TWI600069B - 晶圓加工用膠帶 - Google Patents
晶圓加工用膠帶 Download PDFInfo
- Publication number
- TWI600069B TWI600069B TW104140168A TW104140168A TWI600069B TW I600069 B TWI600069 B TW I600069B TW 104140168 A TW104140168 A TW 104140168A TW 104140168 A TW104140168 A TW 104140168A TW I600069 B TWI600069 B TW I600069B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- tape
- adhesive layer
- support member
- wafer processing
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014246306A JP6406999B2 (ja) | 2014-12-04 | 2014-12-04 | ウェハ加工用テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201633386A TW201633386A (zh) | 2016-09-16 |
TWI600069B true TWI600069B (zh) | 2017-09-21 |
Family
ID=56124828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104140168A TWI600069B (zh) | 2014-12-04 | 2015-12-01 | 晶圓加工用膠帶 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6406999B2 (ko) |
KR (1) | KR101847246B1 (ko) |
CN (1) | CN105694743B (ko) |
TW (1) | TWI600069B (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116209237B (zh) * | 2022-12-29 | 2023-10-27 | 东莞市富颖电子材料有限公司 | 一种元器件点胶贴及其制备工艺 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04360653A (ja) | 1991-06-06 | 1992-12-14 | Tochigi Pref Gov | 麻の実の多価不飽和脂肪酸高含有鶏卵の生産方法 |
JP4360653B2 (ja) * | 2007-09-14 | 2009-11-11 | 古河電気工業株式会社 | ウエハ加工用テープ |
EP2192611B9 (en) * | 2007-09-14 | 2012-08-15 | Furukawa Electric Co., Ltd. | Wafer processing tape |
JP2009224628A (ja) * | 2008-03-18 | 2009-10-01 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
JP5737185B2 (ja) * | 2009-11-13 | 2015-06-17 | 日立化成株式会社 | 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ |
JP4991921B2 (ja) * | 2010-09-06 | 2012-08-08 | 日東電工株式会社 | 半導体装置用フィルム、及び、半導体装置 |
JP4976532B2 (ja) * | 2010-09-06 | 2012-07-18 | 日東電工株式会社 | 半導体装置用フィルム |
JP2012082285A (ja) * | 2010-10-08 | 2012-04-26 | Hitachi Chemical Co Ltd | 接着シート |
JP5957795B2 (ja) * | 2011-02-07 | 2016-07-27 | 日立化成株式会社 | 接着シートロール及び半導体装置 |
JP5733049B2 (ja) * | 2011-06-23 | 2015-06-10 | 日立化成株式会社 | 接着シート、接着シートの製造方法、接着シートロール、半導体装置の製造方法、及び半導体装置 |
JP5889026B2 (ja) * | 2012-02-10 | 2016-03-22 | 古河電気工業株式会社 | ウエハ加工用テープ |
-
2014
- 2014-12-04 JP JP2014246306A patent/JP6406999B2/ja active Active
-
2015
- 2015-12-01 TW TW104140168A patent/TWI600069B/zh active
- 2015-12-02 KR KR1020150170629A patent/KR101847246B1/ko active IP Right Grant
- 2015-12-02 CN CN201510869333.2A patent/CN105694743B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201633386A (zh) | 2016-09-16 |
CN105694743A (zh) | 2016-06-22 |
JP2016111155A (ja) | 2016-06-20 |
KR20160067758A (ko) | 2016-06-14 |
KR101847246B1 (ko) | 2018-04-09 |
CN105694743B (zh) | 2019-03-15 |
JP6406999B2 (ja) | 2018-10-17 |
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