TWI598973B - Heat sink offset detection method and device - Google Patents
Heat sink offset detection method and device Download PDFInfo
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Description
本發明係有關於一種偏移檢測方法及裝置，尤指使用在檢測貼附於基板上之散熱片之位置是否偏移之散熱片偏移檢測方法及裝置。The present invention relates to an offset detecting method and apparatus, and more particularly to a fin offset detecting method and apparatus for detecting whether a position of a heat sink attached to a substrate is offset.
一般半導體封裝製程中，對於需要進行散熱片封裝的半導體，通常會在已置放晶片之基板上先進行注入黏性材料，然後再將散熱片貼附於黏性材料上，接著進行壓合的操作使散熱片與黏性材料固著一段時間形成產品，再將產品移入一烘烤裝置以進行烘乾，而在進行壓合或烘乾之後，需對基板上之散熱片位置進行檢測，以確保散熱片係在標準位置上，無發生偏移之情形。In a general semiconductor packaging process, for a semiconductor that requires a heat sink package, a viscous material is usually implanted on a substrate on which the wafer has been placed, and then the heat sink is attached to the viscous material, followed by pressing. The operation is to fix the heat sink and the adhesive material for a period of time to form a product, and then move the product into a baking device for drying, and after pressing or drying, the position of the heat sink on the substrate is detected to Make sure the heat sink is in the standard position and there is no offset.
習知散熱片偏移檢測，係對產品進行攝像，再分別對產品影像中之基板與散熱片進行定位，並檢測兩者之位置差異來判斷散熱片有無偏移。Conventional heat sink offset detection is to image the product, and then respectively position the substrate and the heat sink in the product image, and detect the difference between the two to determine whether the heat sink has offset.
惟，散熱片之尺寸大小通常與基板十分接近，甚至等同於基板尺寸，且基板之周圍亦設有許多限位機構，在兩者分別定位時，基板之邊界線辨識參數不易設定，若是因散熱片偏移導致基板之邊界被部分遮蔽或是因散熱片尺寸與基板尺寸相同而完全覆蓋基板，更是無從對基板進行定位，導致散熱片偏移檢測容易有誤判之情形。However, the size of the heat sink is usually very close to the substrate, even equivalent to the size of the substrate, and there are many limiting mechanisms around the substrate. When the two are respectively positioned, the boundary line identification parameters of the substrate are not easy to set, if it is due to heat dissipation. The sheet offset causes the boundary of the substrate to be partially shielded or completely covers the substrate because the size of the heat sink is the same as the size of the substrate, and the substrate is not positioned, resulting in a situation in which the offset detection of the heat sink is easily misjudged.
爰是，本發明的目的，在於提供一種降低檢測誤判情形之散熱片偏移檢測方法。Accordingly, it is an object of the present invention to provide a fin offset detecting method that reduces detection misjudgment.
本發明的另一目的，在於提供一種降低檢測誤判情形之散熱片偏移檢測裝置。Another object of the present invention is to provide a heat sink offset detecting apparatus which reduces the detection misjudgment.
依據本發明目的之散熱片偏移檢測方法，包括：一散熱片邊角位置取得步驟：搜尋散熱片影像之邊界線，並以散熱片影像之邊界線推算散熱片影像之第一邊角位置；一基板邊角位置取得步驟：以散熱片影像之邊界線推算基板影像之邊界線，並以基板影像之邊界線推算基板影像之第二邊角位置；一偏移判斷步驟：計算散熱片影像之第一邊角與基板影像之第二邊角兩點位置之偏差量，並檢測是否符合預設值。The heat sink offset detecting method according to the present invention includes: a heat sink edge position obtaining step: searching for a boundary line of the heat sink image, and estimating a first corner position of the heat sink image by using a boundary line of the heat sink image; a substrate edge position obtaining step: estimating a boundary line of the substrate image by using a boundary line of the heat sink image, and estimating a second corner position of the substrate image by using a boundary line of the substrate image; and an offset determining step: calculating a heat sink image The amount of deviation between the first corner and the second corner of the substrate image, and detects whether the preset value is met.
依據本發明目的之另一散熱片偏移檢測方法，包括：一散熱片邊角位置取得步驟：搜尋散熱片影像之邊界線，並以散熱片影像之邊界線推算散熱片影像之第一邊角位置；一基板邊角位置取得步驟：以散熱片影像之邊界線推算基板影像之邊界線，並以基板影像之邊界線推算基板影像之第二邊角位置；一偏移判斷步驟：以基板影像之第二邊角位置計算出產品影像之尺寸，並檢測是否符合預設值。Another heat sink offset detecting method according to the object of the present invention comprises: a heat sink edge position obtaining step: searching for a boundary line of the heat sink image, and estimating a first corner of the heat sink image by using a boundary line of the heat sink image Position; a substrate edge position obtaining step: estimating a boundary line of the substrate image by using a boundary line of the heat sink image, and estimating a second corner position of the substrate image by using a boundary line of the substrate image; an offset determining step: using the substrate image The second corner position calculates the size of the product image and detects whether it meets the preset value.
依據本發明目的之又一散熱片偏移檢測方法，包括：一散熱片邊角位置取得步驟：搜尋散熱片影像之邊界線，並以散熱片影像之邊界線推算散熱片影像之第一邊角位置；一基板邊角位置取得步驟：以散熱片影像之邊界線取代成為基板影像之邊界線，並以基板影像之邊界線推算基板影像之第二邊角位置；一偏移判斷步驟：以基板影像之第二邊角位置計算出產品影像之尺寸，並檢測是否符合預設值。A heat sink offset detecting method according to the present invention includes: a heat sink edge position obtaining step: searching for a boundary line of the heat sink image, and estimating a first corner of the heat sink image by using a boundary line of the heat sink image Position; a substrate edge position obtaining step: replacing the boundary line of the substrate image with the boundary line of the heat sink image, and estimating the second corner position of the substrate image by the boundary line of the substrate image; an offset determining step: using the substrate The second corner position of the image calculates the size of the product image and detects whether it meets the preset value.
依據本發明另一目的之散熱片偏移檢測裝置，包括：用以執行如申請專利範圍第1至7項任一項所述散熱片偏移檢測方法之裝置。A heat sink offset detecting apparatus according to another object of the present invention, comprising: means for performing the heat sink offset detecting method according to any one of claims 1 to 7.
本發明實施例之散熱片偏移檢測方法及裝置，在先搜尋到散熱片影像之邊界線之情形下，以散熱片影像之邊界線為基礎，再去推算出基板影像之邊界線，且在無法搜尋到基板影像之邊界線時，可使用散熱片影像之邊界線進行取代，以產品產品影像之尺寸大小來判斷散熱片影像有無偏移超出基板影像，將可克服過去基板影像之邊界線辨識參數不易設定，無從對基板影像進行定位之問題，降低偏移檢測誤判之情形。In the method for detecting the heat sink offset of the embodiment of the present invention, in the case of searching for the boundary line of the heat sink image, based on the boundary line of the heat sink image, the boundary line of the substrate image is further calculated, and When the boundary line of the substrate image cannot be searched, the boundary line of the heat sink image can be used instead. The size of the product image can be used to determine whether the heat sink image is offset beyond the substrate image, which can overcome the boundary line identification of the past substrate image. The parameters are not easy to set, and there is no problem of positioning the substrate image, which reduces the misjudgment of the offset detection.
請參閱圖1、2，本發明實施例之電子產品E係將一散熱片E1貼附於一基板E2上，該基板E2上設有一晶片E3，該電子產品E可置放於一載盤B上，該載盤B設有數個矩陣排列之容置區B1，該容置區B1之四個角落處各設有兩限位銷B2，電子產品E之基板E2之四個角緣恰可嵌於該等限位銷B2間，使電子產品E限位於該容置區B1內，其中，在標準情形下，散熱片E1係應該貼附於基板E2中央處(如圖3A)，但實際上，散熱片E1可能產生偏移，且限位銷B2與基板E2間可能具有間隙，導致散熱片E1在貼附時偏移超出基板E2範圍(如圖3B)，故需對載盤B上之每個電子產品E進行攝像以進行散熱片E1之偏移檢測。Referring to FIG. 1 and FIG. 2, the electronic product E of the embodiment of the present invention attaches a heat sink E1 to a substrate E2. The substrate E2 is provided with a wafer E3, and the electronic product E can be placed on a carrier B. The carrier B is provided with a plurality of matrix-arranged accommodating areas B1. The four corners of the accommodating area B1 are respectively provided with two limiting pins B2, and the four corners of the substrate E2 of the electronic product E can be embedded. Between the limit pins B2, the electronic product E is confined in the accommodating area B1. In the standard case, the heat sink E1 should be attached to the center of the substrate E2 (as shown in FIG. 3A), but actually The heat sink E1 may be offset, and there may be a gap between the limit pin B2 and the substrate E2, so that the heat sink E1 is offset beyond the substrate E2 when attached (as shown in FIG. 3B), so it is required to be on the carrier B. Each electronic product E performs imaging to perform offset detection of the heat sink E1.
電子產品E攝像後之原始影像需先進行灰階處理，轉換成灰階影像後方能進行偏移檢測，請參閱圖4所示，本發明實施例之散熱片偏移檢測方法包括以下步驟： 一散熱片邊角位置取得步驟S1：取得散熱片影像Ep1之四個第一邊角Ep11位置(如圖5)； 一基板邊角位置取得步驟S2：取得基板影像Ep2之四個第二邊角Ep21位置(如圖6)； 一偏移判斷步驟S3：以第一邊角Ep11與第二邊角Ep21兩點之位置差異來判斷散熱片影像Ep1是否偏移(如圖8A~D)，或是以四個第二邊角Ep21’所形成之產品影像Ep尺寸來判斷散熱片影像Ep1是否因偏移而超出基板影像Ep2之範圍(如圖9)。The original image of the electronic product E is processed by the grayscale processing, and the offset detection is performed after the grayscale image is converted. Referring to FIG. 4, the heat sink offset detection method of the embodiment of the present invention includes the following steps: Step S1 of obtaining the edge position of the fins: obtaining the positions of the four first corners Ep11 of the fin image Ep1 (as shown in FIG. 5); obtaining the position of the substrate corners in step S2: obtaining the four second corners Ep21 of the substrate image Ep2 Position (Fig. 6); an offset determining step S3: determining whether the heat sink image Ep1 is offset by the difference in position between the first corner Ep11 and the second corner Ep21 (as shown in Figs. 8A to D), or The product image Ep size formed by the four second corners Ep21' is used to determine whether the heat sink image Ep1 is out of the range of the substrate image Ep2 due to the offset (see FIG. 9).
請參閱圖4、5，該散熱片邊角位置取得步驟S1包括以下步驟： 一散熱片尋邊步驟S11：在灰階產品影像Ep上建立預設之起點幾何輪廓R1與終點幾何輪廓R2，該起點幾何輪廓R1與終點幾何輪廓R2之大小與位置在對第一個產品影像Ep進行第一次之檢測時係由操作人員手動拉取，之後系統可自動建立在後續之產品影像Ep上，並設定由起點幾何輪廓R1發出，用於尋邊之數條掃描線S之方向係由內到外或由外到內，灰階變化係由黑到白或由白到黑，在本發明實施例中，起點幾何輪廓R1係設定位於散熱片影像Ep1內，終點幾何輪廓R2係設定位於基板影像Ep2外且掃描線S方向係由內到外，灰階變化係由白到黑，並逐一判斷每一掃描線S所經過的兩相鄰像素點之灰階變化，若兩相鄰像素點之灰階變化超出預設值，則在該方向上之第一次灰階變化超出預設值處建立標記點T在掃描線S上，之後連結數個標記點T，推算形成散熱片影像Ep1之邊界線L1，若無法搜尋到邊界線L1，則判斷產品影像Ep無法檢測； 一第一尋角步驟S12：在確立散熱片影像Ep1之四條邊界線L1後，因散熱片影像Ep1為矩形形狀，故兩相鄰之邊界線L1會相交形成第一邊角Ep11，並以此方式搜尋到散熱片影像Ep1之四個第一邊角Ep11。Referring to FIG. 4 and FIG. 5, the heat sink edge position obtaining step S1 includes the following steps: a heat sink edge searching step S11: establishing a preset starting point geometric contour R1 and an ending geometric point R2 on the grayscale product image Ep. The size and position of the starting geometrical contour R1 and the ending geometrical contour R2 are manually pulled by the operator when the first product image Ep is first detected, and then the system can be automatically established on the subsequent product image Ep, and The setting is issued by the starting geometrical contour R1, and the direction of the plurality of scanning lines S for edge finding is from inside to outside or from outside to inside, and the grayscale change is from black to white or from white to black, in the embodiment of the present invention. The starting geometric profile R1 is set in the heat sink image Ep1, the end geometric profile R2 is set outside the substrate image Ep2 and the scanning line S direction is from inside to outside, and the grayscale change is from white to black, and each one is judged one by one. A gray-scale change of two adjacent pixel points passing through a scan line S. If the gray-scale change of two adjacent pixel points exceeds a preset value, the first gray-scale change in the direction exceeds a preset value. Mark point T on scan line S Then, a plurality of mark points T are connected to calculate a boundary line L1 for forming the heat sink image Ep1. If the boundary line L1 cannot be searched, it is judged that the product image Ep cannot be detected; a first angle finding step S12: establishing the heat sink image Ep1 After the four boundary lines L1, since the heat sink image Ep1 has a rectangular shape, the two adjacent boundary lines L1 intersect to form the first corner Ep11, and the four first corners Ep11 of the heat sink image Ep1 are searched in this way. .
請參閱圖4、6，該基板邊角位置取得步驟S2包括以下步驟： 一基板尋邊步驟S21：從散熱片影像Ep1之邊界線L1發出數條由內到外尋邊之掃描線S，在本發明實施例中，散熱片影像Ep1之邊界線L1即為起點幾何輪廓R1，而灰階變化係設定由白到黑，故連結數個標記點T，推算形成基板影像Ep2之邊界線L2，若可順利搜尋到邊界線L2則進入一第二尋角步驟S22，若無法搜尋到邊界線L2，則進入一第三尋角步驟S23； 一第二尋角步驟S22：在確立基板影像Ep2之四條邊界線L2後，因基板影像Ep2為矩形形狀，故兩相鄰之邊界線L2會相交形成第二邊角Ep21，並以此方式搜尋到基板影像Ep2之四個第二邊角Ep21； 一第三尋角步驟S23：當散熱片E1之尺寸等同於基板E2尺寸或散熱片E1超出基板E2範圍(如圖3B)時，會產生無法確立基板影像Ep2之所有邊界線L2之情形，請參閱圖7，若無法搜尋到邊界線L2，即會以搜尋側之散熱片影像Ep1之邊界線L1取代為基板影像Ep2之邊界線L2’，並同樣以兩相鄰之邊界線L2、L2’相交形成第二邊角Ep21’，以搜尋四個第二邊角Ep21’位置，在本發明實施例中，因散熱片影像Ep1超出於產品影像Ep之上側與右側，故無法搜尋到基板影像Ep2上側與右側之邊界線L2，故以散熱片影像Ep1上側與右側之邊界線L1取代基板影像Ep2上側與右側之邊界線L2’，而下側與左側因可搜尋到基板影像Ep2之邊界線L2，故不需以散熱片影像Ep1之邊界線L1取代。Referring to FIGS. 4 and 6, the substrate edge position obtaining step S2 includes the following steps: a substrate edge finding step S21: issuing a plurality of scan lines S from the inside to the outside of the boundary line L1 of the heat sink image Ep1. In the embodiment of the present invention, the boundary line L1 of the heat sink image Ep1 is the starting point geometric contour R1, and the gray scale change is set from white to black. Therefore, a plurality of marking points T are connected, and the boundary line L2 forming the substrate image Ep2 is estimated. If the boundary line L2 can be searched smoothly, a second angle finding step S22 is entered. If the boundary line L2 cannot be searched, a third angle finding step S23 is entered. A second angle finding step S22: establishing the substrate image Ep2 After the four boundary lines L2, since the substrate image Ep2 has a rectangular shape, the two adjacent boundary lines L2 intersect to form a second corner Ep21, and in this way, the four second corners Ep21 of the substrate image Ep2 are searched; The third angle finding step S23: when the size of the heat sink E1 is equal to the size of the substrate E2 or the heat sink E1 exceeds the range of the substrate E2 (as shown in FIG. 3B), all the boundary lines L2 of the substrate image Ep2 cannot be established, please refer to Figure 7, if you can't find the boundary line L2 That is, the boundary line L1 of the heat sink image Ep1 on the search side is replaced with the boundary line L2' of the substrate image Ep2, and the second corner Ep21' is also formed by intersecting the two adjacent boundary lines L2 and L2' to search for four. In the embodiment of the present invention, since the heat sink image Ep1 is beyond the upper side and the right side of the product image Ep, the boundary line L2 between the upper side and the right side of the substrate image Ep2 cannot be searched, so the heat sink is used. The boundary line L1 of the upper side and the right side of the image Ep1 replaces the boundary line L2' between the upper side and the right side of the substrate image Ep2, and the boundary line L2 of the substrate image Ep2 can be searched for the lower side and the left side, so that the boundary line of the heat sink image Ep1 is not required. L1 is substituted.
請參閱圖4，該偏移判斷步驟S3包括以下步驟： 一邊角位置檢測步驟S31：接續第二尋角步驟S22，請參閱圖8A~D，計算位於四個角落相鄰對應之第一邊角Ep11與第二邊角Ep21兩點位置之偏差量，該偏差量包含檢測兩點之X分量x、Y分量y、距離d…等綜合評估，並比較偏差量是否符合預設值；若有一個以上邊角之偏差量不符合預設值，則判斷散熱片影像Ep1不在預設位置上，有偏移基板影像Ep2之非標準情形； 一產品尺寸檢測步驟S32：接續第三尋角步驟S23，係以基板影像Ep2之四個第二邊角Ep21’位置計算出基板影像Ep2之尺寸，且因第二邊角Ep21已為產品影像Ep之最外側角落，故此基板影像Ep2之尺寸即可設為產品影像Ep之尺寸(圖9斜線部分)，並比較產品影像Ep之尺寸大小是否符合預設值(在本發明實施例中，預設值為原始基板影像Ep2尺寸)，若尺寸大於預設值，則判斷散熱片影像Ep1不在預設位置上有偏移超出基板影像Ep2之非標準情形； 此外，在執行該產品尺寸檢測步驟S32前，亦可加入執行邊角位置檢測步驟S31，因在散熱片影像Ep1未完全覆蓋基板影像Ep2之情形下，仍有部分第一邊角Ep11與第二邊角Ep21’可供計算偏差量，若在產品尺寸檢測步驟S32前加入執行邊角位置檢測步驟S31，則產品尺寸檢測步驟S32僅檢測散熱片影像Ep1完全覆蓋基板影像Ep2之情形。Referring to FIG. 4, the offset determining step S3 includes the following steps: a corner position detecting step S31: following the second corner finding step S22, referring to FIG. 8A to D, calculating the first corner corresponding to the adjacent corners of the four corners The deviation between the two points of the Ep11 and the second corner Ep21, the deviation amount includes a comprehensive evaluation of detecting the X component x, the Y component y, the distance d, and the like of the two points, and comparing whether the deviation amount meets the preset value; if there is one If the deviation of the above corners does not meet the preset value, it is determined that the heat sink image Ep1 is not at the preset position, and there is a non-standard situation of offsetting the substrate image Ep2; a product size detecting step S32: following the third angle finding step S23, The size of the substrate image Ep2 is calculated by the position of the fourth second corner Ep21' of the substrate image Ep2, and since the second corner Ep21 is the outermost corner of the product image Ep, the size of the substrate image Ep2 can be set to The size of the product image Ep (the oblique line portion of FIG. 9), and whether the size of the product image Ep is compared with the preset value (in the embodiment of the present invention, the preset value is the original substrate image Ep2 size), if the size is larger than the preset value , to determine the heat The image Ep1 does not have a non-standard situation in which the offset is beyond the substrate image Ep2. In addition, before performing the product size detecting step S32, the execution edge position detecting step S31 may be added because the heat sink image Ep1 is not completely completed. In the case of covering the substrate image Ep2, some first corners Ep11 and second corners Ep21' are still available for calculating the deviation amount. If the edge position detecting step S31 is added before the product size detecting step S32, the product size is detected. Step S32 detects only the case where the heat sink image Ep1 completely covers the substrate image Ep2.
本發明實施例在實施上，首先推算出散熱片影像Ep1之邊界線L1，再由邊界線L1為基礎推算出基板影像Ep2之邊界線L2，若無法搜尋到基板影像Ep2之邊界線L2時，則以搜尋側之散熱片影像Ep1之邊界線L1取代之，並以兩相鄰之邊界線L1、L2、L2’兩兩相交各形成散熱片影像Ep1與基板影像Ep2之四個第一邊角Ep11與第二邊角Ep21、Ep21’，並檢測比較第一邊角Ep11與第二邊角Ep21、Ep21’兩點位置之偏差量是否符合預設值，若有一個以上邊角之偏差量不符合預設值，則判斷散熱片影像Ep1不在預設位置上有偏移基板影像Ep2之非標準情形；或者在散熱片影像Ep1之邊界線L1取代成為基板影像Ep2之邊界線L2’時，以第二邊角Ep21’之位置計算出產品影像Ep之尺寸，若尺寸大於預設值，則判斷散熱片影像Ep1不在預設位置上有偏移超出基板影像Ep2之非標準情形。In the implementation of the present invention, the boundary line L1 of the heat sink image Ep1 is first calculated, and the boundary line L2 of the substrate image Ep2 is estimated based on the boundary line L1. If the boundary line L2 of the substrate image Ep2 cannot be found, Then, the boundary line L1 of the heat sink image Ep1 on the search side is replaced, and the two first corners of the heat sink image Ep1 and the substrate image Ep2 are formed by intersecting the two adjacent boundary lines L1, L2, and L2'. Ep11 and the second corners Ep21 and Ep21', and detecting whether the deviation between the first corner Ep11 and the second corners Ep21 and Ep21' is in accordance with a preset value, and if there is more than one corner, the deviation is not If the preset value is met, it is determined that the heat sink image Ep1 does not have a non-standard condition of offsetting the substrate image Ep2 at the preset position; or when the boundary line L1 of the heat sink image Ep1 is replaced with the boundary line L2' of the substrate image Ep2, The position of the second corner Ep21' calculates the size of the product image Ep. If the size is larger than the preset value, it is determined that the heat sink image Ep1 does not have a non-standard situation in which the offset exceeds the substrate image Ep2.
本發明實施例之散熱片偏移檢測方法及裝置，在先搜尋到散熱片影像Ep1之邊界線L1之情形下，以散熱片影像Ep1之邊界線L1為基礎，再去推算出基板影像Ep2之邊界線L2，且在無法搜尋到基板影像Ep2之邊界線L2時，可使用散熱片影像Ep1之邊界線L1進行取代，以產品影像Ep之尺寸大小來判斷散熱片影像Ep1有無偏移超出基板影像Ep2，將可克服過去基板影像Ep2之邊界線L2辨識參數不易設定，無從對基板影像Ep2進行定位之問題，降低偏移檢測誤判之情形。In the case of searching for the boundary line L1 of the heat sink image Ep1, the heat sink offset detecting method and device of the embodiment of the present invention are based on the boundary line L1 of the heat sink image Ep1, and then the substrate image Ep2 is calculated. When the boundary line L2 is not found, and the boundary line L2 of the substrate image Ep2 cannot be searched, the boundary line L1 of the heat sink image Ep1 can be used instead, and the size of the product image Ep can be used to determine whether the heat sink image Ep1 is offset or not. Ep2 can overcome the problem that the boundary line L2 identification parameter of the past substrate image Ep2 is difficult to set, and there is no problem of positioning the substrate image Ep2, thereby reducing the misjudgment of the offset detection.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
B‧‧‧載盤
B1‧‧‧容置區
B2‧‧‧限位銷
E‧‧‧電子產品
E1‧‧‧散熱片
E2‧‧‧基板
E3‧‧‧晶片
Ep‧‧‧產品影像
Ep1‧‧‧散熱片影像
Ep11‧‧‧第一邊角
Ep2‧‧‧基板影像
Ep21‧‧‧第二邊角
Ep21’‧‧‧第二邊角
L1‧‧‧邊界線
L2‧‧‧邊界線
L2’‧‧‧邊界線
R1‧‧‧起點幾何輪廓
R2‧‧‧終點幾何輪廓
S‧‧‧掃描線
S1‧‧‧散熱片邊角位置取得步驟
S11‧‧‧散熱片尋邊步驟
S12‧‧‧第一尋角步驟
S2‧‧‧基板邊角位置取得步驟
S21‧‧‧基板尋邊步驟
S22‧‧‧第二尋角步驟
S23‧‧‧第三尋角步驟
S3‧‧‧偏移判斷步驟
S31‧‧‧邊角位置檢測步驟
S32‧‧‧產品尺寸檢測步驟
T‧‧‧標記點
d‧‧‧距離
x‧‧‧X分量
y‧‧‧Y分量B‧‧‧ Carrier
B1‧‧‧Receiving area
B2‧‧‧ Limit pin
E‧‧‧Electronic products
E1‧‧‧ heat sink
E2‧‧‧Substrate
E3‧‧‧ wafer
Ep‧‧‧Product Image
Ep1‧‧‧ heat sink image
Ep11‧‧‧First corner
Ep2‧‧‧ substrate image
Ep21‧‧‧second corner
Ep21'‧‧‧second corner
L1‧‧‧ boundary line
L2‧‧‧ boundary line
L2'‧‧‧ boundary line
R1‧‧‧ starting geometric profile
R2‧‧‧End geometric profile
S‧‧‧ scan line
S1‧‧‧Fast film corner position acquisition steps
S11‧‧‧ Heat sink edge finding step
S12‧‧‧First angle finding step
S2‧‧‧Step of obtaining the corner position of the substrate
S21‧‧‧ substrate edge finding step
S22‧‧‧Second angle finding step
S23‧‧‧ third angle finding step
S3‧‧‧ offset judgment step
S31‧‧‧ corner position detection steps
S32‧‧‧Product size detection steps
T‧‧‧ points
D‧‧‧distance
x‧‧‧X component
y‧‧‧Y component
圖1係本發明實施例之電子產品與載盤之示意圖。 圖2係本發明實施例之電子產品置放於載盤之示意圖。 圖3A係本發明實施例之散熱片貼附於基板預設位置之示意圖。 圖3B係本發明實施例之散熱片貼附偏移於基板預設位置之示意圖。 圖4係本發明實施例之散熱片偏移檢測步驟之流程示意圖。 圖5係本發明實施例之搜尋散熱片影像之邊界線與第一邊角之示意圖。 圖6係本發明實施例之搜尋基板影像之邊界線與第二邊角之示意圖。 圖7係本發明實施例之圖3B影像之第二邊角之示意圖。 圖8A~D係本發明實施例之圖3A影像之四個對應之第一邊角與第二邊角位置偏移量之示意圖。 圖9係本發明實施例之圖3B影像之產品影像尺寸之示意圖。1 is a schematic diagram of an electronic product and a carrier of an embodiment of the present invention. 2 is a schematic view showing an electronic product placed on a carrier in an embodiment of the present invention. 3A is a schematic view showing a heat sink attached to a predetermined position of a substrate according to an embodiment of the present invention. FIG. 3B is a schematic view showing the heat sink attachment of the embodiment of the present invention offset to a predetermined position of the substrate. FIG. FIG. 4 is a schematic flow chart of a heat sink offset detecting step according to an embodiment of the present invention. FIG. 5 is a schematic diagram of a boundary line and a first corner of a search for a heat sink image according to an embodiment of the present invention. FIG. 6 is a schematic diagram of a boundary line and a second corner of a search substrate image according to an embodiment of the invention. FIG. 7 is a schematic diagram of a second corner of the image of FIG. 3B according to an embodiment of the present invention. 8A-D are schematic diagrams showing the offsets of the four corresponding first and second corner positions of the image of FIG. 3A according to the embodiment of the present invention. FIG. 9 is a schematic diagram showing the image size of the product of FIG. 3B according to an embodiment of the present invention.
S1‧‧‧散熱片邊角位置取得步驟 S1‧‧‧Fast film corner position acquisition steps
S11‧‧‧散熱片尋邊步驟 S11‧‧‧ Heat sink edge finding step
S12‧‧‧第一尋角步驟 S12‧‧‧First angle finding step
S2‧‧‧基板邊角位置取得步驟 S2‧‧‧Step of obtaining the corner position of the substrate
S21‧‧‧基板尋邊步驟 S21‧‧‧ substrate edge finding step
S22‧‧‧第二尋角步驟 S22‧‧‧Second angle finding step
S23‧‧‧第三尋角步驟 S23‧‧‧ third angle finding step
S3‧‧‧偏移判斷步驟 S3‧‧‧ offset judgment step
S31‧‧‧邊角位置檢測步驟 S31‧‧‧ corner position detection steps
S32‧‧‧產品尺寸檢測步驟 S32‧‧‧Product size detection steps
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| TW201431015A (en) * | 2013-01-22 | 2014-08-01 | Uunup Technology Co Ltd | A heat sink for semiconductor wafer device |
| TW201524286A (en) * | 2013-12-06 | 2015-06-16 | All Ring Tech Co Ltd | Method and device for placing cooling fin |
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| TW201431015A (en) * | 2013-01-22 | 2014-08-01 | Uunup Technology Co Ltd | A heat sink for semiconductor wafer device |
| TW201524286A (en) * | 2013-12-06 | 2015-06-16 | All Ring Tech Co Ltd | Method and device for placing cooling fin |
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