TWI525742B - 基底傳送設備和基底加工設備 - Google Patents

基底傳送設備和基底加工設備 Download PDF

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Publication number
TWI525742B
TWI525742B TW102141165A TW102141165A TWI525742B TW I525742 B TWI525742 B TW I525742B TW 102141165 A TW102141165 A TW 102141165A TW 102141165 A TW102141165 A TW 102141165A TW I525742 B TWI525742 B TW I525742B
Authority
TW
Taiwan
Prior art keywords
transfer table
shaft
substrate
air bearing
suction
Prior art date
Application number
TW102141165A
Other languages
English (en)
Chinese (zh)
Other versions
TW201420467A (zh
Inventor
沈亨基
金賢中
安珍榮
車恩熙
Original Assignee
Ａｐ系統股份有限公司
三星顯示有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ａｐ系統股份有限公司, 三星顯示有限公司 filed Critical Ａｐ系統股份有限公司
Publication of TW201420467A publication Critical patent/TW201420467A/zh
Application granted granted Critical
Publication of TWI525742B publication Critical patent/TWI525742B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW102141165A 2012-11-13 2013-11-13 基底傳送設備和基底加工設備 TWI525742B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120128136A KR101403458B1 (ko) 2012-11-13 2012-11-13 기판 이송 장치 및 기판 처리 장치

Publications (2)

Publication Number Publication Date
TW201420467A TW201420467A (zh) 2014-06-01
TWI525742B true TWI525742B (zh) 2016-03-11

Family

ID=50707975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102141165A TWI525742B (zh) 2012-11-13 2013-11-13 基底傳送設備和基底加工設備

Country Status (4)

Country Link
JP (1) JP5925747B2 (ko)
KR (1) KR101403458B1 (ko)
CN (1) CN103811386B (ko)
TW (1) TWI525742B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101983327B1 (ko) 2016-07-26 2019-05-29 에이피시스템 주식회사 레이저 처리장치
CN112828485B (zh) * 2020-12-31 2023-03-24 南昌航空大学 一种用于止推顶箔微激光点焊的装置
CN114724999B (zh) * 2022-03-31 2023-01-03 先之科半导体科技(东莞)有限公司 一种二极管入料座
CN117276160B (zh) * 2023-11-21 2024-02-13 上海隐冠半导体技术有限公司 一种气浮刹车装置、运动装置及气浮刹车装置的控制方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141536A (ja) * 1982-02-17 1983-08-22 Sanyo Electric Co Ltd 半導体ウエハ−の吸着ヘツド
KR0131754Y1 (ko) * 1995-12-27 1999-02-01 문정환 스테이지 구동장치
JP2000264411A (ja) * 1999-03-17 2000-09-26 Mitsubishi Heavy Ind Ltd 浮上移動台車
JP2002217082A (ja) * 2001-01-12 2002-08-02 Nikon Corp ステージ装置及び露光装置
US7313926B2 (en) * 2005-01-18 2008-01-01 Rexorce Thermionics, Inc. High efficiency absorption heat pump and methods of use
JP4782710B2 (ja) * 2006-03-02 2011-09-28 住友重機械工業株式会社 ステージ装置
TWI457193B (zh) * 2006-03-02 2014-10-21 Sumitomo Heavy Industries Stage device
JP2009210295A (ja) * 2008-02-29 2009-09-17 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
KR100982345B1 (ko) * 2008-05-14 2010-09-15 주식회사 쎄믹스 레이저 리페어 시스템을 위한 척 플레이트 이송장치
JP2010286784A (ja) * 2009-06-15 2010-12-24 Canon Inc ステージ装置、露光装置およびデバイス製造方法
KR101089626B1 (ko) * 2009-07-24 2011-12-06 에이피시스템 주식회사 기판 이송이 에어 베어링을 통해 이루어지는 레이저 열처리 장치
JP2011133724A (ja) * 2009-12-25 2011-07-07 Nikon Corp 流体静圧軸受、移動体装置、露光装置、デバイス製造方法、及び清掃装置
KR20110131011A (ko) * 2010-05-28 2011-12-06 (유)에스엔티 스크린 프린터의 클리닝 장치 및 이를 구비하는 스크린 프린터
JP5454971B2 (ja) * 2012-04-13 2014-03-26 株式会社日本製鋼所 移動ステージ

Also Published As

Publication number Publication date
JP2014099607A (ja) 2014-05-29
TW201420467A (zh) 2014-06-01
JP5925747B2 (ja) 2016-05-25
CN103811386B (zh) 2017-04-12
KR20140061614A (ko) 2014-05-22
KR101403458B1 (ko) 2014-06-30
CN103811386A (zh) 2014-05-21

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