TWI554866B - Electronic device - Google Patents
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- TWI554866B TWI554866B TW104132831A TW104132831A TWI554866B TW I554866 B TWI554866 B TW I554866B TW 104132831 A TW104132831 A TW 104132831A TW 104132831 A TW104132831 A TW 104132831A TW I554866 B TWI554866 B TW I554866B
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Description
本發明有關於一種電子裝置。 The invention relates to an electronic device.
如TWM508053所揭露之電子裝置包括一基板、至少一發光二極體及一至少半透明之導光體。該基版具有一PCI-E插排，該PCI-E插排供與一PCI-E插槽電性插接；該至少一發光二極體設於該基板相對於該插排之一側，且與該插排電性連接；該至少半透明之導光體至少覆蓋該至少一發光二極體。 An electronic device as disclosed in TWM508053 includes a substrate, at least one light emitting diode, and an at least translucent light guide. The base plate has a PCI-E strip, and the PCI-E strip is electrically connected to a PCI-E socket; the at least one LED is disposed on a side of the substrate relative to the strip. And electrically connected to the plug; the at least translucent light guide covers at least the light emitting diode.
然而，此類電子裝置於實際使用時，因為發光部(LED)與基板是一體連接的，若是發光部損壞，通常須將整塊基板一同更換，才得以得到發亮的電子裝置，十分浪費金錢與資源。 However, when such an electronic device is actually used, since the light-emitting portion (LED) is integrally connected with the substrate, if the light-emitting portion is damaged, it is usually necessary to replace the entire substrate together to obtain a bright electronic device, which is a waste of money. With resources.
並且，當發光部散熱效率太差時，也容易使基板過熱而損壞，進而需更換整組電子裝置。 Moreover, when the heat dissipation efficiency of the light-emitting portion is too poor, the substrate is easily overheated and damaged, and the entire electronic device needs to be replaced.
除此之外，導光部並無法有效地使發出之光線均勻分布，難以達到均勻發亮之功效，並會使該電子裝置較不美觀。 In addition, the light guiding portion cannot effectively distribute the emitted light evenly, and it is difficult to achieve uniform lightening effect, and the electronic device is less beautiful.
因此，有必要提供一種新穎且具有進步性之電子裝置，以解決上述之問題。 Therefore, it is necessary to provide a novel and progressive electronic device to solve the above problems.
本發明之主要目的在於提供一種電子裝置，使基板與發光部可分別設置，當發光部損壞時，僅需更換設置有發光部之載板即可，不必更換整組電子裝置，因此大大地降低了更換成本。 The main object of the present invention is to provide an electronic device, wherein the substrate and the light-emitting portion can be separately disposed. When the light-emitting portion is damaged, only the carrier plate provided with the light-emitting portion needs to be replaced, and the entire set of electronic devices does not need to be replaced, thereby greatly reducing Replacement costs.
並且，發光部另設於載板上，不用再與基板共用散熱面積，可使散熱效率提升，降低電子裝置因過熱而損壞之風險。 Moreover, the light-emitting portion is separately disposed on the carrier, and the heat-dissipating area is not shared with the substrate, so that the heat-dissipation efficiency is improved, and the risk of damage of the electronic device due to overheating is reduced.
除此之外，亦可例如透過導光部之散射結構讓發光部投射出來的光線可較均勻地散射至電子裝置外部，並可使光線看起來更加柔美。 In addition, for example, the light emitted from the light-emitting portion can be more uniformly scattered to the outside of the electronic device through the scattering structure of the light guiding portion, and the light can be made more soft.
為達成上述目的，本發明提供一種電子裝置。該電子裝置包括一本體及一PCI-E插排。該本體具有一基板、一發光模組及一導光部，該發光模組具有一載板及一設於該載板之發光部，該導光部係相對該發光部設置，至少部分該發光部之光源經由該導光部而射至該電子裝置之外部；該PCI-E插排設於該基板，且該PCI-E插排供與一PCI-E插槽電性連接。 To achieve the above object, the present invention provides an electronic device. The electronic device includes a body and a PCI-E strip. The main body has a substrate, a light-emitting module and a light-guiding portion. The light-emitting module has a carrier and a light-emitting portion disposed on the carrier. The light-guiding portion is disposed opposite to the light-emitting portion, and at least partially emits the light. The light source of the part is emitted to the outside of the electronic device through the light guiding portion; the PCI-E plug is disposed on the substrate, and the PCI-E plug is electrically connected to a PCI-E slot.
1‧‧‧電子裝置 1‧‧‧Electronic device
10‧‧‧本體 10‧‧‧ Ontology
11‧‧‧基板 11‧‧‧Substrate
111‧‧‧貫孔 111‧‧‧through holes
112‧‧‧電子單元 112‧‧‧Electronic unit
113‧‧‧第一電性插槽 113‧‧‧First electrical slot
12‧‧‧發光模組 12‧‧‧Lighting module
121‧‧‧載板 121‧‧‧ Carrier Board
122‧‧‧側翼 122‧‧‧Flanking
123‧‧‧發光部 123‧‧‧Lighting Department
124‧‧‧第二電性插槽 124‧‧‧Second electrical slot
13‧‧‧導光部 13‧‧‧Light Guide
131‧‧‧散射結構 131‧‧‧scatter structure
14‧‧‧電性排線 14‧‧‧Electrical cable
15‧‧‧PCI-E插排 15‧‧‧PCI-E strip
16‧‧‧PCI-E插槽 16‧‧‧PCI-E slot
17‧‧‧殼部 17‧‧‧Shell Department
171‧‧‧透光部 171‧‧‧Transmission Department
123a‧‧‧發光部 123a‧‧‧Lighting Department
13a‧‧‧導光部 13a‧‧‧Light Guide
131a‧‧‧散射結構 131a‧‧‧scattering structure
132a‧‧‧入射面 132a‧‧‧Incoming surface
133a‧‧‧散射面 133a‧‧‧scattering surface
134a‧‧‧出射面 134a‧‧‧Outlet
圖1為本發明一較佳實施例之立體圖。 1 is a perspective view of a preferred embodiment of the present invention.
圖2為本發明一較佳實施例之分解圖。 2 is an exploded view of a preferred embodiment of the present invention.
圖3為本發明一較佳實施例之另一分解圖。 Figure 3 is another exploded view of a preferred embodiment of the present invention.
圖4為本發明一較佳實施例之使用狀態示意圖。 4 is a schematic view showing the state of use of a preferred embodiment of the present invention.
圖5為本發明一較佳實施例之電性關係方塊圖。 FIG. 5 is a block diagram of an electrical relationship according to a preferred embodiment of the present invention.
圖6為本發明另一較佳實施例之使用狀態示意圖。 Figure 6 is a schematic view showing the state of use of another preferred embodiment of the present invention.
以下僅以實施例說明本發明可能之實施態樣，然並非用以限 制本發明所欲保護之範疇，合先敘明。 In the following, only possible embodiments of the present invention will be described by way of examples, but not limited thereto. The scope of the invention to be protected is described in advance.
請參考圖1至5，其顯示本發明之一較佳實施例，本發明之電子裝置1包括一本體10及一PCI-E插排15。 Referring to FIGS. 1 through 5, there is shown a preferred embodiment of the present invention. The electronic device 1 of the present invention includes a body 10 and a PCI-E strip 15.
該本體10具有一基板11、一發光模組12及一導光部13。進一步說，該基板11設有一電子單元112，該電子單元112與該PCI-E插排15電性連接，該電子單元112可為繪圖處理模組、顯示處理模組或其它處理模組，使該電子裝置1能當作繪圖卡、顯示卡或其它裝置使用。該發光模組12具有一載板121及一設於該載板121之發光部123，該導光部13係相對該發光部123設置。 The body 10 has a substrate 11 , a light emitting module 12 , and a light guiding portion 13 . Further, the substrate 11 is provided with an electronic unit 112. The electronic unit 112 is electrically connected to the PCI-E plug-in board 15. The electronic unit 112 can be a graphics processing module, a display processing module, or other processing module. The electronic device 1 can be used as a graphics card, display card or other device. The light-emitting module 12 has a carrier 121 and a light-emitting portion 123 disposed on the carrier 121. The light-guiding portion 13 is disposed opposite to the light-emitting portion 123.
該PCI-E插排15設於該基板11，且該PCI-E插排15供與一PCI-E插槽16電性連接，較明確地說，該PCI-E插排15不僅可傳輸電力、亦可傳輸資料。可理解的，該PCI-E插排15可因應不同主機板規格之PCI-E插槽16而為PCI-E x1,PCI-E x2,PCI-E x4,PCI-E x8或PCI-E x16之插排。 The PCI-E strip 15 is disposed on the substrate 11 , and the PCI-E strip 15 is electrically connected to a PCI-E slot 16 . More specifically, the PCI-E strip 15 not only transmits power. It can also transmit data. Understandably, the PCI-E strip 15 can be PCI-E x1, PCI-E x2, PCI-E x4, PCI-E x8 or PCI-E x16 depending on the PCI-E slot 16 of different motherboard specifications. The row is inserted.
該基板11設有一與該PCI-E插排15電性連接之第一電性插槽113，該載板121設有一與該發光部123電性連接之第二電性插槽124，該第一電性插槽113及該第二電性插槽124以一電性排線14相互插接而電性連接，且該基板11與該載板121係為印刷電路板，進而使該發光部123可與該PCI-E插排15電性連接；於其它實施例，載板與基板並不限於用插槽與電性排線插接而電性連接，亦可以焊接的方式來電性連接；抑或是，發光部不與PCI-E插排電性連接，而係另外將電性排線外接至其它外部電源(例如主機板之其餘插槽)。 The substrate 11 is provided with a first electrical socket 113 electrically connected to the PCI-E strip 15 , and the carrier 121 is provided with a second electrical socket 124 electrically connected to the light-emitting portion 123 . An electrical socket 113 and the second electrical socket 124 are electrically connected to each other by an electrical cable 14 , and the substrate 11 and the carrier 121 are printed circuit boards, and the light emitting portion is further 123 can be electrically connected to the PCI-E strip 15; in other embodiments, the carrier and the substrate are not limited to being electrically connected by sockets and electrical cables, and can also be electrically connected by soldering; Or, the light-emitting portion is not electrically connected to the PCI-E plug, and the electrical cable is additionally connected to other external power sources (for example, the remaining slots of the motherboard).
該本體10還包括一殼部17，該殼部17蓋設於該基板11之 相對二側，該殼部17設有一透光部171，至少部分該發光部123之光源可經由該導光部13及該透光部171而射至該電子裝置1之外部。該透光部171可為透光材料層或鏤空結構(抑或是將導光部嵌設於鏤空結構上)，同樣可使該導光部13射出來之光線投射至該電子裝置1之外部。於其他實施例，殼部並不限於設有透光部，亦可直接將發光模組及導光部設於殼部外表面，同樣具有發亮及增加散熱效率之效果。 The body 10 further includes a shell portion 17 that is disposed on the substrate 11 The light-emitting portion 171 is disposed on the shell portion 17 , and the light source of the light-emitting portion 123 can be incident on the outside of the electronic device 1 through the light-guiding portion 13 and the light-transmitting portion 171 . The light transmitting portion 171 can be a light transmissive material layer or a hollow structure (or the light guiding portion can be embedded on the hollow structure), and the light emitted from the light guiding portion 13 can be projected to the outside of the electronic device 1 . In other embodiments, the shell portion is not limited to being provided with a light transmitting portion, and the light emitting module and the light guiding portion may be directly disposed on the outer surface of the shell portion, which also has the effect of brightening and increasing heat dissipation efficiency.
進一步說，該基板11具有一貫孔111，該導光部13穿設於該貫孔111(亦可將載板嵌設於貫孔處)，使該導光部13較不佔空間，進而減少該電子裝置1之整體體積。該載板121凸設有至少一側翼122，該至少一側翼122連接於該基板11，於本實施例，該發光模組12之載板121係可拆卸地連接該本體10之基板11，該載板121係於其相對二端分別凸設有一該側翼122，使該載板121可固設於該基板11；要說明的是，該載板121與該基板11可用焊接、組接或卡接等方式來連接。除此之外，載板與基板亦可不相連接，而將載板與殼部相連；抑或是，導光部嵌設於殼部，進而將與導光部連接之載板定位。 Further, the substrate 11 has a uniform hole 111, and the light guiding portion 13 is disposed in the through hole 111 (the carrier plate can also be embedded in the through hole), so that the light guiding portion 13 does not occupy a space, thereby reducing The overall volume of the electronic device 1. The carrier board 121 is detachably connected to the substrate 11 , and the carrier board 121 of the light module 12 is detachably connected to the substrate 11 of the body 10 . The carrier plate 121 has a side flap 122 protruding from the opposite ends thereof, so that the carrier plate 121 can be fixed to the substrate 11; for example, the carrier plate 121 and the substrate 11 can be soldered, assembled or carded. Connect and other methods to connect. In addition, the carrier board and the substrate may not be connected to each other, and the carrier board is connected to the shell portion; or the light guiding portion is embedded in the shell portion to position the carrier plate connected to the light guiding portion.
該導光部13設有一散射結構131，部分該發光部123之光源朝該散射結構131投射而散射後、均勻地穿透出該導光部13並射至該電子裝置1之外部，從該電子裝置1外部觀視時，光線可較不會太過集中而刺眼。 The light guiding portion 13 is provided with a scattering structure 131. The light source of the light emitting portion 123 is projected toward the scattering structure 131 to be scattered, uniformly penetrates the light guiding portion 13 and is emitted to the outside of the electronic device 1. When the electronic device 1 is externally viewed, the light may be less concentrating and glaring.
於本實施例，該散射結構131均勻地分佈於該導光部13內，部分該發光部123之光源經由該散射結構131散射後可向該導光部13之周側射出。進一步說，該散射結構131係為複數散射粒子，該等散射粒子與 該導光部13基材之材質相異，因此光源射到該等散設粒子即會散射(反射)或折射而使光線可較均勻地散出。可理解的是，該發光部123可緊貼於該導光部13，可使光源傳遞效率較佳；抑或是，該發光部123與該導光部13保持適當距離，可避免該導光部13因該發光部123的熱而耗損。 In the present embodiment, the scattering structure 131 is uniformly distributed in the light guiding portion 13 , and a part of the light source of the light emitting portion 123 is scattered by the scattering structure 131 and can be emitted toward the circumferential side of the light guiding portion 13 . Further, the scattering structure 131 is a plurality of scattering particles, and the scattering particles are Since the material of the base material of the light guiding portion 13 is different, the light source is scattered (reflected) or refracted by the scattered particles, so that the light can be more uniformly dispersed. It can be understood that the light-emitting portion 123 can be closely attached to the light guiding portion 13 to make the light source transmission efficiency better; or the light-emitting portion 123 and the light guiding portion 13 can maintain an appropriate distance to avoid the light guiding portion. 13 is consumed by the heat of the light-emitting portion 123.
於另一實施例，如圖6所示之導光部13a，相較於圖1至5之實施例，該導光部13a具有至少一入射面132a、一設有散射結構131a之散射面133a及一相對該散射面133a之出射面134a，發光部123a鄰設於該至少一入射面132a，該發光部123a之光源朝該至少一入射面132a入射、且部分光源經由該散射結構131a散射後可從該出射面134a透出。進一步說，該散射結構131a係為凹凸結構，該發光部123a係於該導光部13a之相對二端面(入射面)入射光源，使光源經由該凹凸結構散射後可較均勻地從該出射面134a透出；於其它實施例，散射結構亦可為散射網點結構，同樣可使光源較均勻地從特定出射面透出。 In another embodiment, as shown in FIG. 6 , the light guiding portion 13 a has at least one incident surface 132 a and a scattering surface 133 a provided with a scattering structure 131 a compared with the embodiment of FIGS. 1 to 5 . And an emitting surface 134a opposite to the scattering surface 133a, the light emitting portion 123a is adjacent to the at least one incident surface 132a. The light source of the light emitting portion 123a is incident on the at least one incident surface 132a, and a part of the light source is scattered through the scattering structure 131a. It can be seen from the exit surface 134a. Further, the scattering structure 131a is a concave-convex structure, and the light-emitting portion 123a is incident on the opposite end surfaces (incident surfaces) of the light guiding portion 13a, and the light source can be uniformly distributed from the emitting surface through the concave-convex structure. 134a is permeable; in other embodiments, the scattering structure may also be a scattering dot structure, which also allows the light source to be more uniformly transmitted from a specific exit surface.
綜上，本發明之電子裝置可透過與基板分別設置之發光部(另設於載板)，若發光部損壞時，僅需更換設置有發光部之載板即可，不必更換整組電子裝置，因此大大地降低了更換成本。 In summary, the electronic device of the present invention can transmit a light-emitting portion (separately disposed on the carrier) respectively disposed on the substrate. If the light-emitting portion is damaged, only the carrier plate provided with the light-emitting portion needs to be replaced, and the entire set of electronic devices does not have to be replaced. Therefore, the replacement cost is greatly reduced.
並且，發光部另設於載板上，不用再與電子單元共用基板的散熱面積，可使散熱效率提升，降低電子裝置過熱而損壞之風險。 Moreover, the light-emitting portion is separately disposed on the carrier, and the heat-dissipating area of the substrate is not shared with the electronic unit, so that the heat-dissipation efficiency is improved, and the risk of overheating and damage of the electronic device is reduced.
除此之外，亦可例如透過導光部之散射結構讓發光部投射出來的光線可較均勻地散射至電子裝置外部，並可使光線看起來更加柔美。 In addition, for example, the light emitted from the light-emitting portion can be more uniformly scattered to the outside of the electronic device through the scattering structure of the light guiding portion, and the light can be made more soft.
綜上所述，本發明之整體結構設計、實用性及效益上，確實是完全符合產業上發展所需，且所揭露之結構發明亦是具有前所未有的創 新構造，所以其具有「新穎性」應無疑慮，又本發明可較之習知結構更具功效之增進，因此亦具有「進步性」，其完全符合我國專利法有關發明專利之申請要件的規定，乃依法提起專利申請，並敬請 鈞局早日審查，並給予肯定。 In summary, the overall structural design, practicability and efficiency of the present invention are indeed fully in line with the needs of industrial development, and the disclosed structural invention is also unprecedentedly innovative. The new structure, so its "newness" should be undoubted, and the invention can be more effective than the conventional structure, so it is also "progressive", which fully complies with the application requirements of the invention patents of the Chinese Patent Law. The stipulation is that a patent application is filed in accordance with the law, and the bureau should be reviewed at an early date and affirmed.
1‧‧‧電子裝置 1‧‧‧Electronic device
10‧‧‧本體 10‧‧‧ Ontology
11‧‧‧基板 11‧‧‧Substrate
111‧‧‧貫孔 111‧‧‧through holes
112‧‧‧電子單元 112‧‧‧Electronic unit
113‧‧‧第一電性插槽 113‧‧‧First electrical slot
12‧‧‧發光模組 12‧‧‧Lighting module
121‧‧‧載板 121‧‧‧ Carrier Board
122‧‧‧側翼 122‧‧‧Flanking
123‧‧‧發光部 123‧‧‧Lighting Department
124‧‧‧第二電性插槽 124‧‧‧Second electrical slot
13‧‧‧導光部 13‧‧‧Light Guide
14‧‧‧電性排線 14‧‧‧Electrical cable
17‧‧‧殼部 17‧‧‧Shell Department
171‧‧‧透光部 171‧‧‧Transmission Department
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104132831A TWI554866B (en) | 2015-10-06 | 2015-10-06 | Electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104132831A TWI554866B (en) | 2015-10-06 | 2015-10-06 | Electronic device |
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| Publication Number | Publication Date |
|---|---|
| TWI554866B true TWI554866B (en) | 2016-10-21 |
| TW201714034A TW201714034A (en) | 2017-04-16 |
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| TW104132831A TWI554866B (en) | 2015-10-06 | 2015-10-06 | Electronic device |
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| TW (1) | TWI554866B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI652002B (en) * | 2018-01-30 | 2019-02-21 | 技嘉科技股份有限公司 | Light guide heat dissipation module and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7507119B2 (en) * | 2000-01-06 | 2009-03-24 | Super Talent Electronics, Inc. | USB device with integrated USB plug with USB-substrate supporter inside |
| TWM448772U (en) * | 2012-09-04 | 2013-03-11 | Avexir Technologies Corp | Dram |
| US8517589B2 (en) * | 2010-06-03 | 2013-08-27 | The Swatch Group Research And Development Ltd | Lighting system for a data display device including a light guide |
| TWM508053U (en) * | 2015-05-12 | 2015-09-01 | Avexir Technologies Corp | Electric circuit module |
-
2015
- 2015-10-06 TW TW104132831A patent/TWI554866B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7507119B2 (en) * | 2000-01-06 | 2009-03-24 | Super Talent Electronics, Inc. | USB device with integrated USB plug with USB-substrate supporter inside |
| US8517589B2 (en) * | 2010-06-03 | 2013-08-27 | The Swatch Group Research And Development Ltd | Lighting system for a data display device including a light guide |
| TWM448772U (en) * | 2012-09-04 | 2013-03-11 | Avexir Technologies Corp | Dram |
| TWM508053U (en) * | 2015-05-12 | 2015-09-01 | Avexir Technologies Corp | Electric circuit module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI652002B (en) * | 2018-01-30 | 2019-02-21 | 技嘉科技股份有限公司 | Light guide heat dissipation module and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201714034A (en) | 2017-04-16 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |