TWI566061B - The management system of the mold clamping device - Google Patents
The management system of the mold clamping device Download PDFInfo
- Publication number
- TWI566061B TWI566061B TW103106029A TW103106029A TWI566061B TW I566061 B TWI566061 B TW I566061B TW 103106029 A TW103106029 A TW 103106029A TW 103106029 A TW103106029 A TW 103106029A TW I566061 B TWI566061 B TW I566061B
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- signal
- sensor
- clamping device
- management system
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/20—Opening, closing or clamping
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C2033/705—Mould inspection means, e.g. cameras
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013035669A JP5800289B2 (ja) | 2013-02-26 | 2013-02-26 | 型締装置の管理システム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201441780A TW201441780A (zh) | 2014-11-01 |
TWI566061B true TWI566061B (zh) | 2017-01-11 |
Family
ID=51363488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103106029A TWI566061B (zh) | 2013-02-26 | 2014-02-24 | The management system of the mold clamping device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5800289B2 (ja) |
KR (1) | KR20140106394A (ja) |
CN (1) | CN104002450B (ja) |
TW (1) | TWI566061B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6494113B2 (ja) * | 2016-07-26 | 2019-04-03 | 双葉電子工業株式会社 | 計測装置、計測方法、プログラム |
JP6514280B2 (ja) | 2017-07-20 | 2019-05-15 | ファナック株式会社 | 射出成形機 |
JP6591509B2 (ja) * | 2017-11-06 | 2019-10-16 | 株式会社東芝 | 金型温度異常予兆検知装置及びプログラム |
JP7001453B2 (ja) * | 2017-12-15 | 2022-01-19 | 東京エレクトロン株式会社 | ギャップ調整装置、ギャップ調整方法および樹脂成形装置 |
WO2021248414A1 (zh) * | 2020-06-11 | 2021-12-16 | 南通丽科发知识产权代理有限公司 | 一种合模机器人*** |
JP7127917B1 (ja) * | 2022-03-22 | 2022-08-30 | 株式会社マツシマメジャテック | メンテナンス要求発生システム |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101044005A (zh) * | 2004-10-19 | 2007-09-26 | 赫斯基注射器成型***有限公司 | 智能模制环境和控制施加合模力的方法 |
CN101174281A (zh) * | 2006-11-03 | 2008-05-07 | 鸿富锦精密工业(深圳)有限公司 | 自动合模检查***及方法 |
CN101430725A (zh) * | 2007-11-06 | 2009-05-13 | 鸿富锦精密工业(深圳)有限公司 | 冲压模具零件自动检查***及方法 |
CN101847568A (zh) * | 2009-03-26 | 2010-09-29 | 台湾积体电路制造股份有限公司 | 半导体制造方法与装置 |
CN102806642A (zh) * | 2011-05-30 | 2012-12-05 | 东芝机械株式会社 | 合模装置、合模装置的控制方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3562582B2 (ja) * | 2001-02-26 | 2004-09-08 | 住友重機械工業株式会社 | 射出成形機の制御方法及び制御装置 |
JP3962725B2 (ja) * | 2004-03-29 | 2007-08-22 | ファナック株式会社 | トグル式射出成形機の型締力調整装置 |
JP4395552B2 (ja) * | 2005-11-22 | 2010-01-13 | 国立大学法人 東京大学 | 射出成形装置の寸型開制御方法 |
CN102574308A (zh) * | 2009-09-29 | 2012-07-11 | 柯尼卡美能达精密光学株式会社 | 模具调芯装置、成形机及成形方法 |
-
2013
- 2013-02-26 JP JP2013035669A patent/JP5800289B2/ja active Active
- 2013-12-24 CN CN201310722095.3A patent/CN104002450B/zh active Active
-
2014
- 2014-01-27 KR KR1020140009750A patent/KR20140106394A/ko active Search and Examination
- 2014-02-24 TW TW103106029A patent/TWI566061B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101044005A (zh) * | 2004-10-19 | 2007-09-26 | 赫斯基注射器成型***有限公司 | 智能模制环境和控制施加合模力的方法 |
CN101174281A (zh) * | 2006-11-03 | 2008-05-07 | 鸿富锦精密工业(深圳)有限公司 | 自动合模检查***及方法 |
CN101430725A (zh) * | 2007-11-06 | 2009-05-13 | 鸿富锦精密工业(深圳)有限公司 | 冲压模具零件自动检查***及方法 |
CN101847568A (zh) * | 2009-03-26 | 2010-09-29 | 台湾积体电路制造股份有限公司 | 半导体制造方法与装置 |
CN102806642A (zh) * | 2011-05-30 | 2012-12-05 | 东芝机械株式会社 | 合模装置、合模装置的控制方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104002450A (zh) | 2014-08-27 |
TW201441780A (zh) | 2014-11-01 |
JP2014162132A (ja) | 2014-09-08 |
JP5800289B2 (ja) | 2015-10-28 |
CN104002450B (zh) | 2018-01-26 |
KR20140106394A (ko) | 2014-09-03 |
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