隨現行電子設備逐漸以輕薄作為標榜之訴求，故各項元件皆須隨之縮小其尺寸，但電子設備之尺寸縮小伴隨而來產生的熱變成電子設備與系統改善性能的主要障礙。所以業界為了有效解決電子設備內的元件散熱問題，便分別提出具有導熱效能較佳的均溫板(Vapor chamber)及熱管(Heat pipe)，以有效解決現階段的散熱問題。 均溫板(Vapor chamber係包括呈矩型狀之殼體及其殼體內部腔室壁面的毛細結構，且該殼體內部填充有工作液體，並該殼體的一側(即蒸發區)係貼設在一發熱元件(如中央處理器、南北橋晶片、電晶體等)上吸附該發熱元件所產生之熱量，使液態之工作液體於該殼體之蒸發區產生蒸發轉換為汽態，將熱量傳導至該殼體之冷凝區，該汽態之工作液體於冷凝區受冷卻後冷凝為液態，該液態之工作液體再透過重力或毛細結構回流至蒸發區繼續汽液循環，以有效達到均溫散熱之效果。 熱管(Heat pipe)的原理與理論架構與均溫板相同，主要是在圓管口徑的熱管內之中空部分填入金屬粉末，並透過燒結之方式於該熱管之內壁形成一環狀的毛細結構，其後將該熱管抽真空並填充工作液體，最後封閉以形成熱管結構。當工作液體由蒸發部受熱蒸發後擴散至該冷凝 端，並該工作液體於該蒸發部係為汽態，由該蒸發部離開後向該冷凝端擴散時逐步受冷卻冷凝轉換為液態，並且再透過毛細結構回流至該蒸發部。 比較均溫板與熱管兩者只有熱傳導的方式不同，均溫板的熱傳導方式是二維的，是面的熱傳導方式，然而熱管的熱傳導方式是一維的熱傳導方式(即遠端散熱)。故現今的電子元件僅配合單一的熱管或均溫板已不敷使用，因此，如何將熱管與均溫板結合在一起使用，以期大幅提升熱傳導之效率，而有效解決高功率電子元件之散熱問題，是目前業者所需改進的。With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Therefore, in order to effectively solve the problem of heat dissipation of components in electronic equipment, the industry has proposed a Vapor chamber and a heat pipe with better heat conduction performance to effectively solve the current heat dissipation problem. The tempering plate (the Vapor chamber) comprises a capillary structure having a rectangular shape and a wall surface of the inner chamber of the casing, and the inside of the casing is filled with a working liquid, and one side of the casing (ie, an evaporation zone) is Attached to a heating element (such as a central processing unit, a north-south bridge chip, a transistor, etc.) to adsorb heat generated by the heating element, so that the liquid working liquid is evaporated into a vapor state in the evaporation zone of the casing, The heat is transferred to the condensation zone of the casing, and the vaporous working liquid is cooled and condensed into a liquid state in the condensation zone, and the liquid working fluid is recirculated through the gravity or capillary structure to the evaporation zone to continue the vapor-liquid circulation, so as to effectively reach the The principle and theoretical structure of the heat pipe is the same as that of the temperature equalizing plate. The hollow part of the heat pipe of the circular pipe is filled with metal powder and formed on the inner wall of the heat pipe by sintering. An annular capillary structure, after which the heat pipe is evacuated and filled with a working liquid, and finally closed to form a heat pipe structure. When the working liquid is evaporated by heat from the evaporation portion, it is diffused to the condensation end, and the work The liquid is in a vapor state in the evaporation portion, and is gradually cooled and condensed into a liquid state by being separated from the evaporation portion and diffused toward the condensation end, and is again returned to the evaporation portion through the capillary structure. Comparing only the temperature equalizing plate and the heat pipe The way of heat conduction is different. The heat conduction mode of the uniform temperature plate is two-dimensional, which is the heat conduction mode of the surface. However, the heat conduction mode of the heat pipe is one-dimensional heat conduction mode (ie, heat dissipation at the far end). Therefore, the current electronic components only cooperate with a single heat pipe. Or the temperature equalizing plate is no longer sufficient. Therefore, how to combine the heat pipe with the temperature equalizing plate to greatly improve the efficiency of heat conduction, and effectively solve the heat dissipation problem of high-power electronic components is currently required by the industry.
爰此，為有效解決上述之問題，本創作之主要目的在提供一種可達到增加結合強度的散熱單元結合強化結構。 本創作之另一目的係在提供一種可達到增加結合面積以達到穩固結合及保護作用的散熱單元結合強化結構。 本創作之另一目的係在提供一種具有提升飽和蒸氣壓的耐壓效果的散熱單元結合強化結構。 本創作之另一目的係在提供一種透過該熱管與該殼體是相通結構，使熱管內的一熱管毛細結構連接殼體內的一殼體毛細結構，藉以達到提升熱傳效率的散熱單元結合強化結構。 為達上述目的，本創作係提供一種散熱單元結合強化結構，包括一殼體、至少一強化結構及至少一熱管，該殼體具有一殼體腔室及至少一開口，該殼體腔室具有一工作流體與一殼體毛細結構係形成在該殼體腔室內壁，該至少一開口係貫穿該殼體的一頂側，且連通該殼體腔室，該至少一強化結構設有一強化本體，該強化本體係設於對應該至少一開口上，該強化本體具有一貫穿該強化本體的連接孔，該強化本體具有一內側，該連接孔連通對應該殼體腔室，該熱管具有一封閉端、一開放端及一熱管腔室，該熱管的開放端插接相對該連接孔內，且該強化本體的內側係對接相對該熱管的一外側，該熱管腔室位於該開放端與該封閉端之間，且通過該開放端連通該殼體腔室，一熱管毛細結構形成在該熱管腔室內壁，且連接相對該殼體毛細結構；透過本創作的結構設計，使得有效達到增加結合強度及結合面積，且還有效達到保護作用及耐壓性佳的效果。Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipating unit combined with a reinforcing structure that can achieve an increased bonding strength. Another object of the present invention is to provide a heat dissipating unit bonding reinforcing structure which can achieve an increased bonding area for stable bonding and protection. Another object of the present invention is to provide a heat dissipating unit bonding reinforcing structure having a withstand voltage effect of increasing saturated vapor pressure. Another object of the present invention is to provide a capillary structure in which a heat pipe capillary structure in the heat pipe is connected to the casing through the heat pipe, thereby achieving heat transfer unit bonding enhancement for improving heat transfer efficiency. structure. In order to achieve the above object, the present invention provides a heat dissipating unit combined with a reinforcing structure, comprising a casing, at least one reinforcing structure and at least one heat pipe, the casing having a casing chamber and at least one opening, the casing chamber having a working a fluid and a casing capillary structure are formed on the inner wall of the casing cavity, the at least one opening is through a top side of the casing, and communicates with the casing cavity, the at least one reinforcing structure is provided with a reinforcing body, the reinforcing body The reinforcing body has a connecting hole penetrating the reinforcing body, the reinforcing body has an inner side, and the connecting hole communicates with the corresponding housing cavity, the heat pipe has a closed end and an open end And a heat pipe chamber, the open end of the heat pipe is inserted into the connecting hole, and the inner side of the reinforcing body is butted against an outer side of the heat pipe, and the heat pipe chamber is located between the open end and the closed end And communicating with the housing chamber through the open end, a heat pipe capillary structure is formed on the inner wall of the heat pipe cavity, and is connected with the capillary structure of the casing; Meter, so that effective to achieve increased bonding area and bonding strength, and also effective to protect the pressure resistance effect and excellent effect.
本創作之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。 本創作係提供一種散熱單元結合強化結構。第1圖為本創作之第一實施例之立體組合示意圖；第2圖為本創作之第一實施例之立體分解示意圖；第2A圖為本創作之第一實施例之組合剖面示意圖。該散熱單元結合強化結構包括一殼體1、至少一強化結構及至少一熱管3，該殼體1（其可如金、銀、銅、鋁、不銹鋼、鈦、陶瓷等材質製成）於本實施例表示為一均溫板，該殼體1具有一頂側10、一底側11、一側邊12、一殼體腔室13、一封管18及至少一開口14，該側邊12環設在該殼體1的頂側10與底側11之間，該封管18係貫穿在該側邊12上，以連通該殼體腔室13。並該殼體腔室13界定在該頂側10及底側11及側邊12之間，該殼體腔室13具有一工作流體與一形成在該殼體腔室13內壁的殼體毛細結構16，該工作流體是經由該封管18填充入至該殼體1的殼體腔室13內，並於工作流體填充完成後，即將封管18密封，並該殼體毛細結構16於本實施例表示為一燒結粉末體，但不侷限於此。其中前述殼體1也可改設計為一熱板或一平板式熱管3。 該開口14係貫穿在該殼體1的頂側10上，且連通該殼體腔室13，該開口14於本實施例表示為4個開口14說明，但並不局限於此，於具體實施時，前述開口14的數量可為1個或1個以上，且所述開口14的數量是匹配對應熱管3的數量而設計，例如1個開口14匹配對應1隻熱管3或2個開口14匹配對應2隻熱管3，依此類推。並該殼體1具有至少一結合槽17，前述結合槽17凹設於相鄰該開口14的殼體1之頂側10上，且於本實施例表示為4個結合槽17且匹配對應4個開口，前述強化結構設有一強化本體2，該強化本體2為一金屬材質(如金、銀、銅、鋁、不銹鋼、鈦材質)所構成，且其係設置在對應的開口14上，於本實施例之強化本體2表示為4個強化本體分別係以例如焊接方式或擴散接合方式連接在對應的4個開口14上，令該等強化本體2一體連接在相鄰對應該等開口14的殼體1之頂側10上。 該強化本體2具有一連接孔21、一對接部24、一內側22、一外周側23及一強化連接部25，該對接部24從該強化連接部25的外周側23以水平方向向外延伸構成，且與對應該殼體1的結合槽17相連接，前述對接部24的一上側係平齊相鄰該殼體1的頂側10，該連接孔21貫穿在該強化本體2的強化連接部25上，用以供對應的熱管3插設，該連接孔21係連通對應的殼體腔室13。另外，該強化本體2具有一唇部26，該唇部26係從該強化連接部25的一底端向下凸伸構成，且與對應的開口14之一內周側相嵌接。 而本實施例的熱管3係以4隻熱管3具有可彎折的特性說明，該熱管3具有一封閉端32、一開放端33、一熱管毛細結構36及一熱管腔室35，該熱管毛細結構36於本實施例表示為一燒結粉末體，該熱管毛細結構36形成設於在該熱管3的一內側312上，該熱管腔室35位於該封閉端32與開放端33之間且連通該開放端33。該熱管3的開放端33插接相對該強化本體2的連接孔21內，令該強化本體2之強化連接部25的內側22與唇部26的內側22緊貼結合於相對該熱管3的外側311上，該熱管腔室35通過該開放端33連通該殼體腔室13，並該殼體腔室13與熱管腔室35係垂直連通，且該熱管3未與強化本體2接觸的其餘部分(包含封閉端32)是裸露於該殼體1外。其中前述熱管3與強化本體2之連接係為焊接方式或擴散接合方式連接構成一體。 因此，藉由該本創作的熱管3與殼體1結合為一體且是相通的結構，讓熱管3與殼體1結合間沒有接觸的介面熱阻。此外，參考第2A圖，透過該強化本體2之強化連接部25的軸向剖面厚度係大於該熱管3的軸向剖面厚度及殼體1的軸向剖面厚度，使該強化本體2與對應該熱管3相接合區域的厚度增加，例如強化連接部25的軸向剖面厚度如3.3mm(公厘)與對應熱管3的軸向剖面厚度如0.3mm(公厘)相接合區域之軸向剖面厚度為3.6mm(公厘)，藉此可有效增強該強化本體2與熱管3的結合強度及結合面積，且於組合製程及使用時透過該強化本體2可有效避免前述接合區域受損壞，以有效達到保護作用。另者，當該殼體1接收到一熱量時，令該殼體腔室13內的工作流體因高溫而蒸發轉換為蒸氣，此時透過該強化本體2緊密接合在對應該熱管3之外側311上的設計，使得可達到提升飽和蒸氣壓的耐壓需求。其中前述強化本體2及其強化連接部25的軸向剖面厚度並不侷於上述3.3mm(公厘)，於具體實施時，使用者可以根據結合強度及飽和蒸汽壓的耐壓需求，設計調整前述強化本體2及其強化連接部25的軸向剖面厚度，例如1mm或1mm以上。 在一實施例，前述殼體毛細結構16與該熱管毛細結構36也可選擇為網格體、纖維體、溝槽或複合型毛細結構。 再者，前述開放端33處從該熱管3一體向外延伸一延伸部34，該延伸部34是於該殼體腔室13內直接抵接該殼體腔室13內的底側11，就是該延伸部34於該連接孔21內的開放端33上朝相對該殼體腔室13內的底側11向下延伸，以與該殼體腔室13內的底側11相連接一起，並該開放端33與延伸部34之間形成一缺口形狀或一開口形狀或一貫孔形狀，且該延伸部34為該熱管3的一部分，相對該延伸部34的內側即為熱管3的內側312。所以藉由該熱管3的開放端33處一體延伸的延伸部34連接該殼體腔室13內的底側11，以及該熱管3的外側311連接相對該強化本體2的內側22形成了可支撐該殼體腔室13內的支撐結構，故本案的殼體腔室13內未設有習知用來支撐的銅柱，藉以達到節省成本的效果。 請參考第1、2A圖，前述熱管毛細結構36是從該封閉端32向該開放端33延伸並連接接觸對應該殼體腔室13之底側11的殼體毛細結構16，如圖所示，該延伸部34的內側312其上的熱管毛細結構36直接連接接觸於該殼體腔室13內的底側11其上的殼體毛細結構16，而位於該開放端33的該熱管3內側312其上的熱管毛細結構36直接連接接觸相鄰該殼體腔室13內的頂側10其上殼體毛細結構16，所以藉由該熱管毛細結構36與殼體毛細結構16連接接觸的設計，使得可有效達到提升熱傳效率及均溫的效果，進而更有效增加汽液循換效率。 當該殼體1的底側11外貼設在相對一發熱元件(如中央處理器或MCU或其他電子元件)上時，該殼體1的底側11會吸收該發熱元件產生的一熱量，令該殼體腔室13內的底側11其上殼體毛細結構16的工作流體受熱蒸發後而轉換為蒸氣的工作流體(或稱為汽態工作流體)，使蒸氣的工作流體會朝該殼體腔室13內的頂側10方向流動，同時一部分蒸氣的工作流體也會通過該熱管3的開放端33流動到該熱管腔室35內，直到該蒸氣的工作流體於該殼體腔室13內的頂側10上及熱管腔室35內的封閉端32上冷凝後而轉換為冷卻的工作流體(或稱為液態工作流體)，此時該熱管腔室35內的封閉端32上的冷卻的工作流體便藉由熱管毛細結構36的毛細力迅速回流到該殼體腔室13內的底側11其上該殼體毛細結構16，因此使該工作流體於該殼體腔室13與熱管腔室35內不斷汽液循環，來達到較佳的散熱效果。 請參考第3圖為本創作之第二實施例之立體組合示意圖；第4圖為本創作之第二實施例之立體分解示意圖；第4A圖為本創作之第二實施例之組合剖面示意圖。該本實施例的殼體1、熱管3及強化本體2的結構及連結關係及其功效大致與前述第一實施例的殼體1、熱管3及強化本體2的結構及連結關係及其功效相同，故在此不重新贅述，本實施例主要是將前述第一實施例的殼體1之頂側10上沒有凹設前述結合槽17以及該強化本體2(包含強化連接部25與對接部24及唇部26)改設計成為該殼體1本身的一部分(即強化本體2與殼體1為一體成型)，如圖所示，該強化本體2係沿相鄰該開口14周緣從該殼體1的頂側10向上延伸構成，且該熱管3的開放端33插接相對該連接孔21及連通該連接孔21的開口14內，令該強化本體2之內側22及該開口14之內周側緊密接合(或緊貼結合)於相對該熱管3的外側311上。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. This creation provides a heat sink unit with a reinforced structure. 1 is a perspective view of a first embodiment of the present invention; FIG. 2 is a perspective exploded view of the first embodiment of the present invention; and FIG. 2A is a schematic cross-sectional view of the first embodiment of the present invention. The heat dissipating unit combined with the reinforcing structure comprises a casing 1, at least one reinforcing structure and at least one heat pipe 3, and the casing 1 (which can be made of materials such as gold, silver, copper, aluminum, stainless steel, titanium, ceramics, etc.) The embodiment is shown as a temperature equalizing plate having a top side 10, a bottom side 11, a side 12, a housing chamber 13, a tube 18 and at least one opening 14, the side 12 ring Located between the top side 10 and the bottom side 11 of the housing 1, the sealing tube 18 extends through the side 12 to communicate with the housing chamber 13. The housing chamber 13 is defined between the top side 10 and the bottom side 11 and the side edge 12. The housing chamber 13 has a working fluid and a housing capillary structure 16 formed on the inner wall of the housing chamber 13. The working fluid is filled into the housing chamber 13 of the housing 1 via the sealing tube 18, and after the working fluid is filled, the sealing tube 18 is sealed, and the housing capillary structure 16 is represented in this embodiment as A sintered powder body, but is not limited thereto. The housing 1 can also be modified as a hot plate or a flat heat pipe 3. The opening 14 is formed on the top side 10 of the housing 1 and communicates with the housing chamber 13 . The opening 14 is illustrated as four openings 14 in this embodiment, but is not limited thereto. The number of the openings 14 may be one or more, and the number of the openings 14 is designed to match the number of the corresponding heat pipes 3, for example, one opening 14 matches one heat pipe 3 or two openings 14 matches. 2 heat pipes 3, and so on. The housing 1 has at least one coupling groove 17, and the coupling groove 17 is recessed on the top side 10 of the housing 1 adjacent to the opening 14, and is represented as four coupling grooves 17 in the present embodiment and matches the corresponding ones. The reinforcing structure is provided with a reinforcing body 2, which is made of a metal material (such as gold, silver, copper, aluminum, stainless steel, titanium), and is disposed on the corresponding opening 14 The reinforced body 2 of the present embodiment is shown as four reinforced bodies which are respectively connected to the corresponding four openings 14 by means of welding or diffusion bonding, so that the reinforced bodies 2 are integrally connected to the adjacent openings 14 . On the top side 10 of the housing 1. The reinforcing body 2 has a connecting hole 21, a pair of connecting portions 24, an inner side 22, an outer peripheral side 23 and a reinforcing connecting portion 25 extending outward from the outer peripheral side 23 of the reinforcing connecting portion 25 in the horizontal direction. The upper side of the abutting portion 24 is flush with the top side 10 of the housing 1 , and the connecting hole 21 penetrates the reinforcing connecting portion 25 of the reinforcing body 2 . The upper heat pipe 3 is inserted, and the connecting hole 21 is connected to the corresponding housing chamber 13. Further, the reinforcing body 2 has a lip portion 26 which is formed to project downward from a bottom end of the reinforcing connecting portion 25 and engages with an inner peripheral side of one of the corresponding openings 14. The heat pipe 3 of the present embodiment has a bendable characteristic of four heat pipes 3 having a closed end 32, an open end 33, a heat pipe capillary structure 36 and a heat pipe chamber 35, the heat pipe The capillary structure 36 is shown as a sintered powder body in the present embodiment. The heat pipe capillary structure 36 is formed on an inner side 312 of the heat pipe 3 between the closed end 32 and the open end 33. The open end 33 is connected. The open end 33 of the heat pipe 3 is inserted into the connecting hole 21 of the reinforcing body 2 such that the inner side 22 of the reinforcing connecting portion 25 of the reinforcing body 2 and the inner side 22 of the lip portion 26 are tightly coupled to the outer side of the heat pipe 3 311, the heat pipe chamber 35 communicates with the housing chamber 13 through the open end 33, and the housing chamber 13 is in vertical communication with the heat pipe chamber 35, and the remaining portion of the heat pipe 3 not in contact with the reinforcing body 2 (including the closed end 32) is exposed outside the housing 1. The connection between the heat pipe 3 and the reinforcing body 2 is integrally formed by welding or diffusion bonding. Therefore, the heat pipe 3 of the present invention is integrated with the casing 1 in an integrated structure, and the heat resistance of the interface between the heat pipe 3 and the casing 1 is not contacted. In addition, referring to FIG. 2A, the axial cross-sectional thickness of the reinforcing connecting portion 25 passing through the reinforcing body 2 is greater than the axial cross-sectional thickness of the heat pipe 3 and the axial cross-sectional thickness of the casing 1, so that the reinforcing body 2 corresponds to The thickness of the heat pipe 3-phase joining region is increased, for example, the axial cross-sectional thickness of the reinforcing joint portion 25 such as 3.3 mm (millimeter) and the axial cross-sectional thickness of the corresponding heat pipe 3 such as 0.3 mm (millimeter). It is 3.6 mm (millimeter), thereby effectively enhancing the bonding strength and bonding area of the reinforcing body 2 and the heat pipe 3, and the reinforcing body 2 can be effectively prevented from being damaged during the combined manufacturing process and use. Achieve protection. In addition, when the housing 1 receives a heat, the working fluid in the housing chamber 13 is evaporated into steam due to high temperature, and at this time, the reinforcing body 2 is tightly coupled to the outer side 311 of the corresponding heat pipe 3. The design makes it possible to achieve a pressure requirement that increases the saturated vapor pressure. The axial section thickness of the reinforcing body 2 and the reinforcing connecting portion 25 thereof is not limited to 3.3 mm (mm), and in the specific implementation, the user can design and adjust according to the bonding strength and the withstand voltage requirement of the saturated vapor pressure. The axial thickness of the reinforcing body 2 and the reinforcing connecting portion 25 thereof is, for example, 1 mm or more. In one embodiment, the housing capillary structure 16 and the heat pipe capillary structure 36 may also be selected as a mesh body, a fibrous body, a groove or a composite capillary structure. Further, the open end 33 extends integrally from the heat pipe 3 to an extending portion 34. The extending portion 34 directly abuts the bottom side 11 in the housing chamber 13 in the housing chamber 13, which is the extension. The portion 34 extends downwardly on the open end 33 in the connecting hole 21 toward the bottom side 11 in the housing chamber 13 to be connected with the bottom side 11 in the housing chamber 13, and the open end 33 A notch shape or an open shape or a consistent hole shape is formed between the extension portion 34, and the extension portion 34 is a part of the heat pipe 3, and the inner side 312 of the heat pipe 3 is opposite to the inner side of the extension portion 34. Therefore, the bottom side 11 in the housing chamber 13 is connected by an extending portion 34 integrally extending at the open end 33 of the heat pipe 3, and the outer side 311 of the heat pipe 3 is connected to the inner side 22 of the reinforcing body 2 to form a supportable portion. The support structure in the housing chamber 13 is such that the copper chambers conventionally used for supporting are not provided in the housing chamber 13 of the present invention, thereby achieving a cost-saving effect. Referring to Figures 1 and 2A, the heat pipe capillary structure 36 extends from the closed end 32 toward the open end 33 and is connected to the housing capillary structure 16 corresponding to the bottom side 11 of the housing chamber 13, as shown, The heat pipe capillary structure 36 on the inner side 312 of the extension portion 34 is directly connected to the housing capillary structure 16 on the bottom side 11 of the housing chamber 13, and the inner side 312 of the heat pipe 3 at the open end 33 is The upper heat pipe capillary structure 36 is directly connected to the top side capillary 10 of the top side 10 adjacent to the housing cavity 13 , so that the heat pipe capillary structure 36 is in contact with the housing capillary structure 16 , so that Effectively improve the heat transfer efficiency and the uniform temperature effect, and thus more effectively increase the vapor-liquid conversion efficiency. When the bottom side 11 of the housing 1 is externally attached to a heat generating component (such as a central processing unit or an MCU or other electronic component), the bottom side 11 of the housing 1 absorbs a heat generated by the heating element. The working fluid of the bottom side 11 in the casing chamber 13 and the working fluid of the upper casing capillary structure 16 is converted into a vapor working fluid (or a vapor working fluid), so that the working fluid of the vapor will face the shell. The top side 10 in the body chamber 13 flows, and a portion of the vaporous working fluid also flows into the heat pipe chamber 35 through the open end 33 of the heat pipe 3 until the working fluid of the vapor is in the housing chamber 13. The top side 10 and the closed end 32 in the heat pipe chamber 35 are condensed and converted into a cooled working fluid (or liquid working fluid), at which point the closed end 32 in the heat pipe chamber 35 The cooled working fluid is rapidly returned to the bottom side 11 in the housing chamber 13 by the capillary force of the heat pipe capillary structure 36, thereby placing the working fluid in the housing chamber 13 and the heat pipe. The vapor-liquid circulation in the chamber 35 is continued to achieve a better heat dissipation effect. Please refer to FIG. 3 for a perspective view of a second embodiment of the present invention; FIG. 4 is a perspective exploded view of a second embodiment of the present invention; and FIG. 4A is a schematic cross-sectional view of the second embodiment of the present invention. The structure, the connection relationship, and the effects of the casing 1, the heat pipe 3, and the reinforcing body 2 of the present embodiment are substantially the same as those of the casing 1, the heat pipe 3, and the reinforcing body 2 of the first embodiment. Therefore, in this embodiment, the first embodiment of the housing 1 of the first embodiment is not recessed with the coupling groove 17 and the reinforcing body 2 (including the reinforcing connecting portion 25 and the abutting portion 24). And the lip portion 26) is modified to be part of the housing 1 itself (ie, the reinforcing body 2 is integrally formed with the housing 1). As shown, the reinforcing body 2 is adjacent to the periphery of the opening 14 from the housing. The top side 10 of the heat pipe 3 is inserted upwardly, and the open end 33 of the heat pipe 3 is inserted into the opening 14 of the reinforcing body 2 and the opening 14 of the connecting hole 21, so that the inner side 22 of the reinforcing body 2 and the inner circumference of the opening 14 The sides are tightly joined (or tightly bonded) to the outer side 311 of the heat pipe 3.