TWI606767B - 於如回流錫焊之製程期間精確定位及對齊一組件 - Google Patents

於如回流錫焊之製程期間精確定位及對齊一組件 Download PDF

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TWI606767B
TWI606767B TW103113572A TW103113572A TWI606767B TW I606767 B TWI606767 B TW I606767B TW 103113572 A TW103113572 A TW 103113572A TW 103113572 A TW103113572 A TW 103113572A TW I606767 B TWI606767 B TW I606767B
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conductive layer
channels
component
solder
solder paste
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TW201503785A (zh
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彼得 立歐
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海特根微光學公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0272Adaptations for fluid transport, e.g. channels, holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
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    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
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    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
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    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/18Printed circuits structurally associated with non-printed electric components
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    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663Divided layout, i.e. conductors divided in two or more parts
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745Recess in conductor, e.g. in pad or in metallic substrate
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    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909Special local insulating pattern, e.g. as dam around component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0445Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2203/048Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
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    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0571Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

於如回流錫焊之製程期間精確定位及對齊一組件
本發明係關於在諸如回流錫焊之製程期間精確定位及對齊一組件。
表面安裝技術(SMT)係一電子元件組裝製程,其中電子組件引線藉由定位於一印刷電路板(PCB)表面上之個別墊連接之方式接合至該板。在一典型SMT製程中,使用一網版印刷機將焊料膏應用於該PCB,且經設計具有在個別墊上方之洞之模板控制對於該板之焊料應用。電子組件使用放置設備(例如,取放機)定位於該PCB上,且組件引線經放置成與該等焊料膏墊直接接觸。加熱該焊料膏(即,預合金焊料粉與一助熔劑載體之一混合物)直到其熔化(即,回流),且接著冷卻該焊料膏直到該焊料變硬且產生在該等組件引線與該PCB之間之一永久互連。此回流製程可在一焊料回流爐中執行。回流後,該經組裝之電路板可經清洗、檢測或組裝至一最終產品中。
大量SMT生產線使用自動化設備來執行該SMT製程之步驟。此等生產線可很快生產一完整之電路板,其中放置機可在該PCB上每小時定位多達數萬個組件。
在該PCB上放置及接合該等組件時通常需要高精確度,且在該等組件之尺寸非常小及該等組件靠近彼此放置之情況下可係尤其重要的。然而,由於藉由該取放機之放置及/或在該回流期間該組件之移 位之誤差,可出現定位及對齊誤差。舉例而言,因為該焊料在該回流期間變為液體,故該等組件會自其等所放置之該等位置移動。若一組件移位太遠而偏離其指定位置,則該器件會無法正確運行(例如,由於未充分連接至該板)或該器件會無法進一步被製造。因此,用於減少此等誤差之出現之技術係令人期望的。
揭示可單獨用於或組合用於改良在一PCB上組件之定位及/或對齊及/或用於減少在回流錫焊或其他製程期間發生之移位之量之各種技術。
如在下文更詳細描述,該等技術可包含於待放置一組件之一區域中之一PCB基板之一導電層(例如,一銅墊)之該表面中提供一或多個通道。該等通道可有助於在回流錫焊期間透過在該等通道中之該焊料膏之表面張力/毛細管力而減少或防止該組件之移位。例如,一影像處理系統亦可使用此等通道來促進精確定位及/或對齊該組件。該影像處理系統可單獨使用該等通道之該位置,或與其他特徵項(諸如,一焊料遮罩)或其他對齊標記組合使用來以高精度定位及/或對齊該組件。
舉例而言,在一個態樣中,一裝置包含一基板,該基板包含一絕緣基層及在其表面中具有一或多個通道之一導電層。一電子或光電組件藉由一焊料材料接合至該導電層,使得該組件至少部分安置於該導電層之表面中之一或多個通道上方。
各種實施方案包含一或多個下列特徵。舉例而言,一些焊料可係在一或多個通道中且一些焊料可係在該導電層之表面上。在一些情況下,該一或多個通道之各者係該導電層之該表面中之一窄槽。在一些實施方案中,該一或多個通道之各者實質上完全延伸穿過該導電層之厚度。
根據另一態樣,將一電子或光電組件接合至一印刷電路板基板之一方法包含在該印刷電路板基板之一導電層之一表面上沈積焊料膏。該導電層在其表面中包含一或多個通道,且一些焊料膏係在該等通道中且一些焊料膏係在該導電層之該表面上。該方法包含將該組件放置於該導電層上使之與該焊料膏接觸,使得該組件至少部分安置於在該導電層之表面中之一或多個通道上方。執行一回流錫焊製程以將該組件接合至該導電層。
在一些實施方案中,在此揭示內容中描述之技術,尤其對涉及使用回流錫焊將該組件接合至該基板之製造方法而言,可有助於改良在一PCB基板上之組件之定位及/或對齊。
自下列實施方式、附圖及申請專利範圍將易於明白其他態樣、特徵及優點。
20‧‧‧組件
22‧‧‧印刷電路板(PCB)基板
24‧‧‧絕緣基層
26‧‧‧導電層
28‧‧‧通道
30‧‧‧焊料膏
40‧‧‧設備
42‧‧‧影像處理系統
44‧‧‧控制器
50‧‧‧焊料遮罩
52‧‧‧對齊標記
54‧‧‧對齊標記
100‧‧‧方塊
102‧‧‧方塊
104‧‧‧方塊
106‧‧‧方塊
108‧‧‧方塊
110‧‧‧方塊
d‧‧‧通道28之深度
圖1係放置於一PCB基板之一第一實例上之一組件之一橫截面。
圖2係展示在該PCB基板上之該組件之一俯視圖。
圖3係該PCB基板之一俯視圖。
圖4係用於在該基板上定位及對齊組件之一系統之方塊圖。
圖5係展示一方法之一實例之一流程圖。
圖6係放置於一PCB基板之一第二實例上之一組件之一橫截面。
圖7係展示在圖6之該PCB基板上之該組件之一俯視圖。
圖8係圖6之該PCB基板之一俯視圖。
圖9係展示在一PCB基板之一第三實例上之一組件之一俯視圖。
圖10係展示在一PCB基板之一第四實例上之一組件之一俯視圖。
如在圖1至圖3中繪示,一組件20(例如,一光電模組或一積體電路)安裝於一印刷電路板(PCB)基板22上。基板22可包含由(例如)一陶 瓷或玻璃纖維材料組成之一絕緣基層24,及在基層上方之一導電層26。導電層26可形成為(例如)覆蓋基層24之部分或全部之一銅或其他金屬墊。組件20可使用一回流錫焊製程藉由焊料膏接合至導電層26之表面。
回流錫焊可包含一焊料材料(例如,鉛、錫、金或其他金屬合金)及助熔劑。助熔劑充當一流動劑或純化劑且可係(例如)一樹脂基、有機或無機材料。助熔劑容許焊料在組件與待接合組件之PCB基板之間輕易流動。
如在圖1至圖3中展示,一或多個通道28係提供於導電層26之上表面中(即,在其上安裝組件20之表面)。可具有窄槽之形狀之通道28可(例如)藉由光刻接著蝕刻導電層26而形成。通道28之深度(「d」)取決於實施方案。在圖1之繪示之實例中,通道28經蝕刻貫穿導電層26,其在此實例中具有一厚度約六十微米(μm)。在其他實施方案中,通道28可僅部分延伸穿過導電層26之厚度。
圖3展示在形成通道28之後(且在將組件20放置於導電層26上之前)之導電層26之一俯視圖。儘管繪示之實例展示在一十字形配置中之一對通道28,但可提供一不同數目之通道(例如,少至一個或甚至超過兩個)。此外,通道可提供為具有不同於一十字形圖樣之一配置。同樣地,通道不必形成為直、窄槽,但可(例如)具有一蛇形或其他形狀。較佳地,通道28應係足夠深,使得在回流錫焊製程期間,在通道中之焊料膏30之表面張力及毛細管力顯著減少或防止放置於導電層26上之組件20之移位。
通道28可取決於實施方案而用於一或多個功能。首先,通道28可用於當組件20放置於導電層26上時促進組件20之定位及/或對齊。如由圖4指示,組件20可(例如)使用放置設備40(諸如,一取放機)而定位於基板22上。一影像處理系統42接著可使用通道28及組件20之一影 像來判定組件在基板22上是否正確定位及對齊。舉例而言,組件20及通道28之一影像可與一預存影像或預存資料進行比較。比較之結果可提供至一控制器44,其接著可控制放置設備40以在執行回流錫焊製程之前調整在基板22上之組件20之位置及/或對齊。影像處理系統42可包含(例如)一影像擷取(例如,攝影機)模組、儲存影像之記憶體及用於影像處理之軟體。在一些實施方案中,軟體實施在擷取之(若干)影像中之特徵之光學識別。
除使用通道28來促進組件20之定位及/對齊外,通道28可有助於(例如)在回流錫焊製程期間減少或防止組件之位置之移位。如上文所述,焊料在回流製程期間變為液體,且此情形會使組件在基板上自放置組件之位置移動。通道28可有助於在回流錫焊期間透過在通道中之焊料膏之表面張力及毛細管力而減少或防止組件20之移動。
在一實例製程中,如由圖5指示,提供包含(例如)具有在其表面中之一或多個通道之一銅墊之一印刷電路板基板(方塊100)。接下來,將可包含焊料及助熔劑之一混合物之焊料膏沈積於通道附近之銅墊之表面上,使得一些焊料膏流入通道中且一些焊料膏保留在銅墊之表面上(方塊102)。影像處理系統接著獲得銅墊之表面以及通道之一影像且將影像與一預存之影像或資料進行比較,使得可執行組件之正確之x-y定位及對齊(方塊104)。可將來自影像處理系統之定位及對齊資訊提供至控制器及至取放機。接著基於定位及/對齊資訊(例如)藉由取放機將組件(例如,一光電模組或積體電路)放置於銅墊上方使之與焊料膏接觸(方塊106)。接下來,印刷電路板基板以及在其表面上之組件一起放置於用於焊料回流之一爐中(方塊108)。焊料回流製程將組件永久接合至印刷電路板基板。在回流之後,經組裝之電路板可經清洗、檢測或組裝至一最終產品中(方塊110)。上述方法之一應用之一實例係行動器件(諸如行動電話)之LED閃光燈。該方法亦可用於其 他應用。
在一些實施方案中,多個組件定位於印刷電路板基板22上且形成組裝電路板之部分。可對於各組件執行上述製程。此外,在一些實施方案中,圖5之製程係部分或完全自動化的。
在一些實施方案中,其他特徵項可經提供以促進評估組件20是否正確定位及/或對齊。舉例而言,如在圖6至圖8中展示,一焊料遮罩50可提供於導電層26上以圍繞用於放置組件20之一預定位置。焊料遮罩50可由(例如)一聚合物材料組成,且可藉由各種技術(例如,網版印刷(使用UV或熱固化)或光刻(例如,使用一光可成像焊料遮罩材料之液體或乾膜))而以高精度形成。焊料遮罩50之尺寸可稍大於組件20之尺寸,使得焊料遮罩在基板22之表面上界定待在其內放置組件之一區域。
焊料遮罩50可保護導電層26使之免受氧化且可有助於防止在基板22之表面上之緊密間隔之焊料墊之間形成焊料橋。另外,在一些實施方案中,由影像處理系統42使用焊料遮罩50來判定組件20之正確定位及對齊。如上文對於通道28描述,影像處理系統42可將焊料遮罩50之一影像與一預存影像或資料進行比較,使得可藉由取放機執行組件之正確x-y定位及對齊。影像處理系統42可為此目的單獨使用焊料遮罩50之一影像或與通道28之一影像組合使用。在藉由取放機在導電層26上放置組件20後,可對印刷電路基板以及在其表面上之組件執行焊料回流製程。
在一些實施方案中,額外之對齊標記可提供於導電層26之表面上。在圖9中繪示此等對齊標記52之一第一實例;在圖10中繪示對齊標記54之一第二實例。對齊標記亦可具有其他形狀,且可在導電層26之表面上提供不同數目之對齊標記。此外,對齊標記之位置可與在圖9及圖10中繪示之位置不同。對齊標記52、54可(例如)藉由一光刻製 程形成。對齊標記可(例如)由影像處理系統42單獨使用或與通道28及/或焊料遮罩50組合使用來判定組件20之正確定位及對齊。因此,影像處理系統42可將對齊標記52(或54)之一影像與一預存影像或資料進行比較,使得可藉由取放機執行組件之正確x-y定位及對齊。影像處理系統42可為此目的單獨使用對齊標記52(或54)之一影像或與通道28之一影像及/或焊料遮罩50之一影像組合使用。在藉由取放機在導電層26上放置組件20後,接著可對印刷電路基板以及在其表面上之(若干)組件執行焊料回流製程。
上文描述之技術可有助於改良在一PCB基板上之組件之定位及/或對齊,尤其對於涉及使用回流錫焊將組件接合至基板之製造方法。舉例而言,在一些實施方案中,由在回流錫焊期間組件之移位造成之相對位置誤差可維持在小於20微米且在一些情況下,可維持在明顯小於20微米(例如,相對於一鄰近組件之小於等於5微米之偏差,其中在鄰近組件之間之中心間距距離為大約數毫米(例如,2至4毫米))。
其他實施方案係在申請專利範圍之範疇中。
20‧‧‧組件
26‧‧‧導電層
28‧‧‧通道

Claims (17)

  1. 一種裝置,其包括:一基板,其包含在一絕緣基層上方之一導電層,其中該導電層包含在其表面中之一或多個通道,其中該一或多個通道之各者實質上完全延伸穿過該導電層之一厚度;及一電子或光電組件,其藉由一焊料材料接合至該導電層,其中該組件至少部分地安置於在該導電層之該表面中之該一或多個通道上方。
  2. 如請求項1之裝置,其中一些該焊料係在該一或多個通道中且一些該焊料係在該導電層之該表面上。
  3. 如前述請求項中任一項之裝置,其中該一或多個通道包含複數個通道。
  4. 如請求項1至2中任一項之裝置,其中該一或多個通道之各者係在該導電層之該表面中之一窄槽。
  5. 如請求項1至2中任一項之裝置,其中該導電層係覆蓋該基層之部分之一導電墊。
  6. 如請求項1至2中任一項之裝置,其中該導電墊包括銅。
  7. 如請求項1至2中任一項之裝置,其中該基層包括一陶瓷或玻璃纖維材料。
  8. 如請求項1至2中任一項之裝置,其中該一或多個通道延伸超越該組件之一佔據面積。
  9. 如請求項1至2中任一項之裝置,其進一步包含在該導電層之該表面上之一焊料遮罩,其中該焊料遮罩實質上圍繞該組件之一周長。
  10. 如請求項1至2中任一項之裝置,其進一步包含在該導電層之該 表面上之一或多個對齊特徵項,其中該等對齊特徵項係不同於該一或多個通道。
  11. 一種將一電子或光電組件接合至一印刷電路板基板之方法,該方法包括:將焊料膏沈積於該印刷電路板基板之一導電層之一表面上,其中該導電層包含在其表面中之一或多個通道且其中一些該焊料膏係在該等通道中且一些該焊料膏係在該導電層之該表面上;獲得包含該一或多個通道之該導電層之該表面之一影像;將該影像與一預存影像或資料進行比較;基於該影像與該預存影像或資料之該比較來判定該組件之一定位及/或對齊;基於該判定之定位及/或對齊,將該組件放置於該導電層上使之與該焊料膏接觸,使得該組件至少部分地安置於在該導電層之該表面中之該一或多個通道上方;及執行一回流錫焊製程以將該組件接合至該導電層。
  12. 如請求項11之方法,其中該一或多個通道包含複數個通道。
  13. 如請求項11至12中任一項之方法,其中在該一或多個通道中該焊料膏之存在在該回流錫焊製程期間防止或減少該組件之移動。
  14. 一種將一電子或光電組件接合至一印刷電路板基板之方法,該方法包含:將焊料膏沈積於該印刷電路板基板之一導電層之一表面上,其中在該導電層之該表面上存在一焊料遮罩,及其中該導電層包含在其表面中之一或多個通道且其中一些該焊料膏係在該等通道中且一些該焊料膏係在該導電層之該表面上獲得包含該焊料遮罩之該導電層之該表面之一影像; 將該影像與一預存影像或資料進行比較;基於該影像與該預存影像或資料之該比較來判定該組件之一定位及/或對齊;及基於該判定之定位及/或對齊將組件放置於該導電層之該表面上使得該組件接觸該焊料膏且使得該組件至少部分地安置於在該導電層之該表面中之該一或多個通道上方;及執行一回流錫焊製程以將該組件接合至該導電層。
  15. 一種將一電子或光電組件接合至一印刷電路板基板之方法,該方法包含:將焊料膏沈積於該印刷電路板基板之一導電層之一表面上,其中該導電層包含在其表面中之一或多個通道且其中一些該焊料膏係在該等通道中且一些該焊料膏係在該導電層之該表面上,及其中在該導電層之該表面上存在一或多個對齊特徵項,該等對齊特徵項不同於該等通道;獲得包含該一或多個對齊特徵項之該導電層之該表面之一影像;將該影像與一預存影像或資料進行比較;基於該影像與該預存影像或資料之該比較來判定該組件之一定位及/或對齊;基於該判定之定位及/或對齊將組件放置於該導電層之該表面上使得該組件接觸該焊料膏且使得該組件至少部分地安置於在該導電層之該表面中之該一或多個通道上方;及執行一回流錫焊製程以將該組件接合至該導電層。
  16. 一種裝置,其包括:一印刷電路板,其包含在一基層上之一導電墊,該基層係由一陶瓷或玻璃纖維材料組成,其中該導電墊包含在其表面中之 複數個通道;及一電子或光電組件,其藉由一焊料材料接合至該導電墊,其中該組件至少部分地安置於在該導電墊之該表面中之該等通道上方使得該等通道延伸超越該組件之一外周長,且其中一些該焊料係在該等通道中且一些該焊料安置於在該組件與該導電墊之該表面之間。
  17. 如請求項16項之裝置,其中該等通道之各者具有至少數十微米之一深度。
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US10667387B2 (en) 2020-05-26
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US20160057855A1 (en) 2016-02-25

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