CN106548954A - Method and device for detecting deviation of radiating fin - Google Patents
Method and device for detecting deviation of radiating fin Download PDFInfo
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- CN106548954A CN106548954A CN201610414924.5A CN201610414924A CN106548954A CN 106548954 A CN106548954 A CN 106548954A CN 201610414924 A CN201610414924 A CN 201610414924A CN 106548954 A CN106548954 A CN 106548954A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 238000001514 detection method Methods 0.000 claims description 13
- 238000007689 inspection Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- Image Analysis (AREA)
- Engineering & Computer Science (AREA)
- Image Processing (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a method and a device for detecting deviation of a radiating fin, comprising the following steps: a step of obtaining the corner position of the heat sink: searching the boundary line of the radiating fin image, and calculating the first edge position of the radiating fin image according to the boundary line of the radiating fin image; a step of obtaining the corner position of the substrate: calculating the boundary line of the substrate image by using the boundary line of the radiating fin image, and calculating the second corner position of the substrate image by using the boundary line of the substrate image; an offset determination step: and calculating the deviation amount of two point positions of the first corner of the radiating fin image and the second corner of the substrate image, and detecting whether the deviation amount accords with a preset value.
Description
【Technical field】
The invention relates to a kind of bias detecting method and device, espespecially use and are attached at the radiating on substrate in detection
Fin bias detecting method and device that whether the position of piece offsets.
【Background technology】
In general semiconductor packing process, for needing to carry out the semiconductor of fin encapsulation, it will usually core is put
Injection cohesive material is first carried out on the substrate of piece, then again fin is attached on cohesive material, the behaviour for then being pressed
Make fin product be formed for a period of time with cohesive material set, then product is moved into into an apparatus for baking to be dried, and
After being pressed or being dried, the fin position on substrate need to be detected, to guarantee that fin is put in scalar potential
On, without the situation for shifting.
Known fin offset detection, is that product is imaged, then respectively to the substrate and fin in product image
Positioned, and detect both position differences to judge fin whether there is skew.
【The content of the invention】
Only, the size of fin is generally sufficiently close to substrate, even identical to around substrate size, and substrate
Also many position-limit mechanisms are provided with, when both position respectively, the boundary line identified parameters of substrate are difficult setting, if because of fin
Skew causes the border of substrate to be partially obscured or substrate is completely covered because heat sink sizes are identical with substrate size, even more
Have no way of positioning substrate, cause fin offset detection easily to have the situation of erroneous judgement.
Whence is that the purpose of the present invention is to provide a kind of fin bias detecting method for reducing detection erroneous judgement situation.
It is another object of the present invention to provide a kind of fin offset detecting device for reducing detection erroneous judgement situation.
The fin bias detecting method of foundation the object of the invention, including：One fin corner location acquisition step：Search
The boundary line of fin image, and the first corner location of fin image is calculated with the boundary line of fin image；One substrate
Corner location acquisition step：The boundary line of substrate image is calculated with the boundary line of fin image, and with the border of substrate image
Line calculates the second corner location of substrate image；One skew judges step：Calculate the first corner and the substrate shadow of fin image
The departure of the second corner Liang Dian positions of picture, and detect whether to meet preset value.
Another fin bias detecting method of foundation the object of the invention, including：One fin corner location acquisition step：
The boundary line of fin image is searched, and the first corner location of fin image is calculated with the boundary line of fin image；One
Substrate corner location acquisition step：The boundary line of substrate image is calculated with the boundary line of fin image, and with substrate image
Boundary line calculates the second corner location of substrate image；One skew judges step：Calculated with the second corner location of substrate image
Go out the size of product image, and detect whether to meet preset value.
The another fin bias detecting method of foundation the object of the invention, including：One fin corner location acquisition step：
The boundary line of fin image is searched, and the first corner location of fin image is calculated with the boundary line of fin image；One
Substrate corner location acquisition step：Being replaced with the boundary line of fin image becomes the boundary line of substrate image, and with substrate shadow
The boundary line of picture calculates the second corner location of substrate image；One skew judges step：With the second corner location of substrate image
The size of product image is calculated, and detects whether to meet preset value.
The fin offset detecting device of foundation another object of the present invention, including：To perform such as arbitrary fin
The device of bias detecting method.
The fin bias detecting method of the embodiment of the present invention and device, formerly search the boundary line of fin image
Under situation, based on the boundary line of fin image, then go to extrapolate the boundary line of substrate image, and base cannot searched
During the boundary line of project picture, can be replaced using the boundary line of fin image, be come with the size of product product image
Judge fin image whether there is and be shifted out substrate image, the boundary line identified parameters that can overcome substrate image in the past are difficult to set
Fixed, the problem for having no way of positioning substrate image reduces the situation of offset detection erroneous judgement.
【Description of the drawings】
Fig. 1 is the schematic diagram of the electronic product with load plate of the embodiment of the present invention.
Fig. 2 is the schematic diagram that the electronic product of the embodiment of the present invention is placed in load plate.
Fig. 3 A are the schematic diagrames that the fin of the embodiment of the present invention is attached at substrate predeterminated position.
Fig. 3 B are that the fin of the embodiment of the present invention attaches the schematic diagram for being offset from substrate predeterminated position.
Fig. 4 is the schematic flow sheet of the fin offset detection step of the embodiment of the present invention.
Fig. 5 is the schematic diagram of the boundary line with the first corner of the search fin image of the embodiment of the present invention.
Fig. 6 is the schematic diagram of the boundary line with the second corner of the search substrate image of the embodiment of the present invention.
Fig. 7 is the schematic diagram of the second corner of Fig. 3 B images of the embodiment of the present invention.
Fig. 8 A～D is four corresponding first corners of Fig. 3 A images of the embodiment of the present invention and the second corner location side-play amount
Schematic diagram.
Fig. 9 is the schematic diagram of the product image size of Fig. 3 B images of the embodiment of the present invention.
B load plate B1 accommodating areas
B2 spacer pin E electronic products
E1 fin E2 substrates
E3 chip Ep product images
The first corners of Ep1 fin image Ep11
The second corners of Ep2 substrate image Ep21
The second corners of Ep21 ' L1 boundary lines
L2 boundary lines L2 ' boundary lines
R1 starting point geometric profile R2 terminal geometric profiles
S scan line S1 fin corner location acquisition steps
S11 fin are sought side step S12 first and seek angle step
S2 substrate corner location acquisition step S21 substrates seek side step
S22 second seeks angle step S23 the 3rd and seeks angle step
S3 skews judge step S31 corner location detecting step
S32 product size detecting step T mark points
D is apart from x X-components
Y Y-components
【Specific embodiment】
Refer to Fig. 1,2, the electronic product E of the embodiment of the present invention is that a fin E1 is attached on a substrate E2, should
Substrate E2 is provided with a chip E3, and electronic product E can be placed on a load plate B, and load plate B is provided with the appearance of several matrix arrangements
Area B1 is put, four corners of accommodating area B1 are respectively provided with two spacer pin B2, and four angle edge of the substrate E2 of electronic product E just may be used
It is embedded between these spacer pins B2, electronic product E is limited in the B1 of the accommodating area, wherein, under standard situation, fin E1 is
Substrate E2 centres (such as Fig. 3 A) should be attached at, but in fact, fin E1 may produce skew, and spacer pin B2 and substrate
There may be gap between E2, cause fin E1 in attaching hour offset beyond substrate E2 scopes (such as Fig. 3 B), therefore need to be on load plate B
Each electronic product E imaged to carry out the offset detection of fin E1.
Raw video after electronic product E shootings need to first carry out gray proces, can be carried out partially after being converted into grayscale image
Detection is moved, is referred to shown in Fig. 4, the fin bias detecting method of the embodiment of the present invention is comprised the following steps：
One fin corner location acquisition step S1：Four first corner Ep11 positions of fin image Ep1 are obtained (as schemed
5)；
One substrate corner location acquisition step S2：Obtain four second corner Ep21 positions (such as Fig. 6) of substrate image Ep2；
One skew judges step S3：Fin shadow is judged with the position difference of 2 points of the first corner Ep11 and the second corner Ep21
As whether Ep1 offsets (such as Fig. 8 A～D), or the product image Ep sizes formed with four the second corner Ep21 ' are judging
Whether fin image Ep1 is because skew exceeds the scope (such as Fig. 9) of substrate image Ep2.
Refer to Fig. 4,5, fin corner location acquisition step S1 is comprised the following steps：
One fin seeks side step S11：Default starting point geometric profile R1 and terminal geometry are set up on gray scale product image Ep
The size of profile R2, the starting point geometric profile R1 and terminal geometric profile R2 and position are carrying out the to first product image Ep
It is to be pulled by operating personnel manually during detection once, system can be set up on follow-up product image Ep automatically afterwards, and sets
Fixed to be sent by starting point geometric profile R1, the direction for seeking several scan lines S on side is that from inside to outside or from outside to inside, gray scale becomes
Change is that in embodiments of the present invention, starting point geometric profile R1 is setting positioned at fin image Ep1 in vain or by white to black by black
It is interior, terminal geometric profile R2 be setting positioned at substrate image Ep2 is outer and scan line S direction be from inside to outside, grey scale change be by
White to black, and the grey scale change of two neighbor pixels for judging one by one to be passed through per scan line S, if the ash of two neighbor pixels
Degree change sets up mark point T in scan line S beyond preset value, then first time grey scale change in this direction at preset value
On, linking several mark points T afterwards, reckoning forms the boundary line L1 of fin image Ep1, if boundary line L1 cannot be searched,
Then judge that product image Ep cannot be detected；
One first seeks angle step S12：Behind four edges boundary line L1 for establishing fin image Ep1, because fin image Ep1 is square
Shape shape, therefore two adjacent boundary line L1 can be crossed to form the first corner Ep11, and fin image Ep1 is searched in this way
Four the first corner Ep11.
Refer to Fig. 4,6, substrate corner location acquisition step S2 is comprised the following steps：
One substrate seeks side step S21：Several scan lines S for seeking side from inside to outside are sent from the boundary line L1 of fin image Ep1,
In embodiments of the present invention, the boundary line L1 of fin image Ep1 be starting point geometric profile R1, and grey scale change be set by
White to black, therefore link several mark points T, reckoning forms the boundary line L2 of substrate image Ep2, if boundary line L2 smoothly can be searched
Then angle step S22 is sought into one second, if boundary line L2 cannot be searched, seek angle step S23 into one the 3rd；
One second seeks angle step S22：Behind four edges boundary line L2 for establishing substrate image Ep2, because substrate image Ep2 is rectangle shape
Shape, therefore two adjacent boundary line L2 can be crossed to form the second corner Ep21, and four of substrate image Ep2 are searched in this way
Second corner Ep21；
One the 3rd seeks angle step S23：When the size of fin E1 is equal to substrate E2 sizes or fin E1 beyond substrate E2 models
The situation of all boundary line L2 that cannot establish substrate image Ep2 when enclosing (such as Fig. 3 B), can be produced, Fig. 7 is referred to, if cannot search
Boundary line L2 is sought, i.e., the boundary line of substrate image Ep2 can be substituted by with the boundary line L1 for searching the fin image Ep1 of side
L2 ', and equally the second corner Ep21 ' is crossed to form with two adjacent boundary line L2, L2 ', to search four the second corner Ep21 '
Position, in embodiments of the present invention, because fin image Ep1 exceeds the upside and right side of product image Ep, therefore cannot search
Boundary line L2 on the upside of substrate image Ep2 with right side, therefore with the boundary line L1 substituents on the upside of fin image Ep1 with right side
Boundary line L2 ' of the project on the upside of Ep2 with right side, and downside and left side be because searching the boundary line L2 of substrate image Ep2, therefore
It is not required to replace with the boundary line L1 of fin image Ep1.
Fig. 4 is referred to, the skew judges that step S3 is comprised the following steps：
One corner location detecting step S31：Continue and second seek angle step S22, refer to Fig. 8 A～D, calculate positioned at four corners
Adjacent corresponding first corner Ep11 and the departure of second 2 points of positions of corner Ep21, the departure include the X for detecting at 2 points
Component x, Y-component y, comprehensive assessment is waited apart from d ..., and compare whether departure meets preset value；If there is more than one corner
Departure does not meet preset value, then judge that fin image Ep1, not on predeterminated position, offsets the nonstandard of substrate image Ep2
Agree to do a favour shape；
One product size detecting step S32：Continue and the 3rd seek angle step S23, be four the second corners with substrate image Ep2
Ep21 ' position calculation goes out the size of substrate image Ep2, and the outermost corner because of the second corner Ep21 for product image Ep,
So the size (Fig. 9 oblique line portions) of product image Ep by the size of substrate image Ep2, is set to, and comparative product image Ep
Whether size meets preset value (in embodiments of the present invention, preset value is original substrate image Ep2 sizes), if size is big
In preset value, then judge that fin image Ep1 does not offset the non-standard situation beyond substrate image Ep2 on predeterminated position；
Additionally, before product size detecting step S32 is performed, execution corner location detecting step S31 can be also added, because dissipating
In the case of backing image Ep1 is not completely covered substrate image Ep2, still there is part the first corner Ep11 and the second corner Ep21 '
It is available for calculating departure, if add before product size detecting step S32 performing corner location detecting step S31, product chi
Very little detecting step S32 only detects that fin image Ep1 is completely covered the situation of substrate image Ep2.
The embodiment of the present invention extrapolates the boundary line L1 of fin image Ep1 on the implementation, first, then by boundary line L1 is
The boundary line L2 of substrate image Ep2 is extrapolated on basis, if cannot search the boundary line L2 of substrate image Ep2, to search
The boundary line L1 of the fin image Ep1 of side replaces it, and it is scattered to intersect each formation two-by-two with two adjacent boundary line L1, L2, L2 '
Four first corner Ep11 and second corner Ep21, Ep21 ' of backing image Ep1 and substrate image Ep2, and detection compares first
Whether the departure of corner Ep11 and second corner Ep21, Ep21 ' two point position meets preset value, if there is more than one corner
Departure does not meet preset value, then judge that fin image Ep1 does not offset the non-standard of substrate image Ep2 on predeterminated position
Situation；Or when the boundary line L1 of fin image Ep1 replaces and becomes the boundary line L2 ' of substrate image Ep2, with the second corner
The position calculation of Ep21 ' goes out the size of product image Ep, if size is more than preset value, judges fin image Ep1 not pre-
If the non-standard situation beyond substrate image Ep2 is offset on position.
The fin bias detecting method of the embodiment of the present invention and device, formerly search the border of fin image Ep1
In the case of line L1, based on the boundary line L1 of fin image Ep1, then go to extrapolate the boundary line L2 of substrate image Ep2,
And when the boundary line L2 of substrate image Ep2 cannot be searched, can be replaced using the boundary line L1 of fin image Ep1,
Judge with the size of product image Ep fin image Ep1 whether there is and be shifted out substrate image Ep2, the past can be overcome
The boundary line L2 identified parameters of substrate image Ep2 are difficult setting, and the problem for having no way of positioning substrate image Ep2 reduces inclined
Move the situation of detection erroneous judgement.
Only as described above, only presently preferred embodiments of the present invention, when the model of present invention enforcement can not be limited with this
Enclose, i.e., the simple equivalence changes made according to scope of the present invention patent and invention description content generally and modification all still belong to
In the range of patent of the present invention covers.
Claims (8)
1. a kind of fin bias detecting method, including：
One fin corner location acquisition step：The boundary line of fin image is searched, and is pushed away with the boundary line of fin image
Calculate the first corner location of fin image；
One substrate corner location acquisition step：The boundary line of substrate image is calculated with the boundary line of fin image, and with substrate
The boundary line of image calculates the second corner location of substrate image；
One skew judges step：Calculate the deviation of the first corner of fin image and the second corner Liang Dian positions of substrate image
Amount, and detect whether to meet preset value.
2. a kind of fin bias detecting method, including：
One fin corner location acquisition step：The boundary line of fin image is searched, and is pushed away with the boundary line of fin image
Calculate the first corner location of fin image；
One substrate corner location acquisition step：The boundary line of substrate image is calculated with the boundary line of fin image, and with substrate
The boundary line of image calculates the second corner location of substrate image；
One skew judges step：The size of product image is calculated with the second corner location of substrate image, and detects whether symbol
Close preset value.
3. a kind of fin bias detecting method, including：
One fin corner location acquisition step：The boundary line of fin image is searched, and is pushed away with the boundary line of fin image
Calculate the first corner location of fin image；
One substrate corner location acquisition step：Being replaced with the boundary line of fin image becomes the boundary line of substrate image, and with
The boundary line of substrate image calculates the second corner location of substrate image；
One skew judges step：The size of product image is calculated with the second corner location of substrate image, and detects whether symbol
Close preset value.
4. the fin bias detecting method as described in claims 1 to 3 is arbitrary, it is characterised in that the first of the fin image
Corner is to be intersected to be formed by the boundary line of two abutting fins images.
5. the fin bias detecting method as described in claims 1 to 3 is arbitrary, it is characterised in that the second side of the substrate image
Angle intersecting is formed by the boundary line of two adjacent substrate images.
6. fin bias detecting method as claimed in claim 1, it is characterised in that departure X minute comprising 2 points of detection
Amount, Y-component and distance.
7. the fin bias detecting method as described in Claims 2 or 3, it is characterised in that the preset value is original substrate image
Size.
8. a kind of fin offset detecting device, including：To perform the fin skew inspection as described in claim 1 to 7 is arbitrary
The device of survey method.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104131322 | 2015-09-22 | ||
| TW104131322A TWI598973B (en) | 2015-09-22 | 2015-09-22 | Heat sink offset detection method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106548954A true CN106548954A (en) | 2017-03-29 |
| CN106548954B CN106548954B (en) | 2019-07-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246121A (en) * | 2019-05-15 | 2019-09-17 | 湖北工程学院 | A kind of electronic assemblies assembly accuracy detection method of view-based access control model |
| CN114227440A (en) * | 2021-12-23 | 2022-03-25 | 青岛融合光电科技有限公司 | Automatic adjusting device and adjusting method for feed amount for grinding carrier plate glass |
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| CN1844845A (en) * | 2006-03-20 | 2006-10-11 | 友达光电股份有限公司 | Alignment detection structure and alignment offset detection method |
| TW200742000A (en) * | 2006-04-18 | 2007-11-01 | Advanced Semiconductor Eng | Heatsink and heatsink positioning system |
| CN101221929A (en) * | 2007-01-12 | 2008-07-16 | 日月光半导体制造股份有限公司 | Packaging structure and its radiating module |
| EP2851942A2 (en) * | 2011-12-28 | 2015-03-25 | Princo Corp. | Packaging method for electronic components using a thin substrate |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844845A (en) * | 2006-03-20 | 2006-10-11 | 友达光电股份有限公司 | Alignment detection structure and alignment offset detection method |
| TW200742000A (en) * | 2006-04-18 | 2007-11-01 | Advanced Semiconductor Eng | Heatsink and heatsink positioning system |
| CN101221929A (en) * | 2007-01-12 | 2008-07-16 | 日月光半导体制造股份有限公司 | Packaging structure and its radiating module |
| EP2851942A2 (en) * | 2011-12-28 | 2015-03-25 | Princo Corp. | Packaging method for electronic components using a thin substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246121A (en) * | 2019-05-15 | 2019-09-17 | 湖北工程学院 | A kind of electronic assemblies assembly accuracy detection method of view-based access control model |
| CN110246121B (en) * | 2019-05-15 | 2021-06-29 | 湖北工程学院 | Electronic assembly part assembling precision detection method based on vision |
| CN114227440A (en) * | 2021-12-23 | 2022-03-25 | 青岛融合光电科技有限公司 | Automatic adjusting device and adjusting method for feed amount for grinding carrier plate glass |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI598973B (en) | 2017-09-11 |
| TW201712769A (en) | 2017-04-01 |
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