TWI596694B - Electronic component carrier transport method and device - Google Patents
Electronic component carrier transport method and device Download PDFInfo
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- TWI596694B TWI596694B TW104121228A TW104121228A TWI596694B TW I596694 B TWI596694 B TW I596694B TW 104121228 A TW104121228 A TW 104121228A TW 104121228 A TW104121228 A TW 104121228A TW I596694 B TWI596694 B TW I596694B
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- flow path
- transfer
- carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Specific Conveyance Elements (AREA)
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Description
本發明係有關於一種搬送方法及裝置,尤指一種用以搬送盛載矩陣排列複數電子元件之載盤的電子元件載盤搬送方法及裝置。 The present invention relates to a transport method and apparatus, and more particularly to an electronic component carrier transport method and apparatus for transporting a carrier carrying a plurality of electronic components in a matrix.
按,一般電子元件為便於封裝加工,常將複數電子元件以矩陣方式排列於一載盤中,以方便搬送及進行例如:點膠、塗膠、散熱片植放加工的封裝加工,然基於必要的需求,常有將二種以上的電子元件結合者,例如撓性基板(D31D2xFb1D2 substratD2)與按鍵(HD2y)的貼合,由於按鍵為一經常性被按壓作動的元件,故無法以固定之硬體電路連結,必需藉助撓性基板上所印刷的電路來與控制系統作電信導通,並藉該形成電路之基板的撓性,提供按鍵經常性作動的位移因應;此種撓性基板之電子元件與一例如按鍵之載件貼合的製程,先前技術中常採用在一載盤上盛載複數個矩陣排列的撓性基板,並以人工在各撓性基板上覆設欲與其貼合的載件,使載盤被輸送於一壓合裝置下方的軌架中,再以壓合裝置中的複數個矩陣排列的夾持模組同步對載盤上盛載的複數個矩陣排列的撓性基板及載件進行一次性壓合。 According to the general electronic components, in order to facilitate the packaging process, the plurality of electronic components are often arranged in a matrix on a carrier tray, so as to facilitate the transportation and packaging processing such as dispensing, gluing, and heat sink processing, There is a need to combine two or more electronic components, such as a flexible substrate (D31D2xFb1D2 substratD2) and a button (HD2y). Since the button is a component that is constantly pressed, it cannot be fixed. The body circuit connection must be electrically connected to the control system by means of a circuit printed on the flexible substrate, and the displacement of the button is frequently actuated by the flexibility of the substrate forming the circuit; the electronic component of the flexible substrate In the prior art, a flexible substrate in which a plurality of matrix arrays are mounted on a carrier is used in the prior art, and the carrier to be attached thereto is manually placed on each flexible substrate. The carrier is transported in a rail under the pressing device, and the plurality of matrix rows carried on the carrier are synchronized by the clamping modules arranged in a plurality of matrixes in the pressing device. The flexible substrate and the carrier member one-time pressing.
該先前技術雖然採用複數個矩陣排列的夾持模組同步對載盤上盛載的複數個矩陣排列的撓性基板及載件進行一次性壓合,但卻必須以人工在各撓性基板上覆設欲與其貼合的載件,整體效率並未因採一次性壓合複數個矩陣排列的撓性基板及載件而產生提昇;且該先前技術於載盤中 盛載的撓性基板,由於其本身具有撓性,因此在搬送過程中易生翹曲,為解決此問題,必需在載盤上放置一上蓋,以避免影響其搬送,然即使如此,在完成撓性基板與載件貼合時,撓性基板仍可能有翹曲情況,故在完成撓性基板與載件貼合後仍需設置上蓋予以覆設,惟因單純覆設撓性基板之上蓋與覆設完成貼合後的撓性基板與載件,顯然因為對應被覆蓋物不同而必須使用不同的上蓋,如此造成在製程中被搬送的物件將包括分別盛載撓性基板與載件的二載盤,以及分別覆蓋撓性基板與完成貼合後的撓性基板與載件的二上蓋,如此多的待搬送物件在一貼合製程中如何有效率被搬送,將有待被研發及突破。 The prior art uses a plurality of matrix-arranged clamping modules to simultaneously perform a one-time press-fitting of a plurality of matrix-arranged flexible substrates and carriers carried on the carrier, but must be manually applied to each flexible substrate. Covering the carrier to be attached thereto, the overall efficiency is not improved by adopting a flexible substrate and a carrier arranged by a plurality of matrixes at one time; and the prior art is in the carrier Because of its flexibility, the flexible substrate is prone to warp during transport. To solve this problem, it is necessary to place an upper cover on the carrier to avoid affecting its transport. However, even if this is done When the flexible substrate is bonded to the carrier, the flexible substrate may still be warped. Therefore, after the flexible substrate and the carrier are bonded together, the upper cover needs to be provided for the cover, but the cover of the flexible substrate is simply covered. The flexible substrate and the carrier after the coating is completed, obviously different upper covers must be used because of the different coverings, so that the articles conveyed in the process will include the flexible substrate and the carrier respectively. The second carrier, and the two upper covers covering the flexible substrate and the completed flexible substrate and the carrier, how many articles to be transported are efficiently transported in a bonding process, and will be developed and broken. .
爰是,本發明的目的,在於提供一種可有效率進行載盤搬送的電子元件載盤搬送方法。 Accordingly, an object of the present invention is to provide an electronic component carrier transport method that can efficiently carry a carrier.
本發明的另一目的,在於提供一種可有效率進行載盤搬送的電子元件載盤搬送裝置。 Another object of the present invention is to provide an electronic component carrier transport apparatus that can efficiently carry a carrier.
本發明的又一目的,在於提供一種用以執行如本發明目的電子元件載盤搬送方法的裝置。 It is still another object of the present invention to provide an apparatus for carrying out an electronic component carrier transport method as the object of the present invention.
依據本發明目的之電子元件載盤搬送方法,包括:提供一輸送流路,位於機台台面上方,呈X軸向,用以承載自一供料裝置所輸出提供的載盤;提供一傳送流路,位於機台台面下方,呈X軸向,用以承接該輸送流路所搬送的載盤;提供一移載流路,呈Z軸向,將自該輸送流路取得的載盤搬送至傳送流路。 An electronic component carrier transport method according to the present invention includes: providing a transport flow path, located above a machine table, in an X-axis for carrying a carrier provided from a supply device; providing a transport stream The road is located below the table top and is in the X-axis direction for receiving the carrier conveyed by the conveying flow path; providing a transfer flow path in the Z-axis direction, and transporting the carrier plate obtained from the conveying flow path to Transfer the flow path.
依據本發明另一目的之電子元件載盤搬送裝置,包括:一機台;一供料機構,設於該機台,包括複數個料盒,可容置複數個層層疊置之夾附有待加工元件的載盤、上蓋之組件;一取放機構,設於該機台,包括:複數個可選擇性位移之吸座,其於一移載流路作上、下位移;一流道機構, 設於該取放機構下方,包括可作選擇性位移之流道軌架,其提供一輸送流路;一輸送機構,設於該流道機構下方,包括可被驅動而進行位移的載座其在一傳送流路進行位移。 According to another object of the present invention, an electronic component carrier transport apparatus includes: a machine table; a feeding mechanism disposed on the machine base, comprising a plurality of magazines, which can accommodate a plurality of layers stacked and attached to be processed a component of the carrier and the upper cover; a pick-and-place mechanism, disposed on the machine, comprising: a plurality of selectively displaceable suction seats, which are displaced up and down in a transfer flow path; Provided below the pick-and-place mechanism, comprising a flow path rail that can be selectively displaced, which provides a transport flow path; a transport mechanism disposed below the flow path mechanism, including a carrier that can be driven to be displaced Displacement in a transport flow path.
依據本發明又一目的之電子元件載盤搬送裝置,包括:用以執行如申請專利範圍第1至5項任一項所述電子元件載盤搬送方法的裝置。 An electronic component carrier transport apparatus according to still another aspect of the present invention, comprising: an apparatus for performing the electronic component carrier transport method according to any one of claims 1 to 5.
本發明實施例之電子元件載盤搬送方法及裝置所提供由供料裝置至移載機構間之載盤搬送流路,其係由流道機構的流道軌架所形成的Y軸向可選擇性位移的X軸向輸送流路與載座在該輸送滑軌上進行滑動位移所提供的X軸向傳送流路,配合取放機構以第一取放臂連動第一吸座或第二取放臂連動下方第二吸座經鏤空的移載區間上、下位移之Z軸向移載流路所構成之X、Y、Z軸之三度空間傳送,使上蓋可以有效率的啟閉,令夾附元件的載盤及上蓋組件可有效率的被傳送;且由於供收料機構與流道軌架所提供之X軸向輸送流路,與輸送機構之載座在軌座上輸送滑軌之X軸向傳送流路,藉由流道機構而可分別處於機台台面上方及機台台面向下凹陷的工作區間中,使機台台面上方所述輸送流路與機台台面下方傳送流路在流道機構處形成一段交疊,該交疊之流路長度相當於流道軌架或移載區間長度,該交疊之流路使在整體X軸向的流路長度縮短,因而使整體機台之空間長度可以縮短,而X軸向水平輸送流路與X軸向水平傳送流路間相隔一Z軸向高度間距則提供載盤、上蓋啟、閉之操作;而由於可選擇性位移的第一取放臂下方第一吸座或第二取放臂下方第二吸座配合流道軌架的可選擇性位移及取、放載盤、上蓋,使完成提取或加工的成品一被移出,待進行提取或加工的元件立即分別置入輸送機構中載座被傳送以進行提取或加工,使整體對於搬送的效率充份發揮;且兩組搬送裝置配合移載機構,可 以使兩種不同元件分別被以載盤及上蓋夾附進行搬送,並在搬送中進行啟閉及進行貼合,使搬送的應用更廣泛。 The electronic component carrier transport method and apparatus according to the embodiment of the present invention provides a carrier transport flow path from the supply device to the transfer mechanism, which is selected by the flow path rail of the flow path mechanism. The X-axis conveying flow path of the sexual displacement and the X-axis conveying flow path provided by the sliding displacement of the carrier on the conveying rail, and the first pick-and-place arm interlocking with the first suction seat or the second take-up with the pick-and-place mechanism The three-dimensional space transmission of the X, Y, and Z axes formed by the Z-axis transfer flow path of the upper and lower displacements of the second suction seat under the hollowed-out transfer section is enabled, and the upper cover can be efficiently opened and closed. The carrier and the upper cover assembly of the attached component can be efficiently conveyed; and the X-axis conveying flow path provided by the receiving mechanism and the flow path rail, and the carrier of the conveying mechanism are conveyed on the rail seat The X-axis conveying flow path of the rail can be respectively disposed in the working section above the machine table and recessed downwardly on the machine table by the flow path mechanism, so that the conveying flow path above the machine table and the lower surface of the machine table are transmitted. The flow path forms an overlap at the flow path mechanism, and the overlapping flow path is of a considerable length The length of the flow rail or the transfer section, the overlapping flow path shortens the flow path length in the overall X-axis direction, so that the space length of the whole machine can be shortened, and the X-axis horizontal conveying flow path and the X-axis Providing a Z-axis height interval between the horizontal transfer flow paths provides the operation of the carrier plate and the upper cover opening and closing; and the first suction arm or the second extraction arm below the first extraction arm that is selectively displaceable The second suction seat cooperates with the selective displacement of the flow rail frame and the take-up, release tray and the upper cover, so that the finished product that has been extracted or processed is removed, and the components to be extracted or processed are immediately placed into the transport mechanism. Transfer for extraction or processing, so that the overall efficiency of the transfer is fully utilized; and the two sets of transfer devices cooperate with the transfer mechanism, The two different components are respectively carried by the carrier and the upper cover, and are opened and closed and bonded during transportation, so that the application of the transportation is more extensive.
A1‧‧‧元件 A1‧‧‧ components
B1‧‧‧載盤 B1‧‧‧ Carrier
B11‧‧‧上蓋 B11‧‧‧Upper cover
C‧‧‧機台 C‧‧‧ machine
C1‧‧‧機台台面 C1‧‧‧ machine table
C2‧‧‧工作區間 C2‧‧‧ working area
C3‧‧‧側座 C3‧‧‧ side seat
C4‧‧‧固定座 C4‧‧‧ fixed seat
C41‧‧‧固定部 C41‧‧‧Fixed Department
C42‧‧‧第二固定部 C42‧‧‧Second fixed department
C43‧‧‧第三固定部 C43‧‧‧The third fixed department
C5‧‧‧第一輸送區間 C5‧‧‧First delivery interval
C6‧‧‧第二輸送區間 C6‧‧‧Second transport interval
C7‧‧‧龍門軌座 C7‧‧‧Longmen rail seat
C71‧‧‧立柱 C71‧‧‧ column
C72‧‧‧橫樑 C72‧‧‧ beams
C73‧‧‧橫樑軌道 C73‧‧‧beam track
C8‧‧‧供收料機構 C8‧‧‧Receiving agency
C81‧‧‧座架 C81‧‧‧Rack
C811‧‧‧定位座 C811‧‧‧ Positioning Block
D‧‧‧搬送裝置 D‧‧‧Transporting device
D1‧‧‧供料組 D1‧‧‧Feeding Group
D11‧‧‧第一料盒 D11‧‧‧First box
D12‧‧‧第二料盒 D12‧‧‧Second box
D13‧‧‧推出件 D13‧‧‧Exhibition
D2‧‧‧取放機構 D2‧‧‧ pick-and-place mechanism
D21‧‧‧滑座 D21‧‧‧ slide
D211‧‧‧橫樑驅動件 D211‧‧‧beam drive
D22‧‧‧第一取放臂 D22‧‧‧First take-off arm
D221‧‧‧第一吸座 D221‧‧‧First suction seat
D222‧‧‧第一驅動件 D222‧‧‧First drive
D223‧‧‧第一滑軌 D223‧‧‧First slide rail
D23‧‧‧第二取放臂 D23‧‧‧Second access arm
D231‧‧‧第二吸座 D231‧‧‧Second suction seat
D232‧‧‧第二驅動件 D232‧‧‧second drive
D233‧‧‧第二滑軌 D233‧‧‧Second rail
D26‧‧‧第一組吸附元件 D26‧‧‧First group of adsorption elements
D27‧‧‧第二組吸附元件 D27‧‧‧Second group of adsorption elements
D3‧‧‧流道機構 D3‧‧‧ runner mechanism
D31‧‧‧模座 D31‧‧‧ mold base
D311‧‧‧移載區間 D311‧‧‧Transfer interval
D312‧‧‧模座軌道 D312‧‧‧ mold base track
D313‧‧‧流道軌架 D313‧‧‧Flower rail
D314‧‧‧流道驅動件 D314‧‧‧Flow drive components
D315‧‧‧流道滑座 D315‧‧‧ runner slide
D4‧‧‧輸送機構 D4‧‧‧Transportation agency
D41‧‧‧軌座 D41‧‧‧ rail seat
D411‧‧‧輸送滑軌 D411‧‧‧Transportation rails
D412‧‧‧載座 D412‧‧‧ Carrier
E‧‧‧移載機構 E‧‧‧Transportation mechanism
E1‧‧‧移載軌座 E1‧‧‧Loading rail seat
E11‧‧‧移載軌道 E11‧‧‧Transfer track
E12‧‧‧移載滑座 E12‧‧‧Transfer slide
E13‧‧‧壓合機構 E13‧‧‧Compression mechanism
E14‧‧‧第一檢視單元 E14‧‧‧First inspection unit
F‧‧‧第二檢視單元 F‧‧‧Second inspection unit
G‧‧‧加熱機構 G‧‧‧heating mechanism
H‧‧‧第三檢視單元 H‧‧‧ Third inspection unit
H1‧‧‧軌架 H1‧‧‧rail
圖1係本發明實施例載盤及上蓋與元件組合關係之立體分解示意圖。 1 is a perspective exploded view showing the relationship between a carrier disk and an upper cover and an element combination according to an embodiment of the present invention.
圖2係本發明實施例中各機構與機台配置關係立體示意圖。 FIG. 2 is a schematic perspective view showing the relationship between each mechanism and the machine configuration in the embodiment of the present invention.
圖3係本發明實施例中各機構與機台配置關係之俯視示意圖。 3 is a top plan view showing the relationship between each mechanism and the machine configuration in the embodiment of the present invention.
圖4係本發明實施例中單一搬送裝置與機台配置關係之示意圖。 4 is a schematic diagram showing the relationship between a single conveying device and a machine table in the embodiment of the present invention.
圖5係本發明實施例中單一搬送裝置與機台配置關係之俯視示意圖。 FIG. 5 is a top plan view showing the relationship between a single conveying device and a machine table in the embodiment of the present invention.
圖6係本發明實施例中吸座之二組吸附元件對載盤及上蓋進行吸附狀態之示意圖。 6 is a schematic view showing the adsorption state of the carrier and the upper cover by the two groups of adsorption elements of the suction cup in the embodiment of the present invention.
圖7係本發明實施例中吸座僅吸附上蓋而令載盤落置之示意圖。 FIG. 7 is a schematic view showing the suction cup of the embodiment of the present invention in which only the upper cover is sucked and the carrier is placed.
圖8 係本發明實施例中流道機構之立體示意圖。 Figure 8 is a perspective view of a flow path mechanism in an embodiment of the present invention.
圖9 係本發明實施例中流道機構上承載載盤之示意圖。 Figure 9 is a schematic view showing a carrier on a flow path mechanism in an embodiment of the present invention.
圖10 係本發明實施例中流道機構移至外側露出移載區間之示意圖。 Figure 10 is a schematic view showing the flow path mechanism moved to the outside to expose the transfer section in the embodiment of the present invention.
圖11 係本發明實施例中入料步驟之示意圖。 Figure 11 is a schematic illustration of the feeding step in the embodiment of the present invention.
圖12 係本發明實施例中供料移載步驟之示意圖。 Figure 12 is a schematic illustration of the feed transfer step in the embodiment of the present invention.
圖13 係本發明實施例中再入料步驟之示意圖。 Figure 13 is a schematic illustration of the refilling step in the embodiment of the present invention.
圖14 係本發明實施例中收料移載步驟之示意圖(一)。 Figure 14 is a schematic view (1) of the step of receiving and transferring materials in the embodiment of the present invention.
圖15 係本發明實施例中收料移載步驟之示意圖(二)。 Figure 15 is a schematic view (2) of the step of receiving and transferring materials in the embodiment of the present invention.
圖16 係本發明實施例中返倉移載步驟之示意圖。 Figure 16 is a schematic view showing the steps of transferring a warehouse in the embodiment of the present invention.
圖17 係本發明實施例中二搬送裝置配合一移載機構之立體示意圖。 Figure 17 is a perspective view showing the second transfer device in cooperation with a transfer mechanism in the embodiment of the present invention.
請參閱圖1,本發明實施例中之待加工元件A1,其以一矩形 的載盤B1盛載,載盤B1上以一矩形的上蓋B11覆蓋呈矩陣排列之各元件A1,其中,載盤B1的面積大於上蓋B11,在本實施例中元件A1例如撓性基板或按鍵類之載件;所述上蓋B11與載盤B1間,可設例如磁鐵之磁吸件,以使二者在蓋覆時令整組組件形成較佳之結合定位。 Referring to FIG. 1 , an element to be processed A1 in the embodiment of the present invention has a rectangular shape. The carrier B1 is loaded, and the component B1 is arranged in a matrix by a rectangular upper cover B11. The area of the carrier B1 is larger than that of the upper cover B11. In this embodiment, the component A1 is, for example, a flexible substrate or a button. A carrier member of the type; between the upper cover B11 and the carrier B1, a magnetic member such as a magnet may be disposed so that the two components form a better combined positioning when the cover is covered.
請參閱圖2、3,本發明實施例之電子元件載盤搬送方法及裝置實施例可以如圖中所示之裝置來說明,包括:一機台C,其自機台台面C1中央向下凹陷形成一工作區間C2,使機台台面C1兩側較高而各形成一側座C3,並在工作區間C2中央朝後段部位形成一凸座狀之固定座C4,該兩側座C3及固定座C4之上方表面在同一高度並形成所述機台台面C1;固定座C4區隔凹陷的工作區間C2並形成位於固定座C4與一側座C3間凹陷的第一輸送區間C5及固定座C4與另一側座C3間凹陷的第二輸送區間C6,第一輸送區間C5、第二輸送區間C6在約略同一水平高度;固定座C4上方兩側分別各形成一第一固定部C41及一第二固定部C42,固定座C4後方則形成一第三固定部C43;機台C上設有一龍門軌座C7,其兩側立柱C71立設於機台C之兩側側座C3上,兩側立柱C71上方間橫設之橫樑C72上設有Y軸向之橫樑軌道C73;一供料裝置C8,其以一座架C81下方所設之定位座C811固設於所述機台C之固定座C4後方的第三固定部C43處;本發明實施例之電子元件載盤搬送裝置係由機構相對應而分別各位於機台C第一輸送區間C5、第二輸送區間C6中及上方的二搬送裝置D所構成,並於二者間設有一移載機構E。 Referring to FIG. 2 and FIG. 3, an embodiment of an electronic component carrier carrying method and apparatus according to an embodiment of the present invention may be described as shown in the figure, including: a machine C, which is recessed from the center of the machine table C1. Forming a working section C2, so that the two sides of the machine table C1 are higher and each side forms a seat C3, and a seat-shaped fixing seat C4 is formed in the center of the working section C2 toward the rear part, the two side seats C3 and the fixing seat The upper surface of C4 is at the same height and forms the machine table C1; the fixed seat C4 is separated from the recessed working section C2 and forms a first conveying section C5 and a fixing seat C4 which are recessed between the fixing seat C4 and the one seat C3. The second conveying section C6 in which the other side seat C3 is recessed, the first conveying section C5 and the second conveying section C6 are at approximately the same level; the first fixing part C41 and the second part are respectively formed on the upper sides of the fixing seat C4. a fixing portion C42, a third fixing portion C43 is formed behind the fixing base C4; a gantry rail seat C7 is arranged on the machine table C, and two side pillars C71 are erected on the side seats C3 of the machine table C, and the two sides of the column a cross-beam C72 disposed transversely above the C71 is provided with a Y-axis beam track C73; The feeding device C8 is fixed to the third fixing portion C43 behind the fixing base C4 of the machine C by a positioning seat C811 provided under the rack C81; the electronic component carrier conveying device of the embodiment of the invention Each of the two transporting devices D in the first transport section C5 and the second transport section C6 of the machine C is correspondingly arranged by the mechanism, and a transfer mechanism E is disposed between the two.
請參閱圖4、5,該搬送裝置D包括:一供料組D1,位於該供料裝置C8一側上,其包括併設且位於靠近座架C81內側之框狀第一料盒D11,以及位於遠離座架C81外側之框狀第二料盒D12,其內供層層嵌置盛裝如圖1所示待加工貼合之元件A1的載盤 B1,每一載盤B1上以一上蓋B11覆蓋呈矩陣排列之各元件A1,並設有第一推出件D13可對每組夾附有元件A1的載盤B1、上蓋B11的組件進行推出第一料盒D11的操作;第二料盒D12內供層層嵌置原盛裝之元件A1已被取用完畢之空的載盤B1,每一載盤B1上以一上蓋B11覆蓋其上;一取放機構D2,設於該機台C上龍門軌座C7的橫樑軌道C73上,包括:一滑座D21,受一橫樑驅動件D211驅動,而可在橫樑C72上橫樑軌道C73上滑移,滑座D21上設有相併設之立向第一、二取放臂D22、D23,其中,第一取放臂D22位於朝機台C內側,第二取放臂D23位於朝機台C外側,第一、二取放臂D22、D23下方分別各設有呈矩形底面之一第一吸座D221、一第二吸座D231;所述第一取放臂D22與第一吸座D221連動,並受一第一驅動件D222所驅動,可在一第一滑軌D223上作上、下位移;所述第二取放臂D23與第二吸座D231連動,並受一第二驅動件D232所驅動,可在一第二滑軌D233上作上、下位移;所述第一吸座D221、第二吸座D231任一者均可選擇性位移地進行上、下移載,其任一者皆如圖6所示(以第一吸座D221之吸附為例),具有位於外周側且吸口較低的第一組吸附元件D26(例如吸嘴),以及位於第一組吸附元件D26內側且吸口較高之第二組吸附元件D27(例如吸嘴),當圖1中夾附有元件A1的載盤B1、上蓋B11受吸附時,係第一組吸附元件D26吸附下方面積較大之載盤B1,而第二組吸附元件D27吸附上方面積較小上蓋B11;請參閱圖7,第一組吸附元件D26用以吸附之負壓解除時,僅載盤B1不被第一組吸附元件D26吸附,該第一吸座D221仍會以第二組吸附元件D27吸附上蓋B11;一流道機構D3,請參閱圖4、8位於該取放機構D2下方,包括平台狀之模座D31;所述模座D31一側固設於機台C一側之側座C3上,另一側固設於機台C凹陷的工作區間C2中固定座C4的第一固定部C41上, 模座D31下方懸空,並設有一靠機台C內側之鏤空的移載區間D311與下方機台C凹陷的工作區間C2中第一輸送區間C5相通,該移載區間D311提供所述第一取放臂D22下方之第一吸座D221伸經其間作上、下位移之Z軸向移載流路,以搬送該圖1中組件並進行該上蓋B11之啟閉;該移載區間D311前、後兩側各設有Y軸向模座軌道D312,一流道軌架D313設於該模座軌道D312上的流道滑座D315上,請參閱圖9,其提供一機台台面C1上方的輸送流路以承載具有覆設圖1中上蓋B11之載盤B1組件;移載區間D311略成矩形,其矩形的長邊與該流道軌架D313所提供的X軸向輸送流路軸向平行,該移載區間D311的大小可供該載盤B1進出其間;請配合參閱圖8、10,流道滑座D315可受一流道驅動件D314驅動,而藉流道滑座D315所形成之轉換流路滑動,在Y軸向可選擇性位移地遷移該流道軌架D313所提供之輸送流路於靠機台C內側或靠機台C外側之間,使該輸送流路形成一可選擇性位移之流路,當流道軌架D313位移至靠機台C內側時,其下方恰對應為該鏤空之移載區間D311;一輸送機構D4,請參閱圖4,設於機台C之機台台面C1下方凹陷的工作區間C2中,並位於該流道機構D3下方,包括:立設之X軸向軌座D41,該軌座D41設於凹陷的第一輸送區間C5中,其朝機台C內的一側設有X軸向輸送滑軌D411,並於該輸送滑軌D411上設有一與輸送滑軌D411垂直,並可在其上被驅動而以水平方向設置進行滑動位移的載座D412,其位移的路徑提供一位於機台台面C1下方的X軸向傳送流路,可被控制暫停於該所述移載區間D311的下方,以搬送該圖1中上蓋B11已被開啟的載盤B1。 Referring to Figures 4 and 5, the conveying device D comprises: a feeding group D1 on the side of the feeding device C8, which comprises a frame-shaped first cartridge D11 juxtaposed and located inside the frame C81, and located at The frame-shaped second cartridge D12 which is away from the outer side of the frame C81 is embedded with a carrier plate for holding the component A1 to be processed and attached as shown in FIG. B1, each of the carriers B1 covers each of the elements A1 arranged in a matrix with an upper cover B11, and is provided with a first push-out member D13 for pushing out the components of each of the sets of the carrier B1 and the upper cover B11 with the component A1 attached thereto. The operation of a cartridge D11; the second cartridge D12 is provided with an empty carrier B1 on which the component A1 has been taken out, and each carrier B1 is covered with an upper cover B11; The pick-and-place mechanism D2 is disposed on the beam rail C73 of the gantry rail seat C7 of the machine C, and includes: a sliding seat D21, which is driven by a beam driving member D211 and can slide on the beam rail C73 of the beam C72. The sliding seat D21 is provided with the first and second receiving arms D22 and D23, wherein the first picking arm D22 is located inside the machine C, and the second picking arm D23 is located outside the machine C. Each of the first and second take-off arms D22 and D23 is respectively provided with a first suction seat D221 and a second suction seat D231 which are rectangular bottom surfaces; the first pick-and-place arm D22 is interlocked with the first suction seat D221, and Driven by a first driving member D222, it can be displaced up and down on a first sliding rail D223; the second picking and lowering arm D23 is interlocked with the second sliding seat D231, and is subjected to The second driving member D232 is driven to be moved up and down on a second sliding rail D233; any one of the first suction seat D221 and the second suction seat D231 can be moved up and down selectively. Any one of them is shown in FIG. 6 (taking the adsorption of the first suction seat D221 as an example), and has a first group of adsorption elements D26 (for example, suction nozzles) located on the outer peripheral side and having a lower suction port, and is located at the first The second group of adsorption elements D27 (for example, the suction nozzles) of the inner side of the adsorption element D26 and having a higher suction port, when the carrier B1 and the upper cover B11 of the element A1 are attached in FIG. 1 are adsorbed, the first group of adsorption elements D26 are adsorbed. The carrier B1 having a larger area is disposed below, and the second group of adsorption elements D27 adsorbs the upper cover B11 having a smaller area; referring to FIG. 7, when the negative pressure of the first group of adsorption elements D26 is released, only the carrier B1 is not The first set of adsorption elements D26 is adsorbed, and the first suction seat D221 still adsorbs the upper cover B11 by the second group of adsorption elements D27; the first-class track mechanism D3, please refer to FIGS. 4 and 8 under the pick-and-place mechanism D2, including the platform-like shape. The mold base D31; the mold base D31 side is fixed on the side seat C3 on the machine C side, and the other side is fixed on the machine base C C2 interval trap work holder on the first fixing portion C41 C4, The mold base D31 is suspended below, and a hollow transfer section D311 on the inner side of the machine C is connected to the first transport section C5 in the working section C2 recessed by the lower machine C, and the transfer section D311 provides the first take-up The first suction seat D221 under the arm D22 extends through the Z-axis transfer flow path for the upper and lower displacements to transport the assembly of FIG. 1 and perform the opening and closing of the upper cover B11; before the transfer interval D311, The rear side is provided with a Y-axis mold base rail D312, and the first-class rail frame D313 is disposed on the flow path slide D315 on the mold base rail D312. Please refer to FIG. 9 , which provides a transport above the machine table C1 . The flow path carries the carrier B1 assembly having the upper cover B11 of FIG. 1; the transfer interval D311 is slightly rectangular, and the long side of the rectangle is parallel to the X-axis conveying flow path provided by the flow path D313. The size of the transfer interval D311 can be used for the loading and unloading of the carrier B1; please refer to FIG. 8 and FIG. 10, the runner slide D315 can be driven by the first-class driving member D314, and the conversion formed by the runner slide D315 The flow path slides, and the transport flow path provided by the flow path rail D313 is selectively displaced in the Y-axis. The inner side of the table C or the outer side of the table C makes the transport flow path form a selectively displaceable flow path. When the flow path rail D313 is displaced to the inner side of the machine table C, the lower part thereof corresponds to the hollowed out The transfer section D311; a transport mechanism D4, please refer to FIG. 4, is disposed in the recessed working section C2 below the machine table C1 of the machine C, and is located below the flow path mechanism D3, including: the vertical X axis The rail seat D41 is disposed in the first conveying section C5 of the recess, and is provided with an X-axis conveying rail D411 on one side in the machine table C, and a conveying and conveying on the conveying rail D411 The slide rail D411 is vertical and can be driven thereon to be disposed in a horizontal direction for the sliding displacement of the carrier D412, the displacement path of which provides an X-axis transfer flow path below the machine table C1, which can be controlled to be suspended. Below the transfer section D311, the carrier B1 in which the upper cover B11 of Fig. 1 has been opened is transported.
本發明實施例電子元件載盤搬送方法,包括: 一入料步驟,請參閱圖1、5、8、11,使流道軌架D313受流道驅動件D314驅動而藉流道滑座D315滑動位移於靠機台C內側,並恰對應位於鏤空的移載區間D311上方;使整組夾附有元件A1的載盤B1、上蓋B11之組件,由供收料機構C8之第一供料組D1的第一料盒D11被移入流道軌架D313中;第一取放臂D22下方第一吸座D221被驅動下移以第一組吸附元件D26吸附載盤B1而第二組吸附元件D27吸附上蓋B11(參閱圖6)方式吸附整組組件後上移以完成取料;一供料移載步驟,請參閱圖1、9、12,流道軌架D313受驅動移至靠機台C外側,第一取放臂D22下方第一吸座D221被驅動下移經鏤空的移載區間D311,將整組組件交卸於在移載區間D311下方等待的輸送機構D4之載座D412後,第一取放臂D22下方第一吸座D221中的第一組吸附元件D26予以關閉負壓,而僅由第二組吸附元件D27吸附上蓋B11上移,而使盛載有元件A1的載盤B1留置在第一載座D412上(參閱圖7);載座D412承接盛載有元件A1的載盤B1後,將循軌座D41上X軸向輸送滑軌D411之傳送流路搬送至加工處被提取或被加工;一再入料步驟,請參閱圖5、8、13,使流道軌架D313受流道驅動件D314驅動而藉流道滑座D315滑動位移於靠機台C內側,並恰對應位於鏤空的第一移載區間D311上方;使下一個整組夾附有元件A1的載盤B1、上蓋B11之組件,由供收料機構C8之第一供料組D1的第一料盒D11被移入流道軌架D313中;同時滑座D21被驅動在橫樑軌道C73上滑移至靠機台C內側,使第二取放臂D23下方第二吸座D231被驅動下移以第一組吸附元件D26吸附載盤B1而第二組吸附元件D27吸附上蓋B11方式吸附整組組件後上移以完成再入料步驟; 一收料移載步驟,請參閱圖1、9、14,所有元件A1被提取或完成加工的載盤B1、上蓋B11組件,將隨載座D412循軌座D41上X軸向輸送滑軌D411之原傳送流路返回至對應鏤空的移載區間D311下方的原起送點;流道軌架D313受流道驅動件D314驅動而藉流道滑座D315滑動位移於靠機台C外側,而滑座D21被驅動在橫樑軌道C73上滑移至靠機台C外側,使第一取放臂D22下方第一吸座D221被驅動下移,經鏤空的移載區間D311以原第二組吸附元件D27(請同時配合參閱圖7)尚吸附的第一上蓋B11覆蓋在載座D412上的載盤B1上,並在第一組吸附元件D26吸附載盤B1而第二組吸附元件D27吸附上蓋B11下,完成交付整組組件給第一吸座D221,並在第一取放臂D22連動第一吸座D221下上移,請參閱圖8、15,再使流道軌架D313受流道驅動件D314驅動而藉流道滑座D315滑動位移於靠機台C內側,第一取放臂D22下方第一吸座D221被驅動下移,將載盤B1、上蓋B11空組件或載有完成加工之元件的組件置於流道軌架D313;一返倉收集步驟,請參閱圖1、5、9、16,流道軌架D313受驅動移至靠機台C外側,以將所有元件A1被提取或完成加工的載盤B1、上蓋B11組件排出至供收料機構C8之第一供料組D1的第二料盒D12中收集,並執行一接續的供料移載步驟,使第二取放臂D23下方第二吸座D231被驅動下移經鏤空的移載區間D311,將整組在前述再入料步驟中吸附暫留的夾附有元件A1的載盤B1、上蓋B11之組件,移載交卸於在移載區間D311下方等待的輸送機構D4之載座D412後,第二取放臂D23下方第二吸座D231中的第一組吸附元件D26予以關閉負壓,僅由第二組吸附元件D27吸附上蓋B11上移,而使盛載有元件A1的載盤B1留置在載座D412上(參閱圖6); 類同上述原理及方法,循環地反復進行搬送。 The electronic component carrier carrying method of the embodiment of the invention includes: Referring to Figures 1, 5, 8, and 11, the flow path rail D313 is driven by the flow path driving member D314 to be slidably displaced by the flow path sliding seat D315 on the inner side of the machine table C, and is correspondingly located in the hollow Above the transfer section D311; the assembly of the carrier B1 and the upper cover B11 to which the entire group is attached with the component A1 is moved into the flow path rail by the first cartridge D11 of the first supply group D1 of the receiving mechanism C8. In D313, the first suction seat D221 below the first pick-and-place arm D22 is driven down to the first group of adsorption elements D26 to adsorb the carrier B1 and the second group of adsorption elements D27 to adsorb the upper cover B11 (see FIG. 6) to adsorb the whole set of components. After the upward movement to complete the reclaiming; a feeding transfer step, please refer to Figures 1, 9, and 12, the flow rail D313 is driven to move to the outside of the machine C, and the first suction arm D22 is below the first suction seat The D221 is driven to move down through the hollow transfer section D311, and the entire set of components is transferred to the carrier D412 of the transport mechanism D4 waiting under the transfer section D311, and then the first pick-up arm D221 is below the first pick-up arm D221. The first group of adsorption elements D26 closes the negative pressure, and only the second group of adsorption elements D27 adsorbs the upper cover B11 up, so that the components A1 are loaded. The carrier B1 is placed on the first carrier D412 (refer to FIG. 7); after the carrier D412 receives the carrier B1 carrying the component A1, the X-axis of the tracking seat D41 is transported to the transmission path of the sliding rail D411. The transfer to the processing station is extracted or processed; the re-feeding step, please refer to Figures 5, 8, and 13, so that the flow path rail D313 is driven by the flow path driving member D314 and the slide rail slide D315 is slidably displaced to the machine table. C inside, and corresponds to the first transfer section D311 located in the hollow; the next set of components of the carrier B1 and the upper cover B11 with the component A1 attached, the first supply group D1 of the receiving mechanism C8 The first cartridge D11 is moved into the runner rail D313; at the same time, the slider D21 is driven to slide on the beam rail C73 to the inner side of the machine C, so that the second suction port D231 is driven under the second pick-and-place arm D23. Moving down the first group of adsorption elements D26 to adsorb the carrier B1 and the second group of adsorption elements D27 adsorbing the upper cover B11 to adsorb the entire set of components and then moving up to complete the re-feeding step; For a material transfer and transfer step, please refer to Figures 1, 9, and 14. The carrier B1 and the upper cover B11 assembly of all components A1 are extracted or finished, and the slide rail D411 will be conveyed along the X-axis of the carrier D412 on the rail seat D41. The original transport flow path returns to the original lift point below the corresponding transfer section D311; the flow rail D313 is driven by the flow path drive D314 and is slidably displaced by the flow path slide D315 outside the machine C, The carriage D21 is driven to slide on the beam rail C73 to the outside of the machine C, so that the first suction seat D221 below the first pick-and-place arm D22 is driven to move downward, and the hollow second transfer section D311 is adsorbed by the original second group. The component D27 (please refer to FIG. 7 at the same time) is attached to the carrier B1 on the carrier D412, and the carrier B1 is adsorbed on the first group of adsorption elements D26 and the second group of adsorption elements D27 is adsorbed on the cover. Under B11, the whole set of components is delivered to the first suction cup D221, and moved up by the first pick-up arm D22 linked to the first suction seat D221, please refer to Figures 8 and 15, and then the flow path rail D313 is subjected to the flow path. The driving member D314 is driven to be slidably displaced from the inside of the machine C by the runner slide D315, and the first suction seat D221 is located below the first pick-and-place arm D22. Driven down, place the carrier B1, the upper cover B11 empty component or the component carrying the finished component on the flow rail D313; a return storage step, please refer to Figure 1, 5, 9, 16 The rail D313 is driven to move to the outside of the machine C to discharge the carrier B1 and the upper cover B11 assembly from which all components A1 are extracted or finished to the second cartridge of the first supply group D1 of the receiving mechanism C8. Collecting in D12, and performing a subsequent feeding and transferring step, so that the second suction seat D231 under the second pick-and-place arm D23 is driven down and moved through the hollowing transfer section D311, and the whole group is in the foregoing re-feeding step. The components of the carrier B1 and the upper cover B11 of the component A1 are attached to the adsorption retention, and are transferred and unloaded to the carrier D412 of the transport mechanism D4 waiting under the transfer section D311, and the second suction arm D23 is secondly sucked. The first group of adsorption elements D26 in the seat D231 is closed with a negative pressure, and only the second group of adsorption elements D27 adsorbs the upper cover B11 up, and the carrier B1 carrying the element A1 is placed on the carrier D412 (see FIG. 6). ); Similar to the above principles and methods, the transport is repeated cyclically.
請參閱圖17,本發明實施例中二搬送裝置D中可以一搬送裝置D搬送待進行貼合的第一個元件,而以另一個搬送裝置D搬送待進行貼合的第二個元件,而使藉由移載機構E將第一個元件由一搬送裝置D搬送至另一個搬送裝置D與第二個元件貼合,並由原搬送第一個元件的搬送裝置D送回第一個元件已被提取完的空載盤B1,及由原搬送第二個元件的搬送裝置D送回盛載有已完成第一個元件、第二個元件貼合成品的載盤B1;該移載機構E,包括:一移載軌座E1,其兩端固設於機台C之兩側側座C3上,其上設有Y軸向之移載軌道E11,移載軌道E11上設有移載滑座E12,移載滑座E12上設有Z軸向同步連動之壓合機構E13及第一檢視單元E14,可在移載軌道E11上位移於該搬送第一個元件的搬送裝置D之輸送滑軌D411上載座D412與搬送第二個元件的另一個搬送裝置D的輸送滑軌D411上載座D412間;該壓合機構E13具有吸附及壓合構件,其可採用例如申請人所申請的第104107816號「壓合方法及裝置」中所揭露的壓合裝置;該第一檢視單元E14可為一由上往下進行檢視之CCD鏡頭;一第二檢視單元F,設於該機台C凹陷的工作區間C2中,並在二搬送裝置D的二輸送滑軌D411間,且為移載滑座E12上壓合機構E13自搬送第一個元件的搬送裝置D之輸送滑軌D411上載座D412移至搬送第二個元件的搬送裝置D之輸送滑軌D411上載座D412的路徑中,其可為一由下往上進行檢視之CCD鏡頭;一加熱機構G,設於該機台C凹陷的工作區間C2中,並在該搬送第一個元件的搬送裝置D之輸送滑軌D411與搬送第二個元件的另一個搬送裝置D的輸送滑軌D411間,且為載座D412在該搬送第二個元件的搬送 裝置D的輸送滑軌D411上載座D412滑移的路徑中,加熱機構G位於載座B12下方,;一第三檢視單元H,可為一由上往下進行檢視之CCD鏡頭,並以一軌架H1設於該機台C靠該搬送第二個元件的搬送裝置D的輸送滑軌D411一側的側座C3上,其可在軌架H1上受驅動作Y軸向滑移,該第三檢視單元H恰對應位於該搬送第二個元件的搬送裝置D的輸送滑軌D411上載座D412在該輸送滑軌D411上滑移的路徑中,並為該載座D412的上方,用以檢視完成貼合的成品;所述第二檢視單元F、加熱機構G同在移載機構E中移載軌座E1上移載軌道E11所引導提供之直線移載路徑上,該第二檢視單元F、加熱機構G在該移載路徑上之連線為一平行於該移載軌道D311之直線。 Referring to FIG. 17, in the second transport apparatus D of the embodiment of the present invention, one transporting device D can transport the first component to be bonded, and the other transporting device D can transport the second component to be bonded. The first component is transferred from the one transport device D to the other transport device D by the transfer mechanism E, and is bonded to the second component, and the first component is returned by the transport device D that originally transports the first component. The empty tray B1 that has been extracted, and the transport device D that originally transports the second component are sent back to the carrier B1 carrying the completed first component and the second component bonding product; the transfer mechanism E, comprising: a transfer rail seat E1, the two ends of which are fixed on the side seats C3 of the machine table C, and the Y-axis transfer rail E11 is arranged thereon, and the transfer rail E11 is provided with a transfer The carriage E12 and the transfer carriage E12 are provided with a Z-axis synchronous interlocking pressing mechanism E13 and a first inspection unit E14, which can be displaced on the transfer rail E11 by the conveying device D for conveying the first component. The slide rail D411 is mounted between the dock D412 and the transport rail D411 of the other transport device D carrying the second component, and is placed between the dock D412; The squeezing mechanism E13 has a squeezing and squeezing member, and the squeezing device disclosed in the "Pressing Method and Apparatus" of the applicant's application No. 104107816; A CCD lens for inspection; a second inspection unit F is disposed in the working section C2 of the machine C recessed, and is between the two conveying rails D411 of the second conveying device D, and is pressed by the transfer sliding seat E12 The transport mechanism D13 moves from the transport rail D411 of the transport device D that transports the first component to the transport D412 of the transport device D that transports the second component to the transport D412, which can be a lower path. a CCD lens that is viewed upward; a heating mechanism G is disposed in the recess C12 of the machine C, and transports the slide D411 and the second component to the transport device D that transports the first component The transfer rail D411 of the other transport device D is transported by the carrier D412 in the transport of the second component. The conveying slide D411 of the device D is in the path of the sliding movement of the seat D412, and the heating mechanism G is located below the carrier B12. The third inspection unit H can be a CCD lens for viewing from top to bottom, and is guided by a rail. The frame H1 is disposed on the side seat C3 on the side of the transport rail D411 of the transport device D for transporting the second component, and is driven to be axially slipped on the rail frame H1. The three view unit H corresponds to the transport slide D411 of the transport device D for transporting the second component, and the carriage D412 slides on the transport slide D411, and is above the carrier D412 for viewing. Finishing the finished product; the second viewing unit F and the heating mechanism G are on the linear transfer path provided by the transfer track E11 on the transfer rail seat E1 in the transfer mechanism E, and the second inspection unit F The line connecting the heating mechanism G on the transfer path is a line parallel to the transfer track D311.
本發明實施例中,該移載機構E將執行如下之搬送方法:一移載步驟,被搬送裝置D搬送於移載機構E處的載座D412上的載盤B1上的第一元件將受移載機構E上第一檢視單元E14以由上往下進行檢視之CCD鏡頭進行檢視對位,壓合機構E13將依第一檢視單元E14檢測對位取得的資訊,撿取該通過檢視的第一元件循移載軌座E1上橫設的Y軸向之移載軌道E11所提供的Y軸向移載路徑,移至該移載路徑上的第二檢視單元F上方,以由下往上進行檢視之CCD鏡頭對該第一元件下方進行檢測,並藉此取得該第一元件下方對位資訊,壓合機構E13在依據第二檢視單元F取得的對位資訊下,將該第一元件移載至另一個搬送裝置D載座D412中載盤B1上的第二元件上方;一貼合步驟,使壓合機構E13將該第一元件下移與第二元件貼合,在貼合過程中,透過壓合機構E13進行加壓及透過該已盛載第一元件、第二元件的載座D412下方在該移載路徑上的加熱機構G,使加熱機構G由下 往上抵入載座D412進行加熱,以使第一元件與第二元件完成貼合,再使完成貼合的成品藉載座D412之位移而至第三檢視單元H處,以由上往下進行檢視之CCD鏡頭進行成品檢核;一回送步驟,搬送第一元件的搬送裝置D中載座D412上載盤B1中所有第一元件逐一被提取後,載座D412連同其上空的載盤B1循軌座D41上X軸向輸送滑軌D411之原傳送流路將先被回送至原軌座D41上起送點;另一個原搬送第二元件的搬送裝置D中載座D412則在完成所有第一元件與第二第二元件貼合及檢視後,載座D412才連同其上盛載第一元件、第二元件完成貼合之成品的載盤B1,循軌座D41的X軸向輸送滑軌D411之原傳送流路回送至原軌座D41上起送點。 In the embodiment of the present invention, the transfer mechanism E performs the following transfer method: a transfer step, the first component carried by the transfer device D on the carrier B1 on the carrier D412 at the transfer mechanism E is subject to The first inspection unit E14 of the transfer mechanism E performs the inspection alignment with the CCD lens that is viewed from the top down, and the pressing mechanism E13 detects the information obtained by the alignment according to the first inspection unit E14, and extracts the information obtained by the inspection. The Y-axis transfer path provided by the Y-axis transfer track E11 disposed on the traverse carrier rail E1 is moved to the top of the second inspection unit F on the transfer path to be from bottom to top. The CCD lens for inspection detects the underside of the first component, and thereby obtains the alignment information under the first component, and the pressing mechanism E13 performs the first component under the alignment information obtained by the second viewing unit F. Transfer to the second component on the carrier B1 of the other carrier D carrier D412; a bonding step, the pressing mechanism E13 moves the first component down and the second component is attached, in the bonding process Pressurizing and transmitting the first component through the pressing mechanism E13 D412 carriage below the second heating element means G in the transfer path, the heating means by the G Upwardly entering the carrier D412 for heating, so that the first component and the second component are completed, and then the finished finished carrier D412 is displaced to the third inspection unit H, from top to bottom. The CCD lens for inspection is used for product inspection; in a returning step, the carrier D of the first component is carried in the carrier D412. After all the first components in the tray B1 are extracted one by one, the carrier D412 is followed by the carrier B1 above it. The original conveying flow path of the X-axis conveying rail D411 on the rail seat D41 will be sent back to the starting point of the original rail seat D41, and the carrier D412 of the other conveying unit D of the original second element is completed. After a component is attached and inspected by the second component, the carrier D412 is transported along with the X-axis of the tracking seat D41 along with the carrier B1 on which the first component and the second component are attached. The original conveying flow path of the rail D411 is sent back to the starting point on the original rail seat D41.
本發明實施例之電子元件載盤搬送方法及裝置,由於搬送裝置D所提供由供料裝置C至移載機構D3間之載盤搬送流路,其係由流道機構D3的流道軌架D313所形成的Y軸向可選擇性位移的X軸向輸送流路與載座D412在該輸送滑軌D411上進行滑動位移所提供的X軸向傳送流路,配合取放機構D2以第一取放臂D22連動第一吸座D221或第二取放臂D23連動下方第二吸座D231經鏤空的移載區間D311上、下位移之Z軸向移載流路所構成之X、Y、Z軸之三度空間傳送,使上蓋B11可以有效率的啟閉,令夾附元件A的載盤B1及上蓋B11組件可有效率的被傳送;且由於供收料機構D與流道軌架D313所提供之X軸向輸送流路,與輸送機構D4之載座D412在軌座D41上輸送滑軌D411之X軸向傳送流路,藉由流道機構D3而可分別處於機台台面C1上方及機台台面C1向下凹陷的工作區間C2中,使機台台面C1上方所述輸送流路與機台台面C1下方傳送流路在流道機構D3處形成一段交疊,該交疊之流路長度相當於流道軌架D313或移載區間D311長度,該交疊之流路使在整體X軸向的流路長度縮短,因而使整體機台C之空間長度可以 縮短,而X軸向水平輸送流路與X軸向水平傳送流路間相隔一Z軸向高度間距則提供載盤、上蓋啟、閉之操作;而由於可選擇性位移的第一取放臂D22下方第一吸座D221或第二取放臂D23下方第二吸座D231配合流道軌架D313的可選擇性位移及取、放載盤、上蓋,使完成提取或加工的成品一被移出,待進行提取或加工的元件立即分別置入輸送機構D4中載座D412被傳送以進行提取或加工,使整體對於搬送的效率充份發揮;且兩組搬送裝置D配合移載機構E,可以使兩種不同元件分別被以載盤B1及上蓋B11夾附進行搬送,並在搬送中進行啟閉及進行貼合,使搬送的應用更廣泛。 In the electronic component carrier transport method and apparatus according to the embodiment of the present invention, the carrier transport path between the supply device C and the transfer mechanism D3 is provided by the transport device D, which is the flow path rail of the flow path mechanism D3. The X-axis transport flow path formed by D313 and the selectively displaceable X-axis transport flow path and the X-axis transport flow path provided by the carrier D412 on the transport slide rail D411 are matched with the pick-and-place mechanism D2. The pick-up arm D22 is linked with the first suction seat D221 or the second pick-up arm D23, and the second suction seat D231 is connected with the X-axis transfer flow path of the upper and lower displacement Z311. The three-dimensional space transmission of the Z-axis enables the upper cover B11 to be efficiently opened and closed, so that the carrier B1 and the upper cover B11 assembly of the component A can be efficiently transported; and because the receiving and receiving mechanism D and the flow path rail The X-axis conveying flow path provided by D313 and the carrier D412 of the conveying mechanism D4 convey the X-axis conveying flow path of the sliding rail D411 on the rail seat D41, and can be respectively located on the machine table C1 by the flow path mechanism D3. In the working section C2 in which the upper and the table top C1 are recessed downward, the conveying flow path and the machine above the machine table C1 are made. The conveying flow path below the table C1 forms a section at the flow path mechanism D3, and the length of the overlapping flow path is equivalent to the length of the flow path rail D313 or the transfer section D311, and the overlapping flow path is made in the overall X-axis direction. The length of the flow path is shortened, so that the space length of the whole machine C can be Shortened, and the X-axis horizontal conveying flow path and the X-axis horizontal conveying flow path are separated by a Z-axis height spacing to provide the operation of the carrier plate and the upper cover opening and closing; and the first displacement arm capable of being selectively displaced The first suction seat D221 below the D22 or the second suction seat D231 under the second pick-and-place arm D23 cooperates with the selective displacement of the flow path rail D313 and the take-up and release trays and the upper cover, so that the finished product that has been extracted or processed is removed. The components to be extracted or processed are immediately placed in the transport mechanism D4, and the carrier D412 is transported for extraction or processing, so that the overall efficiency of the transport is fully utilized; and the two sets of transport devices D cooperate with the transfer mechanism E, The two different components are respectively carried by the carrier B1 and the upper cover B11, and are opened and closed and bonded during transportation, so that the application of the transportation is wider.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
C‧‧‧機台 C‧‧‧ machine
C1‧‧‧機台台面 C1‧‧‧ machine table
C2‧‧‧工作區間 C2‧‧‧ working area
C3‧‧‧側座 C3‧‧‧ side seat
C4‧‧‧固定座 C4‧‧‧ fixed seat
C41‧‧‧固定部 C41‧‧‧Fixed Department
C42‧‧‧第二固定部 C42‧‧‧Second fixed department
C43‧‧‧第三固定部 C43‧‧‧The third fixed department
C5‧‧‧第一輸送區間 C5‧‧‧First delivery interval
C6‧‧‧第二輸送區間 C6‧‧‧Second transport interval
C7‧‧‧龍門軌座 C7‧‧‧Longmen rail seat
C71‧‧‧立柱 C71‧‧‧ column
C72‧‧‧橫樑 C72‧‧‧ beams
C73‧‧‧橫樑軌道 C73‧‧‧beam track
D‧‧‧搬送裝置 D‧‧‧Transporting device
D2‧‧‧取放機構 D2‧‧‧ pick-and-place mechanism
D21‧‧‧滑座 D21‧‧‧ slide
D211‧‧‧橫樑驅動件 D211‧‧‧beam drive
D22‧‧‧第一取放臂 D22‧‧‧First take-off arm
D221‧‧‧第一吸座 D221‧‧‧First suction seat
D222‧‧‧第一驅動件 D222‧‧‧First drive
D223‧‧‧第一滑軌 D223‧‧‧First slide rail
D23‧‧‧第二取放臂 D23‧‧‧Second access arm
D231‧‧‧第二吸座 D231‧‧‧Second suction seat
D232‧‧‧第二驅動件 D232‧‧‧second drive
D233‧‧‧第二滑軌 D233‧‧‧Second rail
D3‧‧‧流道機構 D3‧‧‧ runner mechanism
D31‧‧‧模座 D31‧‧‧ mold base
D311‧‧‧移載區間 D311‧‧‧Transfer interval
D312‧‧‧模座軌道 D312‧‧‧ mold base track
D313‧‧‧流道軌架 D313‧‧‧Flower rail
D315‧‧‧流道滑座 D315‧‧‧ runner slide
D41‧‧‧軌座 D41‧‧‧ rail seat
D411‧‧‧輸送滑軌 D411‧‧‧Transportation rails
D412‧‧‧載座 D412‧‧‧ Carrier
Claims (14)
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TW104121228A TWI596694B (en) | 2015-06-30 | 2015-06-30 | Electronic component carrier transport method and device |
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CN108575084B (en) * | 2017-03-14 | 2021-04-27 | 万润科技股份有限公司 | Conveying method and device |
TWI683394B (en) * | 2018-02-14 | 2020-01-21 | 萬潤科技股份有限公司 | Processing carrier, laminating equipment and transportation method using the processing carrier |
TWI776315B (en) * | 2020-12-14 | 2022-09-01 | 萬潤科技股份有限公司 | Conveyor rail frame and carrier tray covering method and device using the same |
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TW200816887A (en) * | 2006-09-28 | 2008-04-01 | Hon Tech Inc | Conveying device and method adapted for electronic element |
TW201425190A (en) * | 2012-12-28 | 2014-07-01 | Nagaoka Seisakusho Corp | Parts reversing unit |
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TW201701392A (en) | 2017-01-01 |
CN106332538B (en) | 2019-01-01 |
CN106332538A (en) | 2017-01-11 |
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