TWI593768B - 先設置型半導體封裝用膜 - Google Patents

先設置型半導體封裝用膜 Download PDF

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Publication number
TWI593768B
TWI593768B TW102132545A TW102132545A TWI593768B TW I593768 B TWI593768 B TW I593768B TW 102132545 A TW102132545 A TW 102132545A TW 102132545 A TW102132545 A TW 102132545A TW I593768 B TWI593768 B TW I593768B
Authority
TW
Taiwan
Prior art keywords
film
semiconductor
component
semiconductor sealing
sealing
Prior art date
Application number
TW102132545A
Other languages
English (en)
Chinese (zh)
Other versions
TW201410820A (zh
Inventor
吉田真樹
川本里美
寺木慎
Original Assignee
納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 納美仕有限公司 filed Critical 納美仕有限公司
Publication of TW201410820A publication Critical patent/TW201410820A/zh
Application granted granted Critical
Publication of TWI593768B publication Critical patent/TWI593768B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW102132545A 2012-09-13 2013-09-10 先設置型半導體封裝用膜 TWI593768B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012201146A JP6106389B2 (ja) 2012-09-13 2012-09-13 先設置型半導体封止用フィルム

Publications (2)

Publication Number Publication Date
TW201410820A TW201410820A (zh) 2014-03-16
TWI593768B true TWI593768B (zh) 2017-08-01

Family

ID=50612846

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102132545A TWI593768B (zh) 2012-09-13 2013-09-10 先設置型半導體封裝用膜

Country Status (2)

Country Link
JP (1) JP6106389B2 (ja)
TW (1) TWI593768B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873771B2 (en) 2014-06-04 2018-01-23 Hitachi Chemical Company, Ltd. Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
KR102319292B1 (ko) 2014-10-10 2021-11-01 나믹스 가부시끼가이샤 열경화성 수지 조성물 및 그의 제조 방법
JP6837237B2 (ja) * 2017-05-11 2021-03-03 ナミックス株式会社 ダイボンディング剤
KR102488314B1 (ko) * 2018-12-27 2023-01-13 주식회사 두산 반도체 패키지용 비전도성 접착필름 및 이를 이용하는 반도체 패키지의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200814256A (en) * 2006-08-10 2008-03-16 Sumitomo Bakelite Co Semiconductor package and method for manufacturing the same, sealing resin and semiconductor device
TW201226468A (en) * 2010-11-25 2012-07-01 Asahi Kasei E Materials Corp Epoxy resin and resin composition
CN102666723A (zh) * 2009-11-27 2012-09-12 欧姆龙株式会社 单液性环氧树脂组合物及其利用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2600536B2 (ja) * 1991-10-02 1997-04-16 日立化成工業株式会社 接着剤組成物の製造方法
JPH0786465A (ja) * 1993-09-16 1995-03-31 Toshiba Corp 半導体封止用エポキシ樹脂組成物
CN1957012B (zh) * 2004-03-31 2011-07-20 旭化成电子材料株式会社 环氧树脂用硬化剂及环氧树脂组合物
JP2012158719A (ja) * 2011-02-02 2012-08-23 Hitachi Chemical Co Ltd 半導体封止充てん用エポキシ樹脂組成物並びにそれを用いた半導体装置及び半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200814256A (en) * 2006-08-10 2008-03-16 Sumitomo Bakelite Co Semiconductor package and method for manufacturing the same, sealing resin and semiconductor device
CN102666723A (zh) * 2009-11-27 2012-09-12 欧姆龙株式会社 单液性环氧树脂组合物及其利用
TW201226468A (en) * 2010-11-25 2012-07-01 Asahi Kasei E Materials Corp Epoxy resin and resin composition

Also Published As

Publication number Publication date
JP2014055245A (ja) 2014-03-27
JP6106389B2 (ja) 2017-03-29
TW201410820A (zh) 2014-03-16

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