TWI560400B - Laminate film and method for manufacturing the same, and laminate structure - Google Patents

Laminate film and method for manufacturing the same, and laminate structure

Info

Publication number
TWI560400B
TWI560400B TW100139214A TW100139214A TWI560400B TW I560400 B TWI560400 B TW I560400B TW 100139214 A TW100139214 A TW 100139214A TW 100139214 A TW100139214 A TW 100139214A TW I560400 B TWI560400 B TW I560400B
Authority
TW
Taiwan
Prior art keywords
laminate
manufacturing
same
laminate film
film
Prior art date
Application number
TW100139214A
Other languages
English (en)
Other versions
TW201231873A (en
Inventor
Grigoriy Basin
Paul Scott Martin
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW201231873A publication Critical patent/TW201231873A/zh
Application granted granted Critical
Publication of TWI560400B publication Critical patent/TWI560400B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y10T428/2486—Intermediate layer is discontinuous or differential with outer strippable or release layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Optical Filters (AREA)
TW100139214A 2010-10-27 2011-10-27 Laminate film and method for manufacturing the same, and laminate structure TWI560400B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40718010P 2010-10-27 2010-10-27

Publications (2)

Publication Number Publication Date
TW201231873A TW201231873A (en) 2012-08-01
TWI560400B true TWI560400B (en) 2016-12-01

Family

ID=44993634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100139214A TWI560400B (en) 2010-10-27 2011-10-27 Laminate film and method for manufacturing the same, and laminate structure

Country Status (7)

Country Link
US (1) US9351348B2 (zh)
EP (1) EP2633554A1 (zh)
JP (3) JP2013541220A (zh)
KR (1) KR101909299B1 (zh)
CN (1) CN103180945B (zh)
TW (1) TWI560400B (zh)
WO (1) WO2012056378A1 (zh)

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JP2014075527A (ja) * 2012-10-05 2014-04-24 Nippon Telegr & Teleph Corp <Ntt> 半導体素子構造およびその作製法
US9299687B2 (en) * 2012-10-05 2016-03-29 Bridgelux, Inc. Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
DE102012109806A1 (de) * 2012-10-15 2014-04-17 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement
JP6713720B2 (ja) * 2013-08-30 2020-06-24 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びそれを含む車両用照明装置
US20160131328A1 (en) * 2014-11-07 2016-05-12 Lighthouse Technologies Limited Indoor smd led equipped for outdoor usage
CN106449951B (zh) * 2016-11-16 2019-01-04 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法
JP6815507B2 (ja) * 2017-06-29 2021-01-20 京セラ株式会社 回路基板およびこれを備える発光装置
US11022791B2 (en) 2018-05-18 2021-06-01 Facebook Technologies, Llc Assemblies of anisotropic optical elements and methods of making
US11923483B2 (en) 2018-05-18 2024-03-05 Ddp Specialty Electronic Materials Us, Llc Method for producing LED by one step film lamination
US11527684B2 (en) 2020-12-04 2022-12-13 Lumileds Llc Patterned downconverter and adhesive film for micro-LED, mini-LED downconverter mass transfer

Citations (5)

* Cited by examiner, † Cited by third party
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US20070096131A1 (en) * 2005-10-28 2007-05-03 Lumileds Lighting U.S. Llc Laminating encapsulant film containing phosphor over LEDS
US20090020779A1 (en) * 2007-06-27 2009-01-22 Namics Corporation Method of preparing a sealed light-emitting diode chip
US20090173960A1 (en) * 2004-06-09 2009-07-09 Koninklijke Philips Electronics N.V. Semiconductor light emitting device with pre-fabricated wavelength converting element
US20100051984A1 (en) * 2008-09-02 2010-03-04 Scott West Phosphor-Converted LED
TW201019395A (en) * 2008-11-13 2010-05-16 Samsung Electro Mech Method of fabricating thin film device

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GB1522145A (en) 1974-11-06 1978-08-23 Marconi Co Ltd Light emissive diode displays
JP4496774B2 (ja) * 2003-12-22 2010-07-07 日亜化学工業株式会社 半導体装置の製造方法
US20070267646A1 (en) 2004-06-03 2007-11-22 Philips Lumileds Lighting Company, Llc Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic
US7352011B2 (en) * 2004-11-15 2008-04-01 Philips Lumileds Lighting Company, Llc Wide emitting lens for LED useful for backlighting
JP4615981B2 (ja) 2004-12-08 2011-01-19 スタンレー電気株式会社 発光ダイオード及びその製造方法
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JP5327042B2 (ja) * 2009-03-26 2013-10-30 豊田合成株式会社 Ｌｅｄランプの製造方法
US8597963B2 (en) * 2009-05-19 2013-12-03 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
TW201216526A (en) 2010-08-20 2012-04-16 Koninkl Philips Electronics Nv Lamination process for LEDs
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090173960A1 (en) * 2004-06-09 2009-07-09 Koninklijke Philips Electronics N.V. Semiconductor light emitting device with pre-fabricated wavelength converting element
US20070096131A1 (en) * 2005-10-28 2007-05-03 Lumileds Lighting U.S. Llc Laminating encapsulant film containing phosphor over LEDS
US20090020779A1 (en) * 2007-06-27 2009-01-22 Namics Corporation Method of preparing a sealed light-emitting diode chip
US20100051984A1 (en) * 2008-09-02 2010-03-04 Scott West Phosphor-Converted LED
TW201019395A (en) * 2008-11-13 2010-05-16 Samsung Electro Mech Method of fabricating thin film device

Also Published As

Publication number Publication date
US20130221835A1 (en) 2013-08-29
JP6595044B2 (ja) 2019-10-23
TW201231873A (en) 2012-08-01
KR20130140039A (ko) 2013-12-23
US9351348B2 (en) 2016-05-24
JP6883632B2 (ja) 2021-06-09
JP2018160678A (ja) 2018-10-11
EP2633554A1 (en) 2013-09-04
WO2012056378A1 (en) 2012-05-03
CN103180945A (zh) 2013-06-26
CN103180945B (zh) 2016-12-07
JP2019220720A (ja) 2019-12-26
KR101909299B1 (ko) 2018-10-17
JP2013541220A (ja) 2013-11-07

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MM4A Annulment or lapse of patent due to non-payment of fees