TWI568813B - An energy ray-hardening type hydrophilic adhesive composition, an adhesive sheet, and a hydrophilic structure - Google Patents

An energy ray-hardening type hydrophilic adhesive composition, an adhesive sheet, and a hydrophilic structure Download PDF

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Publication number
TWI568813B
TWI568813B TW102106143A TW102106143A TWI568813B TW I568813 B TWI568813 B TW I568813B TW 102106143 A TW102106143 A TW 102106143A TW 102106143 A TW102106143 A TW 102106143A TW I568813 B TWI568813 B TW I568813B
Authority
TW
Taiwan
Prior art keywords
energy ray
adhesive composition
curable
adhesive
hydrophilic
Prior art date
Application number
TW102106143A
Other languages
English (en)
Chinese (zh)
Other versions
TW201402737A (zh
Inventor
Kazue Uemura
Kaisuke Yanagimoto
Yumi Hirate
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW201402737A publication Critical patent/TW201402737A/zh
Application granted granted Critical
Publication of TWI568813B publication Critical patent/TWI568813B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW102106143A 2012-02-27 2013-02-22 An energy ray-hardening type hydrophilic adhesive composition, an adhesive sheet, and a hydrophilic structure TWI568813B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012040735 2012-02-27

Publications (2)

Publication Number Publication Date
TW201402737A TW201402737A (zh) 2014-01-16
TWI568813B true TWI568813B (zh) 2017-02-01

Family

ID=49082298

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102106143A TWI568813B (zh) 2012-02-27 2013-02-22 An energy ray-hardening type hydrophilic adhesive composition, an adhesive sheet, and a hydrophilic structure

Country Status (3)

Country Link
JP (1) JP6086899B2 (ja)
TW (1) TWI568813B (ja)
WO (1) WO2013129096A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015145633A1 (ja) * 2014-03-26 2015-10-01 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
JP6537872B2 (ja) * 2015-04-07 2019-07-03 株式会社イノアック技術研究所 粘着付与剤、粘着組成物、粘着組成物の製造方法および、粘性流体
JP6545994B2 (ja) * 2015-04-07 2019-07-17 株式会社イノアック技術研究所 粘着組成物、粘着組成物の製造方法および、粘性流体
JP6764222B2 (ja) * 2015-07-28 2020-09-30 株式会社朝日Ｆｒ研究所 マイクロ化学チップ及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203003A (ja) * 2007-02-19 2008-09-04 Seiko Instruments Inc マイクロ流路およびマイクロリアクタ
TW201107438A (en) * 2009-07-06 2011-03-01 Lintec Corp Energy ray-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet for inspecting stampers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4324374B2 (ja) * 2002-03-29 2009-09-02 大日本印刷株式会社 微細凹凸パターン形成材料、微細凹凸パターン形成方法、転写箔、光学物品及びスタンパー
JP4218929B2 (ja) * 2002-04-09 2009-02-04 日東電工株式会社 放射線硬化型粘着シート
JP4100991B2 (ja) * 2002-07-31 2008-06-11 大日本印刷株式会社 光硬化性樹脂組成物を用いた光学物品、微細凹凸パターン形成方法、及び転写箔
JP2005158232A (ja) * 2003-10-30 2005-06-16 Bridgestone Corp 光硬化性転写シート、これを用いた光情報記録媒体の製造方法、及び光情報記録媒体
JP2007098347A (ja) * 2005-10-07 2007-04-19 Kawamura Inst Of Chem Res マイクロ流体デバイス用重合性組成物、及びマイクロ流体デバイス
JP4560523B2 (ja) * 2007-02-01 2010-10-13 リンテック株式会社 光記録媒体製造用シート、ならびに光記録媒体およびその製造方法
KR101457254B1 (ko) * 2007-09-28 2014-10-31 아사히 가라스 가부시키가이샤 광경화성 조성물, 미세 패턴 형성체의 제조 방법 및 광학 소자
JP4881403B2 (ja) * 2009-03-26 2012-02-22 株式会社東芝 パターン形成方法
WO2012124389A1 (ja) * 2011-03-17 2012-09-20 リンテック株式会社 エネルギー線硬化型粘着剤および粘着シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203003A (ja) * 2007-02-19 2008-09-04 Seiko Instruments Inc マイクロ流路およびマイクロリアクタ
TW201107438A (en) * 2009-07-06 2011-03-01 Lintec Corp Energy ray-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet for inspecting stampers

Also Published As

Publication number Publication date
JP6086899B2 (ja) 2017-03-01
TW201402737A (zh) 2014-01-16
WO2013129096A1 (ja) 2013-09-06
JPWO2013129096A1 (ja) 2015-07-30

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