CN206992098U - Semiconductor-type heat sink - Google Patents
Semiconductor-type heat sink Download PDFInfo
- Publication number
- CN206992098U CN206992098U CN201720922083.9U CN201720922083U CN206992098U CN 206992098 U CN206992098 U CN 206992098U CN 201720922083 U CN201720922083 U CN 201720922083U CN 206992098 U CN206992098 U CN 206992098U
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- China
- Prior art keywords
- shell
- semiconductor chip
- semiconductor
- fixedly connected
- heat sink
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Abstract
The utility model provides semiconductor-type heat sink, including shell, the bottom of shell inner cavity is installed with semiconductor chip carrier, semiconductor chip is installed with the top of semiconductor chip carrier, the water inlet of shell side is fixedly connected with water inlet pipe, one end of water inlet pipe extends to the inside of shell and is fixedly connected with rectangular duct, the inner side of rectangular duct and the outer surface of semiconductor chip are fixedly mounted, the side of rectangular duct is fixedly connected with outlet pipe, and one end of outlet pipe is fixedly connected with the water outlet of shell opposite side.The semiconductor-type heat sink, by setting water inlet pipe cooling water can be injected into enclosure, by setting rectangular duct so that the surrounding of semiconductor chip outer surface can carry out water cooling, reduce the temperature of semiconductor chip outer surface, so as to extend the service life of semiconductor chip, it is air-cooled by setting radiator fan to carry out, the temperature of enclosure is distributed from heat emission hole.
Description
Technical field
It the utility model is related to technical field of integrated circuits, specially semiconductor-type heat sink.
Background technology
With the development of integrated circuit technique, the structure of integrated circuit also becomes increasingly complex；Semiconductor refers to a kind of conduction
Property can be controlled, scope is the material between insulator and conductor, no matter from science and technology or economic development from the perspective of, partly lead
The importance of body is all very huge；Existing semiconductor chip（3）All it is to be adhered on chip carrier, and needs to pass through baking
Step fixes elargol, chip is fixed on chip carrier, will can only be fixed on because its cooling-down effect is bad, during chip failure
Scrapped between chip on chip carrier.
Utility model content
（One）The technical problem of solution
In view of the shortcomings of the prior art, the utility model provides semiconductor-type heat sink, solves above-mentioned background skill
The problem of being proposed in art.
（Two）Technical scheme
To realize object above, the utility model is achieved by the following technical programs：Semiconductor-type heat sink, bag
Shell is included, the bottom of the shell inner cavity is installed with semiconductor chip carrier, and peace is fixed at the top of the semiconductor chip carrier
Equipped with semiconductor chip, the water inlet of the shell side is fixedly connected with water inlet pipe, and one end of the water inlet pipe extends to
The inside of shell and rectangular duct is fixedly connected with, the inner side of the rectangular duct and the outer surface of semiconductor chip are fixed and pacified
Dress, the side of the rectangular duct are fixedly connected with outlet pipe, one end of the outlet pipe and the water outlet of shell opposite side
It is fixedly connected, is provided with cover plate at the top of the shell, the both sides at the top of the cover plate is provided with fixed plate, the fixed plate
Bottom be installed with connecting rod, the outer surface of the connecting rod is socketed with the first spring, solid on the inwall of the connecting rod
Dingan County is equipped with the first fixed block, and the side of first fixed block is fixedly connected with second spring, one end of the second spring
Contiguous block is fixedly connected with, the side of the contiguous block extends to the outer surface of connecting rod, the left and right sides of the outer casing inner wall
It is installed with the stopper corresponding with contiguous block.
Preferably, the both sides at the top of the shell and cover plate offer the groove corresponding with connecting rod, the connection
The bottom of bar extends to the inside of groove.
Preferably, the both sides of the shell are provided with T-shaped block, one end of the T-shaped block extend to the inside of shell and
It is fixedly connected with the second fixed block.
Preferably, the bottom of the stopper is provided with the 3rd spring, one end and the second fixed block of the 3rd spring
Side be fixedly connected.
Preferably, the side of the shell inner cavity is installed with radiator fan, and the top of the semiconductor chip is fixed
Fin is installed.
Preferably, the water outlet of the shell both sides is connected with the jam corresponding with water inlet pipe and outlet pipe, institute
The left and right sides for stating shell offers the heat emission hole equidistantly distributed.
（Three）Beneficial effect
The utility model provides semiconductor-type heat sink.Possesses following beneficial effect：
1st, semiconductor-type heat sink, by setting water inlet pipe cooling water can be injected into enclosure, by setting
Rectangular duct is put so that the surrounding of semiconductor chip outer surface can carry out water cooling, so as to reduce semiconductor chip appearance
The temperature in face, so as to extend the service life of semiconductor chip, by setting fin to absorb at the top of semiconductor chip
Temperature, it is air-cooled by setting radiator fan to carry out so that the temperature of enclosure can distribute from heat emission hole, so as to
The temperature of enclosure is reduced, the temperature that semiconductor chip gives out is not stored inside the housing, so that cooling
Effect reaches more preferable.
2nd, the semiconductor-type heat sink, by setting connecting rod and T-shaped block consequently facilitating the dismounting of shell and cover plate,
Semiconductor chip is changed so as to facilitate, so as to save the use of manpower, by setting jam so that water inlet pipe
With the better tightness of outlet pipe, while cooling water can also be changed, make its semiconductor chip in lower task pair
The effect that it is cooled is more preferable.
Brief description of the drawings
Fig. 1 is the utility model section view；
Fig. 2 is the utility model rectangular duct top view；
Fig. 3 is the sectional view of the utility model shell；
Fig. 4 is enlarged drawing at A in the utility model Fig. 3.
In figure：1 shell, 2 semiconductor chip carriers, 3 semiconductor chips, 4 water inlet pipes, 5 rectangular ducts, 6 outlet pipes, 7 cover plates,
8 fixed plates, 9 connecting rods, 10 first springs, 11 grooves, 12 first fixed blocks, 13 second springs, 14 contiguous blocks, 15 stoppers,
16 T-shaped blocks, 17 second fixed blocks, 18 the 3rd springs, 19 radiator fans, 20 fin, 21 heat emission holes, 22 jams.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
As Figure 1-4, the utility model embodiment provides semiconductor-type heat sink, including shell 1, the both sides of shell 1
Water outlet be connected with the jam 22 corresponding with water inlet pipe 4 and outlet pipe 6, by setting jam 22 so that water inlet pipe
4 and the better tightness of outlet pipe 6, while cooling water can also be changed, make its semiconductor chip 3 in lower task
The effect to be cooled to it is more preferable, and the bottom of the inner chamber of shell 1 is installed with semiconductor chip carrier 2, semiconductor chip carrier 2
Top is installed with semiconductor chip 3, and the top of semiconductor chip 3 is installed with fin 20, by setting fin
20 can absorb the temperature at the top of semiconductor chip 3, so as to which temperature is distributed by heat emission hole 21, the side of shell 1
Water inlet be fixedly connected with water inlet pipe 4, by setting water inlet pipe 4 that cooling water can be injected into inside shell 1, water inlet pipe
4 one end extends to the inside of shell 1 and is fixedly connected with rectangular duct 5, by setting rectangular duct 5 so that semiconductor core
The surrounding of the outer surface of piece 3 can carry out water cooling, so as to reduce the temperature of the outer surface of semiconductor chip 3, so as to extend half
The service life of conductor chip 3, the inner side of rectangular duct 5 are fixedly mounted with the outer surface of semiconductor chip 3, rectangular duct 5
Side is fixedly connected with outlet pipe 6, and one end of outlet pipe 6 is fixedly connected with the water outlet of the opposite side of shell 1, the top of shell 1
Portion is provided with cover plate 7, by setting cover plate 7 to play a part of protecting semiconductor chip 3, prevents foreign object from knocking semiconductor core
Piece 3 causes to damage, and so as to extend the service life of semiconductor chip 3, the both sides at the top of cover plate 7 are provided with fixed plate 8, Gu
The bottom of fixed board 8 is installed with connecting rod 9, and the outer surface of connecting rod 9 is socketed with the first spring 10, shell 1 and the top of cover plate 7
Both sides offer the groove 11 corresponding with connecting rod 9, the bottom of connecting rod 9 extends to the inside of groove 11, by setting
Putting groove 11, can to slide connecting rod 9 more smooth, is installed with the first fixed block 12 on the inwall of connecting rod 9, and first
The side of fixed block 12 is fixedly connected with second spring 13, and one end of second spring 13 is fixedly connected with contiguous block 14, contiguous block
14 side extends to the outer surface of connecting rod 9, and the left and right sides of the inwall of shell 1 is installed with corresponding with contiguous block 14
Stopper 15, the both sides of shell 1 are provided with T-shaped block 16, by pressing T-shaped block 16 so as to extending the band of the 3rd spring 18
Dynamic second fixed block 17 moves, and then can extrude contiguous block 14 and be compressed second spring 13, when contiguous block 14 is pressed
When being reduced in groove 11, move up connecting rod 9 under the elastic reaction of the first spring 10, so as to move up cover plate
7, so as to which cover plate 7 and shell 1 be disassembled, semiconductor chip 3 is changed so as to facilitate, so as to save manpower
Use, one end of T-shaped block 16 extends to the inside of shell 1 and is fixedly connected with the second fixed block 17, and the bottom of stopper 15 is set
The 3rd spring 18 is equipped with, one end of the 3rd spring 18 is fixedly connected with the side of the second fixed block 17, and the side of the inner chamber of shell 1 is consolidated
Dingan County is equipped with radiator fan 19, by setting radiator fan 19 to blow out temperature from heat emission hole 21, so as to reduce in shell 1
The temperature in portion, so as to provide the environment of low temperature to semiconductor chip 3, and then the service life of semiconductor chip 3 is extended, outside
The left and right sides of shell 1 offers the heat emission hole 21 equidistantly distributed, by setting heat emission hole 21, so as to accelerate shell 1
Interior air flow, making the speed of radiating, faster the effect of cooling is more preferable.
Operation principle：The semiconductor can make rectangle when work distributes heat, by the cooling water injected from water inlet pipe 4
Pipeline 5 carries out water cooling to the surrounding of the outer surface of semiconductor chip 3, so as to reduce the temperature of semiconductor chip 3, passes through setting
Fin 20 so as to absorb the heat that the top of semiconductor chip 3 gives out, then by radiator fan 19 by temperature from dissipating
Hot hole 21 is blown out, so as to reduce the temperature inside shell 1, so as to provide the environment of low temperature to semiconductor chip 3, and then
The service life of semiconductor chip 3 is extended, drives second to fix so as to extend the 3rd spring 18 by pressing T-shaped block 16
Block 17 moves, and then can extrude contiguous block 14 and be compressed second spring 13, when contiguous block 14 is compressed to groove 11
When interior, move up connecting rod 9 under the elastic reaction of the first spring 10, so as to move up cover plate 7, so as to cover
Plate 7 disassembles with shell 1.
To sum up, the semiconductor-type heat sink, by setting water inlet pipe 4 that cooling water can be injected into inside shell 1, lead to
Cross and rectangular duct 5 is set so that the surrounding of the outer surface of semiconductor chip 3 can carry out water cooling, so as to reduce semiconductor core
The temperature of the outer surface of piece 3, so as to extend the service life of semiconductor chip 3, partly led by setting fin 20 to absorb
The temperature at the top of body chip 3, it is air-cooled by setting radiator fan 19 to carry out, so that the temperature inside shell 1 can be from radiating
Hole 21 is distributed, and so as to reduce the temperature inside shell 1, the temperature for giving out semiconductor chip 3 will not be stored in outside
Inside shell 1, so that the effect of cooling reaches more preferable.
Also, semiconductor-type heat sink, by setting connecting rod 9 and T-shaped block 16 consequently facilitating shell 1 and cover plate
7 dismounting, semiconductor chip 3 is changed so as to facilitate, so as to save the use of manpower, by set jam 22 from
And make the better tightness of water inlet pipe 4 and outlet pipe 6, while cooling water can also be changed, its semiconductor chip 3 is existed
The effect to be cooled during lower task to it is more preferable.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions, by sentence " including one ... the key element limited, it is not excluded that
Other identical element also be present in process, method, article or equipment including the key element.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. semiconductor-type heat sink, including shell（1）, it is characterised in that：The shell（1）The bottom of inner chamber is installed with
Semiconductor chip carrier（2）, the semiconductor chip carrier（2）Top be installed with semiconductor chip（3）, the shell（1）
The water inlet of side is fixedly connected with water inlet pipe（4）, the water inlet pipe（4）One end extend to shell（1）Inside and solid
Surely it is connected with rectangular duct（5）, the rectangular duct（5）Inner side and semiconductor chip（3）Outer surface be fixedly mounted, it is described
Rectangular duct（5）Side be fixedly connected with outlet pipe（6）, the outlet pipe（6）One end and shell（1）The water outlet of opposite side
It is fixedly connected at mouthful, the shell（1）Top be provided with cover plate（7）, the cover plate（7）The both sides at top are provided with fixation
Plate（8）, the fixed plate（8）Bottom be installed with connecting rod（9）, the connecting rod（9）Outer surface be socketed with first
Spring（10）, the connecting rod（9）Inwall on be installed with the first fixed block（12）, first fixed block（12）One
Side is fixedly connected with second spring（13）, the second spring（13）One end be fixedly connected with contiguous block（14）, the connection
Block（14）Side extend to connecting rod（9）Outer surface, the shell（1）The left and right sides of inwall is installed with connecting
Connect block（14）Corresponding stopper（15）.
2. semiconductor-type heat sink according to claim 1, it is characterised in that：The shell（1）And cover plate（7）Top
Both sides offer and connecting rod（9）Corresponding groove（11）, the connecting rod（9）Bottom extend to groove（11）'s
It is internal.
3. semiconductor-type heat sink according to claim 1, it is characterised in that：The shell（1）Both sides be respectively provided with
There is T-shaped block（16）, the T-shaped block（16）One end extend to shell（1）Inside and be fixedly connected with the second fixed block（17）.
4. semiconductor-type heat sink according to claim 3, it is characterised in that：The stopper（15）Bottom set
There is the 3rd spring（18）, the 3rd spring（18）One end and the second fixed block（17）Side be fixedly connected.
5. semiconductor-type heat sink according to claim 1, it is characterised in that：The shell（1）The side of inner chamber is consolidated
Dingan County is equipped with radiator fan（19）, the semiconductor chip（3）Top be installed with fin（20）.
6. semiconductor-type heat sink according to claim 1, it is characterised in that：The shell（1）The delivery port of both sides
Place is connected with and water inlet pipe（4）And outlet pipe（6）Corresponding jam（22）, the shell（1）The left and right sides open up
There is the heat emission hole equidistantly distributed（21）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720922083.9U CN206992098U (en) | 2017-07-27 | 2017-07-27 | Semiconductor-type heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720922083.9U CN206992098U (en) | 2017-07-27 | 2017-07-27 | Semiconductor-type heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206992098U true CN206992098U (en) | 2018-02-09 |
Family
ID=61417142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720922083.9U Expired - Fee Related CN206992098U (en) | 2017-07-27 | 2017-07-27 | Semiconductor-type heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206992098U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108568007A (en) * | 2018-05-16 | 2018-09-25 | 佛山特种医用导管有限责任公司 | Semiconductor cooling liquid device and medical Transfusion device |
| CN117729741A (en) * | 2023-11-13 | 2024-03-19 | 江苏佰睿安新能源科技有限公司 | Heat radiation structure for printed circuit board |
-
2017
- 2017-07-27 CN CN201720922083.9U patent/CN206992098U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108568007A (en) * | 2018-05-16 | 2018-09-25 | 佛山特种医用导管有限责任公司 | Semiconductor cooling liquid device and medical Transfusion device |
| CN108568007B (en) * | 2018-05-16 | 2023-12-05 | 佛山特种医用导管有限责任公司 | Semiconductor liquid cooler and medical infusion apparatus |
| CN117729741A (en) * | 2023-11-13 | 2024-03-19 | 江苏佰睿安新能源科技有限公司 | Heat radiation structure for printed circuit board |
| CN117729741B (en) * | 2023-11-13 | 2024-05-28 | 江苏佰睿安新能源科技有限公司 | Heat radiation structure for printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180209 Termination date: 20180727 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |