TWI557545B - Cooling device - Google Patents
Cooling device Download PDFInfo
- Publication number
- TWI557545B TWI557545B TW104125568A TW104125568A TWI557545B TW I557545 B TWI557545 B TW I557545B TW 104125568 A TW104125568 A TW 104125568A TW 104125568 A TW104125568 A TW 104125568A TW I557545 B TWI557545 B TW I557545B
- Authority
- TW
- Taiwan
- Prior art keywords
- cooling device
- shaped body
- vortex tube
- disc
- flow guiding
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明係有關於一種降溫裝置。更具體地來說，本發明有關於一種具有多次冷熱分離效果之降溫裝置。 The invention relates to a cooling device. More specifically, the present invention relates to a temperature reducing device having multiple cooling and heat separation effects.
為冷媒為目前常見的降溫方法，一般來說，其原理是藉由冷媒蒸發會吸收大量熱能的特性來降低溫度，再使用壓縮機加壓冷媒蒸汽使其液化並排出熱量。雖然冷媒能有效地降低溫度，但壓縮機等元件持續運作時需耗費許多能量，且冷媒也容易造成環境汙染。相較起來，渦流管只需要以壓力來驅動氣體流動，並以空氣為工作流體，不會對環境造成任何破壞。 For the refrigerant, the current common cooling method is generally based on the principle that the evaporation of the refrigerant absorbs a large amount of thermal energy to lower the temperature, and then the compressor is used to pressurize the refrigerant vapor to liquefy and discharge the heat. Although the refrigerant can effectively lower the temperature, it takes a lot of energy to continuously operate the components such as the compressor, and the refrigerant is also likely to cause environmental pollution. In comparison, the vortex tube only needs to use pressure to drive the gas flow and use air as the working fluid without any damage to the environment.
然而，一般渦流管需要藉由高壓設備來驅動氣體，使其產生渦流運動，進而達到冷流熱流分離的效果。高壓設備如空氣壓縮機，所佔用的體積相當龐大，若在有限的空間內幾乎無法置入。因此，如何設計出一種具小尺寸並提供良好降溫效果的降溫裝置，始成一重要之課題。 However, in general, a vortex tube needs to be driven by a high-pressure device to generate a vortex motion, thereby achieving the effect of cold flow heat flow separation. High-voltage equipment, such as air compressors, take up a considerable amount of space and can hardly be placed in a limited space. Therefore, how to design a cooling device with a small size and providing a good cooling effect has become an important issue.
為了解決上述習知之問題點，本發明提供一種降溫裝置，包括一圓盤狀本體、一渦流管、一第一導流元件、以及一第二導流元件。圓盤狀本體具有一圓形表面、與前述圓形表面相鄰之一側面、以及形成於前述圓形表面之一出風口。第 一導流元件設置於出風口，以將圓盤狀本體內之氣體排出。渦流管連接前述側面，並具有一進氣口、一氣體通道和一排氣口，其中進氣口與排氣口位於氣體通道之相反側。第二導流元件設置於進氣口，以將一外部環境之氣體導入氣體通道內。 In order to solve the above problems, the present invention provides a cooling device comprising a disk-shaped body, a vortex tube, a first flow guiding element, and a second flow guiding element. The disc-shaped body has a circular surface, a side surface adjacent to the circular surface, and an air outlet formed on the circular surface. First A flow guiding element is disposed at the air outlet to discharge the gas in the disk-shaped body. The vortex tube connects the aforementioned side surface and has an air inlet, a gas passage and an exhaust port, wherein the intake port and the exhaust port are located on opposite sides of the gas passage. The second flow guiding element is disposed at the air inlet to introduce a gas of an external environment into the gas passage.
本發明一實施例中，前述降溫裝置更包括一隔熱元件，設置於圓盤狀本體和渦流管之間。 In an embodiment of the invention, the cooling device further includes a heat insulating element disposed between the disk-shaped body and the vortex tube.
本發明一實施例中，前述進氣口鄰近該隔熱元件。 In an embodiment of the invention, the air inlet is adjacent to the heat insulating element.
本發明一實施例中，前述隔熱元件具有一錐形結構。 In an embodiment of the invention, the heat insulating member has a tapered structure.
本發明一實施例中，前述錐形結構具有一第一端和一第二端，其中第一端連接渦流管，第二端連接圓盤狀本體，且第二端之截面面積大於第一端之截面面積。 In an embodiment of the invention, the tapered structure has a first end and a second end, wherein the first end is connected to the vortex tube, the second end is connected to the disc-shaped body, and the cross-sectional area of the second end is larger than the first end The cross-sectional area.
本發明一實施例中，前述進氣口沿渦流管之管壁的切線方向形成。 In an embodiment of the invention, the air inlet is formed along a tangential direction of a wall of the vortex tube.
本發明一實施例中，前述氣體通道之截面面積與排氣口之截面面積大致相同。 In an embodiment of the invention, the cross-sectional area of the gas passage is substantially the same as the cross-sectional area of the exhaust port.
本發明一實施例中，前述渦流管之延伸方向對齊該圓盤狀本體之內壁的切線方向。 In an embodiment of the invention, the extending direction of the vortex tube is aligned with the tangential direction of the inner wall of the disc-shaped body.
本發明一實施例中，前述降溫裝置更包括複數個第二導流元件且渦流管具有複數個進氣口，該些第二導流元件分別設置於該些進氣口，且該些進氣口彼此之間具有相同間距。 In an embodiment of the invention, the cooling device further includes a plurality of second flow guiding elements, and the vortex tube has a plurality of air inlets, and the second flow guiding elements are respectively disposed at the air inlets, and the air inlets are respectively The ports have the same spacing from each other.
本發明一實施例中，前述降溫裝置更包括複數個渦流管，連接圓盤狀本體之側面，且該些渦流管彼此之間具有 相同間距。 In an embodiment of the invention, the cooling device further includes a plurality of vortex tubes connected to the sides of the disc-shaped body, and the vortex tubes have a mutual The same spacing.
本發明一實施例中，前述圓盤狀本體包括一熱導材料。 In an embodiment of the invention, the disk-shaped body comprises a thermal conductive material.
第一導流元件和該第二導流元件分別包括一風扇。 The first flow guiding element and the second flow guiding element respectively comprise a fan.
100‧‧‧圓盤狀本體 100‧‧‧Disc body
110‧‧‧圓形表面 110‧‧‧round surface
111‧‧‧出風口 111‧‧‧air outlet
120‧‧‧側面 120‧‧‧ side
200‧‧‧渦流管 200‧‧‧ vortex tube
210‧‧‧進氣口 210‧‧‧air inlet
220‧‧‧排氣口 220‧‧‧Exhaust port
230‧‧‧氣體通道 230‧‧‧ gas passage
300‧‧‧第一導流元件 300‧‧‧First flow guiding element
400‧‧‧第二導流元件 400‧‧‧Second flow guiding element
500‧‧‧隔熱元件 500‧‧‧Insulation components
510‧‧‧第一端 510‧‧‧ first end
520‧‧‧第二端 520‧‧‧ second end
A‧‧‧箭頭 A‧‧‧ arrow
C‧‧‧中心軸 C‧‧‧ center axis
E‧‧‧電子裝置 E‧‧‧Electronic device
第1圖係表示本發明一實施例之降溫裝置示意圖。 Fig. 1 is a schematic view showing a temperature lowering device according to an embodiment of the present invention.
第2圖係表示本發明一實施例之降溫裝置的局部放大示意圖。 Fig. 2 is a partially enlarged schematic view showing a temperature lowering device according to an embodiment of the present invention.
第3圖係表示係表示第2圖中沿x-x方向之剖視圖。 Fig. 3 is a cross-sectional view taken along the line x-x in Fig. 2;
第4圖係表示外部環境中之氣體進入渦流管之示意圖。 Figure 4 is a schematic diagram showing the entry of gas into the vortex tube in the external environment.
第5圖係表示渦流管中之氣體進入圓盤狀本體之示意圖。 Fig. 5 is a view showing the gas entering the disk-shaped body in the vortex tube.
第6圖係表示第一導流元件將圓盤狀本體內之氣體抽出並導向電子裝置之示意圖。 Fig. 6 is a view showing the first flow guiding member for extracting the gas in the disk-shaped body and guiding it to the electronic device.
以下說明本發明實施例之降溫裝置。然而，可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明，並非用以侷限本發明的範圍。 The cooling device of the embodiment of the present invention will be described below. However, it will be readily understood that the embodiments of the present invention are susceptible to many specific embodiments of the invention and can The specific embodiments disclosed are merely illustrative of the invention, and are not intended to limit the scope of the invention.
除非另外定義，在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語，例如在通常使用的字典中定義的用語，應被解讀成具有一與相關技術及本揭露的背景或上下 文一致的意思，而不應以一理想化或過度正式的方式解讀，除非在此特別定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning It can be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a context and related background and context. The meaning of the text is consistent and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.
本發明一實施例之降溫裝置如第1圖所示，主要包括一圓盤狀本體100、複數個渦流管200、一第一導流元件300、以及複數個第二導流元件400，其中圓盤狀本體100具有彼此相鄰的一圓形表面110和一側面120，圓形表面110上形成有一出風口111，前述第一導流元件300設置於此出風口111，而前述渦流管200則分別連接圓盤狀本體100之側面120。 The cooling device according to an embodiment of the present invention, as shown in FIG. 1 , mainly includes a disk-shaped body 100 , a plurality of vortex tubes 200 , a first flow guiding element 300 , and a plurality of second flow guiding elements 400 . The disk-shaped body 100 has a circular surface 110 and a side surface 120 adjacent to each other. The circular surface 110 is formed with an air outlet 111. The first flow guiding element 300 is disposed at the air outlet 111, and the vortex tube 200 is The side faces 120 of the disc-shaped body 100 are respectively connected.
請繼續參閱第1圖，每一個渦流管200皆包括複數個進氣口210和一排氣口220，前述第二導流元件400分別設置於這些進氣口210處。於本實施例中，前述第一、第二導流元件300、400可包括選定轉速的風扇，例如為可分別提供圓盤狀本體100內外和渦流管200內外壓力差1psi的風扇。 Referring to FIG. 1 , each vortex tube 200 includes a plurality of air inlets 210 and an exhaust port 220 , and the second flow guiding elements 400 are respectively disposed at the air inlets 210 . In the present embodiment, the first and second flow guiding members 300, 400 may include a fan of a selected rotational speed, for example, a fan that can provide a pressure difference of 1 psi inside and outside the disk-shaped body 100 and inside and outside the vortex tube 200, respectively.
第2圖係表示降溫裝置的局部放大示意圖，而第3圖係表示第2圖中沿x-x方向之剖視圖。如第2、3圖所示，於本實施例中，圓盤狀本體100和渦流管200之間設置有一隔熱元件500，其包括一錐形結構，並具有一第一端510和一第二端520，其中第一端510與渦流管200之氣體通道230相連，而第二端520與圓盤狀本體100相連，且第二端520之截面面積大於第一端510之截面面積。渦流管200的進氣口210和排氣口220設置於氣體通道230之相反側，且進氣口210鄰近前述隔熱元件500。 Fig. 2 is a partially enlarged schematic view showing the temperature lowering device, and Fig. 3 is a cross-sectional view taken along line x-x in Fig. 2; As shown in the second and third embodiments, in the present embodiment, a heat insulating member 500 is disposed between the disk-shaped body 100 and the vortex tube 200, and includes a tapered structure and has a first end 510 and a first The two ends 520, wherein the first end 510 is connected to the gas passage 230 of the vortex tube 200, and the second end 520 is connected to the disc-shaped body 100, and the cross-sectional area of the second end 520 is larger than the cross-sectional area of the first end 510. The intake port 210 and the exhaust port 220 of the vortex tube 200 are disposed on opposite sides of the gas passage 230, and the intake port 210 is adjacent to the aforementioned heat insulating member 500.
此外，需特別說明的是，如第1、3圖所示，於本實施例中，渦流管200之延伸方向係對齊圓盤狀本體100之切線方向，且六個渦流管200彼此之間具有相同間距，亦即以圓盤 狀本體100之中心軸C為圓心，每60°設置一渦流管200。因此，由渦流管200流入圓盤狀本體100之氣流可更為順暢且均勻。同樣的，本實施例中之渦流管200上的進氣口210亦是沿渦流管200管壁之切線方向而形成，且三個進氣口210彼此之間具有相同間距，因此，外部環境之氣體可更為順暢且均勻地進入渦流管200。 In addition, as shown in FIGS. 1 and 3, in the present embodiment, the extending direction of the vortex tube 200 is aligned with the tangential direction of the disk-shaped body 100, and the six eddy current tubes 200 have a mutual relationship therebetween. Same spacing, that is, with a disc The central axis C of the body 100 is a center of the circle, and a vortex tube 200 is disposed every 60 degrees. Therefore, the airflow flowing into the disk-shaped body 100 from the vortex tube 200 can be smoother and more uniform. Similarly, the air inlet 210 on the vortex tube 200 in this embodiment is also formed along the tangential direction of the tube wall of the vortex tube 200, and the three air inlets 210 have the same spacing from each other, and therefore, the external environment The gas can enter the vortex tube 200 more smoothly and evenly.
應注意的是，雖然本實施例中每一渦流管200上之進氣口210數量和渦流管200之數量分別為三個和六個，然而兩者之數量可依使用需求而調整(第二導流元件400之數量亦可隨之調整)，例如當第一、第二導流元件300、400提供之壓差夠高或所需之降溫效果需求較低時，可減少兩者的數量；而當第一、第二導流元件300、400提供之壓差不足或所需之降溫效果需求較高時，可增加兩者的數量。惟降溫裝置最少需要至少一個進氣口210和至少一渦流管200，而當進氣口210和渦流管200數量大於一個時，彼此之間應具有相同間距而平均配置於渦流管200和圓盤狀本體100。 It should be noted that although the number of the intake ports 210 and the number of the vortex tubes 200 on each vortex tube 200 in this embodiment are three and six, respectively, the number of the two may be adjusted according to the use requirements (second. The number of the flow guiding elements 400 can also be adjusted accordingly. For example, when the pressure difference provided by the first and second flow guiding elements 300, 400 is sufficiently high or the required cooling effect is low, the number of the two can be reduced; When the pressure difference provided by the first and second flow guiding members 300, 400 is insufficient or the required cooling effect is high, the number of both can be increased. However, the temperature lowering device requires at least one air inlet 210 and at least one vortex tube 200, and when the number of the air inlet 210 and the vortex tube 200 is greater than one, they should have the same spacing between each other and be equally disposed on the vortex tube 200 and the disk. Shape body 100.
以下說明本發明之降溫裝置之使用方法，首先請參閱第4圖，當第一導流元件300和第二導流元件400開啟時，外部環境的氣體會被第二導流元件400導引，由進氣口210進入渦流管200的氣體通道230內，繞渦流管200之內壁旋轉並沿氣體通道230向左前進。氣體沿渦流管200內壁旋轉時，其內的熱流會往渦流管200內壁靠近，而冷流則會遠離前述內壁，換言之，靠近渦流管200的中心軸之氣體多為冷流，因此呈現一種冷熱分離的效果。 The following describes the method of using the cooling device of the present invention. First, referring to FIG. 4, when the first flow guiding element 300 and the second flow guiding element 400 are opened, the external environment gas is guided by the second guiding element 400. The gas inlet 230 enters the gas passage 230 of the vortex tube 200, rotates around the inner wall of the vortex tube 200, and advances leftward along the gas passage 230. When the gas rotates along the inner wall of the vortex tube 200, the heat flow therein will approach the inner wall of the vortex tube 200, and the cold flow will be far from the inner wall. In other words, the gas near the central axis of the vortex tube 200 is mostly cold flow. Presents a cold and hot separation effect.
此時，由於第一導流元件300持續將圓盤狀本體100內的氣體排出，故圓盤狀本體100內之壓力係低於渦流管200內之壓力。因此，前述渦流管200內之氣體中的冷流會被吸引進圓盤狀本體100內(如箭頭A所示)，而氣體中的熱流則會由排氣口220排出。應注意的是，由於本發明是利用第一導流元件300使圓盤狀本體100內產生負壓來吸引冷流，因此不需在排氣口220處設置使氣體反彈回折(infolding)的擋塊，氣體通道230之截面面積與排氣口220之截面面積可大致相同，藉以避免氣體中的熱流被反彈至圓盤狀本體100中。 At this time, since the first flow guiding member 300 continuously discharges the gas in the disk-shaped body 100, the pressure in the disk-shaped body 100 is lower than the pressure in the vortex tube 200. Therefore, the cold flow in the gas in the aforementioned vortex tube 200 is attracted into the disk-shaped body 100 (as indicated by the arrow A), and the heat flow in the gas is discharged from the exhaust port 220. It should be noted that since the present invention utilizes the first flow guiding member 300 to generate a negative pressure in the disk-shaped body 100 to attract the cold flow, it is not necessary to provide a block for inflating the gas at the exhaust port 220. The cross-sectional area of the gas passage 230 and the cross-sectional area of the exhaust port 220 may be substantially the same to prevent the heat flow in the gas from being rebounded into the disc-shaped body 100.
此外，由於進氣口210鄰近渦流管200和圓盤狀本體100之間的隔熱元件500，因此可避免由進氣口210進入的氣體與被吸入圓盤狀本體100的冷流混合而導致冷流溫度升高。 Further, since the intake port 210 is adjacent to the heat insulating member 500 between the vortex tube 200 and the disc-shaped body 100, it is possible to prevent the gas entering from the intake port 210 from being mixed with the cold flow sucked into the disc-shaped body 100. The cold flow temperature rises.
如第5、6圖所示，從渦流管200進入圓盤狀本體100之氣體(即前述冷流)會繞圓盤狀本體100之內壁旋轉，同樣的，氣體將產生冷熱分離的效果，其中較熱之氣體靠近圓盤狀本體100之內壁，而較冷之氣體則遠離圓盤狀本體100之內壁而靠近圓盤狀本體100之中央。第一導流元件300可對準一需降溫之電子裝置E，將位於圓盤狀本體100中央經過兩次冷熱分離後的氣體抽出並導向前述電子裝置E，使電子裝置E得以降溫。 As shown in Figs. 5 and 6, the gas entering the disk-shaped body 100 from the vortex tube 200 (i.e., the aforementioned cold flow) is rotated around the inner wall of the disk-shaped body 100. Similarly, the gas will have the effect of separating the heat and the heat. The hotter gas is adjacent to the inner wall of the disc-shaped body 100, and the cooler gas is away from the inner wall of the disc-shaped body 100 and near the center of the disc-shaped body 100. The first flow guiding element 300 can be aligned with an electronic device E that needs to be cooled, and the gas that has been cooled and separated by two times in the center of the disk-shaped body 100 is taken out and guided to the electronic device E, so that the electronic device E can be cooled.
在前述冷熱分離的過程中，圓盤狀本體100和渦流管200的內壁將持續接觸較熱之氣體，並與前述較熱之氣體產生摩擦，因此溫度會較高，故於本實施例中，圓盤狀本體100和渦流管200之材料皆包括熱導材料(例如金屬)，以利將熱散至外部環境。 During the aforementioned thermal separation, the inner walls of the disc-shaped body 100 and the vortex tube 200 will continue to contact the hotter gas and generate friction with the hotter gas, so the temperature will be higher, so in this embodiment The materials of the disc-shaped body 100 and the vortex tube 200 all include a heat conductive material (for example, metal) to facilitate heat dissipation to the external environment.
綜上所述，本發明提供一種降溫裝置，藉由渦流管和圓盤狀本體內的氣體流動，可達到至少兩次冷熱分離之效果，因此可減少渦流管的長度，使降溫裝置之尺寸得以縮減。再者，降溫裝置內部之氣體係由第一、第二導流元件所帶動，故毋須設置加壓元件或在渦流管中設置使氣體回彈之擋塊，進而減少降溫裝置的尺寸並避免冷流之溫度上升。其次，圓盤狀本體和渦流管間的隔熱元件亦可避免前述冷流與外部環境之氣體混合而造成溫度上升。因此，本發明所述的降溫裝置可具有小尺寸並提供電子裝置良好的降溫效果。 In summary, the present invention provides a cooling device capable of achieving at least two effects of cold and heat separation by the flow of gas in the vortex tube and the disk-shaped body, thereby reducing the length of the vortex tube and allowing the size of the cooling device to be reduce. Furthermore, the gas system inside the cooling device is driven by the first and second flow guiding elements, so that it is not necessary to provide a pressing element or a stop for the gas to rebound in the vortex tube, thereby reducing the size of the cooling device and avoiding cold. The temperature of the stream rises. Secondly, the heat insulating element between the disc-shaped body and the vortex tube can also prevent the cold flow from mixing with the gas of the external environment to cause a temperature rise. Therefore, the temperature reducing device of the present invention can have a small size and provide a good cooling effect of the electronic device.
雖然本發明的實施例及其優點已揭露如上，但應該瞭解的是，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作更動、替代與潤飾。此外，本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟，任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟，只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此，本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外，每一申請專利範圍構成個別的實施例，且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments of the present invention and its advantages are disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. In addition, the scope of the present invention is not limited to the processes, machines, manufacture, compositions, devices, methods, and steps in the specific embodiments described in the specification. Any one of ordinary skill in the art can. The processes, machines, fabrications, compositions, devices, methods, and procedures that are presently or in the future are understood to be used in accordance with the present invention as long as they can perform substantially the same function or achieve substantially the same results in the embodiments described herein. Accordingly, the scope of the invention includes the above-described processes, machines, manufactures, compositions, devices, methods, and steps. In addition, the scope of each of the claims constitutes an individual embodiment, and the scope of the invention also includes the combination of the scope of the application and the embodiments.
雖然本發明以前述數個較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可做些許之更動與潤 飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。此外，每個申請專利範圍建構成一獨立的實施例，且各種申請專利範圍及實施例之組合皆介於本發明之範圍內。 While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the invention. Those skilled in the art to which the present invention pertains can make some changes and changes without departing from the spirit and scope of the present invention. Decoration. Therefore, the scope of the invention is defined by the scope of the appended claims. In addition, each patent application scope is constructed as a separate embodiment, and various combinations of patents and combinations of embodiments are within the scope of the invention.
100‧‧‧圓盤狀本體 100‧‧‧Disc body
110‧‧‧圓形表面 110‧‧‧round surface
111‧‧‧出風口 111‧‧‧air outlet
120‧‧‧側面 120‧‧‧ side
200‧‧‧渦流管 200‧‧‧ vortex tube
210‧‧‧進氣口 210‧‧‧air inlet
220‧‧‧排氣口 220‧‧‧Exhaust port
300‧‧‧第一導流元件 300‧‧‧First flow guiding element
400‧‧‧第二導流元件 400‧‧‧Second flow guiding element
C‧‧‧中心軸 C‧‧‧ center axis
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104125568A TWI557545B (en) | 2015-08-06 | 2015-08-06 | Cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104125568A TWI557545B (en) | 2015-08-06 | 2015-08-06 | Cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI557545B true TWI557545B (en) | 2016-11-11 |
| TW201706764A TW201706764A (en) | 2017-02-16 |
Family
ID=57851542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104125568A TWI557545B (en) | 2015-08-06 | 2015-08-06 | Cooling device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI557545B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114439650A (en) * | 2022-01-17 | 2022-05-06 | 西安航天动力试验技术研究所 | Single-unit attitude and orbit control engine body cooling device and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW370603B (en) * | 1996-11-20 | 1999-09-21 | Mitsubishi Electric Corp | Air ventilation device and air ventilation system |
| CN101178227A (en) * | 2006-11-06 | 2008-05-14 | 木村工机株式会社 | Air conditioner |
| CN103477154A (en) * | 2011-03-21 | 2013-12-25 | Hivap私人有限公司 | High velocity mist evaporation |
-
2015
- 2015-08-06 TW TW104125568A patent/TWI557545B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW370603B (en) * | 1996-11-20 | 1999-09-21 | Mitsubishi Electric Corp | Air ventilation device and air ventilation system |
| CN101178227A (en) * | 2006-11-06 | 2008-05-14 | 木村工机株式会社 | Air conditioner |
| CN103477154A (en) * | 2011-03-21 | 2013-12-25 | Hivap私人有限公司 | High velocity mist evaporation |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201706764A (en) | 2017-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101352273B1 (en) | Heat exchanger and indoor unit including the same | |
| RU2721956C2 (en) | Improved heat exchange efficiency of finned heat exchanger with ellipsoidal working surface | |
| KR101385148B1 (en) | Local cooling aparratus | |
| WO2018009259A3 (en) | Gas turbine engine having a surface cooler with ogv oriented fin angles | |
| TWI576551B (en) | Vortex tube device | |
| TWI557545B (en) | Cooling device | |
| CN209724711U (en) | A kind of industrial fan equipment that radiating efficiency can be improved | |
| EP3399188A1 (en) | Packaged compressor | |
| TWM529077U (en) | Primary fan blade capacity enhancement structure of axial flow fan | |
| EP3214380A1 (en) | Air conditioner | |
| TWM525399U (en) | Fan module and electronic device | |
| CN105041648A (en) | Screw compressor and machine body thereof | |
| KR20140118777A (en) | A cooling device for compressor | |
| CN206992098U (en) | Semiconductor-type heat sink | |
| KR20190136411A (en) | Heat pump radiating apparatus having increased air flow | |
| TW202016469A (en) | Thermoelectric dehumidifier | |
| JP2017048954A (en) | Indoor unit of air conditioner | |
| TWI613540B (en) | Hear dissipating module | |
| JPWO2019073584A1 (en) | Compressor housing and turbocharger provided with the compressor housing | |
| TWM530421U (en) | Water-cooling heat dissipation mechanism | |
| TWI593884B (en) | Compressor with high heat-dissipation efficiency and thermal management method therefor | |
| CN103744497B (en) | A kind of cooling system | |
| CN107542674A (en) | Centrifugal compressor | |
| TWI598546B (en) | The dry-wind outlet water cooling divce | |
| KR20190136415A (en) | Space-saving radiating apparatus for heat pump |