TWI505904B - Device for clamping planar disk-shaped articles - Google Patents
Device for clamping planar disk-shaped articles Download PDFInfo
- Publication number
- TWI505904B TWI505904B TW102103615A TW102103615A TWI505904B TW I505904 B TWI505904 B TW I505904B TW 102103615 A TW102103615 A TW 102103615A TW 102103615 A TW102103615 A TW 102103615A TW I505904 B TWI505904 B TW I505904B
- Authority
- TW
- Taiwan
- Prior art keywords
- clamping
- rotating body
- electromagnets
- elements
- wafer
- Prior art date
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Description
本案係關於半導體技術領域，特別關於一種夾持平面盤狀物的裝置。This case relates to the field of semiconductor technology, and more particularly to a device for holding a flat disk.
本申請案主張2012年2月17日申請之大陸申請案第201210037911.2號之優先權，該等案至全文以引用的方式併入本文中。The present application claims priority to PCT Application No. 201210037911.2, filed on Feb. 17, 2012, which is hereby incorporated by reference.
在晶圓生產過程中，需要對晶圓進行清洗，但由於在晶圓清洗的過程中需要使晶圓進行高速旋轉，因而需要通過夾持元件來帶動晶圓旋轉，夾持元件在本技術領域內應用最多的是銷夾盤、伯努利吸盤等，在公開號為CN101587851A的大陸申請案中公開了一種利用離心力將晶圓卡緊，利用磁鐵的排斥力來打開晶圓的裝置，但由於無法對夾持元件與晶圓接觸的地方進行有效地清洗，在乾燥後常形成晶圓表面邊緣和夾持元件接觸地方的污染，即“水印”，從而在分子外延、熱擴散等晶圓製造工藝過程中造成水印在晶圓表面邊緣的揮發、擴散而導致晶圓表面品質的缺陷，從而影響晶圓整體品質。In the wafer production process, the wafer needs to be cleaned. However, since the wafer needs to be rotated at a high speed during the wafer cleaning process, the wafer rotation is required by the clamping component, and the clamping component is in the technical field. The most widely used ones are pin chucks, Bernoulli chucks, etc. In the Continental Application Publication No. CN101587851A, a device for clamping a wafer by centrifugal force and using a repulsive force of a magnet to open the wafer is disclosed, but It is impossible to effectively clean the place where the clamping element is in contact with the wafer, and often forms a contamination of the surface of the wafer surface and the contact point of the clamping member after drying, that is, "watermark", thereby manufacturing wafers such as molecular epitaxy and thermal diffusion. During the process, the watermark is volatilized and diffused at the edge of the wafer surface, which causes defects in the quality of the wafer surface, thereby affecting the overall quality of the wafer.
本發明所要解決之技術問題在於如何在晶圓清洗的過程中，對夾持元件與晶圓接觸的地方進行有效清洗。The technical problem to be solved by the present invention is how to effectively clean the place where the clamping member is in contact with the wafer during the wafer cleaning process.
為實現上述目的，本發明提供一種夾持平面盤狀物的裝置，該裝置包括：一圓柱形的旋轉主體、兩組夾持元件、一空心圓筒形的電磁鐵保持架、以及若干電磁鐵，每組夾持元件具有至少三個夾持元件，該旋轉主體的側壁上設有與該夾持元件個數相同的基座，該兩組夾持元件通過該基座安裝於該旋轉主體的側壁上，該兩組夾持元件通過一旋轉軸與該基座連接，該電磁鐵保持架繞該旋轉主體一周且內壁與該旋轉主體的外壁呈預設距離，該若干電磁鐵沿該電磁鐵保持架徑向設於該電磁鐵保持架的內部，在該夾持元件上設有一磁性單元，每組夾持元件中各個夾持元件的磁性單元沿徑向的極性相同，該兩組夾持元件之間的磁性單元沿徑向的極性相反，在該基座上與該夾持元件下部相對處設有一張力單元，該夾持元件繞該旋轉軸旋轉。To achieve the above object, the present invention provides a device for holding a flat disk, the device comprising: a cylindrical rotating body, two sets of clamping elements, a hollow cylindrical electromagnet holder, and a plurality of electromagnets Each set of clamping elements has at least three clamping elements, and the side wall of the rotating body is provided with the same number of bases as the clamping elements, and the two sets of clamping elements are mounted on the rotating body through the base On the side wall, the two sets of clamping elements are connected to the base through a rotating shaft, the electromagnet holder is around the rotating body and the inner wall is at a predetermined distance from the outer wall of the rotating body, and the plurality of electromagnets are along the electromagnetic The iron cage is radially disposed inside the electromagnet holder, and a magnetic unit is disposed on the clamping member, and the magnetic units of each of the clamping members of each group have the same polarity in the radial direction. The magnetic units between the holding elements are opposite in polarity in the radial direction, and a force unit is provided on the base opposite to the lower portion of the holding member, the holding member being rotated about the rotating shaft.
優選地，該張力單元為壓縮彈簧，且沿徑向設置。Preferably, the tensioning unit is a compression spring and is disposed in a radial direction.
優選地，該磁性單元為沿徑向設置的永磁鐵。Preferably, the magnetic unit is a permanent magnet disposed in a radial direction.
優選地，該基座上設有一調整單元，用於調整該夾持元件繞該旋轉軸旋轉的最大角度。Preferably, the base is provided with an adjusting unit for adjusting the maximum angle of rotation of the clamping element about the rotating shaft.
優選地，該旋轉主體上表面設有至少三個平面盤狀物支撐。Preferably, the upper surface of the rotating body is provided with at least three flat disc supports.
優選地，該夾持元件用於夾持一平面盤狀物，該平面盤狀物為晶圓。Preferably, the clamping element is for holding a planar disk, the planar disk being a wafer.
承上所述，本案之夾持平面盤狀物的裝置，通過設置兩組夾持元件，在晶圓清洗的過程中通過輪換夾持來實現晶圓上表面的完全清洗，有效提高了晶圓的整體品質。According to the above description, the device for holding the flat disc in the present case has the two sets of clamping elements, and the wafer upper surface is completely cleaned by the rotation clamping during the wafer cleaning process, thereby effectively improving the wafer. The overall quality.
為讓本發明之上述和其他特徵和優點能更明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。The above and other features and advantages of the present invention will become more apparent from the description of the appended claims.
以下將配合圖式及實施例來詳細說明本發明之特徵與實施方式，內容足以使任何熟習相關技藝者能夠輕易地充分理解本發明解決技術問題所應用的技術手段並據以實施，藉此實現本發明可達成的功效，其中相同的元件將以相同的參照符號加以說明。The features and embodiments of the present invention will be described in detail below with reference to the drawings and embodiments, which are sufficient to enable those skilled in the art to fully understand the technical means to which the present invention solves the technical problems, and The achievable effects of the present invention will be explained by the same reference numerals.
下面以每組夾持元件具有三個夾持元件來說明本發明，但不限制本發明之專利保護範圍。參照圖1~5，該裝置包括：圓柱形的旋轉主體2、兩組夾持元件1，1' 、空心圓筒形的電磁鐵保持架3、以及若干電磁鐵4，每組夾持元件具有三個夾持元件(本實施方式中的三個夾持元件為等間隔設置)，該旋轉主體2的側壁上設有與該夾持元件個數相同的基座，該兩組夾持元件1，1' 通過該基座安裝於該旋轉主體2的側壁上，該兩組夾持元件1，1' 通過旋轉軸G與該基座連接。該電磁鐵保持架3繞該旋轉主體2一周且內壁與該旋轉主體2的外壁呈預設距離，電磁鐵4沿該電磁鐵保持架3徑向設於該電磁鐵保持架3的內部。在該夾持元件1，1' 上設有磁性單元，每組夾持元件中各個夾持元件的磁性單元沿徑向的極性相同，該兩組夾持元件之間的磁性單元沿徑向的極性相反，例如，第一組夾持 元件1的磁性單元的N極沿徑向向外，而第二組夾持元件1' 的磁性單元的N極則沿徑向向內，優選地，本實施方式中該磁性單元為沿徑向設置的永磁鐵7。在該基座上與該夾持元件下部相對處設有張力單元，優選地，本實施方式中該張力單元為壓縮彈簧5、且沿徑向設置，該夾持元件1，1' 能繞旋轉軸G旋轉。The invention will now be described with three clamping elements per clamping element, but without limiting the scope of the invention. Referring to Figures 1 to 5, the apparatus comprises: a cylindrical rotating body 2, two sets of clamping elements 1, 1 ' , a hollow cylindrical electromagnet holder 3, and a plurality of electromagnets 4, each set of clamping elements having Three clamping elements (the three clamping elements in the embodiment are disposed at equal intervals), and the side wall of the rotating body 2 is provided with the same number of bases as the clamping elements, the two sets of clamping elements 1 , 1 ' is mounted on the side wall of the rotating body 2 through the base, and the two sets of clamping elements 1, 1 ' are connected to the base via a rotating shaft G. The electromagnet holder 3 is wound around the rotating body 2 and the inner wall is at a predetermined distance from the outer wall of the rotating body 2. The electromagnet 4 is radially disposed inside the electromagnet holder 3 along the electromagnet holder 3. A magnetic unit is disposed on the clamping member 1, 1 ' , the magnetic units of each of the clamping elements of each group of clamping elements have the same polarity in the radial direction, and the magnetic unit between the two sets of clamping elements is radial The polarities are opposite, for example, the N poles of the magnetic elements of the first set of clamping elements 1 are radially outward, while the N poles of the magnetic elements of the second set of clamping elements 1 ' are radially inward, preferably In the embodiment, the magnetic unit is a permanent magnet 7 disposed in the radial direction. A tensioning unit is disposed on the base opposite to the lower portion of the clamping member. Preferably, in the present embodiment, the tensioning unit is a compression spring 5 and is disposed in a radial direction, and the clamping member 1, 1 ' can be rotated. The axis G rotates.
為便於調整夾持元件1，1' 的旋轉活動範圍，優選地，該基座上設有調整單元6，用於調整該夾持元件繞旋轉軸G旋轉的最大角度(通過調整圖4中的調整單元限位面S2的位置來調整該最大角度)，參照圖5，圖中的“α”為旋轉軸限位面S3與夾持元件鬆開晶圓時的限位面S4之間的夾角，也即為夾持元件繞旋轉軸旋轉的最大角度。In order to facilitate the adjustment of the range of rotational movement of the clamping element 1, 1 ' , preferably, the base is provided with an adjustment unit 6 for adjusting the maximum angle of rotation of the clamping element about the axis of rotation G (by adjusting the Adjusting the position of the unit limiting surface S2 to adjust the maximum angle), referring to FIG. 5, the "α" in the figure is the angle between the rotating shaft limiting surface S3 and the limiting surface S4 when the clamping element releases the wafer. That is, the maximum angle at which the clamping element rotates about the axis of rotation.
為便於平面盤狀物的放置，優選地，該旋轉主體2上表面設有至少三個平面盤狀物支撐8。In order to facilitate the placement of the planar disc, preferably, the upper surface of the rotating body 2 is provided with at least three planar disc supports 8.
優選地，該夾持元件用於夾持平面盤狀物，其中平面盤狀物可為晶圓W。該夾持元件與晶圓W接觸處可通過設置凹槽進行夾持，這樣可使夾持元件1，1' 的夾持點到旋轉主體2的中心距離稍小於晶圓半徑，藉此夾持元件能夠每次皆以相同的力夾持晶圓W，避免由於夾持力太小造成晶圓W相對旋轉主體2的相對滑動，該夾持元件與平面盤狀物接觸處也可不設置凹槽，通過摩擦力來進行夾持。Preferably, the clamping element is for holding a planar disk, wherein the planar disk can be a wafer W. The contact between the clamping member and the wafer W can be clamped by providing a groove, so that the center distance of the clamping point of the clamping member 1, 1 ' to the rotating body 2 is slightly smaller than the radius of the wafer, thereby clamping The component can hold the wafer W with the same force each time, avoiding the relative sliding of the wafer W relative to the rotating body 2 due to the clamping force being too small, and the clamping element may not be provided with the groove at the contact with the planar disk. , clamping by friction.
本實施方式的裝置的工作原理為：在清洗工藝過程開始時，先在旋轉主體2的平面盤狀物支撐8上放置晶圓W，並通過夾持元件1，1' 對晶圓W進行夾持，旋轉主體 2開始旋轉，由於夾持元件的關係，使得旋轉主體2帶動晶圓W進行旋轉，清洗液體噴射單元9噴射清洗液對晶圓W的上表面進行清洗。由於晶圓W的旋轉，能夠使清洗液比較均勻的覆蓋晶圓W的上表面，但該夾持元件1，1' 與晶圓W接觸處存在阻力和液體流動死區導致該處清洗液在甩乾的過程中無法完全甩乾，為使得該夾持元件與晶圓接觸處的清洗液完全甩乾，則通過如下兩個步驟：第一步，對電磁鐵4進行通電，使得電磁鐵4會對第一組夾持元件1的永磁鐵7之間產生排斥力，從而使得第一組夾持元件1克服壓縮彈簧5的張力和作用在第一組夾持元件1上的離心力，以使得第一組夾持元件1沿與其對應的旋轉軸G逆時針旋轉α角度，使第一組夾持元件1的限位面S1與調整單元限位元面S2接觸，此時，第一組夾持元件1處於完全打開狀態，第一組夾持元件1與晶圓W接觸處的殘留的液體被迅速甩乾，此時由於第二組夾持元件1' 的永磁鐵由於與第一組夾持元件1的永磁鐵沿徑向的極性相反，而不會打開；第二步，對電磁鐵4進行通電，使得電磁鐵4會對第二組夾持元件1' 的永磁鐵7之間產生排斥力，從而使得第二組夾持元件1' 克服壓縮彈簧5的張力和作用在第二組夾持元件1' 上的離心力，以使得第二組夾持元件1' 沿與其對應的旋轉軸G逆時針旋轉α角度，使第二組夾持元件1' 的限位面S1與調整單元的限位元面S2接觸，此時，第二組夾持元件1' 處於完全打開狀態，第二組夾持元件1' 與晶 圓W接觸處的殘留的液體被迅速甩乾，此時由於第一組夾持元件1的永磁鐵與第二組夾持元件1' 的永磁鐵沿徑向的極性相反，而不會打開。The working principle of the device of the present embodiment is that, at the beginning of the cleaning process, the wafer W is placed on the planar disk support 8 of the rotating body 2, and the wafer W is clamped by the clamping member 1, 1 ' . When the rotating body 2 starts to rotate, the rotating body 2 drives the wafer W to rotate due to the relationship between the holding elements, and the cleaning liquid ejecting unit 9 ejects the cleaning liquid to clean the upper surface of the wafer W. Due to the rotation of the wafer W, the cleaning liquid can be relatively uniformly covered on the upper surface of the wafer W, but the contact between the clamping member 1, 1 ' and the wafer W has a resistance and a liquid flow dead zone, resulting in the cleaning liquid at the place In the process of drying, it cannot be completely dried. In order to completely dry the cleaning liquid at the contact point between the clamping element and the wafer, the following two steps are performed: First, the electromagnet 4 is energized, so that the electromagnet 4 Repulsive forces are generated between the permanent magnets 7 of the first set of clamping elements 1 such that the first set of clamping elements 1 overcomes the tension of the compression spring 5 and the centrifugal force acting on the first set of clamping elements 1 such that The first group of clamping elements 1 rotates by an angle α counterclockwise along their corresponding rotation axis G, so that the limiting surface S1 of the first group of clamping elements 1 is in contact with the adjusting unit limiting element surface S2, at this time, the first group of clamping members Holding the component 1 in a fully open state, the residual liquid of the first set of clamping elements 1 in contact with the wafer W is rapidly dried, at this time due to the permanent magnet of the second set of clamping elements 1 ' due to the first set The permanent magnet holding the element 1 has the opposite polarity in the radial direction and does not open; , The electromagnet 4 is energized, the electromagnet 4 so that the second group of clamping elements have a "repulsive force is generated between the permanent magnet 7, so that the second group of clamping element 1 'against the action of tension and compression springs 5 The centrifugal force on the second set of clamping elements 1 ' such that the second set of clamping elements 1 ' rotate counterclockwise by an angle α along its corresponding axis of rotation G such that the limiting faces S1 of the second set of clamping elements 1 ' Contacting the limiting element surface S2 of the adjusting unit, at this time, the second group of clamping elements 1 ′ is in a fully open state, and the residual liquid of the second group of clamping elements 1 ′ in contact with the wafer W is quickly dried. At this time, since the permanent magnets of the first group of clamping members 1 and the permanent magnets of the second group of clamping members 1 ' have opposite polarities in the radial direction, they do not open.
清洗工藝完成後，旋轉主體2停在圖3所示位置，使夾持元件正對電磁鐵，對與第一組夾持元件1正對的電磁鐵4" 通電，使電磁鐵4" 與第一組夾持元件1內的永磁鐵產生排斥力，對於第二組夾持元件1' 正對的電磁鐵4' 通電，使電磁鐵4' 與第二組夾持元件1' 內的永磁鐵產生排斥力，以使得第一組夾持元件1和第二組夾持元件1' 均完全打開，便於換取晶圓W。After the cleaning process is completed, the rotating body 2 is stopped at the position shown in FIG. 3, the clamping element facing the electromagnet, the clamping member of the first group of electromagnets 4 1 n "is energized, the electromagnet 4" and the second The permanent magnets in one set of clamping elements 1 generate a repulsive force, and the electromagnets 4 ' that are facing the second set of clamping elements 1 ' are energized to make the electromagnets 4 ' and the permanent magnets in the second set of clamping elements 1 ' A repulsive force is generated such that the first set of clamping elements 1 and the second set of clamping elements 1 ' are all fully open for easy exchange of the wafer W.
如此一來，在第一步的旋轉過程中，晶圓W與第一組夾持元件1脫離了接觸，在接觸處殘留的清洗液在離心力的作用下能夠被甩乾，在第二步的旋轉過程中，晶圓W與第二組夾持元件1' 脫離了接觸，在接觸處殘留的清洗液在離心力的作用下能夠被甩乾。由此，晶圓W與夾持元件接觸的地方殘留的清洗液完全被甩乾，使得晶圓W的上表面完全被清洗，從而提高了清洗品質。In this way, during the rotation of the first step, the wafer W is out of contact with the first group of clamping elements 1, and the residual cleaning liquid at the contact can be dried by the centrifugal force, in the second step. During the rotation, the wafer W is out of contact with the second group of clamping members 1 ' , and the cleaning liquid remaining at the contact can be dried by the centrifugal force. Thereby, the cleaning liquid remaining at the place where the wafer W comes into contact with the holding member is completely dried, so that the upper surface of the wafer W is completely cleaned, thereby improving the cleaning quality.
雖然本發明所揭露之實施方式如上，惟該之內容並非用以直接限定本發明之專利保護範圍。任何本發明所屬技術領域中具有通常知識者，在不脫離本發明所揭露之精神和範圍的前提下，而對其進行之等效修改或變更，均應包含於後附之申請專利範圍中。The embodiments of the present invention are as described above, but the contents are not intended to directly limit the scope of the invention. Equivalent modifications or variations of the present invention are intended to be included within the scope of the appended claims.
1‧‧‧第一組夾持元件1‧‧‧First set of clamping elements
1'‧‧‧第二組夾持元件1'‧‧‧Second set of clamping elements
2‧‧‧旋轉主體2‧‧‧Rotating subject
3‧‧‧電磁鐵保持架3‧‧‧Electromagnetic cage
4,4' ,4" ‧‧‧電磁鐵4,4 ' ,4 " ‧‧‧electromagnet
5‧‧‧壓縮彈簧5‧‧‧Compressed spring
6‧‧‧調整單元6‧‧‧Adjustment unit
7‧‧‧永磁鐵7‧‧‧ permanent magnet
8‧‧‧平面盤狀物支撐8‧‧‧ flat disc support
9‧‧‧清洗液體噴射單元9‧‧‧ Cleaning liquid spray unit
W‧‧‧晶圓W‧‧‧ wafer
G‧‧‧旋轉軸G‧‧‧Rotary axis
S1‧‧‧夾持元件卡緊晶圓時的限位面S1‧‧‧Restricted surface when the clamping component clamps the wafer
S2‧‧‧調整單元限位元面S2‧‧‧Adjustment unit limit element
S3‧‧‧旋轉軸限位面S3‧‧‧Rotary shaft limit surface
S4‧‧‧夾持元件鬆開晶圓時的限位面S4‧‧‧Restricted surface when the clamping element releases the wafer
圖1為按照本發明一實施方式的夾持平面盤狀物的裝置的結構示意圖(圖中的電磁鐵保持架為沿徑向的剖視圖)；圖2為圖1所示的夾持平面盤狀物的裝置的沿徑向的剖視圖；圖3為圖1所示的夾持平面盤狀物的裝置清洗結束後的俯視圖；圖4為圖1所示的夾持平面盤狀物的裝置中夾持元件處於卡緊晶圓狀態時的局部結構示意圖；以及圖5為圖1所示的夾持平面盤狀物的裝置中夾持元件處於鬆開晶圓狀態時的局部結構示意圖。1 is a schematic structural view of an apparatus for holding a flat disk according to an embodiment of the present invention (the electromagnet holder in the drawing is a cross-sectional view in the radial direction); FIG. 2 is a clamping plane disk shape as shown in FIG. FIG. 3 is a plan view of the apparatus for holding a flat disc shown in FIG. 1 after cleaning; FIG. 4 is a clip of the apparatus for holding a flat disc shown in FIG. FIG. 5 is a partial structural view showing the state in which the holding member is in the state of chucking the wafer; and FIG. 5 is a partial structural view of the device for holding the flat disk shown in FIG.
1‧‧‧第一組夾持元件1‧‧‧First set of clamping elements
1'‧‧‧第二組夾持元件1'‧‧‧Second set of clamping elements
2‧‧‧旋轉主體2‧‧‧Rotating subject
3‧‧‧電磁鐵保持架3‧‧‧Electromagnetic cage
4‧‧‧電磁鐵4‧‧‧Electromagnet
9‧‧‧清洗液體噴射單元9‧‧‧ Cleaning liquid spray unit
W‧‧‧晶圓W‧‧‧ wafer
G‧‧‧旋轉軸G‧‧‧Rotary axis
Claims (6)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210037911.2A CN102569155B (en) | 2012-02-17 | 2012-02-17 | Device for clamping planar disc |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201402267A TW201402267A (en) | 2014-01-16 |
| TWI505904B true TWI505904B (en) | 2015-11-01 |
Family
ID=46414236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102103615A TWI505904B (en) | 2012-02-17 | 2013-01-31 | Device for clamping planar disk-shaped articles |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102569155B (en) |
| TW (1) | TWI505904B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104249830B (en) * | 2013-06-28 | 2016-06-08 | 江苏天工工具有限公司 | A kind of drill bit is placed with inhaling card device |
| JP2016092025A (en) * | 2014-10-29 | 2016-05-23 | 東レエンジニアリング株式会社 | Substrate holding device and method and substrate inspection device |
| CN104538345B (en) * | 2014-12-31 | 2017-06-06 | 北京七星华创电子股份有限公司 | A kind of pan device for clamping and rotating |
| CN106563989B (en) * | 2016-09-23 | 2019-01-04 | 江苏吉星新材料有限公司 | The clamping method of sapphire wafer after a kind of polishing |
| CN109164681B (en) * | 2018-09-19 | 2020-09-08 | 武汉华星光电技术有限公司 | Bearing device and fixing method thereof |
| CN109304649B (en) * | 2018-10-13 | 2020-08-21 | 北京圣龙缘科技有限公司 | Unmanned aerial vehicle electronic chip makes and equips |
| CN111048466B (en) * | 2019-12-26 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Wafer clamping device |
| CN112935892B (en) * | 2021-05-17 | 2021-10-01 | 烟台华皓电子科技有限公司 | Magnetostrictive workpiece supporting mechanism based on moving assembly |
| CN113909198B (en) * | 2021-09-06 | 2023-09-01 | 天津晟龙科技发展有限公司 | Cleaning device for wafer semiconductor processing |
| CN113990796A (en) * | 2021-10-26 | 2022-01-28 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and grabbing device |
| CN114378559B (en) * | 2022-02-11 | 2023-05-26 | 芜湖尚唯汽车饰件有限公司 | Automobile engine sound insulation cabin assembly processingequipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI256101B (en) * | 2005-03-07 | 2006-06-01 | Grand Plastic Technology Corp | An apparatus for clamping wafer with multiple groups of clamping fingers |
| CN1848400A (en) * | 2005-04-04 | 2006-10-18 | 弘塑科技股份有限公司 | Mechanical structure of apparatus for holding chip with multi-clamping finger |
| TWI295831B (en) * | 2005-03-07 | 2008-04-11 | Grand Plastic Technology Corp | Mechanical structure of apparatus for clamping wafer with multiple groups of clamping fingers |
| CN101587851A (en) * | 2009-06-23 | 2009-11-25 | 北京七星华创电子股份有限公司 | A kind of device that is used for holding plate-like article |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202549815U (en) * | 2012-02-17 | 2012-11-21 | 北京七星华创电子股份有限公司 | Device for clamping planar disc |
-
2012
- 2012-02-17 CN CN201210037911.2A patent/CN102569155B/en active Active
-
2013
- 2013-01-31 TW TW102103615A patent/TWI505904B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI256101B (en) * | 2005-03-07 | 2006-06-01 | Grand Plastic Technology Corp | An apparatus for clamping wafer with multiple groups of clamping fingers |
| TWI295831B (en) * | 2005-03-07 | 2008-04-11 | Grand Plastic Technology Corp | Mechanical structure of apparatus for clamping wafer with multiple groups of clamping fingers |
| CN1848400A (en) * | 2005-04-04 | 2006-10-18 | 弘塑科技股份有限公司 | Mechanical structure of apparatus for holding chip with multi-clamping finger |
| CN101587851A (en) * | 2009-06-23 | 2009-11-25 | 北京七星华创电子股份有限公司 | A kind of device that is used for holding plate-like article |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201402267A (en) | 2014-01-16 |
| CN102569155A (en) | 2012-07-11 |
| CN102569155B (en) | 2015-05-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI505904B (en) | Device for clamping planar disk-shaped articles | |
| TWI485804B (en) | Device for holding disk-shaped articles and method thereof | |
| US9038262B2 (en) | Device for holding disk-shaped articles and method thereof | |
| CN203721699U (en) | Disk-like object holding device and disk-like object rotating platform < | |
| JP6400977B2 (en) | Spin processing device | |
| US9698031B2 (en) | Substrate treatment method and substrate treatment apparatus | |
| TWI719075B (en) | Substrate holding apparatus | |
| CN102945820B (en) | Disk holding device | |
| TWI460817B (en) | Device for holding wafer shaped articles | |
| TW201041083A (en) | Device for treating disc-like articles | |
| WO2016107131A1 (en) | Disk clamping and rotating device | |
| TWI677939B (en) | Substrate holding apparatus | |
| CN202549815U (en) | Device for clamping planar disc | |
| JP2009295751A (en) | Substrate holding mechanism, and substrate holding method | |
| CN101587851A (en) | A kind of device that is used for holding plate-like article | |
| TWI545645B (en) | Substrate processing method and substrate processing device | |
| TWI569361B (en) | Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device | |
| JP2016192545A (en) | Spin processor | |
| TW201838087A (en) | Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method | |
| TWI733875B (en) | Two-level tape frame rinse assembly | |
| CN103762196B (en) | The clamping device of pan and the rotation platform of pan | |
| JP6294121B2 (en) | Substrate processing equipment | |
| JP6230941B2 (en) | Substrate processing equipment | |
| CN202616215U (en) | Thin wall disc-like object clamping device easy to clean | |
| JP6899703B2 (en) | Substrate processing equipment and substrate processing method |