CN102630126B - Compound double-side copper clad laminate and manufacturing method thereof - Google Patents
Compound double-side copper clad laminate and manufacturing method thereof Download PDFInfo
- Publication number
- CN102630126B CN102630126B CN201210094596.7A CN201210094596A CN102630126B CN 102630126 B CN102630126 B CN 102630126B CN 201210094596 A CN201210094596 A CN 201210094596A CN 102630126 B CN102630126 B CN 102630126B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- glue
- copper
- clad laminate
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention discloses a compound double-side copper clad laminate and the manufacturing method thereof. The compound double-side copper clad laminate is manufactured in the way that a non-adhesive single-side copper-clad laminate composed of a copper foil and an insulating basal membrane formed on one surface of the copper foil is hot-pressed with an adhesive copper foil laminate composed of another copper foil and an insulating assembly glue layer applied on one surface of the copper foil under the condition of low temperature. The problems of adopting a high-temperature pressing processing procedure in the prior art and using expensive raw material of TPI can be avoided, and the compound double-side copper clad laminate meeting the requirements of characteristics of a non-adhesive double-side laminate can be obtained, so that not only is the manufacturing cost saved, but also the production yield of products can be improved, the application range of the products is expanded; and the compound double-side laminate provided by the invention has excellent dimensional stability and bending resistance and has the advantages of masking effect, high heat resistance and high reflectivity.
Description
Technical field
The invention belongs to flexible printed circuit board structure and technology field, be specifically related to a kind of composite type double sided copper clad laminate and manufacture method thereof.
Background technology
At present the development trend of global electronic industry is to compact, high-fire resistance, multifunctionality, densification, high reliability and future development cheaply, so selecting of substrate just becomes very important influencing factor.And good substrate must possess high thermal conductivity, high dimensional stability, the high material behavior that hides chromatic effect, high-cooling property, high-fire resistance and low thermal coefficient of expansion.Polyimide resin thermal stability is high and have excellent thermal diffusivity, mechanical strength and adherence, often applies to multiple electronic material, as for flexible printed wiring board (Flexible Printed Circuit).
The glue-free copper foil base material using due to current FPC industry is generally subject to the technology controls of raw material manufacturer abroad such as Japan, higher and the complex manufacturing of relative production cost, need to be through very high high-temperature process, be not easy to the cost control with price of promoting the use of of product.The processing procedure of traditional glue-free double sided board is: two-sided Copper Foil pressing thermoplastic polyimide (TPI) is produced finished product after high-temperature laminating baking processing procedure curing reaction is complete.This production technology not only expends the energy, and uses the higher TPI raw material of relative cost, and yield is on the low side in process of production.Therefore, conventionally the restriction that needs the processing procedures such as high-temperature process, long-time high-temperature baking to control when the glue-free Double-sided copper clad laminate using exists production at present, not only need higher production cost, waste energy and the production time, and cannot guarantee yield and the efficiency of producing to have limited production capacity.
In view of above-mentioned defect, be necessary to develop superior performance, be convenient to volume production and cost is low, yield is high Double-sided copper clad laminate and manufacturing process.As Chinese patent 200810217932.6 discloses a kind of double side flexible copper coated board and preparation method thereof, this double side flexible copper coated board comprises a single-side coated copper plate, coats the adhesive layer on this single-side coated copper plate and is overlaid on another Copper Foil or another single-face flexibility copper-clad board on this adhesive layer, described single-side coated copper plate comprises a Copper Foil and coats the polyimide layer on Copper Foil, the adjacent setting of described polyimide layer and adhesive layer; Its manufacture method comprises the steps: step 1, Copper Foil is provided and prepares polyamic acid and adhesive; Step 2 is coated with one deck polyamic acid on Copper Foil, after super-dry, high temperature imidization, forms single-sided polyimide flexibility coat copper plate; Step 3 is coated with one deck adhesive on the polyimides face of the single-face flexibility copper-clad board making, and makes double side flexible copper coated board after compound and curing through roll-in after drying with Copper Foil or another single-face flexibility copper-clad board.Although the original idea of patent 200810217932.6 is to provide and a kind ofly can overcomes three-layer process and manufacture double side flexible copper coated board and be difficult to slimming and the poor deficiency of dimensional stability, and the problem of the expensive and apparent difference of two-layer method flexibility coverlay, and excellent combination property, with low cost, can realize the double side flexible copper coated board and preparation method thereof of the slimming of base material, but can there is following defect in it: procedure for producing is more difficult in actual production, equipment need to be controlled finely by tension force, be coated with after upper glue layer, at pressing section, be easy to produce wrinkle, length cannot be done length, yield is not high, yield only has 30% left and right.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of process for pressing production carried out, can use lower temperature to produce, and produce simple, yield composite type double sided copper clad laminate high, excellent performance, easy to use, with respect to traditional processing technology, do great improvement.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of composite type double sided copper clad laminate, by glue-free single-side coated copper plate and the pressing of band glue copper foil plate, formed, described glue-free single-side coated copper plate consists of one deck Copper Foil and the insulating basement membrane that is formed at Copper Foil one surface, describedly with glue copper foil plate, by another Copper Foil and the insulation adhesive glue-line that is coated on another Copper Foil one surface, formed, and described insulating basement membrane and the adjacent setting of described insulation adhesive glue-line.
Preferably, described insulating basement membrane is a kind of in polyimides (PI) film, PETG (PET) film, poly-naphthalene ester (PEN) film and liquid crystal polymer (PLC) film, and the thickness of described insulating basement membrane is 7～100um.
Preferably, described insulating basement membrane is polyimides (PI) film.
Preferably, described Copper Foil is calendering (RA) Copper Foil, electrolysis (ED) Copper Foil and high a kind of in (HD) Copper Foil of extending, and the thickness of described Copper Foil is 7.5～35um.
Preferably, described insulation adhesive glue-line is a kind of in epoxide-resin glue system layer, acrylate adhesive system layer, PETG glue system layer, polyurethane adhesive system layer and polyimides glue system layer, and the thickness of described insulation adhesive glue-line is 5～50um.
The manufacture method of above-mentioned composite type double sided copper clad laminate is as follows: by by one deck Copper Foil and be formed at glue-free single-side coated copper plate that the insulating basement membrane on Copper Foil one surface forms and by another Copper Foil and be coated on the band glue copper foil plate that the insulation adhesive glue-line on another Copper Foil one surface forms and carry out hot pressing, and described insulating basement membrane and the adjacent setting of described insulation adhesive glue-line, hot pressing temperature is controlled at 30～100 ℃, makes composite type double sided copper clad laminate of the present invention.
Preferably, the preparation method of described glue-free single-side coated copper plate is as follows: the liquid dispersion that forms described insulating basement membrane is coated on Copper Foil, and forms described glue-free single-side coated copper plate through baking-curing.
Preferably, described band glue copper foil plate is by RCC copper foil base material, to remove release layer to form afterwards, and the preparation method of described RCC copper foil base material is as follows: a surface that the liquid dispersion that forms insulation adhesive glue-line is coated on to another Copper Foil, then baking, make described liquid dispersion reach half mobile semi-cured state and form insulation adhesive glue-line, then on insulation adhesive glue-line surface, paste release layer, make RCC copper foil base material.Preferably, described release layer is release liners or release film, and thickness is 30～200um.
The invention has the beneficial effects as follows: the present invention makes composite type double sided copper clad laminate of the present invention by using conventional glue-free single-side coated copper plate and band glue copper foil plate to carry out Low Temperature Thermal pressing, avoided the high-temperature laminating processing procedure of prior art and used expensive TPI raw material, and obtain meeting the composite type double sided copper clad laminate of glue-free double sided board characteristic needs, not only saved production cost, and improved the yield of production, expanded the scope of application of product, and composite type double sided copper clad laminate of the present invention has excellent dimensional stability and resistance to bending performance, and there is screening chromatic effect, high-fire resistance and high reflectance.
Accompanying drawing explanation
Fig. 1 is composite type double sided copper foil baseplate structure schematic diagram of the present invention;
Fig. 2 is the manufacture method schematic diagram of composite type double sided copper clad laminate of the present invention.
Embodiment
Embodiment: below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
A kind of composite type double sided copper clad laminate, by glue-free single-side coated copper plate 1 and 2 both pressings of band glue copper foil plate, formed, described glue-free single-side coated copper plate 1 consists of one deck Copper Foil 11 and the insulating basement membrane 12 that is formed at Copper Foil one surface, describedly with glue copper foil plate 2, by another Copper Foil 21 and the insulation adhesive glue-line 22 that is coated on another Copper Foil one surface, formed, and described insulating basement membrane 12 and the adjacent setting of described insulation adhesive glue-line 22.
Wherein, described insulating basement membrane 12 is a kind of in polyimides (PI) film, PETG (PET) film, poly-naphthalene ester (PEN) film and liquid crystal polymer (PLC) film, polyimides (PI) film preferably, the thickness of described insulating basement membrane 12 is 7～100um.
Wherein, described Copper Foil 11,21 is calendering (RA) Copper Foil, electrolysis (ED) Copper Foil and high a kind of in (HD) Copper Foil of extending, and the thickness of described Copper Foil 11,21 is 7.5～35um.
Wherein, described insulation adhesive glue-line 22 is a kind of in epoxide-resin glue system layer, acrylate adhesive system layer, PETG glue system layer, polyurethane adhesive system layer and polyimides glue system layer, and the thickness of described insulation adhesive glue-line 22 is 5～50um.
The manufacture method of above-mentioned composite type double sided copper clad laminate is as follows:
One, the preparation of glue-free single-side coated copper plate 1: utilize organic solvent to carry out each required component of mixed dissolution, form the liquid dispersion of insulating basement membrane, use coating production equipment that this liquid dispersion is coated to and on Copper Foil 11, forms insulating basement membrane 12, make the insulating basement membrane process online dry baking oven after this coating, remove the organic solvent including and reach curing, in order to avoid mutually adhere to when rolling, and it is curing by follow-up baking process, to reach composition reaction, forms glue-free single-side coated copper plate 1;
Two, the preparation of RCC copper clad laminate: utilize organic solvent to mix each required component, form the liquid dispersion of insulation adhesive glue-line 22, use coating production equipment to be coated on the matsurface side of Copper Foil 21 liquid dispersion of this insulation adhesive glue-line, baking through online dry baking oven, the organic solvent that removal includes, and make insulation adhesive glue-line reach half mobile semi-cured state, finally on insulation adhesive glue-line, note covers release layer, forms RCC copper clad laminate;
Three, use glue-free single-side coated copper plate 1 and RCC copper clad laminate, the release layer of RCC copper clad laminate is removed and obtains being with glue copper foil plate 2, by glue-free single-side coated copper plate 1 with after being with glue copper foil plate 2 by pressing machine hot pressing (described insulating basement membrane 12 and the adjacent setting of described insulation adhesive glue-line 22), obtain composite type double sided copper clad laminate again through overcuring, wherein hot pressing temperature is controlled at 30～100 ℃.
In said method, the adjustment by formula, makes insulating basement membrane and insulation adhesive glue-line reach approaching thermal coefficient of expansion.
Manufacture method of the present invention aborning tension force is easily controlled, and can produce continuously, needn't worry to reload midway and causes the problems such as machine down, produces yield also higher, and yield reaches more than 90%.Adopt the glue-free single-side coated copper plate of length range 100～1000m to carry out hot pressing, realize continuous volume production.By using the composite type double sided copper clad laminate that obtains invention after conventional glue-free single-side coated copper plate and RCC copper foil base material mixed binding, can meet glue-free double sided board characteristic needs, save production cost, improved the yield of production, expanded the scope of application of product.
The dimensional stability test result of the Double-sided copper clad laminate of composite type double sided copper clad laminate of the present invention and prior art is as following table 1:
Table 1:
| |
|
Sample 3 | Sample 4 | |
| Copper Foil | RA copper | ED copper | RA copper | RA copper |
| Insulating basement membrane | Polyimides | Polyimides | Polyimides | TPI |
| Insulation adhesive glue-line | Transparent | Transparent | Nothing | Transparent |
| Dimensional stability | 0.05％ | 0.06％ | 0.08％ | 0.07％ |
| Scolding tin thermal endurance | 288℃10S | 288℃10S | 288℃10S | 288℃10S |
| Reflectivity | 95％ | 85％ | 82％ | 83％ |
| Cover power | Opaque | Opaque | Opaque | Opaque |
| The number of times of resistance to bending | > 100,000 times | > 90,000 times | > 70,000 times | > 80,000 times |
In upper table 1, sample 1 and 2 is composite type double sided copper clad laminate of the present invention; Sample 3 and sample 4 are prior art Double-sided copper clad laminate.
By table 1 data, shown, composite type double sided copper clad laminate of the present invention has excellent dimensional stability and resistance to bending performance, and has chromatic effect, high-fire resistance and the high reflectance of screening.
Above-described embodiment is only the illustrative principle of the invention and effect thereof, but not for limiting the present invention.The scope of the present invention, should be as listed in claims.
Claims (5)
1. the manufacture method of a composite type double sided copper clad laminate, it is characterized in that: by by one deck Copper Foil (11) and be formed at glue-free single-side coated copper plate (1) that the insulating basement membrane (12) on Copper Foil one surface forms and by another Copper Foil (21) and be coated on band glue copper foil plate (2) that the insulation adhesive glue-line (22) on another Copper Foil one surface forms both carry out hot pressing, and described insulating basement membrane (12) and the adjacent setting of described insulation adhesive glue-line (22), hot pressing temperature is controlled at 30～100 ℃, makes composite type double sided copper clad laminate of the present invention.
2. the manufacture method of composite type double sided copper clad laminate as claimed in claim 1, it is characterized in that: the preparation method of described glue-free single-side coated copper plate (1) is as follows: the liquid dispersion that forms described insulating basement membrane is coated on Copper Foil, and forms described glue-free single-side coated copper plate (1) through baking-curing.
3. the manufacture method of composite type double sided copper clad laminate as claimed in claim 1, it is characterized in that: described band glue copper foil plate (2) is by RCC copper foil base material, to remove release layer to form afterwards, and the preparation method of described RCC copper foil base material is as follows: a surface that the liquid dispersion that forms insulation adhesive glue-line is coated on to another Copper Foil, then baking, make described liquid dispersion reach half mobile semi-cured state and form insulation adhesive glue-line, then on insulation adhesive glue-line surface, paste release layer, make RCC copper foil base material.
4. the manufacture method of composite type double sided copper clad laminate as claimed in claim 3, is characterized in that: described release layer is a kind of in release liners and release film, and thickness is 30～200um.
5. the manufacture method of the composite type double sided copper clad laminate as described in any one in claim 1 to 4, it is characterized in that: described insulating basement membrane (12) is a kind of in polyimide film, PETG film, poly-naphthalene ester film and liquid crystalline polymer film, and the thickness of described insulating basement membrane is 7～100um; Described Copper Foil (11,21) is a kind of in rolled copper foil, electrolytic copper foil and high extension Copper Foil, and the thickness of described Copper Foil is 7.5～35um; Described insulation adhesive glue-line (22) is a kind of in epoxide-resin glue system layer, acrylate adhesive system layer, PETG glue system layer, polyurethane adhesive system layer and polyimides glue system layer, and the thickness of described insulation adhesive glue-line is 5～50um.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210094596.7A CN102630126B (en) | 2012-04-01 | 2012-04-01 | Compound double-side copper clad laminate and manufacturing method thereof |
| TW101120193A TW201343034A (en) | 2012-04-01 | 2012-06-06 | Compound double-side copper clad laminate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210094596.7A CN102630126B (en) | 2012-04-01 | 2012-04-01 | Compound double-side copper clad laminate and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102630126A CN102630126A (en) | 2012-08-08 |
| CN102630126B true CN102630126B (en) | 2014-04-16 |
Family
ID=46588253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210094596.7A Active CN102630126B (en) | 2012-04-01 | 2012-04-01 | Compound double-side copper clad laminate and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102630126B (en) |
| TW (1) | TW201343034A (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102794962A (en) * | 2012-08-29 | 2012-11-28 | 松扬电子材料(昆山)有限公司 | Composite double-sided copper foil substrate and manufacturing method thereof |
| CN103029375B (en) * | 2013-01-11 | 2016-04-13 | 松扬电子材料(昆山)有限公司 | Composite double-face copper foil substrate and manufacture method thereof |
| CN105291538B (en) * | 2015-11-13 | 2017-09-12 | 广东生益科技股份有限公司 | Without glue double side flexible copper coated board production equipment and method |
| TWI589959B (en) * | 2016-04-01 | 2017-07-01 | 台虹科技股份有限公司 | Method for manufacturing single-sided board |
| CN105979704B (en) * | 2016-06-06 | 2018-10-26 | 苏州安洁科技股份有限公司 | A kind of welding procedure based on the high heat elimination printed circuit board of the double-deck aluminium |
| CN106658957A (en) * | 2017-03-20 | 2017-05-10 | 成都多吉昌新材料股份有限公司 | All-polyimide type flexible copper clad laminate base plate and integrated circuit board |
| CN108859316B (en) * | 2017-05-10 | 2020-02-21 | 昆山雅森电子材料科技有限公司 | Composite LCP high-frequency high-speed double-sided copper foil substrate and preparation method thereof |
| CN108995228B (en) * | 2017-06-07 | 2021-01-05 | 东安生技实业股份有限公司 | Method for manufacturing packaging material for filling hair dye and packaging bag made of the packaging material |
| CN108012414A (en) * | 2018-01-08 | 2018-05-08 | 昆山雅森电子材料科技有限公司 | High frequency high-transmission FPC and preparation method with FRCC |
| CN110366309B (en) * | 2018-04-11 | 2024-02-06 | 昆山雅森电子材料科技有限公司 | FPC (flexible printed circuit) and technology based on high-frequency FRCC (frequency division multiplexing) and FCCL (frequency division multiplexing) single panel |
| CN110366330B (en) * | 2018-04-11 | 2024-02-06 | 昆山雅森电子材料科技有限公司 | FPC (flexible printed circuit) multilayer board based on high-frequency FRCC (frequency division multiplexing) and high-frequency double-sided board and process |
| CN110825272A (en) * | 2018-08-10 | 2020-02-21 | 无锡变格新材料科技有限公司 | Manufacturing process of copper-platinum-based capacitive touch sensor |
| CN111716773B (en) * | 2020-06-11 | 2022-06-28 | 四川铂利明德科技有限公司 | Preparation method of high-performance modified polyimide flexible substrate |
| CN112055484A (en) * | 2020-08-31 | 2020-12-08 | 湖北奥马电子科技有限公司 | Flexible substrate and method for producing the same |
| CN113386416B (en) * | 2021-07-08 | 2022-12-16 | 江西柔顺科技有限公司 | Heat-conducting double-sided copper-clad plate and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002020714A (en) * | 2000-07-04 | 2002-01-23 | Tokai Rubber Ind Ltd | Method for producing double-sided copper-clad laminate |
| CN101420820B (en) * | 2008-12-02 | 2011-10-26 | 广东生益科技股份有限公司 | Double side flexible copper coated board and manufacturing method thereof |
| KR101102180B1 (en) * | 2009-01-23 | 2012-01-02 | 주식회사 두산 | Novel flexible metalclad laminate and method of producing the same |
| TWM377823U (en) * | 2009-11-17 | 2010-04-01 | Asia Electronic Material Co | Complex double-sided copper clad laminate and structure of flexible printed circuit board using the same |
| CN102009515B (en) * | 2010-07-21 | 2013-01-02 | 广东生益科技股份有限公司 | Two-layer-method double-sided flexible CCL (Copper-Clad Laminate) and manufacture method thereof |
| CN202573178U (en) * | 2012-04-01 | 2012-12-05 | 松扬电子材料(昆山)有限公司 | Composite double-faced copper foil base plate |
-
2012
- 2012-04-01 CN CN201210094596.7A patent/CN102630126B/en active Active
- 2012-06-06 TW TW101120193A patent/TW201343034A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN102630126A (en) | 2012-08-08 |
| TW201343034A (en) | 2013-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102630126B (en) | Compound double-side copper clad laminate and manufacturing method thereof | |
| CN102794962A (en) | Composite double-sided copper foil substrate and manufacturing method thereof | |
| CN201830544U (en) | High-heat conductivity cover film and copper-clad plate using the same | |
| CN108859316B (en) | Composite LCP high-frequency high-speed double-sided copper foil substrate and preparation method thereof | |
| CN101420820B (en) | Double side flexible copper coated board and manufacturing method thereof | |
| CN202986235U (en) | Double-faced flexible copper-clad plate | |
| CN206932462U (en) | Combined type LCP high-frequency high-speed FRCC base materials | |
| CN104057664A (en) | Double-sided flexible copper-clad laminate and production method thereof | |
| CN104325774A (en) | Preparation method of dual-layer glue-free type double-face flexible copper-clad plate | |
| CN206840863U (en) | Combined type LCP high-frequency high-speed Double-sided copper clad laminates | |
| CN102009515B (en) | Two-layer-method double-sided flexible CCL (Copper-Clad Laminate) and manufacture method thereof | |
| CN202573178U (en) | Composite double-faced copper foil base plate | |
| CN103144376A (en) | Composite copper clad laminate with electromagnetic shielding effect and manufacture method thereof | |
| CN110744891A (en) | Blending modified polyimide high-frequency adhesive-free flexible copper clad laminate and manufacturing method thereof | |
| CN102215642B (en) | Manufacturing method for rigid flexible printed circuit board (R-F PCB) | |
| CN103660490A (en) | Manufacturing method for two-layer method produced double-side flexible copper-clad plate | |
| CN202782009U (en) | Composite double-sided copper clad laminate | |
| CN103029375B (en) | Composite double-face copper foil substrate and manufacture method thereof | |
| CN206077834U (en) | A kind of flexible copper-clad plate | |
| CN108882501A (en) | Combined type LCP high-frequency high-speed FRCC substrate and preparation method thereof | |
| CN202435714U (en) | Glue-free single-sided copper foil coated substrate with bonding function | |
| CN103200771B (en) | There is glue-free single sided copper clad substrate and the manufacture method thereof of paste functionality | |
| CN203126052U (en) | Composite double-sided copper foil substrate | |
| CN110744890A (en) | Fluorine polyimide high-frequency adhesive-free flexible copper clad laminate and manufacturing method thereof | |
| CN103458607A (en) | Extinction stiffening plate used for printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |