201224390 六、發明說明： 【發明所屬之技術領域】 本發明係提供_齡取放器每:欠將電子元件置人測試裝置之 ^時知職裝置歧否具有錢，讀即時排除異常 【先前技術】 於另元以移料裝置將電子元件移載置入 用會使電子元件受損’故必須設置檢知機構， 而加以排除異常；以電子元件檢測機為例，該 元件移載置二測座係=移料裝置將待測之電子 元件與測試套ί之異’且該異物亦會影響電子 試品質不佳雜i ZfL /發生奸树損神增加及測 用以檢知測試套朗是;制試裝置處設有檢知機構， 賴^機進彳==_物，如發現異常情形，則立即控 裝置2及Si 台上設有測試裝置1、載送 測試電路板1 1，用以式巧置^係設有一具測試套座1 2之 置1之兩側分別設有人料裁^件’該载达裝置2係於測試裝 測/完測之電子元件，該移出料載台2 2，用以載送待 二可作X- Z轴向位移3係於測試裝置1之上方設有 -、二移料具3丄、f 1及第二移料具3 2，第 動機構3 3、3 4，使第—1C取H3 5、3 6之浮 36於測試裝置i與載縣—移J4'31、32之取放器3 5、 裝置3係於測試套以工2 二移載電子元件，其中，該移料 構係具有-C C D 3 7 (雪固設—檢知機構，該檢知機 内部；於初始執行峨作^^ ^她】以取像測試套座1 2之 衫重新開機時，移料裝置3之第-辱 3 201224390 $具31及第二移料具3 2係分別位移至载送裝置2之入料載台 21及出料載台2 2上方，以供c C D 3 7取像測試套座1^之 内巧，並將取像資料傳輸至中央控制單元（圖未示出），由中 制早7L判酬試套座！ 2内衫具有異物，若姻測試套座^ ，並無異物’第-移料具3 1之取放n 3 5再將制之電子元件 移載置人於測試套座1 2㈣執行測試健，反之，若判別 j套座1 2内具有異物’射控制機终機進行異倾除， 由CD 3 7係1D設於機架上’工作人員欲以c CD 3 7 =查測試套座1 2岐否具有異物時，即必須先控_、 ;斗具31、3 2先離開測試套座12之上方，方可使c c d ? 7 取像，待CCD 37取像後，再控制第―、二移料具3卜 3測之電子元件4移載置人於職套座i 2内，以致檢知 費時間，工作人員亦基於此-因素，僅於初始執行測气作 業或，開機時，方才以c c D 3 7進行檢知測試套座丄= ^具有異物之作業，但檢職於檢測作#雜巾， 有電子元件等異物’工作人該無法立即得:^ 降低檢測品質，實有待加以改善。 又相以及 因此’如何辦卜種可即時檢知測試套座岐否具有201224390 VI. Description of the invention: [Technical field to which the invention pertains] The present invention provides an _ age pick-and-place device for each: owing an electronic component to a test device; 】 In the other element, the electronic component is transferred by the transfer device, which will damage the electronic component. Therefore, the detection mechanism must be set to eliminate the abnormality; for example, the electronic component inspection machine is used to move the component. The pedestal = the transfer device will measure the electronic component to be tested and the test set ί" and the foreign object will also affect the quality of the electronic test. Miscellaneous i ZfL / increase in the incidence of the tree and the test to detect the test set is There is a detection mechanism at the test equipment, and the machine is equipped with a ==_ object. If an abnormal situation is found, the test device 2 and the Si table are provided with a test device 1, and the test circuit board 1 is carried. The type of the test set is provided with a test set. The two sides of the set are respectively provided with a human cutting piece. The carrying device 2 is a test component for measuring/finishing the electronic component. 2 2, for carrying the two to be X-Z axial displacement 3 is on the test device 1 The square is provided with -, the second moving material 3 丄, the f 1 and the second moving material 3 2, the first moving mechanism 3 3, 3 4, so that the first -1C takes the H3 5, 3 6 floating 36 in the test device i and Carrying the county-shifting J4'31, 32 pick-and-place device 3 5, device 3 is in the test set to work 2 2 transfer electronic components, wherein the moving material system has -CCD 3 7 (snow fixing - detection Institution, the inside of the inspection machine; in the initial execution of the work ^ ^ ^ her] to take the test test socket 1 2 shirt re-boot, the third shift of the transfer device 3 201224390 $ with 31 and the second transfer The 3 2 series are respectively displaced to the loading stage 21 and the discharging stage 2 2 of the carrying device 2 for the c CD 3 7 image bearing test set 1 and the image data is transmitted to The central control unit (not shown), the 7L early compensation test set! 2 inner shirt has foreign objects, if the marriage test set ^, there is no foreign matter 'the first shifting material 3 1 pick and place n 3 5 The electronic components are then placed in the test socket 1 2 (4) to perform the test, and vice versa, if the j-seat 1 2 has a foreign object 'the control plane terminal to perform the special dumping, the CD 3 7 series 1D Set on the rack 'workers want to c CD 3 7 = Check the test socket 1 2岐 If there is a foreign object, you must first control _,; the buckets 31, 3 2 leave the test cover 12 first, so that the ccd 7 can be taken, after the CCD 37 is taken , and then control the electronic components 4 of the first and second shifting tools 3 and 3 to be placed in the seat i 2, so that the inspection time is incurred, and the staff also performs the gas measurement based on this factor. At the time of operation or booting, the test suite is tested with cc D 3 7 = ^ has a foreign object operation, but the inspection is done as #杂巾, there are foreign objects such as electronic components, and the worker cannot get it immediately: ^ Reducing the quality of testing needs to be improved. And so, and how to do it, you can immediately check if the test kit has
Si除降低電子元件損壞率及提升檢測品質之^時檢 知裝置，即為業者研發之標的。 7饱 【發明内容】 本發明之目的一 ’係提供—種電子元件移料裝置之 =冓孩該移料裝置係設於—機台上，並具有至少—機: =移，移料具’移料具之下方則裝配有具取放器之浮 二中兮f?料裝置係於移料具與浮動機構間設有-即時檢知機 時檢知機構係於移料具上設有感測器，於浮動 料具帶動補機構之取放器將電子元件置人測試裝置之^g 201224390 測件S高時器感測位於浮動機構上之被或 可，，常，達否具有異物，Ξ 機構’ ί:月：二構：口::巧料裝置之即時檢知 ί構於測試裝置處下屢到異物而反向回|!^，件，當浮動 j高j严，而可於檢__中二峨感測件 機構本構：二置之即時檢知 =應感測器之位置設有被n 機機構上 形成一檢知區，若測試裝置之頂 冓下方之區域 之取邮下_峨置i頂_ 5面即會下壓到異物，並帶動被感測件反向構之 感測器感測稿測件的高度變化，以即時;^j ’使 =有異物’進而可擴大檢知範圍，達到提升檢 【實施方式】 實施；配:1==明作更進-步之瞭解’兹舉-較佳 請參閱第2、3、4圖，該移料裝置5係設於―機么 /、有至少一由驅動機構5 i驅動位移之移料具5 2，誃二、’ $為-L型架體或面板，並可作至少—軸向位移，^於移^ 2之下方設有浮動機構，該移料具5 2可直接於底面裂配洋ς ，構’亦或於底面裝配有至少一連結板5 2丄，並於連^板 1之下方裝配浮動機構，於本實施例中，該移料具5 2 一 型架體，並於底面裝配二連結板5 2丄，各連結板5 ^ 則裝配有浮動機構，該浮動機構可為轴承式浮動機構或膜片式严 201224390 動機構，於本實施例中，該移料具 有壓力源通氣口 5 2 2，並“;=各，板5 2 1係開設 膜片式浮動機構係於移料且西己有—臈片式浮動機構，該 有-頂面具通孔5 3 1之j匕壓f原，口 5 2 2下方裝設 之連結板521間設有-膜片54 2本體53與移料具52 間形成-密閉之氣室5 片5 4與連結板5 2 i 孔5 3 1，另於本體5 3之内部裳 3之通 垂直向保持器5 5内設有可遠⑽持為5 5，並於 而連接塊5 7之内部則設有水平向=之=立柱5 6 1， 之下方鎖固底板5 9，用以限位水平向例於7 保持器5 8之下方鎖固一速处成只^^保待11。5 8，另於水平向 作動塊5 6回位柱5 6 座6 0係於相對應 並使珠體6 0 2嵌置於=⑹工二珠體6〇2， 0之底面則設有至少—為吸頭之^^槽’而連結座6 件，其中，該浮動機構與移料且 ° =以取放電子元 购件，該感======器 於本實施例中，係於移料具5具5 2上’ 6 2，供分職配—咸_ 板5 2 1上設有二固定件 或雷射感測器等，另感測器6 3可為近接感測器 «測件6 4於相對應感測器6 3之位置設有 相對應感測器6 3之:：有，動機構之連結座6 0外部 被感測件6 4與』3d:為j板之被感測件6 4，並使 構之連結座6 j 適當檢測距離，進而使浮動機 於檢^範^之得即時檢知機構可檢知位 元件:測:u他!明之移料裝置5可應用於電子。 中’本發明移料ΐ具有異物’於本實施例 η裝置5係應用於電子元件檢測機，該檢測機係於… f C r 6 201224390 機台7上配置有測試裝置8、輸送裝置9及移料裝置^= : 4、 裝置8係設有一具測試套座8 2之測試電路板8 i，該 9係於測試裝置8之兩侧分別設有至少一載台g 1、^刑达衷置 載送待測/完測之電子元件，該移料裝置5 i於測m3f 方設有二驅動機構51、5 ΙΑ，用以分別帶動移料之當 2 A、具取放器61、61Α之浮動機構及即時檢知& Z軸向位移，使各取放器6 1、6 1 A可於測試套座 台9 i : 9 2間，待測/完測之電子元件，並以即^= 檢知測§式裝置8處疋否具有異物，由於移料具5 2之厭+、产 口 5 2 2供氣體注人於氣室5 4 1，使膜^ 4 & f力源通氣 ^ ^ 6T# ^ 平向保持器5 8及底板5 9下移，並以水平向保持器 結座6 0及取放器6 1向下位移凸伸，使得即時檢^ 測件6 4可與感測器6 3保持-預設之檢知距離檢機構之被感 凊參閱第5、7圖，當移料裝置5之取放器6丄於 電子元件1 ◦後’可控制驅動機I ΐΐϊίΐί2作轴向位移，將取放器61及待測電子元件 至測試裝置8之測試套座8 2上方，再驅動移料豆5 2 Ϊ3Ϊ;61及待測電子元件1 〇作2軸向下降位移ΐ:! ”=測之電子元件i 0置入於測試套座δ 2時移以 器61及連結⑽向上』:In addition to reducing the damage rate of electronic components and improving the quality of detection, Si is the target for research and development. 7 full [invention] The object of the present invention is to provide an electronic component moving device = 冓 child, the moving device is set on the machine, and has at least - machine: = shift, shifting tool ' Below the moving material, a floating device with a pick-and-place device is installed. The device is installed between the moving material and the floating mechanism. The detecting mechanism is attached to the moving material. The detector is placed on the floating device and the pick-up device of the moving mechanism is placed on the test device. 201224390 The test piece S is used to sense the presence or absence of the floating mechanism, and often, it has a foreign object.机构 Agency ' ί: Month: Two structures: mouth:: The instant detection of the device is ί 构 于 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在__中二峨 件 机构 机构 : : : : 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时 即时Under the post _ 峨 i i top _ 5 will immediately press down to the foreign object, and drive the height of the sensor sensed by the opposite part of the sensor ;^j 'make = have foreign objects' and then expand the scope of detection, to achieve the lifting inspection [implementation] implementation; with: 1 = = Ming made more progress - step by step understanding - better - see please refer to the second, third 4, the moving device 5 is disposed at the machine / has at least one shifting device 5 2 driven by the driving mechanism 5 i, the second, ' $ is a -L frame or panel, and For at least - axial displacement, a floating mechanism is disposed below the shifting ^ 2, and the moving material 52 can be directly disposed on the bottom surface, and the structure is also equipped with at least one connecting plate 5 2 丄 on the bottom surface. And a floating mechanism is assembled under the board 1 . In the embodiment, the moving material has a frame body of 5 2 , and two connecting plates 5 2 装配 are assembled on the bottom surface, and each connecting plate 5 ^ is equipped with a floating mechanism. The floating mechanism may be a bearing type floating mechanism or a diaphragm type strict 201224390 moving mechanism. In this embodiment, the moving material has a pressure source vent 52 2 2, and "; = each, the plate 5 2 1 is a film The chip type floating mechanism is used for the material transfer and the west has a 臈-type floating mechanism, and the gusset-shaped through hole 5 3 1 is pressed, and the connecting plate 52 is installed under the mouth 5 2 2 . 1 is provided with a diaphragm 54 2 and a body 53 is formed between the body 53 and the transfer tool 52. The air chamber 5 is 5 and the connecting plate 5 2 i is 5 3 1 , and the inner body of the body 5 3 is vertical. The holder 5 5 is provided with a distance (10) that is 5 5, and the inside of the connection block 57 is provided with a horizontal direction = the lower column 5 6 1 and a lower locking base plate 5 9 for limiting The horizontal direction is locked below the 7 retainer 5 8 at the first speed to ensure that only 11. 5 8. In addition to the horizontal actuating block 5 6 return column 5 6 seat 6 0 is corresponding to the bead The body 6 0 2 is embedded in the =6 (6) working bead body 6〇2, and the bottom surface of the 0 is provided with at least a slot for the tip of the nozzle and 6 pieces of the joint, wherein the floating mechanism and the material are moved and ° = In order to pick up and place the electronic component purchase, the sense ====== in the present embodiment, the transfer tool has 5 5 2 '6 2, for the job allocation - salty _ board 5 2 1 There are two fixing members or laser sensors, etc., and the sensor 63 can be a proximity sensor «the measuring member 6 4 is provided with a corresponding sensor 63 at the position of the corresponding sensor 63: : Yes, the joint of the moving mechanism 60 is externally sensed 6 4 and 3d: is the sensed member of the j board 64, and the connection is made Block 6 j Properly detect the distance, so that the floating machine can detect the position of the instant detection mechanism. The component: Measurement: u He! Ming's transfer device 5 can be applied to electronics. In the present embodiment, the device 5 is applied to an electronic component inspection machine, which is equipped with a test device 8 and a transport device 9 on the machine table 7 and The feeding device ^=: 4, the device 8 is provided with a test circuit board 8 i of the test socket 8 2 , and the 9 is respectively provided on the two sides of the testing device 8 with at least one loading table g 1 The electronic component that is to be tested and completed is placed, and the loading device 5 i is provided with two driving mechanisms 51, 5 于 on the m3f side for respectively driving the material to be moved 2 A, with the pick-and-place devices 61, 61 Α The floating mechanism and the instant detection & Z axial displacement enable each pick-and-placer 6 1 , 6 1 A to be tested in the test stand 9 i : 9 2, the electronic components to be tested / completed, and ^= Detecting whether the device at the § type device has foreign matter, because the hoppers of the hopper 5 2, the mouth 5 2 2 for gas injection in the gas chamber 5.4, the membrane ^ 4 & f source Ventilation ^ ^ 6T# ^ The flat retainer 5 8 and the bottom plate 5 9 are moved downward, and the horizontally facing retainer base 60 and the pick-and-placer 6 1 are downwardly displaced, so that the instant test piece 6 4 can be Keep with sensor 63 - preset Knowing the distance inspection mechanism is referred to in Figures 5 and 7, when the pick-and-place device 6 of the transfer device 5 is placed on the electronic component 1 ', the drive driver I ΐΐϊίΐί2 can be controlled for axial displacement, and the pick-and-place device 61 and The electronic component to be tested is above the test socket 8 2 of the testing device 8, and then the moving bean is driven 5 2 Ϊ 3 Ϊ; 61 and the electronic component 1 to be tested is 2 axially descending displacement !: ! ” = measured electronic component i 0 When placed in the test set δ 2, move the device 61 and connect (10) upwards:
向，5 8、作動塊5 6等上移，使作 H4使取放器61相對於電子元件1〇作-緩H ίΐ^^ϊ；16° 範圍内之測試#£8tf面及削2係為—檢知區’若位於檢知區 構之連結座6 並無異物，職^ 機構之感測器6 3於感測;丨被减置檢知 料傳輸至中央控制單元,由中央裝== f *- * 201224390 8 ™ 請參閱第8圖，若測試裝置8之頂面或測試套座8 2内且有 異物（如電子元件或螺絲等），於本實施例中，該測試套座2'之 件1 0 A，當移料裝置5之移料具5 2帶動取 〇 A，而使連結座6 〇作一緩衝浮動向上位移以 4同步上移，使被感測件6 4回饋殘留於測試 子疋件1 ◦ A高度，該即時檢知機構之感測器6 S感ϊίί測件2 4之高度後’係將感測資料傳輸至中央控 1早疋’巾央控制單元卿測試套座8 2内是否具有異物，由 並未下降至預設卫作高度，使得即時檢 f戒Η料======座 面即會28 02 :二==連⑶底 =機η=6 4同步上二 ===資？傳輸至中央控制單元，由中央控制U 0並夹;面疋否具有異物，由於浮動機構之連結座Θ 亦改作高ΐ ’使得即時檢知機構之被感測件6 4 頂'面且ϊί物％ :控制單元即可依感測資料判別測試裝置8之 時排除異常，止電子树受St質有異物’而可即 201224390 據此，本發明移料穿 子元件之裝置，以即眸二即時檢知機構可應用於不同承置電 除異常，實為一深星實用装置上是否具有異物，而可立即排 品及刊物公開’從“】步性之設計，然未見有相同之產 【圖式簡單說明】 發明專利申請要件，爰依法提出申請。 第1圖.f式移料裝置之檢知機構使用示。 第2圖··本發明移料裝置之示意圖。〜 發明移料裝置之局部外觀示意圖。 第4圖：本發明移職置之局雜裝剖視圖。 ί 3 移料|置應用於電子元件檢測機之示意圖。 第6圖·本發明移料裝置之使用示意圖（一）。 第7圖：本發明移料裝置之使用示意圖（二）。 第8圖：本發明移料裝置之使用示意圖（三）。 第9圖：本發明移料裝置之使用示意圖（四）。 【主要元件符號說明】 〔習式〕 測試裝置：1 測試套座：12 載送裝置：2 出料載台：2 2 移料裝置：3 第二移料具：3 2 取放器：3 5、3 6 電子元件：4 〔本發明〕 移料裝置：5 移料具：52、5 2Α 壓力源通氣口 ： 5 2 2 通孔：5 3 1 氣室：5 4 1 測試電路板：1i 入料载台：21 第一移料具：31 浮動機構：3 3、3 4 CCD : 3 7 驅動機構：51 連結板：5 21 本體：5 3 膜片：5 4 垂直向保持器： 201224390 作動塊：5 6 錐槽：5 6 2 水平向保持器 :5 8 連結座：6 0 珠體：6 0 2 固定件：6 2 被感測件： 6 4 機台：7 測試裝置： 8 測試套座： 8 2 輸送裝置： 9 電子元件： 1 0、 1 0 A 螺絲：2 0 回位柱：5 61 連接塊：5 7 底板：5 9 彈簧：6 0 1 取放器：61、61 感測器：6 3 測試電路板：81 載台：9 1、9 2Toward, 5, actuate block 5 6 and so on, so that H4 makes pick and place device 61 relative to electronic component 1 - slow H ΐ ^ ^ ^ ϊ; 16 ° range test # £ 8tf face and cut 2 If the detection area is located in the connection area of the detection area, there is no foreign matter, the sensor 6 of the occupation mechanism is sensed; the defect detection material is transmitted to the central control unit, and the central unit is installed. = f *- * 201224390 8 TM Please refer to Fig. 8. If there is foreign matter (such as electronic components or screws) in the top surface of the test device 8 or the test socket 8 2, in this embodiment, the test socket 2' of the piece 1 0 A, when the moving device 5 2 of the moving device 5 drives the picking A, and the connecting seat 6 is made as a buffer floating upward displacement to move up 4 synchronously, so that the sensed member 6 4 feeds back Remaining in the height of the test sub-assembly 1 ◦ A, the sensor of the instant detection mechanism 6 S sense ϊ ί 测 测 2 2 2 2 2 2 2 2 2 2 2 2 2 感 感 感 感 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Whether there is foreign matter in the test socket 8 2, the height is not lowered to the preset guard height, so that the instant inspection f or the material ====== the seat surface will be 28 02 : two == even (3) bottom = machine η =6 4 sync on the second === ? Transfer to the central control unit, centrally control U 0 and clamp; face 疋 no foreign matter, because the connection mechanism of the floating mechanism is also changed to high ΐ 'so that the sensing unit of the instant detection mechanism 6 4 top surface and ϊ 物% : The control unit can discriminate the abnormality when the test device 8 is judged according to the sensing data, and the electronic tree is subjected to the St-like foreign matter', that is, 201224390, according to the present invention, the device for moving the material-piercing component of the present invention The detection organization can be applied to different installations to eliminate the abnormality. It is actually a foreign object on a deep-star utility device, and the immediate layout and publications can be disclosed as 'from' step by step, but there is no similar production. Brief description of the schema] The invention patent application requirements are submitted in accordance with the law. Figure 1 shows the use of the detection mechanism of the f-type material transfer device. Figure 2 is a schematic diagram of the material transfer device of the present invention. Schematic diagram of the partial appearance. Fig. 4 is a cross-sectional view of the miscellaneous assembly of the shifting device of the present invention. ί 3 Transfer material|schematic diagram applied to the electronic component inspection machine. Fig. 6 is a schematic view showing the use of the transfer device of the present invention (1). Figure 7: The present invention Schematic diagram of the use of the material transfer device (2) Fig. 8: Schematic diagram of the use of the material transfer device of the present invention (3) Fig. 9: Schematic diagram of the use of the material transfer device of the present invention (4) [Explanation of main component symbols] Test device: 1 Test socket: 12 Carrier: 2 Discharge station: 2 2 Transfer device: 3 Second transfer tool: 3 2 Pick and place: 3 5, 3 6 Electronic components: 4 〔 The invention] the material moving device: 5 moving material: 52, 5 2 压力 pressure source vent: 5 2 2 through hole: 5 3 1 gas chamber: 5 4 1 test circuit board: 1i feeding platform: 21 first shift Material: 31 Floating mechanism: 3 3, 3 4 CCD : 3 7 Drive mechanism: 51 Link plate: 5 21 Body: 5 3 Diaphragm: 5 4 Vertical retainer: 201224390 Actuating block: 5 6 Cone groove: 5 6 2 Horizontal retainer: 5 8 Connector: 6 0 Beads: 6 0 2 Fixings: 6 2 Sensed parts: 6 4 Machine: 7 Test set: 8 Test set: 8 2 Conveyor: 9 Electronics Components: 1 0, 1 0 A Screw: 2 0 Return post: 5 61 Connection block: 5 7 Base plate: 5 9 Spring: 6 0 1 Pick and place: 61 , 61 sensors: 6 3 test circuit board: 81 stage: 9 1, 9 2