TWI503656B - Heat dissipating structure - Google Patents
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- TWI503656B TWI503656B TW101132866A TW101132866A TWI503656B TW I503656 B TWI503656 B TW I503656B TW 101132866 A TW101132866 A TW 101132866A TW 101132866 A TW101132866 A TW 101132866A TW I503656 B TWI503656 B TW I503656B
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Description
本發明係關於一種散熱結構，特別是一種用於電子裝置之散熱結構。The present invention relates to a heat dissipation structure, and more particularly to a heat dissipation structure for an electronic device.
精簡型電腦(Thin Client)一般來說係透過連接網際網路來傳輸資料或操作應用程式，故精簡型電腦內無需安裝光碟機、硬碟機及軟碟機而可具有更小的體積。精簡型電腦因內部電子元件較少，相對來說精簡型電腦所產生的熱能也較少。因此，精簡型電腦內通常採用無需安裝風扇的被動散熱，也就是指精簡型電腦內部的熱能係藉由散熱鰭片傳導至殼體，再透過殼體與外界進行熱交換來達到散熱的效果。Thin Clients generally connect to the Internet to transfer data or manipulate applications. Therefore, compact PCs can be installed in smaller volumes without the need to install CDs, hard drives, and floppy drives. Compact computers have less internal thermal components and relatively less compact computers produce less heat. Therefore, the passive computer usually adopts passive heat dissipation without installing a fan, that is, the heat energy inside the simplified computer is transmitted to the casing through the heat dissipation fins, and then heat exchange is performed through the casing to exchange heat with the outside to achieve heat dissipation.
然而為了讓精簡型電腦的散熱效果更好，散熱鰭片與殼體間通常會增設一導熱矽膠片，導熱矽膠片用來填補散熱鰭片與殼體間的空隙以增加散熱鰭片與殼體間的熱接觸面積。但由於精簡型電腦一般係藉由滑動的方式來完成殼體組裝，在組裝過程中，導熱矽膠片容易受到殼體的推擠而移位，甚至與散熱鰭片分離。如此一來，將大幅降低導熱矽膠片與殼體的熱接觸面積而使精簡型電腦的散熱效果下降。However, in order to make the heat dissipation effect of the simplified computer better, a thermal conductive film is usually added between the heat dissipation fin and the casing, and the thermal conductive film is used to fill the gap between the heat dissipation fin and the casing to increase the heat dissipation fin and the casing. The area of thermal contact between. However, since the compact computer generally completes the housing assembly by sliding, during the assembly process, the thermal conductive film is easily displaced by the pushing of the housing, and even separated from the heat sink fins. As a result, the thermal contact area between the thermal conductive film and the casing is greatly reduced, and the heat dissipation effect of the compact computer is lowered.
本發明在於提供一種散熱結構，藉以解決習知精簡型電腦在組裝時，導熱矽膠片容易受到殼體推擠而移位，並導致精簡型電 腦的散熱效果下降的問題。The invention provides a heat dissipating structure, so as to solve the problem that the heat-conducting crucible film is easily displaced by the housing when the conventional compact computer is assembled, and leads to a simplified electric system. The problem of the cooling effect of the brain is reduced.
本發明所揭露之散熱結構包含一殼體、一熱源、一散熱件及至少一導熱件。其中，殼體包含相對的一底殼及一頂殼。熱源設置於底殼上。散熱件設置於熱源上，以吸收熱源之熱能。導熱件包含相疊的一第一導熱層及一第二導熱層，第一導熱層之熱膨脹係數大於第二導熱層之熱膨脹係數，導熱件之一端貼附於散熱件，第一導熱層面向散熱件，第二導熱層面向頂殼，且導熱件與頂殼保持一距離，當導熱件吸收熱能而膨脹形變，導熱件朝頂殼彎曲，並與頂殼熱接觸。The heat dissipation structure disclosed in the present invention comprises a casing, a heat source, a heat sink and at least one heat conducting member. Wherein, the housing comprises an opposite bottom case and a top case. The heat source is disposed on the bottom case. The heat sink is disposed on the heat source to absorb the heat energy of the heat source. The heat conducting component comprises a first heat conducting layer and a second heat conducting layer, wherein a thermal expansion coefficient of the first heat conducting layer is greater than a thermal expansion coefficient of the second heat conducting layer, and one end of the heat conducting component is attached to the heat sink, and the first heat conducting layer faces the heat sink The second heat conducting layer faces the top case, and the heat conducting member is kept at a distance from the top case. When the heat conducting member absorbs thermal energy and expands and deforms, the heat conducting member is bent toward the top case and is in thermal contact with the top case.
根據上述實施例之散熱結構，係透過導熱件具有受熱而膨脹彎曲的特性，使導熱件於受熱時與頂殼熱接觸。當組裝殼體時，由於導熱件之溫度低於其形變溫度，導熱件與頂殼保持一距離，使組裝人員在組裝頂殼時不會推擠到導熱件。當殼體組裝好，熱源開始產生熱能時，導熱件開始吸熱而膨脹彎曲，使得導熱件能夠與頂殼熱接觸而獲得良好的散熱效果。According to the heat dissipating structure of the above embodiment, the heat conducting member has the property of being heated and expanded and bent, so that the heat conducting member is in thermal contact with the top case when heated. When the housing is assembled, since the temperature of the heat conducting member is lower than its deformation temperature, the heat conducting member is kept at a distance from the top case, so that the assembler does not push the heat conducting member when assembling the top case. When the housing is assembled and the heat source begins to generate thermal energy, the heat conductive member starts to absorb heat and expand and bend, so that the heat conductive member can be in thermal contact with the top case to obtain a good heat dissipation effect.
有關本發明的特徵、實作與功效，茲配合圖式作最佳實施例詳細說明如下。The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.
請參照「第1圖」至「第4圖」，「第1圖」係為根據本發明一實施例之散熱結構的立體示意圖，「第2圖」為「第1圖」之分解示意圖，「第3圖」與「第4圖」為「第1圖」之組裝流程圖。Please refer to FIG. 1 to FIG. 4, which is a perspective view of a heat dissipation structure according to an embodiment of the present invention, and FIG. 2 is an exploded view of FIG. Figure 3 and Figure 4 are the assembly flow chart of Figure 1.
本實施例之散熱結構10包含一殼體100、一熱源200、一散 熱件300及二導熱件400。其中導熱件400的數量並不以本實施例之二個為限。The heat dissipation structure 10 of the embodiment includes a housing 100, a heat source 200, and a heat dissipation The heat member 300 and the two heat conductive members 400. The number of the heat conducting members 400 is not limited to the two of the embodiments.
殼體100例如為一電子裝置的一部分，在本實施例中，電子裝置係以精簡型電腦為例，但不以此為限。殼體100包含相對的一底殼110及一頂殼120。頂殼120可拆卸地裝設於底殼110，底殼110具有一容置槽113。詳細來說，本實施例之底殼110具有多個卡槽111，頂殼120具有與卡槽111數量相匹配的多個卡勾121。頂殼120可相對底殼110滑動而具有一卡扣位置及一釋放位置。當頂殼120於卡扣位置時，這些卡勾121卡扣於這些卡槽111(如「第4圖」所示)。當頂殼120於釋放位置時，這些卡勾121脫離這些卡槽(如「第3圖」所示)。The housing 100 is, for example, a part of an electronic device. In the embodiment, the electronic device is exemplified by a simplified computer, but is not limited thereto. The housing 100 includes an opposite bottom case 110 and a top case 120. The top case 120 is detachably mounted on the bottom case 110, and the bottom case 110 has a receiving groove 113. In detail, the bottom case 110 of the embodiment has a plurality of card slots 111, and the top case 120 has a plurality of hooks 121 matching the number of the card slots 111. The top case 120 is slidable relative to the bottom case 110 to have a snap position and a release position. When the top case 120 is in the snap position, the hooks 121 are snapped onto the card slots 111 (as shown in FIG. 4). When the top case 120 is in the release position, the hooks 121 are disengaged from the slots (as shown in "Fig. 3").
熱源200設置於底殼110，並位於容置槽113內。熱源200為一電子元件，譬如為中央處理器。熱源200係電性設置於一電路板600上。電路板600位於底殼110上。熱源200運作時，會產生熱能，使得殼體100內部的溫度升高。散熱件300設置於熱源200上，以吸收熱源200之熱能。散熱件300為一散熱鰭片。The heat source 200 is disposed in the bottom case 110 and located in the receiving groove 113. The heat source 200 is an electronic component such as a central processing unit. The heat source 200 is electrically disposed on a circuit board 600. The circuit board 600 is located on the bottom case 110. When the heat source 200 operates, thermal energy is generated, causing the temperature inside the casing 100 to rise. The heat sink 300 is disposed on the heat source 200 to absorb the heat energy of the heat source 200. The heat sink 300 is a heat sink fin.
請一併參閱「第5圖」及「第6圖」，「第5圖」與「第6圖」為「第1圖」之導熱件受熱膨脹形變的剖面示意圖。導熱件400具有一貼附端410及一自由端420。導熱件400之貼附端410貼附於散熱件300以吸收熱源200之熱能。導熱件400包含相疊的一第一導熱層430及一第二導熱層440(如「第5圖」所示)。第一導熱層430面向散熱件300，而第二導熱層440面向頂殼120，且第 二導熱層440與頂殼120保持一距離。其中，第一導熱層430之熱膨脹係數大於第二導熱層440之熱膨脹係數。當導熱件400吸收到熱源200之熱能時，導熱件400因吸收熱能而膨脹形變，使得導熱件400朝頂殼120彎曲，並與頂殼120熱接觸。詳細來說，本實施例之第一導熱層430之材質係以銅為例，第二導熱層440之材質以鐵為例。導熱件400受熱時，第一導熱層430之伸長量會大於第二導熱層440之伸長量，使得導熱件400彎曲而導致導熱件400之自由端420與頂殼120熱接觸(如「第6圖」所示)。如此一來，導熱件400可以與頂殼120熱接觸，進而讓熱源200之熱能依序透過散熱件300及導熱件400傳導至頂殼120而增加散熱結構10的散熱效果。Please refer to "5th" and "6th", "5th" and "6th" as the cross-sectional view of the heat transfer element of "Fig. 1". The heat conductive member 400 has an attachment end 410 and a free end 420. The attaching end 410 of the heat conductive member 400 is attached to the heat sink 300 to absorb the heat energy of the heat source 200. The heat conducting member 400 includes a first heat conducting layer 430 and a second heat conducting layer 440 stacked together (as shown in FIG. 5). The first heat conduction layer 430 faces the heat sink 300, and the second heat conduction layer 440 faces the top case 120, and the first The two heat conducting layers 440 are maintained at a distance from the top case 120. The thermal expansion coefficient of the first heat conduction layer 430 is greater than the thermal expansion coefficient of the second heat conduction layer 440. When the heat conductive member 400 absorbs the heat energy of the heat source 200, the heat conductive member 400 expands and deforms by absorbing heat energy, so that the heat conductive member 400 is bent toward the top case 120 and is in thermal contact with the top case 120. In detail, the material of the first heat conduction layer 430 of the embodiment is copper, and the material of the second heat conduction layer 440 is exemplified by iron. When the heat conducting member 400 is heated, the elongation of the first heat conducting layer 430 is greater than the elongation of the second heat conducting layer 440, so that the heat conducting member 400 is bent to cause the free end 420 of the heat conducting member 400 to be in thermal contact with the top case 120 (eg, "6th" Figure"). In this way, the heat conducting member 400 can be in thermal contact with the top case 120, so that the heat energy of the heat source 200 is sequentially transmitted to the top case 120 through the heat dissipating member 300 and the heat conducting member 400 to increase the heat dissipating effect of the heat dissipating structure 10.
更進一步來說，導熱件400因由兩種相異熱膨脹係數的材質組成，使得導熱件400能因吸收熱能而膨脹彎曲。當導熱件400之溫度超過變形溫度時，導熱件400便彎曲變形而與頂殼120熱接觸，以將熱能傳遞至頂殼120。當導熱件400之溫度低於變形溫度時，導熱件400與頂殼120分開。此時，因導熱件400與頂殼120保持一距離，當頂殼120於組裝過程而相對底殼110滑動時，將不會造成頂殼120推擠導熱件400的情況產生。Furthermore, the heat conducting member 400 is composed of two materials having different coefficients of thermal expansion, so that the heat conducting member 400 can expand and bend due to absorption of thermal energy. When the temperature of the heat conductive member 400 exceeds the deformation temperature, the heat conductive member 400 is bent and deformed to be in thermal contact with the top case 120 to transfer thermal energy to the top case 120. When the temperature of the heat conductive member 400 is lower than the deformation temperature, the heat conductive member 400 is separated from the top case 120. At this time, since the heat conducting member 400 is kept at a distance from the top case 120, when the top case 120 slides relative to the bottom case 110 during the assembly process, the top case 120 will not be caused to push the heat conducting member 400.
在本實施例與其他實施例中，散熱結構10另包含一傳導墊500。傳導墊500例如為導熱矽膠片。傳導墊500設置於第二導熱層440，並位於導熱件400之自由端420。其中導熱件400未吸熱時，傳導墊500亦與頂殼120保持一距離，此距離可避免組裝時 傳導墊500受頂殼120推擠而位移。當導熱件400吸收熱能而膨脹形變時，導熱件400之自由端420朝頂殼120彎曲，並令傳導墊500與頂殼120熱接觸。In this embodiment and other embodiments, the heat dissipation structure 10 further includes a conductive pad 500. The conductive pad 500 is, for example, a thermal conductive film. The conductive pad 500 is disposed on the second heat conductive layer 440 and is located at the free end 420 of the heat conductive member 400. When the heat conducting member 400 does not absorb heat, the conductive pad 500 also maintains a distance from the top case 120, which can avoid assembly. The conductive pad 500 is displaced by the push of the top case 120. When the heat conducting member 400 absorbs thermal energy to expand and deform, the free end 420 of the heat conducting member 400 is bent toward the top case 120, and the conductive pad 500 is in thermal contact with the top case 120.
在本實施例與其他實施例中，底殼110另包含一屏蔽板112，底殼110之屏蔽板112設置於底殼110面向頂殼120的一側面，熱源200設置於底殼110上。頂殼120另包含一屏蔽板122，頂殼120之屏蔽板122設置於頂殼120面向底殼110的一側面。當導熱件400吸收熱能而膨脹形變時，導熱件400之自由端420朝頂殼120彎曲，並令傳導墊500與頂殼120的屏蔽板122熱接觸。In this embodiment and other embodiments, the bottom case 110 further includes a shielding plate 112. The shielding plate 112 of the bottom case 110 is disposed on a side of the bottom case 110 facing the top case 120, and the heat source 200 is disposed on the bottom case 110. The top case 120 further includes a shielding plate 122. The shielding plate 122 of the top case 120 is disposed on a side of the top case 120 facing the bottom case 110. When the heat conductive member 400 absorbs thermal energy and expands and deforms, the free end 420 of the heat conductive member 400 is bent toward the top case 120, and the conductive pad 500 is in thermal contact with the shield plate 122 of the top case 120.
此外，為了增加傳導墊500與頂殼120之屏蔽板122間的熱接觸效果，頂殼120之屏蔽板122另具有一凸部123，凸部123朝底殼110凸出。其中，凸部123面向底殼110之一側面可為與導熱件400形變後之形狀相匹配的曲面，以增加兩者之間的接觸面積，進而增加其散熱效果。In addition, in order to increase the thermal contact effect between the conductive pad 500 and the shielding plate 122 of the top case 120, the shielding plate 122 of the top case 120 further has a convex portion 123, and the convex portion 123 protrudes toward the bottom case 110. The side surface of the convex portion 123 facing the bottom case 110 may be a curved surface matching the deformed shape of the heat conductive member 400 to increase the contact area between the two, thereby increasing the heat dissipation effect.
根據上述實施例之散熱結構，係透過導熱件具有受熱而膨脹彎曲的特性，使導熱件於受熱時與頂殼熱接觸。於組裝殼體時，由於導熱件之溫度低於其形變溫度，傳導墊與頂殼保持一距離，使組裝人員在組裝頂殼時不會推擠到傳導墊。於熱源運作時，導熱件吸收熱源之熱能而膨脹彎曲，使得傳導墊能夠與頂殼接觸而獲得良好的散熱效果。According to the heat dissipating structure of the above embodiment, the heat conducting member has the property of being heated and expanded and bent, so that the heat conducting member is in thermal contact with the top case when heated. When the housing is assembled, since the temperature of the heat conducting member is lower than its deformation temperature, the conductive pad is kept at a distance from the top case, so that the assembler does not push the conductive pad when assembling the top case. When the heat source operates, the heat conducting member absorbs the heat energy of the heat source to expand and bend, so that the conductive pad can contact the top case to obtain a good heat dissipation effect.
雖然本發明以前述之較佳實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍 內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the skilled in the art, without departing from the spirit and scope of the invention. In the meantime, the scope of patent protection of the present invention is subject to the scope of the patent application attached to the specification.
10‧‧‧散熱結構10‧‧‧heating structure
100‧‧‧殼體100‧‧‧shell
110‧‧‧底殼110‧‧‧ bottom case
111‧‧‧卡槽111‧‧‧ card slot
112‧‧‧屏蔽板112‧‧‧Shield
113‧‧‧容置槽113‧‧‧ accommodating slots
120‧‧‧頂殼120‧‧‧ top shell
121‧‧‧卡勾121‧‧‧ hook
122‧‧‧屏蔽板122‧‧‧Shield
123‧‧‧凸部123‧‧‧ convex
200‧‧‧熱源200‧‧‧heat source
300‧‧‧散熱件300‧‧‧ Heat sink
400‧‧‧導熱件400‧‧‧Heat conductive parts
410‧‧‧貼附端410‧‧‧ Attached end
420‧‧‧自由端420‧‧‧Free end
430‧‧‧第一導熱層430‧‧‧First thermal layer
440‧‧‧第二導熱層440‧‧‧Second thermal layer
500‧‧‧傳導墊500‧‧‧ Conductive pad
600‧‧‧電路板600‧‧‧ boards
「第1圖」係為根據本發明一實施例之散熱結構的立體示意圖。Fig. 1 is a perspective view showing a heat dissipation structure according to an embodiment of the present invention.
「第2圖」為「第1圖」之分解示意圖。"2nd picture" is an exploded view of "1st picture".
「第3圖」與「第4圖」為「第1圖」之組裝流程圖。"3rd" and "4th" are the assembly flow charts of "1st figure".
「第5圖」與「第6圖」為「第1圖」之導熱件受熱膨脹形變的剖面示意圖。"5th" and "6th" are schematic cross-sectional views showing the thermal expansion of the heat-conducting member of "Fig. 1".
10‧‧‧散熱結構10‧‧‧heating structure
100‧‧‧殼體100‧‧‧shell
110‧‧‧底殼110‧‧‧ bottom case
111‧‧‧卡槽111‧‧‧ card slot
112‧‧‧屏蔽板112‧‧‧Shield
113‧‧‧容置槽113‧‧‧ accommodating slots
120‧‧‧頂殼120‧‧‧ top shell
121‧‧‧卡勾121‧‧‧ hook
122‧‧‧屏蔽板122‧‧‧Shield
123‧‧‧凸部123‧‧‧ convex
200‧‧‧熱源200‧‧‧heat source
300‧‧‧散熱件300‧‧‧ Heat sink
400‧‧‧導熱件400‧‧‧Heat conductive parts
410‧‧‧貼附端410‧‧‧ Attached end
420‧‧‧自由端420‧‧‧Free end
500‧‧‧傳導墊500‧‧‧ Conductive pad
600‧‧‧電路板600‧‧‧ boards
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| US10091866B2 (en) * | 2016-12-21 | 2018-10-02 | Intel IP Corporation | Device with switchable heat path |
| CN108323111A (en) * | 2018-02-09 | 2018-07-24 | 苏州天脉导热科技股份有限公司 | Unidirectional heat radiation module |
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| TWM259468U (en) * | 2004-07-20 | 2005-03-11 | Shine Ying Co Ltd | Two-phase flow evaporator with high efficiency and of gravitational type |
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| CN201119232Y (en) * | 2007-10-19 | 2008-09-17 | 讯凯国际股份有限公司 | Heat conduction device |
| TWM387475U (en) * | 2010-02-02 | 2010-08-21 | Liga Prec Technology Co Ltd | Hollow thin plate type cooling unit structure |
| US20120103589A1 (en) * | 2010-10-28 | 2012-05-03 | Samsung Electro-Mechanics Co., Ltd. | Heat dissipation device for power conversion module |
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| TWM259468U (en) * | 2004-07-20 | 2005-03-11 | Shine Ying Co Ltd | Two-phase flow evaporator with high efficiency and of gravitational type |
| CN2757332Y (en) * | 2004-11-19 | 2006-02-08 | 威盛電子股份有限公司 | Heat radiator |
| TW200635491A (en) * | 2005-03-28 | 2006-10-01 | Via Tech Inc | Heat dissipater module and electronic device having the same |
| TW200640348A (en) * | 2005-05-09 | 2006-11-16 | Benq Corp | Electronic device |
| JP2007012913A (en) * | 2005-06-30 | 2007-01-18 | Polymatech Co Ltd | Heat dissipation sheet and heat dissipation structure |
| CN201119232Y (en) * | 2007-10-19 | 2008-09-17 | 讯凯国际股份有限公司 | Heat conduction device |
| TWM387475U (en) * | 2010-02-02 | 2010-08-21 | Liga Prec Technology Co Ltd | Hollow thin plate type cooling unit structure |
| US20120103589A1 (en) * | 2010-10-28 | 2012-05-03 | Samsung Electro-Mechanics Co., Ltd. | Heat dissipation device for power conversion module |
Also Published As
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|---|---|
| TW201411319A (en) | 2014-03-16 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |