TW201425959A - Electronic component operation unit having image capturing device and operation equipment using same - Google Patents
Electronic component operation unit having image capturing device and operation equipment using same Download PDFInfo
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- TW201425959A TW201425959A TW101151000A TW101151000A TW201425959A TW 201425959 A TW201425959 A TW 201425959A TW 101151000 A TW101151000 A TW 101151000A TW 101151000 A TW101151000 A TW 101151000A TW 201425959 A TW201425959 A TW 201425959A
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Abstract
Description
本發明尤指其提供一種以單一的取像器同時擷取位於上方之電子元件的仰視影像及位於下方之承置座的俯視影像，進而有效達到簡化作業時間及降低設備成本之具影像擷取裝置之電子元件作業單元及其應用之作業設備。 In particular, the present invention provides a top view image of an electronic component located above and a top view image of the underlying mount by a single image capture device, thereby effectively achieving image capture and simplifying the operation of the device. The electronic component operating unit of the device and the operating equipment for its application.
一般電子元件在對位置入於作業區之承置座前，係必須先確認承置座內是否有殘留電子元件或殘留受損電子元件之餘屑或灰塵等異物，以避免後續置入之電子元件因壓抵到異物而陸續受損，且該殘留的異物亦會影響電子元件與承置座的有效接觸，而影響作業的品質。以電子元件的測試分類機為例，請參閱第1圖，其係為本申請人所申請之台灣專利申請第94124172號『積體電路檢測機』專利案，該檢測機係於熱測室10之頂板相對應測試台11位置固設有一為CCD12之視覺裝置，使用者可依所需而控制CCD12對測試台11進行掃瞄，並將掃瞄訊號傳輸至控制器(圖中未示出)，以檢測出測試台11之內部是否殘留有受損IC或餘屑或灰塵等異物，如掃瞄出測試台11具有異物，即可事先獲知並迅速將異物排除，以防止後續置入之IC壓抵於異物而造成損壞，以大幅降低IC損壞率。 Before the electronic components are placed in the mounting area of the working area, it is necessary to confirm whether there are residual electronic components in the mounting base or foreign matter such as residual chips or dust remaining in the damaged electronic components to avoid subsequent insertion of the electronic components. The components are damaged by the pressure against the foreign matter, and the residual foreign matter also affects the effective contact between the electronic component and the socket, thereby affecting the quality of the work. Taking the tester of the electronic component as an example, please refer to FIG. 1 , which is a patent application of the "Integrated Circuit Tester" of Taiwan Patent Application No. 94124172, which is applied to the thermal test room 10 The top plate is fixed with a visual device for the CCD 12 corresponding to the position of the test bed 11, and the user can control the CCD 12 to scan the test table 11 as needed, and transmit the scan signal to the controller (not shown). In order to detect whether there is any damaged foreign matter such as damaged IC or residual dust or dust inside the test bench 11, if the scanning test stand 11 has a foreign object, the foreign matter can be known in advance and the foreign matter can be quickly eliminated to prevent the IC from being inserted later. Damage caused by pressing against foreign objects to significantly reduce the IC damage rate.
然而隨著電子元件朝向小巧輕薄的小體積微接點發展，電子元件在置入於作業區之承置座前，不僅必須先確認承置座內是否有殘留電子元件或餘屑或灰塵等異物，且由於小體積微接點的電子元件置入於作業區之承置件內之精準度要求相當高，若精準度稍有偏差，即使得電子元件無法在承置件內有效的執行作業，而降低作業的品質，因此也必須同時確保電子元件可準確對位置入於作業區之承置件內。再以電子元件的測試分類機為例，請參閱第2圖，其係為本申請人所申請之台灣專利申請第96149417號『可使電子元件精準對位之移載裝置』專利案，該測試分類機之 機台上係包括有供料裝置20、輸入端輸送裝置21、作業區22、輸出端輸送裝置23及收料裝置24；輸入端輸送裝置21係將供料裝置20上待測之電子元件分別輸送至作業區22內之供料載具221，作業區22內之第一、第二收料載具222、223上完測之電子元件，則依據檢測結果由輸出端輸送裝置23輸送至收料裝置24分類放置。請參閱第3圖，作業區22包括有測試站224、取像機構225、位於測試站224一側之第一收料載具222、位於測試站224另側之供料載具221及第二收料載具223、第一移載取放器226及第二移載取放器227；其中，該供料載具221之上方係設有複數個底面具鏤空孔且用以承置待測電子元件之承座2211，各承座2211係配置有複數個可為伺服馬達且呈不同軸向設置之調整件2212、2213、2214，而可利用調整件2212、2213、2214驅動承座2211作X-Y兩軸向及θ角之位移，而供料載具221之下方則設有滑軌組2215，而可於作業區22之供料處供輸入端輸送裝置將待測電子元件置入於各承座2211上後，利用滑軌組2215將待測電子元件移載至取像機構225處由下往上擷取電子元件底部的電性接點影像，並以各調整件2212、2213、2214驅動承座2211作X-Y兩軸向及θ角之補償校正，而可精確調整待測電子元件之擺置位置，另該第一、二收料載具222、223則供承置完測之電子元件，該第一、二收料載具222、223係以固定的方式定位於相對測試站224的相關位置，以供第一、二移載取放器226、227及輸出端輸送裝置進行收料作業，該平行位於供料載具221側方之取像機構225係為CCD取像器，並設置於機台之透明台板下方，且以線路連接訊號至中央控制器，於供料載具221移載電子元件至取像機構225處由下往上擷取電子元件底部的電性接點影像後，將取像訊號傳輸至中央控制器，且經由中央控制器之比對，而運算出其偏差量，進而命令供料載具 221之各承座2211作位置或角度之補償校正，使電子元件精準正確擺置，以供第一移載取放器226取出並移載置入於測試站224上執行檢測作業。 However, as the electronic components are developed toward small, small and small micro-contacts, the electronic components must be confirmed before the mounting seat of the working area, whether or not there are residual electronic components or foreign matter such as residual dust or dust. Moreover, since the precision of the electronic components of the small-sized micro-contacts placed in the mountings of the working area is relatively high, if the accuracy is slightly deviated, the electronic components cannot perform the operations effectively in the mounting members. In order to reduce the quality of the work, it is also necessary to ensure that the electronic components can be accurately placed in the holder of the work area. Taking the tester of the electronic component as an example, please refer to FIG. 2, which is a patent application of the Taiwan Patent Application No. 96194417, which can be applied to the precise transfer of electronic components. Sorting machine The machine platform includes a feeding device 20, an input conveying device 21, a working area 22, an output conveying device 23 and a receiving device 24; the input conveying device 21 is for respectively selecting the electronic components to be tested on the feeding device 20 The electronic component that is transported to the feeding carrier 221 in the working area 22 and the first and second receiving carriers 222 and 223 in the working area 22 is transported by the output conveying device 23 according to the detection result. The material devices 24 are placed in categories. Referring to FIG. 3, the work area 22 includes a test station 224, an image capture mechanism 225, a first receiving carrier 222 on the side of the test station 224, a supply carrier 221 on the other side of the test station 224, and a second The receiving carrier 223, the first transfer pick-and-place 226 and the second transfer pick-and-place 227; wherein the top of the feeding carrier 221 is provided with a plurality of bottom mask hollow holes for bearing the test The socket 2211 of the electronic component, each of the sockets 2211 is provided with a plurality of adjusting members 2212, 2213 and 2214 which can be servo motors and arranged in different axial directions, and the adjusting members 2212, 2213 and 2214 can be used to drive the socket 2211. The displacement of the XY two-axis and the θ angle, and the slide carrier 2215 is provided below the feeding carrier 221, and the input end conveying device can be placed in the feeding portion of the working area 22 to place the electronic component to be tested in each After the bearing 2211 is mounted, the electronic component to be tested is transferred to the image of the electrical contact of the bottom of the electronic component from the bottom up by the slide group 2215, and the adjustment components 2212, 2213, 2214 are used. The driving socket 2211 is used for the compensation correction of the XY two-axis and the θ angle, and the position of the electronic component to be tested can be accurately adjusted. In addition, the first and second receiving carriers 222, 223 are used to mount the tested electronic components, and the first and second receiving carriers 222, 223 are fixedly positioned relative to the test station 224 in a fixed manner. The first and second transfer pickers 226, 227 and the output end conveying device perform a receiving operation, and the image taking mechanism 225 located on the side of the feeding carrier 221 is a CCD image picker and is disposed on the machine. Below the transparent platen of the table, the signal is connected to the central controller by the line, and after the electronic component is transferred from the feeding carrier 221 to the image capturing mechanism 225, the electrical contact image of the bottom of the electronic component is captured from the bottom up. The image capturing signal is transmitted to the central controller, and the deviation is calculated by the comparison of the central controller, thereby commanding the feeding carrier Each of the seats 2211 is compensated for position or angle compensation so that the electronic components are accurately and correctly placed for the first transfer picker 226 to be taken out and transferred to the test station 224 for performing the inspection operation.
亦即對於現今電子元件的測試分類機來說，除了必須如第1圖所示，於相對應測試台11位置的上方機架上固設CCD12，以檢測測試台11之內部是否殘留有受損IC或餘屑或灰塵等異物外，同時也必須如第2、3圖所示，於機台下方設置取像機構225，以於待測電子元件移載至取像機構225處時，取像機構225可由下往上擷取電子元件底部的電性接點影像，再由中央控制器之比對，而命令供料載具221之各承座2211作位置或角度之補償校正，使電子元件精準正確擺置，以供第一移載取放器226取出並移載置入於測試站224上執行檢測作業；而同時設置如第1圖所示之CCD12及如第2、3圖所示之取像機構225，除了增加設備成本外，同時也因為分段擷取影像而增加作業時間，進而影響設備的競爭力。 That is, for the test sorter of today's electronic components, in addition to having to be as shown in FIG. 1, the CCD 12 is fixed on the upper frame corresponding to the position of the test stand 11 to detect whether the inside of the test stand 11 remains damaged. In addition to the IC or foreign matter such as dust or dust, the image capturing mechanism 225 must be disposed under the machine as shown in Figures 2 and 3 to capture the image when the electronic component to be tested is transferred to the image taking mechanism 225. The mechanism 225 can capture the electrical contact image at the bottom of the electronic component from the bottom up, and then compare the central controller, and command the respective carrier 2211 of the feeding carrier 221 to compensate for the position or angle, so that the electronic component Precisely and correctly placed for the first transfer picker 226 to be taken out and transferred to the test station 224 for performing the test operation; and at the same time, the CCD 12 as shown in FIG. 1 and the second and third figures are shown. The image capturing mechanism 225 not only increases the equipment cost, but also increases the working time due to the segmentation of the image, thereby affecting the competitiveness of the device.
有鑑於此，本發明人為因應小體積電子元件的發展趨勢，係研創出一種可簡化作業時間及降低設備成本之影像擷取裝置，此即為本發明之設計宗旨。 In view of this, the present inventors have developed an image capturing device that can simplify the operation time and reduce the cost of equipment in response to the development trend of small-sized electronic components, which is the design object of the present invention.
本發明之目的一，係提供一種具影像擷取裝置之電子元件作業單元，該影像擷取裝置係包括有取像器及反射鏡組，而於移載取放裝置移動對應於作業區之承置座上方位置時，以取像器本身對該移載取放裝置上之電子元件或作業區之承置座進行取像，並搭配反射鏡組的反射影像，對該移載取放裝置上之電子元件或作業區之承置座進行取像，再將取像所得之即時影像資料傳輸至比對裝置，以供判斷是否執行下一步作業；藉此，利用影像擷取裝置之取像器及反射鏡組，即可以單一的取像器同時擷取位於上方之電子元件的仰視影像及位於下方之承置座的俯視影像，進而有效達到簡化作業時間及降低設備成本之實用效益。 An object of the present invention is to provide an electronic component working unit with an image capturing device, wherein the image capturing device includes an image capturing device and a mirror group, and the moving and receiving device moves to correspond to the working area. When the upper position is set, the image pickup device itself takes an image of the electronic component or the mounting base of the working area on the transfer pick-and-place device, and cooperates with the reflected image of the mirror group to move the pick-and-place device The electronic component or the mounting base of the working area is imaged, and the instant image data obtained by the image capturing is transmitted to the comparing device for judging whether to perform the next operation; thereby, the image capturing device of the image capturing device is utilized And the mirror group, that is, a single image capturing device can simultaneously capture the upward looking image of the electronic component located above and the top view image of the mounting seat located below, thereby effectively achieving the practical benefit of simplifying the working time and reducing the equipment cost.
本發明之目的二，係提供一種具影像擷取裝置之電子元件作業單元應用之作業設備，該作業設備包含有供料裝置、收料裝置、作業單元、輸入端輸送裝置、輸出端輸送裝置及中央控制單元，供料裝置係配置於機台上，用以容納至少一待執行作業之電子元件，收料裝置係配置於機台上，用以容納至少一完成作業之電子元件，作業單元係配置於機台上，並設有至少一移載取放裝置、至少一作業區及至少一影像擷取裝置及比對裝置，用以對電子元件執行預設的作業，輸入端輸送裝置及輸出端輸送裝置係配置於機台上，用以將供料裝置上之電子元件輸入作業單元及自作業單元輸出電子元件至收料裝置，中央控制單元係用以控制及整合各裝置作動，以執行自動化作業，達到提升作業效能之實用效益。 The second object of the present invention is to provide an operation device for an electronic component working unit with an image capturing device, which comprises a feeding device, a receiving device, a working unit, an input end conveying device, an output end conveying device, and a central control unit, the feeding device is disposed on the machine platform for accommodating at least one electronic component to be executed, and the receiving device is disposed on the machine platform for accommodating at least one electronic component for completing the work, the working unit is Disposed on the machine, and provided with at least one transfer pick-and-place device, at least one working area and at least one image capturing device and comparison device for performing preset operations on the electronic components, the input end conveying device and the output The end conveying device is disposed on the machine platform for inputting the electronic components on the feeding device into the working unit and outputting the electronic components from the working unit to the receiving device, wherein the central control unit is used for controlling and integrating the devices to perform Automated operations to achieve practical benefits of improved operational performance.
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如后：請參閱第4圖，本發明之作業單元30係於機台上設有至少一移載取放裝置31、至少一作業區32、至少一影像擷取裝置33及比對裝置(圖式未示)；該移載取放裝置31係可移動而將待執行作業之電子元件移載至作業區32位置，於本實施例中，該移載取放裝置31係包括有位於作業區32第一側之第一供料載台311及第一收料載台312、位於作業區32第二側之第二供料載台313及第二收料載台314、移動於作業區32與第一供料載台311及第一收料載台312間之第一移載取放器315以及移動於作業區32與第二供料載台313及第二收料載台314間之第二移載取放器316；位於作業區32第一側之第一供料載台311上係具有至少一第一供料承座3111，以於供料位置承置待執行作業之電子元件，並可移動至對應作業區32的側方位置，第一收料載台312上係具有至少一第一收料承座3121，並可移動至對應作業區32的側方位置，以承置完成作業之電子元件並移動至收料位置，位於作業區32 第二側之第二供料載台313上係具有至少一第二供料承座3131，以於供料位置承置待執行作業之電子元件，並可移動至對應作業區32的側方位置，第二收料載台314上係具有至少一第二收料承座3141，並可移動至對應作業區32的側方位置，以承置完成作業之電子元件並移動至收料位置，第一移載取放器315係可移動至第一側之第一供料載台311位置，以將第一供料載台311上待執行作業之電子元件移載至作業區32位置，或將作業區32完成作業之電子元件移載至第一收料載台312上，第二移載取放器316係可移動至第二側之第二供料載台313位置，以將第二供料載台313上待執行作業之電子元件移載至作業區32位置，或將作業區32完成作業之電子元件移載至第二收料載台314上；至少一作業區32，作業區32係可供置入待執行作業之電子元件，以對該電子元件執行預設的作業，該預設的作業可以為印刷、模壓、外觀檢測或電性測試等，於本實施例中該作業區32係執行電性測試作業，而於作業區32內設有測試電路板321，以及於測試電路板321上設有供電子元件對位置放之承置座322，由於本實施例為執行電性測試作業，承置座322內並設有複數個連接至電路板321之電性接點323，以供電子元件之接腳或錫球電性接觸該電性接點323；請參閱第4、5圖，為了確認承置座322內是否有殘留電子元件或餘屑或灰塵等異物，以及使第一移載取放器315或第二移載取放器316可以準確的將電子元件36置放於承置座322內，並使電子元件36之接腳或錫球361可以精準的電性接觸承置座322內之電性接點323，本發明係設有影像擷取裝置33及比對裝置(圖式未示)，於本實施例中，該影像擷取裝置33係於機台台面設有至少一為CCD之取像器331，而可在第一移載取放器315或第二移載取放器316移動對應於作業區32之承置座322上方位置時，對該第一移載取放器315或第二移載取放器316上之電子元件36，由下往上擷取底部的仰視影像，影像擷取裝置33另於對應取像器33 1的上方位置裝設有至少一反射鏡組332，於本實施例中，該反射鏡組332係裝設於第一移載取放器315或第二移載取放器316上，該反射鏡組332並架設呈適當傾角角度，以於第一移載取放器315或第二移載取放器316移動對應於作業區32之承置座322上方位置時，可將承置座322的俯視影像投影於該反射鏡組332中，再由取像器331由下往上擷取反射鏡組332中承置座322的俯視影像，進而可由單一個的取像器331同時擷取電子元件36底部的仰視影像及承置座322的俯視影像，達到簡化作業時間及降低設備成本之效益，接著影像擷取裝置33再將取像所得之電子元件36底部的仰視影像及承置座322的俯視影像傳輸至比對裝置，比對裝置於接收影像擷取裝置33傳輸之電子元件36底部的仰視影像及承置座322的俯視影像後，比對判斷電子元件36是否精準正確擺置及承置座322內部是否殘留有受損電子元件或餘屑或灰塵等異物，若判斷為異常時，則可通知工作人員進行異常狀況排除，於本實施例中，更包含設有對位調整裝置35，以於電子元件36擺置偏差時作位置或角度之補償校正，於本實施例中，該對位調整裝置35係於第一移載取放器315或第二移載取放器316上架置多層式的調整平台，以第一移載取放器315為例，該調整平台上方為固定座351，固定座351下方架設有一可由X軸向調整件352驅動作X軸向滑移之第一滑動座353，第一滑動座353下方再架設有一可由Y軸向調整件354驅動作Y軸向滑移及可由角度調整件355驅動作角度調整之第二滑動座356，第一移載取放器315取放電子元件之吸持件3151則固定於第二滑動座356下方；由於多層式的調整平台已為習知的技術，因此其動作不再贅述，進而使得電子元件36可於第一移載取放器315或第二移載取放器316上進行對位調整，以準確的將電子元件36置放於承置座322內，並使電子元件36之接腳或錫球361可以精準的電性接觸承置座322內之電性接點323。 In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment will be described in conjunction with the drawings, which will be described in detail later. Referring to FIG. 4, the working unit 30 of the present invention is provided on the machine. a transfer pick-and-place device 31, at least one work area 32, at least one image capture device 33, and a comparison device (not shown); the transfer pick-and-place device 31 is an electronic component that can move to perform work In the present embodiment, the transfer pick-and-place device 31 includes a first feeding stage 311 and a first receiving stage 312 located on the first side of the working area 32, and is located at the working position. The second loading stage 313 and the second receiving stage 314 on the second side of the area 32, and the first transfer loading between the working area 32 and the first feeding stage 311 and the first receiving stage 312 The discharger 315 and the second transfer picker 316 moving between the work area 32 and the second supply stage 313 and the second receiving stage 314; the first supply stage located on the first side of the work area 32 The 311 has at least one first feeding socket 3111 for receiving the electronic components of the work to be performed at the feeding position, and can be moved to the corresponding working area 32 The lateral position of the first receiving platform 312 has at least one first receiving socket 3121, and can be moved to the lateral position of the corresponding working area 32 to receive the electronic components of the work and move to the receiving position. Material location, located in the work area 32 The second feeding platform 313 of the second side has at least one second feeding socket 3131 for receiving the electronic components of the work to be performed at the feeding position, and can be moved to the lateral position of the corresponding working area 32. The second receiving platform 314 has at least one second receiving socket 3141 and can be moved to a lateral position of the corresponding working area 32 to receive the electronic components of the work and move to the receiving position. A transfer picker 315 is movable to the first feed stage 311 position on the first side to transfer the electronic components of the first supply stage 311 to be executed to the work area 32 position, or The electronic component of the work area 32 is transferred to the first receiving stage 312, and the second transfer picker 316 is movable to the second feeding stage 313 of the second side to provide the second supply. The electronic components of the material to be executed on the material stage 313 are transferred to the working area 32, or the electronic components of the working area 32 are transferred to the second receiving stage 314; at least one working area 32, the working area 32 An electronic component that can be placed into a job to be executed to perform a preset job on the electronic component, the pre- The operation may be printing, molding, appearance inspection or electrical test. In the embodiment, the working area 32 performs an electrical test operation, and the test circuit board 321 is disposed in the work area 32, and the test circuit board is provided. The 321 is provided with a mounting base 322 for the electronic component to be placed. Since the present embodiment is for performing an electrical test operation, the mounting base 322 is provided with a plurality of electrical contacts 323 connected to the circuit board 321 to The pins or solder balls of the electronic components are electrically contacted with the electrical contacts 323; please refer to Figures 4 and 5, in order to confirm whether there are any residual electronic components, foreign materials such as debris or dust in the socket 322, and A transfer picker 315 or a second transfer pick and place 316 can accurately place the electronic component 36 in the socket 322, and the pin or the solder ball 361 of the electronic component 36 can be accurately electrically contacted. The present invention is provided with an image capturing device 33 and a matching device (not shown). In the embodiment, the image capturing device 33 is attached to the machine table. At least one CCD image finder 331 is provided, but the first transfer picker 315 or the second shift When the picker 316 moves to a position above the receiving base 322 of the working area 32, the electronic component 36 on the first transfer picker 315 or the second transfer picker 316 is captured from the bottom up. The bottom view image, the image capture device 33 is further connected to the corresponding image capture device 33 At least one mirror group 332 is disposed at an upper position of the mirror assembly 332. In the embodiment, the mirror group 332 is mounted on the first transfer pick-and-place 315 or the second transfer pick-and-place 316. The mirror group 332 is erected at an appropriate angle of inclination so that the holder 322 can be placed when the first transfer picker 315 or the second transfer picker 316 moves to a position above the holder 322 of the work area 32. The top view image is projected into the mirror group 332, and the viewfinder 331 captures the top view image of the mount 322 in the mirror group 332 from the bottom up, and the electronic image capture device 331 can simultaneously capture the electrons. The bottom view image of the bottom of the component 36 and the top view image of the mounting base 322 are used to simplify the operation time and reduce the cost of the device. Then, the image capturing device 33 takes the bottom image of the electronic component 36 and the mounting base 322 of the obtained electronic component 36. The top view image is transmitted to the comparison device, and the comparison device receives the top view image of the bottom of the electronic component 36 and the top view image of the mounting base 322 transmitted by the image capturing device 33, and then compares and determines whether the electronic component 36 is accurately and correctly placed and Whether there is damage inside the socket 322 If the child component or the foreign matter such as the residual material or the dust is abnormal, the worker can be notified to perform the abnormality elimination. In the embodiment, the alignment adjusting device 35 is further provided to dispose the electronic component 36. In the present embodiment, the alignment adjustment device 35 is mounted on the first transfer pick-and-place 315 or the second transfer pick-and-place 316 to mount a multi-layer adjustment platform. For example, a loading and unloading device 315 is disposed on the upper surface of the adjusting platform. The first sliding seat 353 is driven by the X-axis adjusting member 352 to be X-axis sliding. A second sliding seat 356 which can be driven by the Y-axis adjusting member 354 for Y-axis sliding and angularly adjustable by the angle adjusting member 355 is disposed under the 353. The first transfer pick-and-place device 315 picks up the electronic component. The holding member 3151 is fixed under the second sliding seat 356; since the multi-layer adjusting platform has been a well-known technology, its operation will not be described again, so that the electronic component 36 can be used in the first transfer picker 315 or the first Two transfer loaders 316 for alignment , With accurate electronic component 36 disposed within the bearing housing seat 322, and the pin electronics 36 of the ball 361 or tin can be electrically precise within electrical contact 322 contacts bearing housing seat 323.
請參閱第6圖，本發明之作業單元30於執行作業時，其係由移載取放裝置31將待執行作業之電子元件移載至對應作業區32位置，於本實施例中，移載取放裝置31之第一供料載台311係將第一供料承座3111內待執行作業之電子元件36移載至對應作業區32的側方位置，第一移載取放器315並移動至第一供料載台311上方位置，以吸取待執行作業之電子元件36。請參閱第7圖，接著第一移載取放器315移載待執行作業之電子元件36至對應於作業區32之承置座322的上方位置。 Referring to FIG. 6, when the work unit 30 of the present invention performs the work, the electronic components of the work to be executed are transferred to the corresponding work area 32 by the transfer pick-and-place device 31. In this embodiment, the transfer is performed. The first feeding stage 311 of the pick-and-place device 31 transfers the electronic component 36 of the first feeding socket 3111 to be executed to the lateral position of the corresponding working area 32, and the first loading and unloading device 315 Moving to a position above the first supply stage 311 to draw the electronic component 36 of the job to be performed. Referring to FIG. 7, the first transfer picker 315 then transfers the electronic component 36 of the work to be performed to a position above the holder 322 corresponding to the work area 32.
請參閱第8圖，本發明為了確保承置座322內未殘留有電子元件或餘屑或灰塵等異物，以及使待執行作業之電子元件36可以精準對位放置於作業區32之承置座322內，接著由影像擷取裝置33之取像器331及反射鏡組332，擷取承置座322的俯視影像及第一移載取放器315上待執行作業之電子元件36底部的仰視影像，進而可由單一個的取像器331同時擷取二種即時影像資料，達到簡化作業時間及降低設備成本之效益，影像擷取裝置33再將該二種即時影像資料傳輸至比對裝置進行比對，比對裝置於接收影像擷取裝置33傳輸之二種即時影像資料後，比對判斷電子元件36是否精準正確擺置及承置座322內部是否殘留電子元件或餘屑或灰塵等異物，如果判斷發現承置座322內部殘留有受損電子元件餘屑或灰塵等異物時，可通知工作人員進行異常狀況排除，如果判斷發現電子元件36擺置偏差時，除可通知工作人員進行異常狀況排除外，亦可由對位調整裝置35作位置或角度之補償校正。 Referring to FIG. 8 , in order to ensure that no foreign matter such as electronic components or residual debris or dust remains in the socket 322 , and the electronic component 36 of the work to be performed can be accurately placed in the bearing seat of the working area 32 . In the 322, the image capturing device 331 and the mirror group 332 of the image capturing device 33 are used to capture the top view image of the mounting base 322 and the bottom view of the bottom of the electronic component 36 on the first transfer pick-and-place device 315 to be executed. The image capture device 331 can simultaneously capture two kinds of real-time image data, thereby simplifying the operation time and reducing the cost of the device, and the image capturing device 33 transmits the two kinds of real-time image data to the comparison device. After the comparison, the comparison device receives the two kinds of real-time image data transmitted by the image capturing device 33, and compares whether the electronic component 36 is accurately and correctly placed and whether the electronic component or the foreign matter such as waste or dust remains in the socket 322. If it is judged that there is any foreign matter such as debris or dust of the damaged electronic component remaining inside the socket 322, the worker may be notified to perform the abnormality elimination, and if it is judged that the electronic component 36 is placed The difference, in addition to inform staff exclude abnormal conditions, it can also compensate for the alignment adjustment means 35 for correcting the position or angle.
請參閱第9圖，經由比對裝置進行比對後，如承置座322內部未發現殘留有電子元件或餘屑或灰塵等異物，以及電子元件36擺置未超出誤差範圍或超出誤差範圍而完成對位調整，電子元件36則再由第一移載取放器315直接下降移入承置座322，進而使電子元件36之接腳或錫球361可以精準的電性接觸承置座322內之電性接點323，於本實施例中，該電性測 試作業係採壓測的方式進行，其第一移載取放器315將待執行作業之電子元件36置入作業區32之承置座322內後，係以第一移載取放器315保持壓抵於待執行作業之電子元件36的上方，以確保待執行作業之電子元件36的接腳或錫球361可保持電性接觸承置座322內之電性接點323。 Referring to FIG. 9 , after the comparison device is compared, if no foreign matter such as electronic components or residual debris or dust remains in the interior of the socket 322, and the electronic component 36 is placed outside the error range or exceeds the error range. After the alignment adjustment is completed, the electronic component 36 is directly lowered and moved into the socket 322 by the first transfer handler 315, so that the pin or the solder ball 361 of the electronic component 36 can accurately contact the socket 322. Electrical contact 323, in this embodiment, the electrical measurement The test operation is performed by a pressure measurement method. After the first transfer picker 315 puts the electronic component 36 of the work to be executed into the socket 322 of the work area 32, the first transfer picker 315 is used. The pressure is maintained against the upper portion of the electronic component 36 to be performed to ensure that the pins or solder balls 361 of the electronic component 36 to be executed remain electrically in contact with the electrical contacts 323 within the socket 322.
請參閱第10圖，在第一移載取放器315壓抵待執行作業之電子元件36執行電性測試作業時，第二移載取放器316係移動至第二供料載台313位置，並準備吸取第二供料載台313內另一待執行作業之電子元件37。請參閱第11圖，作業區32完成電子元件36的電性測試作業後，係由移載取放裝置31將完成作業之電子元件移出作業區32，於本實施例中，其係以第一移載取放器315將電子元件36移出作業區32之承置座322，並將電子元件36移載放置於第一收料載台312上，第一收料載台312再將完成作業之電子元件36移載至收料位置；此時由於第一移載取放器315已經移出作業區32，而由第二移載取放器316接替將待執行作業之電子元件37移載至作業區32位置，以進行相同的作業。 Referring to FIG. 10, when the first transfer handler 315 is pressed against the electronic component 36 to be executed to perform an electrical test operation, the second transfer handler 316 is moved to the second supply stage 313 position. And preparing to take up the electronic component 37 of another work to be performed in the second supply stage 313. Referring to FIG. 11, after the work area 32 completes the electrical test operation of the electronic component 36, the electronic component that completes the work is removed from the work area 32 by the transfer pick-and-place device 31. In this embodiment, it is first. The transfer picker 315 moves the electronic component 36 out of the mounting base 322 of the working area 32, and the electronic component 36 is placed on the first receiving stage 312, and the first receiving stage 312 will complete the operation. The electronic component 36 is transferred to the receiving position; at this time, since the first transfer picker 315 has been removed from the work area 32, the second transfer picker 316 takes over the transfer of the electronic component 37 to be executed to the job. Zone 32 location to perform the same job.
請參閱第12圖，本發明影像擷取裝置33之另一實施例，其係於機台台面設有至少一反射鏡組332，於本實施例中，該反射鏡組332架設呈適當傾角角度，以於第一移載取放器315或第二移載取放器316移動對應於反射鏡組332上方位置時，可將電子元件36底部的仰視影像投影於該反射鏡組332中，影像擷取裝置33另於對應反射鏡組332的上方位置裝設有至少一為CCD之取像器331，於本實施例中，該取像器331係裝設於第一移載取放器315或第二移載取放器316上，而可由上往下擷取反射鏡組332中電子元件36底部的仰視影像，並於第一移載取放器315或第二移載取放器316移動對應於作業區32之承置座322上方位置時，由上往下擷取承置座322的俯視影像，相同的可由單一個的取像器331同時擷取承置座322的俯視影像及電子元件36底部的仰視影像，進 而可由單一個的取像器331同時擷取二種即時影像資料，達到簡化作業時間及降低設備成本之效益，影像擷取裝置33再將取像所得之二種即時影像資料傳輸至比對裝置，比對裝置於接收影像擷取裝置33傳輸之二種即時影像資料後，比對判斷承置座322內部是否殘留有電子元件或餘屑或灰塵等異物及電子元件36是否精準正確擺置，以使電子元件36之接腳或錫球361可以精準的電性接觸承置座322內之電性接點323。 Referring to FIG. 12, another embodiment of the image capturing device 33 of the present invention is provided with at least one mirror group 332 on the machine table. In the embodiment, the mirror group 332 is erected at an appropriate angle of inclination. When the first transfer picker 315 or the second transfer picker 316 moves corresponding to the position above the mirror set 332, the bottom view image of the bottom of the electronic component 36 can be projected into the mirror set 332. The capturing device 33 is further provided with at least one CCD image capturing device 331 at a position above the corresponding mirror group 332. In the embodiment, the image capturing device 331 is mounted on the first loading and unloading device 315. Or the second transfer picker 316, and the bottom view image of the bottom of the electronic component 36 in the mirror group 332 can be captured from the top down, and the first transfer picker 315 or the second transfer picker 316 When the position corresponding to the upper position of the receiving base 322 of the working area 32 is moved, the top view image of the receiving base 322 is taken up from the top, and the same viewfinder image of the mounting base 322 can be simultaneously captured by the single image taking unit 331 and Looking up at the bottom of the electronic component 36, into The image capturing device 33 can transmit the two types of real-time image data obtained by the image capturing device to the comparing device by simultaneously capturing two kinds of real-time image data from a single image capturing device 331 to achieve the advantages of simplifying the working time and reducing the cost of the device. After comparing the two types of real-time image data transmitted by the image capturing device 33, the comparison device determines whether the electronic component, the foreign matter such as the residual debris or the dust, and the electronic component 36 are accurately and correctly placed inside the socket 322. The pins or solder balls 361 of the electronic component 36 can electrically contact the electrical contacts 323 in the socket 322 accurately.
請參閱第13圖，本發明之作業單元30應用於作業設備時，以測試分類機為例，其係於機台上設有供料裝置40、輸入端輸送裝置50、作業單元30、輸出端輸送裝置60及收料裝置70；輸入端輸送裝置50係將供料裝置40上待執行測試作業之電子元件分別輸送至作業單元30之第一供料載台311及第二供料載台313，作業單元30之第一收料載台312及第二收料載台314上完成測試作業之電子元件，則依據測試結果由輸出端輸送裝置60輸送至收料裝置70分類放置，中央控制單元係用以控制及整合各裝置作動，以執行自動化作業，達到提升作業效能之實用效益。 Referring to FIG. 13 , when the working unit 30 of the present invention is applied to a working device, the test sorting machine is taken as an example, and the feeding machine is provided with a feeding device 40, an input conveying device 50, a working unit 30, and an output end. The conveying device 60 and the receiving device 70; the input end conveying device 50 is configured to respectively convey the electronic components of the feeding device 40 to be tested to the first feeding stage 311 and the second feeding stage 313 of the working unit 30. The electronic components of the first receiving stage 312 and the second receiving stage 314 of the working unit 30 that complete the testing operation are transported by the output conveying device 60 to the receiving device 70 according to the test result, and the central control unit is placed. It is used to control and integrate the operation of each device to perform automated operations and achieve practical benefits of improving operational efficiency.
習知部分： Conventional part:
10‧‧‧熱測室 10‧‧‧Thermal test room
11‧‧‧測試台 11‧‧‧ test bench
12‧‧‧CCD 12‧‧‧CCD
20‧‧‧供料裝置 20‧‧‧Feeding device
21‧‧‧輸入端輸送裝置 21‧‧‧Input conveyor
22‧‧‧作業區 22‧‧‧Working area
221‧‧‧供料載具 221‧‧‧Feeding vehicle
2211‧‧‧承座 2211‧‧‧ socket
2212‧‧‧調整件 2212‧‧‧Adjustment
2213‧‧‧調整件 2213‧‧‧Adjustment
2214‧‧‧調整件 2214‧‧‧Adjustment
2215‧‧‧滑軌組 2215‧‧‧Slide group
221‧‧‧第一收料載具 221‧‧‧First receiving vehicle
223‧‧‧第二收料載具 223‧‧‧Second receiving vehicle
224‧‧‧測試站 224‧‧‧ test station
225‧‧‧取像機構 225‧‧‧Image agency
226‧‧‧第一移載取放器 226‧‧‧First transfer picker
227‧‧‧第二移載取放器 227‧‧‧Second transfer picker
23‧‧‧輸出端輸送裝置 23‧‧‧Output conveyor
24‧‧‧收料裝置 24‧‧‧ Receiving device
本發明部分： Part of the invention:
30‧‧‧作業單元 30‧‧‧Operating unit
31‧‧‧移載取放裝置 31‧‧‧Transfer pick and place device
311‧‧‧第一供料載台 311‧‧‧First feeding platform
3111‧‧‧第一供料承座 3111‧‧‧First supply seat
312‧‧‧第一收料載台 312‧‧‧First receiving platform
3121‧‧‧第一收料承座 3121‧‧‧First receiving seat
313‧‧‧第二供料載台 313‧‧‧Second feed stage
3131‧‧‧第二供料承座 3131‧‧‧Second feed holder
314‧‧‧第二收料載台 314‧‧‧Second receiving platform
3141‧‧‧第二收料承座 3141‧‧‧Second receipt holder
315‧‧‧第一移載取放器 315‧‧‧First Transfer Picker
3151‧‧‧吸持件 3151‧‧‧ holding parts
316‧‧‧第二移載取放器 316‧‧‧Second transfer picker
32‧‧‧作業區 32‧‧‧Working area
321‧‧‧測試電路板 321‧‧‧Test circuit board
322‧‧‧承置座 322‧‧‧Hosting
323‧‧‧電性接點 323‧‧‧Electrical contacts
33‧‧‧影像擷取裝置 33‧‧‧Image capture device
331‧‧‧取像器 331‧‧‧Imager
332‧‧‧反射鏡組 332‧‧‧Mirror group
35‧‧‧對位調整裝置 35‧‧‧ alignment adjustment device
351‧‧‧固定座 351‧‧‧ fixed seat
352‧‧‧X軸向調整件 352‧‧‧X axial adjustment
353‧‧‧第一滑動座 353‧‧‧First sliding seat
354‧‧‧Y軸向調整件 354‧‧‧Y axial adjustment
355‧‧‧角度調整件 355‧‧‧Angle adjustment
356‧‧‧第二滑動座 356‧‧‧Second sliding seat
36‧‧‧電子元件 36‧‧‧Electronic components
361‧‧‧錫球 361‧‧‧ solder balls
37‧‧‧電子元件 37‧‧‧Electronic components
40‧‧‧供料裝置 40‧‧‧Feeding device
50‧‧‧輸入端輸送裝置 50‧‧‧Input conveyor
60‧‧‧輸出端輸送裝置 60‧‧‧Output conveying device
70‧‧‧收料裝置 70‧‧‧Receiving device
第1圖：台灣申請第94124172號檢測機之示意圖。 Figure 1: Schematic diagram of Taiwan's application for the inspection machine No. 94124172.
第2圖：台灣申請第96149417號專利案於測試分類機之配置示意圖。 Figure 2: Schematic diagram of the configuration of the Taiwan patent application No. 96194417 in the test classification machine.
第3圖：台灣申請第96149417號專利案作業區之配置示意圖。 Figure 3: Schematic diagram of the configuration of the operating area of Taiwan Patent Application No. 96194417.
第4圖：本發明作業單元之配置示意圖。 Figure 4: Schematic diagram of the configuration of the working unit of the present invention.
第5圖：本發明作業單元之影像擷取裝置之示意圖。 Figure 5 is a schematic view of an image capture device of the working unit of the present invention.
第6圖：本發明作業單元之動作示意圖(一)。 Figure 6: Schematic diagram of the operation of the working unit of the present invention (1).
第7圖：本發明作業單元之動作示意圖(二)。 Figure 7: Schematic diagram of the operation of the working unit of the present invention (2).
第8圖：本發明作業單元之動作示意圖(三)。 Figure 8: Schematic diagram of the operation of the working unit of the present invention (3).
第9圖：本發明作業單元之動作示意圖(四)。 Figure 9: Schematic diagram of the operation of the working unit of the present invention (4).
第10圖：本發明作業單元之動作示意圖(五)。 Figure 10: Schematic diagram of the operation of the working unit of the present invention (5).
第11圖：本發明作業單元之動作示意圖(六)。 Figure 11: Schematic diagram of the operation of the working unit of the present invention (6).
第12圖：本發明影像擷取裝置之另一實施例圖。 Fig. 12 is a view showing another embodiment of the image capturing device of the present invention.
第13圖：本發明作業單元應用於作業設備之配置示意圖。 Figure 13 is a schematic view showing the configuration of the working unit of the present invention applied to the working equipment.
315‧‧‧第一移載取放器 315‧‧‧First Transfer Picker
3151‧‧‧吸持件 3151‧‧‧ holding parts
316‧‧‧第二移載取放器 316‧‧‧Second transfer picker
32‧‧‧作業區 32‧‧‧Working area
321‧‧‧測試電路板 321‧‧‧Test circuit board
322‧‧‧承置座 322‧‧‧Hosting
323‧‧‧電性接點 323‧‧‧Electrical contacts
33‧‧‧影像擷取裝置 33‧‧‧Image capture device
331‧‧‧取像器 331‧‧‧Imager
332‧‧‧反射鏡組 332‧‧‧Mirror group
35‧‧‧對位調整裝置 35‧‧‧ alignment adjustment device
351‧‧‧固定座 351‧‧‧ fixed seat
352‧‧‧X軸向調整件 352‧‧‧X axial adjustment
353‧‧‧第一滑動座 353‧‧‧First sliding seat
354‧‧‧Y軸向調整件 354‧‧‧Y axial adjustment
355‧‧‧角度調整件 355‧‧‧Angle adjustment
356‧‧‧第二滑動座 356‧‧‧Second sliding seat
36‧‧‧電子元件 36‧‧‧Electronic components
361‧‧‧錫球 361‧‧‧ solder balls
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101151000A TWI467197B (en) | 2012-12-28 | 2012-12-28 | An electronic component operating unit for an image capturing device, and a working device for its application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101151000A TWI467197B (en) | 2012-12-28 | 2012-12-28 | An electronic component operating unit for an image capturing device, and a working device for its application |
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| Publication Number | Publication Date |
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| TW201425959A true TW201425959A (en) | 2014-07-01 |
| TWI467197B TWI467197B (en) | 2015-01-01 |
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|---|---|---|---|
| TW101151000A TWI467197B (en) | 2012-12-28 | 2012-12-28 | An electronic component operating unit for an image capturing device, and a working device for its application |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI595247B (en) * | 2015-03-30 | 2017-08-11 | Seiko Epson Corp | Electronic parts conveying apparatus and electronic parts inspection apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI811770B (en) * | 2021-08-23 | 2023-08-11 | 鴻勁精密股份有限公司 | Transmission mechanism, testing equipment, detecting method, and handler using the same |
| TWI794992B (en) * | 2021-09-24 | 2023-03-01 | 英業達股份有限公司 | System and method for controlling test jig machine continues to operate based on test results |
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| SG138491A1 (en) * | 2006-06-21 | 2008-01-28 | Generic Power Pte Ltd | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components |
| TWM327261U (en) * | 2007-05-25 | 2008-02-21 | Smart Chain Entpr Co Ltd | Automatic positioning device for faceplate under test |
| TWM414656U (en) * | 2011-05-20 | 2011-10-21 | Hon Tech Inc | Electronic component tester with image-taking device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI595247B (en) * | 2015-03-30 | 2017-08-11 | Seiko Epson Corp | Electronic parts conveying apparatus and electronic parts inspection apparatus |
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