TWI600069B - 晶圓加工用膠帶 - Google Patents

晶圓加工用膠帶 Download PDF

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Publication number
TWI600069B
TWI600069B TW104140168A TW104140168A TWI600069B TW I600069 B TWI600069 B TW I600069B TW 104140168 A TW104140168 A TW 104140168A TW 104140168 A TW104140168 A TW 104140168A TW I600069 B TWI600069 B TW I600069B
Authority
TW
Taiwan
Prior art keywords
film
tape
adhesive layer
support member
wafer processing
Prior art date
Application number
TW104140168A
Other languages
English (en)
Chinese (zh)
Other versions
TW201633386A (zh
Inventor
青山真沙美
大田郷史
木村和寛
佐久間登
杉山二朗
Original Assignee
古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電氣工業股份有限公司 filed Critical 古河電氣工業股份有限公司
Publication of TW201633386A publication Critical patent/TW201633386A/zh
Application granted granted Critical
Publication of TWI600069B publication Critical patent/TWI600069B/zh

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  • Engineering & Computer Science (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW104140168A 2014-12-04 2015-12-01 晶圓加工用膠帶 TWI600069B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014246306A JP6406999B2 (ja) 2014-12-04 2014-12-04 ウェハ加工用テープ

Publications (2)

Publication Number Publication Date
TW201633386A TW201633386A (zh) 2016-09-16
TWI600069B true TWI600069B (zh) 2017-09-21

Family

ID=56124828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104140168A TWI600069B (zh) 2014-12-04 2015-12-01 晶圓加工用膠帶

Country Status (4)

Country Link
JP (1) JP6406999B2 (ko)
KR (1) KR101847246B1 (ko)
CN (1) CN105694743B (ko)
TW (1) TWI600069B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116209237B (zh) * 2022-12-29 2023-10-27 东莞市富颖电子材料有限公司 一种元器件点胶贴及其制备工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04360653A (ja) 1991-06-06 1992-12-14 Tochigi Pref Gov 麻の実の多価不飽和脂肪酸高含有鶏卵の生産方法
JP4360653B2 (ja) * 2007-09-14 2009-11-11 古河電気工業株式会社 ウエハ加工用テープ
EP2192611B9 (en) * 2007-09-14 2012-08-15 Furukawa Electric Co., Ltd. Wafer processing tape
JP2009224628A (ja) * 2008-03-18 2009-10-01 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP5737185B2 (ja) * 2009-11-13 2015-06-17 日立化成株式会社 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ
JP4991921B2 (ja) * 2010-09-06 2012-08-08 日東電工株式会社 半導体装置用フィルム、及び、半導体装置
JP4976532B2 (ja) * 2010-09-06 2012-07-18 日東電工株式会社 半導体装置用フィルム
JP2012082285A (ja) * 2010-10-08 2012-04-26 Hitachi Chemical Co Ltd 接着シート
JP5957795B2 (ja) * 2011-02-07 2016-07-27 日立化成株式会社 接着シートロール及び半導体装置
JP5733049B2 (ja) * 2011-06-23 2015-06-10 日立化成株式会社 接着シート、接着シートの製造方法、接着シートロール、半導体装置の製造方法、及び半導体装置
JP5889026B2 (ja) * 2012-02-10 2016-03-22 古河電気工業株式会社 ウエハ加工用テープ

Also Published As

Publication number Publication date
TW201633386A (zh) 2016-09-16
CN105694743A (zh) 2016-06-22
JP2016111155A (ja) 2016-06-20
KR20160067758A (ko) 2016-06-14
KR101847246B1 (ko) 2018-04-09
CN105694743B (zh) 2019-03-15
JP6406999B2 (ja) 2018-10-17

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