TWI580901B - A lighting device having a semiconductor light emitting element - Google Patents
A lighting device having a semiconductor light emitting element Download PDFInfo
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- TWI580901B TWI580901B TW102138204A TW102138204A TWI580901B TW I580901 B TWI580901 B TW I580901B TW 102138204 A TW102138204 A TW 102138204A TW 102138204 A TW102138204 A TW 102138204A TW I580901 B TWI580901 B TW I580901B
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- light
- emitting element
- semiconductor light
- led
- light emitting
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- 239000004065 semiconductor Substances 0.000 title claims description 24
- 238000009792 diffusion process Methods 0.000 claims description 30
- 239000003566 sealing material Substances 0.000 claims description 23
- 238000005286 illumination Methods 0.000 claims description 20
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- 229920005989 resin Polymers 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 8
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- 239000012212 insulator Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007649 pad printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Description
本發明涉及一種具備半導體發光元件(LED)的照明器具。 The present invention relates to a lighting fixture including a semiconductor light emitting element (LED).
作為利用半導體發光元件(LED)的照明器具的現有例，例如有專利文獻1公開的照明器具。 As a conventional example of a lighting fixture using a semiconductor light emitting element (LED), for example, there is a lighting fixture disclosed in Patent Document 1.
該照明器具具備：絕緣性材料構成的基底部件、固定於基底部件的觸點和固定於基底部件的LED單元。LED單元一體地具備與觸點導通的基板和安裝於該基板的LED(半導體發光元件)，LED通過形成於基底部件的露出窗露出於外側。由於觸點通過線纜(cable)與電源連接，因此當電源產生的電力通過線纜以及觸點供給至LED時，LED發光。 The lighting fixture includes a base member made of an insulating material, a contact fixed to the base member, and an LED unit fixed to the base member. The LED unit integrally includes a substrate that is electrically connected to the contact and an LED (semiconductor light-emitting element) that is mounted on the substrate, and the LED is exposed to the outside through an exposure window formed on the base member. Since the contacts are connected to the power source through a cable, the LEDs emit light when power generated by the power source is supplied to the LEDs through the cables and the contacts.
就LED產生的光而言，由於LED附近的亮度集中性地變高，因此，一直以來的做法是，在上述的照明器具中，將擴散鏡片安裝於基底部件，使LED產生的光通過擴散鏡片擴散。 In the light generated by the LED, since the brightness in the vicinity of the LED is concentrated, the conventional method is to mount the diffusing lens on the base member and pass the light generated by the LED through the diffusing lens. diffusion.
然而僅憑現有的擴散鏡片難以使LED產生的光進行充分的擴散，容易產生亮度不均或顏色不均。因此，一直以來的做法是，在擴散鏡片的正前方，配置與擴散鏡片(及基底部件)分開的平板狀的擴散板(LSD)(專利文獻2)。由於利用擴散板的話能夠使從各LED射出的光進行充分的擴散(能夠使光的擴散狀態更加均一化)，因此即使減少LED的數量也能夠獲得足夠的亮度。 However, it is difficult to sufficiently diffuse the light generated by the LED by the existing diffusing lens, and uneven brightness or color unevenness is likely to occur. Therefore, conventionally, a flat diffuser (LSD) separated from the diffusing lens (and the base member) is disposed directly in front of the diffusing lens (Patent Document 2). When the diffusing plate is used, the light emitted from each of the LEDs can be sufficiently diffused (the light diffusing state can be made more uniform), and therefore sufficient brightness can be obtained even if the number of LEDs is reduced.
專利文獻1：日本特開2012-164613號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2012-164613
專利文獻2：日本特開2008-241987號公報 Patent Document 2: JP-A-2008-241987
近些年，強烈要求安裝有照明器具的電子設備(例如液晶顯示器)的輕薄化。另外，對於顯示器等，也有希望降低亮度不均的市場需求。 In recent years, the thinning of electronic devices (such as liquid crystal displays) equipped with lighting fixtures has been strongly demanded. In addition, there is also a desire for a display or the like to reduce the market demand for uneven brightness.
然而，為了使亮度不均降低，如果以與擴散鏡片(及基底部件)分開的狀態配置擴散板的話，由於將基底部件、LED單元、擴散鏡片以及擴散板作為構成要素而具備的照明器具整體的厚度變大，因此不能夠滿足該要求。 However, in order to reduce the unevenness of the brightness, when the diffusing plate is disposed in a state of being separated from the diffusing lens (and the base member), the entire lighting fixture including the base member, the LED unit, the diffusing lens, and the diffusing plate is used as a constituent element. The thickness becomes large, so this requirement cannot be satisfied.
另外，如果嘗試通過設置擴散板、或者增加LED的數量而使亮度不均降低的話，那麼照明器具的部件數量就會變多，導致製造成本上升。 In addition, if an attempt is made to reduce the brightness unevenness by providing a diffusion plate or increasing the number of LEDs, the number of components of the lighting fixture becomes large, resulting in an increase in manufacturing cost.
本發明的目的在於提供一種具備半導體發光元件的照明器具，無需使用與支撐半導體發光元件的基底部件分開的光擴散部件，而能夠使半導體發光元件產生的光充分擴散。 An object of the present invention is to provide a lighting fixture including a semiconductor light emitting element, which can sufficiently diffuse light generated by the semiconductor light emitting element without using a light diffusing member that is separated from a base member that supports the semiconductor light emitting element.
本發明的具備半導體發光元件的照明器具，其特徵在於，具備：基底部件；第一導電部件以及第二導電部件，形成於該基底部件的表面，都能夠與電源電氣導通並且相互分開；半導體發光元件，安裝於所述基底部件的表面，能夠與所述第一導電部件以及所述第二導電部件電氣導通；透光部件，安裝於所述基底部件的表面，覆蓋所述半導體發光元件，並且所述半導體發光元件發出的照明光在擴散的同時透過該透光部件；擴 散膜，形成於該透光部件的表面，使照明光的一部分擴散的同時透過。 A lighting fixture including a semiconductor light emitting device according to the present invention includes: a base member; the first conductive member and the second conductive member are formed on a surface of the base member, and are electrically connected to and separated from each other by a power source; An element mounted on a surface of the base member electrically connectable to the first conductive member and the second conductive member; a light transmissive member mounted on a surface of the base member covering the semiconductor light emitting element, and The illumination light emitted by the semiconductor light-emitting element is transmitted through the light-transmitting member while being diffused; The scattering film is formed on the surface of the light transmitting member to transmit a part of the illumination light while being diffused.
所述透光部件也可以為在所述基底部件的表面及與所述半導體發光元件之間形成空間的透光性罩部件。 The light transmissive member may be a light transmissive cover member that forms a space between the surface of the base member and the semiconductor light emitting element.
也可以是所述半導體發光元件固定於所述基底部件的表面所形成的凹部的底面，透光性的密封材料設置於所述凹部的底面。 The semiconductor light emitting element may be fixed to a bottom surface of a concave portion formed on a surface of the base member, and a light transmissive sealing material may be provided on a bottom surface of the concave portion.
本發明的照明器具，對於固定有半導體發光元件的基底部件，安裝半導體發光元件發出的照明光在擴散的同時能夠透過的透光部件，並且在透光部件的表面形成擴散膜。 In the lighting fixture of the present invention, a light-transmitting member through which the illumination light emitted from the semiconductor light-emitting device can be diffused while the base member having the semiconductor light-emitting element is fixed is mounted, and a diffusion film is formed on the surface of the light-transmitting member.
因此，半導體發光元件產生的照明光，在通過透光部件被擴散後，通過擴散膜進一步被擴散。因此，無需設置與基底部件分開的光擴散部件，而能夠使照明光充分地擴散。 Therefore, the illumination light generated by the semiconductor light-emitting element is further diffused by the diffusion film after being diffused by the light-transmitting member. Therefore, it is not necessary to provide a light diffusing member separate from the base member, and the illumination light can be sufficiently diffused.
因此能夠減少設置於照明器具的半導體發光元件。 Therefore, the semiconductor light emitting element provided in the lighting fixture can be reduced.
此外，由於不需要設置光擴散部件，因此能夠減少照明器具的部件的數量，降低製造成本。 Further, since it is not necessary to provide the light diffusing member, the number of components of the lighting fixture can be reduced, and the manufacturing cost can be reduced.
另外，由於不需要設置與基底部件分開的光擴散部件，因此能夠減小照明器具整體的厚度。 Further, since it is not necessary to provide a light diffusing member separate from the base member, the thickness of the entire lighting fixture can be reduced.
10‧‧‧照明器具 10‧‧‧Lighting appliances
11‧‧‧散熱器 11‧‧‧ radiator
12‧‧‧上端凸部(凹部) 12‧‧‧Upper convex part (concave part)
14‧‧‧樹脂部(基底部件) 14‧‧‧Resin part (base part)
15‧‧‧圓形凹部(凹部) 15‧‧‧Circular recess (concave)
16‧‧‧圓形貫通孔 16‧‧‧Circular through hole
17‧‧‧連接用凹部 17‧‧‧Connecting recess
18‧‧‧卡合孔 18‧‧‧Snap hole
19‧‧‧導通板 19‧‧‧Connecting board
20‧‧‧第一導電部件 20‧‧‧First conductive parts
20A‧‧‧引線連接部 20A‧‧‧ lead connection
20B‧‧‧線纜連接部 20B‧‧‧ Cable connection
21‧‧‧第二導電部件 21‧‧‧Second conductive parts
21A‧‧‧引線連接部 21A‧‧‧Lead connection
21B‧‧‧線纜連接部 21B‧‧‧ Cable connection
22A,22B‧‧‧托架部 22A, 22B‧‧‧ bracket section
23‧‧‧托架連接部 23‧‧‧ bracket connection
24‧‧‧第一切斷橋接器 24‧‧‧First cut-off bridge
25‧‧‧第二切斷橋接器 25‧‧‧Second cut bridge
26‧‧‧第三切斷橋接器 26‧‧‧ Third cut bridge
28‧‧‧反射膜 28‧‧‧Reflective film
29‧‧‧LED固定部 29‧‧‧LED fixed part
31‧‧‧LED(半導體發光元件) 31‧‧‧LED (semiconductor light-emitting element)
33‧‧‧接合引線 33‧‧‧bonding leads
35‧‧‧密封材料(透光部件) 35‧‧‧Sealing material (light-transmitting parts)
37‧‧‧底座 37‧‧‧Base
39‧‧‧透光性罩部件(透光部件) 39‧‧‧Translucent cover parts (transparent parts)
40‧‧‧擴散鏡片 40‧‧‧Diffusion lenses
41‧‧‧突部 41‧‧‧ protrusion
42‧‧‧連接用突部 42‧‧‧Connecting projections
43‧‧‧擴散膜 43‧‧‧Diffuser film
45‧‧‧帶有連接器的線纜 45‧‧‧Connected cable
46‧‧‧線纜 46‧‧‧ Cable
47‧‧‧電線 47‧‧‧Wire
48‧‧‧覆蓋管 48‧‧‧ Covering tube
49‧‧‧連接器 49‧‧‧Connector
50‧‧‧絕緣體 50‧‧‧Insulator
圖1是本發明的一實施方式的照明器具的省略了透光性罩部件以及接合引線(bonding wire)而示出的從上方觀察的立體圖。 Fig. 1 is a perspective view of the lighting fixture according to the embodiment of the present invention, as seen from above, with the light-transmitting cover member and the bonding wire omitted.
圖2是切斷加工前的導通板的俯視圖。 2 is a plan view of a conduction plate before cutting.
圖3是照明器具的省略了透光性罩部件而示出的俯視圖。 Fig. 3 is a plan view showing the illuminating device with the light-transmitting cover member omitted.
圖4是沿圖1的IV-IV箭頭線的剖面圖。 Figure 4 is a cross-sectional view taken along line IV-IV of Figure 1 .
圖5是底座(chassis)和固定於底座的照明器具的立體圖。 Fig. 5 is a perspective view of a chassis and a lighting fixture fixed to the base.
圖6是透光性罩部件的中央部的剖面圖。 Fig. 6 is a cross-sectional view showing a central portion of a light-transmitting cover member.
圖7是將照明器具固定於底座並且將帶有連接器的線纜的連接器連接於照明器具時的俯視圖。 Fig. 7 is a plan view showing a state in which a lighting fixture is fixed to a base and a connector of a cable with a connector is connected to the lighting fixture.
圖8是省略了透光性罩以及底座的圖示的圖7的照明器具的示意俯視圖。 Fig. 8 is a schematic plan view of the lighting fixture of Fig. 7 in which the light-transmitting cover and the base are omitted.
以下，參照附圖對本發明的一實施方式進行說明。並且，以下說明中的前後、左右以及上下的方向以圖中的箭頭的方向為基準。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Further, the directions of the front, back, left and right, and up and down in the following description are based on the direction of the arrow in the drawing.
本實施方式的照明器具10具備散熱器11和一體成形於散熱器11的上部的樹脂部14(基底部件)。 The lighting fixture 10 of the present embodiment includes a heat sink 11 and a resin portion 14 (base member) integrally formed on the upper portion of the heat sink 11.
散熱器11是由鋁等的金屬構成的一體成形品，其熱傳導率比樹脂部14高。在散熱器11的上部突設有低矮的圓柱形狀的上端凸部12，上端凸部12的上面由平面構成。 The heat sink 11 is an integrally molded product made of a metal such as aluminum, and has a higher thermal conductivity than the resin portion 14. A low cylindrical upper end convex portion 12 is protruded from an upper portion of the heat sink 11, and an upper surface of the upper end convex portion 12 is formed by a flat surface.
俯視大致為方形的樹脂部14由絕緣性以及耐熱性高的樹脂材料(例如液晶聚合物等)構成。於樹脂部14的上面形成有俯視為圓形的圓形凹部15，於圓形凹部15的底面形成有俯視為圓形並且與上端凸部12相同直徑的圓形貫通孔16。如圖4所示，散熱器11的上端凸部12嵌合於樹脂部14的圓形貫通孔16(圓形凹部15的內面與上端凸部12的上面相當於本發明技術方案中的「凹部」)。於位於樹脂部14的對角線上的兩個角部凹設有連接用凹部17。此外，於樹脂部14的上面形成有四個卡合孔18。 The resin portion 14 having a substantially square shape in plan view is made of a resin material (for example, a liquid crystal polymer or the like) having high insulation properties and heat resistance. A circular recess 15 having a circular shape in plan view is formed on the upper surface of the resin portion 14, and a circular through hole 16 having a circular shape in plan view and having the same diameter as the upper end projection 12 is formed on the bottom surface of the circular recess 15. As shown in Fig. 4, the upper end convex portion 12 of the heat sink 11 is fitted into the circular through hole 16 of the resin portion 14 (the upper surface of the circular concave portion 15 and the upper surface of the upper end convex portion 12 correspond to the "in the technical solution of the present invention" Concave"). A connection recess 17 is recessed in two corner portions on the diagonal line of the resin portion 14. Further, four engaging holes 18 are formed in the upper surface of the resin portion 14.
照明器具10具備與樹脂部14的內部以及樹脂部14的表面 一體化的金屬部件。該金屬部件是將例如黃銅、鈹銅、科森銅鎳矽合金(corson copper alloy)等的導電性、熱傳導性、剛性較佳的金屬製的平板沖壓成形而成。 The lighting fixture 10 is provided with the inside of the resin portion 14 and the surface of the resin portion 14. Integrated metal parts. The metal member is formed by press-forming a flat plate made of metal such as brass, beryllium copper, or corson copper alloy, which is excellent in electrical conductivity, thermal conductivity, and rigidity.
該金屬部件具備各兩個第一導電部件20和第二導電部件 21。第一導電部件20具備圓弧狀的引線(wire)連接部20A和與引線連接部20A連接的線纜連接部20B。另外，第二導電部件21具備圓弧狀(與引線連接部20A相同形狀)的引線連接部21A和與引線連接部21A連接的線纜連接部21B。如圖所示，引線連接部20A、21A，在樹脂部14的表面(圓形凹部15的底面)露出，線纜連接部20B、21B在連接用凹部17的表面露出。 The metal component is provided with two first conductive members 20 and second conductive members twenty one. The first conductive member 20 includes an arc-shaped wire connecting portion 20A and a cable connecting portion 20B connected to the lead connecting portion 20A. Further, the second conductive member 21 includes a lead connecting portion 21A having an arc shape (the same shape as the lead connecting portion 20A) and a cable connecting portion 21B connected to the lead connecting portion 21A. As shown in the figure, the lead connecting portions 20A and 21A are exposed on the surface of the resin portion 14 (the bottom surface of the circular recessed portion 15), and the cable connecting portions 20B and 21B are exposed on the surface of the connecting recessed portion 17.
該第一導電部件20和第二導電部件21在照明器具10製造 前的階段分別構成一個導通板19的一部分。導通板19為圖2所示的形狀，其整體形狀為沿前後方向延伸的長尺寸平板狀(圖1只圖示了導通板19的一部分)。導通板19的左右兩側部由沿前後方向延伸的托架(carrier)部22A、22B構成，在前後方向以等間隔設置的托架連接部23在多處將托架部22A和托架部22B彼此連接。此外，兩個第一導電部件20都通過兩個第一切斷橋接部24分別與托架部22A、22B以及托架連接部23一體化，兩個第二導電部件21都通過一個第二切斷橋接部25與托架連接部23一體化。此外，鄰接的第一導電部件20和第二導電部件21通過一個第三切斷橋接部26相互連接。 The first conductive member 20 and the second conductive member 21 are fabricated in the lighting fixture 10 The previous stages respectively form part of a via 19 . The conduction plate 19 has a shape as shown in FIG. 2, and its overall shape is a long flat plate shape extending in the front-rear direction (only a part of the conduction plate 19 is illustrated in FIG. 1). The left and right side portions of the conduction plate 19 are constituted by carrier portions 22A and 22B extending in the front-rear direction, and the bracket connecting portion 23 provided at equal intervals in the front-rear direction has the bracket portion 22A and the bracket portion at a plurality of locations. 22B are connected to each other. In addition, the two first conductive members 20 are integrated with the bracket portions 22A, 22B and the bracket connecting portion 23 through the two first cutting bridge portions 24, respectively, and the two second conductive members 21 are all passed through a second cut. The broken bridge portion 25 is integrated with the bracket connecting portion 23. Further, the adjacent first conductive member 20 and second conductive member 21 are connected to each other by a third cut bridge portion 26.
樹脂部14經過兩次的成形行程與散熱器11一體化。在樹脂 部14的第一階段的成形行程完成時，導通板19與樹脂部14(的第一階段的完成體)一體化。在樹脂部14的第一次的成形行程完成後，當通過省略圖示的切斷裝置將導通板19的第一切斷橋接器24、第二切斷橋接器25以及第三切斷橋接器26切斷時，與樹脂部14(的第一階段的完成體)一體化的第一導電部件20和第二導電部件21成為相互分離的狀態。 The resin portion 14 is integrated with the heat sink 11 by two molding strokes. In resin When the forming stroke of the first stage of the portion 14 is completed, the conduction plate 19 is integrated with the (completed body of the first stage) of the resin portion 14. After the first molding stroke of the resin portion 14 is completed, the first cutting bridge 24, the second cutting bridge 25, and the third cutting bridge of the conduction plate 19 are turned by a cutting device (not shown). At the time of the cutting of 26, the first conductive member 20 and the second conductive member 21 integrated with (the completed body of the first stage of the resin portion 14) are separated from each other.
在上端凸部12的上面、圓形凹部15的底面(位於上端凸部12的外周側的環狀的部位)、以及圓形凹部15的內周面(錐形形狀的環狀壁)，通過移印機(圖示省略)，以30μm厚度的薄膜的形式一體地(連續地)印刷反射膜28。反射膜28，在作為主要成分的聚氨酯樹脂中，混合了作為著色劑的氧化鈦(TiO2)等，整體具有絕緣性。反射膜28，由於含有著色劑，因此為白色，與由鋁構成的散熱器11顏色(色調)不同，其(光的)可見光反射率比散熱器11以及樹脂部14高(具體而言，使用可見光反射率為90%以上、較佳使用95%以上的反射膜)。另外形成於上端凸部12的上面的反射膜28，以避開上端凸部12的上面的一部分的樣式形成。也就是說，如圖所示，在上端凸部12的上面，以避開多個(共計36個)俯視為矩形的區域的樣式形成。各俯視為矩形的區域分別構成LED固定部29，反射膜28的上面和LED固定部29之間產生相當於反射膜28的厚度的高度差。 The upper surface of the upper end convex portion 12, the bottom surface of the circular concave portion 15 (the annular portion on the outer circumferential side of the upper end convex portion 12), and the inner circumferential surface (the annular annular wall of the circular concave portion 15) pass through The pad printing machine (not shown) prints the reflective film 28 integrally (continuously) in the form of a film having a thickness of 30 μm. In the urethane resin as a main component, the reflective film 28 is mixed with titanium oxide (TiO 2 ) or the like as a colorant, and has insulating properties as a whole. Since the reflective film 28 contains a coloring agent, it is white, and unlike the color (tone) of the heat sink 11 made of aluminum, the visible light reflectance (light) is higher than that of the heat sink 11 and the resin portion 14 (specifically, The visible light reflectance is 90% or more, and preferably 95% or more of the reflective film). Further, the reflection film 28 formed on the upper surface of the upper end convex portion 12 is formed in a pattern avoiding a part of the upper surface of the upper end convex portion 12. In other words, as shown in the figure, the upper surface of the upper end convex portion 12 is formed in a pattern avoiding a plurality of (a total of 36) rectangular regions in plan view. Each of the rectangular regions in plan view constitutes the LED fixing portion 29, and a height difference corresponding to the thickness of the reflecting film 28 is generated between the upper surface of the reflecting film 28 and the LED fixing portion 29.
於各LED支撐部29固定有大致長方體形狀的LED31(半導體發光元件)。如圖所示，各LED31的平面形狀與LED固定部29大致相同(比LED固定部29尺寸略小)。在對於LED固定部29固定LED31時，首先將粘接劑(圖示省略)塗抹於各LED固定部29(上端凸部12的上面)， 接著省略圖示的LED傳送裝置將LED31載置於各LED固定部29。如上所述，由於在反射膜28的上面與LED固定部29之間產生了相當於反射膜28的厚度的高度差(由於LED固定部29成為由反射膜28包圍的凹部)，因此能夠簡單並且準確將LED31安裝(嵌合)於各LED固定部29。此外，由於在反射膜28的上面與LED固定部29之間產生了相當於反射膜28的厚度的高度差，因此能夠抑制塗抹於LED固定部29(上端凸部12的上面)的粘接劑流至LED固定部29的周圍(反射膜28側)。另外，上述LED傳送裝置具有識別色調差的感應器，上述LED傳送裝置，在識別反射膜28與LED固定部29之間的色調差(邊界線)的同時，將LED31載置於LED固定部29。因此，能夠將LED31正確地載置於LED固定部29。 An LED 31 (semiconductor light-emitting element) having a substantially rectangular parallelepiped shape is fixed to each of the LED support portions 29. As shown in the figure, the planar shape of each of the LEDs 31 is substantially the same as that of the LED fixing portion 29 (slightly smaller than the size of the LED fixing portion 29). When the LED 31 is fixed to the LED fixing portion 29, first, an adhesive (not shown) is applied to each of the LED fixing portions 29 (the upper surface of the upper end convex portion 12). Next, the LED transfer device (not shown) mounts the LED 31 on each of the LED fixing portions 29. As described above, since a height difference corresponding to the thickness of the reflective film 28 is generated between the upper surface of the reflective film 28 and the LED fixing portion 29 (because the LED fixing portion 29 becomes a concave portion surrounded by the reflective film 28), it can be simple and The LEDs 31 are accurately mounted (fitted) to the respective LED fixing portions 29. Further, since a height difference corresponding to the thickness of the reflective film 28 is generated between the upper surface of the reflective film 28 and the LED fixing portion 29, the adhesive applied to the LED fixing portion 29 (the upper surface of the upper end convex portion 12) can be suppressed. It flows to the periphery of the LED fixing portion 29 (on the side of the reflection film 28). Further, the LED transfer device has a sensor for recognizing a difference in hue, and the LED transfer device mounts the LED 31 on the LED fixing portion 29 while recognizing a difference in hue (boundary line) between the reflective film 28 and the LED fixing portion 29. . Therefore, the LED 31 can be correctly placed on the LED fixing portion 29.
露出於相鄰的LED31的上面而形成的端子(圖示省略)，彼此通過接合引線33(圖3所示的粗線)連接，並且位於與引線連接部20A相對的位置的LED31的端子和引線連接部20A通過接合引線33連接的同時，位於與引線連接部21A相對的位置的LED31的端子和引線連接部21A通過接合引線33連接。此外前側的引線連接部20A與後側的引線連接部21A通過接合引線33連接，並且後側的引線連接部20A與前側的引線連接部21A也通過接合引線33連接。 Terminals (not shown) formed by being exposed on the upper surface of the adjacent LEDs 31 are connected to each other by the bonding wires 33 (thick lines shown in FIG. 3), and the terminals and leads of the LEDs 31 located at positions opposite to the lead connecting portions 20A. The connection portion 20A is connected by the bonding wire 33, and the terminal of the LED 31 located at a position facing the lead connecting portion 21A and the lead connecting portion 21A are connected by the bonding wire 33. Further, the lead connecting portion 20A on the front side and the lead connecting portion 21A on the rear side are connected by the bonding lead 33, and the lead connecting portion 20A on the rear side and the lead connecting portion 21A on the front side are also connected by the bonding lead 33.
此外，樹脂部14的圓形凹部15內，設有由具有透光性以及絕緣性的熱固性樹脂材料或紫外線固化性樹脂材料等構成的密封材料35(透光部件)，密封材料35將引線連接部20A、引線連接部21A、反射膜28、LED31以及接合引線33覆蓋。如圖4所示，由於密封材料35的表面通過曲面(球面或非球面)構成，因此密封材料35能夠發揮鏡片功能(光 的擴散功能)。 Further, a sealing material 35 (light transmitting member) made of a thermosetting resin material or an ultraviolet curable resin material having light transmissivity and insulating properties is provided in the circular recessed portion 15 of the resin portion 14, and the sealing material 35 connects the leads. The portion 20A, the lead connecting portion 21A, the reflection film 28, the LED 31, and the bonding leads 33 are covered. As shown in FIG. 4, since the surface of the sealing material 35 is formed by a curved surface (spherical surface or aspherical surface), the sealing material 35 can function as a lens (light) Diffusion function).
照明器具10，具備相對於樹脂部14能夠拆裝的透光性罩部件39(透光部件)。透光性罩部件39由透光性材料構成，並且為下面開口的中空部件，一體地具備：大致半球狀的擴散鏡片40(參照圖6)、從擴散鏡片40的下部向側方突出的四個突部41、和在突部41的下面分別突設的四個連接用突起42。此外，於擴散鏡片40的表面(上面)，通過移印(或者絲網印刷或噴墨印刷也可以)塗裝有擴散膜43。擴散膜43為以透光性的聚氨酯樹脂作為主要成分，並且在該聚氨酯樹脂中混合氧化鈦(TiO2)等而成，其厚度為數μm~數十μm。 The lighting fixture 10 is provided with a light-transmitting cover member 39 (light-transmitting member) detachably attached to the resin portion 14. The light-transmitting cover member 39 is made of a light-transmitting material and is a hollow member that is open at the lower surface, and integrally includes a substantially hemispherical diffusing lens 40 (see FIG. 6 ) and four protruding from the lower portion of the diffusing lens 40 . The projections 41 and the four connection projections 42 projecting from the lower surface of the projection 41, respectively. Further, on the surface (upper surface) of the diffusion lens 40, a diffusion film 43 is applied by pad printing (or screen printing or inkjet printing). The diffusion film 43 is made of a light-transmitting urethane resin as a main component, and titanium oxide (TiO 2 ) or the like is mixed with the urethane resin, and has a thickness of several μm to several tens of μm.
透光性罩部件39，通過相對於與四個連接用突起42對應的卡合孔18進行嵌合，相對於樹脂部14能夠拆裝地進行安裝。 The light-transmitting cover member 39 is detachably attached to the resin portion 14 by fitting with respect to the engagement hole 18 corresponding to the four connection projections 42.
照明器具10的散熱器11的下面，固定於由金屬板構成的底座37的上面。 The lower surface of the heat sink 11 of the lighting fixture 10 is fixed to the upper surface of the base 37 made of a metal plate.
相對於照明器具10能夠拆裝的帶有連接器的線纜45，是將兩根線纜46和連接器49一體化形成的。具有可撓性的線纜46，具備集束多根金屬線而成的電線47和由覆蓋電線47的表面的絕緣材料構成的覆蓋管48，各線纜46的兩端通過除去覆蓋管48而使電線47露出。連接器49具有絕緣材料構成的絕緣體50和第一觸點以及第二觸點(圖示省略)。第一觸點以及第二觸點都是由導電性材料(金屬等)構成，以固定狀態***絕緣體50的內部空間。於第一觸點以及第二觸點的一端分別壓接(連接)有兩根電線47的一個端部。 The cable 45 with a connector detachable with respect to the lighting fixture 10 is formed by integrally joining two cables 46 and a connector 49. The flexible cable 46 includes an electric wire 47 in which a plurality of metal wires are bundled, and a cover pipe 48 made of an insulating material covering the surface of the electric wire 47. Both ends of each cable 46 are removed by removing the cover pipe 48. The electric wire 47 is exposed. The connector 49 has an insulator 50 made of an insulating material and first and second contacts (not shown). Each of the first contact and the second contact is made of a conductive material (metal or the like) and is inserted into the internal space of the insulator 50 in a fixed state. One end portion of the two electric wires 47 is crimped (connected) to one ends of the first contact and the second contact, respectively.
如圖7所示，在照明器具10的一個連接用凹部17，能夠拆 裝地連接帶有連接器的線纜45的連接器49。當連接器49連接於連接用凹部17時，第一觸點和第二觸點分別接觸線纜連接部20B和線纜連接部21B。該帶有連接器的線纜45的兩根線纜46分別連接於電源的陽極和陰極。 As shown in FIG. 7, in one connection recess 17 of the lighting fixture 10, it can be removed. The connector 49 of the cable 45 with the connector is connected to the ground. When the connector 49 is connected to the connection recess 17, the first contact and the second contact respectively contact the cable connection portion 20B and the cable connection portion 21B. The two cables 46 of the connector cable 45 are connected to the anode and cathode of the power source, respectively.
當省略圖示的電源開關由OFF切換成ON時，由於電源產生的電流，經由線纜46流向由第一導電部件20、第二導電部件21、LED31以及接合引線33構成的並聯電路，因此各LED31(在圖8中，匯總相比照明器具10的中心部而位於左側的全部的LED以LED31A來表示，匯總相比該中心部而位於右側的全部的LED31以LED31B來表示)發光。另外，上述電源開關由ON切換至OFF時，由於電流向LED31的供給被切斷，因此各LED31熄燈。 When the power switch (not shown) is switched from OFF to ON, the current generated by the power source flows through the cable 46 to the parallel circuit including the first conductive member 20, the second conductive member 21, the LED 31, and the bonding lead 33. In the LED 31 (in FIG. 8 , all the LEDs on the left side of the center of the lighting fixture 10 are collectively indicated by the LED 31A, and all the LEDs 31 located on the right side of the center portion are indicated by the LED 31B) emit light. Further, when the power switch is switched from ON to OFF, the supply of current to the LED 31 is cut off, so that each of the LEDs 31 is turned off.
各LED31射出的照明光的一部分，透過密封材料35的同時通過密封材料35擴散，餘下的照明光通過反射膜28反射的同時射向密封材料35側。透過密封材料35的照明光射向擴散鏡片40側。射向擴散鏡片40的照明光的一部分通過擴散鏡片40擴散的同時，射向擴散鏡片40的外側，餘下的照明光通過擴散鏡片40向內側反射(進一步，在通過密封材料35或反射膜28反射後再度射向擴散鏡片40側)。一邊向擴散鏡片40的外側擴散一邊前進的照明光的一部分，通過擴散膜43擴散的同時，射向擴散膜43的外側。另外，一邊向擴散鏡片40的外側擴散一邊前進的餘下的照明光，通過擴散膜43(以及擴散鏡片40)向內側反射(並且在通過反射膜28、密封材料35、擴散鏡片40反射後再度射向擴散膜43側)。 A part of the illumination light emitted from each of the LEDs 31 is diffused by the sealing material 35 while passing through the sealing material 35, and the remaining illumination light is reflected by the reflection film 28 and is directed toward the sealing material 35 side. The illumination light that has passed through the sealing material 35 is directed toward the diffusing lens 40 side. A part of the illumination light that is incident on the diffusion lens 40 is diffused toward the outside of the diffusion lens 40 while being diffused by the diffusion lens 40, and the remaining illumination light is reflected inward by the diffusion lens 40 (further, reflected by the sealing material 35 or the reflection film 28) Afterwards, it is directed to the side of the diffusing lens 40). A part of the illumination light that is advanced while diffusing toward the outside of the diffusing lens 40 is diffused by the diffusion film 43 and is emitted to the outside of the diffusion film 43. Further, the remaining illumination light that has proceeded while diffusing toward the outside of the diffusing lens 40 is reflected inward by the diffusing film 43 (and the diffusing lens 40) (and is reflected by the reflecting film 28, the sealing material 35, and the diffusing lens 40). To the side of the diffusion film 43).
如此，從各LED31射出的照明光，通過密封材料35、擴散鏡片40以及擴散膜43被充分地擴散(以及反射)，形成極為均一的配光狀 態(亮度不均或顏色不均變少)。從而，無需在與樹脂部14(以及散熱器11)(向上方)分開的位置設置光擴散部件(例如擴散板(LSD))，能夠充分地使照明光擴散。 In this way, the illumination light emitted from each of the LEDs 31 is sufficiently diffused (and reflected) by the sealing material 35, the diffusing lens 40, and the diffusion film 43 to form a highly uniform light distribution. State (uneven brightness or uneven color). Therefore, it is not necessary to provide a light diffusing member (for example, a diffusion plate (LSD)) at a position apart from the resin portion 14 (and the heat sink 11) (upward), and the illumination light can be sufficiently diffused.
因此能夠減少設置於照明器具10的LED31的數量。 Therefore, the number of the LEDs 31 provided in the lighting fixture 10 can be reduced.
另外，由於沒有必要設置與樹脂部14(以及散熱器11)分開的光擴散部件，因此能夠使照明器具10的整體的厚度(上下尺寸)變小。 Further, since it is not necessary to provide a light diffusing member separate from the resin portion 14 (and the heat sink 11), the thickness (upper and lower dimensions) of the entire lighting fixture 10 can be made small.
此外，由於沒有必要設置與樹脂部14(以及散熱器11)分開的光擴散部件，因此能夠減少照明器具10的部件的數量，降低製造成本。 Further, since it is not necessary to provide a light diffusing member separate from the resin portion 14 (and the heat sink 11), the number of components of the lighting fixture 10 can be reduced, and the manufacturing cost can be reduced.
此外，由於各LED31產生的熱量，經由反射膜28傳導至散熱器11並且從散熱器11的下半部(沒有被樹脂部14覆蓋而露出的部分)放熱，同時，由於從散熱器11傳導至底座37後從底座37進行放熱，因此能夠使LED31的熱量高效地向外部放熱。因此能夠防止由高溫化造成的LED31的發光效率的降低。另外，由於能夠將發熱量多的大型的LED元件作為LED31使用，因此能夠使光量增多。 Further, heat generated by each of the LEDs 31 is conducted to the heat sink 11 via the reflective film 28 and radiates heat from the lower half of the heat sink 11 (the portion not exposed by the resin portion 14), while being conducted from the heat sink 11 to Since the base 37 is rearranged from the base 37, the heat of the LEDs 31 can be efficiently radiated to the outside. Therefore, it is possible to prevent a decrease in the luminous efficiency of the LED 31 caused by the high temperature. In addition, since a large-sized LED element having a large amount of heat can be used as the LED 31, the amount of light can be increased.
以上，基於上述各實施方式對本發明進行了說明，但是本發明並不限定於上述實施方式，能夠採取各種各樣的變形進行實施。 The present invention has been described above based on the above embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made.
例如，可以使擴散鏡片40的表面為粗面(存在細微凹凸的面)的基底上，在擴散鏡片40的表面形成擴散膜43。這樣的話，擴散膜43相對於擴散鏡片40的表面的形成狀態(密接狀態)更為安定。此外，由於擴散鏡片40的表面的細微凹凸以及與之對應的擴散膜43內面的細微凹凸，能夠發揮擴散以及反射照明光的功能，因此能夠使照明光的配光狀態更為均一。 For example, the diffusion film 43 may be formed on the surface of the diffusion lens 40 such that the surface of the diffusion lens 40 is a rough surface (a surface having fine unevenness). In this case, the diffusion film 43 is more stable with respect to the formation state (adhesive state) of the surface of the diffusion lens 40. In addition, since the fine unevenness on the surface of the diffusing lens 40 and the fine unevenness on the inner surface of the diffusing film 43 are provided, the function of diffusing and reflecting the illumination light can be exhibited, so that the light distribution state of the illumination light can be made more uniform.
另外也可以使擴散鏡片40的裡面(下面)為粗面(存在細微凹凸的面)。這種情況下也能夠使照明光的配光狀態更為均一。 Alternatively, the inner surface (lower surface) of the diffusing lens 40 may be a rough surface (a surface having fine unevenness). In this case as well, the light distribution state of the illumination light can be made more uniform.
另外，也可以在密封材料35的表面(上面)形成擴散膜43。以這種方式構成的密封材料35，能夠發揮與表面形成有擴散膜43的擴散鏡片40(透光性罩部件39)相同的技術效果。 Further, the diffusion film 43 may be formed on the surface (upper surface) of the sealing material 35. The sealing material 35 configured in this manner can exhibit the same technical effects as the diffusing lens 40 (translucent cover member 39) having the diffusion film 43 formed on its surface.
另外，如此在密封材料35的表面(上面)形成擴散膜43的情況下，既可以在透光性罩部件39的表面形成擴散膜43，也可以不形成。此外，在密封材料35的表面(上面)形成擴散膜43的情況下，也可以將透光性罩部件39省略。 Further, when the diffusion film 43 is formed on the surface (upper surface) of the sealing material 35 as described above, the diffusion film 43 may or may not be formed on the surface of the light-transmitting cover member 39. Further, in the case where the diffusion film 43 is formed on the surface (upper surface) of the sealing material 35, the light-transmitting cover member 39 may be omitted.
另外，在擴散鏡片40(透光性罩部件39)的表面形成擴散膜43的情況下，也可以將密封材料35省略。 Further, when the diffusion film 43 is formed on the surface of the diffusing lens 40 (translucent cover member 39), the sealing material 35 may be omitted.
另外，由上述的方式變更鄰接的引線連接部20A與引線連接部21A之間的通過接合引線33的連接方式，從而，可以將由第一導電部件20、第二導電部件21、LED31以及接合引線33構成的電路變為與上述並聯電路不同的方式。此外，也可以通過在兩端具有連接器49的帶有連接器的線纜45，將多個照明器具10彼此連接。 Further, by the above-described manner, the connection manner between the adjacent lead connecting portion 20A and the lead connecting portion 21A by the bonding lead 33 is changed, whereby the first conductive member 20, the second conductive member 21, the LED 31, and the bonding lead 33 can be used. The constructed circuit becomes a different approach from the parallel circuit described above. Further, the plurality of lighting fixtures 10 may be connected to each other by a cable 45 with a connector having connectors 49 at both ends.
此外，也可以在散熱器11與底座37之間***導熱性的片材或導熱性的粘接劑。 Further, a heat conductive sheet or a thermally conductive adhesive may be inserted between the heat sink 11 and the chassis 37.
10‧‧‧照明器具 10‧‧‧Lighting appliances
14‧‧‧樹脂部(基底部件) 14‧‧‧Resin part (base part)
17‧‧‧連接用凹部 17‧‧‧Connecting recess
20B‧‧‧線纜連接部 20B‧‧‧ Cable connection
21B‧‧‧線纜連接部 21B‧‧‧ Cable connection
37‧‧‧底座 37‧‧‧Base
39‧‧‧透光性罩部件(透光部件) 39‧‧‧Translucent cover parts (transparent parts)
41‧‧‧突部 41‧‧‧ protrusion
42‧‧‧連接用突部 42‧‧‧Connecting projections
43‧‧‧擴散膜 43‧‧‧Diffuser film
Claims (2)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013055997A JP5904671B2 (en) | 2013-03-19 | 2013-03-19 | Luminaire provided with semiconductor light emitting device |
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| Publication Number | Publication Date |
|---|---|
| TW201437557A TW201437557A (en) | 2014-10-01 |
| TWI580901B true TWI580901B (en) | 2017-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102138204A TWI580901B (en) | 2013-03-19 | 2013-10-23 | A lighting device having a semiconductor light emitting element |
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| Country | Link |
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| JP (1) | JP5904671B2 (en) |
| KR (1) | KR20140114724A (en) |
| CN (1) | CN104064661A (en) |
| TW (1) | TWI580901B (en) |
Citations (4)
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|---|---|---|---|---|
| TW200832765A (en) * | 2006-12-19 | 2008-08-01 | Seoul Semiconductor Co Ltd | Heat conducting slug having multi-step structure and the light emitting diode package using the same |
| TW201043863A (en) * | 2009-04-02 | 2010-12-16 | Koninkl Philips Electronics Nv | Reflector with mixing chamber |
| US20120018754A1 (en) * | 2010-07-23 | 2012-01-26 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
| WO2012090356A1 (en) * | 2010-12-28 | 2012-07-05 | パナソニック株式会社 | Light-emitting device, light-emitting module, and lamp |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19918370B4 (en) * | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED white light source with lens |
| US7456499B2 (en) * | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
| JP2009218434A (en) * | 2008-03-11 | 2009-09-24 | Sharp Corp | Optical space transmission device |
| WO2009148543A2 (en) * | 2008-05-29 | 2009-12-10 | Cree, Inc. | Light source with near field mixing |
| US7932529B2 (en) * | 2008-08-28 | 2011-04-26 | Visera Technologies Company Limited | Light-emitting diode device and method for fabricating the same |
-
2013
- 2013-03-19 JP JP2013055997A patent/JP5904671B2/en not_active Expired - Fee Related
- 2013-08-05 KR KR1020130092366A patent/KR20140114724A/en not_active Application Discontinuation
- 2013-10-23 TW TW102138204A patent/TWI580901B/en not_active IP Right Cessation
- 2013-12-26 CN CN201310729407.3A patent/CN104064661A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200832765A (en) * | 2006-12-19 | 2008-08-01 | Seoul Semiconductor Co Ltd | Heat conducting slug having multi-step structure and the light emitting diode package using the same |
| TW201043863A (en) * | 2009-04-02 | 2010-12-16 | Koninkl Philips Electronics Nv | Reflector with mixing chamber |
| US20120018754A1 (en) * | 2010-07-23 | 2012-01-26 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
| WO2012090356A1 (en) * | 2010-12-28 | 2012-07-05 | パナソニック株式会社 | Light-emitting device, light-emitting module, and lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5904671B2 (en) | 2016-04-20 |
| CN104064661A (en) | 2014-09-24 |
| KR20140114724A (en) | 2014-09-29 |
| JP2014182908A (en) | 2014-09-29 |
| TW201437557A (en) | 2014-10-01 |
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