TWI593768B - 先設置型半導體封裝用膜 - Google Patents
先設置型半導體封裝用膜 Download PDFInfo
- Publication number
- TWI593768B TWI593768B TW102132545A TW102132545A TWI593768B TW I593768 B TWI593768 B TW I593768B TW 102132545 A TW102132545 A TW 102132545A TW 102132545 A TW102132545 A TW 102132545A TW I593768 B TWI593768 B TW I593768B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- semiconductor
- component
- semiconductor sealing
- sealing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012201146A JP6106389B2 (ja) | 2012-09-13 | 2012-09-13 | 先設置型半導体封止用フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201410820A TW201410820A (zh) | 2014-03-16 |
TWI593768B true TWI593768B (zh) | 2017-08-01 |
Family
ID=50612846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102132545A TWI593768B (zh) | 2012-09-13 | 2013-09-10 | 先設置型半導體封裝用膜 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6106389B2 (ja) |
TW (1) | TWI593768B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9873771B2 (en) | 2014-06-04 | 2018-01-23 | Hitachi Chemical Company, Ltd. | Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device |
KR102319292B1 (ko) | 2014-10-10 | 2021-11-01 | 나믹스 가부시끼가이샤 | 열경화성 수지 조성물 및 그의 제조 방법 |
JP6837237B2 (ja) * | 2017-05-11 | 2021-03-03 | ナミックス株式会社 | ダイボンディング剤 |
KR102488314B1 (ko) * | 2018-12-27 | 2023-01-13 | 주식회사 두산 | 반도체 패키지용 비전도성 접착필름 및 이를 이용하는 반도체 패키지의 제조방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200814256A (en) * | 2006-08-10 | 2008-03-16 | Sumitomo Bakelite Co | Semiconductor package and method for manufacturing the same, sealing resin and semiconductor device |
TW201226468A (en) * | 2010-11-25 | 2012-07-01 | Asahi Kasei E Materials Corp | Epoxy resin and resin composition |
CN102666723A (zh) * | 2009-11-27 | 2012-09-12 | 欧姆龙株式会社 | 单液性环氧树脂组合物及其利用 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2600536B2 (ja) * | 1991-10-02 | 1997-04-16 | 日立化成工業株式会社 | 接着剤組成物の製造方法 |
JPH0786465A (ja) * | 1993-09-16 | 1995-03-31 | Toshiba Corp | 半導体封止用エポキシ樹脂組成物 |
CN1957012B (zh) * | 2004-03-31 | 2011-07-20 | 旭化成电子材料株式会社 | 环氧树脂用硬化剂及环氧树脂组合物 |
JP2012158719A (ja) * | 2011-02-02 | 2012-08-23 | Hitachi Chemical Co Ltd | 半導体封止充てん用エポキシ樹脂組成物並びにそれを用いた半導体装置及び半導体装置の製造方法 |
-
2012
- 2012-09-13 JP JP2012201146A patent/JP6106389B2/ja active Active
-
2013
- 2013-09-10 TW TW102132545A patent/TWI593768B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200814256A (en) * | 2006-08-10 | 2008-03-16 | Sumitomo Bakelite Co | Semiconductor package and method for manufacturing the same, sealing resin and semiconductor device |
CN102666723A (zh) * | 2009-11-27 | 2012-09-12 | 欧姆龙株式会社 | 单液性环氧树脂组合物及其利用 |
TW201226468A (en) * | 2010-11-25 | 2012-07-01 | Asahi Kasei E Materials Corp | Epoxy resin and resin composition |
Also Published As
Publication number | Publication date |
---|---|
JP2014055245A (ja) | 2014-03-27 |
JP6106389B2 (ja) | 2017-03-29 |
TW201410820A (zh) | 2014-03-16 |
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