TW201613437A - Printed circuit board with embedded electronic component and method for manufacturing same - Google Patents

Printed circuit board with embedded electronic component and method for manufacturing same

Info

Publication number
TW201613437A
TW201613437A TW103138088A TW103138088A TW201613437A TW 201613437 A TW201613437 A TW 201613437A TW 103138088 A TW103138088 A TW 103138088A TW 103138088 A TW103138088 A TW 103138088A TW 201613437 A TW201613437 A TW 201613437A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
electronic component
bonding sheet
manufacturing same
Prior art date
Application number
TW103138088A
Other languages
Chinese (zh)
Other versions
TWI599290B (en
Inventor
hai-bo Qin
Original Assignee
Zhen Ding Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhen Ding Technology Co Ltd filed Critical Zhen Ding Technology Co Ltd
Publication of TW201613437A publication Critical patent/TW201613437A/en
Application granted granted Critical
Publication of TWI599290B publication Critical patent/TWI599290B/en

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present disclosure relates to a printed circuit board with an electronic component. The printed circuit board includes an inner printed circuit board, an electronic component, a first bonding sheet, a second bonding sheet, and circuit pattern layers. A receiving hole is defined in the inner printed circuit board. The electronic component is received in the receiving hole. A plurality of electric protrusion blocks are formed on electrodes of the electronic component. A cross section area of each electric protrusion block is gradually decreased away from the corresponding electrode. The first bonding sheet and the second bonding sheet are respectively formed on two opposite sides of the inner printed circuit board. The circuit pattern layers are formed on surfaces of the first bonding sheet and the second bonding sheet. Each electric protrusion block passes through the first bonding sheet and electrically connected with a circuit pattern layer. A method for manufacturing the printed circuit board with an electronic component is also provided.
TW103138088A 2014-09-29 2014-11-03 Printed circuit board with embeded electronic component and method for manufacturing same TWI599290B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410511781.0A CN105530765A (en) 2014-09-29 2014-09-29 Circuit board with embedded element and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201613437A true TW201613437A (en) 2016-04-01
TWI599290B TWI599290B (en) 2017-09-11

Family

ID=55772652

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103138088A TWI599290B (en) 2014-09-29 2014-11-03 Printed circuit board with embeded electronic component and method for manufacturing same

Country Status (2)

Country Link
CN (1) CN105530765A (en)
TW (1) TWI599290B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020073344A1 (en) * 2018-10-12 2020-04-16 庆鼎精密电子（淮安）有限公司 Embedded circuit board and manufacturing method therefor
CN114786367A (en) * 2021-01-22 2022-07-22 宏恒胜电子科技（淮安）有限公司 High-density interconnection circuit board and preparation method thereof
WO2023272642A1 (en) * 2021-06-30 2023-01-05 深南电路股份有限公司 Electronic component package, electronic component, voltage regulator module, and voltage stabilizing device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI295912B (en) * 2005-10-14 2008-04-11 Advanced Semiconductor Eng Method for manufacturing a substrate embedded with an electronic component and device from the same
CN101281894B (en) * 2007-04-02 2012-01-18 欣兴电子股份有限公司 Semiconductor component bearing structure and splicing structure
CN101594740B (en) * 2008-05-27 2012-06-06 华通电脑股份有限公司 Circuit board with imbedded electronic device and method of imbedding electronic device therein
TWI393513B (en) * 2009-02-04 2013-04-11 Unimicron Technology Corp Embedded circuit board and fabricating method thereof
US9305854B2 (en) * 2012-08-21 2016-04-05 Stats Chippac, Ltd. Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package

Also Published As

Publication number Publication date
CN105530765A (en) 2016-04-27
TWI599290B (en) 2017-09-11

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