TWI557359B - Electronic device and circuit module thereof - Google Patents

Electronic device and circuit module thereof Download PDF

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Publication number
TWI557359B
TWI557359B TW104136194A TW104136194A TWI557359B TW I557359 B TWI557359 B TW I557359B TW 104136194 A TW104136194 A TW 104136194A TW 104136194 A TW104136194 A TW 104136194A TW I557359 B TWI557359 B TW I557359B
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Taiwan
Prior art keywords
light
circuit module
substrate
transmitting portion
lacquer layer
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TW104136194A
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Chinese (zh)
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TW201608170A (en
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鄭翰鴻
郭繼汾
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宇帷國際股份有限公司
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Priority to TW104136194A priority Critical patent/TWI557359B/en
Publication of TW201608170A publication Critical patent/TW201608170A/en
Priority to GB1613365.4A priority patent/GB2544142A/en
Priority to DE102016116535.2A priority patent/DE102016116535A1/en
Priority to NL1042102A priority patent/NL1042102B1/en
Application granted granted Critical
Publication of TWI557359B publication Critical patent/TWI557359B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F23/00—Advertising on or in specific articles, e.g. ashtrays, letter-boxes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/18—Edge-illuminated signs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

電子裝置及其電路模組 Electronic device and circuit module thereof

本發明有關於一種電子裝置及其電路模組。 The invention relates to an electronic device and a circuit module thereof.

如TWM448772所揭露之電子裝置及其電路模組包含一本體、至少一發光二極體以及一至少半透明之導光體。該發光二極體設於該本體且與該本體電性連接電子單元，該導光體係設於該本體並覆蓋該發光二極體，且該發光二極體之光源能穿透出該導光體。 The electronic device and the circuit module thereof as disclosed in TWM448772 comprise a body, at least one light emitting diode and an at least translucent light guide. The light-emitting diode is disposed on the body and electrically connected to the electronic unit, the light guiding system is disposed on the body and covers the light-emitting diode, and the light source of the light-emitting diode can penetrate the light guide body.

然而，此類電路模組於實際使用時，需要另外設置覆設於發光二極體之導光體，如此一來，整體裝置容易過厚、且製造成本較高。 However, in the actual use of such a circuit module, it is necessary to additionally provide a light guide body that is disposed on the light emitting diode, so that the overall device is easily too thick and the manufacturing cost is high.

因此，有必要提供一種新穎且具有進步性之電路模組，以解決上述之問題。 Therefore, it is necessary to provide a novel and progressive circuit module to solve the above problems.

本發明之主要目的在於提供一種電子裝置及其電路模組，可不用另外設置導光部，僅需將發光部埋設於基板、以及於漆層另設有出射透光部，即可達到同樣之發亮效果，如此一來，可減少整體厚度並節省製造成本。 The main object of the present invention is to provide an electronic device and a circuit module thereof, which can be disposed without the need of separately providing a light guiding portion, and only need to embed the light emitting portion on the substrate, and further provide a light transmitting portion in the paint layer to achieve the same. The lightening effect, in this way, reduces overall thickness and saves manufacturing costs.

為達成上述目的，本發明提供一種電路模組。該電路模組包括一本體、一發光部及一PCI-E插排。該本體包括一基板及一第一漆層，該 基板具有一透光部及一第一面，該第一漆層覆設於該第一面，該第一漆層設有一對應於該透光部之出射透光部；該發光部埋設於該基板，該發光部之光源可投射至該透光部並經由該出射透光部射至該電路模組之外部；該PCI-E插排設於該基板。 To achieve the above object, the present invention provides a circuit module. The circuit module includes a body, a light emitting portion and a PCI-E strip. The body includes a substrate and a first lacquer layer, The substrate has a light transmitting portion and a first surface, the first lacquer layer is disposed on the first surface, and the first lacquer layer is provided with an outgoing light transmitting portion corresponding to the light transmitting portion; the light emitting portion is embedded in the The substrate, the light source of the light emitting portion can be projected to the light transmitting portion and emitted to the outside of the circuit module via the outgoing light transmitting portion; the PCI-E is arranged on the substrate.

為達成上述目的，本發明另提供一種電子裝置，包括上述之電路模組，另包括一殼部。該殼部蓋設於該電路模組之相對二側面，該殼部還設有一對應於該出射透光部之殼體透光部，由該出射透光部射出之光源可經由該殼體透光部而射至該電子裝置之外部。 In order to achieve the above object, the present invention further provides an electronic device comprising the above circuit module, further comprising a shell portion. The shell portion is disposed on opposite sides of the circuit module, and the shell portion is further provided with a light-transmissive portion corresponding to the light-transmitting portion, and the light source emitted from the light-transmitting portion can be transparent through the shell The light portion is incident on the outside of the electronic device.

1‧‧‧電路模組 1‧‧‧ circuit module

20‧‧‧本體 20‧‧‧ body

21‧‧‧第一漆層 21‧‧‧First paint layer

210‧‧‧出射透光部 210‧‧‧Output light transmission

22‧‧‧第二漆層 22‧‧‧second paint layer

23‧‧‧基板 23‧‧‧Substrate

230‧‧‧透光部 230‧‧‧Transmission Department

231‧‧‧第一面 231‧‧‧ first side

232‧‧‧第二面 232‧‧‧ second side

233‧‧‧電子單元 233‧‧‧Electronic unit

30‧‧‧發光部 30‧‧‧Lighting Department

31‧‧‧發光二極體 31‧‧‧Lighting diode

40‧‧‧PCI-E插排 40‧‧‧PCI-E strip

50‧‧‧殼部 50‧‧‧Shell Department

51‧‧‧殼體透光部 51‧‧‧The light transmission part of the shell

100‧‧‧電子裝置 100‧‧‧Electronic devices

圖1為本發明一較佳實施例之立體圖。 1 is a perspective view of a preferred embodiment of the present invention.

圖2為本發明一較佳實施例之分解圖。 2 is an exploded view of a preferred embodiment of the present invention.

圖3為本發明一較佳實施例之局部放大圖。 Figure 3 is a partial enlarged view of a preferred embodiment of the present invention.

圖4為本發明圖1之剖面圖。 Figure 4 is a cross-sectional view of Figure 1 of the present invention.

以下僅以實施例說明本發明可能之實施態樣，然並非用以限制本發明所欲保護之範疇，合先敘明。 The following is a description of the possible embodiments of the present invention, and is not intended to limit the scope of the invention as claimed.

請參考圖1至4，其顯示本發明之一較佳實施例之電子裝置100及其電路模組1，該電路模組1包括一本體20、一發光部30及一PCI-E插排40。 Please refer to FIG. 1 to FIG. 4 , which illustrate an electronic device 100 and a circuit module 1 thereof according to a preferred embodiment of the present invention. The circuit module 1 includes a body 20 , a light emitting portion 30 , and a PCI-E strip 40 . .

該本體20包括一基板23及一第一漆層21。進一步說，該基板23具有一透光部230及一第一面231，該基板23係一體成型有該透光 部230，該第一漆層21覆設於該第一面231，該第一漆層21設有一對應於該透光部230之出射透光部210。於本實施例，該第一漆層21至少遮蔽部分該發光部30，進一步說，該第一漆層21係全面遮蔽該發光部30，該發光部30之光源可先經過該透光部230導光(折射或反射)而傳遞至該出射透光部210，可使透出之光源較柔美而不顯得刺眼；於其它實施例，發光部亦可不被第一漆層遮蔽，而係面對出射透光部設置；抑或是，部分發光部被第一漆層遮蔽、部分不被遮蔽。 The body 20 includes a substrate 23 and a first lacquer layer 21. Further, the substrate 23 has a transparent portion 230 and a first surface 231. The substrate 23 is integrally formed with the light. The first lacquer layer 21 is disposed on the first surface 231 , and the first lacquer layer 21 is provided with an outgoing light transmitting portion 210 corresponding to the transparent portion 230 . In the embodiment, the first lacquer layer 21 at least partially shields the illuminating portion 30. Further, the first lacquer layer 21 completely shields the illuminating portion 30. The light source of the illuminating portion 30 can pass through the transparent portion 230 first. The light guide (refracting or reflecting) is transmitted to the outgoing light transmitting portion 210, so that the light source that is transmitted can be soft and not glare; in other embodiments, the light emitting portion can also be not covered by the first paint layer, but is facing The light-emitting portion is disposed; or, the portion of the light-emitting portion is shielded by the first paint layer and partially blocked.

該發光部30埋設於該基板23，該發光部30之光源可投射至該透光部230並經由該出射透光部210射至該電路模組1之外部，要說明的是，該基板23係為一般印刷電路板之半透明基板；於其它實施例，亦可僅有透光部為透光材質層，基板其他部分為不透光材質層，使發光部(可部分埋設於不透光材質層)之發光面直接面向透光部發射光源；抑或是，透光部為鏤空結構，並將發光部之發光面顯露於鏤空結構，同樣可達到發光效果。 The light-emitting portion 30 is embedded in the substrate 23, and the light source of the light-emitting portion 30 can be projected onto the light-transmitting portion 230 and emitted to the outside of the circuit module 1 via the light-emitting and transmitting portion 210. The substrate 23 is illustrated. It is a translucent substrate of a general printed circuit board; in other embodiments, only the light transmitting portion is a light transmissive material layer, and other portions of the substrate are opaque material layers, so that the light emitting portion (which may be partially buried in the opaque layer) The light-emitting surface of the material layer directly faces the light-transmitting portion to emit the light source; or the light-transmitting portion is a hollow structure, and the light-emitting surface of the light-emitting portion is exposed to the hollow structure, and the light-emitting effect can also be achieved.

該基板23設有一電子單元233，該電子單元233與該PCI-E插排40電性連接，該電子單元233可為繪圖處理模組、顯示處理模組或其它處理模組，使該電路模組1能當作繪圖卡、顯示卡或其它裝置使用。該PCI-E插排40設於該基板23，且該PCI-E插排40電性連接該電子單元233，更詳細地說，該發光部30亦電性連接該PCI-E插排40(當然亦可將發光部另外電性連接至例如主機板等其它外部電源)。可理解的是，該PCI-E插排40不僅可以傳輸電力、亦可傳輸資料。 The electronic unit 233 is electrically connected to the PCI-E plug 40. The electronic unit 233 can be a graphics processing module, a display processing module, or other processing module. Group 1 can be used as a graphics card, display card or other device. The PCI-E strip 40 is disposed on the substrate 23, and the PCI-E strip 40 is electrically connected to the electronic unit 233. In more detail, the light-emitting portion 30 is also electrically connected to the PCI-E strip 40 ( Of course, the light-emitting portion can be additionally electrically connected to other external power sources such as a motherboard. It can be understood that the PCI-E strip 40 can not only transmit power but also transmit data.

於本實施例，該基板23還具有一相對該第一面231之第二 面232，該本體20包括一覆設於該第二面232之第二漆層22，該第二漆層22至少遮蔽部分該發光部30(當然第二漆層亦可不遮蔽發光部而使光直接透出)。 In this embodiment, the substrate 23 further has a second surface opposite to the first surface 231. The surface 232 includes a second lacquer layer 22 disposed on the second surface 232. The second lacquer layer 22 at least partially shields the illuminating portion 30 (of course, the second lacquer layer may also shield the illuminating portion from light. Directly revealed).

於本實施例，該第一漆層21及該第二漆層22即為一般電路板上之絕緣漆層，該出射透光部210係為不上漆之鏤空結構；於其它實施例，出射透光部亦可為透光材料層，同樣可使光透過。進一步說，該出射透光部210係為透光圖文部(例如商標等圖文)，從外部觀視時可較醒目與美觀。 In this embodiment, the first lacquer layer 21 and the second lacquer layer 22 are insulating varnish layers on a general circuit board, and the outgoing light transmitting portion 210 is an unpainted hollow structure; in other embodiments, the exiting The light transmitting portion may also be a light transmissive material layer, and the light may be transmitted through. Further, the outgoing light transmitting portion 210 is a light-transmissive image portion (for example, a graphic such as a trademark), and can be more conspicuous and beautiful when viewed from the outside.

進一步說，該發光部30包括複數概沿該出射透光部210之輪廓而埋設於該基板23之發光二極體31，可使從該出射透光部210透出之光線較明亮與均勻。 Further, the light-emitting portion 30 includes a plurality of light-emitting diodes 31 embedded in the substrate 23 along the outline of the light-emitting portion 210, and the light emitted from the light-emitting portion 210 can be brighter and more uniform.

該電子裝置100除包括如上所述的電路模組1、還另包括一殼部50。 The electronic device 100 further includes a casing portion 50 in addition to the circuit module 1 as described above.

該殼部50蓋設於該電路模組1之相對二側面，該殼部50還設有一對應於該出射透光部210之殼體透光部51，由該出射透光部210射出之光源可經由該殼體透光部51而射至該電子裝置100之外部，可理解的是，該殼體透光部51可為鏤空結構或透光材料層，使光源可順利透出。 The shell portion 50 is disposed on opposite sides of the circuit module 1. The shell portion 50 is further provided with a housing light transmitting portion 51 corresponding to the outgoing light transmitting portion 210, and the light source emitted from the outgoing light transmitting portion 210. The light transmitting portion 51 can be incident on the outside of the electronic device 100. It can be understood that the light transmitting portion 51 of the housing can be a hollow structure or a light transmissive material layer, so that the light source can be smoothly penetrated.

於本實施例，該殼部50係為散熱殼部(例如金屬材質)，可避免該電路模組1過熱。 In the embodiment, the shell portion 50 is a heat dissipation shell portion (for example, a metal material) to prevent the circuit module 1 from being overheated.

綜上，本發明之電子裝置及其電路模組可不用另外設置導光部，僅需將發光部埋設於基板、以及於漆層另設有出射透光部，即可達到同樣之發亮效果，如此一來，可減少整體厚度並節省製造成本。 In summary, the electronic device and the circuit module of the present invention can be used without the need of separately providing a light guiding portion, and only need to embed the light emitting portion on the substrate, and additionally provide a light transmitting portion in the paint layer to achieve the same brightening effect. In this way, the overall thickness can be reduced and manufacturing costs can be saved.

綜上所述，本發明之整體結構設計、實用性及效益上，確實是完全符合產業上發展所需，且所揭露之結構發明亦是具有前所未有的創新構造，所以其具有「新穎性」應無疑慮，又本發明可較之習知結構更具功效之增進，因此亦具有「進步性」，其完全符合我國專利法有關發明專利之申請要件的規定，乃依法提起專利申請，並敬請 鈞局早日審查，並給予肯定。 In summary, the overall structural design, practicability and efficiency of the present invention are indeed fully in line with the needs of industrial development, and the disclosed structural invention is also an unprecedented innovative structure, so it has "novelty" should Undoubtedly, the invention can be more effective than the conventional structure, and therefore has "progressiveness", which fully complies with the requirements of the application requirements of the invention patents of the Chinese Patent Law, and is filed according to law, and please The bureau will review it early and give it affirmation.

21‧‧‧第一漆層 21‧‧‧First paint layer

210‧‧‧出射透光部 210‧‧‧Output light transmission

22‧‧‧第二漆層 22‧‧‧second paint layer

23‧‧‧基板 23‧‧‧Substrate

230‧‧‧透光部 230‧‧‧Transmission Department

231‧‧‧第一面 231‧‧‧ first side

232‧‧‧第二面 232‧‧‧ second side

31‧‧‧發光二極體 31‧‧‧Lighting diode

50‧‧‧殼部 50‧‧‧Shell Department

51‧‧‧殼體透光部 51‧‧‧The light transmission part of the shell

Claims (10)

一種電路模組，包括：一本體，包括一基板及一第一漆層，該基板為一印刷電路板，該基板具有一透光部及一第一面，該基板係一體成型有該透光部，該第一漆層覆設於該第一面，該第一漆層設有一對應於該透光部之出射透光部；一發光部，埋設於該基板，該發光部之光源可投射至該透光部並經由該出射透光部射至該電路模組之外部；一PCI-E插排，設於該基板。 A circuit module comprising: a body, comprising a substrate and a first lacquer layer, the substrate is a printed circuit board, the substrate has a light transmitting portion and a first surface, the substrate is integrally formed with the light transmission The first lacquer layer is disposed on the first surface, the first lacquer layer is provided with an outgoing light transmitting portion corresponding to the light transmitting portion, and a light emitting portion is embedded in the substrate, and the light source of the light emitting portion can be projected The light transmissive portion is emitted to the outside of the circuit module via the outgoing light transmitting portion; a PCI-E strip is disposed on the substrate. 如請求項1所述的電路模組，其中該第一漆層至少遮蔽部分該發光部。 The circuit module of claim 1, wherein the first lacquer layer at least partially shields the illuminating portion. 如請求項1所述的電路模組，其中該基板還具有一相對該第一面之第二面，該本體還包括一覆設於該第二面之第二漆層，該第二漆層至少遮蔽部分該發光部。 The circuit module of claim 1, wherein the substrate further has a second surface opposite to the first surface, the body further comprising a second lacquer layer covering the second surface, the second lacquer layer At least a portion of the light emitting portion is shielded. 如請求項1所述的電路模組，其中該發光部包括複數概沿該出射透光部之輪廓而埋設於該基板之發光二極體。 The circuit module of claim 1, wherein the light emitting portion comprises a plurality of light emitting diodes embedded in the substrate along a contour of the outgoing light transmitting portion. 如請求項4所述的電路模組，其中該出射透光部係為透光圖文部。 The circuit module of claim 4, wherein the outgoing light transmitting portion is a light transmitting image portion. 如請求項1所述的電路模組，其中該出射透光部係為鏤空結構或透光材料層。 The circuit module of claim 1, wherein the outgoing light transmitting portion is a hollow structure or a light transmissive material layer. 如請求項1所述的電路模組，其中該基板設有一電子單元，該電子單元與該PCI-E插排電性連接，該電子單元係為繪圖處理模組及顯示處理模組其中一者。 The circuit module of claim 1, wherein the substrate is provided with an electronic unit electrically connected to the PCI-E plug, the electronic unit being one of a graphics processing module and a display processing module. . 一種電子裝置，包括如請求項1至7任一項所述的電路模組，另包括：一殼部，蓋設於該電路模組之相對二側面，且該殼部還設有一對應於該 出射透光部之殼體透光部，由該出射透光部射出之光源可經由該殼體透光部而射至該電子裝置之外部。 An electronic device, comprising the circuit module according to any one of claims 1 to 7, further comprising: a shell portion disposed on opposite sides of the circuit module, and the shell portion further having a corresponding The light-transmitting portion of the housing that emits the light-transmitting portion, and the light source emitted from the light-transmitting and transmitting portion can be emitted to the outside of the electronic device via the light-transmitting portion of the housing. 如請求項8所述的電子裝置，其中該殼體透光部係為鏤空結構或透光材料層。 The electronic device of claim 8, wherein the light transmissive portion of the housing is a hollow structure or a light transmissive material layer. 如請求項8所述的電子裝置，其中該殼部係為散熱殼部。 The electronic device of claim 8, wherein the shell portion is a heat dissipation shell portion.
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