TWI606110B - 異向導電性接著劑組成物、膜狀接著劑、連接結構體、連接結構體的製造方法以及半導體裝置 - Google Patents
異向導電性接著劑組成物、膜狀接著劑、連接結構體、連接結構體的製造方法以及半導體裝置 Download PDFInfo
- Publication number
- TWI606110B TWI606110B TW102137986A TW102137986A TWI606110B TW I606110 B TWI606110 B TW I606110B TW 102137986 A TW102137986 A TW 102137986A TW 102137986 A TW102137986 A TW 102137986A TW I606110 B TWI606110 B TW I606110B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive composition
- circuit
- group
- anisotropic conductive
- conductive adhesive
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012232971A JP6044261B2 (ja) | 2012-10-22 | 2012-10-22 | 異方導電性接着剤組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201422764A TW201422764A (zh) | 2014-06-16 |
TWI606110B true TWI606110B (zh) | 2017-11-21 |
Family
ID=50566041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102137986A TWI606110B (zh) | 2012-10-22 | 2013-10-22 | 異向導電性接著劑組成物、膜狀接著劑、連接結構體、連接結構體的製造方法以及半導體裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6044261B2 (ja) |
KR (1) | KR102185169B1 (ja) |
CN (1) | CN103773265B (ja) |
TW (1) | TWI606110B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101721732B1 (ko) * | 2014-07-25 | 2017-04-10 | 삼성에스디아이 주식회사 | 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 |
WO2016114279A1 (ja) * | 2015-01-14 | 2016-07-21 | 東洋紡株式会社 | 導電性銀ペースト |
EP3216837B1 (en) * | 2015-04-16 | 2020-07-15 | Furukawa Electric Co., Ltd. | Electrically conductive adhesive film and dicing die bonding film |
JP6672837B2 (ja) * | 2016-01-28 | 2020-03-25 | 日立化成株式会社 | 異方導電性接着剤組成物、フィルム状接着剤、接続構造体及び半導体装置 |
JP7273283B2 (ja) * | 2018-09-10 | 2023-05-15 | デクセリアルズ株式会社 | 接着剤組成物 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2706833B2 (ja) | 1990-02-14 | 1998-01-28 | 三新化学工業株式会社 | カチオン重合開始剤および重合性組成物 |
JPH06345726A (ja) | 1993-06-15 | 1994-12-20 | Nippon Soda Co Ltd | 新規スルホニウム塩化合物および重合開始剤 |
JP4228652B2 (ja) * | 1993-07-29 | 2009-02-25 | 日立化成工業株式会社 | 回路接続材料とその接続材料を用いた回路の接続方法 |
US7192991B2 (en) * | 2003-11-26 | 2007-03-20 | 3M Innovative Properties Company | Cationically curable composition |
JP5095208B2 (ja) * | 2004-05-28 | 2012-12-12 | サンアプロ株式会社 | 新規なオニウムおよび遷移金属錯体のフッ素化アルキルフルオロリン酸塩 |
KR101302778B1 (ko) * | 2007-08-02 | 2013-09-02 | 히타치가세이가부시끼가이샤 | 회로 접속 재료, 그것을 이용한 회로 부재의 접속 구조체 및 회로 부재의 접속 방법 |
JP5226562B2 (ja) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接合体及びその製造方法 |
JP5533568B2 (ja) * | 2009-11-05 | 2014-06-25 | 日立化成株式会社 | 熱重合系開始剤システム及び接着剤組成物 |
CN102686690A (zh) * | 2009-11-17 | 2012-09-19 | 日立化成工业株式会社 | 电路连接材料、使用其的连接结构体以及临时压接方法 |
JP2011111556A (ja) * | 2009-11-27 | 2011-06-09 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置 |
JP2011111557A (ja) * | 2009-11-27 | 2011-06-09 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置 |
JP5706651B2 (ja) * | 2010-09-13 | 2015-04-22 | サンアプロ株式会社 | フッ素化アルキルリン酸スルホニウム塩、酸発生剤及び硬化性組成物 |
JP5561199B2 (ja) * | 2011-02-17 | 2014-07-30 | 日立化成株式会社 | 接着剤組成物、回路接続材料、接続体及びその製造方法、並びに半導体装置 |
-
2012
- 2012-10-22 JP JP2012232971A patent/JP6044261B2/ja active Active
-
2013
- 2013-10-21 CN CN201310495087.XA patent/CN103773265B/zh active Active
- 2013-10-21 KR KR1020130125105A patent/KR102185169B1/ko active IP Right Grant
- 2013-10-22 TW TW102137986A patent/TWI606110B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201422764A (zh) | 2014-06-16 |
JP6044261B2 (ja) | 2016-12-14 |
CN103773265B (zh) | 2018-07-10 |
JP2014084357A (ja) | 2014-05-12 |
KR102185169B1 (ko) | 2020-12-01 |
CN103773265A (zh) | 2014-05-07 |
KR20140051085A (ko) | 2014-04-30 |
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