TWI556713B - A fixing device and a manufacturing method thereof - Google Patents
A fixing device and a manufacturing method thereof Download PDFInfo
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- TWI556713B TWI556713B TW104138388A TW104138388A TWI556713B TW I556713 B TWI556713 B TW I556713B TW 104138388 A TW104138388 A TW 104138388A TW 104138388 A TW104138388 A TW 104138388A TW I556713 B TWI556713 B TW I556713B
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本發明是有關於一種裝置及其製造方法，特別是指一種用於承載固定一物件，並固定於一基板上的固定裝置及其製造方法。The present invention relates to a device and a method of manufacturing the same, and more particularly to a fixing device for carrying and fixing an object and fixed to a substrate, and a method of manufacturing the same.
隨著科技的快速發展，電子裝置內部所使用的中央處理器(CPU)或圖形處理器(GPU)等電子元件的效能大幅提升，但也相對地造成這些電子元件在運作時所產生的熱大幅增加，若無法及時的將熱排除，常使得電子元件的內部溫度升高而導致系統停止正常運作，甚至造成電子元件損壞。目前，普遍於電子元件上安裝風扇來輔助散熱，藉由風扇運轉時產生的氣流來促使電子元件所產生的熱快速消散。現有的一種固定裝置是用於承載固定一風扇，並藉由固定件固定在個人電腦主機板或液晶螢幕電路板等基板上，且使風扇與基板間留有一可容置電子元件的間隙。With the rapid development of technology, the performance of electronic components such as a central processing unit (CPU) or a graphics processing unit (GPU) used in an electronic device is greatly improved, but the heat generated by these electronic components during operation is relatively large. If the heat is not removed in time, the internal temperature of the electronic component will increase, causing the system to stop functioning properly and even causing damage to the electronic components. At present, a fan is generally installed on an electronic component to assist in heat dissipation, and the heat generated by the electronic component is quickly dissipated by the airflow generated when the fan is operated. A conventional fixing device is used for supporting and fixing a fan, and is fixed on a substrate such as a personal computer motherboard or a liquid crystal display circuit board by a fixing member, and a gap between the fan and the substrate for accommodating electronic components is left.
上述的固定裝置其製造方法包含以下步驟：製備一金屬板並利用沖床沖壓的方式於該金屬板的上表面形成一穿孔；再運用車床加工出一套筒，並將該套筒穿設於該穿孔且凸伸出該金屬板的下表面；最後使用一固定件穿設於該套筒。在製造此固定裝置的過程中，必須將金屬棒材車削加工出合適於穿孔的套筒，過程耗時且費工；此外，製造一個套筒的成本約新台幣三至四元，在大量生產下累積的成本相當可觀。The manufacturing method of the above fixing device comprises the steps of: preparing a metal plate and forming a perforation on the upper surface of the metal plate by punching; and processing a sleeve by using a lathe, and threading the sleeve on the Perforated and protruding from the lower surface of the metal plate; finally, a fixing member is used to penetrate the sleeve. In the process of manufacturing this fixture, the metal bar must be turned into a sleeve suitable for perforation, which is time consuming and labor intensive; in addition, the cost of manufacturing a sleeve is about NT$3 to 4,000, in mass production. The accumulated cost is considerable.
因此，本發明之目的，即在提供一種可簡化製造步驟以及減少生產成本的固定裝置及其製造方法。Accordingly, it is an object of the present invention to provide a fixing device and a method of manufacturing the same that can simplify the manufacturing steps and reduce the production cost.
於是，本發明提供一種固定裝置是適用於承載固定一物件並固定在一設有凸出於板面之元件的基板上，該固定裝置包含一金屬板及至少一固定件。該金屬板包括一上表面、一下表面，及至少一自該上表面凹陷並凸出於該下表面的凹壁，該凹壁界定一沿該金屬板的法線方向延伸的延伸空間，該凹壁包括一沿該金屬板的法線方向貫穿的貫孔；該至少一固定件是對應設置於該至少一凹壁且自對應凹壁的延伸空間穿設於該貫孔，以將該金屬板與該基板結合固定，且使該金屬板的下表面朝向該基板而使該基板上的元件介於該基板與該金屬板之間。Accordingly, the present invention provides a fixing device which is adapted to carry and fix an object and is fixed to a substrate provided with an element protruding from the surface of the board. The fixing device comprises a metal plate and at least one fixing member. The metal plate includes an upper surface, a lower surface, and at least one concave wall recessed from the upper surface and protruding from the lower surface, the concave wall defining an extended space extending along a normal direction of the metal plate, the concave The wall includes a through hole penetrating in a normal direction of the metal plate; the at least one fixing member is correspondingly disposed on the at least one concave wall and is disposed in the through hole from an extending space of the corresponding concave wall to the metal plate The substrate is bonded and fixed, and the lower surface of the metal plate faces the substrate such that an element on the substrate is interposed between the substrate and the metal plate.
較佳地，該凹壁還具有一凸出於該下表面且圍繞該延伸空間的圍繞部，及一連接於該圍繞部底端並設有該貫孔的平板部，該平板部供該固定件靠抵。Preferably, the concave wall further has a surrounding portion protruding from the lower surface and surrounding the extending space, and a flat portion connected to the bottom end of the surrounding portion and provided with the through hole, the flat portion is for fixing The pieces are against.
較佳地，該固定件包括一止動塊部及一桿部，該止動塊部是靠抵於該凹壁的平板部，而該桿部是穿設於該貫孔。Preferably, the fixing member includes a stopping block portion and a rod portion. The stopping block portion is a flat plate portion that abuts against the concave wall, and the rod portion is disposed through the through hole.
較佳地，該固定件是彈簧鉚釘、鉚釘、螺絲三者其中之一。Preferably, the fixing member is one of a spring rivet, a rivet and a screw.
較佳地，該金屬板包括多個凹壁，該固定裝置包含多個固定件且分別對應該等凹壁設置，每一凹壁還具有一凸出該下表面且圍繞該延伸空間的圍繞部，及一連接於該圍繞部底端並設有該貫孔的平板部，該平板部供對應的固定件靠抵。Preferably, the metal plate comprises a plurality of concave walls, the fixing device comprises a plurality of fixing members and respectively corresponding to the concave walls, each concave wall further has a surrounding portion protruding from the extending surface and surrounding the extending space And a flat plate portion connected to the bottom end of the surrounding portion and provided with the through hole, the flat plate portion being abutted by the corresponding fixing member.
較佳地，該金屬板的材質為鋁。Preferably, the metal plate is made of aluminum.
較佳地，該基板上設有一運作時會產生熱的元件，該金屬板還包括一形成於該下表面且在該等凹壁以外之處，並用以對應接觸該元件以導熱的導熱部。Preferably, the substrate is provided with an element that generates heat during operation, and the metal plate further includes a heat conducting portion formed on the lower surface and outside the concave walls for correspondingly contacting the element for heat conduction.
較佳地，該金屬板還包括多個布設於該等凹壁及該導熱部以外之處的散熱孔。Preferably, the metal plate further includes a plurality of heat dissipation holes disposed outside the concave walls and the heat conducting portion.
本發明還提供了一種固定裝置的製造方法，該固定裝置是適用於承載固定一物件並固定在一設有凸出於板面之元件的基板上，該方法包含以下步驟，製備一金屬板，該金屬板包括一上表面及一下表面；於該金屬板形成至少一由該上表面凹陷並凸出於該下表面的凹壁，該凹壁界定一沿該金屬板的法線方向延伸且可容置一固定件的延伸空間；於該凹壁形成一沿該金屬板的法線方向貫穿的貫孔；以及由該延伸空間穿設該固定件於該貫孔，以將該金屬板與該基板結合固定，且使該金屬板的下表面朝向該基板而使該基板上的元件介於該基板與該金屬板之間。The invention also provides a method for manufacturing a fixing device, which is suitable for carrying and fixing an object and fixed on a substrate provided with an element protruding from the surface of the board, the method comprising the steps of: preparing a metal plate, The metal plate includes an upper surface and a lower surface; the metal plate forms at least one concave wall recessed by the upper surface and protruding from the lower surface, the concave wall defining a direction extending along a normal direction of the metal plate Having a space for extending a fixing member; forming a through hole penetrating in a normal direction of the metal plate; and inserting the fixing member into the through hole through the extending space to The substrate is bonded and fixed, and the lower surface of the metal plate faces the substrate such that an element on the substrate is interposed between the substrate and the metal plate.
較佳地，該凹壁還具有一凸出於該下表面且圍繞該延伸空間的圍繞部，及一連接於該圍繞部底端並設有該貫孔的平板部，該平板部供該固定件靠抵。Preferably, the concave wall further has a surrounding portion protruding from the lower surface and surrounding the extending space, and a flat portion connected to the bottom end of the surrounding portion and provided with the through hole, the flat portion is for fixing The pieces are against.
較佳地，該固定件包括一止動塊部及一桿部，該止動塊部是靠抵於該凹壁的平板部，而該桿部是穿設於該貫孔。Preferably, the fixing member includes a stopping block portion and a rod portion. The stopping block portion is a flat plate portion that abuts against the concave wall, and the rod portion is disposed through the through hole.
較佳地，該固定件是彈簧鉚釘、鉚釘、螺絲三者其中之一。Preferably, the fixing member is one of a spring rivet, a rivet and a screw.
較佳地，該金屬板包括多個凹壁，該固定裝置包含多個固定件且分別對應設置於該等凹壁，每一凹壁還具有一凸出於該下表面且圍繞該延伸空間的圍繞部，及一連接於該圍繞部底端並設有該貫孔的平板部，該平板部供對應的固定件靠抵。Preferably, the metal plate comprises a plurality of concave walls, the fixing device comprises a plurality of fixing members and respectively corresponding to the concave walls, each concave wall further has a convex surface and surrounding the extending space. a surrounding portion, and a flat portion connected to the bottom end of the surrounding portion and provided with the through hole, the flat portion is abutted by the corresponding fixing member.
較佳地，該金屬板的材質為鋁。Preferably, the metal plate is made of aluminum.
較佳地，本發明之固定裝置的製造方法是以沖床沖壓的方式形成該等凹壁及該等貫孔。Preferably, the manufacturing method of the fixing device of the present invention forms the concave walls and the through holes by punching.
較佳地，該基板上設有一運作時會產生熱的元件，而該製造方法還包含：於該下表面且在該等凹壁以外之處形成一用以對應接觸該元件以導熱的導熱部。Preferably, the substrate is provided with an element that generates heat during operation, and the manufacturing method further comprises: forming a heat conducting portion on the lower surface and outside the concave walls for correspondingly contacting the element for heat conduction .
較佳地，本發明之固定裝置的製造方法還包含：於該金屬板形成多個布設於該等凹壁及該導熱部以外之處的散熱孔。Preferably, the method of manufacturing the fixing device of the present invention further comprises: forming a plurality of heat dissipation holes disposed on the metal plate at a position other than the concave wall and the heat conducting portion.
本發明之功效在於，在上述的製造方法中，以在金屬板上形成凹壁及貫孔的方式，代替目前使用車床加工的套筒，在大量製造下可節省相當可觀的加工時間及生產成本。The invention has the effect that in the above manufacturing method, instead of the sleeve which is currently processed by the lathe, the concave wall and the through hole are formed on the metal plate, which can save considerable processing time and production cost in mass production. .
在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖1，本發明固定裝置的第一實施例是使用固定裝置承載固定一風扇4並固定在一裝設有一晶片組5的基板3上，該固定裝置包含一金屬板1及一固定件2。該金屬板1的材質為鋁並包括一上表面11、一下表面12，及一自該上表面11凹陷並凸出於該下表面12的凹壁13。該凹壁13界定一沿該金屬板1的法線方向延伸的延伸空間131，而該凹壁13具有一凸出於該下表面12且圍繞該延伸空間131的圍繞部133、一連接於該圍繞部133底端的平板部134，及一形成於該平板部134的貫孔132。Referring to FIG. 1 , a first embodiment of the fixing device of the present invention is to fix and fix a fan 4 and fix it on a substrate 3 on which a wafer set 5 is mounted. The fixing device comprises a metal plate 1 and a fixing member 2 . . The metal plate 1 is made of aluminum and includes an upper surface 11, a lower surface 12, and a concave wall 13 recessed from the upper surface 11 and protruding from the lower surface 12. The concave wall 13 defines an extending space 131 extending along the normal direction of the metal plate 1, and the concave wall 13 has a surrounding portion 133 protruding from the lower surface 12 and surrounding the extending space 131, and is connected thereto. A flat plate portion 134 surrounding the bottom end of the portion 133 and a through hole 132 formed in the flat plate portion 134.
該固定件2可以是彈簧鉚釘、鉚釘、螺絲三者其中之一，在本實施例中該固定件2是一彈簧鉚釘，並對應設置於該凹壁13的延伸空間131。該彈簧鉚釘包括一靠抵於該凹壁13的平板部134的止動塊部21、一自該延伸空間131穿設於該貫孔132與該基板3的桿部22，以及一卡抵於該基板3底面用以將該金屬板1與該基板3結合固定的倒勾部23。The fixing member 2 can be one of a spring rivet, a rivet and a screw. In the embodiment, the fixing member 2 is a spring rivet and correspondingly disposed in the extended space 131 of the concave wall 13 . The spring rivet includes a stopper portion 21 that abuts against the flat plate portion 134 of the concave wall 13, a rod portion 22 that is inserted through the extending space 131 from the through hole 132 and the base plate 3, and a card is abutted The bottom surface of the substrate 3 is used to bond the metal plate 1 and the substrate 3 to the fixed undercut portion 23.
在本實施例中，利用二固定裝置承載一風扇4並分別固定於該風扇4的兩側，且藉由每一固定裝置的固定件2將每一金屬板1與該基板3結合固定，使每一金屬板1的下表面12朝向該基板3，藉由該凹壁13作為該下表面12與該基板3之間的間隔結構(spacer)可讓該風扇4與該基板3間保有一可容置該晶片組5的間隙，使得該晶片組5於運作時能藉由該風扇4運轉時產生的氣流來促使所產生的熱快速消散，以維持正常運作。在本實施例中，該固定裝置只有一個凹壁13，然而，可依據實際需求調整為兩個以上，但每一凹壁13必須對應設置一固定件2。In this embodiment, a fan 4 is carried by the two fixing devices and fixed to the two sides of the fan 4, and each metal plate 1 and the substrate 3 are fixed and fixed by the fixing member 2 of each fixing device. The lower surface 12 of each metal plate 1 faces the substrate 3, and the concave wall 13 serves as a spacer between the lower surface 12 and the substrate 3 to ensure a gap between the fan 4 and the substrate 3. The gap of the chip set 5 is accommodated, so that the generated heat can be quickly dissipated by the airflow generated when the fan 4 is operated during operation to maintain normal operation. In this embodiment, the fixing device has only one concave wall 13 , however, it can be adjusted to two or more according to actual needs, but each concave wall 13 must be correspondingly provided with a fixing member 2 .
參閱圖3，為上述第一實施例固定裝置的製造方法之製作流程，首先進行步驟61，配合參閱圖4，製備該金屬板1，此時金屬板1處於未加工的平整狀態。Referring to FIG. 3, in the manufacturing process of the manufacturing method of the fixing device of the first embodiment, first, step 61 is performed, and referring to FIG. 4, the metal plate 1 is prepared, and the metal plate 1 is in an unprocessed flat state.
接著進行步驟62，配合參閱圖5，利用沖床(圖中未繪製)於該金屬板1沖壓加工出該凹壁13。Next, step 62 is performed. Referring to FIG. 5, the concave wall 13 is stamped on the metal plate 1 by a punch (not shown).
接著進行步驟63，配合參閱圖6，同樣地使用沖床於該凹壁13的平板部134沖壓出該貫孔132。Next, in step 63, referring to FIG. 6, the through hole 132 is punched out in the flat plate portion 134 of the concave wall 13 by using a punch.
最後進行步驟64，配合參閱圖7，自該延伸空間131穿設該固定件2於該貫孔132。Finally, step 64 is performed. Referring to FIG. 7 , the fixing member 2 is inserted through the fixing hole 2 from the extending space 131 .
在本實施例中，使用沖床於金屬板1上形成凹壁13及貫孔132的方式，不但較目前使用車床加工出套筒的方式簡便，且成本較為低廉，後續能讓固定件2快速簡易地穿設在貫孔132中以提供固定效果，在大量製造下可節省相當可觀的加工時間及生產成本。In the embodiment, the method of forming the concave wall 13 and the through hole 132 on the metal plate 1 by using the punching machine is not only simpler than the current method of processing the sleeve by using the lathe, but also the cost is relatively low, and the fixing member 2 can be quickly and easily The grounding is provided in the through hole 132 to provide a fixing effect, which can save considerable processing time and production cost in mass production.
參閱圖2，本發明固定裝置的第二實施例是直接使用一固定裝置與一設有一晶片組5的基板3結合固定，並以該固定裝置當作該晶片組5的導熱媒介。該晶片組包括一晶片51及一塗抹於晶片51表面的導熱膠52，而該固定裝置包含一金屬板1及二固定件2。Referring to Fig. 2, a second embodiment of the fixture of the present invention is directly coupled to a substrate 3 provided with a wafer set 5 using a fixture, and the fixture is used as a heat transfer medium for the wafer stack 5. The wafer set includes a wafer 51 and a thermal conductive paste 52 applied to the surface of the wafer 51. The fixing device comprises a metal plate 1 and two fixing members 2.
該金屬板1的材質為鋁，且包括一上表面11、一下表面12、二自該上表面11凹陷並凸出於該下表面12的凹壁13、及一形成於該下表面11且在該等凹壁13以外之處，並用以對應接觸該晶片51表面的導熱膠52以幫助該晶片51散熱的導熱部14，該金屬板1還包括多個布設於該等凹壁13及該導熱部14以外之處的散熱孔15。每一凹壁13界定一沿該金屬板1的法線方向延伸的延伸空間131，而每一凹壁13具有一凸出於該下表面12且圍繞該延伸空間131的圍繞部133、一連接於該圍繞部133底端的平板部134，及一形成於該平板部134的貫孔132。The metal plate 1 is made of aluminum and includes an upper surface 11, a lower surface 12, two concave walls 13 recessed from the upper surface 11 and protruding from the lower surface 12, and a lower surface 11 formed on the lower surface 11 and The heat conducting portion 14 is disposed outside the concave wall 13 and corresponding to the thermal conductive adhesive 52 contacting the surface of the wafer 51 to assist the heat dissipation of the wafer 51. The metal plate 1 further includes a plurality of the concave walls 13 disposed on the concave wall 13 and the heat conduction. The heat dissipation hole 15 except the portion 14. Each of the concave walls 13 defines an extending space 131 extending along a normal direction of the metal plate 1, and each of the concave walls 13 has a surrounding portion 133 protruding from the lower surface 12 and surrounding the extending space 131, and a connection The flat portion 134 at the bottom end of the surrounding portion 133 and a through hole 132 formed in the flat portion 134.
該等固定件2可以是彈簧鉚釘、鉚釘、螺絲三者其中之一，在本實施例中該等固定件2分別是一彈簧鉚釘，並分別設置於該對應凹壁13的延伸空間131。每一彈簧鉚釘各包括一靠抵於該凹壁13的平板部134的止動塊部21、一自該延伸空間131穿設於該貫孔132與該基板3的桿部22，及一卡抵於該基板3底面用以將該金屬板1與該基板3結合固定的倒勾部23。The fixing members 2 can be one of a spring rivet, a rivet and a screw. In the embodiment, the fixing members 2 are respectively a spring rivet and are respectively disposed in the extending space 131 of the corresponding concave wall 13 . Each of the spring rivets includes a stopper portion 21 that abuts against the flat plate portion 134 of the concave wall 13 , a rod portion 22 that is inserted through the extending space 131 from the through hole 132 and the base plate 3 , and a card The undercut portion 23 is fixed to the bottom surface of the substrate 3 for bonding the metal plate 1 to the substrate 3.
在本實施例中，藉由該等固定件2與該基板3結合固定，且使該金屬板1的下表面12朝向該基板3而使該基板3上的晶片組5介於該基板3與該金屬板之間1，並藉由該金屬板1與該導熱膠52接觸的導熱部14及該等散熱孔15幫助該晶片組5將運作時所產生的熱快速消散，以維持正常運作。In this embodiment, the fixing member 2 is fixed to the substrate 3, and the lower surface 12 of the metal plate 1 faces the substrate 3 so that the wafer group 5 on the substrate 3 is interposed between the substrate 3 and the substrate 3. The heat conducting portion 14 between the metal plates 1 and the heat conducting portion 15 and the heat dissipating holes 15 of the metal plate 1 help the wafer group 5 to quickly dissipate heat generated during operation to maintain normal operation.
參閱圖8，為上述第二實施例固定裝置的製造方法之製作流程，首先進行步驟71，配合參閱圖4，製備該金屬板1，此時金屬板1處於未加工的平整狀態。Referring to FIG. 8, which is a manufacturing process of the manufacturing method of the fixing device of the second embodiment, first, step 71 is performed, and referring to FIG. 4, the metal plate 1 is prepared, and the metal plate 1 is in an unprocessed flat state.
接著進行步驟72，配合參閱圖9，利用沖床於該金屬板1沖壓加工出該等凹壁13。Next, step 72 is performed. Referring to FIG. 9, the concave walls 13 are stamped and processed on the metal plate 1 by a punch.
接著進行步驟73，配合參閱圖10，同樣地使用沖床於每一凹壁13的平板部134沖壓出該貫孔132。Next, step 73 is performed. Referring to FIG. 10, the through hole 132 is punched out in the flat plate portion 134 of each concave wall 13 by using a punch.
接著進行步驟74，配合參閱圖11，分別將該等固定件2自對應的延伸空間131穿設於對應的貫孔132。Then, step 74 is performed. Referring to FIG. 11 , the fixing members 2 are respectively disposed from the corresponding extending spaces 131 in the corresponding through holes 132 .
接著進行步驟75，配合參閱圖12，於該金屬板1形成一用以對應接觸該導熱膠52以幫助該晶片51散熱的導熱部14。Next, in step 75, referring to FIG. 12, a heat conducting portion 14 is formed on the metal plate 1 for correspondingly contacting the thermal conductive adhesive 52 to help dissipate the heat of the wafer 51.
最後進行步驟76，配合參閱圖12，於該金屬板1布設多個於該等凹壁13及該導熱部14以外之處的散熱孔15。在本實施例中，步驟75及步驟76分別是在步驟74及步驟75結束後才接著進行，然而，可依據實際生產情況將步驟74及步驟75的順序調整為結束步驟71後之任一步驟。Finally, step 76 is performed. Referring to FIG. 12 , a plurality of heat dissipation holes 15 are disposed on the metal plate 1 except for the concave walls 13 and the heat conducting portion 14 . In this embodiment, step 75 and step 76 are performed after step 74 and step 75 respectively. However, the order of step 74 and step 75 can be adjusted to any step after the end step 71 according to actual production conditions. .
綜上所述，以該金屬板1上形成凹壁13及貫孔132的方式，代替目前使用車床加工的套筒，在大量製造下可節省相當可觀的加工時間及生產成本。除此之外，藉由於該金屬板1上形成導熱部14及散熱孔15，可直接將該金屬板1結合固定於基板3上並與晶片組5接觸，不須另外裝設風扇4即可幫助晶片組5將運作時所產生的熱快速消散，以維持正常運作。因此，本發明固定裝置及其製造方法，確實能達成本發明的目的。In summary, the recessed wall 13 and the through hole 132 are formed on the metal plate 1 instead of the sleeve which is currently processed by a lathe, which can save considerable processing time and production cost in mass production. In addition, since the heat conducting portion 14 and the heat dissipation holes 15 are formed on the metal plate 1, the metal plate 1 can be directly bonded and fixed to the substrate 3 and contacted with the wafer group 5, without separately installing the fan 4. Help chipset 5 dissipate the heat generated during operation to maintain normal operation. Therefore, the fixing device of the present invention and the method of manufacturing the same can indeed achieve the object of the present invention.
惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.
1‧‧‧金屬板
11‧‧‧上表面
12‧‧‧下表面
13‧‧‧凹壁
131‧‧‧延伸空間
132‧‧‧貫孔
133‧‧‧圍繞部
134‧‧‧平板部
14‧‧‧導熱部
15‧‧‧散熱孔
2‧‧‧固定件
21‧‧‧止動塊部
22‧‧‧桿部
23‧‧‧倒勾部
3‧‧‧基板
4‧‧‧風扇
5‧‧‧晶片組
51‧‧‧晶片
52‧‧‧導熱膠
61~64‧‧‧製作流程
71~76‧‧‧製作流程1‧‧‧Metal sheet
11‧‧‧ upper surface
12‧‧‧ Lower surface
13‧‧‧ concave wall
131‧‧‧Extension space
132‧‧‧through holes
133‧‧‧ Surrounding
134‧‧‧ flat section
14‧‧‧Transfer Department
15‧‧‧ vents
2‧‧‧Fixed parts
21‧‧‧stop block
22‧‧‧ pole
23‧‧‧Back hook
3‧‧‧Substrate
4‧‧‧Fan
5‧‧‧ Chipset
51‧‧‧ wafer
52‧‧‧thermal adhesive
61~64‧‧‧Production process
71~76‧‧‧Production process
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是一剖視示意圖，說明本發明固定裝置及其製造方法的第一實施例與一風扇及一基板的配合關係； 圖2是一剖視示意圖，說明本發明固定裝置及其製造方法的第二實施例與一基板的配合關係； 圖3是該第一實施例的一製作流程說明圖； 圖4是一製作示意圖，輔助說明步驟61、71； 圖5是一製作示意圖，輔助說明步驟62； 圖6是一製作示意圖，輔助說明步驟63； 圖7是一製作示意圖，輔助說明步驟64； 圖8是該第二實施例的一製作流程說明圖； 圖9是一製作示意圖，輔助說明步驟72； 圖10是一製作示意圖，輔助說明步驟73； 圖11是一製作示意圖，輔助說明步驟74；及 圖12是一製作示意圖，輔助說明步驟75、76。BRIEF DESCRIPTION OF THE DRAWINGS Other features and advantages of the present invention will be apparent from the embodiments of the present invention. FIG. 1 is a cross-sectional view showing a first embodiment of a fixing device and a method of manufacturing the same according to the present invention. FIG. 2 is a cross-sectional view showing a second embodiment of the fixing device and the manufacturing method thereof, and a substrate; FIG. 3 is an explanatory diagram of a manufacturing process of the first embodiment; Figure 4 is a schematic diagram of the preparation, the steps 61, 71 are assisted; Figure 5 is a schematic diagram of the preparation, the step 62 is assisted; Figure 6 is a schematic diagram of the preparation, the step 63 is assisted; Figure 7 is a schematic diagram of the preparation, step 64; FIG. 8 is a schematic diagram of a manufacturing process of the second embodiment; FIG. 9 is a schematic view of the manufacturing process, and FIG. 10 is a schematic diagram for assisting the description of step 73; FIG. 11 is a schematic diagram of the manufacturing process, and FIG. And Figure 12 is a schematic diagram of the fabrication, with steps 75, 76 being aided.
1‧‧‧金屬板 1‧‧‧Metal sheet
11‧‧‧上表面 11‧‧‧ upper surface
12‧‧‧下表面 12‧‧‧ Lower surface
13‧‧‧凹壁 13‧‧‧ concave wall
131‧‧‧延伸空間 131‧‧‧Extension space
132‧‧‧貫孔 132‧‧‧through holes
133‧‧‧圍繞部 133‧‧‧ Surrounding
134‧‧‧平板部 134‧‧‧ flat section
2‧‧‧固定件 2‧‧‧Fixed parts
21‧‧‧止動塊部 21‧‧‧stop block
22‧‧‧桿部 22‧‧‧ pole
23‧‧‧倒勾部 23‧‧‧Back hook
3‧‧‧基板 3‧‧‧Substrate
4‧‧‧風扇 4‧‧‧Fan
5‧‧‧晶片組 5‧‧‧ Chipset
Claims (17)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104138388A TWI556713B (en) | 2015-11-20 | 2015-11-20 | A fixing device and a manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104138388A TWI556713B (en) | 2015-11-20 | 2015-11-20 | A fixing device and a manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI556713B true TWI556713B (en) | 2016-11-01 |
| TW201720269A TW201720269A (en) | 2017-06-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104138388A TWI556713B (en) | 2015-11-20 | 2015-11-20 | A fixing device and a manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI556713B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080043429A1 (en) * | 2006-08-16 | 2008-02-21 | Fujitsu Limited | Apparatus, data processing apparatus and heat radiating member |
| TW200826823A (en) * | 2006-12-08 | 2008-06-16 | Inventec Corp | Fixing apparatus |
| TWM411602U (en) * | 2011-04-28 | 2011-09-11 | Shu-Hui Wang | Positioning member of chip dissipater |
| TWM426993U (en) * | 2011-12-22 | 2012-04-11 | Asia Vital Components Co Ltd | Fixing structure of cooling module |
| TW201315360A (en) * | 2011-09-21 | 2013-04-01 | Foxconn Tech Co Ltd | Heat dissipation device |
| CN104717875A (en) * | 2013-12-17 | 2015-06-17 | 广达电脑股份有限公司 | Method for manufacturing heat radiation assembly |
| TWM503600U (en) * | 2015-02-12 | 2015-06-21 | Win Win Prec Ind Co Ltd | Back plate assembly and fastening structure |
-
2015
- 2015-11-20 TW TW104138388A patent/TWI556713B/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080043429A1 (en) * | 2006-08-16 | 2008-02-21 | Fujitsu Limited | Apparatus, data processing apparatus and heat radiating member |
| TW200826823A (en) * | 2006-12-08 | 2008-06-16 | Inventec Corp | Fixing apparatus |
| TWM411602U (en) * | 2011-04-28 | 2011-09-11 | Shu-Hui Wang | Positioning member of chip dissipater |
| TW201315360A (en) * | 2011-09-21 | 2013-04-01 | Foxconn Tech Co Ltd | Heat dissipation device |
| TWM426993U (en) * | 2011-12-22 | 2012-04-11 | Asia Vital Components Co Ltd | Fixing structure of cooling module |
| CN104717875A (en) * | 2013-12-17 | 2015-06-17 | 广达电脑股份有限公司 | Method for manufacturing heat radiation assembly |
| TWM503600U (en) * | 2015-02-12 | 2015-06-21 | Win Win Prec Ind Co Ltd | Back plate assembly and fastening structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201720269A (en) | 2017-06-01 |
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