two wafers push the moving member to move away from the carrier, and the moving member triggers the switch, so that the prompt emits a light as the prompt.

如請求項1所述之晶片檢驗裝置，其中該檢驗模組另包含一開關，該開關設置於該支架上且電性連接該提示件，該提示件為一揚聲器；當該至少二晶片容置於該承載格中時，該至少二晶片推動該移動件朝遠離該承載格的方向移動，且該移動件觸發該開關，使得該提示件發出一聲音而作為該提示。The wafer inspection device of claim 1, wherein the inspection module further comprises a switch, the switch is disposed on the bracket and electrically connected to the prompting member, the prompting member is a speaker; when the at least two wafers are received In the carrier, the at least two wafers push the moving member to move away from the carrier, and the moving member triggers the switch, so that the prompt emits a sound as the prompt.

如請求項1所述之晶片檢驗裝置，其中該檢驗模組另包含一彈性件，該彈性件設置於該移動件上。The wafer inspection device of claim 1, wherein the inspection module further comprises an elastic member, the elastic member being disposed on the moving member.

如請求項1所述之晶片檢驗裝置，其中該檢驗格具有至少一遮擋部以及一鏤空部，該晶片具有一標記；當該晶片容置於該承載格中時，該標記被該遮擋部遮擋或自該鏤空部暴露出來。The wafer inspection device of claim 1, wherein the inspection cell has at least one shielding portion and a hollow portion, the wafer having a mark; when the wafer is received in the carrier, the mark is blocked by the shielding portion Or exposed from the hollow.