TWI599290B - Printed circuit board with embeded electronic component and method for manufacturing same - Google Patents
Printed circuit board with embeded electronic component and method for manufacturing same Download PDFInfo
- Publication number
- TWI599290B TWI599290B TW103138088A TW103138088A TWI599290B TW I599290 B TWI599290 B TW I599290B TW 103138088 A TW103138088 A TW 103138088A TW 103138088 A TW103138088 A TW 103138088A TW I599290 B TWI599290 B TW I599290B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- circuit board
- layer
- film
- electronic component
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
本發明涉及電路板製作領域,尤其涉及一種具有內埋元件的電路板及其製作方法。 The present invention relates to the field of circuit board manufacturing, and in particular to a circuit board having embedded components and a method of fabricating the same.
為了要達到輕薄短小的目的,各製造商開始致力於將原來焊接於多層電路板表面的電子元件改為內埋於多層電路板內部,以此來增加電路板表面的佈線面積從而縮小電路板尺寸並減少其重量和厚度,該電子元件可以為主動或被動元件。現有的內埋於多層電路板在貼裝內埋式電子元件時,需要通過過回焊將錫膏電子元件焊接於電路板內,因回焊爐內溫度較高,容易造成電路板變形,從而影響電路板品質。 In order to achieve the purpose of lightness and thinness, manufacturers have begun to change the electronic components originally soldered on the surface of the multilayer circuit board into the inside of the multilayer circuit board, thereby increasing the wiring area on the surface of the circuit board and reducing the size of the circuit board. And reducing its weight and thickness, the electronic component can be an active or passive component. When the embedded multilayer electronic circuit board is embedded in the embedded electronic component, the solder paste electronic component needs to be soldered into the circuit board by over-reflow soldering, and the temperature of the soldering furnace is high, which is likely to cause deformation of the circuit board. Affect the quality of the board.
因此,有必要提供一種不需要過回焊且品質較高的具有內埋元件的電路板及其製作方法。 Therefore, it is necessary to provide a circuit board having buried components that does not require over-reflow and has a high quality and a method of fabricating the same.
一種具有內埋元件的多層電路板的製作方法,包括步驟:提供芯層電路板,在所述芯層電路板上形成貫通的安裝孔;提供電子零件,在所述電子零件的電極上形成複數導電凸塊,每個所述導電凸塊在自所述電極向遠離電極的方向上的截面面積逐漸減小;將形成導電凸塊後的所述電子零件收容於所述芯層 電路板的安裝孔內,並在所述芯層電路板兩側均依次疊合膠片及銅箔;壓合使所述芯層電路板與每個所述銅箔通過一個所述膠片相黏結,並使每個所述導電凸塊貫穿一所述膠片並與與所述膠片相貼的所述銅箔相接觸並相電連接,從而形成電路基板;將每個所述銅箔製作形成導電線路層,使所述電子零件與所述導電線路層相電連接,從而形成所述具有內埋元件的多層電路板。 A manufacturing method of a multilayer circuit board having a buried component, comprising the steps of: providing a core circuit board, forming a through hole on the core circuit board; providing an electronic component, forming a plurality of electrodes on the electrode of the electronic component Conductive bumps, each of the conductive bumps gradually decreasing in cross-sectional area from the electrode toward the electrode; the electronic component after forming the conductive bumps is received in the core layer a film and a copper foil are sequentially laminated on the mounting holes of the circuit board, and the core circuit board is bonded to each of the copper foils through one of the films. And each of the conductive bumps is penetrated through a film and is in contact with and electrically connected to the copper foil attached to the film to form a circuit substrate; each of the copper foils is formed to form a conductive line a layer electrically connecting the electronic component to the conductive circuit layer to form the multilayer circuit board having the embedded component.
一種具有內埋元件的多層電路板,包括一芯層電路板、一電子零件、第一膠片、第二膠片及導電線路層。所述芯層電路板上形成有貫通的安裝孔。所述電子零件收容於所述安裝孔內。複數導電凸塊形成於所述電子零件的電極上,每個所述導電凸塊在自所述電極向遠離電極的方向上的截面面積逐漸減小。所述第一膠片及第二膠片分別形成於所述芯層電路板的相對兩側,複數所述導電凸塊貫穿所述第一膠片。所述導電線路層分別形成於所述第一膠片及所述第二膠片表面。貫穿所述第一膠片的所述導電凸塊與與所述第一膠片相貼的導電線路層相接觸並相電連接。 A multilayer circuit board having embedded components, comprising a core circuit board, an electronic component, a first film, a second film, and a conductive circuit layer. A through hole is formed in the core layer circuit board. The electronic component is housed in the mounting hole. A plurality of conductive bumps are formed on the electrodes of the electronic component, and a cross-sectional area of each of the conductive bumps in a direction away from the electrodes toward the electrodes is gradually reduced. The first film and the second film are respectively formed on opposite sides of the core circuit board, and the plurality of conductive bumps penetrate the first film. The conductive circuit layers are formed on the first film and the second film surface, respectively. The conductive bumps penetrating the first film are in contact with and electrically connected to a conductive circuit layer attached to the first film.
相較於先前技術,本發明實施例本發明實施例的具有內埋元件的多層電路板及製作方法通過在電子零件上形成具有尖端的導電凸塊,使導電凸塊刺穿膠片與導電線路層電連接,從而將電子零件內埋,並且不需要過回焊,可以減少因回焊造成的電路板翹曲、漲縮不匹配等問題,從而提高電路板製作良率。 Compared with the prior art, the multi-layer circuit board with embedded components of the embodiment of the present invention and the manufacturing method thereof enable the conductive bump to pierce the film and the conductive circuit layer by forming a conductive bump having a tip on the electronic component. The electrical connection allows the electronic components to be buried, and does not require over-reflow, which can reduce the problem of circuit board warpage, shrinkage mismatch, etc. caused by reflow, thereby improving the board production yield.
100‧‧‧具有內埋元件的多層電路板 100‧‧‧Multilayer boards with embedded components
10‧‧‧芯層電路板 10‧‧‧core circuit board
17‧‧‧電子零件 17‧‧‧Electronic parts
181‧‧‧第一膠片 181‧‧‧first film
191‧‧‧第二膠片 191‧‧‧second film
22‧‧‧第三導電線路層 22‧‧‧ Third conductive circuit layer
23‧‧‧第四導電線路層 23‧‧‧fourth conductive layer
11‧‧‧基材層 11‧‧‧Substrate layer
121‧‧‧第一導電線路層 121‧‧‧First conductive circuit layer
131‧‧‧第二導電線路層 131‧‧‧Second conductive circuit layer
141‧‧‧導電通孔 141‧‧‧ conductive through holes
16‧‧‧安裝孔 16‧‧‧Installation holes
173‧‧‧主體部 173‧‧‧ Main body
171‧‧‧電極 171‧‧‧electrode
1711‧‧‧上表面 1711‧‧‧ upper surface
1712‧‧‧下表面 1712‧‧‧ lower surface
172‧‧‧導電凸塊 172‧‧‧Electrical bumps
24‧‧‧第一導電盲孔 24‧‧‧First conductive blind hole
25‧‧‧第二導電盲孔 25‧‧‧Second conductive blind hole
27‧‧‧第三膠片 27‧‧‧ Third film
28‧‧‧第五導電線路層 28‧‧‧ Fifth conductive circuit layer
29‧‧‧第四膠片 29‧‧‧Fourth film
30‧‧‧第六導電線路層 30‧‧‧ sixth conductive circuit layer
12‧‧‧第一導電層 12‧‧‧First conductive layer
13‧‧‧第二導電層 13‧‧‧Second conductive layer
14‧‧‧線路區 14‧‧‧Line area
15‧‧‧零件安裝區 15‧‧‧Parts installation area
18‧‧‧第一增層材料 18‧‧‧First layered material
19‧‧‧第二增層材料 19‧‧‧Second layered material
20‧‧‧疊合結構 20‧‧‧Multilayer structure
182‧‧‧第一銅箔 182‧‧‧First copper foil
192‧‧‧第二銅箔 192‧‧‧second copper foil
26‧‧‧四層的具有內埋元件的電路板 26‧‧‧Four-layer circuit board with embedded components
31‧‧‧第三導電盲孔 31‧‧‧ Third conductive blind hole
32‧‧‧第四導電盲孔 32‧‧‧4th conductive blind hole
圖1係本發明第一實施例提供的具有內埋元件的多層電路板的剖視圖。 1 is a cross-sectional view of a multilayer circuit board having embedded components according to a first embodiment of the present invention.
圖2係本發明第二實施例提供芯層電路板的剖視圖。 2 is a cross-sectional view showing a core layer circuit board according to a second embodiment of the present invention.
圖3係將圖2中的芯層電路板上形成安裝孔後的剖視圖。 Fig. 3 is a cross-sectional view showing the mounting hole formed on the core circuit board of Fig. 2.
圖4係在本發明第二實施例提供電子零件上形成導電凸塊後的剖視圖。 4 is a cross-sectional view showing the formation of conductive bumps on an electronic component in a second embodiment of the present invention.
圖5係將圖4的電子零件收容於圖3的芯層電路板中的安裝孔內並在芯層電路板兩側疊合增層材料形成疊合結構後的剖視圖。 5 is a cross-sectional view showing the electronic component of FIG. 4 housed in a mounting hole in the core layer circuit board of FIG. 3 and laminated on the both sides of the core circuit board to form a stacked structure.
圖6係將圖5中疊合結構壓合形成電路基板後剖視圖。 Fig. 6 is a cross-sectional view showing the laminated structure of Fig. 5 pressed to form a circuit substrate.
圖7係將圖6中的銅箔製作形成導電線路層得到四層的具有內埋元件的電路板後的剖視圖。 Fig. 7 is a cross-sectional view showing the copper foil of Fig. 6 after forming a conductive circuit layer to obtain four layers of a circuit board having embedded elements.
請參閱圖1,本發明第一實施例提供一種具有內埋元件的多層電路板100,包括:一芯層電路板10、收容於芯層電路板10內的電子零件17、形成與芯層電路板10兩側的第一膠片181及第二膠片191、形成於第一膠片181側的第三導電線路層22、以及形成於第二膠片191側的第四導電線路層23。 Referring to FIG. 1, a first embodiment of the present invention provides a multilayer circuit board 100 having embedded components, including: a core circuit board 10, electronic components 17 received in the core circuit board 10, and a core circuit. A first film 181 and a second film 191 on both sides of the board 10, a third conductive wiring layer 22 formed on the first film 181 side, and a fourth conductive wiring layer 23 formed on the second film 191 side.
所述芯層電路板10包括基材層11,以及設置於基材層11相對兩側的第一導電線路層121及第二導電線路層131,一導電通孔141電連接所述第一導電線路層121及所述第二導電線路層131,一安裝孔16貫通所述芯層電路板10。 The core layer circuit board 10 includes a substrate layer 11 and a first conductive circuit layer 121 and a second conductive circuit layer 131 disposed on opposite sides of the substrate layer 11, and a conductive via 141 electrically connects the first conductive layer The wiring layer 121 and the second conductive wiring layer 131 have a mounting hole 16 penetrating the core circuit board 10.
所述電子零件17收容於所述安裝孔16內。所述電子零件17包括主體部173及電極171,所述電子零件17的厚度等於或略小於所述安裝孔16的深度。所述主體部173大致呈長方形,所述兩個電極171及形成於所述主體部173長方向的兩端,所述兩個電極171均包括一上表面1711及與所述上表面1711相對的下表面1712,兩個所述上表面1711位於所述電子零件17的同一側,兩個所述下表面1712位於所述電子零件17的相對另一側,所述兩個電極171的上表面1711及下表面1712上形成有導電凸塊172。所述導電凸塊172突出的延伸方向與所述芯層電路板10相垂直。所述導電凸塊172在自所述電極171向遠離電極171的方向上截面面積逐漸減小。 The electronic component 17 is received in the mounting hole 16 . The electronic component 17 includes a body portion 173 and an electrode 171, and the thickness of the electronic component 17 is equal to or slightly smaller than the depth of the mounting hole 16. The main body portion 173 is substantially rectangular, and the two electrodes 171 are formed at both ends of the main body portion 173 in the longitudinal direction. The two electrodes 171 each include an upper surface 1711 and opposite the upper surface 1711. a lower surface 1712, two of the upper surfaces 1711 are located on the same side of the electronic component 17, two lower surfaces 1712 are located on opposite sides of the electronic component 17, and an upper surface 1711 of the two electrodes 171 Conductive bumps 172 are formed on the lower surface 1712. The conductive bumps 172 protrude in a direction perpendicular to the core circuit board 10. The conductive bump 172 gradually decreases in cross-sectional area from the electrode 171 in a direction away from the electrode 171.
所述第一膠片181內形成有至少一個第一導電盲孔24,所述第二膠片191內形成有至少一個第二導電盲孔25,所述第一導電盲孔24電連接所述第一導電線路層121與所述第三導電線路層22,所述第二導電盲孔25電連接所述第二導電線路層131與所述第四導電線路層23。所述電子零件17兩側的的導電凸塊172分別貫穿所述第一及第二膠片181、191,並分別與所述第三及第四導電線路層22、23相電連接。 At least one first conductive blind hole 24 is formed in the first film 181, at least one second conductive blind hole 25 is formed in the second film 191, and the first conductive blind hole 24 is electrically connected to the first The conductive circuit layer 121 and the third conductive circuit layer 22 are electrically connected to the second conductive circuit layer 131 and the fourth conductive circuit layer 23. The conductive bumps 172 on both sides of the electronic component 17 respectively penetrate the first and second films 181 and 191 and are electrically connected to the third and fourth conductive circuit layers 22 and 23, respectively.
所述第三導電線路層22側還依次形成有第三膠片27及第五導電線路層28,所述第四導電線路層23側還依次形成有第四膠片29及第六導電線路層30。所述第三膠片27及第四膠片29內分別形成有第三導電盲孔31及第四導電盲孔32,所述第三導電盲孔31電連接所述第三導電線路層22與所述第五導電線路層28,所述第四導電盲孔32電連接所述第四導電線路層23與所述第六導電線路層30。 A third film 27 and a fifth conductive circuit layer 28 are sequentially formed on the third conductive circuit layer 22 side, and a fourth film 29 and a sixth conductive circuit layer 30 are sequentially formed on the fourth conductive circuit layer 23 side. A third conductive blind hole 31 and a fourth conductive blind hole 32 are formed in the third film 27 and the fourth film 29, and the third conductive blind hole 31 electrically connects the third conductive circuit layer 22 with the The fifth conductive circuit layer 28 electrically connects the fourth conductive circuit layer 23 and the sixth conductive circuit layer 30.
請一併參閱圖2-7,本發明第二實施例提供一種上述具有內埋元件的多層電路板100的製作方法,包括如下步驟: Referring to FIG. 2-7 together, a second embodiment of the present invention provides a method for fabricating the above-described multilayer circuit board 100 having embedded components, including the following steps:
第一步,請參閱圖2,提供一芯層電路板10,所述芯層電路板10包括基材層11,以及設置於基材層11相對兩側的第一導電層12及第二導電層13。 In the first step, referring to FIG. 2, a core circuit board 10 is provided. The core circuit board 10 includes a substrate layer 11, and first conductive layers 12 and second conductive electrodes disposed on opposite sides of the substrate layer 11. Layer 13.
本實施例中,以所述芯層電路板10的一個電路板單元為例進行說明,所述芯層電路板10劃分出一線路區14及一零件安裝區15。所述零件安裝區15的尺寸與待安裝的零件的尺寸大致相同。所述線路區14內的所述第一導電層12及第二導電層13均為形成有導電線路的導電線路層,定義線路區14內的所述第一導電層12及第二導電層13分別為第一導電線路層121及第二導電線路層131。所述芯層電路板10在所述線路區14內還形成有至少一個導電通孔141,所述導電通孔141電連接所述第一導電線路層121及所述第二導電線路層131。所述零件安裝區15內的所述第一導電層12及第二導電層13並未形成導電線路,且分別與線路區14內的第一導電層12及第二導電層13相斷開。在另一實施例中,所述零件安裝區15內的 所述第一導電層12及第二導電層13也可以不與所述線路區14內的第一導電層12及第二導電層13相斷開。在其他實施例中,所述零件安裝區15內也可以不形成所述第一導電層12及第二導電層13。 In this embodiment, a circuit board unit of the core circuit board 10 is taken as an example. The core circuit board 10 defines a line area 14 and a component mounting area 15. The part mounting area 15 is approximately the same size as the part to be mounted. The first conductive layer 12 and the second conductive layer 13 in the line region 14 are all conductive circuit layers formed with conductive lines, and the first conductive layer 12 and the second conductive layer 13 in the line region 14 are defined. The first conductive circuit layer 121 and the second conductive circuit layer 131 are respectively. The core circuit board 10 is further formed with at least one conductive via 141 in the line region 14 , and the conductive via 141 electrically connects the first conductive wiring layer 121 and the second conductive wiring layer 131 . The first conductive layer 12 and the second conductive layer 13 in the component mounting region 15 do not form conductive lines, and are disconnected from the first conductive layer 12 and the second conductive layer 13 in the wiring region 14, respectively. In another embodiment, within the part mounting area 15 The first conductive layer 12 and the second conductive layer 13 may not be disconnected from the first conductive layer 12 and the second conductive layer 13 in the line region 14. In other embodiments, the first conductive layer 12 and the second conductive layer 13 may not be formed in the component mounting region 15 .
本實施例中,第一導電層12及第二導電層13的材質均為銅。所述本實施例中,所述基材層11為絕緣層,即所述芯層電路板10為雙面電路板。在其他實施例中,所述基材層11也可以包括多層絕緣層及導電線路層,此時,絕緣層與導電線路層交替排列,且基材層11最外兩側為絕緣層,也即,在其他實施例中,所述芯層電路板10也可以為多層電路板。在其他實施例中,所述零件安裝區15的數量也可以為複數;所述芯層電路板10可以包括複數電路板單元。 In this embodiment, the materials of the first conductive layer 12 and the second conductive layer 13 are all copper. In the embodiment, the substrate layer 11 is an insulating layer, that is, the core circuit board 10 is a double-sided circuit board. In other embodiments, the substrate layer 11 may also include a plurality of insulating layers and conductive circuit layers. In this case, the insulating layer and the conductive circuit layer are alternately arranged, and the outermost sides of the substrate layer 11 are insulating layers, that is, In other embodiments, the core circuit board 10 can also be a multi-layer circuit board. In other embodiments, the number of component mounting regions 15 may also be plural; the core circuit board 10 may include a plurality of circuit board units.
第二步,請一併參閱圖3,去除所述零件安裝區15內的所述芯層電路板10,從而在所述芯層電路板10上形成一安裝孔16。 In the second step, referring to FIG. 3, the core circuit board 10 in the component mounting area 15 is removed, thereby forming a mounting hole 16 in the core circuit board 10.
本實施例中,通過鐳射切割的方式沿所述線路區14與所述零件安裝區15的交界線切割所述芯層電路板10,從而去除所述零件安裝區15內的所述芯層電路板10。所述安裝孔16貫通所述芯層電路板10,所述安裝孔16用於收容一電子零件。因在本實施例中,所述零件安裝區15內的所述第一導電層12及第二導電層13分別與線路區14內的第一導電層12及第二導電層13相斷開,故,切割時只切割到基材層11而並不會切割到導電層,較容易切割。在其他實施例中,也可以通過沖型、撈型等方式形成所述安裝孔16。 In the embodiment, the core circuit board 10 is cut along the boundary line between the line area 14 and the component mounting area 15 by laser cutting, thereby removing the core layer circuit in the component mounting area 15. Board 10. The mounting hole 16 extends through the core circuit board 10 for receiving an electronic component. In the present embodiment, the first conductive layer 12 and the second conductive layer 13 in the component mounting region 15 are disconnected from the first conductive layer 12 and the second conductive layer 13 in the wiring region 14, respectively. Therefore, only the substrate layer 11 is cut during cutting without cutting into the conductive layer, which is easier to cut. In other embodiments, the mounting hole 16 may also be formed by punching, fishing, or the like.
第三步,請參閱圖4,提供一電子零件17,在所述電子零件17的電極171上形成導電凸塊172,所述導電凸塊172在自所述電極171向遠離電極171的方向上截面面積逐漸減小。 In a third step, referring to FIG. 4, an electronic component 17 is provided. On the electrode 171 of the electronic component 17, a conductive bump 172 is formed. The conductive bump 172 is in a direction away from the electrode 171 away from the electrode 171. The cross-sectional area is gradually reduced.
本實施例中,所述電子零件17包括主體部173及兩個電極171。所述主體部173大致呈長方形,所述兩個電極171及形成於所述主體部173長方向的兩端,所述兩個電極171均包括一上表面1711及與所述上表面1711相對的下表面 1712,兩個所述上表面1711位於所述電子零件17的同一側,兩個所述下表面1712位於所述電子零件17的相對另一側。所述導電凸塊172的數量為四個,分別形成於所述兩個電極171的上表面1711及下表面1712上。所述電子零件17的厚度等於或略小於所述安裝孔16的深度。 In the embodiment, the electronic component 17 includes a main body portion 173 and two electrodes 171. The main body portion 173 is substantially rectangular, and the two electrodes 171 are formed at both ends of the main body portion 173 in the longitudinal direction. The two electrodes 171 each include an upper surface 1711 and opposite the upper surface 1711. lower surface 1712, two of the upper surfaces 1711 are located on the same side of the electronic component 17, and the two lower surfaces 1712 are located on opposite sides of the electronic component 17. The number of the conductive bumps 172 is four, which are respectively formed on the upper surface 1711 and the lower surface 1712 of the two electrodes 171. The thickness of the electronic component 17 is equal to or slightly smaller than the depth of the mounting hole 16.
在所述電子零件17的電極171上形成導電凸塊172包括步驟:首先,通過印刷的方式在所述電子零件17的每個電極171其中上表面1711及下表面1712上形成導電膏體,所述導電膏體可以為銀膏、銅膏等;其次,將所述導電膏體固化得到所述導電凸塊172,所述導電凸塊172在自所述電極171向遠離電極171的方向上截面面積逐漸減小,所述導電凸塊172可以為圓錐狀、圓臺狀、三棱錐狀、三棱臺狀、多棱錐狀、多棱臺狀等。 Forming the conductive bumps 172 on the electrodes 171 of the electronic component 17 includes the steps of: first, forming a conductive paste on the upper surface 1711 and the lower surface 1712 of each of the electrodes 171 of the electronic component 17 by printing. The conductive paste may be a silver paste, a copper paste or the like; secondly, the conductive paste is cured to obtain the conductive bump 172, and the conductive bump 172 is in a cross section away from the electrode 171 in a direction away from the electrode 171. The area of the conductive bumps 172 may be a conical shape, a truncated cone shape, a triangular pyramid shape, a triangular prism shape, a polygonal pyramid shape, a polygonal prism shape, or the like.
在其他實施例中,所述導電凸塊172也可以只形成在所述上表面1711上,或只形成在所述下表面1712上;所述導電凸塊172的數量也不限於本實施例,例如,每個電極171的上表面1711及下表面1712上還可以形成兩個或者更多導電凸塊172。 In other embodiments, the conductive bumps 172 may also be formed only on the upper surface 1711 or only on the lower surface 1712; the number of the conductive bumps 172 is not limited to the embodiment. For example, two or more conductive bumps 172 may be formed on the upper surface 1711 and the lower surface 1712 of each of the electrodes 171.
第四步,請參閱圖5,將形成導電凸塊172後的所述電子零件17收容於所述芯層電路板10的安裝孔16內,並在所述芯層電路板10兩側分別疊合一第一增層材料18及第二增層材料19,使所述電子零件17的導電凸塊172均與增層材料相接觸,從而形成一疊合結構20。 In the fourth step, referring to FIG. 5, the electronic component 17 after the conductive bumps 172 are formed is received in the mounting holes 16 of the core circuit board 10, and stacked on both sides of the core circuit board 10. The first build-up material 18 and the second build-up material 19 are combined such that the conductive bumps 172 of the electronic component 17 are in contact with the build-up material to form a stack structure 20.
本實施例中,所述第一增層材料18包括一第一膠片181及一第一銅箔182,所述第二增層材料19包括一第二膠片191及一第二銅箔192,所述電子零件17兩側的導電凸塊172分別與所述第一及膠片181、191直接相接觸。所述第一及第二膠片181、191可以為半固化絕緣樹脂片,且可以包含玻璃纖維布等增韌材料。所述第一膠片181及第二膠片191的厚度分別與與其相接觸的導電凸塊172突出於所述芯層電路板10的高度大致相同。 In this embodiment, the first build-up material 18 includes a first film 181 and a first copper foil 182, and the second build-up material 19 includes a second film 191 and a second copper foil 192. The conductive bumps 172 on both sides of the electronic component 17 are in direct contact with the first and film 181, 191, respectively. The first and second films 181, 191 may be semi-cured insulating resin sheets, and may include a toughened material such as a glass cloth. The thicknesses of the first film 181 and the second film 191 are substantially the same as the height of the conductive bumps 172 in contact with the core layer circuit board 10, respectively.
本實施例中,所述疊合結構20的形成步驟包括:首先,提供所述第一膠片181,通過滾壓的方式將所述第一膠片預貼合於所述芯層電路板10的一側,也即,通過所述第一膠片181封閉所述安裝孔16的一端開口;之後,將形成導電凸塊172後的所述電子零件17收容於所述芯層電路板10的安裝孔16內,並使所述電子零件17一側的導電凸塊172支撐於所述第一膠片181上;然後,在所述第一膠片181遠離所述芯層電路板10的一側疊合所述第一銅箔182,在所述芯層電路板10遠離所述第一膠片181的一側依次疊合所述第二膠片191及一第二銅箔192,從而形成所述疊合結構20。 In this embodiment, the step of forming the laminated structure 20 includes: firstly providing the first film 181, and pre-bonding the first film to the core circuit board 10 by rolling Side, that is, the one end opening of the mounting hole 16 is closed by the first film 181; after that, the electronic component 17 after the conductive bump 172 is formed is received in the mounting hole 16 of the core circuit board 10. And supporting the conductive bump 172 on one side of the electronic component 17 on the first film 181; then, superimposing the side of the first film 181 away from the core circuit board 10 The first copper foil 182 sequentially overlaps the second film 191 and the second copper foil 192 on the side of the core circuit board 10 away from the first film 181, thereby forming the stacked structure 20.
第五步,請參閱圖6,壓合所述疊合結構20,使所述芯層電路板10與所述第一增層材料18及第二增層材料19相黏結,並使所述電子零件17兩側的的導電凸塊172分別貫穿所述第一及第二膠片181、191,並分別與同側的所述銅箔相電連接,從而形成一電路基板21。 In a fifth step, referring to FIG. 6, the laminated structure 20 is pressed, the core circuit board 10 is bonded to the first build-up material 18 and the second build-up material 19, and the electrons are bonded. The conductive bumps 172 on both sides of the component 17 respectively penetrate the first and second films 181, 191 and are electrically connected to the copper foil on the same side, thereby forming a circuit substrate 21.
因在本實施例中,所述導電凸塊172在自所述電極171向遠離電極171的方向上截面面積逐漸減小,也即具有較尖銳的端部,故,在壓力作用下,所述導電凸塊172可以刺穿所述第一膠片181與第二膠片191從而與第一及第二銅箔182、192相電連接,又因所述第一膠片181及第二膠片191的厚度與與其相接觸的導電凸塊172突出於所述芯層電路板10的高度大致相同,故,所述導電凸塊172可以與所述第一及第二銅箔182、192相電連接而不刺穿所述第一及第二銅箔182、192。 In this embodiment, the conductive bump 172 gradually decreases in cross-sectional area from the electrode 171 in a direction away from the electrode 171, that is, has a sharp end, so under pressure, the The conductive bump 172 can pierce the first film 181 and the second film 191 to be electrically connected to the first and second copper foils 182, 192, and the thickness of the first film 181 and the second film 191 The conductive bumps 172 in contact therewith protrude substantially the same height of the core circuit board 10, so the conductive bumps 172 can be electrically connected to the first and second copper foils 182, 192 without puncturing. The first and second copper foils 182, 192 are worn.
第六步,請參閱圖7,將所述第一銅箔182製作形成第三導電線路層22,將所述第二銅箔192製作形成第四導電線路層23,並在所述第一膠片181內形成至少一個第一導電盲孔24,在所述第二膠片191內形成至少一個第二導電盲孔25,使所述第一導電盲孔24電連接所述第一導電線路層121與所述第三導電線路層22,使所述第二導電盲孔25電連接所述第二導電線路層131與所述第四導電線路層 23,並使所述電子零件17兩側的的導電凸塊172分別與同側的所述導電線路層相電連接,也即,使所述電子零件17與所述第三及第四導電線路層22、23相電連接,從而得到一四層的具有內埋元件的電路板26。 In a sixth step, referring to FIG. 7, the first copper foil 182 is formed into a third conductive wiring layer 22, and the second copper foil 192 is formed into a fourth conductive wiring layer 23, and in the first film. Forming at least one first conductive blind via 24 in the 181, forming at least one second conductive via 25 in the second film 191, electrically connecting the first conductive via 24 to the first conductive trace layer 121 The third conductive circuit layer 22 electrically connects the second conductive via hole 25 to the second conductive circuit layer 131 and the fourth conductive circuit layer 23, and electrically connecting the conductive bumps 172 on both sides of the electronic component 17 to the conductive circuit layer on the same side, that is, the electronic component 17 and the third and fourth conductive lines The layers 22, 23 are electrically connected to each other to obtain a four-layer circuit board 26 having embedded components.
本實施例中,所述導電盲孔及導電線路層可以通過如下步驟形成:首先,通過鐳射燒蝕在所述第一膠片181及第一銅箔182上形成至少一個盲孔,及在所述第二膠片191及第二銅箔192上形成至少一個盲孔;之後,電鍍在所述盲孔孔壁形成電鍍層,從而將所述盲孔製作形成第一導電盲孔24及第二導電盲孔25;最後,通過影像轉移工藝及蝕刻工藝將所述第一銅箔182製作形成第三導電線路層22,及將所述第二銅箔192製作形成第四導電線路層23。 In this embodiment, the conductive via hole and the conductive circuit layer may be formed by: firstly forming at least one blind via on the first film 181 and the first copper foil 182 by laser ablation, and in the Forming at least one blind hole on the second film 191 and the second copper foil 192; then, plating is formed on the wall of the blind hole to form a plating layer, thereby forming the blind hole to form the first conductive blind hole 24 and the second conductive blind Hole 25; Finally, the first copper foil 182 is formed into a third conductive wiring layer 22 by an image transfer process and an etching process, and the second copper foil 192 is formed into a fourth conductive wiring layer 23.
第七步,請一併參閱圖1,在所述四層的具有內埋元件的電路板26兩側增層,分別形成第三膠片27及第五導電線路層28、第四膠片29及第六導電線路層30,並分別在所述第三膠片27及第四膠片29內分別形成第三導電盲孔31及第四導電盲孔32,使所述第三導電盲孔31電連接所述第三導電線路層22與所述第五導電線路層28,使所述第四導電盲孔32電連接所述第四導電線路層23與所述第六導電線路層30,從而得到具有內埋元件的多層電路板100。 In the seventh step, please refer to FIG. 1 to add layers on both sides of the four-layer circuit board 26 with embedded components to form a third film 27 and a fifth conductive circuit layer 28, a fourth film 29 and a first a sixth conductive circuit layer 30, and a third conductive blind hole 31 and a fourth conductive blind hole 32 are respectively formed in the third film 27 and the fourth film 29, so that the third conductive blind hole 31 is electrically connected to the The third conductive circuit layer 22 and the fifth conductive circuit layer 28 electrically connect the fourth conductive blind via 32 to the fourth conductive trace layer 23 and the sixth conductive trace layer 30, thereby obtaining a buried Multilayer circuit board 100 of components.
本步驟中增層方式與第四至第六步類似,即均為先壓合膠片及銅箔,之後在膠片內形成導電盲孔,最後再將銅箔製作成導電線路。當然,如果僅需要形成四層電路板,則不需要進行本步驟。 In this step, the layering method is similar to the fourth to sixth steps, that is, the film and the copper foil are first pressed, and then the conductive blind holes are formed in the film, and finally the copper foil is made into a conductive line. Of course, if only four layers of boards need to be formed, this step is not required.
可以理解,還可以在所述具有內埋元件的多層電路板100上形成防焊層以保護最外兩側裸露的導電線路;本案的多層電路板還可以用第七步的方式形成更多的導電線路層從而得到包括更多層線路層的具有內埋元件的多層電路板100。 It can be understood that a solder resist layer can also be formed on the multilayer circuit board 100 having the embedded component to protect the exposed conductive lines on the outermost sides; the multilayer circuit board of the present invention can also form more in the seventh step manner. The conductive wiring layer thus results in a multilayer circuit board 100 having embedded components including more layers of wiring layers.
相較於先前技術,本發明實施例的具有內埋元件的多層電路板100及製作方法通過在電子零件17上形成具有尖端的導電凸塊172,使導電凸塊刺 穿膠片與導電線路層電連接,從而將電子零件17內埋,並且不需要過回焊,可以減少因回焊造成的電路板翹曲、漲縮不匹配等問題,從而提高電路板製作良率。 Compared with the prior art, the multilayer circuit board 100 having the embedded component of the embodiment of the present invention and the manufacturing method thereof are formed by forming the conductive bump 172 having the tip on the electronic component 17 to make the conductive bump thorn The film is electrically connected to the conductive circuit layer, thereby burying the electronic component 17 and eliminating the need for over-reflow, which can reduce the problem of circuit board warpage, shrinkage mismatch, etc. caused by reflow, thereby improving the board fabrication yield. .
惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之請求項。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下請求項內。 However, the above description is only a preferred embodiment of the present invention, and the claim of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included in the following claims.
100‧‧‧具有內埋元件的多層電路板 100‧‧‧Multilayer boards with embedded components
10‧‧‧芯層電路板 10‧‧‧core circuit board
17‧‧‧電子零件 17‧‧‧Electronic parts
181‧‧‧第一膠片 181‧‧‧first film
191‧‧‧第二膠片 191‧‧‧second film
22‧‧‧第三導電線路層 22‧‧‧ Third conductive circuit layer
23‧‧‧第四導電線路層 23‧‧‧fourth conductive layer
11‧‧‧基材層 11‧‧‧Substrate layer
121‧‧‧第一導電線路層 121‧‧‧First conductive circuit layer
131‧‧‧第二導電線路層 131‧‧‧Second conductive circuit layer
141‧‧‧導電通孔 141‧‧‧ conductive through holes
16‧‧‧安裝孔 16‧‧‧Installation holes
173‧‧‧主體部 173‧‧‧ Main body
171‧‧‧電極 171‧‧‧electrode
1711‧‧‧上表面 1711‧‧‧ upper surface
172‧‧‧導電凸塊 172‧‧‧Electrical bumps
24‧‧‧第一導電盲孔 24‧‧‧First conductive blind hole
25‧‧‧第二導電盲孔 25‧‧‧Second conductive blind hole
27‧‧‧第三膠片 27‧‧‧ Third film
28‧‧‧第五導電線路層 28‧‧‧ Fifth conductive circuit layer
29‧‧‧第四膠片 29‧‧‧Fourth film
30‧‧‧第六導電線路層 30‧‧‧ sixth conductive circuit layer
31‧‧‧第三導電盲孔 31‧‧‧ Third conductive blind hole
32‧‧‧第四導電盲孔 32‧‧‧4th conductive blind hole
Claims (15)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410511781.0A CN105530765A (en) | 2014-09-29 | 2014-09-29 | Circuit board with embedded element and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201613437A TW201613437A (en) | 2016-04-01 |
TWI599290B true TWI599290B (en) | 2017-09-11 |
Family
ID=55772652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103138088A TWI599290B (en) | 2014-09-29 | 2014-11-03 | Printed circuit board with embeded electronic component and method for manufacturing same |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105530765A (en) |
TW (1) | TWI599290B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI698158B (en) * | 2018-10-12 | 2020-07-01 | 大陸商慶鼎精密電子(淮安)有限公司 | Embedded circuit board and method for making the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114786367A (en) * | 2021-01-22 | 2022-07-22 | 宏恒胜电子科技(淮安)有限公司 | High-density interconnection circuit board and preparation method thereof |
WO2023272642A1 (en) | 2021-06-30 | 2023-01-05 | 深南电路股份有限公司 | Electronic component package, electronic component, voltage regulator module, and voltage stabilizing device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI295912B (en) * | 2005-10-14 | 2008-04-11 | Advanced Semiconductor Eng | Method for manufacturing a substrate embedded with an electronic component and device from the same |
CN101281894B (en) * | 2007-04-02 | 2012-01-18 | 欣兴电子股份有限公司 | Semiconductor component bearing structure and splicing structure |
CN101594740B (en) * | 2008-05-27 | 2012-06-06 | 华通电脑股份有限公司 | Circuit board with imbedded electronic device and method of imbedding electronic device therein |
TWI393513B (en) * | 2009-02-04 | 2013-04-11 | Unimicron Technology Corp | Embedded circuit board and fabricating method thereof |
US9305854B2 (en) * | 2012-08-21 | 2016-04-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package |
-
2014
- 2014-09-29 CN CN201410511781.0A patent/CN105530765A/en active Pending
- 2014-11-03 TW TW103138088A patent/TWI599290B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI698158B (en) * | 2018-10-12 | 2020-07-01 | 大陸商慶鼎精密電子(淮安)有限公司 | Embedded circuit board and method for making the same |
Also Published As
Publication number | Publication date |
---|---|
TW201613437A (en) | 2016-04-01 |
CN105530765A (en) | 2016-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6863458B2 (en) | Laminated electronic components | |
TWI466607B (en) | Printed circuit board having buried component and method for manufacturing same | |
US9247646B2 (en) | Electronic component built-in substrate and method of manufacturing the same | |
KR101103301B1 (en) | A build-up printed circuit board with odd-layer and Manufacturing method of the same | |
TWI466606B (en) | Printed circuit board having buried component and method for manufacturing same | |
TWI519223B (en) | Method of manufacturing multilayer wiring board | |
TWI448223B (en) | Multilayer printed circuit board and method for manufacturing same | |
US9839135B2 (en) | Method of producing electronic components and method of producing substrate-type terminals | |
TWI538584B (en) | Embedded high density interconnection printed circuit board and method for manufactruing same | |
TWI478642B (en) | Printed circuit board with embedded component and method for manufacturing same | |
US9801283B2 (en) | Method of producing electronic components | |
US9265146B2 (en) | Method for manufacturing a multi-layer circuit board | |
JP2015038912A (en) | Electronic component incorporated wiring board and manufacturing method thereof | |
JP2017073458A (en) | Wiring board and manufacturing method therefor | |
TWI536888B (en) | Method for manufacturing rigid-flexible printed circuit board | |
TWI599290B (en) | Printed circuit board with embeded electronic component and method for manufacturing same | |
WO2015141004A1 (en) | Multilayer circuit board, semiconductor device, and multilayer circuit board manufacturing method | |
US10123413B2 (en) | Package substrate and manufacturing method thereof | |
JP6673304B2 (en) | Multilayer board | |
TWI477214B (en) | Printed circuit board having buried component and method for manufacturing same | |
KR101138542B1 (en) | Manufactory method for multi-layer printed circuit board | |
TWI461135B (en) | Method for fabricating circuit board | |
JP6387226B2 (en) | Composite board | |
JP4677383B2 (en) | Manufacturing method of ceramic substrate | |
JP6750728B2 (en) | Multi-layer electronic component and multi-layer electronic component module |