1298619 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電子設備，尤指一種具有能防電磁 干擾之散熱器的電子設備。 【先前技術】 按，隨著高科技的蓬勃發展，電子元件如CPU的體積 趨於微小化，而且單位面積上的密集度也越來越高，其效 奉 能更是不斷增強，在這些因素之下，電子元件的總發熱量 幾乎逐年升高，倘若沒有良好的散熱方式來排除電子元件 所產生的熱量，過高的溫度將導致電子元件產生電子游離 (Thermal Runaway)與熱應力（Thermal Stress)等現象，造成 '整體穩定性降低，以及縮短電子元件本身的壽命。為了散 發電子元件產生的熱量，通常藉助散熱器來散發上述熱量。 請參照第一圖，揭示了一種傳統的散熱器40。該散熱 . 器40安裝於電子元件之上，其包括複數散熱片42，用於 散發電子元件產生的熱量。然而，因現有之電子元件通常 整合了各種高頻電路、數位電路和類比電路，電子元件在 工作會產生大量的電磁波，且這種散熱器40沒有其它結構 以屏蔽該電子元件產生的電磁波，也不能屏蔽其它電子元 件產生之電磁波。故該電子元件和其它電子元件會互相産 生電磁干擾（Electromagnetic Interference，EMI)，其不僅 1298619 影響電子元件之功能，而且危害人體健康。因而如何協調 防EMI和散熱兩者之關係，成為散熱器製作中亟待解決的 問題。 【發明内容】 本發明之目的係提供一種能防電磁干擾之散熱器。 本發明之另一目的係提供一種具有能防電磁干擾之散 熱器的電子設備。 本發明之能防電磁干擾之散熱器用於防電磁干擾及散 發電子元件產生的熱量，其包括一本體和複數散熱片。該 本體包括至少一收容空間，該電子元件收容在該收容空間 中。該等散熱片設置於該本體並與該收容空間相對設置， 用於散發該電子元件所產生的熱量。 本發明之電子設備包括一電路板及一能防電磁干擾之 散熱器，該電路板上裝有至少一電子元件。該能防電磁干 擾之散熱器包括一本體和複數散熱片。該本體包括至少一 收容空間，該電子元件收容在該收容空間中。該等散熱片 設置於該本體並與該收容空間相對設置，用於散發該電子 元件所產生的熱量。 作為本發明的進一步改進，該本體與該等散熱片係一 體成型。本體包括複數側壁和至少一凸塊，該收容空間由 該等側壁圍成。該凸塊位於該收容空間中。 7 1298619 與習知技術相比，本發明的優點在於：因該能防電磁 干擾之散熱器不僅包括收容電子元件的收容空間而且包括 散熱片，從而使得安裝於其中之電子元件既可以防止外部 電子元件産生之電磁波干擾其本身，又可以防止其本身産 生之電磁波干擾外部電子元件’同時可有效降低所述電子 元件之溫度，進而保證了所述電子元件之性能。 【實施方式】 請參照第二圖，揭示了本發明之電子設備，該電子設 備包括一電路板20及一能防電磁干擾（Electromagnetic Interference，EMI)之散熱器 。 電路板20包括複數電子元件24、複數第一裝配孔22及 複數定位孔26。第一裝配孔22和定位孔26分別位於該等電 子元件24之四週。 請同時參照第三圖，該能防電磁干擾之散熱器1〇可安 裝於電路板20上。該散熱器1〇包括複數散熱片12及一本體 14。該本體14包括複數側璧142，該等側壁142圍成複數收 容空間140。該等電子元件24收容在該等收容空間140中。 在本實施方式中，收容空間I40為三個。當然所述收容空間 140也可為一個，其個數根據需要可隨意變更。至少一凸塊 144凸設於該收容空間，該等凸塊144與電路板20的電子元 件24相對應。本體14對應所述第一裝配孔22和所述定位孔 8 1298619 ’ 26設有複數第二裝配孔146和複數定位柱148。第二裝配孔 146與第一裝配孔22—起用於將所述散熱器10安裝於上述 電路板20。安裝時，定位柱148和定位孔26可定位所述散熱 器10。 該等散熱片12與本體14一體成型，並分別與本體14垂 直，兩相鄰散熱片12間各有一槽120。 請同時參照第四圖，組裝時，將定位柱148***電路板 籲 20的定位孔26，且使固持件如螺釘（圖未示）分別穿過第二 裝配孔146和第一裝配孔22並鎖固於電路板10的底部，從而 散熱器10便安裝於電路板20。此時，所述凸塊144分別緊貼 所述電子元件24。這樣，所述電子元件24産生之熱量便可 及時被散發，進而保證了所述電子元件24之性能。 因本體14具有複數收容空間140，這樣所述散熱器1〇 可同時為複數電子元件24散熱，而且所述散熱器1〇既可以 馨 防止安裝於其中之電子元件64相互之間的電磁干擾又可以 屏蔽外部電子元件產生之電磁波，同時可防止電子元件64 産生之電磁波干擾外部電子元件。 【圖式簡單說明】 第一圖係習知散熱器之立體圖。 第二圖係本發明能防電磁干擾之散熱器與電路板之立體 分解圖。 9 1298619 第三圖係本發明能防電磁干擾之散熱器之另一角度立體 第四圖係本發明能防電磁干擾之散熱器與電路板之立體 組裝圖。 【主要元件符號說明】1298619 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic device, and more particularly to an electronic device having a heat sink capable of preventing electromagnetic interference. [Prior Art] According to the rapid development of high technology, the volume of electronic components such as CPU tends to be smaller, and the density per unit area is also increasing, and its effectiveness can be continuously enhanced. Under the circumstance, the total heat generation of electronic components increases almost every year. If there is no good heat dissipation method to eliminate the heat generated by electronic components, too high temperature will cause electronic runaway and thermal stress (Thermal Stress). And other phenomena, resulting in 'integrated stability reduction, and shortening the life of the electronic components themselves. In order to dissipate the heat generated by the electronic components, the heat is usually dissipated by means of a heat sink. Referring to the first figure, a conventional heat sink 40 is disclosed. The heat sink 40 is mounted on the electronic component and includes a plurality of heat sinks 42 for dissipating heat generated by the electronic components. However, since the existing electronic components usually integrate various high-frequency circuits, digital circuits, and analog circuits, the electronic components generate a large amount of electromagnetic waves during operation, and the heat sink 40 has no other structure to shield electromagnetic waves generated by the electronic components. It is not possible to shield electromagnetic waves generated by other electronic components. Therefore, the electronic component and other electronic components generate electromagnetic interference (EMI), which not only affects the function of the electronic component but also endangers human health. Therefore, how to coordinate the relationship between EMI and heat dissipation has become an urgent problem to be solved in the manufacture of heat sinks. SUMMARY OF THE INVENTION An object of the present invention is to provide a heat sink capable of preventing electromagnetic interference. Another object of the present invention is to provide an electronic device having a heat sink capable of preventing electromagnetic interference. The anti-electromagnetic interference heat sink of the present invention is used for preventing electromagnetic interference and dissipating heat generated by electronic components, and includes a body and a plurality of heat sinks. The main body includes at least one receiving space, and the electronic component is received in the receiving space. The heat sink is disposed on the body and disposed opposite the receiving space for dissipating heat generated by the electronic component. The electronic device of the present invention comprises a circuit board and a heat sink capable of preventing electromagnetic interference, the circuit board being provided with at least one electronic component. The heat sink capable of preventing electromagnetic interference includes a body and a plurality of heat sinks. The body includes at least one receiving space, and the electronic component is received in the receiving space. The heat sink is disposed on the body and disposed opposite the receiving space for dissipating heat generated by the electronic component. As a further improvement of the present invention, the body is integrally formed with the heat sinks. The body includes a plurality of side walls and at least one protrusion, and the receiving space is surrounded by the side walls. The bump is located in the receiving space. 7 1298619 Compared with the prior art, the present invention has an advantage in that the heat sink capable of preventing electromagnetic interference includes not only a receiving space for accommodating electronic components but also a heat sink, so that electronic components mounted therein can prevent external electronic components. The electromagnetic wave generated by the component interferes with itself, and can prevent the electromagnetic wave generated by itself from interfering with the external electronic component' while effectively reducing the temperature of the electronic component, thereby ensuring the performance of the electronic component. [Embodiment] Referring to the second figure, an electronic device of the present invention is disclosed. The electronic device includes a circuit board 20 and a heat sink capable of preventing electromagnetic interference (EMI). The circuit board 20 includes a plurality of electronic components 24, a plurality of first mounting holes 22, and a plurality of positioning holes 26. The first mounting hole 22 and the positioning hole 26 are located around the respective electronic components 24. Referring to the third figure at the same time, the anti-electromagnetic interference heat sink 1 can be mounted on the circuit board 20. The heat sink 1 includes a plurality of fins 12 and a body 14. The body 14 includes a plurality of side sills 142 that enclose a plurality of receiving spaces 140. The electronic components 24 are housed in the accommodating spaces 140. In the present embodiment, the storage space I40 is three. Of course, the accommodating space 140 may also be one, and the number thereof may be arbitrarily changed as needed. At least one bump 144 protrudes from the receiving space, and the bumps 144 correspond to the electronic component 24 of the circuit board 20. The body 14 is provided with a plurality of second mounting holes 146 and a plurality of positioning posts 148 corresponding to the first mounting holes 22 and the positioning holes 8 1298619 ' 26 . The second fitting hole 146 is used together with the first fitting hole 22 for mounting the heat sink 10 to the above-described circuit board 20. The positioning post 148 and the locating hole 26 can position the heat sink 10 during installation. The fins 12 are integrally formed with the body 14 and are respectively perpendicular to the body 14, and each of the adjacent fins 12 has a groove 120 therebetween. Referring to the fourth figure at the same time, when assembling, the positioning post 148 is inserted into the positioning hole 26 of the circuit board 20, and the holding member such as a screw (not shown) passes through the second mounting hole 146 and the first mounting hole 22, respectively. The heat sink 10 is mounted on the circuit board 20 by being locked to the bottom of the circuit board 10. At this time, the bumps 144 are in close contact with the electronic component 24, respectively. Thus, the heat generated by the electronic component 24 can be dissipated in time, thereby ensuring the performance of the electronic component 24. Since the body 14 has a plurality of receiving spaces 140, the heat sink 1 can simultaneously dissipate heat for the plurality of electronic components 24, and the heat sink 1 can prevent the electromagnetic interference between the electronic components 64 mounted therein. It can shield electromagnetic waves generated by external electronic components while preventing electromagnetic waves generated by electronic components 64 from interfering with external electronic components. [Simple description of the diagram] The first figure is a perspective view of a conventional radiator. The second figure is a perspective exploded view of the heat sink and the circuit board capable of preventing electromagnetic interference of the present invention. 9 1298619 The third figure is another perspective view of the heat sink capable of preventing electromagnetic interference according to the present invention. The fourth figure is a three-dimensional assembly diagram of the heat sink and the circuit board capable of preventing electromagnetic interference according to the present invention. [Main component symbol description]
散熱器 10 散熱片 12 本體 14 電路板 20 第一裝配孔 22 電子元件 24 定位孑L 26 槽 120 收容空間 140 側壁 142 凸塊 144 第二裝配孔 146 定位柱 148Heat sink 10 Heat sink 12 Body 14 Circuit board 20 First mounting hole 22 Electronics 24 Positioning 孑L 26 Slot 120 Housing space 140 Side wall 142 Bump 144 Second mounting hole 146 Positioning post 148