CN1848400A - Mechanical structure of apparatus for holding chip with multi-clamping finger - Google Patents
Mechanical structure of apparatus for holding chip with multi-clamping finger Download PDFInfo
- Publication number
- CN1848400A CN1848400A CN 200510059979 CN200510059979A CN1848400A CN 1848400 A CN1848400 A CN 1848400A CN 200510059979 CN200510059979 CN 200510059979 CN 200510059979 A CN200510059979 A CN 200510059979A CN 1848400 A CN1848400 A CN 1848400A
- Authority
- CN
- China
- Prior art keywords
- wafer
- group
- folder
- etching
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention discloses a mechanical structure of wafer-holding device with several clamping fingers. On the rotary chuck of the rotary etching and cleaning machine table are set several groups of clamping fingers, every group of clamping fingers can be used for holding wafer by turns when the wafer is etched and cleaned, so that the etching and cleaning operation can be continuously made. Said clamping finger is composed of contact block, clamping arm, clamping arm turning shaft, bearing joint, restoring spring, drawing mechanism and driving mechanism.
Description
Technical field
The invention relates to a kind of mechanism with the rotary machine holding chip, particularly a kind ofly utilize two groups of above folders to refer to, make two groups of above folders refer to when etching or clean wafers, can take turns holding chip and avoid metal or photoresistance to remain on the wafer with the mechanical realization of holding chip in turn.
Background technology
Be sprayed on the wafer surface of rotation (spin) board to remove the part in the metal pattern (pattren) with chemical agent in little shadow (lithography) in the integrated circuit fabrication process and etching (etching) manufacturing process, be called the method for tearing off (lift-off), or for cleaning the photoresist on back (developed) wafer that develops.Wafer places on one (chuck), and the mode of general fixing wafer has multiple.As shown in Figure 1, Fig. 1 refers to wafer is retained on schematic diagram on the pedestal with folder for prior art.Shown in Fig. 1 (A), wafer 101 on pedestal 103 is referred to 102-1 by one group of folder, 102-2,102-3 clamps, and shown in Fig. 1 (B), Fig. 1 (B) is the profile along the A-A ' line of Fig. 1 (A), wafer 101 places on the pedestal 103, for folder refers to 102-1,102-2 clamps, and folder refers to removable to clamp or to unclamp wafer.Pedestal 103 rotation then, wafer 101 are held on the position and are unlikely to get loose and leave pedestal 103, can spray chemical agent or pure water 106 and carry out etching and tear the part that should tear off in the metal pattern on the wafer off; Or clean.In case but etching is over, folder refers to 102-1, and the metal of the wafer surface 102-2,102-3 under is because of being lived by the folder finger pressure, and the metal that chemical agent can not the contact wafer surface causes kish under folder refers to, its shape refers to consistent with folder.If clean the photoresist that develops, then the residual photoresistor agent forms serious pollution when wafer enters high temperature furnace, makes and forms defective (defect) on the wafer.The mode of another fixing wafer is that the contact block that utilizes folder to refer to contacts with holding chip with wafer as Fig. 1 (C) and (D), can carry out etching or clean wafers from the upper surface of wafer and the lower surface sprinkling chemical agent or the pure water of wafer.The schematic diagram of the contact block clamping that Fig. 1 (C) is referred to by folder for wafer.Wafer 101 is clamped by the contact block 104 that folder refers to, can carry out etching or cleaning from the upper surface sprinkling chemical agent or the pure water 106 of wafer, and lower surface sprinkling chemical agent or the pure water 108 from wafer carries out etching or cleaning simultaneously.But also kish or photoresist on surface that wafer contacts with contact block, its shape is consistent with contact block.Cause etching not exclusively or clean not exclusively to form and pollute.
For improving this shortcoming, generally use the pedestal of vacuum hold instead.On pedestal, there are vacuum groove and pipeline to pass to vacuum pump, make in the groove and form vacuum and retaining wafer.But this kind sticking mode also has its shortcoming.Vacuum expendable pattern when instant cut-off, wafer certainly will fly away from pedestal and breakage.If have pollution, vacuum not to form wafer is flown away from the pedestal again.Another shortcoming of this method is that equipment cost is higher.
Another is improved one's methods to utilizing the static retaining wafer on pedestal, high-voltage DC power supply formation magnetic field is arranged under pedestal and hold wafer, but outage is also arranged and undermine wafer, and static also has suction to metal or photoresistance, causing to remove not exclusively has residual formation defective and pollution.
Therefore, prior art can't provide really holding chip, and the metal on the etched wafer or thoroughly clean the device of photoresistance fully makes manufacturing process leave a big leak again.Therefore one demand is arranged, can clamp wafer really and can tear metal film not fully off when metal on etched wafer or cleaning photoresistance, thoroughly clean up the device of the photoresistance on the wafer, to improve reliability of process.
Summary of the invention
Purpose of the present invention is providing a mechanical realization with multi-clamping finger holding chip device, refers at the folder of installing more than two groups on the pedestal, when etching or cleaning, refers to holding chip by one group of folder at every turn, so that each part of wafer is all etched or cleaning.
Of the present invention time a purpose is providing a mechanical realization with multi-clamping finger holding chip device, utilize pneumatic cylinder or electronic promotion haulage gear, move up and down and fasten along rotating shaft or open via a clamping limb, each group folder refers to be started by a haulage gear, to reach the purpose of holding chip in turn.
For reaching above-mentioned purpose and other purpose, first viewpoint of the present invention is instructed the device of a kind of rotary machine with the multi-clamping finger holding chip, utilize two groups of above folders to refer to that (clampingfinger) is at the different phase holding chip, folder refers to that down metal or photoresistance can complete etchings or cleaning and reduce residually when making etching, comprises at least: a spin stand platform (chuck).Can be along a rotation, spray on the wafer surface for putting wafer or the preset chemical agent to carry out etching or cleaning.Multi-clamping finger, every group has most folders and refers to that be fixed on the spin stand platform, may command is with the engaging wafer or unclamp wafer.Every group of folder refers to holding chip a period of time in the wafer spin etch, the beginning was unclamped wafer after another group of waiting was pressed from both sides and referred to clamp wafer, press from both sides the metal under referring to or clean last group of photoresistance that presss from both sides under referring to carry out last group of etching, change one group of folder again and refer to holding chip, be held the time that part is exposed to etching solution to increase wafer.
Above and other purpose of the present invention and advantage with reference to following with reference to icon and most preferred embodiment explanation and easilier understand fully.
Description of drawings
Fig. 1 is prior art refers to holding chip with folder a schematic diagram.
Fig. 2 shows according to one embodiment of the invention with two groups of clampings schematic diagram of the phase I of holding chip stage by stage.
Fig. 2 (A) is retained on top view on the pedestal for referring to folder with wafer.
Fig. 2 (B) is the profile along the A-A ' line of Fig. 2 (A).
Fig. 2 (C) is the profile along the B-B ' line of Fig. 2 (A).
Fig. 2 (D) is the contact block that refers to the folder top view with the wafer fixing.
Fig. 2 (E) is the profile along the A-A ' line of Fig. 2 (D).
Fig. 2 (F) is the profile along the B-B ' line of Fig. 2 (D).
Fig. 3 shows according to one embodiment of the invention to refer to the schematic diagram of the second stage of holding chip stage by stage with two groups of folders.
Fig. 3 (A) is retained on top view on the pedestal for referring to folder with wafer.
Fig. 3 (B) is the profile along the A-A ' line of Fig. 3 (A).
Fig. 3 (C) is the profile along the B-B ' line of Fig. 3 (A).
Fig. 3 (D) is the contact block that refers to the folder top view with the wafer fixing.
Fig. 3 (E) is the profile along the A-A ' line of Fig. 3 (D).
Fig. 3 (F) is the profile along the B-B ' line of Fig. 3 (D).
Fig. 4 is according to the spin stand platform of one embodiment of the invention and the perspective view of fixture.
Fig. 5 is according to the spin stand platform of one embodiment of the invention and the profile of fixture.
Fig. 6 is the profile that Fig. 5 further amplifies.
[primary clustering symbol description]
101 wafers, 102 folders refer to
103 pedestals, 104 contact blocks
106 chemical agents or pure water 108 chemical agents or pure water
201 wafers
202-1,202-2,202-3,202-4 folder refer to
202 '-1,202 '-2,202 '-3,202 '-4 folders refer to
203-1,203-2,203-3,203-4 folder refer to
203 '-1,203 '-2,203 '-3,203 '-4 folders refer to
204 pedestals
206,208 chemical agents or pure water
402-1,402-2,402-3, the 402-4 folder refers to
404-1,404-2,404-3, the 404-4 folder refers to 406 nozzles
408 rotating shafts, 410 rotating disks
412-1,412-2 transmission mechanism 414 liquid lines
502 contact blocks, 504 clamping limbs
506 clamping limb rotating shafts 508 recover spring
510 ball and socket joints, 512 haulage gears
Embodiment
With reference to figure 2, Fig. 2 shows according to one embodiment of the invention and refers to the schematic diagram of the phase I of holding chip stage by stage with two groups of folders.Fig. 2 (A) is retained on top view on the pedestal for referring to folder with wafer.Wafer 201 is to utilize the 1st group of folder to refer to that 202-1,202-2,202-3,202-4 clamp to carry out etching at etched preceding half section, the metal film that presss from both sides this moment under referring to refers to that because of being subjected to folder 202-1,202-2,202-3 hide, can not contact etch liquid, thereby still stay on the wafer 201.
Fig. 2 (B) is the profile along Figure 1B-B ' line, brilliant Figure 20 1 places on the pedestal (chuck) 204 with mechanical arm, pedestal is rotatable wafer holder, generally with the stainless steel manufacturing, then, the control folder refers to that 202-1,202-2,202-3,203-4 descend to clamp wafer, and folder refers to that 202-1,202-2,202-3,203-4 are fixed on the pedestal 204, together rotate with pedestal and wafer, with chemical agent 206 from the wafer surface sprinkling to carry out etching.Other the 2nd group of folder refers to that 203-1,203-2,203-3,203-4 then rise not holding chip, shown in Fig. 2 (C).Folder refers to also to make it outwards leave wafer surface, sprays downwards in order to chemical agent.Fig. 2 (D) is the contact block that refers to the folder top view with the wafer fixing.Wafer 201 is to utilize the 1st group of folder to refer to that 202 '-1,202 '-2,202 '-3,202 '-4 clamp shown in the wafer map 2 (E) at etched preceding half section.Other the 2nd group of folder refers to that 203 '-1,203 '-2,203 '-3,203 '-4 are left wafer, shown in Fig. 2 (F).Spray to carry out etching with the upper surface and the lower surface of chemical agent 206,208 from wafer, the metal film of wafer refers to that because of being subjected to folder 202 '-1,202 '-2,202 '-3,202 '-4 hide on the contact block at this moment, can not contact etch liquid, thereby still stay on the wafer 201.
Please refer to Fig. 3.Fig. 3 shows according to one embodiment of the invention to refer to the schematic diagram of the second stage of holding chip stage by stage with two groups of folders.Fig. 3 (A) is retained on top view on the pedestal for referring to folder with wafer.After etching a period of time, for example after the etching period of half, pedestal 204 continues rotation, and the 2nd group of folder refers to that 203-1,203-2,203-3,203-4 clamp wafer 201 downwards, again the 1st group of folder referred to that folder refers to rise or leave wafer surface, carries out the etching of second half section again.The metal film etching that is subjected to the 1st group of folder to refer to that 202-1,202-2,202-3,202-4 hide with the phase I etching time is removed.Fig. 3 (B) is the profile along Fig. 3 A-A ' line.Fig. 3 (B) shows that the 1st group of folder refers to that 202-1,202-2,202-3,202-4 leave the situation of wafer.This moment, chemical agent 206 was removed from the metal film etching that the wafer surface sprinkling is subjected to the 1st group of folder to refer to that 202-1,202-2,202-3,202-4 hide when being etched with the phase I etching.And Fig. 3 (C) is the profile along the B-B ' line of Fig. 3 (A), shows that the 2nd group of folder refers to that 203-1,203-2,203-3,203-4 clamp the situation of wafer 201.With chemical agent 206 from the wafer surface sprinkling to carry out etching.Fig. 3 (D) is the contact block that refers to the folder top view with the wafer fixing.Wafer 201 is to utilize the 2nd group of folder to refer to that 203 '-1,203 '-2,203 '-3,203 '-4 clamp to carry out etching, shown in Fig. 2 (E) in the etched second half section.And the phase I is subjected to folder to refer to 202 '-1,202 '-2,202 '-3,203 '-4 metal films that hide, and because of folder refers to that 202 '-1,202 '-2,202 '-3,203 '-4 leave wafer 201 contact etch liquid, thereby fully the metal film etching is removed.
As mentioned above, during etching or be to refer to holding chip successively when cleaning, make folder refer to that metal down or photoresistance can or remove by complete etching, can promote the complete and reliability of manufacturing process with two groups of folders.The phase I clean finish after, can not stop the rotation and earlier the 2nd group of folder referred to descend and clamp wafer, rise the 1st group of folder again to refer to that so promptly needn't stop the rotation, wafer is also unlikely to be flown away from.
Please refer to Fig. 4, Fig. 4 is according to the spin stand platform of one embodiment of the invention and the perspective view of fixture.Liquid line 414 supply fluids such as etching solution or deionized water (D.I.water) are arranged to nozzle 406 in the rotating disk rotating shaft 408, so that supply fluid is to carry out etching or cleaning down from wafer (not icon), rotating disk 410 is positioned at the top of rotating shaft 408, multi-clamping finger is arranged on it, and this example is 2 groups, and every group of 4 folders refer to, the 1st group of folder refers to 402-1,402-2,402-3,402-4, the 2nd group of folder refers to 404-1,404-2,404-3,404-4.The action that refers to of folder inwardly fastens to clamp wafer it by many groups transmission mechanism, outwards opens leaving wafer, and this example is with two groups of transmission mechanism 412-1,412-2, and this transmission mechanism is promoted with pneumatic mode or in the electronic mode of electric power or magnetic force by pneumatic cylinder.
With reference to figure 5, Fig. 5 is according to the spin stand platform of one embodiment of the invention and the profile of fixture.And showing that simultaneously the folder of other on section does not refer to 402-1,402-2 and 404-1 are so that explanation.As seen from Figure 5, in rotating disk rotating shaft 408, the central parts of many group nozzle 406 supply fluids to wafer are arranged, flowed to wafer outside by centrifugal force and reach the purpose of etching or cleaning, each organizes nozzle by liquid line 414 supply fluids.Each folder refer to the upper end all have contact block 502 with the contact and supporting wafer (not icon) in the location.Get loose in the time of can exempting to rotate, contact block 502 is that the corrosion resisting elastic material is made, for example rubber or plastic material.Folder refers to be formed by the upper end of a clamping limb 504.Clamping limb is an axle and can shaking with clamping limb rotating shaft 506, and the other end of clamping limb 504 links to each other with haulage gear 512 with ball and socket joint 510.Haulage gear then links to each other with transmission mechanism 412.Be subjected to pneumatic or electronic and upwards the time at transmission mechanism 412,504 of clamping limbs are axle and outwards open and leave wafer with clamping limb rotating shaft 506, recover spring 508 simultaneously and store power by compression.When aerodynamic force or electric power disappearance, one end of clamping limb 504 recovered spring 508 thrust and downwards, making clamping limb 504 is axle and inwardly fasten and clamp wafer with clamping limb rotating shaft 506, other group was pressed from both sides to refer to all outwards open and was left wafer this moment, change another group folder after being etched to a certain degree and refer to fasten other group folder and refer to all outwards open and leave wafer, thereby each part of etching or clean wafers fully.
Fig. 6 is the profile that Fig. 5 further amplifies.Can more clearly see the structure of clamping limb.
Another embodiment of the present invention, the group number that folder refers to is not limited to two groups, and can be many groups, for example two groups, three groups, four groups ..., the time of each group holding chip is shortened, the shielded time of metal under it or photoresistance is shorter, and etching is promptly more thorough.
By the detailed description of above preferable specific embodiment, be to wish know more to describe feature of the present invention, and be not to come category of the present invention is limited with above-mentioned disclosed preferred embodiments with spiritual.Opposite, its objective is that hope can contain in the category of being arranged in of various changes and tool equality institute of the present invention desire protection.
Claims (5)
1. mechanical realization with the device of multi-clamping finger holding chip, multi-clamping finger is set on spin stand platform, make each group folder refer to when etching or clean wafers, take turns holding chip, rotation and etching cleaned do not stop and each part that can the etching clean wafers and noresidue comprises at least:
(a) multi-clamping finger, each group press from both sides and refer to take turns holding chip in certain etching or cleaning time-histories;
(b) each group folder refers to have at least three folders to refer to, gets loose for holding chip is unlikely simultaneously;
(c) each folder refers to by a contact block, one clamping limb, one clamping limb rotating shaft, one ball and socket joint, one recovers spring, one haulage gear and a transmission mechanism are formed, contact block in order to the contact and supporting wafer in the location, clamping limb forms a leverage around the clamping limb rotating shaft, one end of clamping limb links to each other with haulage gear with ball and socket joint, haulage gear links to each other with transmission mechanism, be subjected to pneumatic or electronic moving upward and contact block is outwards opened leave wafer at transmission mechanism, to be recovered the thrust of spring and make clamping limb downwards served as axle and inwardly fastening to clamp wafer with the clamping limb rotating shaft to an end of clamping limb when haulage gear was downward;
(d) transmission mechanism is connected to a pneumatic cylinder or motor, make the transmission mechanism upper and lower motion certain distance of energy and promote haulage gear, after each etching time-histories has one group of transmission mechanism to make this group folder refer to clamp wafer downwards, make other group gearing structure upwards so that other group folder refers to leave wafer, to clean each part of etched wafer in turn again.
2. mechanical realization as claimed in claim 1 is characterized in that, this multi-clamping finger has two groups at least.
3. mechanical realization as claimed in claim 1 is characterized in that, each group of this multi-clamping finger has at least three folders to refer to.
4. mechanical realization as claimed in claim 1 is characterized in that, this is pneumatic to provide power by pneumatic cylinder.
5. mechanical realization as claimed in claim 1 is characterized in that, this is electronic to provide power by electric power or magnetic force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100599790A CN100492608C (en) | 2005-04-04 | 2005-04-04 | Mechanical structure of apparatus for holding chip with multi-clamping finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100599790A CN100492608C (en) | 2005-04-04 | 2005-04-04 | Mechanical structure of apparatus for holding chip with multi-clamping finger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1848400A true CN1848400A (en) | 2006-10-18 |
| CN100492608C CN100492608C (en) | 2009-05-27 |
Family
ID=37077892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100599790A Expired - Fee Related CN100492608C (en) | 2005-04-04 | 2005-04-04 | Mechanical structure of apparatus for holding chip with multi-clamping finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100492608C (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944497A (en) * | 2009-07-03 | 2011-01-12 | 东京毅力科创株式会社 | Position deviation preventing device, substrate holding member including the same, substrate transfer apparatus and substrate transfer method |
| CN101710573B (en) * | 2009-09-30 | 2011-05-25 | 日东电子科技(深圳)有限公司 | Clamping device for precalibration of COG chip |
| CN101714500B (en) * | 2009-09-30 | 2012-02-01 | 日东电子科技(深圳)有限公司 | COG chip inversion bonding device |
| CN102569155A (en) * | 2012-02-17 | 2012-07-11 | 北京七星华创电子股份有限公司 | Device for clamping planar disc |
| CN102569150A (en) * | 2012-02-23 | 2012-07-11 | 北京七星华创电子股份有限公司 | Device and method for clamping easily cleaned thin-walled disc |
| CN102945820A (en) * | 2012-10-23 | 2013-02-27 | 北京七星华创电子股份有限公司 | Disk holding device |
| TWI555681B (en) * | 2009-07-03 | 2016-11-01 | Tokyo Electron Ltd | A position shift preventing device, a substrate holder including the same, a substrate handling device, and a substrate handling method |
| CN106548971A (en) * | 2016-10-11 | 2017-03-29 | 武汉新芯集成电路制造有限公司 | A kind of chuck of wet method single chip washer platform |
| TWI596664B (en) * | 2015-08-25 | 2017-08-21 | Screen Holdings Co Ltd | Substrate processing method |
| CN111020517A (en) * | 2019-12-02 | 2020-04-17 | Tcl华星光电技术有限公司 | Base plate support bracket |
| CN111970840A (en) * | 2020-08-28 | 2020-11-20 | 李钟波 | Printed circuit board etching device |
| CN115540549A (en) * | 2022-09-29 | 2022-12-30 | 内蒙古兴固科技有限公司 | Drying device is used in crystalline silicon chip processing |
-
2005
- 2005-04-04 CN CNB2005100599790A patent/CN100492608C/en not_active Expired - Fee Related
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944497B (en) * | 2009-07-03 | 2012-06-06 | 东京毅力科创株式会社 | Position deviation preventing device, substrate holding member including the same, substrate transfer apparatus and substrate transfer method |
| CN101944497A (en) * | 2009-07-03 | 2011-01-12 | 东京毅力科创株式会社 | Position deviation preventing device, substrate holding member including the same, substrate transfer apparatus and substrate transfer method |
| TWI555681B (en) * | 2009-07-03 | 2016-11-01 | Tokyo Electron Ltd | A position shift preventing device, a substrate holder including the same, a substrate handling device, and a substrate handling method |
| CN101710573B (en) * | 2009-09-30 | 2011-05-25 | 日东电子科技(深圳)有限公司 | Clamping device for precalibration of COG chip |
| CN101714500B (en) * | 2009-09-30 | 2012-02-01 | 日东电子科技(深圳)有限公司 | COG chip inversion bonding device |
| CN102569155B (en) * | 2012-02-17 | 2015-05-27 | 北京七星华创电子股份有限公司 | Device for clamping planar disc |
| CN102569155A (en) * | 2012-02-17 | 2012-07-11 | 北京七星华创电子股份有限公司 | Device for clamping planar disc |
| TWI505904B (en) * | 2012-02-17 | 2015-11-01 | Beijing Sevenstar Electronics Co Ltd | Device for clamping planar disk-shaped articles |
| CN102569150A (en) * | 2012-02-23 | 2012-07-11 | 北京七星华创电子股份有限公司 | Device and method for clamping easily cleaned thin-walled disc |
| CN102569150B (en) * | 2012-02-23 | 2014-12-10 | 北京七星华创电子股份有限公司 | Device and method for clamping easily cleaned thin-walled disc |
| WO2013123742A1 (en) * | 2012-02-23 | 2013-08-29 | 北京七星华创电子股份有限公司 | Easy-to-clean clamping device and method for thin-walled disk-shaped object |
| CN102945820B (en) * | 2012-10-23 | 2015-03-18 | 北京七星华创电子股份有限公司 | Disk holding device |
| CN102945820A (en) * | 2012-10-23 | 2013-02-27 | 北京七星华创电子股份有限公司 | Disk holding device |
| US10453674B2 (en) | 2015-08-25 | 2019-10-22 | SCREEN Holdings Co., Ltd. | Substrate treatment method and substrate treatment device |
| TWI596664B (en) * | 2015-08-25 | 2017-08-21 | Screen Holdings Co Ltd | Substrate processing method |
| CN106548971A (en) * | 2016-10-11 | 2017-03-29 | 武汉新芯集成电路制造有限公司 | A kind of chuck of wet method single chip washer platform |
| CN111020517A (en) * | 2019-12-02 | 2020-04-17 | Tcl华星光电技术有限公司 | Base plate support bracket |
| CN111020517B (en) * | 2019-12-02 | 2021-11-23 | Tcl华星光电技术有限公司 | Base plate support bracket |
| CN111970840A (en) * | 2020-08-28 | 2020-11-20 | 李钟波 | Printed circuit board etching device |
| CN111970840B (en) * | 2020-08-28 | 2021-05-18 | 李钟波 | Printed circuit board etching device |
| CN115540549A (en) * | 2022-09-29 | 2022-12-30 | 内蒙古兴固科技有限公司 | Drying device is used in crystalline silicon chip processing |
| CN115540549B (en) * | 2022-09-29 | 2023-11-28 | 内蒙古兴固科技有限公司 | Drying device is used in crystal silicon wafer processing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100492608C (en) | 2009-05-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1848400A (en) | Mechanical structure of apparatus for holding chip with multi-clamping finger | |
| JP6592147B2 (en) | Film and wafer separation apparatus and method | |
| KR100226027B1 (en) | Wafer attaching apparatus and attaching method thereby | |
| CN113510610A (en) | Crystal disc automatic feeding and expand membrane equipment | |
| CN105097438A (en) | Wafer back side cleaning device | |
| CN1959938A (en) | Wet process device for etching wafer, and wet process etching method | |
| CN213170297U (en) | A sucker structure for chip test | |
| US20070116551A1 (en) | Device and method for holding a substrate | |
| CN201410458Y (en) | Fixing device for substrate of spin coater | |
| JP2002066972A (en) | Suction device | |
| CN1835202A (en) | Rotary table device using multi-group clips for retaining wafers | |
| CN111403322B (en) | Wafer stripping device | |
| JP2004342939A (en) | Substrate processing equipment | |
| CN111558895B (en) | Wafer recovery device, polishing system and wafer recovery method | |
| CN113539936A (en) | Belt cleaning device is used in production of chip wafer | |
| CN219705197U (en) | Clamping device | |
| CN111505476A (en) | Test equipment of sensor wafer level test method | |
| CN220106449U (en) | Wafer switching device of die bonder | |
| TWI246148B (en) | Cleaning fixture for wafer stage of semiconductor tool | |
| TWI806587B (en) | Peeling mechanism | |
| CN220208890U (en) | Grid device suitable for cleaning ion beam etching equipment | |
| TWI776536B (en) | Substrate debonder | |
| JP3245673U (en) | Electrostatic chuck device for chemical mechanical polishing of wafers | |
| CN220617372U (en) | Circuit board static electricity removing device | |
| CN112542402A (en) | Wafer cleaning device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090527 Termination date: 20130404 |