TWI589959B - Method for manufacturing single-sided board - Google Patents

Method for manufacturing single-sided board Download PDF

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Publication number
TWI589959B
TWI589959B TW105110482A TW105110482A TWI589959B TW I589959 B TWI589959 B TW I589959B TW 105110482 A TW105110482 A TW 105110482A TW 105110482 A TW105110482 A TW 105110482A TW I589959 B TWI589959 B TW I589959B
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Taiwan
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single panel
manufacturing
thermoplastic substrate
release film
panel according
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TW105110482A
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Chinese (zh)
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TW201736911A (en
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黃慧貞
顏志明
賴忠孝
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台虹科技股份有限公司
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Priority to TW105110482A priority Critical patent/TWI589959B/en
Priority to CN201610312792.5A priority patent/CN107283991A/en
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Publication of TW201736911A publication Critical patent/TW201736911A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

單面板的製造方法Single panel manufacturing method

本發明是有關於一種單面板的製造方法，且特別是有關於一種不限於使用塗佈機台與環化機台即可進行生產的單面板的製造方法。The present invention relates to a method of manufacturing a single panel, and more particularly to a method of manufacturing a single panel that can be produced without using a coating machine and a cyclizing machine.

一般製造單面板是使用塗佈與環化的方式生產，所以需要使用塗佈機台與環化機台。此外，由於上述方法的機速慢且製程繁瑣，因此造成製造工時長，且製造單面板的產能有限。另外，使用塗佈法不容易生產厚的單面板，且生產成本較高。Generally, the production of a single panel is produced by coating and cyclizing, so it is necessary to use a coating machine and a cycling machine. In addition, since the above method has a slow machine speed and a cumbersome process, the manufacturing time is long and the production capacity of the single panel is limited. In addition, it is not easy to produce a thick single panel using a coating method, and the production cost is high.

另一方面，由於在以上述方法進行單面板的製作時，須使用溶劑，因此會產生環保的問題。On the other hand, since a solvent is used in the production of a single panel by the above method, environmental problems are caused.

本發明提供一種單面板的製造方法，其可有效地提升單面板的產能。The invention provides a method for manufacturing a single panel, which can effectively increase the productivity of a single panel.

本發明提供另一種單面板的製造方法，其可藉由簡易且低成本的方式製作出厚的單面板。The present invention provides another method of manufacturing a single panel that can produce a thick single panel in a simple and low cost manner.

本發明提出一種單面板的製造方法，包括下列步驟。對依序堆疊設置的第一金屬層、至少一層第一熱塑性基材、離型膜、至少一層第二熱塑性基材與第二金屬層以捲對捲的方式進行熱壓合製程。在進行熱壓合製程之後，分別捲收第一單面板、離型膜與第二單面板，其中第一單面板包括堆疊設置的第一熱塑性基材與第一金屬層，且第二單面板包括堆疊設置的第二熱塑性基材與第二金屬層。The present invention provides a method of manufacturing a single panel comprising the following steps. The first metal layer, the at least one first thermoplastic substrate, the release film, and the at least one second thermoplastic substrate and the second metal layer are sequentially subjected to a thermal compression bonding process in a roll-to-roll manner. After performing the thermocompression bonding process, the first single panel, the release film and the second single panel are separately wound, wherein the first single panel comprises a first thermoplastic substrate and a first metal layer stacked in a stack, and the second single panel A second thermoplastic substrate and a second metal layer disposed in a stack are included.

依照本發明的一實施例所述，在上述之單面板的製造方法中，第一熱塑性基材與第二熱塑性基材的材料例如是熱塑性聚醯亞胺(TPI)、液晶聚合物(LCP)或聚胺甲酸酯(PU)。According to an embodiment of the invention, in the method for manufacturing a single panel, the material of the first thermoplastic substrate and the second thermoplastic substrate is, for example, a thermoplastic polyimine (TPI) or a liquid crystal polymer (LCP). Or polyurethane (PU).

依照本發明的一實施例所述，在上述之單面板的製造方法中，第一熱塑性基材與第二熱塑性基材的玻璃轉移溫度(Tg)的範圍可為150℃至400℃。According to an embodiment of the present invention, in the above method for manufacturing a single panel, the glass transition temperature (Tg) of the first thermoplastic substrate and the second thermoplastic substrate may range from 150 ° C to 400 ° C.

依照本發明的一實施例所述，在上述之單面板的製造方法中，離型膜的材料例如是聚醯亞胺(PI)、聚乙烯(PE)、聚乙烯對苯二甲酸酯(PET)、鐵氟龍(Teflon)或聚-4-甲基-1-戊烯(TPX)。According to an embodiment of the present invention, in the above method for manufacturing a single panel, the material of the release film is, for example, polyimine (PI), polyethylene (PE), or polyethylene terephthalate ( PET), Teflon or poly-4-methyl-1-pentene (TPX).

依照本發明的一實施例所述，在上述之單面板的製造方法中，離型膜的中心線平均粗糙度(Ra)的範圍可為0.05微米至10微米。According to an embodiment of the present invention, in the above method for manufacturing a single panel, the center line average roughness (Ra) of the release film may range from 0.05 μm to 10 μm.

依照本發明的一實施例所述，在上述之單面板的製造方法中，熱壓合製程的壓合壓力的範圍可為10 KN至50 KN。According to an embodiment of the present invention, in the manufacturing method of the single panel described above, the pressing pressure of the thermocompression bonding process may range from 10 KN to 50 KN.

依照本發明的一實施例所述，在上述之單面板的製造方法中，熱壓合製程的壓合溫度的範圍可為200℃至400℃，且壓合溫度例如是大於第一熱塑性基材與第二熱塑性基材的玻璃轉移溫度至少50℃。According to an embodiment of the present invention, in the manufacturing method of the single panel, the pressing temperature of the thermocompression bonding process may range from 200 ° C to 400 ° C, and the pressing temperature is, for example, greater than the first thermoplastic substrate. The glass transition temperature with the second thermoplastic substrate is at least 50 °C.

依照本發明的一實施例所述，在上述之單面板的製造方法中，熱壓合製程的機速的範圍可為0.5公尺/分(m/min)至10公尺/分。According to an embodiment of the present invention, in the manufacturing method of the single panel described above, the machine speed of the thermocompression bonding process may range from 0.5 m/min to 10 m/min.

依照本發明的一實施例所述，在上述之單面板的製造方法中，在進行所述熱壓合製程之後，相鄰的第一熱塑性基材與離型膜之間的剝離強度的範圍可為0.001 kgf/cm至0.5 kgf/cm，進一步可為0.002 kgf/cm至0.2 kgf/cm，更可為0.002 kgf/cm至0.1 kgf/cm。相鄰的第二熱塑性基材與離型膜之間的剝離強度的範圍可為0.001 kgf/cm至0.5 kgf/cm，進一步可為0.002 kgf/cm至0.2 kgf/cm，更可為0.002 kgf/cm至0.1 kgf/cm。According to an embodiment of the present invention, in the manufacturing method of the single panel described above, after the thermal compression bonding process, the range of peeling strength between the adjacent first thermoplastic substrate and the release film may be It may be from 0.001 kgf/cm to 0.5 kgf/cm, further from 0.002 kgf/cm to 0.2 kgf/cm, and more preferably from 0.002 kgf/cm to 0.1 kgf/cm. The peel strength between the adjacent second thermoplastic substrate and the release film may range from 0.001 kgf/cm to 0.5 kgf/cm, further from 0.002 kgf/cm to 0.2 kgf/cm, and more preferably 0.002 kgf/ Cm to 0.1 kgf/cm.

本發明提出另一種單面板的製造方法，包括下列步驟。對依序堆疊設置的離型膜、多層熱塑性基材與金屬層以捲對捲的方式進行熱壓合製程。在進行熱壓合製程之後，分別捲收單面板與離型膜，其中單面板包括堆疊設置的熱塑性基材與金屬層。The present invention proposes another method of manufacturing a single panel comprising the following steps. The release film, the multilayer thermoplastic substrate and the metal layer which are sequentially stacked are subjected to a thermocompression bonding process in a roll-to-roll manner. After the thermal compression process, the single panel and the release film are separately wound, wherein the single panel comprises a stacked thermoplastic substrate and a metal layer.

依照本發明的另一實施例所述，在上述之單面板的製造方法中，離型膜的材料例如是聚醯亞胺、聚乙烯、聚乙烯對苯二甲酸酯、鐵氟龍或聚-4-甲基-1-戊烯。According to another embodiment of the present invention, in the above method for manufacturing a single panel, the material of the release film is, for example, polyimide, polyethylene, polyethylene terephthalate, Teflon or poly. -4-methyl-1-pentene.

依照本發明的另一實施例所述，在上述之單面板的製造方法中，離型膜的中心線平均粗糙度的範圍可為0.05微米至10微米。According to another embodiment of the present invention, in the above method for manufacturing a single panel, the center line average roughness of the release film may range from 0.05 μm to 10 μm.

依照本發明的另一實施例所述，在上述之單面板的製造方法中，熱塑性基材的材料例如是熱塑性聚醯亞胺、液晶聚合物或聚胺甲酸酯。According to another embodiment of the present invention, in the above method for manufacturing a single panel, the material of the thermoplastic substrate is, for example, a thermoplastic polyimide, a liquid crystal polymer or a polyurethane.

依照本發明的另一實施例所述，在上述之單面板的製造方法中，熱塑性基材的玻璃轉移溫度的範圍可為150℃至400℃。According to another embodiment of the present invention, in the above method for manufacturing a single panel, the glass transition temperature of the thermoplastic substrate may range from 150 ° C to 400 ° C.

依照本發明的另一實施例所述，在上述之單面板的製造方法中，熱壓合製程的壓合壓力的範圍可為10 KN至50 KN之間。According to another embodiment of the present invention, in the above-described manufacturing method of the single panel, the pressing pressure of the thermocompression bonding process may range from 10 KN to 50 KN.

依照本發明的另一實施例所述，在上述之單面板的製造方法中，熱壓合製程的壓合溫度的範圍可為200℃至400℃，且壓合溫度例如是大於熱塑性基材的玻璃轉移溫度至少50℃。According to another embodiment of the present invention, in the manufacturing method of the single panel described above, the pressing temperature of the thermocompression bonding process may range from 200 ° C to 400 ° C, and the pressing temperature is, for example, greater than that of the thermoplastic substrate. The glass transition temperature is at least 50 °C.

依照本發明的另一實施例所述，在上述之單面板的製造方法中，熱壓合製程的機速的範圍可為0.5公尺/分至10公尺/分。According to another embodiment of the present invention, in the above-described manufacturing method of the single panel, the machine speed of the thermocompression bonding process may range from 0.5 m/min to 10 m/min.

依照本發明的另一實施例所述，在上述之單面板的製造方法中，進行熱壓合製程之後，相鄰的熱塑性基材與離型膜之間的剝離強度的範圍可為0.001 kgf/cm至0.5 kgf/cm，進一步可為0.002 kgf/cm至0.2 kgf/cm，更可為0.002 kgf/cm至0.1 kgf/cm。According to another embodiment of the present invention, in the above method for manufacturing a single panel, after the thermal compression bonding process, the peel strength between the adjacent thermoplastic substrate and the release film may range from 0.001 kgf/ From cm to 0.5 kgf/cm, further from 0.002 kgf/cm to 0.2 kgf/cm, and more preferably from 0.002 kgf/cm to 0.1 kgf/cm.

基於上述，在本發明所提出的單面板的製造方法中，由於使用熱壓合製程來製作單面板，所以不限於使用塗佈機台與環化機台即可進行單面板的生產，且可避免產生環保的問題。另一方面，由於採用捲對捲的熱壓合製程，因此可不受限於塗佈機台與環化機台的產能，且可使得生產機速提高並縮短製造工時。Based on the above, in the method for manufacturing a single panel proposed by the present invention, since a single panel is produced by using a thermal compression bonding process, it is not limited to the production of a single panel by using a coating machine and a cycling machine, and Avoid environmental problems. On the other hand, since the roll-to-roll hot press process is employed, it is not limited to the productivity of the coater and the cycling machine, and the production speed can be increased and the manufacturing man-hour can be shortened.

此外，藉由對依序堆疊設置的第一金屬層、第一熱塑性基材、離型膜、第二熱塑性基材與第二金屬層以捲對捲的方式進行熱壓合製程，可單次壓合兩個單面板，因此可有效地提升單面板的產能。另外，藉由對依序堆疊設置的離型膜、多層熱塑性基材與金屬層以捲對捲的方式進行熱壓合製程，可單次壓合多層熱塑性基材而製作單面板，因此可藉由簡易且低成本的方式製作出厚的單面板。另一方面，藉由捲收離型膜，可將離型膜回收使用，進而可降低製造成本。In addition, the first metal layer, the first thermoplastic substrate, the release film, the second thermoplastic substrate and the second metal layer which are sequentially stacked are subjected to a thermal compression bonding process in a roll-to-roll manner, which can be performed once. The two single panels are pressed together, which effectively increases the productivity of the single panel. In addition, by performing a thermal compression bonding process on the release film, the multilayer thermoplastic substrate and the metal layer which are sequentially stacked, the single-panel can be produced by pressing the multilayer thermoplastic substrate in a single pass, so that it can be borrowed A thick single panel is produced in an easy and low cost manner. On the other hand, by taking up the release film, the release film can be recycled and used, and the manufacturing cost can be reduced.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.

圖1為本發明一實施例的單面板的製造方式的示意圖。圖2為本發明一實施例的單面板的製造流程圖。1 is a schematic view showing a manufacturing method of a single panel according to an embodiment of the present invention. 2 is a flow chart showing the manufacture of a single panel according to an embodiment of the present invention.

請同時參照圖1與圖2，進行步驟S100，對依序堆疊設置的金屬層200、至少一層熱塑性基材202、離型膜204、至少一層熱塑性基材206與金屬層208以捲對捲的方式進行熱壓合製程。藉此，可同時將單面板S1、S2壓合在離型膜204上。Referring to FIG. 1 and FIG. 2 simultaneously, step S100 is performed to sequentially stack the metal layer 200, the at least one thermoplastic substrate 202, the release film 204, the at least one thermoplastic substrate 206 and the metal layer 208 in a roll-to-roll manner. The method is performed by a thermocompression bonding process. Thereby, the single panels S1, S2 can be simultaneously pressed against the release film 204.

金屬層200、208的材料例如是銅、鋁、銀或其合金。熱塑性基材202、206的材料例如是熱塑性聚醯亞胺、液晶聚合物或聚胺甲酸酯。熱塑性基材202、206的玻璃轉移溫度的範圍可為150℃至400℃。在一實施例中，熱塑性基材202、206的玻璃轉移溫度的範圍可為150℃至300℃。熱塑性基材202、206的厚度的範圍可為9微米至200微米。離型膜204的材料例如是聚醯亞胺、聚乙烯、聚乙烯對苯二甲酸酯、鐵氟龍或聚-4-甲基-1-戊烯。離型膜204的中心線平均粗糙度的範圍可為0.05微米至10微米。The material of the metal layers 200, 208 is, for example, copper, aluminum, silver or alloys thereof. The material of the thermoplastic substrates 202, 206 is, for example, a thermoplastic polyimide, a liquid crystal polymer or a polyurethane. The glass transition temperatures of the thermoplastic substrates 202, 206 can range from 150 °C to 400 °C. In one embodiment, the glass transition temperatures of the thermoplastic substrates 202, 206 can range from 150 °C to 300 °C. The thickness of the thermoplastic substrates 202, 206 can range from 9 microns to 200 microns. The material of the release film 204 is, for example, polyimide, polyethylene, polyethylene terephthalate, Teflon or poly-4-methyl-1-pentene. The centerline average roughness of the release film 204 may range from 0.05 microns to 10 microns.

熱壓合製程例如是藉由多軸壓合機100來進行製作。多軸壓合機100包括出料輪102、104、106、108、110、壓合滾輪112、導輪114與收料輪116、118、120，但本發明並不以此為限。The thermocompression bonding process is produced, for example, by a multi-axis press machine 100. The multi-axis press machine 100 includes discharge wheels 102, 104, 106, 108, 110, a press roller 112, a guide wheel 114, and a receiving wheel 116, 118, 120, but the invention is not limited thereto.

在此實施例中，多軸壓合機100是以5軸壓合機為例來進行說明。此外，於此技術領域具有通常知識者可依照產品需求來調整熱塑性基材202與熱塑性基材206的層數，以控制單面板S1、S2的厚度。在此實施例中，熱塑性基材202與熱塑性基材206的層數是以一層為例來進行說明。在其他實施例中，熱塑性基材202與熱塑性基材206的層數亦可為多層，此時會對應調整多軸壓合機100所使用的出料輪數量。In this embodiment, the multi-axis press machine 100 will be described by taking a 5-axis press machine as an example. In addition, those skilled in the art can adjust the number of layers of thermoplastic substrate 202 and thermoplastic substrate 206 to control the thickness of single panels S1, S2 in accordance with product requirements. In this embodiment, the number of layers of the thermoplastic substrate 202 and the thermoplastic substrate 206 is described by taking one layer as an example. In other embodiments, the number of layers of the thermoplastic substrate 202 and the thermoplastic substrate 206 may also be multiple layers, and the number of discharge wheels used in the multi-axis press machine 100 may be adjusted accordingly.

舉例來說，可藉由出料輪102、104、106、108、110分別提供金屬層200、熱塑性基材202、離型膜204、熱塑性基材206與金屬層208至壓合滾輪112進行熱壓合製程。熱壓合製程熱壓合製程的壓合壓力的範圍可為10 KN至50 KN。熱壓合製程的壓合溫度的範圍可為200℃至400℃，且壓合溫度例如是大於熱塑性基材的玻璃轉移溫度至少50℃。在一實施例中，熱壓合製程的壓合溫度的範圍可為300℃至380℃。熱壓合製程的機速的範圍可為0.5公尺/分至10公尺/分。在進行熱壓合製程之後，相鄰的熱塑性基材202與離型膜204之間的剝離強度的範圍可為0.001 kgf/cm至0.5 kgf/cm，進一步可為0.002 kgf/cm至0.2 kgf/cm，更可為0.002 kgf/cm至0.1 kgf/cm。相鄰的熱塑性基材206與離型膜204之間的剝離強度的範圍可為0.001 kgf/cm至0.5 kgf/cm，進一步可為0.002 kgf/cm至0.2 kgf/cm，更可為0.002 kgf/cm至0.1 kgf/cm。相鄰的熱塑性基材202與離型膜204之間的剝離強度以及相鄰的熱塑性基材206與離型膜204之間的剝離強度可藉由壓合溫度與機速來進行調整。For example, the metal layer 200, the thermoplastic substrate 202, the release film 204, the thermoplastic substrate 206, and the metal layer 208 may be supplied to the press roller 112 by the discharge wheels 102, 104, 106, 108, 110, respectively. Pressing process. The press-bonding pressure of the thermocompression bonding process can range from 10 KN to 50 KN. The press-bonding temperature of the thermocompression bonding process may range from 200 ° C to 400 ° C, and the press-bonding temperature is, for example, at least 50 ° C greater than the glass transition temperature of the thermoplastic substrate. In one embodiment, the press-fit temperature of the thermocompression process can range from 300 °C to 380 °C. The machine speed of the thermocompression process can range from 0.5 meters per minute to 10 meters per minute. After the thermal compression process, the peel strength between the adjacent thermoplastic substrate 202 and the release film 204 may range from 0.001 kgf/cm to 0.5 kgf/cm, and further may range from 0.002 kgf/cm to 0.2 kgf/ The cm can be from 0.002 kgf/cm to 0.1 kgf/cm. The peel strength between the adjacent thermoplastic substrate 206 and the release film 204 may range from 0.001 kgf/cm to 0.5 kgf/cm, further from 0.002 kgf/cm to 0.2 kgf/cm, and more preferably 0.002 kgf/ Cm to 0.1 kgf/cm. The peel strength between the adjacent thermoplastic substrate 202 and the release film 204 and the peel strength between the adjacent thermoplastic substrate 206 and the release film 204 can be adjusted by the press temperature and the machine speed.

進行步驟S102，在進行熱壓合製程之後，分別捲收單面板S1、離型膜204與單面板S2，其中單面板S1包括堆疊設置的熱塑性基材202與金屬層200，且單面板S2包括堆疊設置的熱塑性基材206與金屬層208。Step S102 is performed. After performing the thermal compression bonding process, the single panel S1, the release film 204, and the single panel S2 are respectively wound, wherein the single panel S1 includes the stacked thermoplastic substrate 202 and the metal layer 200, and the single panel S2 includes The thermoplastic substrate 206 and the metal layer 208 are stacked.

舉例來說，離型膜204與壓合在離型膜204上的單面板S1、S2可經由導輪114進行傳輸，再藉由收料輪116、118、120分別捲收單面板S1、離型膜204與單面板S2。For example, the release film 204 and the single panels S1 and S2 pressed onto the release film 204 can be transported via the guide wheel 114, and then the single panel S1 is separated by the receiving wheels 116, 118, and 120, respectively. The film 204 is a single panel S2.

基於上述實施例可知，由於使用熱壓合製程來製作單面板S1、S2，所以不限於使用塗佈機台與環化機台即可進行單面板S1、S2的生產，且可避免產生環保的問題。此外，由於採用捲對捲的熱壓合製程，因此可不受限於塗佈機台與環化機台的產能，且可使得生產機速提高並縮短製造工時。另一方面，藉由捲收離型膜204，可將離型膜204回收使用，進而可降低製造成本。According to the above embodiment, since the single-panel S1 and S2 are produced by using the thermal compression bonding process, the production of the single-panel S1 and S2 can be performed without using the coating machine and the cycling machine, and environmental protection can be avoided. problem. In addition, since the roll-to-roll hot press process is employed, it is not limited to the productivity of the coater and the cycling machine, and the production speed can be increased and the manufacturing man-hour can be shortened. On the other hand, by taking up the release film 204, the release film 204 can be recycled and used, and the manufacturing cost can be reduced.

另外，藉由對依序堆疊設置的金屬層200、熱塑性基材202、離型膜204、熱塑性基材206與金屬層208以捲對捲的方式進行熱壓合製程，可單次壓合兩個單面板而同時製作出單面板S1、S2，因此可有效地提升單面板的產能。In addition, by performing the thermal compression bonding process on the metal layer 200, the thermoplastic substrate 202, the release film 204, the thermoplastic substrate 206, and the metal layer 208 which are sequentially stacked, the film can be pressed once in a single roll. The single panel and the single panel S1 and S2 are simultaneously produced, so that the productivity of the single panel can be effectively improved.

圖3為本發明另一實施例的單面板的製造方式的示意圖。圖4為本發明另一實施例的單面板的製造流程圖。3 is a schematic view showing a manufacturing method of a single panel according to another embodiment of the present invention. 4 is a flow chart showing the manufacture of a single panel according to another embodiment of the present invention.

請同時參照圖3與圖4，進行步驟S200，對依序堆疊設置的離型膜400、熱塑性基材402、404與金屬層406以捲對捲的方式進行熱壓合製程。藉此，可單次壓合多層熱塑性基材(如，熱塑性基材402、404)而製作出厚的單面板S3。Referring to FIG. 3 and FIG. 4 simultaneously, in step S200, the release film 400, the thermoplastic substrates 402, 404 and the metal layer 406 which are sequentially stacked are subjected to a thermal compression bonding process in a roll-to-roll manner. Thereby, a plurality of thermoplastic substrates (e.g., thermoplastic substrates 402, 404) can be laminated in a single pass to produce a thick single panel S3.

離型膜400的材料例如是材料例如是聚醯亞胺、聚乙烯、聚乙烯對苯二甲酸酯、鐵氟龍或聚-4-甲基-1-戊烯。離型膜400的中心線平均粗糙度的範圍可為0.05微米至10微米。熱塑性基材402、404的材料例如是熱塑性聚醯亞胺、液晶聚合物或聚胺甲酸酯。熱塑性基材402、404的玻璃轉移溫度的範圍可為150℃至400℃。在一實施例中，熱塑性基材402、404的玻璃轉移溫度範圍可為150℃至300℃。熱塑性基材402、404的厚度的範圍可為9微米至200微米之間。金屬層406的材料例如是銅、鋁、銀或其合金。 The material of the release film 400 is, for example, a material such as polyimide, polyethylene, polyethylene terephthalate, Teflon or poly-4-methyl-1-pentene. The centerline average roughness of the release film 400 may range from 0.05 microns to 10 microns. The material of the thermoplastic substrate 402, 404 is, for example, a thermoplastic polyimide, a liquid crystal polymer or a polyurethane. The glass transition temperatures of the thermoplastic substrates 402, 404 can range from 150 °C to 400 °C. In one embodiment, the thermoplastic substrate 402, 404 can have a glass transition temperature in the range of from 150 °C to 300 °C. The thickness of the thermoplastic substrates 402, 404 can range from 9 microns to 200 microns. The material of the metal layer 406 is, for example, copper, aluminum, silver or an alloy thereof.

熱壓合製程例如是藉由多軸壓合機300來進行製作。多軸壓合機300包括出料輪302、304、306、308、310、壓合滾輪312、導輪314與收料輪316、318，但本發明並不以此為限。 The thermocompression bonding process is produced, for example, by a multi-axis press machine 300. The multi-axis press machine 300 includes discharge wheels 302, 304, 306, 308, 310, a press roller 312, a guide wheel 314, and a receiving wheel 316, 318, but the invention is not limited thereto.

在此實施例中，多軸壓合機300是以5軸壓合機為例來進行說明，且熱塑性基材的層數是以兩層(即，熱塑性基材402、404)為例來進行說明，但本發明並不以此為限。於此技術領域具有通常知識者可依照產品需求來調整熱塑性基材的層數，以控制單面板S3的厚度。亦即，只要熱塑性基材的層數為多層即屬於本發明所保護的範圍。在另一實施例中，熱塑性基材的層數亦可為三層以上，此時會對應調整多軸壓合機100所使用的出料輪數量。 In this embodiment, the multi-axis press machine 300 is exemplified by a 5-axis press machine, and the number of layers of the thermoplastic substrate is exemplified by two layers (ie, thermoplastic substrates 402, 404). It should be noted that the invention is not limited thereto. Those skilled in the art will be able to adjust the number of layers of thermoplastic substrate to control the thickness of the single panel S3 in accordance with product requirements. That is, as long as the number of layers of the thermoplastic substrate is a plurality of layers, it is within the scope of protection of the present invention. In another embodiment, the number of layers of the thermoplastic substrate may be three or more, and the number of discharge wheels used in the multi-axis press 100 may be adjusted accordingly.

舉例來說，可藉由出料輪302、304、308、310分別提供離型膜400、熱塑性基材402、404與金屬層406至壓合滾輪312進行熱壓合製程。熱壓合製程的壓合壓力的範圍可為10KN至50KN。熱壓合製程的壓合溫度的範圍可為200℃至400℃，且壓合溫度例如是大於熱塑性基材的玻璃轉移溫度至少50℃。在一實施例中，熱壓合製程的壓合溫度的範圍可為300℃至380℃。熱壓合製程的 機速的範圍可為0.5公尺/分至10公尺/分。在進行熱壓合製程之後，相鄰的熱塑性基材402與離型膜400之間的剝離強度的範圍可為0.001kgf/cm至0.5kgf/cm，進一步可為0.002kgf/cm至0.2kgf/cm，更可為0.002kgf/cm至0.1kgf/cm。相鄰的熱塑性基材402與離型膜400之間的剝離強度可藉由壓合溫度與機速來進行調整。 For example, the release film 400, the thermoplastic substrate 402, 404, and the metal layer 406 to the press roller 312 can be separately subjected to a thermal compression process by the discharge wheels 302, 304, 308, and 310. The press pressure of the thermocompression bonding process can range from 10 KN to 50 KN. The press-bonding temperature of the thermocompression bonding process may range from 200 ° C to 400 ° C, and the press-bonding temperature is, for example, at least 50 ° C greater than the glass transition temperature of the thermoplastic substrate. In one embodiment, the press-fit temperature of the thermocompression process can range from 300 °C to 380 °C. Hot press process The speed of the machine can range from 0.5 meters per minute to 10 meters per minute. After the thermocompression bonding process, the peel strength between the adjacent thermoplastic substrate 402 and the release film 400 may range from 0.001 kgf/cm to 0.5 kgf/cm, and further may range from 0.002 kgf/cm to 0.2 kgf/ The cm may be from 0.002 kgf/cm to 0.1 kgf/cm. The peel strength between the adjacent thermoplastic substrate 402 and the release film 400 can be adjusted by the pressing temperature and the machine speed.

進行步驟S202，在進行熱壓合製程之後，分別捲收單面板S3與離型膜400，其中單面板S3包括堆疊設置的熱塑性基材402、404與金屬層406。 Step S202 is performed. After performing the thermal compression bonding process, the single panel S3 and the release film 400 are respectively wound up, wherein the single panel S3 includes the stacked thermoplastic substrates 402, 404 and the metal layer 406.

舉例來說，離型膜400與壓合在離型膜400上的單面板S3可經由導輪314進行傳輸，再藉由收料輪316、318分別捲收離型膜400與單面板S3。 For example, the release film 400 and the single panel S3 pressed onto the release film 400 can be transported via the guide wheel 314, and the release film 400 and the single panel S3 are respectively wound up by the take-up wheels 316, 318.

基於上述實施例可知，由於使用熱壓合製程來製作單面板S3，所以不限於使用塗佈機台與環化機台即可進行單面板S3的生產，且可避免產生環保的問題。此外，由於採用捲對捲的熱壓合製程，因此可不受限於塗佈機台與環化機台的產能，且可使得生產機速提高並縮短製造工時。另一方面，藉由捲收離型膜400，可將離型膜400回收使用，進而可降低製造成本。 According to the above embodiment, since the single-panel S3 is produced by using the thermal compression bonding process, the production of the single-panel S3 can be performed without using the coating machine and the cycling machine, and the problem of environmental protection can be avoided. In addition, since the roll-to-roll hot press process is employed, it is not limited to the productivity of the coater and the cycling machine, and the production speed can be increased and the manufacturing man-hour can be shortened. On the other hand, by releasing the release film 400, the release film 400 can be recycled and used, and the manufacturing cost can be reduced.

另一方面，藉由對依序堆疊設置的離型膜400、多層熱塑性基材402、404與金屬層406以捲對捲的方式進行熱壓合製程，可單次壓合多層熱塑性基材(如，熱塑性基材402、404)而製作單面板，因此可藉由簡易且低成本的方式製作出厚的單面板。 On the other hand, by subjecting the release film 400, the multilayer thermoplastic substrates 402, 404 and the metal layer 406 which are sequentially stacked to be subjected to a thermal compression bonding process in a roll-to-roll manner, a plurality of thermoplastic substrates can be individually pressed ( For example, the thermoplastic substrates 402 and 404) are formed into a single panel, so that a thick single panel can be produced in a simple and low-cost manner.

綜上所述，上述實施例的單面板的製造方法不限於使用塗佈機台與環化機台即可進行單面板的生產，且可避免產生環保的問題。此外，上述實施例的單面板的製造方法可有效地提升單面板的產能。另外，上述實施例的單面板的製造方法可藉由簡易且低成本的方式製作出厚的單面板。另一方面，上述實施例的單面板的製造方法能夠將離型膜回收使用，進而可降低製造成本。As described above, the manufacturing method of the single panel of the above embodiment is not limited to the production of a single panel by using the coating machine and the cycling machine, and the problem of environmental protection can be avoided. In addition, the manufacturing method of the single panel of the above embodiment can effectively increase the productivity of the single panel. Further, the method for manufacturing a single panel of the above embodiment can produce a thick single panel in a simple and low-cost manner. On the other hand, in the manufacturing method of the single panel of the above embodiment, the release film can be recycled and used, and the manufacturing cost can be reduced.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100、300‧‧‧多軸壓合機100, 300‧‧‧ multi-axis press

102、104、106、108、110、302、304、306、308、310‧‧‧出料輪102, 104, 106, 108, 110, 302, 304, 306, 308, 310‧‧‧ discharge wheels

112、312‧‧‧壓合滾輪112, 312‧‧‧ Pressing roller

114、314‧‧‧導輪114, 314‧‧·guide wheels

116、118、120、316、318‧‧‧收料輪116, 118, 120, 316, 318‧‧‧ receiving wheels

200、208、406‧‧‧金屬層200, 208, 406‧‧‧ metal layers

202、206、402、404‧‧‧熱塑性基材202, 206, 402, 404‧‧‧ thermoplastic substrates

204、400‧‧‧離型膜204, 400‧‧‧ release film

S1、S2、S3‧‧‧單面板S1, S2, S3‧‧‧ single panel

S100、S102、S200、S202‧‧‧步驟S100, S102, S200, S202‧‧‧ steps

圖1為本發明一實施例的單面板的製造方式的示意圖。 圖2為本發明一實施例的單面板的製造流程圖。 圖3為本發明另一實施例的單面板的製造方式的示意圖。 圖4為本發明另一實施例的單面板的製造流程圖。1 is a schematic view showing a manufacturing method of a single panel according to an embodiment of the present invention. 2 is a flow chart showing the manufacture of a single panel according to an embodiment of the present invention. 3 is a schematic view showing a manufacturing method of a single panel according to another embodiment of the present invention. 4 is a flow chart showing the manufacture of a single panel according to another embodiment of the present invention.

S100、S102‧‧‧步驟 S100, S102‧‧‧ steps

Claims (20)

一種單面板的製造方法，包括：對依序堆疊設置的第一金屬層、至少一層第一熱塑性基材、離型膜、至少一層第二熱塑性基材與第二金屬層以捲對捲的方式進行熱壓合製程；以及在進行所述熱壓合製程之後，分別捲收第一單面板、所述離型膜與第二單面板至不同的收料輪中，其中所述第一單面板包括堆疊設置的所述至少一層第一熱塑性基材與所述第一金屬層，且所述第二單面板包括堆疊設置的所述至少一層第二熱塑性基材與所述第二金屬層。 A method for manufacturing a single panel, comprising: stacking a first metal layer, at least one first thermoplastic substrate, a release film, and at least one second thermoplastic substrate and a second metal layer in a roll-to-roll manner Performing a thermocompression bonding process; and, after performing the thermocompression bonding process, respectively winding the first single panel, the release film and the second single panel into different receiving wheels, wherein the first single panel The at least one first thermoplastic substrate and the first metal layer are stacked in a stack, and the second single panel includes the at least one second thermoplastic substrate and the second metal layer stacked in a stack. 如申請專利範圍第1項所述的單面板的製造方法，其中所述至少一層第一熱塑性基材與所述至少一層第二熱塑性基材的材料包括熱塑性聚醯亞胺、液晶聚合物或聚胺甲酸酯。 The method of manufacturing a single panel according to claim 1, wherein the material of the at least one first thermoplastic substrate and the at least one second thermoplastic substrate comprises a thermoplastic polyimide, a liquid crystal polymer or a poly Carbamate. 如申請專利範圍第1項所述的單面板的製造方法，其中所述至少一層第一熱塑性基材與所述至少一層第二熱塑性基材的玻璃轉移溫度的範圍為150℃至400℃。 The method of manufacturing a single panel according to claim 1, wherein the glass transition temperature of the at least one first thermoplastic substrate and the at least one second thermoplastic substrate ranges from 150 ° C to 400 ° C. 如申請專利範圍第1項所述的單面板的製造方法，其中所述離型膜的材料包括聚醯亞胺、聚乙烯、聚乙烯對苯二甲酸酯、鐵氟龍或聚-4-甲基-1-戊烯。 The method for manufacturing a single panel according to claim 1, wherein the material of the release film comprises polyimide, polyethylene, polyethylene terephthalate, Teflon or poly-4- Methyl-1-pentene. 如申請專利範圍第1項所述的單面板的製造方法，其中所述離型膜的中心線平均粗糙度的範圍為0.05微米至10微米。 The method of manufacturing a single panel according to claim 1, wherein the release film has a center line average roughness ranging from 0.05 μm to 10 μm. 如申請專利範圍第1項所述的單面板的製造方法，其中所述熱壓合製程的壓合壓力的範圍為10KN至50KN。 The method of manufacturing a single panel according to the first aspect of the invention, wherein the pressing pressure of the thermocompression bonding process ranges from 10 KN to 50 KN. 如申請專利範圍第1項所述的單面板的製造方法，其中所述熱壓合製程的壓合溫度的範圍為200℃至400℃，且所述壓合溫度大於所述至少一層第一熱塑性基材與所述至少一層第二熱塑性基材的玻璃轉移溫度至少50℃。 The method for manufacturing a single panel according to claim 1, wherein the thermocompression bonding process has a pressing temperature in the range of 200 ° C to 400 ° C, and the pressing temperature is greater than the at least one first thermoplastic layer. The glass transition temperature of the substrate and the at least one second thermoplastic substrate is at least 50 °C. 如申請專利範圍第1項所述的單面板的製造方法，其中所述熱壓合製程的機速的範圍為0.5公尺/分至10公尺/分。 The method of manufacturing a single panel according to the first aspect of the invention, wherein the machine speed of the thermocompression bonding process ranges from 0.5 m/min to 10 m/min. 如申請專利範圍第1項所述的單面板的製造方法，其中在進行所述熱壓合製程之後，相鄰的所述第一熱塑性基材與所述離型膜之間的剝離強度的範圍為0.001kgf/cm至0.5kgf/cm，且相鄰的所述第二熱塑性基材與所述離型膜之間的剝離強度的範圍為0.001kgf/cm至0.5kgf/cm。 The method for manufacturing a single panel according to claim 1, wherein a range of peeling strength between the adjacent first thermoplastic substrate and the release film after performing the thermal compression bonding process It is from 0.001 kgf/cm to 0.5 kgf/cm, and the peel strength between the adjacent second thermoplastic substrate and the release film ranges from 0.001 kgf/cm to 0.5 kgf/cm. 如申請專利範圍第9項所述的單面板的製造方法，其中在進行所述熱壓合製程之後，相鄰的所述第一熱塑性基材與所述離型膜之間的剝離強度的範圍為0.002kgf/cm至0.1kgf/cm，且相鄰的所述第二熱塑性基材與所述離型膜之間的剝離強度的範圍為0.002kgf/cm至0.1kgf/cm。 The method for manufacturing a single panel according to claim 9, wherein a range of peeling strength between the adjacent first thermoplastic substrate and the release film after performing the thermal compression bonding process It is from 0.002 kgf/cm to 0.1 kgf/cm, and the peel strength between the adjacent second thermoplastic substrate and the release film ranges from 0.002 kgf/cm to 0.1 kgf/cm. 一種單面板的製造方法，包括：對依序堆疊設置的離型膜、多層熱塑性基材與金屬層以捲對捲的方式進行熱壓合製程；以及在進行所述熱壓合製程之後，分別捲收單面板與所述離型膜 至不同的收料輪中，其中所述單面板包括堆疊設置的所述多層熱塑性基材與所述金屬層。 A method for manufacturing a single panel, comprising: performing a thermocompression bonding process on a release film, a multilayer thermoplastic substrate and a metal layer which are sequentially stacked, in a roll-to-roll manner; and after performing the thermal compression bonding process, respectively Roll take-up panel and the release film To a different take-up wheel, wherein the single panel comprises the multilayer thermoplastic substrate and the metal layer stacked in a stack. 如申請專利範圍第11項所述的單面板的製造方法，其中所述離型膜的材料包括聚醯亞胺、聚乙烯、聚乙烯對苯二甲酸酯、鐵氟龍或聚-4-甲基-1-戊烯。 The method for manufacturing a single panel according to claim 11, wherein the material of the release film comprises polyimine, polyethylene, polyethylene terephthalate, Teflon or poly-4- Methyl-1-pentene. 如申請專利範圍第11項所述的單面板的製造方法，其中所述離型膜的中心線平均粗糙度的範圍為0.05微米至10微米。 The method of manufacturing a single panel according to claim 11, wherein the release film has a center line average roughness ranging from 0.05 μm to 10 μm. 如申請專利範圍第11項所述的單面板的製造方法，其中所述多層熱塑性基材的材料包括熱塑性聚醯亞胺、液晶聚合物或聚胺甲酸酯。 The method of manufacturing a single panel according to claim 11, wherein the material of the multilayer thermoplastic substrate comprises a thermoplastic polyimide, a liquid crystal polymer or a polyurethane. 如申請專利範圍第11項所述的單面板的製造方法，其中所述多層熱塑性基材的玻璃轉移溫度的範圍為150℃至400℃。 The method of manufacturing a single panel according to claim 11, wherein the multilayer thermoplastic substrate has a glass transition temperature in the range of 150 ° C to 400 ° C. 如申請專利範圍第11項所述的單面板的製造方法，其中所述熱壓合製程的壓合壓力的範圍為10KN至50KN。 The method of manufacturing a single panel according to claim 11, wherein the pressing pressure of the thermocompression bonding process ranges from 10 KN to 50 KN. 如申請專利範圍第11項所述的單面板的製造方法，其中所述熱壓合製程的壓合溫度的範圍為200℃至400℃，且所述壓合溫度大於所述多層熱塑性基材的玻璃轉移溫度至少50℃。 The method for manufacturing a single panel according to claim 11, wherein the thermocompression bonding process has a pressing temperature in the range of 200 ° C to 400 ° C, and the pressing temperature is greater than that of the multilayer thermoplastic substrate. The glass transition temperature is at least 50 °C. 如申請專利範圍第11項所述的單面板的製造方法，其中所述熱壓合製程的機速的範圍為0.5公尺/分至10公尺/分。 The method of manufacturing a single panel according to claim 11, wherein the machine speed of the thermocompression bonding process ranges from 0.5 m/min to 10 m/min. 如申請專利範圍第11項所述的單面板的製造方法，其中在進行所述熱壓合製程之後，相鄰的所述熱塑性基材與所述離型膜之間的剝離強度的範圍為0.001kgf/cm至0.5kgf/cm。 The method for manufacturing a single panel according to claim 11, wherein after the hot pressing process, the peel strength between the adjacent thermoplastic substrate and the release film ranges from 0.001 Kgf/cm to 0.5kgf/cm. 如申請專利範圍第19項所述的單面板的製造方法，其中在進行所述熱壓合製程之後，相鄰的所述熱塑性基材與所述離型膜之間的剝離強度的範圍為0.002kgf/cm至0.1kgf/cm。 The method for manufacturing a single panel according to claim 19, wherein a peeling strength between the adjacent thermoplastic substrate and the release film is 0.002 after the hot pressing process is performed. Kgf/cm to 0.1 kgf/cm.
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