TWI560459B - Electronic component carrying device, electronic component carrying method and electronic componentexamination device - Google Patents

Electronic component carrying device, electronic component carrying method and electronic componentexamination device

Info

Publication number
TWI560459B
TWI560459B TW103133770A TW103133770A TWI560459B TW I560459 B TWI560459 B TW I560459B TW 103133770 A TW103133770 A TW 103133770A TW 103133770 A TW103133770 A TW 103133770A TW I560459 B TWI560459 B TW I560459B
Authority
TW
Taiwan
Prior art keywords
electronic component
component carrying
electronic
componentexamination
carrying method
Prior art date
Application number
TW103133770A
Other languages
English (en)
Other versions
TW201518750A (zh
Inventor
Masakuni Shiozawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201518750A publication Critical patent/TW201518750A/zh
Application granted granted Critical
Publication of TWI560459B publication Critical patent/TWI560459B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW103133770A 2011-07-26 2012-07-23 Electronic component carrying device, electronic component carrying method and electronic componentexamination device TWI560459B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011162900A JP2013024829A (ja) 2011-07-26 2011-07-26 電子部品搬送装置及び電子部品搬送方法

Publications (2)

Publication Number Publication Date
TW201518750A TW201518750A (zh) 2015-05-16
TWI560459B true TWI560459B (en) 2016-12-01

Family

ID=47574266

Family Applications (3)

Application Number Title Priority Date Filing Date
TW105131104A TWI632385B (zh) 2011-07-26 2012-07-23 電子零件搬送裝置及電子零件檢查裝置
TW103133770A TWI560459B (en) 2011-07-26 2012-07-23 Electronic component carrying device, electronic component carrying method and electronic componentexamination device
TW101126509A TWI459010B (zh) 2011-07-26 2012-07-23 電子零件搬送裝置及電子零件搬送方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW105131104A TWI632385B (zh) 2011-07-26 2012-07-23 電子零件搬送裝置及電子零件檢查裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101126509A TWI459010B (zh) 2011-07-26 2012-07-23 電子零件搬送裝置及電子零件搬送方法

Country Status (5)

Country Link
US (1) US20130027542A1 (zh)
JP (1) JP2013024829A (zh)
KR (1) KR101365848B1 (zh)
CN (1) CN102901920A (zh)
TW (3) TWI632385B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
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US20140149868A1 (en) * 2012-11-28 2014-05-29 Yahoo! Inc. Method and system for providing audio assistance for non-visual navigation of data
JP2015232446A (ja) * 2014-06-09 2015-12-24 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN104133173B (zh) * 2014-08-14 2017-02-01 潍坊路加精工有限公司 一种全自动测试装置
JP2016070778A (ja) * 2014-09-30 2016-05-09 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP5800378B1 (ja) * 2015-05-27 2015-10-28 上野精機株式会社 電子部品搬送装置
CN104849610A (zh) * 2015-06-02 2015-08-19 深圳市极而峰工业设备有限公司 一种电路自动检测装置
TWI632383B (zh) * 2015-08-31 2018-08-11 日商精工愛普生股份有限公司 電子零件搬送裝置及電子零件檢查裝置
CN106829359A (zh) * 2015-09-30 2017-06-13 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
CN106959409A (zh) * 2015-10-30 2017-07-18 精工爱普生株式会社 电子部件搬运装置以及电子部件检查装置
JP2017173075A (ja) * 2016-03-23 2017-09-28 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
US10423304B2 (en) * 2016-12-02 2019-09-24 International Business Machines Corporation Dynamic web actions palette
JP6903268B2 (ja) * 2016-12-27 2021-07-14 株式会社Ｎｓテクノロジーズ 電子部品搬送装置および電子部品検査装置
JP6804337B2 (ja) * 2017-03-01 2020-12-23 東洋自動機株式会社 中継装置
JP2018189387A (ja) * 2017-04-28 2018-11-29 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2019027924A (ja) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 電子部品搬送装置、電子部品検査装置、位置決め装置、部品搬送装置および位置決め方法
TWI640409B (zh) * 2017-08-01 2018-11-11 蔡宜興 微型電阻檢測裝置及檢測方法
CN110346612A (zh) * 2019-08-15 2019-10-18 苏州华兴源创科技股份有限公司 一种自动对位压接***及方法
CN111169979B (zh) * 2019-12-10 2021-06-15 苏州市创怡盛实业有限公司 机械手搬运方法以及***
US11875493B2 (en) 2019-12-26 2024-01-16 Synax Co., Ltd. Vibrator unit, conveying system, and conveying method
JP6847472B1 (ja) * 2019-12-26 2021-03-24 株式会社 Ｓｙｎａｘ バイブレータユニット、搬送システム、搬送方法、及びコンピュータプログラム
TWI752781B (zh) * 2020-12-31 2022-01-11 致茂電子股份有限公司 雷射二極體檢測系統及其檢測方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1788205A (zh) * 2003-05-30 2006-06-14 株式会社爱德万测试 电子部件试验装置
TW200624798A (en) * 2004-11-30 2006-07-16 Shinko Engineering Co Ltd Visual appearance inspection device and carrier thereof
TW200931556A (en) * 2007-09-28 2009-07-16 Tokyo Electron Ltd Probe apparatus and probing method
TW201009352A (en) * 2008-07-18 2010-03-01 Nidec Read Corp Substrate-inspecting device having cleaning mechanism for tips of pins

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003075025A1 (fr) * 2002-03-07 2003-09-12 Advantest Corporation Dispositif d'essai de composants electroniques
DE10393783T5 (de) * 2002-11-28 2005-10-27 Advantest Corp. Positionserfassungsvorrichtung, Positionserfassungsverfahren und Tragvorrichtung für elektronische Komponenten
WO2007148375A1 (ja) * 2006-06-19 2007-12-27 Advantest Corporation 電子部品試験装置のキャリブレーション方法
WO2008050518A1 (fr) * 2006-10-20 2008-05-02 Panasonic Corporation Dispositif de sondeur
WO2008142754A1 (ja) * 2007-05-18 2008-11-27 Advantest Corporation 電子部品試験装置及び電子部品試験方法
JP2009021397A (ja) * 2007-07-12 2009-01-29 Seiko Epson Corp マルチカードの位置ズレ補正方法及び、回路素子の検査方法
JP5506153B2 (ja) * 2007-12-26 2014-05-28 株式会社ユニオンアロー・テクノロジー 基板検査装置
JP2010038762A (ja) * 2008-08-06 2010-02-18 Micronics Japan Co Ltd 検査装置
JP2010122202A (ja) * 2008-10-23 2010-06-03 Nidec-Read Corp 基板検査治具及びそれを備える基板検査装置
JP4725650B2 (ja) * 2009-01-07 2011-07-13 東京エレクトロン株式会社 プローブ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1788205A (zh) * 2003-05-30 2006-06-14 株式会社爱德万测试 电子部件试验装置
US7511522B2 (en) * 2003-05-30 2009-03-31 Advantest Corporation Electronic device test apparatus
TW200624798A (en) * 2004-11-30 2006-07-16 Shinko Engineering Co Ltd Visual appearance inspection device and carrier thereof
TW200931556A (en) * 2007-09-28 2009-07-16 Tokyo Electron Ltd Probe apparatus and probing method
TW201009352A (en) * 2008-07-18 2010-03-01 Nidec Read Corp Substrate-inspecting device having cleaning mechanism for tips of pins

Also Published As

Publication number Publication date
TW201314229A (zh) 2013-04-01
TWI632385B (zh) 2018-08-11
KR20130012928A (ko) 2013-02-05
JP2013024829A (ja) 2013-02-04
TW201518750A (zh) 2015-05-16
TWI459010B (zh) 2014-11-01
TW201723514A (zh) 2017-07-01
KR101365848B1 (ko) 2014-02-25
CN102901920A (zh) 2013-01-30
US20130027542A1 (en) 2013-01-31

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees