TWI537574B - Method for correction of electronic components - Google Patents
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- TWI537574B TWI537574B TW104129933A TW104129933A TWI537574B TW I537574 B TWI537574 B TW I537574B TW 104129933 A TW104129933 A TW 104129933A TW 104129933 A TW104129933 A TW 104129933A TW I537574 B TWI537574 B TW I537574B
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Description
本發明係提供一種可取得測試座之配置誤差值，以及拾取器上之電子元件偏移誤差值，並以控制器控制拾取器於移載電子元件之移料路徑中作配置誤差值及偏移誤差值之補償校正，使拾取器將電子元件準確對位置入於測試座，進而提升移料準確性及測試品質之電子元件移料校正方法。 The invention provides a configuration error value of the test socket and an electronic component offset error value on the pickup, and the controller controls the pickup to make a configuration error value and offset in the transfer path of the transfer electronic component. The compensation correction of the error value enables the pickup to accurately position the electronic component into the test socket, thereby improving the accuracy of the material transfer and the quality of the electronic component.
在現今，電子元件積極朝向精巧輕薄之設計發展，相對使得電子元件之複數個接點的間距變得更加微小，以致移料機構之拾取器將電子元件之接點對位於測試座之探針的精準度要求相當高，若精準度稍有偏差，即使得電子元件無法於測試座內確實執行測試作業，因而降低測試品質；然目前影響電子元件之接點與測試座之探針二者對位精準度的因素，除了拾取器於承置件(如供料載台)上取出偏移擺置之電子元件，使拾取器與電子元件間具有偏移誤差值外，由於測試不同型式之電子元件，即必需更換不同具測試座之電路板，若電路板上之測試座的配置位置具有偏差，即會影響電子元件之接點與測試座之探針的對位精準度，因此，如何使移料機構將電子元件之接點精準對位於測試座之探針相當重要。 Nowadays, electronic components are actively moving towards a delicate and light design, which makes the spacing of the plurality of contacts of the electronic component smaller, so that the pick-up of the transfer mechanism pairs the contacts of the electronic components with the probes of the test stand. The accuracy requirement is quite high. If the accuracy is slightly deviated, the electronic component can not perform the test operation in the test socket, thus reducing the test quality; however, the contact between the contact of the electronic component and the probe of the test socket is currently aligned. The accuracy factor, in addition to the pick-up device on the mounting member (such as the feeding stage) to take out the offset electronic components, so that the offset error between the pickup and the electronic components, due to testing different types of electronic components It is necessary to replace the circuit board with different test sockets. If the position of the test socket on the circuit board is deviated, it will affect the alignment accuracy of the contacts of the electronic components and the probes of the test socket. Therefore, how to make the shift The material mechanism is very important to accurately contact the contacts of the electronic components to the probes located in the test socket.
請參閱第1、2圖，其係為本申請人所申請之台灣發明專利第I465738號「電子元件作業單元、作業方法及其應用之作業設備」專利案，其作業單元10係於機台設有移載取放裝置11、測試區12、取像裝置13、對位調整裝置14及取樣比對裝置15，該移載取放裝置11係於測試區12之一側設有載送待測/已測電子元件之第一供料載台111及第一出料載台112，於測試區12之另一側設有載送待測/已測電子元件之第二供料載台113及第二出料載台114，另於測試區12之上方設有第一、二移載取放器115、116，用以移載電子元件，該測試區12係設有具複數支探針之測試座121，用以測試電子元件，該取像裝 置13係設有CCD取像器131，用以取像第一移載取放器115或第二移載取放器116上之電子元件，該對位調整裝置14係裝配於第一移載取放器115及第二移載取放器116上，用以調整電子元件之擺置位置，另該取樣比對裝置15係於測試區12之一側設置有動力機構151，動力機構151之活動桿1511係裝配有移動式取像器152，並以懸臂方式驅動移動式取像器152作伸縮位移，而可移動至測試區12之測試座121與第一移載取放器115或第二移載取放器116間，以同時取像測試座121及第一移載取放器115或第二移載取放器116上的電子元件，而獲得測試座121及電子元件間相對位置之取像資料，並將取像資料傳輸至取樣比對裝置15之控制器進行比對，以便執行電子元件與測試座121的對位調整，並將完成對位調整後之電子元件移載至CCD取像器131，而於取樣比對裝置15之資料庫建立校正部件配置樣本資料，當移載取放裝置11之第一移載取放器115於第一供料載台111上取出待測之電子元件，且移載至取像裝置13之CCD取像器131處取像，以獲得電子元件之即時影像資料，並將即時影像資料傳輸至取樣比對裝置15之資料庫，該取樣比對裝置15即與資料庫中之校正部件配置樣本資料進行比對，若具有誤差，則利用對位調整裝置14調整電子元件之擺置位置，使電子元件之接腳或錫球電性接觸測試座121之探針，進而有效執行測試作業；惟，於使用上具有如下缺失： Please refer to Figures 1 and 2, which are the patents of Taiwan Invention Patent No. I465738, "Electronic Component Operation Unit, Operation Method and Application Equipment", and the operation unit 10 is attached to the machine. There are a transfer pick-and-place device 11, a test area 12, an image taking device 13, a registration adjusting device 14, and a sampling comparison device 15, which is placed on one side of the test area 12 and is provided with a test to be tested. a first supply stage 111 and a first discharge stage 112 of the tested electronic component, and a second supply stage 113 for carrying the electronic component to be tested/tested on the other side of the test area 12 and The second discharge stage 114 is further provided with first and second transfer pickers 115, 116 above the test area 12 for transferring electronic components, and the test area 12 is provided with a plurality of probes. Test stand 121 for testing electronic components, the image capture device The 133 is provided with a CCD imager 131 for taking the electronic components on the first transfer pick-and-place device 115 or the second transfer pick-and-place device 116. The alignment adjusting device 14 is mounted on the first transfer. The pick-up device 115 and the second transfer pick-and-place device 116 are configured to adjust the position of the electronic component, and the sampling device 15 is disposed on one side of the test area 12 with a power mechanism 151, and the power mechanism 151 The movable rod 1511 is equipped with a movable image finder 152, and drives the movable image finder 152 in a cantilever manner for telescopic displacement, and can be moved to the test seat 121 of the test area 12 and the first transfer picker 115 or the first Two transfer handlers 116 are used to simultaneously take the electronic components on the test socket 121 and the first transfer handler 115 or the second transfer handler 116 to obtain the relative position between the test socket 121 and the electronic components. The image data is taken, and the image data is transmitted to the controller of the sampling comparison device 15 for performing alignment adjustment of the electronic component and the test socket 121, and transferring the electronic component after the alignment adjustment is completed to The CCD imager 131 establishes a calibration component configuration sample in the database of the sampling comparison device 15 The first transfer carrier 115 of the transfer pick-and-place device 11 takes out the electronic component to be tested on the first supply stage 111 and transfers it to the CCD imager 131 of the image capture device 13. For example, to obtain real-time image data of the electronic component, and transmit the real-time image data to the database of the sampling comparison device 15, the sampling comparison device 15 compares with the calibration component configuration sample data in the database, if The error is adjusted by the alignment adjusting device 14 to adjust the position of the electronic component so that the pin or the solder ball of the electronic component electrically contacts the probe of the test socket 121, thereby effectively performing the test operation; however, the following defects are used in use; :
1．該取樣比對裝置15之動力機構151以懸臂方式驅動移動式取像器152伸入於測試座121與第一移載取放器115或第二移載取放器116間之過程中，該動力機構151將會因本身機構的誤差或組裝上之誤差，導致移動式取像器152產生偏移，並無法準確取像測試座121與電子元件，以致取樣比對裝置15之資料庫內的樣本影像資料有誤，進而影響電子元件之校正作業，造成電子元件之接腳或錫球無法準確電性接觸測試座之探針的缺失。 1. The power mechanism 151 of the sampling comparison device 15 drives the movable image finder 152 in a cantilever manner to extend between the test socket 121 and the first transfer pick-and-placer 115 or the second transfer pick-and-placer 116. The power mechanism 151 will cause the mobile image pickup device 152 to be offset due to the error of the mechanism or the assembly error, and the image bearing unit 121 and the electronic component cannot be accurately taken, so that the sample comparison device 15 is in the database. The sample image data is incorrect, which in turn affects the calibration of the electronic components, resulting in the absence of accurate contact between the pins of the electronic components or the solder balls.
2．由於移載取放裝置11之第一移載取放器115及第二移載取放器116係位於測試區12之測試座121上方，並配置有對位調整裝置14及吸嘴等而具有較長之長度，導致取樣比對裝置15之移動式取像器152僅可於測試座121與第一移載取放器115或第二移載 取放器116間之狹小空間內作伸縮位移，不僅取樣比對裝置15之裝配高度需相當精確，方可使移動式取像器152於狹小空間內位移，取樣比對裝置15之動力機構151亦相當佔據機台空間，造成增加成本及不利機台空間配置之缺失。 2. The first transfer pick-and-place device 115 and the second transfer pick-and-place device 116 of the transfer pick-and-place device 11 are located above the test seat 121 of the test area 12, and are provided with a alignment adjusting device 14 and a nozzle, etc. The longer length, the movable imager 152 of the sampling comparison device 15 can only be used in the test seat 121 and the first transfer picker 115 or the second transfer The telescopic displacement is made in a narrow space between the pickers 116. The assembly height of the sampling device 15 is relatively accurate, so that the movable imager 152 can be displaced in a narrow space, and the power mechanism 151 of the sampling comparison device 15 It also occupies considerable space in the machine, resulting in increased costs and a lack of space configuration for the machine.
本發明之目的一，係提供一種電子元件移料校正方法，其係於取樣比對機構之資料庫建立測試機構之測試座配置樣本資料及校正機構之校正部件配置樣本資料，並以控制器將資料庫內建之校正部件配置樣本資料及測試座配置樣本資料進行比對，而將取得之測試座配置誤差值儲存於資料庫，另以校正機構之取像器取像該移料機構之拾取器及其移載的電子元件，並將取像資料傳輸至取樣比對機構之控制器，該控制器即比對取得電子元件之偏移誤差值，並控制移料機構之拾取器於移載電子元件之移料路徑中作配置誤差值及偏移誤差值之補償校正，使得拾取器將電子元件準確對位置入於測試座，達到提升移料準確性及測試品質之實用效益。 A first object of the present invention is to provide an electronic component transfer correction method, which is to establish a test block configuration sample data of a test mechanism and a calibration component configuration sample data of a calibration mechanism in a database of a sampling comparison mechanism, and The calibration component configuration sample data and the test socket configuration sample data built in the database are compared, and the obtained test socket configuration error value is stored in the database, and the image pickup device of the calibration mechanism is taken to pick up the image pickup mechanism. And the transferred electronic component, and the image data is transmitted to the controller of the sampling comparison mechanism, the controller compares the offset error value of the electronic component, and controls the picking device of the loading mechanism to transfer The compensation error of the configuration error value and the offset error value in the moving path of the electronic component enables the pickup to accurately position the electronic component into the test seat, thereby achieving the practical benefit of improving the accuracy of the transfer and the quality of the test.
本發明之目的二，係提供一種電子元件移料校正方法，其中，係於機台之測試區架裝校正機構之校正治具，該校正治具係設有校正部件，並於校正部件之下方固設有治具取像器，於移料機構之拾取器將電子元件移載至校正治具之校正部件時，利用治具取像器取像校正部件及電子元件，並將取像資料傳輸至取樣比對機構之控制器，以取得校正部件及電子元件間之對位誤差值，並將對位誤差值儲存於資料庫，不僅可排除移動式取像器因機構作動誤差而發生取像偏差之情形，並使控制器控制拾取器於移載電子元件之移料路徑中作對位誤差值之補償校正，使拾取器將電子元件準確對位置入於測試座，達到提升移料準確性之實用效益。 A second object of the present invention is to provide an electronic component transfer correction method, wherein the calibration fixture of the calibration mechanism is mounted on the test area of the machine, and the calibration fixture is provided with a correction component and is below the correction component. The fixture image capture device is fixed, and when the pickup device of the material transfer mechanism transfers the electronic component to the correction component of the calibration fixture, the image pickup device takes the image correction component and the electronic component, and transmits the image data. The controller of the sampling comparison mechanism is used to obtain the alignment error value between the calibration component and the electronic component, and the registration error value is stored in the database, which not only eliminates the image taking effect of the movable image pickup device due to the mechanism error. In the case of deviation, and the controller controls the pickup to compensate the alignment error value in the transfer path of the transfer electronic component, so that the pickup accurately positions the electronic component into the test socket, thereby improving the accuracy of the transfer. Practical benefits.
10‧‧‧作業單元 10‧‧‧Operating unit
11‧‧‧移載取放裝置 11‧‧‧Transfer pick and place device
111‧‧‧第一供料載台 111‧‧‧First feeding stage
112‧‧‧第一出料載台 112‧‧‧First discharge stage
113‧‧‧第二供料載台 113‧‧‧Second feeding platform
114‧‧‧第二出料載台 114‧‧‧Second discharge stage
115‧‧‧第一移載取放器 115‧‧‧First transfer picker
116‧‧‧第二移載取放器 116‧‧‧Second transfer picker
12‧‧‧測試區 12‧‧‧Test area
121‧‧‧測試座 121‧‧‧ test seat
13‧‧‧取像裝置 13‧‧‧Image capture device
131‧‧‧CCD取像器 131‧‧‧CCD imager
14‧‧‧對位調整裝置 14‧‧‧ alignment adjustment device
15‧‧‧取樣比對裝置 15‧‧‧Sampling comparison device
151‧‧‧動力機構 151‧‧‧Power Agency
152‧‧‧移動式取像器 152‧‧‧Mobile Imager
20‧‧‧機台 20‧‧‧ machine
21‧‧‧定位部件 21‧‧‧ Positioning parts
30‧‧‧輸送機構 30‧‧‧Transportation agencies
31‧‧‧第一入料載台 31‧‧‧First feeding platform
32‧‧‧第一出料載台 32‧‧‧First discharge stage
33‧‧‧第二入料載台 33‧‧‧Second feed stage
34‧‧‧第二出料載台 34‧‧‧Second discharge stage
40‧‧‧移料機構 40‧‧‧Transfer mechanism
41‧‧‧第一拾取器 41‧‧‧First picker
411‧‧‧第一吸嘴 411‧‧‧ first nozzle
412‧‧‧第一調整器 412‧‧‧First adjuster
42‧‧‧第二拾取器 42‧‧‧Second Picker
421‧‧‧第二吸嘴 421‧‧‧second nozzle
422‧‧‧第二調整器 422‧‧‧Second adjuster
50‧‧‧測試機構 50‧‧‧Test institutions
51‧‧‧電路板 51‧‧‧ boards
511‧‧‧第一基準部件 511‧‧‧ first reference component
52‧‧‧測試座 52‧‧‧ test seat
521‧‧‧探針 521‧‧‧ probe
60‧‧‧校正機構 60‧‧‧Correction agency
61‧‧‧校正治具 61‧‧‧correcting fixture
611‧‧‧校正部件 611‧‧‧calibration parts
612‧‧‧第二基準部件 612‧‧‧second reference component
62‧‧‧治具取像器 62‧‧ ‧ fixture imager
63‧‧‧第一取像器 63‧‧‧first imager
64‧‧‧第二取像器 64‧‧‧Second imager
70‧‧‧取樣比對機構 70‧‧‧Sampling comparison agency
71‧‧‧資料庫 71‧‧‧Database
72‧‧‧控制器 72‧‧‧ Controller
80‧‧‧電子元件 80‧‧‧Electronic components
A1‧‧‧第一Y軸向基準線 A1‧‧‧First Y-Axial Reference Line
S1‧‧‧第一基準點 S1‧‧‧ first benchmark
B1‧‧‧第一X軸向基準線 B1‧‧‧first X-axis baseline
C1‧‧‧第一X軸向線 C1‧‧‧first X axial line
C2‧‧‧第二X軸向線 C2‧‧‧Second X axial line
D1‧‧‧第一Y軸向線 D1‧‧‧first Y axial line
D2‧‧‧第二Y軸向線 D2‧‧‧Second Y axial line
E1‧‧‧中心點 E1‧‧‧ center point
A2‧‧‧第二Y軸向基準線 A2‧‧‧Second Y-axis baseline
S2‧‧‧第二基準點 S2‧‧‧ second reference point
B2‧‧‧第二X軸向基準線 B2‧‧‧Second X-axis baseline
C3‧‧‧第三X軸向線 C3‧‧‧third X axial line
C4‧‧‧第四X軸向線 C4‧‧‧4th X-axis line
D3‧‧‧第三Y軸向線 D3‧‧‧ third Y axial line
D4‧‧‧第四Y軸向線 D4‧‧‧ fourth Y axial line
E2‧‧‧中心點 E2‧‧‧ center point
第1圖：習知台灣發明專利第I465738號專利案之示意圖。 Fig. 1: Schematic diagram of the patent of Taiwan Patent No. I465738.
第2圖：習知台灣發明專利第I465738號專利案之使用示意圖。 Fig. 2 is a schematic view showing the use of the patent of Taiwan Patent No. I465738.
第3圖：本發明應用於電子元件測試設備之移料作業架構示意圖。 Fig. 3 is a schematic view showing the structure of the material transfer operation of the electronic component testing device of the present invention.
第4圖：本發明電子元件測試設備之局部示意圖。 Fig. 4 is a partial schematic view showing the electronic component testing apparatus of the present invention.
第5圖：本發明具測試座之電路板的示意圖。 Figure 5: Schematic diagram of a circuit board with a test stand of the present invention.
第6圖：本發明之流程示意圖。 Figure 6 is a schematic view showing the flow of the present invention.
第7圖：本發明建立校正部件配置樣本資料之示意圖。 Figure 7: Schematic diagram of the present invention for establishing calibration component configuration sample data.
第8圖：本發明建立測試座配置樣本資料之示意圖。 Figure 8: Schematic diagram of the present invention for establishing test sample configuration sample data.
第9圖：本發明校正機構取像拾取器上之電子元件的示意圖。 Figure 9 is a schematic view of the electronic component on the image pickup device of the calibration mechanism of the present invention.
第10圖：本發明校正機構取像電子元件及校正部件之示意圖(一)。 Fig. 10 is a schematic view (1) of the image taking electronic component and the correcting component of the correcting mechanism of the present invention.
第11圖：本發明校正機構取像電子元件及校正部件之示意圖(二)。 Figure 11 is a schematic view of the image taking electronic component and the correcting component of the correcting mechanism of the present invention (2).
第12圖：本發明架裝具測試座之電路板的示意圖。 Figure 12 is a schematic view of a circuit board of the rack mount test stand of the present invention.
第13圖：本發明拾取器補償校正移載電子元件之使用示意圖(一)。 Figure 13: Schematic diagram of the use of the pickup compensation correction transfer electronic component of the present invention (1).
第14圖：本發明拾取器補償校正移載電子元件之使用示意圖(二)。 Figure 14: Schematic diagram of the use of the pickup compensation correction transfer electronic component of the present invention (2).
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如後： In order to make the reviewer further understand the present invention, a preferred embodiment will be described in conjunction with the drawings, as follows:
請參閱第3、4、5圖，本發明移料校正方法應用於電子元件測試設備之移料作業，該測試設備包含機台20、輸送機構30、移料機構40、測試機構50、校正機構60及取樣比對機構70，該機台20係於測試區設有二定位部件21，該定位部件21可為插孔；該輸送機構30係於測試機構50之一側設有作第一方向(如X方向)位移之第一入料載台31及第一出料載台32，用以分別載送待測電子元件及已測電子元件，於測試機構50之另一側設有作第一方向位移之第二入料載台33及第二出料載台34，以分別載送待測電子元件及已測電子元件；該移料機構40係於測試機構50之上方設有一具有第一吸嘴411且作第二、三方向(如Y、Z方向)位移之第一拾取器41，該第一拾取器41之第一吸嘴411上方設有第一調整器412，用以帶動第一吸嘴411作X-Y方向位移及角度旋轉之位置調整，該第一拾取器41係將第一入料載台31上之待測電子元件移載至測試機構50，以及將測試機構50處之已測電子元件移載至第一出料載台32，移料機構40另於測試機構50之上方設有一具有第二吸嘴421且作第二、三方向位移之第二拾取器42，該第二拾取器42之第二吸嘴421上方設有第二調整器422，以帶動第二吸嘴421作X-Y方向位移及角度旋轉之位置調整，該第二拾取器42係將第二入料載台33上之待測電子元件移載至測試機構 50，以及將測試機構50處之已測電子元件移載至第二出料載台34，由於第一、二調整器412、422係為習知之多層式調整平台，因此其動作不再贅述；該測試機構50係設有具複數個測試座52之電路板51，該電路板51上設有二為插銷之第一基準部件511，二第一基準部件511之間距係相同機台20之二定位部件21的間距，各測試座52係具有複數個呈環狀排列且為探針521之傳輸件，以電性接觸電子元件之接點，該接點可為接腳或錫球，於日後正式測試作業時，該電路板51係利用二第一基準部件511插置於機台20之二定位部件21；該校正機構60係設有具複數個校正部件611之校正治具61，該校正部件611可為通孔，校正治具61並設有二為插銷之第二基準部件612，二第二基準部件612之間距係相同機台20之二定位部件21的間距及電路板51之二第一基準部件511的間距，於正式測試前之移料校正作業，該校正治具61係利用二第二基準部件612插置於機台20之二定位部件21而裝配於測試區，另該校正機構60係於各校正部件611之下方分別固設裝配有一為CCD之治具取像器62，以取像校正部件611及第一、二拾取器41、42移載之電子元件，又該校正機構60係於校正治具61之一側設有第一取像器63，以即時取像該移料機構40之第一拾取器41及其上的電子元件，於校正治具61之另一側設有第二取像器64，以即時取像該移料機構40之第二拾取器42及其上的電子元件，第一取像器63及第二取像器64係與校正治具61保持相同距離，並將取像資料傳輸至該取樣比對機構70；該取樣比對機構70係設有資料庫71、控制器72及取樣單元(圖未示出)，該資料庫71係儲存資料，該控制器72係存取資料庫71之資料，並接收校正機構60之治具取像器62及第一、二取像器63、64之取像資料並進行比對。 Referring to Figures 3, 4 and 5, the transfer correction method of the present invention is applied to a transfer operation of an electronic component test device, which includes a machine table 20, a transport mechanism 30, a transfer mechanism 40, a test mechanism 50, and a calibration mechanism. 60 and a sampling comparison mechanism 70, the machine 20 is provided with two positioning members 21 in the test area, and the positioning member 21 can be a jack; the conveying mechanism 30 is disposed on one side of the testing mechanism 50 as a first direction The first loading stage 31 and the first discharging stage 32 (such as the X direction) are respectively configured to carry the electronic component to be tested and the tested electronic component respectively, and are provided on the other side of the testing mechanism 50. The second loading stage 33 and the second discharging stage 34 are respectively displaced in one direction to respectively carry the electronic component to be tested and the tested electronic component; the feeding mechanism 40 is disposed above the testing mechanism 50 and has a first a first picker 41 that is displaced in the second and third directions (such as the Y and Z directions), and a first adjuster 412 is disposed above the first nozzle 411 of the first picker 41 for driving The first nozzle 411 is adjusted in position in the XY direction and the angle rotation, and the first picker 41 is to receive the first material. The electronic component to be tested on the stage 31 is transferred to the testing mechanism 50, and the tested electronic component at the testing mechanism 50 is transferred to the first discharging stage 32. The loading mechanism 40 is further disposed above the testing mechanism 50. There is a second picker 42 having a second nozzle 421 and a second and third direction displacement. A second adjuster 422 is disposed above the second nozzle 421 of the second picker 42 to drive the second nozzle 421. The position adjustment of the XY direction displacement and the angular rotation, the second pickup 42 transfers the electronic component to be tested on the second loading stage 33 to the testing mechanism 50, and transferring the tested electronic components at the test mechanism 50 to the second discharge stage 34. Since the first and second adjusters 412, 422 are conventional multilayer adjustment platforms, the actions thereof are not described again; The test mechanism 50 is provided with a circuit board 51 having a plurality of test sockets 52. The circuit board 51 is provided with a first reference member 511 which is a latch, and the distance between the two first reference members 511 is the same. For the spacing of the positioning members 21, each of the test sockets 52 has a plurality of transmission members arranged in a ring shape and being probes 521 for electrically contacting the contacts of the electronic components, and the contacts may be pins or solder balls, in the future. In the case of a formal test operation, the circuit board 51 is inserted into the two positioning members 21 of the machine table 20 by using the two first reference members 511; the correction mechanism 60 is provided with a correction jig 61 having a plurality of correction members 611, the correction The component 611 can be a through hole, and the correction jig 61 is provided with a second reference member 612 which is a pin. The distance between the two second reference members 612 is the distance between the two positioning members 21 of the same machine 20 and the circuit board 51 The spacing of the first reference member 511, before the formal test For the operation, the calibration jig 61 is inserted into the test area by the second positioning member 612 inserted into the positioning member 21 of the machine 20, and the correction mechanism 60 is fixedly mounted under the respective correction members 611. The image capturing device 62 for the CCD is used to take the electronic component transferred by the image correcting member 611 and the first and second pickers 41 and 42. The correcting mechanism 60 is provided on the side of the correcting jig 61. The image pickup unit 63 is configured to take the first pickup 41 of the loading mechanism 40 and the electronic components thereon, and the second image pickup unit 64 is disposed on the other side of the correction jig 61 for instant image capturing. The second picker 42 of the transfer mechanism 40 and the electronic components thereon, the first image capture unit 63 and the second image capture unit 64 are kept at the same distance from the correction jig 61, and the image pickup data is transmitted to the sampling ratio. The mechanism 70 is provided with a database 71, a controller 72 and a sampling unit (not shown). The database 71 stores data, and the controller 72 accesses the data of the database 71. And receiving the image data of the jig imager 62 of the correction mechanism 60 and the first and second imagers 63, 64 and performing comparison.
請參閱第3、6、7圖，由於不同電路板上配置之測試座位置具有差異，為使移料機構之拾取器將待測電子元件準確移入測試座52，而必須取得日後實際應用之測試座52的配置誤差值，並將此一固定之配置誤差值建立於取樣比對機構70之資料庫71，以供拾取器於移載同一批次待測之電子元件作補償校正；本發明電子元件移料校正方法，首先建立比對樣本資料程序，其係於該取樣比對機構70之資料庫71建立 該校正機構60之校正治具61的校正部件配置樣本資料及測試機構50之電路板51上的測試座配置樣本資料；於建立校正治具61之校正部件配置樣本資料，該校正機構60係於校正治具61設有二第二基準部件612及第一基準點S1，該取樣比對機構70之取樣單元(圖未示出)係量測校正部件611相對於第一基準點S1之位置座標，並將校正部件611之位置座標建立於該取樣比對機構70之資料庫72，於本實施例中，該取樣比對機構70之取樣單元係於校正治具61之二第二基準部件612間量測繪製一第一Y軸向基準線A1，並以第一Y軸向基準線A1之中點作為第一基準點S1，且繪製一垂直交叉第一基準點S1之第一X軸向基準線B1，再利用運算方法由校正部件611之第一、二X軸向線C1、C2及第一、二Y軸向線D1、D2量測求出中心點E1，並取得校正部件611之中心點E1相對於第一基準點S1的位置座標，亦即取得校正部件611相對於第一基準點S1的位置座標，例如以第一基準點S1作為原點(0,0)，而取得該校正部件611之位置座標為(-3,2)，又可利用第一X軸向線C1與第一X軸向基準線B1間之角度值，以及第一Y軸向線D1與第一Y軸向基準線A1間之角度值，以求出校正部件611之角度，因此，即可取得校正部件611相對於第一基準點S1的位置座標(X1,Y1)及角度，依此類推，而可取得各校正部件相對於第一基準點S1的位置座標，進而將校正部件配置樣本資料建立於取樣比對機構70之資料庫72。 Please refer to Figures 3, 6, and 7. Since the position of the test stand configured on different boards is different, in order for the pick-up mechanism of the transfer mechanism to accurately move the electronic component to be tested into the test stand 52, it is necessary to obtain a test for practical application in the future. The error value of the block 52 is set, and the fixed configuration error value is established in the database 71 of the sampling comparison mechanism 70 for the pickup to perform compensation correction on the electronic component to be tested in the same batch; the electronic device of the present invention The component transfer correction method first establishes a comparison sample data program, which is established in the database 71 of the sampling comparison mechanism 70. The calibration component of the calibration fixture 61 of the calibration mechanism 60 is configured with sample data and the test socket configuration sample data on the circuit board 51 of the testing mechanism 50. The calibration component configuration sample data of the calibration fixture 61 is established, and the calibration mechanism 60 is The calibration jig 61 is provided with two second reference members 612 and a first reference point S1. The sampling unit (not shown) of the sampling comparison mechanism 70 is a position coordinate of the measurement and correction member 611 with respect to the first reference point S1. The position coordinates of the calibration component 611 are established in the database 72 of the sampling comparison mechanism 70. In this embodiment, the sampling unit of the sampling comparison mechanism 70 is attached to the second fixture component 612 of the calibration fixture 61. Inter-measurement draws a first Y-axis reference line A1, and takes a midpoint of the first Y-axis reference line A1 as the first reference point S1, and draws a first X-axis perpendicular to the first reference point S1. The reference line B1 is further measured by the first and second X-axis lines C1 and C2 of the correcting member 611 and the first and second Y-axis lines D1 and D2 by the calculation method to obtain the center point E1, and the correction member 611 is obtained. The position coordinate of the center point E1 with respect to the first reference point S1, that is, The positional coordinate of the positive member 611 with respect to the first reference point S1 is, for example, the first reference point S1 as the origin (0, 0), and the position coordinate of the correction member 611 is obtained as (-3, 2), and is available. An angle value between the first X-axis line C1 and the first X-axis reference line B1, and an angle value between the first Y-axis line D1 and the first Y-axis reference line A1 to determine the correction component 611 The angle, therefore, the position coordinates (X1, Y1) and the angle of the correcting member 611 with respect to the first reference point S1 can be obtained, and so on, and the position coordinates of the respective correcting members with respect to the first reference point S1 can be obtained, and further The calibration component configuration sample data is created in the database 72 of the sampling comparison mechanism 70.
請參閱第3、8圖，接著建立測試座配置樣本資料，係於該測試機構50之電路板51上設有二第一基準部件，以及對應於第一基準點S1位置之第二基準點S2，該取樣比對機構70之取樣單元(圖未示出)係量測出測試座52相對於第二基準點S2之位置座標，並將測試座52之位置座標建立於該取樣比對機構70之資料庫72；於本實施例中，該取樣比對機構70之取樣單元係於電路板51之二第一基準部件511間量測繪製出第二Y軸向基準線A2，並以第二Y軸向基準線A2之中點作為第二基準點S2，且繪製一垂直交叉第二基準點S2之第二X軸向基準線B2，另利用運算方法於測試座52之第一、二X軸向排列之複數個探針量測求出第三、四X軸向線C3、C4，以及於第一、二Y軸向排列之複數個探針量測求出第三、四Y軸向線D3、D4，藉由第三、四X軸向線C3、C4及第三、 四Y軸向線D3、D4求出測試座52之中心點E2位置座標，亦即取得測試座52之中心點E2相對於第二基準點S2的位置座標，例如以第二基準點S2作為原點(0,0)，以取得測試座52之位置座標(-3,2)，又可利用第三X軸向線C3與第二X軸向基準線B2間之角度值，以及第三Y軸向線D3與第二Y軸向基準線A2間之角度值，以求出測試座52之配置角度，因此，即可取得測試座52相對於第二基準點S2的位置座標(X1,Y1)及角度，依此類推，可取得各測試座相對於第二基準點S2的位置座標，並將測試座配置樣本資料建立於取樣比對機構70之資料庫72。 Please refer to FIG. 3 and FIG. 8 , and then establish test block configuration sample data, which is provided with two first reference components on the circuit board 51 of the test mechanism 50 and a second reference point S2 corresponding to the position of the first reference point S1. The sampling unit (not shown) of the sampling comparison mechanism 70 measures the position coordinates of the test seat 52 with respect to the second reference point S2, and establishes the position coordinates of the test seat 52 to the sampling comparison mechanism 70. In the embodiment, the sampling unit of the sampling comparison mechanism 70 measures the second Y-axis reference line A2 between the first reference member 511 of the circuit board 51, and is second. The midpoint of the Y-axis reference line A2 is taken as the second reference point S2, and a second X-axis reference line B2 perpendicularly crossing the second reference point S2 is drawn, and the first and second X of the test block 52 are calculated by an operation method. The plurality of probes arranged in the axial direction are measured to obtain the third and fourth X-axis lines C3 and C4, and the plurality of probes arranged in the first and second Y-axis directions are measured to obtain the third and fourth Y-axis directions. Lines D3, D4, by the third and fourth X-axis lines C3, C4 and third, The four Y-axis lines D3 and D4 obtain the position coordinates of the center point E2 of the test seat 52, that is, the position coordinates of the center point E2 of the test seat 52 with respect to the second reference point S2, for example, the second reference point S2 is used as the original Point (0,0) to obtain the position coordinate (-3, 2) of the test seat 52, and to use the angle value between the third X-axis line C3 and the second X-axis reference line B2, and the third Y The angle between the axial line D3 and the second Y-axis reference line A2 is used to determine the arrangement angle of the test seat 52. Therefore, the position coordinates of the test seat 52 relative to the second reference point S2 can be obtained (X1, Y1). And the angle, and so on, the position coordinates of each test seat relative to the second reference point S2 can be obtained, and the test seat configuration sample data is established in the database 72 of the sampling comparison mechanism 70.
請參閱第3、6、7、8圖，由於校正治具61之裝配位置即為日後電路板51之裝配位置，而可以校正治具61之校正部件配置樣本資料作為比對基礎，接著進行測試座與校正部件位差比對程序，係該取樣比對機構70之控制器72將資料庫71內建之校正部件配置樣本資料及測試座配置樣本資料進行比對，而取得測試座52之配置誤差值，並將配置誤差值儲存於資料庫71；於本實施例中，由於校正治具61之二第二基準部件612的間距係相同於電路板51之二第一基準部件511的間距，使得校正治具61的第一基準點S1位置相同於電路板51的第二基準點S2位置，進而取樣比對機構70之控制器72可將校正治具61第一個校正部件611之位置座標與電路板51第一個測試座52之位置座標進行比對，以取得測試座52之配置誤差值，以此類推，可取得各測試座52之各配置誤差值，由於同一批次電子元件係應用同一具測試座之電路板，進而可將各測試座52之各配置誤差值建立於資料庫71，以提供第一拾取器41及第二拾取器42移載同一批次待測之電子元件作校正補償，日後測試機構50更換另一具測試座之測試電路板時，亦以校正治具61之校正部件配置樣本資料作為比對基礎，而獲得新測試座之配置誤差值，並將該配置誤差值提供第一、二拾取器41、42作校正補償。 Referring to Figures 3, 6, 7, and 8, since the assembly position of the calibration jig 61 is the assembly position of the circuit board 51 in the future, the calibration component configuration sample data of the jig 61 can be corrected as a comparison basis, and then tested. Comparing the block and the correcting component, the controller 72 of the sampling comparison mechanism 70 compares the calibration component configuration sample data and the test socket configuration sample data built in the database 71, and obtains the configuration of the test socket 52. The error value is stored in the database 71. In this embodiment, since the second reference member 612 of the calibration jig 61 is spaced apart from the first reference member 511 of the circuit board 51, The first reference point S1 of the calibration jig 61 is positioned at the same position as the second reference point S2 of the circuit board 51, and the controller 72 of the sampling comparison mechanism 70 can position the coordinate of the first correcting part 611 of the correction jig 61. Comparing with the position coordinates of the first test socket 52 of the circuit board 51 to obtain the configuration error value of the test socket 52, and so on, the configuration error values of the test sockets 52 can be obtained, because the same batch of electronic components are should The circuit board of the same test socket can be used to establish the configuration error values of the test sockets 52 in the database 71 to provide the first picker 41 and the second picker 42 to transfer the same batch of electronic components to be tested. For the correction compensation, when the test board 50 replaces the test circuit board of another test socket, the calibration sample configuration sample data of the calibration jig 61 is also used as a comparison basis, and the configuration error value of the new test socket is obtained, and the The configuration error value provides first and second pickups 41, 42 for correction compensation.
請參閱第3、6、9圖，由於第一、二入料載台31、33載送待測電子元件80之過程中，該待測之電子元件80易於第一、二入料載台31、33之容置槽內位移，導致移料機構40之第一、二拾取器41、42吸取偏移擺置之電子元件80，使第一、二拾取器41、42與電子元件80間產生偏移誤差值，由於每一個待測電子元件80之偏移 誤差值不同，因此，移料機構40之第一、二拾取器41、42每一次於第一、二入料載台31、33吸取電子元件80後，即進行拾取器與電子元件位差比對程序，係以校正機構60之取像器取像移料機構40之拾取器上的電子元件，並將取像資料傳輸至取樣比對機構70之控制器72，由控制器72依據取像資料判別取得電子元件80之偏移誤差值，以第一拾取器41移載電子元件80為例，該輸送機構30之第一入料載台31係作X方向位移將待測之電子元件80載送至第一拾取器41之下方，該第一拾取器41係作Y-Z方向位移，以第一吸嘴411於第一入料載台31取出待測之電子元件80，並將待測之電子元件80移載至校正機構60之第一取像器63，該第一取像器63即取像第一拾取器41及待測之電子元件80，並將取像資料傳輸至取樣比對機構70之控制器72，該控制器72依據取像資料判別取得待測電子元件80之偏移誤差值，並控制第一拾取器41於取出待測之電子元件80後先作一校正補償。 Referring to Figures 3, 6, and 9, since the first and second loading stages 31, 33 are carrying the electronic component 80 to be tested, the electronic component 80 to be tested is easy to be used for the first and second loading stages 31. The displacement of the accommodating slot of the 33 causes the first and second pickers 41 and 42 of the loading mechanism 40 to suck the offset electronic component 80 to generate the first and second pickers 41 and 42 and the electronic component 80. Offset error value due to offset of each electronic component 80 to be tested The error value is different. Therefore, the first and second pick-ups 41 and 42 of the material transfer mechanism 40 respectively take the electronic component 80 after the first and second loading stages 31 and 33 absorb the electronic component 80, thereby performing the difference between the pickup and the electronic component. For the program, the image pickup device of the correction mechanism 60 takes the electronic components on the pickup of the image transfer mechanism 40, and transmits the image pickup data to the controller 72 of the sampling comparison mechanism 70, and the controller 72 determines the image according to the image. The data discriminating obtains the offset error value of the electronic component 80. Taking the first picker 41 to transfer the electronic component 80 as an example, the first loading stage 31 of the transport mechanism 30 is configured to shift the electronic component 80 to be tested in the X direction. Carrying to the lower side of the first pick-up 41, the first pick-up 41 is displaced in the YZ direction, and the first suction nozzle 411 takes out the electronic component 80 to be tested on the first loading stage 31, and the test piece is to be tested. The electronic component 80 is transferred to the first image pickup unit 63 of the correction mechanism 60, and the first image pickup unit 63 takes the image pickup device 41 and the electronic component 80 to be tested, and transmits the image capturing data to the sampling comparison. The controller 72 of the mechanism 70, the controller 72 determines the offset of the electronic component 80 to be tested according to the image data. The difference, and controls the pickup 41 to a first electronic device to be tested after extraction to make a 80-correction.
請參閱第4、10、11圖，由於移料機構40之第一、二拾取器41、42易因機構作動誤差等因素而發生無法將電子元件80準確移入測試座之情形；因此，本發明為確保第一、二拾取器41、42準確將電子元件80移入測試座，係先進行架裝校正治具程序，係該校正機構60之校正治具61利用二第二基準部件612插置於機台20之測試區的二定位部件21，使具有校正部件611之校正治具61裝配於測試區，亦即將校正治具61裝配於日後測試機構之電路板的裝配位置，以藉由移料機構40之第一、二拾取器41、42將電子元件80移載至校正治具61之校正部件611，以取得電子元件80之對位誤差值，亦即取得第一、二拾取器41、42之作動誤差，進而將該電子元件80之對位誤差值提供日後第一、二拾取器41、42將電子元件80移載至測試座作補償校正，於進行電子元件與校正治具比對程序，該移料機構40之拾取器係將電子元件80移載至校正機構60之校正治具61的校正部件611處，該校正機構60係以治具取像器62取像電子元件80及校正部件611，並將取像資料傳輸至取樣比對機構70之控制器72，由控制器72依據取像資料取得電子元件80之對位誤差值，並將該對位誤差值儲存於資料庫71，由於校正治具61之裝配位置即為日後電路板之裝配 位置，校正治具61之第一基準點S1至第一取像器63或第二取像器64係為相同固定距離，以判別第一、二拾取器41、42於移載過程中是否發生作動誤差；以第一拾取器41移載待測之電子元件80為例，當第一拾取器41完成偏移誤差值之校正補償後，第一拾取器41即作Y-Z方向位移將待測之電子元件80移載至校正治具61之校正部件611，由於校正機構60之治具取像器62係固設於校正部件611之下方，進而可排除習知移動式取像器因動力機構之作動或組裝誤差等因素而發生取像偏移的情形，校正機構60即利用治具取像器62由下向上準確取像校正部件611及電子元件80，並將取像資料傳輸至取樣比對機構70之控制器72，控制器72依據取像資料取得電子元件80之對位誤差值，並將對位誤差值儲存於資料庫71。 Referring to Figures 4, 10, and 11, the first and second pickers 41, 42 of the transfer mechanism 40 are susceptible to the fact that the electronic component 80 cannot be accurately moved into the test seat due to factors such as the actuator error; therefore, the present invention In order to ensure that the first and second pickers 41, 42 accurately move the electronic component 80 into the test socket, the racking correction jig program is first performed, and the calibration jig 61 of the correcting mechanism 60 is interposed by the second second reference member 612. The two positioning members 21 of the test area of the machine 20 are equipped with the calibration jig 61 having the correction member 611 in the test area, that is, the calibration jig 61 is assembled at the assembly position of the circuit board of the future test mechanism to be moved by the material. The first and second pickers 41 and 42 of the mechanism 40 transfer the electronic component 80 to the correcting component 611 of the calibration jig 61 to obtain the alignment error value of the electronic component 80, that is, obtain the first and second pickers 41, The actuation error of 42 further provides the alignment error value of the electronic component 80 to the future. The first and second pickups 41 and 42 transfer the electronic component 80 to the test socket for compensation correction, and compare the electronic component with the calibration fixture. Procedure, the transfer mechanism 40 The picking device transfers the electronic component 80 to the correcting component 611 of the correcting jig 61 of the correcting mechanism 60. The correcting mechanism 60 takes the electronic component 80 and the correcting component 611 with the jig imager 62 and takes the image. The data is transmitted to the controller 72 of the sampling comparison mechanism 70. The controller 72 obtains the registration error value of the electronic component 80 according to the image capturing data, and stores the alignment error value in the database 71, because the calibration fixture 61 Assembly position is the assembly of the circuit board in the future Position, the first reference point S1 of the correction jig 61 to the first image picker 63 or the second image picker 64 is the same fixed distance to determine whether the first and second pickers 41, 42 occur during the transfer process. Actuation error; taking the electronic component 80 to be tested by the first picker 41 as an example, after the first picker 41 completes the correction compensation of the offset error value, the first picker 41 is the YZ direction shift to be tested. The electronic component 80 is transferred to the correcting member 611 of the calibration jig 61. Since the jig imager 62 of the correcting mechanism 60 is fixed under the correcting member 611, the conventional mobile image pickup device can be eliminated. When the image capturing offset occurs due to factors such as actuation or assembly error, the correcting mechanism 60 uses the jig imager 62 to accurately take the image correcting component 611 and the electronic component 80 from bottom to top, and transmits the image capturing data to the sampling comparison. The controller 72 of the mechanism 70 obtains the registration error value of the electronic component 80 according to the image capturing data, and stores the registration error value in the database 71.
請參閱第7、8、9、12圖，於正式執行測試作業之前，係進行架裝電路板程序，該測試機構50之電路板51利用二第一基準部件511插置於該機台20之測試區的二定位部件21，使該具測試座52之電路板51裝配於該測試區；於本實施例中，係先將機台20上之校正治具61取下，由於校正治具61之裝配位置即為日後電路板51之裝配位置，且電路板51的二第一基準部件511間距係相同機台20之二定位部件21間距，進而可利用電路板51之二第一基準部件511插置於機台20之二定位部件21，以準確將具測試座52的電路板51裝配於機台20之測試區，又由於電路板51的二第一基準部件511間距係相同校正治具61之二第二基準部件612間距，使得電路板51之第二基準點S2至第一、二取像器63、64的間距係相同於校正治具61之第一基準點S1至第一、二取像器63、64的間距，進而第一拾取器41或第二拾取器42即可以固定移載行程將電子元件80由第一取像器63或第二取像器64處移載至電路板51處。 Referring to Figures 7, 8, 9, and 12, before the formal execution of the test operation, the rack-mounted circuit board program is performed, and the circuit board 51 of the test mechanism 50 is inserted into the machine table 20 by using the two first reference members 511. The two positioning members 21 of the test area are equipped with the circuit board 51 of the test stand 52 in the test area. In this embodiment, the calibration jig 61 on the machine 20 is first removed, because the correction jig 61 The assembly position is the assembly position of the circuit board 51 in the future, and the distance between the two first reference members 511 of the circuit board 51 is the distance between the two positioning members 21 of the same machine 20, and the first reference member 511 of the circuit board 51 can be utilized. The positioning member 21 is inserted into the second positioning component 21 of the machine table 20 to accurately mount the circuit board 51 with the test socket 52 to the test area of the machine base 20, and since the spacing between the two first reference components 511 of the circuit board 51 is the same. 61 bis second reference member 612 is spaced such that the second reference point S2 of the circuit board 51 to the first and second imagers 63, 64 is the same as the first reference point S1 of the correction jig 61 to the first, The distance between the two image pickers 63, 64, and thus the first picker 41 or the second picker 42 The electronic component 80 can be transferred from the first imager 63 or the second imager 64 to the circuit board 51 by a fixed transfer stroke.
請參閱第6、13、14圖，於完成測試機構50之電路板51裝配作業後，正式執行測試作業時，即可進行拾取器移料補正程序，係該取樣比對機構70之控制器72控制移料機構40之拾取器於移載電子元件80之移料路徑中作配置誤差值及偏移誤差值之補償校正，使拾取器將電子元件準確移入測試機構50之測試座52，於本實施例中，以第 一拾取器41移載電子元件80為例，正式執行測試作業時，該第一拾取器41係作Y-Z方向位移於第一入料載台31取出待測之電子元件80，並將待測之電子元件80移載至第一取像器63進行拾取器與電子元件位差比對程序，以取得電子元件80之偏移誤差值，並於第一拾取器41完成偏移誤差值之校正補償後，再將電子元件80移載至電路板51處，由於該取樣比對機構70之資料庫71已建立配置誤差值及對位誤差值，進而取樣比對機構70之控制器72即控制第一拾取器41作配置誤差值及對位誤差值之校正補償，第一拾取器41利用第一調整器412調整待測電子元件80之X-Y方向位移及角度旋轉，進而將待測之電子元件80準確移入測試機構50之測試座52；因此，該取樣比對機構70之控制器72係控制移料機構40之第一拾取器41或第二拾取器42於移載電子元件80之移料路徑中作配置誤差值及偏移誤差值之補償校正，或更進一步作對位誤差值的補償校正，使第一、二拾取器41、42將電子元件80準確對位置入於測試座52，達到提升移料準確性及測試品質之實用效益。 Referring to Figures 6, 13, and 14, after completing the assembly operation of the circuit board 51 of the testing mechanism 50, when the test operation is formally performed, the pickup material replenishing program can be performed, which is the controller 72 of the sampling comparison mechanism 70. The pickup of the transfer mechanism 40 controls the compensation error of the configuration error value and the offset error value in the transfer path of the transfer electronic component 80, so that the pickup accurately moves the electronic component into the test socket 52 of the test mechanism 50, In the embodiment, by For example, when the electronic component 80 is transferred by a picker 41, the first picker 41 is displaced in the YZ direction to the first loading stage 31 to take out the electronic component 80 to be tested, and the test piece is to be tested. The electronic component 80 is transferred to the first image capture unit 63 for the pickup and electronic component level difference comparison procedure to obtain the offset error value of the electronic component 80, and the offset compensation value is corrected by the first pickup 41. Then, the electronic component 80 is transferred to the circuit board 51. Since the data 71 of the sampling comparison mechanism 70 has established a configuration error value and a registration error value, the controller 72 of the sampling comparison mechanism 70 controls the control unit. The first picker 412 adjusts the XY direction displacement and the angular rotation of the electronic component 80 to be tested, and then the electronic component 80 to be tested is adjusted by the first adjuster 412. The test stand 52 of the test mechanism 50 is accurately moved; therefore, the controller 72 of the sample comparison mechanism 70 controls the transfer path of the first picker 41 or the second picker 42 of the transfer mechanism 40 to the transfer electronic component 80. Configuration error value and offset error The compensation correction, or the compensation correction of the alignment error value, causes the first and second pickups 41, 42 to accurately position the electronic component 80 into the test seat 52, thereby achieving the practical benefit of improving the accuracy of the transfer and the quality of the test. .
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111989577A (en) * | 2018-12-21 | 2020-11-24 | 株式会社Synax | Processor |
| CN114563650A (en) * | 2022-04-26 | 2022-05-31 | 苏州威达智电子科技有限公司 | Intelligent Micro LED crimping and lighting detection device and detection method thereof |
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| TWI671535B (en) * | 2018-08-20 | 2019-09-11 | 鴻勁精密股份有限公司 | Electronic component testing device and classification device thereof |
| TWI677685B (en) * | 2018-10-08 | 2019-11-21 | 鴻勁精密股份有限公司 | Electronic component test equipment |
| TWI741442B (en) * | 2019-12-12 | 2021-10-01 | 鴻勁精密股份有限公司 | Correction device, correction method and working equipment for application thereof |
| TWI777740B (en) * | 2021-08-23 | 2022-09-11 | 鴻勁精密股份有限公司 | Correction apparatus, correction method, and handler using the same |
| TWI791270B (en) * | 2021-08-23 | 2023-02-01 | 鴻勁精密股份有限公司 | Correction apparatus, correction method, and handler using the same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111989577A (en) * | 2018-12-21 | 2020-11-24 | 株式会社Synax | Processor |
| CN111989577B (en) * | 2018-12-21 | 2023-01-24 | 株式会社Synax | Processor |
| CN114563650A (en) * | 2022-04-26 | 2022-05-31 | 苏州威达智电子科技有限公司 | Intelligent Micro LED crimping and lighting detection device and detection method thereof |
| CN114563650B (en) * | 2022-04-26 | 2022-07-05 | 苏州威达智电子科技有限公司 | Intelligent Micro LED crimping and lighting detection device and detection method thereof |
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