JP6672837B2 - 異方導電性接着剤組成物、フィルム状接着剤、接続構造体及び半導体装置 - Google Patents
異方導電性接着剤組成物、フィルム状接着剤、接続構造体及び半導体装置 Download PDFInfo
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- JP6672837B2 JP6672837B2 JP2016014586A JP2016014586A JP6672837B2 JP 6672837 B2 JP6672837 B2 JP 6672837B2 JP 2016014586 A JP2016014586 A JP 2016014586A JP 2016014586 A JP2016014586 A JP 2016014586A JP 6672837 B2 JP6672837 B2 JP 6672837B2
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- circuit
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- anisotropic conductive
- silsesquioxane
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- 230000001070 adhesive effect Effects 0.000 title claims description 149
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- 239000002245 particle Substances 0.000 claims description 38
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- 125000000524 functional group Chemical group 0.000 claims description 29
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- 239000000126 substance Substances 0.000 claims description 21
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 17
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- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 125000001153 fluoro group Chemical group F* 0.000 claims description 9
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- 238000000034 method Methods 0.000 claims description 8
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- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 3
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- JFZKOODUSFUFIZ-UHFFFAOYSA-N trifluoro phosphate Chemical compound FOP(=O)(OF)OF JFZKOODUSFUFIZ-UHFFFAOYSA-N 0.000 description 27
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- UQWLFOMXECTXNQ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)methylsulfonyl-trifluoromethane Chemical compound FC(F)(F)S(=O)(=O)[C-](S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F UQWLFOMXECTXNQ-UHFFFAOYSA-N 0.000 description 10
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- 125000003118 aryl group Chemical group 0.000 description 9
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
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- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
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- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
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- 125000005002 aryl methyl group Chemical group 0.000 description 3
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- GQWZJFMIUYDSOE-UHFFFAOYSA-N dimethyl(3-methylbut-2-enyl)sulfanium Chemical compound C[S+](C)CC=C(C)C GQWZJFMIUYDSOE-UHFFFAOYSA-N 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
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- 125000005843 halogen group Chemical group 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
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- 239000007788 liquid Substances 0.000 description 3
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- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 description 3
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- BGYBONWLWSMGNV-UHFFFAOYSA-N 1,4,7,10,13,16,19,22-octaoxacyclotetracosane Chemical compound C1COCCOCCOCCOCCOCCOCCOCCO1 BGYBONWLWSMGNV-UHFFFAOYSA-N 0.000 description 2
- MUEZFYHTEVXURH-UHFFFAOYSA-N 1-[4-(benzylsulfanylmethyl)phenyl]ethanone Chemical compound C1=CC(C(=O)C)=CC=C1CSCC1=CC=CC=C1 MUEZFYHTEVXURH-UHFFFAOYSA-N 0.000 description 2
- XQQZRZQVBFHBHL-UHFFFAOYSA-N 12-crown-4 Chemical compound C1COCCOCCOCCO1 XQQZRZQVBFHBHL-UHFFFAOYSA-N 0.000 description 2
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- DSFHXKRFDFROER-UHFFFAOYSA-N 2,5,8,11,14,17-hexaoxabicyclo[16.4.0]docosa-1(22),18,20-triene Chemical compound O1CCOCCOCCOCCOCCOC2=CC=CC=C21 DSFHXKRFDFROER-UHFFFAOYSA-N 0.000 description 2
- XJKRDAXPDGFSQU-UHFFFAOYSA-N 4-(naphthalen-1-ylmethylsulfanylmethyl)phenol Chemical compound C1=CC(O)=CC=C1CSCC1=CC=CC2=CC=CC=C12 XJKRDAXPDGFSQU-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
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- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
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- 125000003545 alkoxy group Chemical group 0.000 description 2
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- HWRZOQXZPYBNBG-UHFFFAOYSA-O benzyl-[(4-methoxyphenyl)methyl]sulfanium bis(trifluoromethylsulfonyl)methylsulfonyl-trifluoromethane Chemical compound [C-](S(=O)(=O)C(F)(F)F)(S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F.C1(=CC=CC=C1)C[SH+]CC1=CC=C(C=C1)OC HWRZOQXZPYBNBG-UHFFFAOYSA-O 0.000 description 2
- KFHQCRVFPNPTCL-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)methylsulfonyl-trifluoromethane dimethyl(3-phenylprop-2-enyl)sulfanium Chemical compound [C-](S(=O)(=O)C(F)(F)F)(S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F.C(C=CC1=CC=CC=C1)[S+](C)C KFHQCRVFPNPTCL-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical group C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- QWIQXQCJKZMBOC-UHFFFAOYSA-O (4-acetylphenyl)methyl-[(2-methylphenyl)methyl]sulfanium bis(trifluoromethylsulfonyl)methylsulfonyl-trifluoromethane Chemical compound [C-](S(=O)(=O)C(F)(F)F)(S(=O)(=O)C(F)(F)F)S(=O)(=O)C(F)(F)F.CC1=C(C=CC=C1)C[SH+]CC1=CC=C(C=C1)C(C)=O QWIQXQCJKZMBOC-UHFFFAOYSA-O 0.000 description 1
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- NOHNQBSUXAVDOP-UHFFFAOYSA-N 1-[4-[(2-methylphenyl)methylsulfanylmethyl]phenyl]ethanone Chemical compound C1=CC(C(=O)C)=CC=C1CSCC1=CC=CC=C1C NOHNQBSUXAVDOP-UHFFFAOYSA-N 0.000 description 1
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 description 1
- PNKYNQRBXNQDCH-UHFFFAOYSA-N 1-methoxy-4-[(1-methylcyclohexa-2,4-dien-1-yl)methylsulfanylmethyl]benzene Chemical compound CC1(CC=CC=C1)CSCC2=CC=C(C=C2)OC PNKYNQRBXNQDCH-UHFFFAOYSA-N 0.000 description 1
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
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- PQJZHMCWDKOPQG-UHFFFAOYSA-N 2-anilino-2-oxoacetic acid Chemical class OC(=O)C(=O)NC1=CC=CC=C1 PQJZHMCWDKOPQG-UHFFFAOYSA-N 0.000 description 1
- TZLVUWBGUNVFES-UHFFFAOYSA-N 2-ethyl-5-methylpyrazol-3-amine Chemical compound CCN1N=C(C)C=C1N TZLVUWBGUNVFES-UHFFFAOYSA-N 0.000 description 1
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- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000434 metal complex dye Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- 125000004170 methylsulfonyl group Chemical group [H]C([H])([H])S(*)(=O)=O 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000006502 nitrobenzyl group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000006678 phenoxycarbonyl group Chemical group 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002454 poly(glycidyl methacrylate) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical compound S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Description
[式(1)中、Raは水素、メチル基、アセチル基、メトキシカルボニル基、エトキシカルボニル基、ベンジルオキシカルボニル基、ベンゾイル基、フェノキシカルボニル基、9−フルオレニルメトキシカルボニル基のいずれかを、Rb、Rcは独立して水素、ハロゲン、C1〜C4のアルキル基のいずれかを、RdはC1〜C4のアルキル基を、Qはo−ニトロベンジル基、m−ニトロベンジル基、ジニトロベンジル基、トリニトロベンジル基、α−ナフチルメチル基、β−ナフチルメチル基のいずれかを示す。XはSbF6、AsF6、PF6、BF4のいずれかである。]
[式(2)中、Reは、水素原子、アルキル基、ハロゲン原子、カルボキシル基又はアルコキシカルボニル基を表し、Rfはアルキル基を表し、Rgは置換されていてもよいフェニル基又は置換されていてもよいナフチル基を表し、Xは、SbF6、AsF6、PF6又はBF4を表す。]
本実施形態に係る異方導電性接着剤組成物(以下、単に「接着剤組成物」ともいう。)は、(A)スルホニウム塩化合物(以下、場合により「(A)成分」という。)と、(B)カチオン重合性物質(以下、場合により「(B)成分」という。)と、(C)導電粒子(以下、場合により「(C)成分」という。)と、を含有し、上記(B)カチオン重合性物質が、カチオン重合性官能基を有するシルセスキオキサンを含む。また、本実施形態の異方導電性接着剤組成物は、更に(D)フィルム形成性ポリマー(以下、場合により「(D)成分」という。)を含有していてもよい。
[式中、A1及びA2は、それぞれ独立にアルキル基を示し、R6、R7及びR8は、それぞれ独立に、水素原子、アルキル基、又は置換若しくは未置換のアリール基を示し、Y−は上記と同義である。ただし、A1及びA2は一緒になって環を形成していてもよい。]
装置:東ソー株式会社製 GPC−8020
検出器:東ソー株式会社製 RI−8020
カラム:日立化成株式会社製 Gelpack GL−A−160−S+GL−A150
試料濃度:120mg/3mL
溶媒:テトラヒドロフラン
注入量:60μL
圧力:2.9MPa(30kgf/cm2)
流量:1.00mL/mim
図1は、フィルム状接着剤の一実施形態を示す模式断面図である。図1に示すフィルム状接着剤1は、接着剤成分5及び導電粒子7からなる、上述の接着剤組成物をフィルム状に形成したものである。このフィルム状接着剤1によれば、取り扱いが容易であり、被着体へ容易に設置することができ、接続作業を容易に行うことができる。
図2は、接続構造体の一実施形態を示す模式断面図である。図2に示すように、本実施形態の接続構造体は、相互に対向する第一の回路部材20及び第二の回路部材30を備えており、第一の回路部材20と第二の回路部材30との間には、これらを接続する回路接続部材10が設けられている。第一の回路部材20又は第二の回路部材30は無機材料から構成されていてもよい。また、接続部材との被着面の少なくとも一部が無機材料から構成されていてもよい。
次に、上述した接続構造体の製造方法について説明する。
次に、本実施形態に係る半導体装置について説明する。図4は、半導体装置の一実施形態を示す概略断面図である。図4に示すように、本実施形態の半導体装置2は、半導体素子50と、半導体素子の支持部材となる基板60とを備えており、半導体素子50及び基板60の間には、これらを電気的に接続する半導体素子接続部材80が設けられている。また、半導体素子接続部材80は基板60の主面60a上に積層され、半導体素子50は更にその半導体素子接続部材80上に積層されている。
(1)エポキシ基含有かご型シルセスキオキサン(GSQ)の準備
200mlナスフラスコ内にオクタ(ジメチルシリル)オクタシルセスキオキサン(米国ハイブリッドプラスチックス社製、商品名:SH1310)10.26g、アリルグリシジルエーテル9.78g(東京化成株式会社製)、トルエン100ml、白金触媒として1,3−ジビニル−1,1,3,3−テトラメチルジシロキサン白金(0)錯体のキシレン溶液(白金濃度:2質量%)(アルドリッチ株式会社製)30mgを採取した後、室温(20℃)で終夜(24hr)撹拌した。その後、エバポレーターでトルエンと未反応のアリルグリシジルエーテルを除去し、カチオン重合性官能基を有する光重合性かご型シルセスキオキサンであるエポキシ基含有かご型シルセスキオキサンを、薄黄色の液体として17.6gを得た。
攪拌機及び温度計を備えた反応器に、イソプロピルアルコール100ml、下記式(VII)で表される3−(3−エチル−3−オキセタンメトキシ)プロピルトリエトキシシラン(以下、「Ox−TRIES」という。)32.05g(0.1mol)、メチルトリエトキシシラン89.15g(0.5mol)及びヘキサメチルジシロキサン16.24g(0.1mmol)を仕込み、原料混合物とした。その後、原料混合物を25℃で攪拌しながら、1%塩酸40gを徐々に加えて、反応を開始した。反応の進行をGPCにより追跡し、原料のアルコキシシラン化合物がほぼ消失した時点(塩酸の添加開始から20時間後)で反応完結とした。次いで、減圧下で溶媒を留去し、カチオン重合性官能基を有する光重合性かご型シルセスキオキサンであるオキセタン基含有かご型シルセスキオキサンを、薄黄色の液体として70gを得た。
(A)成分としてSI−60(製品名、三新化学工業株式会社製、α−ナフチルメチル−4−ヒドロキシフェニルメチルスルホニウム ヘキサフルオロアンチモネート)を準備した。
(B)成分としてグリシジルエーテル型エポキシ化合物(製品名:YL980、ジャパンエポキシレジン株式会社製、ビスフェノールA型エポキシ樹脂)を準備した。また、4,4’−ビス[(3−エチル−3−オキセタニル)メチル]ビフェニル(製品名:ETERNACOLL OXBP、宇部興産株式会社製、ビフェニル型オキセタン樹脂)を準備した。
(C)成分として、ポリスチレンを核とする粒子の表面に、厚み0.2μmのニッケル層を設け、このニッケル層の外側に、厚み0.02μmの金層を設けた平均粒径3μm、比重2.5の導電粒子を作製して用いた。
(D)成分のフィルム形成性ポリマーとしてフェノキシ樹脂(製品名:YP−70、BPA/BPF共重合型、新日鉄住金化学株式会社製)及びフェノキシ樹脂(製品名:YP−50、BPA型、新日鉄住金化学株式会社製)を準備した。
[フィルム状接着剤の作製]
(A)成分、(B)成分(カチオン重合性シルセスキオキサンを含む)及び(D)成分を、表1に示す混合比(単位:質量部)で配合し、更に導電粒子を組成物全体積を基準として8体積%配合分散させて、導電性接着剤組成物を得た。得られた導電性接着剤組成物を、厚み40μmのPET樹脂フィルムに塗工装置を用いて塗布し、70℃で5分間の熱風乾燥を行うことによって、接着剤層の厚みが5μmのフィルム状導電性接着剤層を得た。また、(A)成分、(B)成分(カチオン重合性シルセスキオキサンを含む)及び(D)成分を、表1に示す混合比(単位:質量部)で配合し、厚み40μmのPET樹脂フィルムに塗工装置を用いて塗布し、70℃で5分間の熱風乾燥を行うことによって、接着剤層の厚みが10μmのフィルム状絶縁性接着剤層を得た。その後、フィルム状導電性接着剤層とフィルム状絶縁性接着剤層とを40℃に加熱してホットロールラミネータで貼り合わせ、フィルム状接着剤(異方導電性フィルム)を得た。
ガラス基板(コーニング#1737、外形38mm×28mm、厚さ0.5mm、表面にITO(酸化インジウム錫)配線パターン(パターン幅50μm、ピッチ50μm)を有するもの)に、2mm×20mmの大きさで実施例1〜4及び比較例1〜2の各フィルム状接着剤を、PET樹脂フィルムから転写した。ICチップ(外形1.7mm×17.2mm、厚さ0.55mm、バンプの大きさ50μm×50μm、バンプのピッチ50μm)を表2に示す実装条件(温度と時間)で、80MPa(バンプ面積換算)の荷重をかけて加熱加圧して実装した。これにより接続構造体を得た。
上記のようにして作製した接続構造体の隣接回路間の抵抗値(14端子測定した中の最大値)を測定し、接続信頼性を評価した。得られた結果を表2に示す。また、保存安定性を評価するために、恒温恒湿槽(85℃、85%RH)に250時間放置した後、接続構造体の隣接回路間の抵抗値(14端子測定した中の最大値)を測定した。恒温恒湿槽での保存安定性試験後の測定結果も表2に示す。
Claims (10)
- (A)スルホニウム塩化合物と、(B)カチオン重合性物質と、(C)導電粒子と、を含有し、前記(B)カチオン重合性物質が、カチオン重合性官能基を有するシルセスキオキサンを含み、
前記(B)成分が、前記カチオン重合性官能基を有するシルセスキオキサンのほかに、エポキシ化合物、及び下記一般式(V)で表されるオキセタン化合物を更に含む、異方導電性接着剤組成物。
[式中、R 9 は水素原子、フッ素原子又は1価の炭化水素基を示し、R 10 は水素原子、n価の脂肪族炭化水素基又はn価の芳香族炭化水素基を示し、nは1〜6の整数を示す。ただし、R 10 が水素原子のときnは1である。nが2以上の整数であるとき、R 10 に結合する複数の酸素原子は、互いにR 10 の同一炭素原子に結合していてもよく、R 10 の異なる炭素原子に結合していてもよい。] - 前記カチオン重合性官能基を有するシルセスキオキサンが、かご型シルセスキオキサンである、請求項1に記載の異方導電性接着剤組成物。
- 前記カチオン重合性官能基を有するシルセスキオキサンが、エポキシ基、オキセタン基及びビニルエーテル基からなる群より選ばれる少なくとも一種を有する、請求項1又は2に記載の異方導電性接着剤組成物。
- 前記カチオン重合性官能基を有するシルセスキオキサンは、エポキシ基を有するシルセスキオキサン、及び、オキセタン基を有するシルセスキオキサンを含む、請求項1〜3のいずれか一項に記載の異方導電性接着剤組成物。
- 前記(B)成分は、前記カチオン重合性官能基を有するシルセスキオキサンのほかに、ビニルエーテル化合物を更に含有する、請求項1〜4のいずれか一項に記載の異方導電性接着剤組成物。
- 更に(D)フィルム形成性ポリマーを含有する、請求項1〜5のいずれか一項に記載の異方導電性接着剤組成物。
- 回路接続用である、請求項1〜6のいずれか一項に記載の異方導電性接着剤組成物。
- 請求項1〜7のいずれか一項に記載の異方導電性接着剤組成物をフィルム状に形成してなる、フィルム状接着剤。
- 第一の回路電極を有する第一の回路部材と、第二の回路電極を有する第二の回路部材と、前記第一の回路部材及び前記第二の回路部材の間に配置され、前記第一の回路電極と前記第二の回路電極とを電気的に接続する回路接続部材と、を備え、
前記回路接続部材が、請求項1〜7のいずれか一項に記載の異方導電性接着剤組成物の硬化物、又は請求項8に記載のフィルム状接着剤の硬化物を含む、接続構造体。 - 半導体素子と、回路パターンを有する基板と、前記半導体素子及び前記基板の間に配置され、前記半導体素子と前記回路パターンとを電気的に接続する半導体素子接続部材と、を備え、
前記半導体素子接続部材が、請求項1〜7のいずれか一項に記載の異方導電性接着剤組成物の硬化物、又は請求項8に記載のフィルム状接着剤の硬化物を含む、半導体装置。
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