200826823 IPD060746TW 22648twf.doc/006 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種固定裝置，且特別是有關於一種 用以固定散熱器於電子裝置上的固定裝置。 【先前技術】 一般電腦的主機板上安裝有多個晶片，例如基本輸出 輸入系統（basic input/output system，BIOS )晶片、南橋晶 f f 片（south bridge)、中央處理器（central processing unit， CPU)等。為了避免晶片過熱而導致電路故障，習知技術 在晶片的表面貼附一散熱器來協助晶片散熱。由於散熱器 是以導熱良好的金屬片製作且整個覆蓋在晶片上，因此可 藉由接地彈片鎖固在主機板上並接地，以使晶片藉由金屬 的屏蔽效應來防止電磁波的干擾。 圖1為一種習知散熱器的固定裝置之剖示圖。散熱器 8〇復盍在安裝於晶片座64上之晶片50的背面以吸收晶片 G 5〇的廢熱，而固定裝置1〇〇用以將散熱器8〇鎖固在主機 板60上，並與主機板60上的銅墊62電性連接。固定裝置 100包括一彈片110以及多個鎖固件120,而彈片11〇具有 一壓扣部112用以將散熱器80壓扣於晶片50上。壓扣部 U2之邊緣垂直向下延伸出多個連接部114，而各連接部 么4水平向外延伸出一接觸部116。各接觸部116分別與主 ，板6〇上的多個銅墊62相接觸並電性連接，而銅墊62 電性連接至主機板60之一接地端（圖未示）以使晶片5〇 不易X外界電磁波干擾。此外，接觸部116各具有一第一 200826823 jl^l>U5U/46TW 22648twf.doc/006 貫孔116a，而銅墊62各具有一對應第一貫孔n6a之固定 孔62a，鎖固件120穿設於第一貫孔1163及相對應的固定 孔62a中，將散熱器80固定在主機板上。200826823 IPD060746TW 22648twf.doc/006 IX. Description of the Invention: [Technical Field] The present invention relates to a fixing device, and more particularly to a fixing device for fixing a heat sink to an electronic device. [Prior Art] A plurality of chips are mounted on a motherboard of a general computer, such as a basic input/output system (BIOS) chip, a south bridge, a central processing unit (CPU). )Wait. In order to avoid circuit failure caused by overheating of the wafer, conventional techniques attach a heat sink to the surface of the wafer to assist in heat dissipation of the wafer. Since the heat sink is made of a metal sheet with good heat conductivity and is entirely covered on the wafer, it can be grounded on the motherboard by a grounding spring and grounded so that the wafer can be prevented from electromagnetic interference by the shielding effect of the metal. 1 is a cross-sectional view of a conventional fixture for a heat sink. The heat sink 8 is rewound on the back surface of the wafer 50 mounted on the wafer holder 64 to absorb the waste heat of the wafer G 5 , and the fixing device 1 is used to lock the heat sink 8 在 on the motherboard 60 and The copper pads 62 on the motherboard 60 are electrically connected. The fixing device 100 includes a resilient piece 110 and a plurality of locking members 120, and the elastic piece 11b has a pressing portion 112 for pressing the heat sink 80 against the wafer 50. The edge of the pressing portion U2 extends vertically downwardly from the plurality of connecting portions 114, and each of the connecting portions 4 extends outwardly from a contact portion 116. Each of the contact portions 116 is in contact with and electrically connected to the plurality of copper pads 62 on the main board 6 , and the copper pads 62 are electrically connected to one of the ground ends of the motherboard 60 (not shown) to make the wafer 5 It is not easy to X external electromagnetic interference. In addition, the contact portions 116 each have a first 200826823 jl^l>U5U/46TW 22648twf.doc/006 through hole 116a, and the copper pads 62 each have a fixing hole 62a corresponding to the first through hole n6a, and the locking member 120 is disposed. The heat sink 80 is fixed to the main board in the first through hole 1163 and the corresponding fixing hole 62a.
在組裝固定裝置100時，固定裝置需以一鎖固工 具70將鎖固件120鎖固於第一貫孔U6a以及固定孔62a 中。但因第一貫孔116a的位置較壓扣部112低，為了避免 鎖固工具70在鎖固鎖固件12〇時會受到壓扣部112以及連 接部114的干擾而無法正常運作，銅墊62就必需配置在遠 離晶片50的位置而浪費主機板6〇上的配線空間。現在主 $板為了小型化，而使、線路密度愈來愈冑，可利用的配線 空間愈來愈少。因此，如何改善習知賴定裝置以有效的 利用主機板上的配線空間成為—個重要的課題。 【發明内容】 本發明提供一種固定裝置，其應用在將散熱器固定於 主機板上，可提高使主機板之配線空_使用效率。 小一為解決上述問題，本發明提出一種固定裝置，包括至 2彈片以及多個固定件。彈片具有—壓扣部以及分別與 =扣部相連的多_摺部，其帽扣部具有多個第-貫 ’而内摺部位於壓扣部下方對應於第—貫孔處，且各内 於第—貫孔設置之—第二貫孔。固定件穿設 力^二弟一貝孔以及與該些第一貫孔相對應之該些第二貫 孔中。 片 ，本發明之_實施例中，上述固定裝置更包括一支撐 ，、具有對應於第一貫孔以及第二貫孔設置的多個固定 200826823 IPD060746TW 22648twf.doc/006 孔’而該些in定件可穿設於該些第—貫孔及該些第二 而固定於該些固定孔中。 一一貝札 在本發明之一實施例中 為一體成形。 上述彈片的壓扣部與内摺部 本發明之固定裝置將第—貫孔設置於壓扣部上，因此 在使用鎖心具鎖_絲置時，顧卫具位於彈片的上 方而不會受到彈片的干擾。如此，在設置第—貫孔時，不When the fixing device 100 is assembled, the fixing device needs to lock the locking member 120 in the first through hole U6a and the fixing hole 62a by a locking tool 70. However, since the position of the first through hole 116a is lower than that of the pressing portion 112, in order to prevent the locking tool 70 from being interfered by the pressing portion 112 and the connecting portion 114 when the locking device 12 is locked, the copper pad 62 cannot be operated normally. It is necessary to dispose the wiring space on the motherboard 6A at a position away from the wafer 50. Nowadays, in order to miniaturize the main board, the line density is getting more and more, and the available wiring space is getting less and less. Therefore, how to improve the conventional sizing device to effectively utilize the wiring space on the main board becomes an important issue. SUMMARY OF THE INVENTION The present invention provides a fixing device which is used for fixing a heat sink to a motherboard, thereby improving wiring efficiency of the motherboard. In order to solve the above problems, the present invention provides a fixing device comprising to two elastic pieces and a plurality of fixing members. The elastic piece has a press-fitting portion and a plurality of fold portions respectively connected to the buckle portion, wherein the cap buckle portion has a plurality of first-through portions, and the inner fold portion is located below the press-button portion corresponding to the first through-hole, and each of the inner portions The second through hole is disposed in the first through hole. The fixing member is disposed in the second hole and the second through hole corresponding to the first through holes. In the embodiment of the present invention, the fixing device further includes a support having a plurality of fixed 200826823 IPD060746TW 22648twf.doc/006 holes corresponding to the first through holes and the second through holes. The piece can be disposed in the first through hole and the second and fixed in the fixing holes. One-to-one Bezi is integrally formed in one embodiment of the invention. The pressing portion and the inner folding portion of the elastic piece of the present invention are provided with the first through hole on the pressing portion, so that when the locking device is used, the cleaning device is located above the elastic piece without being subjected to The interference of the shrapnel. So, when setting the first through hole, not
u 需預留讓鎖固工具鎖固的空間。相較於習知固定裝置，本 發明之固定裝置可將散熱器固定於晶片上時，域板上的 銅墊可設置於距離晶片較近的㈣，使得域板上的 t右强柹。 ' 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 、圖2為本發明一實施例之固定裝置的正面視圖，圖3 為圖2中固定裝置應用於晶片及主機板上之立體示意圖， H圖2中固定裝置顧於晶片及主機板上的剖面圖。 凊參照圖2、圖3以及圖4,以下以固定裝置200將散熱器 420固定於主機板4〇〇上為例說明。散熱器42〇為一金屬 1，其覆蓋在晶片座430上並與晶片300背面接觸。散熱 器420可藉由熱導管44〇將廢熱傳導至風扇45〇的出風 口 ’以降低晶片3〇〇的溫度。 固定裝置200具有一彈片21〇以及多個固定件22〇， 其中彈片210可為一金屬片，且彈片21〇具有一壓扣部212 200826823 JUPD06U746TW 22648twf.doc/006 以及多個内摺部214。壓扣部212壓扣於晶片300上方之 散熱器420，使散熱器420固定於晶片座43〇上，而内摺 部214由壓扣部212的邊緣延伸至壓扣部212的下方，且 内摺部214與壓扣部212可為一體成形，其形狀例如是〔 子型。内摺部214與主機板400上的銅墊41〇接觸並電性 連接，而銅墊410電性連接到一接地端（圖未示），如此 彈片210可接地以使散熱器420產生金屬屏蔽的功效，以 避免晶片300受到電磁波干擾。 ( 此外，壓扣部212具有多個第一貫孔212a，而各内摺 部214分別具有對應於第一貫孔212a之一第二貫孔 214a，且主機板400上之銅墊410可具有多個第三貫孔 412，而且固定件22〇穿設於第一貫孔212a及第二貫孔 214a中以將政熱裔420固定在主機板4〇〇上。固定件220 例如疋螺絲，而第三貫孔412内則可具有與固定件22〇相 配合的螺紋’且固定件220穿設於第一貫孔212a與第二貫 孔214a中，並螺鎖於第三貫孔412中。值得注意的是，在 U 本實施例中，第一貫孔212a、第二貫孔214a、第三貫孔 412以及固定件220皆以兩個為例說明，但本領域的技術 人員亦可使用三個或三個以上的第一貫孔212a、第二貫孔 214a、第三貫孔412以及固定件220，本發明並不對此加 以限制。 由於第一貫孔212a設置於壓扣部212上，因此在鎖 固彈片210時，鎖固工具位於彈片21〇的上方而不會受到 彈片210的干擾。如此，在設置第一貫孔212&時，不需預 200826823 IPD060746TW 22648twf.doc/006 留讓鎖固工具鎖固的空間，也就是說，對應第一貫孔212a 的第三貫孔412可以設置在主機板400上距離晶片300較 近的位置。因此，主機板400上之銅墊410亦可設置於距 離晶片300較近的位置，使得主機板400上的配線更有彈 性0 在本實施例中，固定裝置200更可具有一支撐件230, 支撐件230配置於主機板400上與晶片300相對的另外一 面（底面），且支撐件230具有多個固定孔232,其中固 疋孔232對應於第三貫孔412設置，而固定件220可穿設 於第一貫孔212a、第二貫孔214a、第三貫孔412以及固定 孔232中以固定散熱器420以及主機板400。支撐件230 可加強主機板400的結構，以避免晶片300受到外力破壞。 此外，固定裝置200更可具有一固定片24〇，固定片24〇 配置於彈片210上，用以輔助固定彈片21〇，使彈片21〇 可更穩固的壓扣於晶片3〇〇上。 综上所述，本發明之固定裝置與習知技術相較之下至 少具有下列優點： 〜壯1·由於將第一貫孔設置於壓扣部上，因此在鎖固時固 置，，鎖固具可位於彈片的上方。如此，在設置第 二孔日守，不需預留讓鎖固工具鎖固的空間，而使對應第 二貫孔的第三貫孔可以設置在主機板上距離晶片較近的位 。因此，主機板上之銅墊亦可設置於距離晶片較近的位 ，使得主機板上的配線更有彈性。 2·彈片與主機板上接地的銅墊接觸並電性連接，因此 200826823 1PD060746TW 22648twf.doc/006 散熱裔可產生金屬屏蔽的功效，以避免晶片受到電磁波干 擾。 3.固定裝置具有-支樓件，可加強主機板的結構，避 免晶片受外力破壞。 —雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明之精神和範圍内，當可作些許之 C =本發明之保護範圍當視後附之申請專利範嶋定者 圖式簡單說明】 圖1為一種習知的固定裝置之剖示圖。 示意圖 圖2為本發明—實施例之固定裝置的正面視圖。 ^為圖2中固定裝置應料w及主機板上之 圖 圖4為圖2中固絲置細於晶片及錢板上的剖面 【主要元件符號說明】 5〇 :晶片 60 :主機板 62 :銅塾 62a :固定孔 64 ·晶片座 200826823 IPD060746TW 22648twf.doc/006 70 :鎖固工具 80:散熱器 100 :固定裝置 110 :彈片 112 :壓扣部 114 :連接部 116 :接觸部 116a ··第一貫孔 120 :鎖固件 200 :固定裝置 210 :彈片 212 :壓扣部 214 :内摺部 212a :第一貫孔 214a ··第二貫孔 220 :固定件 230 :支撐件 232 :固定孔 240 :固定片 300 :晶片 400 :主機板 410 :銅墊 412 :第三貫孔 420 :散熱器 200826823 IPD060746TW 22648twf.doc/006 430 :晶片座 440 :熱導管 450 :風扇 12u Reserve space for the locking tool to be locked. Compared with the conventional fixing device, when the fixing device of the present invention can fix the heat sink on the wafer, the copper pad on the domain plate can be disposed closer to the wafer (4), so that the t-right on the domain plate is strong. The above described features and advantages of the present invention will be more apparent from the following description. 2 is a front view of a fixing device according to an embodiment of the present invention, and FIG. 3 is a perspective view of the fixing device of FIG. 2 applied to a wafer and a motherboard. Sectional view on the board. Referring to Fig. 2, Fig. 3 and Fig. 4, the fixing device 200 will be described below by fixing the heat sink 420 to the motherboard 4A. The heat sink 42 is a metal 1, which is covered on the wafer holder 430 and is in contact with the back surface of the wafer 300. The heat sink 420 can conduct waste heat to the air outlet □ of the fan 45 藉 through the heat pipe 44 以 to lower the temperature of the wafer 3 。. The fixing device 200 has a resilient piece 21〇 and a plurality of fixing members 22〇. The elastic piece 210 can be a metal piece, and the elastic piece 21〇 has a pressing portion 212200826823 JUPD06U746TW 22648twf.doc/006 and a plurality of inner folds 214. The pressing portion 212 is pressed against the heat sink 420 above the wafer 300 to fix the heat sink 420 on the wafer holder 43 , and the inner folded portion 214 extends from the edge of the pressing portion 212 to below the pressing portion 212 , and The folded portion 214 and the pressing portion 212 may be integrally formed, and the shape thereof is, for example, a [subtype. The inner folded portion 214 is in contact with and electrically connected to the copper pad 41 on the motherboard 400, and the copper pad 410 is electrically connected to a ground end (not shown), so that the elastic piece 210 can be grounded to cause the heat sink 420 to be metal-shielded. The effect is to prevent the wafer 300 from being disturbed by electromagnetic waves. In addition, the pressing portion 212 has a plurality of first through holes 212a, and each of the inner folded portions 214 has a second through hole 214a corresponding to one of the first through holes 212a, and the copper pad 410 on the motherboard 400 may have a plurality of third through holes 412, and the fixing member 22 is disposed in the first through hole 212a and the second through hole 214a to fix the political heat 420 on the motherboard 4. The fixing member 220 is, for example, a screw. The third through hole 412 can have a thread matching with the fixing member 22 且 and the fixing member 220 is disposed in the first through hole 212 a and the second through hole 214 a and is screwed into the third through hole 412 . It should be noted that in the present embodiment, the first through hole 212a, the second through hole 214a, the third through hole 412, and the fixing member 220 are exemplified by two, but those skilled in the art may also The first through hole 212a, the second through hole 214a, the third through hole 412, and the fixing member 220 are used in the present invention. The first through hole 212a is disposed in the pressing portion 212. Therefore, when the elastic piece 210 is locked, the locking tool is located above the elastic piece 21〇 without being interfered by the elastic piece 210. When the first through hole 212 & is set, it is not necessary to pre-200826823 IPD060746TW 22648twf.doc/006 to allow the locking tool to lock the space, that is, the third through hole 412 corresponding to the first through hole 212a can be set in The motherboard 400 is located closer to the wafer 300. Therefore, the copper pad 410 on the motherboard 400 can also be disposed closer to the wafer 300, so that the wiring on the motherboard 400 is more flexible. 0 In this embodiment The fixing device 200 further has a supporting member 230 disposed on the other side (bottom surface) of the motherboard 400 opposite to the wafer 300, and the supporting member 230 has a plurality of fixing holes 232, wherein the fixing holes 232 correspond to The third through hole 412 is disposed, and the fixing member 220 can be disposed in the first through hole 212a, the second through hole 214a, the third through hole 412, and the fixing hole 232 to fix the heat sink 420 and the motherboard 400. The support member 230 The structure of the motherboard 400 can be reinforced to prevent the wafer 300 from being damaged by external force. In addition, the fixing device 200 can further have a fixing piece 24〇 disposed on the elastic piece 210 for assisting the fixing of the elastic piece 21〇, so that the elastic piece 21〇 can be more stable In the above, the fixing device of the present invention has at least the following advantages compared with the prior art: ~ Zhuang 1 · Since the first through hole is disposed on the pressing portion, Therefore, when the lock is fixed, the lock can be located above the elastic piece. Thus, in the second hole, the space for locking the locking tool is not reserved, and the second corresponding hole is required. The three through holes can be placed on the motherboard closer to the wafer. Therefore, the copper pad on the motherboard can also be placed closer to the chip, making the wiring on the motherboard more flexible. 2. The shrapnel is in contact with and electrically connected to the grounded copper pad on the motherboard. Therefore, the heat sink can produce a metal shield to prevent the chip from being disturbed by electromagnetic waves. 3. The fixing device has a - branch member that can strengthen the structure of the main board to prevent the wafer from being damaged by external force. The present invention has been described above by way of a preferred embodiment, and is not intended to limit the invention, and any one of ordinary skill in the art can make some C = without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a conventional fixing device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2 is a front elevational view of the fixing device of the present invention. ^ is the figure of the fixing device in FIG. 2 and the board on the motherboard. FIG. 4 is a section in which the fixing wire of FIG. 2 is thinner on the wafer and the money board. [Main component symbol description] 5: Wafer 60: Motherboard 62: Brass 62a: fixing hole 64 · wafer holder 200826823 IPD060746TW 22648twf.doc/006 70: locking tool 80: heat sink 100: fixing device 110: elastic piece 112: pressing portion 114: connecting portion 116: contact portion 116a ·· Consistent hole 120: Locking device 200: Fixing device 210: Shrapnel 212: Pressing portion 214: Inner folding portion 212a: First through hole 214a · Second through hole 220: Fixing member 230: Supporting member 232: Fixing hole 240 : Fixed piece 300 : Wafer 400 : Motherboard 410 : Copper pad 412 : Third through hole 420 : Radiator 200826823 IPD060746TW 22648twf.doc / 006 430 : Wafer holder 440 : Heat pipe 450 : Fan 12