TWM543532U - Heat dissipation module - Google Patents
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- TWM543532U TWM543532U TW106201980U TW106201980U TWM543532U TW M543532 U TWM543532 U TW M543532U TW 106201980 U TW106201980 U TW 106201980U TW 106201980 U TW106201980 U TW 106201980U TW M543532 U TWM543532 U TW M543532U
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Description
本創作係有關於一種散熱模組,尤指一種用於電路板之散熱模組。The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for a circuit board.
隨著電子產業的快速發展,設置於電路板上的晶片的運算量提高,加速了資訊處理功能,然高速運算之晶片則會產生大量的熱能。若不加以適當地散熱,電路板的穩定度及運作效率下降,甚至可能過熱而失效,因此,電路板的散熱相當重要。一般而言,常利用散熱鰭片或風扇來維持電路板的溫度使得該電路板能穩定地運作。With the rapid development of the electronics industry, the amount of computation of the wafers disposed on the circuit board is increased, and the information processing function is accelerated. However, the high-speed computing wafer generates a large amount of thermal energy. If the heat is not properly dissipated, the stability and operating efficiency of the board are degraded, and even the overheating may fail. Therefore, the heat dissipation of the board is very important. In general, heat sink fins or fans are often used to maintain the temperature of the board so that the board can operate stably.
第一圖係繪示習知的電路板及散熱模組,散熱模組用於協助電路板1散熱。該散熱模組包括一基板2’以及一鰭片組3,該基板2’係設於該電路板1上方,而該鰭片組3則設置於該基板2’上方。該基板2’係與該電路板的主要元件11(如中央處理器及晶片組)接觸,故由主要元件11所產生的熱能可傳遞至該基板2’並藉由該基板2’傳遞至該鰭片組3,進而由該鰭片組3散熱置外部。The first figure shows a conventional circuit board and a heat dissipation module, and the heat dissipation module is used to assist the circuit board 1 to dissipate heat. The heat dissipation module includes a substrate 2' and a fin set 3, the substrate 2' is disposed above the circuit board 1, and the fin set 3 is disposed above the substrate 2'. The substrate 2' is in contact with the main components 11 of the circuit board (such as a central processing unit and a chipset), so that thermal energy generated by the main component 11 can be transferred to the substrate 2' and transmitted to the substrate 2'. The fin group 3 is further radiated to the outside by the fin group 3.
然而,電路板上若安裝有可拆卸元件12(如記憶體模組),若欲更換或移除該可拆卸元件12時,則需移除散熱模組,且通常該基板2’與該主要元件11接觸處塗覆有散熱膏,一旦移除了散熱模組,則散熱膏也需重新塗佈,更換可拆卸元件12的程序極為複雜。此外,電路板上除了主要元件11 以外,其他元件(如記憶體模組及電源元件)亦需要散熱,故對於有風扇的散熱器而言,由於基板的存在,氣流無法直接吹到該些元件,而影響其散熱效能。However, if a detachable component 12 (such as a memory module) is mounted on the circuit board, if the detachable component 12 is to be replaced or removed, the heat dissipation module needs to be removed, and usually the substrate 2' and the main The contact of the component 11 is coated with a thermal grease. Once the thermal module is removed, the thermal grease is also recoated, and the procedure for replacing the detachable component 12 is extremely complicated. In addition, in addition to the main component 11 on the circuit board, other components (such as the memory module and the power supply component) also need to dissipate heat. Therefore, for a fan-mounted heat sink, the airflow cannot be directly blown to the components due to the presence of the substrate. And affect its heat dissipation performance.
因此,目前急需一種新穎的散熱模組,可依據電路板的類型而組配散熱模組,且簡化替換可拆卸元件的程序。Therefore, there is an urgent need for a novel heat dissipation module that can be combined with a heat dissipation module depending on the type of circuit board, and simplifies the process of replacing the detachable component.
為了達到上述之目的,本創作提供了一種散熱模組,以解決習知電路板於組裝散熱模組後,難以替換電路板上可拆卸元件之問題。In order to achieve the above purpose, the present invention provides a heat dissipation module to solve the problem that the conventional circuit board is difficult to replace the detachable components on the circuit board after assembling the heat dissipation module.
本創作所提供之散熱模組係用於一電路板,該電路板包括一主要元件以及一可拆卸元件,而該散熱模組包括:一框架,疊置於該電路板上,該框架具有一第一開口、以及一第二開口,其中,該第一開口係對應該主要元件,以及該第二開口係對應該可拆卸元件;以及,一散熱器,對應該第一開口而設置於該框架,並與該主要元件接觸。The heat dissipation module provided by the present invention is used for a circuit board, the circuit board includes a main component and a detachable component, and the heat dissipation module includes: a frame stacked on the circuit board, the frame has a a first opening, and a second opening, wherein the first opening corresponds to the main component, and the second opening corresponds to the detachable component; and a heat sink corresponding to the first opening is disposed on the frame And in contact with the main component.
於本創作之一實施態樣中,該框架更包括複數個固定柱,其係固鎖於該電路板上對應之複數個螺孔,使得該框架疊置於該電路板上時,彼此之間以所述固定柱而維持一距離。其中,該電路板上之複數個螺孔的位置係根據各種類的電路板的規格而定,且再藉由電路板的螺孔位置而設置框架上所述固定柱。所述固定柱之長度可視該散熱器所設置的位置而定,該框架與該電路板的距離應使得該散熱器可接觸該主要元件。In one embodiment of the present invention, the frame further includes a plurality of fixing posts that are locked to the corresponding plurality of screw holes on the circuit board such that the frames are stacked on the circuit board Maintain a distance with the fixed column. Wherein, the positions of the plurality of screw holes on the circuit board are determined according to the specifications of various types of circuit boards, and the fixing posts on the frame are further disposed by the screw hole positions of the circuit boards. The length of the fixing post may depend on the position at which the heat sink is disposed, and the frame is spaced from the circuit board such that the heat sink can contact the main component.
於本創作之其他實施態樣中,該框架上之該第一開口以及該第二開口的形狀及大小應視該電路板的類型及其而定,並無特別的限制,只要該第一開口係對應該主要元件,該第二開口係對應該可拆卸元件,且該可拆卸元件可由該第二開口顯露即可。此外,於本創作之一實施態樣中,該第一開口與該第二開口係彼此連通或不連通,且該可拆卸元件係自該第二開口顯露,故藉此可經由該第二開口而自該電路板上更換或卸除該可拆卸元件。In other implementations of the present invention, the shape and size of the first opening and the second opening on the frame are determined according to the type of the circuit board and are not particularly limited as long as the first opening Corresponding to the main component, the second opening corresponds to the detachable component, and the detachable component can be exposed by the second opening. In one embodiment of the present invention, the first opening and the second opening are connected or disconnected from each other, and the detachable component is exposed from the second opening, thereby thereby passing through the second opening The detachable component is replaced or removed from the circuit board.
於一較佳實施態樣中,該散熱器係對應該第一開口並設置於該框架之上方或下方。該散熱器較佳係包括一導熱片以及一鰭片組,該導熱片係與該主要元件接觸,而該鰭片組係與該導熱片連接且彼此熱導通。若該散熱器係設置於該框架之上方,則該散熱器之該導熱片,或者該導熱片以及該鰭片組係應穿過該第一開口而與該主要元件接觸。而該主要元件所產生的熱能可藉由該導熱片而傳導至該鰭片組。於本創作中,該鰭片組較佳係由銅所製成,而該鰭片組的態樣並無特別的限制,只要是本領域中使用的鰭片組即可。In a preferred embodiment, the heat sink corresponds to the first opening and is disposed above or below the frame. The heat sink preferably includes a heat conducting sheet and a fin set, the heat conducting sheet being in contact with the main element, and the fin set is connected to the heat conducting sheet and thermally conductive to each other. If the heat sink is disposed above the frame, the heat conductive sheet of the heat sink, or the heat conductive sheet and the fin assembly, should pass through the first opening to be in contact with the main component. The thermal energy generated by the main component can be conducted to the fin set by the thermal pad. In the present creation, the fin group is preferably made of copper, and the aspect of the fin group is not particularly limited as long as it is a fin group used in the art.
於另一較佳實施態樣中,該散熱模組可更包括一風扇,設置於該散熱器之上方,且提供一氣流,朝向該鰭片組以及該主要元件的方向吹送。此外,該氣流可流向該電路板的其他元件上,包括一部分流向該可拆卸元件,以提供散熱功效。In another preferred embodiment, the heat dissipation module further includes a fan disposed above the heat sink and providing an air flow for blowing toward the fin set and the main component. In addition, the airflow can flow to other components of the circuit board, including a portion of the flow to the detachable component to provide heat dissipation.
於一較佳實施態樣中,當該散熱器係設置於該框架之下方時,該風扇係設置於該散熱器與該框架之間,或設置於該框架之上方。而當該散熱器設置於該框架之下方且該風扇設置於該框架之上方時,該散熱器與該風扇之間則具有一間隙。該間隙較佳係介於2~5毫米之間,且實質上係相當於該框架之一厚度。該散熱器與該風扇之間保持該間隙可降低該散熱模組於運作時的風切聲。In a preferred embodiment, when the heat sink is disposed under the frame, the fan is disposed between the heat sink and the frame or above the frame. When the heat sink is disposed below the frame and the fan is disposed above the frame, there is a gap between the heat sink and the fan. The gap is preferably between 2 and 5 mm and is substantially equivalent to one of the thicknesses of the frame. The gap between the heat sink and the fan can reduce the wind cut sound of the heat dissipation module during operation.
另外,於本創作之一實施態樣中,該電路板上之該主要元件可為一中央處理器、一晶片、或其他高速運算之元件,而該可拆卸元件係一記憶體模阻。舉例而言,該電路板可為一COM Express基板,其中該主要元件係一中央處理器,而該可拆卸元件可為插槽式記憶體模組。In addition, in one embodiment of the present invention, the main component on the circuit board can be a central processing unit, a chip, or other high-speed computing component, and the detachable component is a memory mold. For example, the circuit board can be a COM Express substrate, wherein the main component is a central processing unit, and the detachable component can be a slot memory module.
綜上,本創作所提供之散熱模組可有效率地散熱,且藉由該框架之該第二開口,於拆卸或替換該可拆卸元件時不需將整個散熱模組移除後再進行更換,僅需由該第二開口處直接拆卸電路板上的可拆卸元件,可解決習知難以替換電路板上可拆卸元件之問題。In summary, the heat dissipation module provided by the present invention can efficiently dissipate heat, and the second opening of the frame can be used to remove or replace the detachable component without removing the entire heat dissipation module. It is only necessary to directly disassemble the detachable component on the circuit board from the second opening, which solves the problem that it is difficult to replace the detachable component on the circuit board.
此技藝之人士可由本說明書所揭示之內容輕易地了解本創作之其他優點與功效。惟需注意的是,以下圖式均為簡化之示意圖,圖式中之元件數目、形狀及尺寸可依實際實施狀況而隨意變更,且元件佈局狀態可更為複雜。本創作亦可藉由其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本創作之精神下進行各種修飾與變更。Those skilled in the art can readily appreciate other advantages and effects of the present disclosure from the disclosure herein. It should be noted that the following drawings are simplified schematic diagrams. The number, shape and size of components in the drawings can be changed arbitrarily according to actual implementation conditions, and the component layout state can be more complicated. The present invention can also be implemented or applied by various other specific embodiments. The details of the present specification can also be modified and changed without departing from the spirit of the present invention.
[實施例1][Example 1]
本實施例之散熱模組1000係如第二圖之立體圖以及第三圖之***圖所示,其係裝設於一電路板1上。該散熱模組1000主要包括一框架2、一散熱器3、以及一風扇4。其中,該電路板1包括一主要元件11以及一可拆卸元件12;而該框架2係架設於該電路板1上方,並具有一第一開口21、以及一第二開口22,該第一開口21係對應該主要元件11,而該第二開口22係對應該可拆卸元件12;該散熱器3係設置於該框架2之下方,請參照第四圖所述之該散熱裝置之底面,該散熱器3包含一鰭片組31以及一導熱片32,該散熱器3之導熱片32係用以與該主要元件11接觸,將熱傳遞至該鰭片組31以達到散熱的功效;再者,該風扇4係設置於該框架2之上方,該風扇4係藉由該框架2與該與該散熱器3間隔開來,並具有一3毫米之間隙D。The heat dissipation module 1000 of the present embodiment is mounted on a circuit board 1 as shown in the perspective view of the second figure and the exploded view of the third figure. The heat dissipation module 1000 mainly includes a frame 2, a heat sink 3, and a fan 4. The circuit board 1 includes a main component 11 and a detachable component 12; and the frame 2 is mounted on the circuit board 1 and has a first opening 21 and a second opening 22, the first opening 21 is corresponding to the main component 11, and the second opening 22 is corresponding to the detachable component 12; the heat sink 3 is disposed under the frame 2, please refer to the bottom surface of the heat dissipating device described in the fourth figure, The heat sink 3 includes a fin set 31 and a heat conducting sheet 32. The heat conducting sheet 32 of the heat sink 3 is used to contact the main component 11 to transfer heat to the fin set 31 for heat dissipation. The fan 4 is disposed above the frame 2. The fan 4 is spaced apart from the heat sink 3 by the frame 2 and has a gap D of 3 mm.
於本實施例中,該電路板1係一COM Express基板,故其主要元件11係發出較大熱能之中央處理器,而其可拆卸元件12係一記憶體模組,然本創作並不受限於COM Express基板,可為任一種同時具有主要元件11及可拆卸元件12之電路板。In this embodiment, the circuit board 1 is a COM Express substrate, so that the main component 11 is a central processor that emits a large amount of thermal energy, and the detachable component 12 is a memory module, but the creation is not Limited to the COM Express substrate, it can be any circuit board having both the main component 11 and the detachable component 12.
更詳細而言,該框架2係利用四個鎖固件23而鎖固於該電路板1之上方,該電路板1上具有四個對應鎖固件23之螺孔13,且該框架2與該電路板1彼此不接觸。如圖所示,該些螺孔13係以不完全對稱的方式配置,其位置係遵照COM Express基板之規範,通常用來鎖固習知的散熱基板,使得元件之間的組裝具有方向性,而於本實施例中則用來鎖固該框架2。該框架2上之該第一開口21以及該第二開口22之間係彼此相連通,而該框架2上之該第一開口21與該第二開口22的交界處更具有二凸板24,可供該散熱器3以及該風扇4各自由相反方向設置於該框架2上,而該凸板24之厚度則等於該間隙D。In more detail, the frame 2 is locked above the circuit board 1 by means of four locks 23 having four screw holes 13 corresponding to the locks 23, and the frame 2 and the circuit The plates 1 are not in contact with each other. As shown, the screw holes 13 are arranged in an incompletely symmetrical manner, the position of which is in accordance with the specifications of the COM Express substrate, and is generally used to lock a conventional heat dissipation substrate, so that the assembly between the components is directional. In the present embodiment, the frame 2 is locked. The first opening 21 and the second opening 22 of the frame 2 are connected to each other, and the boundary between the first opening 21 and the second opening 22 of the frame 2 has two convex plates 24, The heat sink 3 and the fan 4 are each disposed on the frame 2 in opposite directions, and the thickness of the convex plate 24 is equal to the gap D.
該散熱器3與該風扇4之間具有一間隙D可有效地減少該散熱模組1000於運作時的風切聲,避免產生噪音。The gap D between the heat sink 3 and the fan 4 can effectively reduce the wind cut sound of the heat dissipation module 1000 during operation and avoid noise.
另外,於本實施例中,該散熱器3之該鰭片組31係如第四圖所繪示以放射式排列,而其中央係連接該導熱片32,該導熱片32突出該鰭片組31,當該散熱模組1000設置於該電路板1上時,該導熱片32係與該電路板1之該主要元件11接觸以傳導熱能至該鰭片組31。再者,該風扇4更提供一氣流,朝向該散熱器3以及該主要元件11的方向吹送,可協助該散熱器3散熱,以增強對主要元件11散熱的效果。此外,該風扇4所提供的風流亦可部分流向該可拆卸元件12以及該電路板1上的其他元件,以提供整體電路板1的散熱功能。In addition, in the embodiment, the fin group 31 of the heat sink 3 is arranged in a radial manner as shown in the fourth figure, and the central portion is connected to the heat conducting sheet 32, and the heat conducting sheet 32 protrudes from the fin group. 31. When the heat dissipation module 1000 is disposed on the circuit board 1, the heat conductive sheet 32 is in contact with the main component 11 of the circuit board 1 to conduct thermal energy to the fin group 31. Moreover, the fan 4 further provides an air flow, which is blown toward the heat sink 3 and the main component 11 to assist the heat dissipation of the heat sink 3 to enhance the heat dissipation effect on the main component 11. In addition, the airflow provided by the fan 4 may also partially flow to the detachable component 12 and other components on the circuit board 1 to provide a heat dissipation function of the overall circuit board 1.
若欲更換該電路板上之該可拆卸元件12,使用者僅需於該第二開口22處移除該可拆卸元件12,不須將整體該散熱模組1000拆除。If the detachable component 12 on the circuit board is to be replaced, the user only needs to remove the detachable component 12 at the second opening 22 without removing the heat dissipation module 1000 as a whole.
[實施例2][Embodiment 2]
請參照第五圖所示之散熱模組2000,本實施例之散熱模組2000大致上與實施例1相同,其不同在於,該散熱器3以及該風扇4皆設置於該框架2之上方,而該散熱器3之該導熱片31以及該鰭片組32係自該第一開口21向下方突出超過該框架2並接觸該主要元件11,以傳導該主要元件11所產生的熱能,而該風扇4係由該散熱器3上方提供氣流,朝向該鰭片組32以及該主要元件11的方向吹送,以有效地將該鰭片組32的熱能逸散。該風扇4所提供的風流亦可流向該可拆卸元件12以及該電路板1上的其他元件,以提供整體電路板1的散熱功能。Referring to the heat dissipation module 2000 shown in FIG. 5 , the heat dissipation module 2000 of the present embodiment is substantially the same as the first embodiment, except that the heat sink 3 and the fan 4 are disposed above the frame 2 . The heat conducting sheet 31 of the heat sink 3 and the fin set 32 protrude downward from the first opening 21 beyond the frame 2 and contact the main element 11 to conduct heat energy generated by the main element 11 . The fan 4 is supplied with airflow from above the heat sink 3, blowing toward the fin set 32 and the main element 11 to effectively dissipate the thermal energy of the fin set 32. The wind flow provided by the fan 4 can also flow to the detachable component 12 and other components on the circuit board 1 to provide the heat dissipation function of the overall circuit board 1.
[實施例3][Example 3]
請參照第六圖所示之散熱模組3000,本實施例之散熱模組3000大致上與實施例1相同,其不同在於,該散熱器3以及該風扇4皆設置於該框架2之下方,該散熱器3之該導熱片31係接觸該主要元件11,並將該主要元件11產生的熱能傳遞至該鰭片組32,而該風扇4係朝向該鰭片組32以及主要元件11的方向吹送,該風扇4所產生的風流可流向該可拆卸元件12以及該電路板1上的其他元件,以提供整體電路板1的散熱功能。The heat dissipation module 3000 of the present embodiment is substantially the same as the first embodiment except that the heat sink 3 and the fan 4 are disposed below the frame 2, The heat conducting sheet 31 of the heat sink 3 contacts the main element 11 and transfers thermal energy generated by the main element 11 to the fin set 32, and the fan 4 faces the fin set 32 and the main element 11 The air flow generated by the fan 4 can flow to the detachable component 12 and other components on the circuit board 1 to provide a heat dissipation function of the overall circuit board 1.
上述的實施例僅用來例舉本創作的實施態樣,以及闡釋本創作的技術特徵,並非用來限制本創作的保護範疇。任何熟悉此技術者可輕易完成的改變或均等性的安排均屬於本創作所主張的範圍,本創作的權利保護範圍應以申請專利範圍為準。The above-described embodiments are only used to exemplify the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present creation. Any change or equivalence that can be easily accomplished by those skilled in the art is within the scope of this creation. The scope of protection of this creation shall be subject to the scope of the patent application.
1000、2000、3000‧‧‧散熱模組
1‧‧‧電路板
11‧‧‧主要元件
12‧‧‧可拆卸元件
13‧‧‧螺孔
2‧‧‧框架
21‧‧‧第一開口
22‧‧‧第二開口
23‧‧‧鎖固件
24‧‧‧凸板
2’‧‧‧基板
3‧‧‧散熱器
31‧‧‧鰭片組
32‧‧‧導熱片
4‧‧‧風扇
D‧‧‧間隙1000, 2000, 3000‧‧‧ Thermal Module
1‧‧‧ boards
11‧‧‧ main components
12‧‧‧Removable components
13‧‧‧ screw holes
2‧‧‧Frame
21‧‧‧ first opening
22‧‧‧second opening
23‧‧‧Lock Firmware
24‧‧‧ convex plate
2'‧‧‧Substrate
3‧‧‧heatsink
31‧‧‧Fin group
32‧‧‧thermal sheet
4‧‧‧Fan
D‧‧‧ gap
第一圖係先前技術之電路板與散熱模組之***圖。 第二圖係本創作實施例1之散熱模組之立體圖。 第三圖係本創作實施例1之散熱模組之***圖。 第四圖係本創作實施例1之散熱模組之底視圖。 第五圖係本創作實施例2之散熱模組之立體圖。 第六圖係本創作實施例3之散熱模組之立體圖。The first figure is an exploded view of the prior art circuit board and heat sink module. The second figure is a perspective view of the heat dissipation module of the first embodiment of the present invention. The third figure is an exploded view of the heat dissipation module of the creation example 1 of the present invention. The fourth figure is a bottom view of the heat dissipation module of the creation example 1 of the present invention. The fifth figure is a perspective view of the heat dissipation module of the second embodiment of the present invention. The sixth drawing is a perspective view of the heat dissipation module of the third embodiment of the present invention.
1000‧‧‧散熱模組 1000‧‧‧ Thermal Module
1‧‧‧電路板 1‧‧‧ boards
12‧‧‧可拆卸元件 12‧‧‧Removable components
2‧‧‧框架 2‧‧‧Frame
3‧‧‧散熱器 3‧‧‧heatsink
4‧‧‧風扇 4‧‧‧Fan
Claims (14)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106201980U TWM543532U (en) | 2017-02-10 | 2017-02-10 | Heat dissipation module |
CN201721605619.0U CN207460724U (en) | 2017-02-10 | 2017-11-27 | Heat radiation module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106201980U TWM543532U (en) | 2017-02-10 | 2017-02-10 | Heat dissipation module |
Publications (1)
Publication Number | Publication Date |
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TWM543532U true TWM543532U (en) | 2017-06-11 |
Family
ID=59689765
Family Applications (1)
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TW106201980U TWM543532U (en) | 2017-02-10 | 2017-02-10 | Heat dissipation module |
Country Status (2)
Country | Link |
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CN (1) | CN207460724U (en) |
TW (1) | TWM543532U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI749838B (en) * | 2020-07-20 | 2021-12-11 | 南亞科技股份有限公司 | Electronic module |
-
2017
- 2017-02-10 TW TW106201980U patent/TWM543532U/en unknown
- 2017-11-27 CN CN201721605619.0U patent/CN207460724U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI749838B (en) * | 2020-07-20 | 2021-12-11 | 南亞科技股份有限公司 | Electronic module |
Also Published As
Publication number | Publication date |
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CN207460724U (en) | 2018-06-05 |
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