TWI608423B - 具有經強化電子模組之混合接觸－非接觸式的智慧卡 - Google Patents

具有經強化電子模組之混合接觸－非接觸式的智慧卡 Download PDF

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TWI608423B
TWI608423B TW101125231A TW101125231A TWI608423B TW I608423 B TWI608423 B TW I608423B TW 101125231 A TW101125231 A TW 101125231A TW 101125231 A TW101125231 A TW 101125231A TW I608423 B TWI608423 B TW I608423B
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card
module
layer
antenna
contactless smart
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TW201319951A (zh
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皮爾 班那多
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Ask股份有限公司
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

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Description

具有經強化電子模組之混合接觸-非接觸式的智慧卡
本發明係有關於非接觸式射頻識別(RFID)裝置，並且明確地說是有關於一種具有經強化的積體電路模組之混合接觸-非接觸式智慧卡及其製造過程。
非接觸式RFID裝置是一種由一天線以及一連接至該天線的端子的積體電路所構成的裝置。通常，該積體電路並未被供電，而是透過在讀取器的天線與該RFID裝置的天線之間的電磁耦合來接收其能量；資訊係在該RFID裝置與該讀取器之間做交換，尤其是在該積體電路中儲存相關於該RFID裝置位在上面的物體的持有者的識別之資訊、以及該持有者的進入一受控的存取區域的授權。
除了與讀取器的資料交換也可以藉由在該卡中經連接至該積體電路的齊平且導電的接觸區域上的接觸來發生之外，混合接觸-非接觸式智慧卡是一種非接觸式RFID裝置。因此，該積體電路係被囊封在該模組內，該模組的外表面係包括該些齊平的接觸區域。該積體電路亦連接至該模組中被設計來連接至該卡的天線的內表面。因此，該積體電路係連接至雙面的模組的兩個面，一旦囊封後，用以形成雙面的積體電路模組或是雙面的電子模組。因此，該電子模組的強度以及因此在該卡上的積體電路的強度係相關於非接觸式積體電路卡而減弱，其中該積體電路是最經常囊 封在卡主體中。因此，混合接觸-非接觸式智慧卡的主要間題是其易損壞的本質。再者，該模組是一種不彎曲的剛性元件。因此，應力係集中在該模組的周圍，特別是沿著其位在最靠近該卡的對稱軸、因而是最靠近該卡的中心的內部邊緣。通常，用於製造混合接觸-非接觸式智慧卡的製造過程係包括以下的步驟：一用於在一支持件上製造該天線的步驟，一用於將卡主體疊層到該天線支持件之上的步驟，其係在於藉由一熱壓模製技術以將構成該卡主體的一或數片的塑膠材料焊接到該支持件的每一側邊上，一用於研磨凹處的步驟，其係在於在該些卡主體中之一者內刺穿一凹處，該凹處係被設計以容置由該積體電路及雙面電路所形成的模組，該凹處係包括一接收該積體電路之較小的內部部分以及一接收該雙面模組之較大的外部部分，該研磨步驟係使得該天線的接點能夠減輕被研磨，以及一模組***步驟，其係在於利用一黏膠以固定該模組以及利用一導電黏膠以連接該模組至該些接點並且為此目的以將該模組設置在該凹處中。
根據在目前的標準中所界定的準則，該混合接觸-非接觸式智慧卡係受到彎曲及扭曲的測試。一第一類型的混合接觸-非接觸式智慧卡是一單片的卡，其中該塑膠天線支持件係被***在構成上方及下方的卡主體的兩層塑膠材料之間，並且藉由在加壓下的熱疊層來加以熱黏合。該模組係 藉由一致能歐姆接觸之建立的導電黏膠或等效物而連接至該天線。
此類型的卡是相當有剛性的。因此，當此類型的卡遭受到機械式彎曲及/或扭曲應力時，該些應力並非使該卡留下痕跡，而是使得該卡沿著受到最大量的應力的軸，亦即沿著該模組而斷裂。
另一類型的卡係配備有一抗斷裂的紙製天線支持件。此類型的卡有一項缺點，是因為該電子模組並未穩固地固定在該卡上。由例如是紙的纖維材料所做成的天線支持件確實提供"記憶"該卡的彎曲的優點，但該卡欠缺內黏聚力，此係在多次彎曲之後，促使在保持該模組到該卡之上的黏膠接合點之下的紙因此相對該卡主體之較薄的部分會垂直地脫層，因而造成該電子模組與天線的斷開。通常，該模組中從天線斷開的第一接點是一位在最靠近該卡的中心的接點。
這是為何本發明之目的是提供一種混合接觸-非接觸式智慧卡來對付這些缺點，亦即，其係能夠承受彎曲測試，而無卡主體的斷裂或是在該模組與天線之間的連接斷開。
本發明之另一目的是提供一種用於製造此一裝置的方法。
因此，本發明之目的是一種混合接觸-非接觸式智慧卡，其係包括一由複數個層所組成的卡主體，該些層中被 稱為支持層之一層係支承一由至少一匝組成的印刷式天線並且支承一積體電路模組，該積體電路模組係藉由兩個分別位在該些天線匝的內部及外部末端的延伸中的內部及外部接點而連接至該天線，該模組係位在該卡上的一部分中，該部分係藉由該卡的一第一側邊、該卡的一垂直於該第一側邊的第二側邊、一平行於該卡的該第一側邊的第一線以及一平行於該卡的該第二側邊的第二線所界定。根據本發明的主要特徵，該些天線匝的連接至該內部接點的該內部末端係以當該卡遭受到彎曲及/或扭曲應力時，在該模組與該天線之間的連接不被切斷的此種方式而完全位在該部分中。再者，該些接點係藉由印刷至少兩層的導電油墨到該支持件之上來加以製成，第一油墨層係包含未覆蓋油墨的空間。
大致而言，在以下的說明中，該用語"內部"邊緣或側邊係指一元件的邊緣及側邊相較於相同的元件由用語"外部"所指明的相對的邊緣或側邊在幾何位置上位在較靠近該卡的中心。
根據圖1的例圖，一混合接觸-非接觸式智慧卡1係配備有一模組10。該卡的外部尺寸係對應於在標準的ISO 7810中所界定的"***"格式。該卡係包含垂直於兩個長的側邊7及8的兩個短的側邊5及6。該模組10係包含兩個短的邊緣23及24以及兩個長的邊緣25及27。在機械上 的測試期間並且特別是在該卡的彎曲測試期間，該卡上受到最大應力的軸，亦即應力是最大之處係由虛線3及4來表示。位於沿著該模組的內部邊緣23及25的線3及4係分別平行於該卡的側邊6及8。該卡的破裂區域係位在這些線3及4上、在沿著該模組的內部邊緣之連續線上。該模組係位在該卡上的一部分中，該部分係藉由該卡的一第一側邊6、該卡垂直於該第一側邊6的一第二側邊8、該線3以及一第二線4所界定。
根據圖2，根據本發明的裝置係包含由一非導電的支持件19所組成的一電子模組10，該支持件19係在其第一面上具有適配於連接至讀取裝置的讀取頭的接點之齊平的接觸區域12，並且在另一面上具有適配於連接至該卡的天線之接點13及14。一積體電路15係接著藉由透過為此目的而設置的孔洞11來穿過該支持件之焊接的金線16而連接至該些齊平的接觸區域12，並且藉由焊接的金線17而連接至該些接點13及14，該些接點13及14亦適配於連接至該天線。該積體電路15以及線16及17係接著藉由從上方澆灌的樹脂18而受到保護及圍繞。當該樹脂已經硬化時，該積體電路以及線係接著被囊封，並且如圖3中所繪，只有該接點13及14中打算連接至該天線接點的一部分是可見的。該模組10的接點13及14係位在該樹脂18的兩側邊上，並且分別平行於該模組10之短的邊緣23及24。此種模組係被稱為雙側的積體電路模組，因為其在兩側邊上包含接點，此係不同於用在接觸式智慧卡的製造之僅由齊平 的接觸區域所構成之單側的積體電路模組。該模組是剛性的，因而其並不在該卡受到彎曲及扭曲應力時彎曲。在該積體電路15與接點12、13及14之間的連接係因此受到保護而免於斷裂。
根據圖4，一天線41係在一支持層40上製成。該天線41係藉由複數個由一種導電材料所做成的匝來加以形成。該些在形狀上呈有效矩形的匝係包含數個直線部分以便於沿著卡的邊緣走線。該些天線匝係跨過一絕緣橋48。該些匝的特點在於兩個構成直線的天線部分的末端45及46係分別延伸有兩個接點43及44，該些接點43及44係欲電連接至該模組的兩個接點13及14。該天線匝的兩個末端45及46係分別被稱為內部及外部末端。該天線的匝及接點係藉由一種絲網印刷、柔版印刷術(flexography)、捲筒紙凹版印刷(rotogravure)、平版或噴墨印刷製程，利用例如是摻雜有像是銀或金的導電元素或是一種導電聚合物的環氧樹脂油墨之導電油墨來加以製成。該支持層40較佳的是由一種不會潛變(亦即，當溫度上升時並不會變形)的材料所做成，例如紙或合成紙(Teslin類型)。
該天線匝的內部末端45係位在該支持件上，因而並不交叉該線3。因此，匝49延伸出該末端45的部分係在盡可能遠離該模組的內部邊緣23下交叉該線3。因此，此配置係將該末端45設置在盡可能的遠離該破裂區域處。因此，在考量到其它天線匝的位置下，匝49的該部分與該線3的交叉處必須被設置成盡可能的靠近該卡的邊緣。當該卡受 到在卡的對稱橫截軸附近的彎曲測試時，位在盡可能的靠近該卡的中心之內部接點43是受到最大機械應力的。位在靠近該卡的邊緣6的外部接點44係遭受到小的機械應力。根據本發明，該兩個接點43及44係藉由在該天線支持件40上印刷至少兩層的油墨來加以製成。該外部接點44的油墨的組件層係彼此重疊，並且都是相同的形狀及尺寸。該接點44的尺寸係使得其內表面區域寬廣地覆蓋該模組10的接點14的表面區域。更明確地說，該接點44的表面積係至少等於該模組10的接點14的表面積的兩倍。該接點43中由層43-1及43-2所指明的油墨組件層係彼此重疊，並且不全都是相同的尺寸。接點43的第一油墨層43-1的表面積係大於後續的油墨層的表面積。該接點43的第一組件層43-1的第二及後續層係具有和該接點44的組件層相同的表面積。該接點43的第一油墨層43-1係被穿刺。根據本發明的較佳實施例，油墨層43-1係以一網格化的形式來加以產生，其網格係具有無油墨的空間47。這些空間可具有不同的形狀，且不偏離本發明的範疇。此種第一層的配置係藉由將來自第二層的一些油墨透過第一層中的空間47而直接附著到該天線支持件上，來提供第二層到該支持件之上的較佳附著，因此防止構成該接點的該些油墨層的脫層。第二油墨層43-2的表面積係小於該油墨層43-1的表面積並且等於該接點44的油墨層的表面積。一旦所有的油墨層重疊之後，該些天線接點的厚度是在50μm到80μm之間。
根據本發明的卡係包含如圖5中的橫截面圖所示的複 數個層。由於該圖並非依照比例，因此只有該兩個接點43及44被表示。一聚氯乙烯(PVC)層61、一聚酯(PET)層63以及一覆蓋層65係以此順序被設置在該天線支持層40上，並且更明確地說，被設置在該層40的製成該天線的面上。一PET層72以及一覆蓋層64係以此順序被設置在該天線支持層40的另一面上。
該疊層步驟係在於堆疊所有的層40、61、63、65、62及64，並且使該些層在150℃等級的溫度且在20 bar等級的壓力下受到熱處理。在壓力及溫度的效應下，該PVC層61係軟化並且圍繞該天線匝以及天線接點43及44。該兩個PET層係使得該組件變硬，尤其是容置該模組於其中的凹處之未穿刺的PET層62。該卡的此種組件層的配置係具有提供該卡抵抗力及彈性的優點，因而該卡在彎曲及/或扭曲測試期間並不會斷裂。
以下的步驟係在於研磨一準備用於接收該模組10的凹處，並且用於將該模組膠合在該凹處中。
在圖7中的透視處，當該模組10是在連接至該些天線接點的位置時，該模組10可被看見。該些接點43及44係重疊該模組10的接點13及14。該天線匝的末端45及46係平行於該模組之短的側邊23及24並且垂直於該模組之長的側邊25及27。因此，該天線匝的末端45及46並不交叉該卡的破裂區域，亦即彎曲應力是最大的區域。若該天線匝的末端45沿著其軸(根據該圖以及所述的實施例，此軸是一直線)延伸，則其將會橫過藉由該模組所界定的表面區 域。該末端45及接點43的軸係被配置成使得其藉由橫切該模組10之長的外部邊緣27而橫過該模組10。
該天線匝的此種末端配置係容許該天線能夠移到遠離位在沿著該模組的邊緣23的破裂區域之處。此外，該末端45係位在該模組內的內部接點43的延伸部分中。以此種方式，當該卡受到機械上的彎曲應力時，該天線匝的末端45並不冒著被切斷的風險。
該接點44係在該模組之小的外部邊緣24的側邊上延伸經過該模組。該第一油墨層43-1的表面區域係在該模組的內部邊緣23以及其長的外部邊緣27的側邊上延伸經過該模組。
1‧‧‧混合接觸-非接觸式智慧卡
3‧‧‧第一線/虛線/軸
4‧‧‧第二線/虛線/軸
5‧‧‧短的側邊
6‧‧‧短的側邊/第一側邊
7‧‧‧長的側邊
8‧‧‧長的側邊/第二側邊
10‧‧‧電子(積體電路)模組
11‧‧‧孔洞
12‧‧‧齊平的接觸區域/接點
13、14‧‧‧接點
15‧‧‧積體電路
16、17‧‧‧焊接的金線
18‧‧‧樹脂
19‧‧‧非導電的支持件
23‧‧‧短的邊緣/內部邊緣
24‧‧‧短的邊緣/外部邊緣
25‧‧‧長的邊緣/內部邊緣
27‧‧‧長的邊緣/外部邊緣
40‧‧‧(天線)支持層
41‧‧‧(印刷式)天線
43‧‧‧(內部)接點
43-1‧‧‧第一油墨層/第一組件層
43-2‧‧‧第二油墨層
44‧‧‧(外部)接點
45‧‧‧內部末端
46‧‧‧外部末端
47‧‧‧空間
48‧‧‧絕緣橋
49‧‧‧匝/延伸
61‧‧‧聚氯乙烯(PVC)層
62‧‧‧未穿刺的聚酯(PET)層
63‧‧‧聚酯(PET)層
64、65‧‧‧覆蓋層
72‧‧‧聚酯(PET)層
本發明之目的、目標及特徵從上述的說明在結合所附的圖式時業已變成更為明顯，其中：圖1是一混合接觸-非接觸式智慧卡的俯視圖，圖2係描繪根據習知技術的一雙面電子模組的剖面，圖3係描繪從積體電路的側邊觀看的根據習知技術的雙面電子模組，圖4是根據本發明的混合接觸-非接觸式智慧卡的天線支持件的俯視圖，圖5是根據本發明的卡的各種組件層的橫截面，圖6係描繪根據本發明的配備有其模組的卡的橫截面，圖7係描繪根據本發明的模組及天線的接點之透視的 俯視圖。
1‧‧‧混合接觸-非接觸式智慧卡
3‧‧‧第一線/虛線/軸
4‧‧‧第二線/虛線/軸
5‧‧‧短的側邊
6‧‧‧短的側邊/第一側邊
7‧‧‧長的側邊
8‧‧‧長的側邊/第二側邊
10‧‧‧電子(積體電路)模組
23‧‧‧短的邊緣/內部邊緣
24‧‧‧短的邊緣/外部邊緣
25‧‧‧長的邊緣/內部邊緣
27‧‧‧長的邊緣/外部邊緣

Claims (8)

  1. 一種混合接觸-非接觸式智慧卡(1)，其係包括一由複數個層所組成的卡主體，該些層中被稱為支持層(40)之一層係支承一由至少一匝所組成的印刷式天線(41)並且支承一積體電路模組(10)，該積體電路模組(10)係藉由兩個分別位在該些天線之匝的內部及外部末端(45、46)的延伸中的內部及外部接點(43、44)而連接至該天線，該模組係位在該卡上的一部分中，該部分係藉由該卡的一第一側邊(6)、該卡垂直於該第一側邊的一第二側邊(8)、平行於該卡的該第一側邊(6)的一第一線(3)以及平行於該卡的該第二側邊的一第二線(4)所界定，其特徵在於：該天線之匝中經連接至該內部接點(43)的該內部末端(45)係以下述一方式而完全位在該部分中：當該卡遭受到彎曲及/或扭曲應力時，在該模組與該天線之間的連接不被切斷，並且其特徵在於：該些接點(43、44)係藉由印刷至少兩層的導電油墨到該支持件(40)之上來加以製成，第一油墨層(43-1)係包含未覆蓋油墨的空間(47)。
  2. 根據申請專利範圍第1項之混合接觸-非接觸式智慧卡，其中該末端(45)的延伸(49)係交叉該線(3)，該末端(45)係交叉該軸(3)，並且它們的交叉處係位在該卡上盡可能的遠離該模組(10)的內部邊緣(23)之處。
  3. 根據申請專利範圍第1或2項之混合接觸-非接觸式智慧卡，其中該末端(45)係位在該內部接點(43)位於該模組內的部分的延伸中。
  4. 根據申請專利範圍第1或2項之混合接觸-非接觸式智慧卡，其中該接點(43)的第一組件層(43-1)的第二及後續的層係具有和該接點(44)的組件層相同的表面積。
  5. 根據申請專利範圍第1或2項之混合接觸-非接觸式智慧卡，其中該些接點(43、44)的厚度是在50μm和80μm之間。
  6. 根據申請專利範圍第1或2項之混合接觸-非接觸式智慧卡，其中該天線(41)以及該模組(10)係被圍繞在該卡主體中位於該支持層(40)的第一面上的聚氯乙烯(PVC)(61)層中，該第一面是其上印刷該天線的面。
  7. 根據申請專利範圍第6項之混合接觸-非接觸式智慧卡，其中該支持層(40)的第二面係被一聚酯(PET)層(62)所覆蓋。
  8. 根據申請專利範圍第6項之混合接觸-非接觸式智慧卡，其中該PVC層(61)係被一PET層(63)所覆蓋。
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TW201319951A (zh) 2013-05-16
FR2977958A1 (fr) 2013-01-18
JP2014521164A (ja) 2014-08-25
WO2013007897A2 (fr) 2013-01-17
CA2841742A1 (fr) 2013-01-17
CN103765447B (zh) 2017-02-15
CN103765447A (zh) 2014-04-30
CA2841742C (fr) 2019-10-22
WO2013007897A3 (fr) 2013-03-28
BR112014000667A2 (pt) 2017-02-14
KR20140053116A (ko) 2014-05-07
MX2014000449A (es) 2014-04-10
EP2732406A2 (fr) 2014-05-21
US20130026238A1 (en) 2013-01-31

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