JP5904671B2 - Luminaire provided with semiconductor light emitting device - Google Patents

Luminaire provided with semiconductor light emitting device Download PDF

Info

Publication number
JP5904671B2
JP5904671B2 JP2013055997A JP2013055997A JP5904671B2 JP 5904671 B2 JP5904671 B2 JP 5904671B2 JP 2013055997 A JP2013055997 A JP 2013055997A JP 2013055997 A JP2013055997 A JP 2013055997A JP 5904671 B2 JP5904671 B2 JP 5904671B2
Authority
JP
Japan
Prior art keywords
led
semiconductor light
light emitting
emitting element
lighting fixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013055997A
Other languages
Japanese (ja)
Other versions
JP2014182908A (en
Inventor
透 我妻
透 我妻
啓光 栗元
啓光 栗元
晃彰 野々山
晃彰 野々山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Connector Products Corp
Original Assignee
Kyocera Connector Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Connector Products Corp filed Critical Kyocera Connector Products Corp
Priority to JP2013055997A priority Critical patent/JP5904671B2/en
Priority to KR1020130092366A priority patent/KR20140114724A/en
Priority to TW102138204A priority patent/TWI580901B/en
Priority to CN201310729407.3A priority patent/CN104064661A/en
Publication of JP2014182908A publication Critical patent/JP2014182908A/en
Application granted granted Critical
Publication of JP5904671B2 publication Critical patent/JP5904671B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Description

本発明は、半導体発光素子（ＬＥＤ）を備える照明器具に関する。   The present invention relates to a lighting fixture including a semiconductor light emitting element (LED).

半導体発光素子（ＬＥＤ）を利用した照明器具の従来例としては、例えば特許文献１に開示されたものがある。
この照明器具は、絶縁性材料からなるベース部材と、ベース部材に固定したコンタクトと、ベース部材に固定したＬＥＤユニットと、を具備している。ＬＥＤユニットは、コンタクトと導通する基板と、該基板に実装したＬＥＤ（半導体発光素子）と、を一体的に備えており、ＬＥＤはベース部材に形成した露出窓を介して外側に露出している。コンタクトはケーブルを介して電源と接続しているので、電源が発生した電力をケーブル及びコンタクトを介してＬＥＤに供給するとＬＥＤが発光する。 As a conventional example of a lighting fixture using a semiconductor light emitting element (LED), there is one disclosed in Patent Document 1, for example.
This luminaire includes a base member made of an insulating material, a contact fixed to the base member, and an LED unit fixed to the base member. The LED unit is integrally provided with a substrate that is electrically connected to the contact and an LED (semiconductor light emitting element) mounted on the substrate, and the LED is exposed to the outside through an exposure window formed in the base member. . Since the contact is connected to the power source via the cable, the LED emits light when the power generated by the power source is supplied to the LED via the cable and the contact.

ＬＥＤで発生した光はＬＥＤ近傍の輝度が集中的に高くなるので、上記のような照明器具においては、ベース部材に拡散レンズを取り付けて、ＬＥＤで発生した光を拡散レンズによって拡散させることが従来より行われている。
しかし従来の拡散レンズだけではＬＥＤで発生した光を十分に拡散させるのが難しく、輝度ムラや色ムラが生じ易い。そのため拡散レンズの直前に、拡散レンズ（及びベース部材）から離間した平板状の拡散板（ＬＳＤ）を配置することが従来より行われている（特許文献２）。拡散板を利用すれば各ＬＥＤから出射される光を十分に拡散できる（光の拡散状態をより均一化できる）ので、ＬＥＤの数を減らしても十分な明るさを得ることが可能である。 Since the light generated by the LED is intensively increased in the brightness near the LED, it is conventional to attach a diffusion lens to the base member and diffuse the light generated by the LED by the diffusion lens in the lighting fixture as described above. Has been done more.
However, it is difficult to sufficiently diffuse the light generated by the LED using only the conventional diffusion lens, and uneven brightness and uneven color are likely to occur. For this reason, a flat diffusion plate (LSD) separated from the diffusion lens (and the base member) is disposed just before the diffusion lens (Patent Document 2). If the diffusion plate is used, the light emitted from each LED can be sufficiently diffused (the light diffusion state can be made more uniform), so that sufficient brightness can be obtained even if the number of LEDs is reduced.

特開２０１２−１６４６１３号公報JP 2012-164613 A 特開２００８−２４１９８７号公報JP 2008-241987

近年、照明器具を実装する電子機器（例えば液晶ディスプレイ）に対して薄型化が強く求められている。一方でディスプレイ等には輝度ムラを低減したいという市場要求がある。
しかしながら輝度ムラを低減させるために拡散板を拡散レンズ（及びベース部材）から離間した状態で配置すると、ベース部材、ＬＥＤユニット、拡散レンズ、及び拡散板を構成要素として具備する照明器具全体の厚みが大きくなってしまうので、この要求に応えられなくなってしまう。
また、拡散板を設けたり、ＬＥＤの数を増やして輝度ムラを低減させようとすると、照明器具の部品点数が多くなり、製造コストが上昇してしまう。 In recent years, there has been a strong demand for thinning electronic devices (for example, liquid crystal displays) on which lighting fixtures are mounted. On the other hand, there is a market demand for displays and the like to reduce luminance unevenness.
However, when the diffuser plate is arranged in a state of being separated from the diffuser lens (and the base member) in order to reduce luminance unevenness, the thickness of the entire lighting fixture including the base member, the LED unit, the diffuser lens, and the diffuser plate as constituent elements is reduced. Because it becomes large, it becomes impossible to meet this demand.
Further, if a diffusion plate is provided or the number of LEDs is increased to reduce luminance unevenness, the number of parts of the lighting fixture increases and the manufacturing cost increases.

本発明の目的は、半導体発光素子を支持するベース部材から離間した光拡散部材を用いることなく、半導体発光素子で発生した光を十分に拡散させることが可能な半導体発光素子を備える照明器具を提供することにある。   An object of the present invention is to provide a luminaire including a semiconductor light emitting element capable of sufficiently diffusing light generated in the semiconductor light emitting element without using a light diffusing member separated from a base member supporting the semiconductor light emitting element. There is to do.

本発明の半導体発光素子を備える照明器具は、その１つの態様では、ベース部材と、上記ベース部材の表面に設けられた、共に電源と電気的に導通可能で互いに離間する第一導電部材及び第二導電部材と、上記ベース部材の表面に設けられた、上記第一導電部材及び上記第二導電部材と電気的に導通可能な半導体発光素子と、上記ベース部材の表面に設けられた、上記第一導電部材、上記第二導電部材及び上記半導体発光素子を覆いかつ上記半導体発光素子が発した照明光が透過する封止剤と、上記ベース部材に設けられた、上記封止剤が透過した照明光を拡散させながら透過させる透光性カバー部材と、を備え、上記封止剤の表面は、曲面であって上記半導体発光素子が発した照明光を拡散する拡散レンズを構成することを特徴としている。 In one aspect, a lighting fixture including a semiconductor light emitting element according to the present invention includes a base member, a first conductive member provided on a surface of the base member, and a first conductive member and a first conductive member that are both electrically connected to a power source and are separated from each other. Two conductive members; a semiconductor light emitting element electrically connected to the first conductive member and the second conductive member provided on the surface of the base member; and the first conductive member provided on the surface of the base member. A sealant that covers the one conductive member, the second conductive member, and the semiconductor light emitting element and that transmits the illumination light emitted from the semiconductor light emitting element; and an illumination that is provided on the base member and that transmits the sealant A translucent cover member that transmits light while diffusing, and the surface of the sealant is a curved surface, and constitutes a diffusion lens that diffuses illumination light emitted from the semiconductor light emitting element Have

上記ベース部材の表面に設けられた凹部の底面に、上記半導体発光素子及び上記封止材が設けられていてもよい。 The bottom surface of the recess provided in the surface of the base member, may be the semiconductor light emitting element and the sealing material is provided.

本発明の照明器具は、半導体発光素子を固定したベース部材に対して、半導体発光素子が発した照明光が拡散しながら透過可能な透光部材を取り付け、さらに透光部材の表面に拡散膜を形成している。
そのため半導体発光素子で発生した照明光は、透光部材によって拡散された後に、拡散膜によってさらに拡散されることになる。そのため、ベース部材から離間した光拡散部材を設けることなく、照明光を十分に拡散させることが可能である。
そのため照明器具に設ける半導体発光素子を少なくすることが可能である。
さらに光拡散部材を設ける必要がないので、照明器具の部品点数を少なくし、製造コストを低くすることが可能である。
また、ベース部材から離間した光拡散部材を設ける必要がないので、照明器具全体の厚みを小さくすることが可能になる。 In the lighting fixture of the present invention, a translucent member capable of transmitting illumination light emitted from a semiconductor light emitting element while diffusing is attached to a base member to which the semiconductor light emitting element is fixed, and a diffusion film is provided on the surface of the translucent member Forming.
Therefore, the illumination light generated by the semiconductor light emitting element is diffused by the light transmitting member and then further diffused by the diffusion film. Therefore, it is possible to sufficiently diffuse the illumination light without providing a light diffusing member separated from the base member.
Therefore, it is possible to reduce the number of semiconductor light emitting elements provided in the lighting fixture.
Furthermore, since it is not necessary to provide a light diffusing member, it is possible to reduce the number of parts of the lighting fixture and reduce the manufacturing cost.
Moreover, since it is not necessary to provide the light-diffusion member spaced apart from the base member, the thickness of the entire lighting fixture can be reduced.

本発明の一実施形態の照明器具の透光性カバー部材及びワイヤーボンディングを省略して示す上方から見た斜視図である。It is the perspective view seen from the upper side which abbreviate | omitted and shows the translucent cover member and wire bonding of the lighting fixture of one Embodiment of this invention. 切断加工前の導通板の平面図である。It is a top view of the conduction | electrical_connection board before a cutting process. 照明器具の透光性カバー部材を省略して示す平面図である。It is a top view which abbreviate | omits and shows the translucent cover member of a lighting fixture. 図１のIV−IV矢線に沿う断面図である。It is sectional drawing which follows the IV-IV arrow line of FIG. シャシーとシャシーに固定した照明器具の斜視図である。It is a perspective view of the lighting fixture fixed to the chassis and the chassis. 透光性カバー部材の中央部の断面図である。It is sectional drawing of the center part of a translucent cover member. シャシーに対して照明器具を固定しかつ照明器具にコネクタ付ケーブルのコネクタを接続したときの平面図である。It is a top view when fixing a lighting fixture with respect to a chassis and connecting the connector of the cable with a connector to a lighting fixture. 透光性カバー及びシャシーの図示を省略した図７の照明器具の模式的な平面図である。It is a typical top view of the lighting fixture of FIG. 7 which abbreviate | omitted illustration of a translucent cover and a chassis.

以下、添付図面を参照しながら本発明の一実施形態について説明する。なお、以下の説明中の前後、左右、及び上下の方向は、図中の矢印の方向を基準としている。
本実施形態の照明器具１０は、ヒートシンク１１と、ヒートシンク１１の上部に一体成形した樹脂部１４（ベース部材）を具備している。
ヒートシンク１１はアルミニウム等の金属からなる一体成形品であり、その熱伝導率は樹脂部１４より高い。ヒートシンク１１の上部には低寸円柱形状の上端凸部１２が突設してあり、上端凸部１２の上面は平面により構成してある。
平面視略方形の樹脂部１４は絶縁性及び耐熱性が高い樹脂材料（例えば液晶ポリマー等）からなるものである。樹脂部１４の上面には平面視円形の円形凹部１５が形成してあり、円形凹部１５の底面には平面視円形かつ上端凸部１２と同径の円形貫通孔１６が形成してある。図４に示すようにヒートシンク１１の上端凸部１２が樹脂部１４の円形貫通孔１６に嵌合している（円形凹部１５の内面と上端凸部１２の上面が特許請求の範囲の「凹部」に相当）。樹脂部１４の対角線上に位置する二つの角部には接続用凹部１７が凹設してある。さらに樹脂部１４の上面には４つの係合孔１８が形成してある。 Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, front and rear, left and right, and up and down directions are based on the directions of arrows in the figure.
The luminaire 10 of the present embodiment includes a heat sink 11 and a resin portion 14 (base member) integrally formed on the heat sink 11.
The heat sink 11 is an integrally molded product made of a metal such as aluminum, and its thermal conductivity is higher than that of the resin portion 14. An upper end convex portion 12 having a small cylindrical shape protrudes from the upper portion of the heat sink 11, and the upper surface of the upper end convex portion 12 is constituted by a plane.
The resin portion 14 having a substantially square shape in plan view is made of a resin material (for example, a liquid crystal polymer) having high insulation and heat resistance. A circular recess 15 having a circular shape in plan view is formed on the upper surface of the resin portion 14, and a circular through hole 16 having a circular shape in plan view and the same diameter as the upper end convex portion 12 is formed on the bottom surface of the circular recess 15. As shown in FIG. 4, the upper end convex portion 12 of the heat sink 11 is fitted in the circular through hole 16 of the resin portion 14 (the inner surface of the circular concave portion 15 and the upper surface of the upper convex portion 12 are “recessed portions” in the claims) Equivalent). Connection recesses 17 are provided at two corners located on the diagonal of the resin part 14. Further, four engagement holes 18 are formed on the upper surface of the resin portion 14.

照明器具１０は、樹脂部１４の内部及び樹脂部１４の表面と一体化した金属部材を具備している。この金属部材は、例えば黄銅、ベリリウム銅、コルソン系銅合金等の導電性と熱伝導性と剛性に優れる金属製の平板をスタンピング成形したものである。
この金属部材は、第一導電部材２０と第二導電部材２１を二つずつ備えている。第一導電部材２０は、円弧状のワイヤー接続部２０Ａと、ワイヤー接続部２０Ａと連続するケーブル接続部２０Ｂを備えている。一方、第二導電部材２１は、円弧状（ワイヤー接続部２０Ａと同じ形状）のワイヤー接続部２１Ａと、ワイヤー接続部２１Ａと連続するケーブル接続部２１Ｂを備えている。図示するようにワイヤー接続部２０Ａ、２１Ａは樹脂部１４の表面（円形凹部１５の底面）において露出しており、ケーブル接続部２０Ｂ、２１Ｂは接続用凹部１７の表面において露出している。
この第一導電部材２０と第二導電部材２１は照明器具１０の製造前の段階においては一つの導通板１９の一部をそれぞれ構成している。導通板１９は図２に示す形状であり、その全体形状は、前後方向に延びる長尺平板状（図１は導通板１９の一部のみを図示している）である。導通板１９の左右両側部は前後方向に延びるキャリア部２２Ａ、２２Ｂにより構成してあり、キャリア部２２Ａとキャリア部２２Ｂの複数箇所どうしを前後方向に等間隔で設けたキャリア接続部２３が接続している。さらに２つの第一導電部材２０は共に２本の第一切断ブリッジ２４によってキャリア部２２Ａ、２２Ｂ及びキャリア接続部２３とそれぞれ一体化しており、２つの第二導電部材２１は共に１本の第二切断ブリッジ２５によってキャリア接続部２３と一体化している。さらに隣接する第一導電部材２０と第二導電部材２１は１本の第三切断ブリッジ２６によって互いに接続している。
樹脂部１４は二回の成形行程を経てヒートシンク１１と一体化するものである。樹脂部１４の一段階目の成形行程が完了したときに導通板１９と樹脂部１４（の一段階目の完成体）は一体化する。樹脂部１４の一回目の成形行程が完了した後に、図示を省略した切断装置によって導通板１９の第一切断ブリッジ２４、第二切断ブリッジ２５、及び第三切断ブリッジ２６を切断すると、樹脂部１４（の一段階目の完成体）と一体化した第一導電部材２０と第二導電部材２１が互いに分離状態となる。 The lighting fixture 10 includes a metal member integrated with the inside of the resin portion 14 and the surface of the resin portion 14. This metal member is formed by stamping a metal flat plate having excellent conductivity, thermal conductivity, and rigidity, such as brass, beryllium copper, and Corson copper alloy.
This metal member includes two first conductive members 20 and two second conductive members 21. The first conductive member 20 includes an arc-shaped wire connection portion 20A and a cable connection portion 20B continuous with the wire connection portion 20A. On the other hand, the second conductive member 21 includes a wire connection portion 21A having an arc shape (the same shape as the wire connection portion 20A) and a cable connection portion 21B continuous with the wire connection portion 21A. As shown in the drawing, the wire connecting portions 20A and 21A are exposed on the surface of the resin portion 14 (the bottom surface of the circular recess 15), and the cable connecting portions 20B and 21B are exposed on the surface of the connecting recess 17.
The first conductive member 20 and the second conductive member 21 respectively constitute a part of one conductive plate 19 in a stage before the lighting fixture 10 is manufactured. The conductive plate 19 has the shape shown in FIG. 2, and the overall shape thereof is a long flat plate extending in the front-rear direction (FIG. 1 shows only a part of the conductive plate 19). The left and right side portions of the conductive plate 19 are configured by carrier portions 22A and 22B extending in the front-rear direction, and a carrier connection portion 23 provided with a plurality of portions of the carrier portion 22A and the carrier portion 22B at equal intervals in the front-rear direction is connected. ing. Furthermore, the two first conductive members 20 are respectively integrated with the carrier portions 22A and 22B and the carrier connecting portion 23 by two first cutting bridges 24, and the two second conductive members 21 are both one second. The carrier bridge 23 is integrated with the cutting bridge 25. Further, the adjacent first conductive member 20 and second conductive member 21 are connected to each other by one third cutting bridge 26.
The resin part 14 is integrated with the heat sink 11 through two molding steps. When the first stage molding process of the resin part 14 is completed, the conductive plate 19 and the resin part 14 (first stage finished product) are integrated. After the first molding process of the resin portion 14 is completed, the first cutting bridge 24, the second cutting bridge 25, and the third cutting bridge 26 of the conductive plate 19 are cut by a cutting device (not shown). The first conductive member 20 and the second conductive member 21 integrated with (the first-stage finished product) are separated from each other.

上端凸部１２の上面、円形凹部１５の底面（上端凸部１２の外周側に位置する環状の部位）、及び円形凹部１５の内周面（テーパ形状の環状壁）にはパッド印刷機（図示略）によって反射膜２８が厚さ３０μｍの薄膜として一体的に（連続的に）印刷してある。反射膜２８は主成分であるポリウレタン樹脂に酸化チタン（ＴｉＯ2）等を着色剤として混合したものであり、全体として絶縁性を有している。反射膜２８は着色剤を含有しているので白色であり、アルミニウムからなるヒートシンク１１とは色（色相）が異なり、その（光の）可視光反射率はヒートシンク１１及び樹脂部１４より高い（具体的には可視光反射率が９０％以上であり、好ましくは９５％以上のものを利用する）。また上端凸部１２の上面に形成した反射膜２８は上端凸部１２の上面の一部を避けた態様で形成してある。即ち、図示するように多数（計３６個）の平面視矩形領域を避ける態様で上端凸部１２の上面に形成してある。各平面視矩形領域はそれぞれＬＥＤ固定部２９を構成しており、反射膜２８の上面とＬＥＤ固定部２９の間には反射膜２８の肉厚分の段差が生じている。 A pad printing machine (not shown) is provided on the upper surface of the upper convex portion 12, the bottom surface of the circular concave portion 15 (an annular portion located on the outer peripheral side of the upper convex portion 12), and the inner peripheral surface (tapered annular wall) of the circular concave portion 15. The reflective film 28 is printed integrally (continuously) as a thin film having a thickness of 30 μm. The reflective film 28 is obtained by mixing titanium oxide (TiO 2 ) or the like as a main component with a polyurethane resin as a main component, and has insulating properties as a whole. The reflective film 28 is white because it contains a colorant, and has a different color (hue) from the heat sink 11 made of aluminum, and its (light) visible light reflectance is higher than that of the heat sink 11 and the resin portion 14 (specifically). For example, the visible light reflectance is 90% or more, preferably 95% or more). Further, the reflection film 28 formed on the upper surface of the upper end convex portion 12 is formed in such a manner that a part of the upper surface of the upper end convex portion 12 is avoided. That is, it is formed on the upper surface of the upper end convex portion 12 so as to avoid a large number (36 in total) of rectangular regions in plan view as shown in the figure. Each rectangular region in plan view constitutes an LED fixing portion 29, and a step corresponding to the thickness of the reflecting film 28 is generated between the upper surface of the reflecting film 28 and the LED fixing portion 29.

各ＬＥＤ支持部２９には略直方体形状のＬＥＤ３１（半導体発光素子）が固定してある。図示するように各ＬＥＤ３１の平面形状はＬＥＤ固定部２９と略同一（ＬＥＤ固定部２９より僅かに小寸）である。ＬＥＤ固定部２９に対してＬＥＤ３１を固定する際は、まず各ＬＥＤ固定部２９（上端凸部１２の上面）に接着剤（図示略）を塗布し、次いで図示を省略したＬＥＤ搬送装置が各ＬＥＤ固定部２９にＬＥＤ３１を載置する。上記したように反射膜２８の上面とＬＥＤ固定部２９の間には反射膜２８の肉厚分の段差が生じているので（ＬＥＤ固定部２９が、反射膜２８によって囲まれた凹部になっているので）、各ＬＥＤ固定部２９に対してＬＥＤ３１を簡単かつ確実に取り付ける（嵌合）ことができる。さらに反射膜２８の上面とＬＥＤ固定部２９の間には反射膜２８の肉厚分の段差が生じているので、ＬＥＤ固定部２９（上端凸部１２の上面）に塗布した接着剤がＬＥＤ固定部２９の周囲（反射膜２８側）に流れるのを抑制できる。また上記ＬＥＤ搬送装置は色相差を識別するセンサーを有しており、上記ＬＥＤ搬送装置は反射膜２８とＬＥＤ固定部２９の間の色相差（境界線）を認識しながらＬＥＤ固定部２９に対してＬＥＤ３１を載置する。そのため、ＬＥＤ固定部２９に対してＬＥＤ３１を確実に載置することが可能である。
隣り合うＬＥＤ３１の上面に露出させて形成した端子（図示略）どうしはワイヤーボンディング３３（図３に示した太線）によって接続してあり、かつ、ワイヤー接続部２０Ａと対向する位置に位置するＬＥＤ３１の端子とワイヤー接続部２０Ａをワイヤーボンディング３３によって接続すると共にワイヤー接続部２１Ａと対向する位置に位置するＬＥＤ３１の端子とワイヤー接続部２１Ａをワイヤーボンディング３３によって接続してある。さらに前側のワイヤー接続部２０Ａと後側のワイヤー接続部２１Ａはワイヤーボンディング３３により接続してあり、かつ、後側のワイヤー接続部２０Ａと前側のワイヤー接続部２１Ａもワイヤーボンディング３３により接続してある。
さらに樹脂部１４の円形凹部１５内には透光性及び絶縁性を有する熱硬化性樹脂材料や紫外線硬化性樹脂材料等からなる封止剤３５（透光部材）が設けてあり、封止剤３５はワイヤー接続部２０Ａ、ワイヤー接続部２１Ａ、反射膜２８、ＬＥＤ３１、及びワイヤーボンディング３３を覆っている。図４に示すように封止剤３５の表面は曲面（球面や非球面）により構成してあるので、封止剤３５はレンズ機能（光の拡散機能）を発揮する。 A substantially rectangular parallelepiped LED 31 (semiconductor light emitting element) is fixed to each LED support portion 29. As shown in the figure, the planar shape of each LED 31 is substantially the same as the LED fixing portion 29 (slightly smaller than the LED fixing portion 29). When fixing the LED 31 to the LED fixing portion 29, first, an adhesive (not shown) is applied to each LED fixing portion 29 (the upper surface of the upper end convex portion 12), and then the LED transport device not shown in the drawing is used for each LED. The LED 31 is placed on the fixing unit 29. As described above, there is a step corresponding to the thickness of the reflective film 28 between the upper surface of the reflective film 28 and the LED fixing part 29 (the LED fixing part 29 becomes a recess surrounded by the reflective film 28. Therefore, the LED 31 can be attached (fitted) easily and reliably to each LED fixing portion 29. Further, since a step corresponding to the thickness of the reflective film 28 is formed between the upper surface of the reflective film 28 and the LED fixing portion 29, the adhesive applied to the LED fixing portion 29 (the upper surface of the upper end convex portion 12) is fixed to the LED. It is possible to suppress the flow around the portion 29 (the reflective film 28 side). Further, the LED transport device has a sensor for identifying a hue difference, and the LED transport device recognizes a hue difference (boundary line) between the reflective film 28 and the LED fixing portion 29 with respect to the LED fixing portion 29. Then, the LED 31 is placed. Therefore, the LED 31 can be reliably placed on the LED fixing portion 29.
Terminals (not shown) formed exposed on the upper surfaces of adjacent LEDs 31 are connected by wire bonding 33 (thick line shown in FIG. 3), and the LED 31 located at a position facing the wire connecting portion 20A. The terminal and the wire connecting part 20A are connected by the wire bonding 33, and the terminal of the LED 31 located at a position facing the wire connecting part 21A and the wire connecting part 21A are connected by the wire bonding 33. Further, the front wire connecting portion 20A and the rear wire connecting portion 21A are connected by wire bonding 33, and the rear wire connecting portion 20A and the front wire connecting portion 21A are also connected by wire bonding 33. .
Further, a sealing agent 35 (translucent member) made of a thermosetting resin material or an ultraviolet curable resin material having translucency and insulation is provided in the circular recess 15 of the resin portion 14. 35 covers the wire connecting part 20 </ b> A, the wire connecting part 21 </ b> A, the reflective film 28, the LED 31, and the wire bonding 33. As shown in FIG. 4, since the surface of the sealing agent 35 is constituted by a curved surface (spherical surface or aspherical surface), the sealing agent 35 exhibits a lens function (light diffusion function).

照明器具１０は、樹脂部１４に対して着脱可能な透光性カバー部材３９（透光部材）を具備している。透光性カバー部材３９は透光性材料からなりかつ下面が開口した中空部材であり、略半球状の拡散レンズ４０（図６参照）と、拡散レンズ４０の下部から側方に突出する４つの突部４１と、突部４１の下面にそれぞれ突設した４つの接続用突起４２と、を一体的に具備している。さらに拡散レンズ４０の表面（上面）にはパッド印刷（或いはスクリーン印刷やインクジェット印刷によっても可）によって拡散膜４３がコーティングしてある。拡散膜４３は透光性のポリウレタン樹脂を主成分とし、かつこのポリウレタン樹脂に酸化チタン（ＴｉＯ2）等を混合させたものであり、その厚みは数μｍ〜数十μｍである。
透光性カバー部材３９は、４つの接続用突起４２を対応する係合孔１８に対して嵌合することにより、樹脂部１４に対して着脱可能に装着してある。
照明器具１０のヒートシンク１１の下面は、金属板からなるシャシー３７の上面に固定してある。 The lighting fixture 10 includes a translucent cover member 39 (translucent member) that can be attached to and detached from the resin portion 14. The translucent cover member 39 is a hollow member made of a translucent material and having an open bottom surface. The translucent cover member 39 includes a substantially hemispherical diffusing lens 40 (see FIG. 6) and four protruding sideways from the lower part of the diffusing lens 40. The protrusion 41 and the four connection protrusions 42 respectively protruding from the lower surface of the protrusion 41 are integrally provided. Further, the surface (upper surface) of the diffusion lens 40 is coated with a diffusion film 43 by pad printing (or screen printing or ink jet printing). The diffusion film 43 has a light-transmitting polyurethane resin as a main component and is made by mixing this polyurethane resin with titanium oxide (TiO 2 ) or the like, and has a thickness of several μm to several tens of μm.
The translucent cover member 39 is detachably attached to the resin portion 14 by fitting the four connection protrusions 42 into the corresponding engagement holes 18.
The lower surface of the heat sink 11 of the lighting fixture 10 is fixed to the upper surface of a chassis 37 made of a metal plate.

照明器具１０に対して着脱可能なコネクタ付ケーブル４５は、２本のケーブル４６と、コネクタ４９とを一体化したものである。可撓性を有するケーブル４６は、多数の金属線を束ねたものである電線４７と、電線４７の表面を被覆する絶縁材料からなる被覆チューブ４８と、を具備しており、各ケーブル４６の両端は被覆チューブ４８を除去することにより電線４７を露出させてある。コネクタ４９は、絶縁材料からなるインシュレータ５０と、第一コンタクト及び第二コンタクト（図示略）とを有している。第一コンタクト及び第二コンタクトは共に導電性材料（金属など）からなるものであり、インシュレータ５０の内部空間に固定状態で挿入してある。第一コンタクト及び第二コンタクトの一端には２本の電線４７の一方の端部がそれぞれ圧着してある（接続している）。
図７に示すように照明器具１０の一方の接続用凹部１７にはコネクタ付ケーブル４５のコネクタ４９が着脱可能に接続してある。コネクタ４９を接続用凹部１７に接続すると、第一コンタクトと第二コンタクトがケーブル接続部２０Ｂとケーブル接続部２１Ｂに対してそれぞれ接触する。当該コネクタ付ケーブル４５の２本のケーブル４６は電源の陽極と陰極にそれぞれ接続している。
図示を省略した電源スイッチをＯＦＦからＯＮに切り換えると、電源で発生した電流がケーブル４６を介して、第一導電部材２０、第二導電部材２１、ＬＥＤ３１、及びワイヤーボンディング３３によって構成された並列回路に流れるので各ＬＥＤ３１（図８では照明器具１０の中心部より左側に位置する全てのＬＥＤをまとめてＬＥＤ３１Ａと表示してあり、該中心部より右側に位置する全てのＬＥＤ３１をまとめてＬＥＤ３１Ｂと表示している）が発光する。なお、上記電源スイッチをＯＮからＯＦＦに切り換えれば、電流のＬＥＤ３１への供給が遮断されるので各ＬＥＤ３１は消灯する。 The cable 45 with a connector that can be attached to and detached from the lighting fixture 10 is obtained by integrating two cables 46 and a connector 49. The cable 46 having flexibility includes an electric wire 47 in which a large number of metal wires are bundled, and a covering tube 48 made of an insulating material that covers the surface of the electric wire 47. The wire 47 is exposed by removing the covering tube 48. The connector 49 has an insulator 50 made of an insulating material, and a first contact and a second contact (not shown). Both the first contact and the second contact are made of a conductive material (metal or the like), and are inserted into the inner space of the insulator 50 in a fixed state. One end of each of the two electric wires 47 is crimped to (connected to) one end of the first contact and the second contact.
As shown in FIG. 7, a connector 49 of a cable 45 with a connector is detachably connected to one connection recess 17 of the lighting fixture 10. When the connector 49 is connected to the connection recess 17, the first contact and the second contact come into contact with the cable connection portion 20B and the cable connection portion 21B, respectively. Two cables 46 of the connector-equipped cable 45 are respectively connected to the anode and the cathode of the power source.
When the power switch (not shown) is switched from OFF to ON, a parallel circuit is formed by the first conductive member 20, the second conductive member 21, the LED 31, and the wire bonding 33 through the cable 46. Each LED 31 (in FIG. 8, all LEDs located on the left side of the central portion of the luminaire 10 are collectively indicated as LED 31A, and all LEDs 31 located on the right side of the central portion are collectively indicated as LED 31B. ) Emits light. When the power switch is switched from ON to OFF, the supply of current to the LEDs 31 is interrupted, and thus each LED 31 is turned off.

各ＬＥＤ３１が出射した照明光の一部は封止材３５を透過しながら封止材３５によって拡散され、残りの照明光は反射膜２８によって反射されながら封止材３５側に向かう。封止材３５を透過した照明光は拡散レンズ４０側に向かう。拡散レンズ４０に向かった照明光の一部は拡散レンズ４０によって拡散されながら拡散レンズ４０の外側に向かい、残りの照明光は拡散レンズ４０によって内側に反射される（さらに封止材３５や反射膜２８によって反射された後に再度拡散レンズ４０側に向かう）。拡散レンズ４０の外側に拡散されながら進んだ照明光の一部は拡散膜４３によって拡散されながら拡散膜４３の外側に向かう。一方、拡散レンズ４０の外側に拡散されながら進んだ残りの照明光は、拡散膜４３（及び拡散レンズ４０）によって内側に反射される（さらに反射膜２８、封止材３５、拡散レンズ４０によって反射された後に再度拡散膜４３側に向かう）。
このように各ＬＥＤ３１から出射された照明光は、封止材３５、拡散レンズ４０、及び拡散膜４３によって十分に拡散（及び反射）されることにより極めて均一な配光状態（輝度ムラや色ムラが少なくなる）になる。従って、樹脂部１４（及びヒートシンク１１）から（上方に）離間した位置に光拡散部材（例えば拡散板（ＬＳＤ））を設けることなく、照明光を十分に拡散させることが可能である。
そのため照明器具１０に設けるＬＥＤ３１の数を少なくすることが可能である。
また、樹脂部１４（及びヒートシンク１１）から離間した光拡散部材を設ける必要がないので、照明器具１０全体の厚み（上下寸法）を小さくすることが可能になる。
さらに樹脂部１４（及びヒートシンク１１）から離間した光拡散部材を設ける必要がないので、照明器具１０の部品点数を少なくし、製造コストを低くすることが可能である。 A part of the illumination light emitted from each LED 31 is diffused by the sealing material 35 while passing through the sealing material 35, and the remaining illumination light is reflected by the reflective film 28 toward the sealing material 35. The illumination light that has passed through the sealing material 35 travels toward the diffusion lens 40 side. A part of the illumination light directed toward the diffusion lens 40 is directed to the outside of the diffusion lens 40 while being diffused by the diffusion lens 40, and the remaining illumination light is reflected to the inside by the diffusion lens 40 (in addition, the sealing material 35 and the reflection film). After being reflected by the light 28, it goes again toward the diffusion lens 40). A part of the illumination light that has traveled while being diffused to the outside of the diffusion lens 40 is directed to the outside of the diffusion film 43 while being diffused by the diffusion film 43. On the other hand, the remaining illumination light that has traveled while being diffused to the outside of the diffusion lens 40 is reflected to the inside by the diffusion film 43 (and the diffusion lens 40) (further reflected by the reflection film 28, the sealing material 35, and the diffusion lens 40). After that, it goes to the diffusion film 43 side again).
In this way, the illumination light emitted from each LED 31 is sufficiently diffused (and reflected) by the sealing material 35, the diffusion lens 40, and the diffusion film 43, so that an extremely uniform light distribution state (luminance unevenness and color unevenness). Less). Therefore, it is possible to sufficiently diffuse the illumination light without providing a light diffusion member (for example, a diffusion plate (LSD)) at a position spaced apart (upward) from the resin portion 14 (and the heat sink 11).
Therefore, it is possible to reduce the number of LEDs 31 provided in the lighting fixture 10.
Moreover, since it is not necessary to provide the light-diffusion member spaced apart from the resin part 14 (and heat sink 11), it becomes possible to reduce the thickness (vertical dimension) of the whole lighting fixture 10. FIG.
Furthermore, since it is not necessary to provide a light diffusing member separated from the resin portion 14 (and the heat sink 11), the number of parts of the lighting fixture 10 can be reduced, and the manufacturing cost can be reduced.

さらに各ＬＥＤ３１で発生した熱は、反射膜２８を介してヒートシンク１１に伝わってヒートシンク１１の下半部（樹脂部１４によって被覆されずに露出している部分）から放熱されると共に、ヒートシンク１１からシャシー３７に伝わった後にシャシー３７から放熱されるので、ＬＥＤ３１の熱を外部に効率よく放熱できる。そのため高温化によるＬＥＤ３１の発光効率の低下を防ぐことが可能である。また、ＬＥＤ３１として発熱量の多い大型のＬＥＤ素子を利用できるので、光量を多くすることも可能である。   Further, the heat generated in each LED 31 is transmitted to the heat sink 11 through the reflective film 28 and is radiated from the lower half of the heat sink 11 (the portion exposed without being covered by the resin portion 14), and from the heat sink 11. Since heat is radiated from the chassis 37 after being transmitted to the chassis 37, the heat of the LED 31 can be efficiently radiated to the outside. Therefore, it is possible to prevent a decrease in light emission efficiency of the LED 31 due to a high temperature. Moreover, since a large-sized LED element with a large calorific value can be used as the LED 31, the amount of light can be increased.

以上、本発明を上記各実施形態に基づいて説明したが、本発明は上記実施形態に限定されるものではなく、様々な変形を施しながら実施可能である。
例えば、拡散レンズ４０の表面を祖面（細かい凹凸がある面）とした上で、拡散レンズ４０の表面に拡散膜４３を形成してもよい。このようにすれば、拡散レンズ４０の表面に対する拡散膜４３の形成状態（密着状態）がより安定する。さらに拡散レンズ４０の表面の細かい凹凸及びこれに対応する拡散膜４３内面の細かい凹凸が照明光を拡散及び反射する機能を発揮するので、照明光の配光状態をより均一にすることが可能になる。
また拡散レンズ４０の裏面（下面）を祖面（細かい凹凸がある面）としてもよい。この場合も、照明光の配光状態をより均一にすることが可能になる。 As mentioned above, although this invention was demonstrated based on said each embodiment, this invention is not limited to the said embodiment, It can implement, giving various deformation | transformation.
For example, the diffusion film 43 may be formed on the surface of the diffusion lens 40 after the surface of the diffusion lens 40 is an anterior surface (a surface with fine irregularities). In this way, the formation state (contact state) of the diffusion film 43 with respect to the surface of the diffusion lens 40 becomes more stable. Furthermore, since the fine irregularities on the surface of the diffusion lens 40 and the fine irregularities on the inner surface of the diffusion film 43 corresponding thereto exhibit the function of diffusing and reflecting the illumination light, it is possible to make the light distribution state of the illumination light more uniform. Become.
Further, the back surface (lower surface) of the diffusing lens 40 may be an ancestor surface (a surface having fine irregularities). Also in this case, the light distribution state of the illumination light can be made more uniform.

また封止材３５の表面（上面）に拡散膜４３を形成してもよい。このように構成した封止材３５は、表面に拡散膜４３が形成された拡散レンズ４０（透光性カバー部材３９）と同じ技術的効果を発揮可能である。
なお、このように封止材３５の表面（上面）に拡散膜４３を形成する場合は、透光性カバー部材３９の表面に拡散膜４３を形成してもよいし、形成しなくてもよい。さらに封止材３５の表面（上面）に拡散膜４３を形成する場合は、透光性カバー部材３９を省略してもよい。
また拡散レンズ４０（透光性カバー部材３９）の表面に拡散膜４３を形成する場合は、封止材３５を省略してもよい。 Further, the diffusion film 43 may be formed on the surface (upper surface) of the sealing material 35. The sealing material 35 configured in this way can exhibit the same technical effect as the diffusion lens 40 (translucent cover member 39) having the diffusion film 43 formed on the surface thereof.
When the diffusion film 43 is formed on the surface (upper surface) of the sealing material 35 in this way, the diffusion film 43 may or may not be formed on the surface of the translucent cover member 39. . Further, when the diffusion film 43 is formed on the surface (upper surface) of the sealing material 35, the translucent cover member 39 may be omitted.
Further, when the diffusion film 43 is formed on the surface of the diffusion lens 40 (translucent cover member 39), the sealing material 35 may be omitted.

また隣接するワイヤー接続部２０Ａとワイヤー接続部２１Ａの間のワイヤーボンディング３３による接続態様を上記の態様から変更することにより、第一導電部材２０、第二導電部材２１、ＬＥＤ３１、及びワイヤーボンディング３３によって構成される電気回路を上記並列回路とは別態様にしてもよい。さらに、両端にコネクタ４９を有するコネクタ付ケーブル４５によって複数の照明器具１０同士を接続してもよい。
さらにヒートシンク１１とシャシー３７の間に伝熱性のシートや伝熱性の接着剤を介在させてもよい。 Moreover, by changing the connection mode by the wire bonding 33 between the adjacent wire connection part 20A and the wire connection part 21A from the above aspect, the first conductive member 20, the second conductive member 21, the LED 31, and the wire bonding 33 The configured electric circuit may be different from the parallel circuit. Furthermore, you may connect several lighting fixtures 10 with the cable 45 with a connector which has the connector 49 at both ends.
Further, a heat conductive sheet or a heat conductive adhesive may be interposed between the heat sink 11 and the chassis 37.

１０ 照明器具
１１ ヒートシンク
１２ 上端凸部（凹部）
１４ 樹脂部（ベース部材）
１５ 円形凹部（凹部）
１６ 円形貫通孔
１７ 接続用凹部
１８ 係合孔
１９ 導通板
２０ 第一導電部材
２０Ａ ワイヤー接続部
２０Ｂ ケーブル接続部
２１ 第二導電部材
２１Ａ ワイヤー接続部
２１Ｂ ケーブル接続部
２２Ａ ２２Ｂ キャリア部
２３ キャリア接続部
２４ 第一切断ブリッジ
２５ 第二切断ブリッジ
２６ 第三切断ブリッジ
２８ 反射膜
２９ ＬＥＤ固定部
３１ ＬＥＤ（半導体発光素子）
３３ ワイヤーボンディング
３５ 封止材（透光部材）
３７ シャシー
３９ 透光性カバー部材（透光部材）
４０ 拡散レンズ
４１ 突部
４２ 接続用突部
４３ 拡散膜
４５ コネクタ付ケーブル
４６ ケーブル
４７ 電線
４８ 被覆チューブ
４９ コネクタ
５０ インシュレータ 10 Lighting fixture 11 Heat sink 12 Convex part (concave part)
14 Resin part (base member)
15 Circular recess (recess)
16 circular through-hole 17 concavity for connection 18 engagement hole 19 conductive plate 20 first conductive member 20A wire connection part 20B cable connection part 21 second conductive member 21A wire connection part 21B cable connection part 22A 22B carrier part 23 carrier connection part 24 1st cutting bridge 25 2nd cutting bridge 26 3rd cutting bridge 28 Reflective film 29 LED fixing | fixed part 31 LED (semiconductor light emitting element)
33 Wire bonding 35 Sealing material (translucent member)
37 Chassis 39 Translucent cover member (translucent member)
40 Diffuse Lens 41 Projection 42 Connection Projection 43 Diffusion Film 45 Cable with Connector 46 Cable 47 Electric Wire 48 Covered Tube 49 Connector 50 Insulator

Claims (2)

ベース部材と、
上記ベース部材の表面に設けられた、共に電源と電気的に導通可能で互いに離間する第一導電部材及び第二導電部材と、
上記ベース部材の表面に設けられた、上記第一導電部材及び上記第二導電部材と電気的に導通可能な半導体発光素子と、
上記ベース部材の表面に設けられた、上記第一導電部材、上記第二導電部材及び上記半導体発光素子を覆いかつ上記半導体発光素子が発した照明光が透過する封止剤と、
上記ベース部材に設けられた、上記封止剤が透過した照明光を拡散させながら透過させる透光性カバー部材と、
を備え、
上記封止剤の表面は、曲面であって上記半導体発光素子が発した照明光を拡散する拡散レンズを構成することを特徴とする、半導体発光素子を備える照明器具。 A base member;
A first conductive member and a second conductive member provided on the surface of the base member, both electrically conductive with a power source and spaced apart from each other;
A semiconductor light-emitting element provided on the surface of the base member and electrically conductive with the first conductive member and the second conductive member;
A sealing agent that is provided on the surface of the base member, covers the first conductive member, the second conductive member, and the semiconductor light emitting element, and transmits the illumination light emitted from the semiconductor light emitting element;
A translucent cover member that is provided on the base member and allows the illumination light transmitted through the sealant to pass through while diffusing;
With
A lighting fixture provided with a semiconductor light emitting element, wherein the surface of the sealant is a curved surface and constitutes a diffusion lens that diffuses illumination light emitted from the semiconductor light emitting element. 請求項１記載の照明器具において、
上記ベース部材の表面に設けられた凹部の底面に、上記半導体発光素子及び上記封止材、が設けられている照明器具。 The lighting fixture according to claim 1,
The lighting fixture in which the said semiconductor light-emitting device and the said sealing material are provided in the bottom face of the recessed part provided in the surface of the said base member.
JP2013055997A 2013-03-19 2013-03-19 Luminaire provided with semiconductor light emitting device Expired - Fee Related JP5904671B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013055997A JP5904671B2 (en) 2013-03-19 2013-03-19 Luminaire provided with semiconductor light emitting device
KR1020130092366A KR20140114724A (en) 2013-03-19 2013-08-05 Illuminating with semiconductor light device
TW102138204A TWI580901B (en) 2013-03-19 2013-10-23 A lighting device having a semiconductor light emitting element
CN201310729407.3A CN104064661A (en) 2013-03-19 2013-12-26 Illuminating Device With Semiconductor Light Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013055997A JP5904671B2 (en) 2013-03-19 2013-03-19 Luminaire provided with semiconductor light emitting device

Publications (2)

Publication Number Publication Date
JP2014182908A JP2014182908A (en) 2014-09-29
JP5904671B2 true JP5904671B2 (en) 2016-04-20

Family

ID=51552285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013055997A Expired - Fee Related JP5904671B2 (en) 2013-03-19 2013-03-19 Luminaire provided with semiconductor light emitting device

Country Status (4)

Country Link
JP (1) JP5904671B2 (en)
KR (1) KR20140114724A (en)
CN (1) CN104064661A (en)
TW (1) TWI580901B (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19918370B4 (en) * 1999-04-22 2006-06-08 Osram Opto Semiconductors Gmbh LED white light source with lens
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
KR100947454B1 (en) * 2006-12-19 2010-03-11 서울반도체 주식회사 Heat conducting slug having multi-step structure and the light emitting diode package using the same
JP2009218434A (en) * 2008-03-11 2009-09-24 Sharp Corp Optical space transmission device
CN102113119A (en) * 2008-05-29 2011-06-29 克利公司 Light source with near field mixing
US7932529B2 (en) * 2008-08-28 2011-04-26 Visera Technologies Company Limited Light-emitting diode device and method for fabricating the same
US20120020083A1 (en) * 2009-04-02 2012-01-26 Koninklijke Philips Electronics N.V. Reflector with mixing chamber
US10546846B2 (en) * 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
EP2492978B1 (en) * 2010-12-28 2015-07-01 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device, light-emitting module, and lamp

Also Published As

Publication number Publication date
CN104064661A (en) 2014-09-24
TWI580901B (en) 2017-05-01
KR20140114724A (en) 2014-09-29
JP2014182908A (en) 2014-09-29
TW201437557A (en) 2014-10-01

Similar Documents

Publication Publication Date Title
JP5327601B2 (en) Light emitting module and lighting device
US20170067618A1 (en) Lighting apparatus
JP2006310138A (en) Light emitting unit, lighting system and display device
JPWO2005091386A1 (en) Lighting device
JP2011146709A (en) Light-emitting device and illumination system
KR101734539B1 (en) Light emitting device, method for fabricating the light emitting device, lighting unit comprising the light emitting device, and lighting device
US20200350300A1 (en) Lighting device
US20120074456A1 (en) Light emitting device package
JP5904671B2 (en) Luminaire provided with semiconductor light emitting device
US8791482B2 (en) Light emitting device package
JP5956396B2 (en) lighting equipment
TWI580888B (en) A support for a semiconductor light emitting element, a semiconductor light emitting element module, and an illuminator And a method for manufacturing a support for a semiconductor light-emitting element
KR101978942B1 (en) Light Emitting Device Package
US20150085225A1 (en) Led backlight unit and led display device including the same
JP5882525B2 (en) Semiconductor light emitting device holder and semiconductor light emitting device module
KR101873551B1 (en) Illumination system
JP2016195123A (en) Optical element and luminaire
KR20120073931A (en) Light-emitting element array
JP6110528B2 (en) Semiconductor light emitting device holder and semiconductor light emitting device module
JP2011077084A (en) Led lighting system and liquid crystal display device
JP5894310B2 (en) Manufacturing method of holder for semiconductor light emitting device
KR101735310B1 (en) Light Emitting Device Package
KR20120073932A (en) Light emitting element array
KR101843734B1 (en) Light emitting device array
KR101843736B1 (en) Light emitting device array

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20141209

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20150130

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150417

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150421

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150618

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150721

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150918

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160301

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20160302

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160314

R150 Certificate of patent or registration of utility model

Ref document number: 5904671

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20160331

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees