TWI503204B - Continuous grinding of glass plate and glass plate continuous grinding method - Google Patents
Continuous grinding of glass plate and glass plate continuous grinding method Download PDFInfo
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- TWI503204B TWI503204B TW100140570A TW100140570A TWI503204B TW I503204 B TWI503204 B TW I503204B TW 100140570 A TW100140570 A TW 100140570A TW 100140570 A TW100140570 A TW 100140570A TW I503204 B TWI503204 B TW I503204B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
- B24B7/244—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass continuous
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/14—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by liquid or gas pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
本發明係關於一種玻璃板之連續研磨裝置及玻璃板之連續研磨方法。The present invention relates to a continuous polishing apparatus for glass sheets and a continuous grinding method for glass sheets.
先前，玻璃等板狀體之研磨中，為實現精加工面之均一化，使壓盤偏心擺動而進行研磨。即，在將壓盤之姿勢保持為固定之狀態下使壓盤偏心旋轉而進行研磨。藉此，不論取哪一點壓盤之圓周速度均為固定，從而可實現研磨之均一化。Conventionally, in the polishing of a plate-like body such as glass, in order to achieve uniformization of the finished surface, the platen is eccentrically oscillated and polished. In other words, the platen is eccentrically rotated and polished while the posture of the platen is kept fixed. Thereby, the circumferential speed of the platen is fixed regardless of which point is taken, so that the uniformity of the grinding can be achieved.
例如，專利文獻1中，作為自動地連續研磨液晶用玻璃基板之類的相對較薄之玻璃板之連續研磨裝置，揭示有如下者：於研磨台車上搭載玻璃板並進行移送時，於沿著移送方向移動之研磨台車之上方排列配置有複數個包含研磨墊之研磨工具，使其分別進行偏心旋轉，藉由各研磨工具自上方連續地研磨搭載於研磨台車上進行移送之玻璃板。For example, Patent Document 1 discloses a continuous polishing apparatus for continuously polishing a relatively thin glass plate such as a glass substrate for liquid crystal, in which a glass plate is mounted on a polishing carriage and transferred. A plurality of polishing tools including polishing pads are arranged in a row above the polishing carriage that moves in the transfer direction, and are respectively eccentrically rotated, and the glass plates that are transported on the polishing carriage are continuously polished from above by the respective polishing tools.
此時，專利文獻1中所記載之連續研磨裝置中，分別進行偏心旋轉之研磨工具係以相鄰之研磨工具之旋轉相位反轉180度之方式而設置，尤其於偶數個研磨工具對玻璃板進行動作時，抵消施加於玻璃板之負載。又，進而使該等複數個研磨工具與一個驅動軸驅動結合，而同時進行旋轉。In this case, in the continuous polishing apparatus described in Patent Document 1, the polishing tools that perform the eccentric rotation are provided such that the rotation phase of the adjacent polishing tool is reversed by 180 degrees, especially for an even number of polishing tools on the glass plate. When the action is performed, the load applied to the glass sheet is offset. Further, the plurality of polishing tools are combined with one drive shaft drive while rotating.
[專利文獻1]日本專利特開平2-83150號公報[Patent Document 1] Japanese Patent Laid-Open No. 2-83150
如上述先前般，藉由利用偏心軸使研磨工具偏心旋轉而進行平面研磨之裝置中，由複數個研磨工具對被研磨材進行連續研磨時，抵消對被研磨材作用之負載成為較大之課題。As described above, in the apparatus for performing surface polishing by eccentrically rotating the polishing tool by the eccentric shaft, when the plurality of polishing tools continuously polish the material to be polished, the load that cancels the action on the material to be polished becomes large. .
然而，尤其伴隨被研磨材大型化，研磨裝置整體亦大型化，作用於被研磨材之負載亦相對增加，因此如上述先前般，使複數個研磨工具與一個驅動軸驅動結合，以相鄰之兩個研磨工具之旋轉相位反轉180度之方式設置而欲抵消作用於被研磨材之負載的裝置中，存在無法應對裝置之大型化之問題。However, in particular, as the size of the material to be polished is increased, the entire polishing apparatus is also enlarged, and the load acting on the material to be polished is relatively increased. Therefore, as described above, a plurality of grinding tools are combined with one driving shaft drive to be adjacent thereto. In the device in which the rotation phases of the two polishing tools are reversed by 180 degrees and the load applied to the workpiece is to be counteracted, there is a problem that the size of the device cannot be increased.
又，進而如上述先前之連續研磨裝置般，由基於一個驅動源之驅動軸使所有研磨工具同時進行偏心旋轉的裝置中，存在無法應對研磨工具之各種用途之問題。Further, as in the above-described conventional continuous polishing apparatus, in the apparatus in which all the polishing tools are simultaneously eccentrically rotated by the drive shaft of one drive source, there is a problem that it is impossible to cope with various uses of the polishing tool.
本發明係鑒於此種情況而完成者，其目的在於提供一種抵消自研磨工具作用於被研磨材之負載，減少裝置之振動，而容易使研磨裝置大型化之玻璃板之連續研磨裝置及玻璃板之連續研磨方法。The present invention has been made in view of such circumstances, and an object of the present invention is to provide a continuous polishing apparatus and a glass plate for a glass sheet which can offset the load applied to the material to be polished by the polishing tool and reduce the vibration of the apparatus, thereby facilitating the enlargement of the polishing apparatus. Continuous grinding method.
為達成上述目的，本發明提供一種玻璃板之連續研磨裝置，其包含向一方向移送玻璃板之研磨台、及於該研磨台之上方沿著玻璃板之移送方向而配置之複數個研磨工具，各研磨工具包含自該研磨工具之質心偏心之偏心軸，一邊將研磨工具保持成使該研磨工具之研磨面與上述玻璃板之被研磨面平行之姿勢一邊進行繞上述偏心軸公轉之偏心旋轉運動，且將相鄰之至少三個以上之研磨工具設為1組，以將藉由構成該組之研磨工具而產生之反作用力彼此相抵消之方式設定構成該組之各研磨工具之旋轉相位差。In order to achieve the above object, the present invention provides a continuous polishing apparatus for a glass sheet, comprising: a polishing table for transferring a glass sheet in one direction; and a plurality of polishing tools disposed above the polishing table along a direction in which the glass sheet is transferred. Each of the polishing tools includes an eccentric shaft that is eccentric from the centroid of the polishing tool, and the eccentric rotation about the eccentric axis is performed while holding the polishing tool such that the polishing surface of the polishing tool is parallel to the polished surface of the glass plate. Moving, and setting at least three adjacent grinding tools to one set to set the rotational phase of each of the grinding tools constituting the set in such a manner that the reaction forces generated by the grinding tools constituting the set cancel each other difference.
藉此，可抵消自研磨工具作用於被研磨材之負載，而減少裝置之振動。Thereby, the load acting on the material to be polished from the grinding tool can be offset, and the vibration of the device can be reduced.
又，同樣地為達成上述目的，本發明提供一種玻璃板之連續研磨裝置，其包含向一方向移送玻璃板之研磨台、及於該研磨台之上方沿著玻璃板之移送方向而配置之複數個研磨工具，各研磨工具包含自該研磨工具之質心偏心之偏心軸，一邊將研磨工具保持成使該研磨工具之研磨面與上述玻璃板之被研磨面平行之姿勢一邊進行繞上述偏心軸公轉之偏心旋轉運動，且將相鄰之至少兩個以上之研磨工具設為1組，以將藉由構成該組之研磨工具而產生之反作用力彼此相抵消之方式設定構成該組之各研磨工具之旋轉相位差，上述組中之各研磨工具間之旋轉相位差係於上述各組中的所有組設為相同，且可調整上述各組之間之旋轉相位差。Further, in order to achieve the above object, the present invention provides a continuous polishing apparatus for a glass sheet, which comprises a polishing table for transferring a glass sheet in one direction, and a plurality of polishing stages disposed above the polishing table along a direction in which the glass sheet is transferred. Each of the grinding tools includes an eccentric shaft that is eccentric from the centroid of the grinding tool, and the grinding tool is held such that the grinding surface of the polishing tool is parallel to the surface to be polished of the glass plate. The eccentric rotation motion of the revolution, and the adjacent at least two or more grinding tools are set to one set to set the respective grindings constituting the group in such a manner that the reaction forces generated by the grinding tools constituting the group cancel each other The rotational phase difference of the tool, the rotational phase difference between the respective grinding tools in the above group is the same for all the groups in the above groups, and the rotational phase difference between the above groups can be adjusted.
藉此，不僅將自研磨工具作用於被研磨材之負載僅於構成各組之研磨工具間相抵消，而且於各組間亦同樣地將負載相抵消，因此可進一步抵消負載，從而可進一步減少裝置之振動。Thereby, not only the load acting on the material to be polished from the polishing tool is canceled only between the polishing tools constituting each group, but also the load is canceled in the same manner between the respective groups, so that the load can be further offset, and the load can be further reduced. Vibration of the device.
又，本發明之玻璃板之連續研磨裝置中，較佳為於上述複數個研磨工具中之任意個停止時，在除包含該停止之研磨工具之組以外的其他組中、或在由除該停止之研磨工具以外之研磨工具重新組成之組中，可調整該等各組之間之旋轉相位差。Further, in the continuous polishing apparatus for a glass sheet according to the present invention, preferably, when any one of the plurality of polishing tools is stopped, in a group other than the group including the stopped grinding tool, or In the reconstituted group of grinding tools other than the stopped grinding tool, the rotational phase difference between the groups can be adjusted.
藉此，在任意研磨工具由於故障、停止或修補等而無法有助於研磨動作時，可由除該研磨工具以外之其他研磨工具調整旋轉相位差。Thereby, when any polishing tool cannot contribute to the polishing operation due to failure, stoppage, repair, or the like, the rotation phase difference can be adjusted by another polishing tool other than the polishing tool.
又，本發明之玻璃板之連續研磨裝置中，較佳為將構成上述組之研磨工具之個數設為m時，將上述組內之各研磨工具間之旋轉相位差設為360度/m。Further, in the continuous polishing apparatus for a glass sheet according to the present invention, it is preferable that when the number of the polishing tools constituting the group is m, the rotational phase difference between the respective polishing tools in the group is set to 360 degrees/m. .
藉此，例如研磨工具4個為1組時旋轉相位差為90度，研磨工具8個為1組時旋轉相位差為45度，從而可使各組內之負載完全相抵消。Thereby, for example, when the number of the polishing tools is one set, the rotational phase difference is 90 degrees, and when the eight grinding tools are one set, the rotational phase difference is 45 degrees, so that the load in each group can be completely canceled.
又，本發明之玻璃板之連續研磨裝置中，較佳為將上述各組之間之旋轉相位差根據實際驅動之上述各組所包含之上述研磨工具之個數而設定。Further, in the continuous polishing apparatus for a glass sheet according to the present invention, it is preferable that the rotational phase difference between the respective groups is set in accordance with the number of the polishing tools included in each of the groups actually driven.
藉此，可以於各組間更佳地使反作用力相抵消之方式調整組間之旋轉相位差。Thereby, the rotational phase difference between the groups can be adjusted in such a manner that the reaction forces are more preferably canceled between the groups.
又，本發明之玻璃板之連續研磨裝置中，較佳為使用伺服馬達作為使上述研磨工具進行偏心旋轉運動之驅動源，而控制各研磨工具之旋轉相位。Further, in the continuous polishing apparatus for a glass sheet according to the present invention, it is preferable to use a servo motor as a driving source for causing the polishing tool to perform an eccentric rotation motion, and to control the rotation phase of each polishing tool.
藉此，藉由使用伺服馬達作為個別驅動機構進行旋轉相位控制，而可利用各種旋轉數、複數個研磨單元且利用旋轉相位配合來減少振動，進而藉此裝置之大型化變得容易。Thereby, by using the servo motor as the individual drive mechanism for the rotational phase control, it is possible to reduce the vibration by using various rotation numbers and a plurality of polishing units and using the rotational phase matching, and it is easy to increase the size of the apparatus.
又，本發明之玻璃板之連續研磨裝置中，於上述研磨工具進行上述偏心旋轉運動之同時，繞該研磨工具之自轉軸進行自轉運動。Further, in the continuous polishing apparatus for a glass sheet according to the present invention, the polishing tool performs the eccentric rotation motion and rotates around the rotation axis of the polishing tool.
藉此，可進行更有效率之研磨。Thereby, more efficient grinding can be performed.
又，同樣地為達成上述目的，本發明提供一種玻璃板之連續研磨方法，其係由研磨台保持並移送玻璃板，並且藉由沿著該玻璃板之移送方向而配置之複數個研磨工具研磨上述移送中之玻璃板，各研磨工具包含自該研磨工具之質心偏心之偏心軸，一邊將研磨工具保持成使該研磨工具之研磨面與上述玻璃板之被研磨面平行之姿勢一邊進行繞上述偏心軸公轉之偏心旋轉運動，且將相鄰之至少三個以上之研磨工具設為1組，以將藉由構成該組之研磨工具而產生之反作用力彼此相抵消之方式設定構成該組之各研磨工具之旋轉相位差。Further, in order to achieve the above object, the present invention provides a continuous polishing method for a glass sheet which is held by a polishing table and transferred to a glass sheet, and is ground by a plurality of abrasive tools arranged along the direction in which the glass sheet is transferred. In the glass plate being transferred, each of the polishing tools includes an eccentric shaft that is eccentric from the center of mass of the polishing tool, and the polishing tool is held while the polishing surface of the polishing tool is parallel to the polished surface of the glass plate. The eccentric rotation of the eccentric shaft is eccentrically rotated, and at least three adjacent abrasive tools are set as one set to set the reaction force generated by the grinding tools constituting the set to cancel each other. The rotational phase difference of each of the grinding tools.
藉此，可抵消自研磨工具作用於被研磨材之負載，從而減少裝置之振動。Thereby, the load acting on the material to be polished from the grinding tool can be offset, thereby reducing the vibration of the device.
又，本發明之玻璃板之連續研磨方法中，於上述研磨工具進行上述偏心旋轉運動之同時，繞該研磨工具之自轉軸進行自轉運動。Further, in the continuous polishing method for a glass sheet according to the present invention, the polishing tool performs the eccentric rotation motion and rotates around the rotation axis of the polishing tool.
藉此，可進行更有效率之研磨。Thereby, more efficient grinding can be performed.
如以上所說明般，根據本發明，可抵消自研磨工具作用於被研磨材之負載，從而減少裝置之振動。As explained above, according to the present invention, the load acting on the material to be polished from the abrasive tool can be offset, thereby reducing the vibration of the device.
以下，參照隨附圖式對本發明之玻璃板之連續研磨裝置及玻璃板之連續研磨方法進行詳細說明。Hereinafter, the continuous polishing apparatus for a glass sheet of the present invention and the continuous polishing method of the glass sheet will be described in detail with reference to the accompanying drawings.
圖1係表示本發明之玻璃板之連續研磨裝置之一實施形態之概略構成之包含一部分剖面的立體圖。Fig. 1 is a perspective view showing a schematic cross-sectional view showing a schematic configuration of an embodiment of a continuous polishing apparatus for a glass sheet according to the present invention.
如圖1所示，本實施形態之連續研磨裝置中，於藉由設置在地面之基架1之架壁面1a而分成左右中之一側設置有研磨線，於研磨線鋪設有左右一對軌道2、2。於軌道2、2上，設置有於上表面搭載將要研磨之玻璃板3且可向箭頭A所示之移送方向行進之複數個研磨台車(研磨台)4，玻璃板3係隔著較薄之緩衝材而貼附固定於研磨台車4之上表面以不對其造成損傷。As shown in Fig. 1, in the continuous polishing apparatus of the present embodiment, a polishing line is provided on one side of the right and left sides by a wall surface 1a of the base frame 1 provided on the floor, and a pair of left and right rails are laid on the polishing line. 2, 2. On the rails 2 and 2, a plurality of polishing carts (polishing tables) 4 on which the glass plate 3 to be polished is mounted on the upper surface and which can travel in the direction of the arrow A is provided, and the glass plate 3 is thinned. The cushioning material is attached and fixed to the upper surface of the grinding carriage 4 so as not to cause damage thereto.
研磨台車4係於俯視時朝向移送方向A形成為矩形狀，且移送方向A上相鄰之研磨台車(省略圖示)之前端部與後端部在移送時會相互接觸。The polishing carriage 4 is formed in a rectangular shape in the transfer direction A in a plan view, and the front end portion and the rear end portion of the polishing carriage (not shown) adjacent to each other in the transfer direction A are in contact with each other at the time of transfer.
雖省略圖示，但於研磨台車4之下表面，與軌道2、2平行地設置有齒條，於齒條嚙合有配置於左右之軌道2、2間之空間部之研磨台車移送用馬達之輸出軸上所安裝的小齒輪，藉由驅動研磨台車移送用馬達而經由小齒輪及齒條將研磨台車4向移送方向A移送。Although not shown in the drawings, a rack is provided in parallel with the rails 2 and 2 on the lower surface of the polishing carriage 4, and the grinding carriage transfer motor disposed in the space between the left and right rails 2 and 2 is engaged with the rack. The pinion gear mounted on the output shaft transfers the grinding carriage 4 to the transfer direction A via the pinion gear and the rack by driving the grinding carriage transfer motor.
又，於架壁面1a之另一側形成有研磨玻璃板3之後之返回線，研磨台車4於返回線藉由輥式輸送機5而向與移送方向A相反之箭頭B方向移送。Further, on the other side of the shelf wall surface 1a, a return line after polishing the glass sheet 3 is formed, and the polishing carriage 4 is transferred to the return line by the roller conveyor 5 in the direction of the arrow B opposite to the transfer direction A.
又，於架壁面1a之研磨線側，朝向移送方向A以固定之間隔且以向軌道2、2之上方側突出之方式固定設置有複數個懸臂狀之水平樑6、6...。再者，圖1之最靠近前方之水平樑6係將其一部分切缺而表示以便瞭解其內部構造。如圖1所示，於水平樑6之內部，朝向在軌道2上移送之研磨台車4之寬度方向以特定之間隔且經由軸承可旋轉地安裝有兩根縱軸7、7。於縱軸7之下端安裝有圓盤8。而且，於在圓盤8之下表面相對於縱軸7之旋轉軸線偏心而固定設置之偏心軸9、9之下端，安裝有支持板10。於支持板10之下方，經由液壓缸11而升降自如地配設有壓盤12。Further, on the polishing line side of the shelf wall surface 1a, a plurality of cantilever-shaped horizontal beams 6, 6, ... are fixedly disposed at a fixed interval toward the transfer direction A so as to protrude toward the upper side of the rails 2, 2. Further, the horizontal beam 6 closest to the front in Fig. 1 is partially cut away to show its internal structure. As shown in Fig. 1, inside the horizontal beam 6, two longitudinal axes 7, 7 are rotatably mounted via a bearing at a specific interval in the width direction of the polishing carriage 4 transferred on the rail 2. A disc 8 is mounted on the lower end of the longitudinal axis 7. Further, a support plate 10 is attached to the lower ends of the eccentric shafts 9, 9 which are eccentrically fixed to the lower surface of the disk 8 with respect to the rotation axis of the longitudinal axis 7. Below the support plate 10, a pressure plate 12 is disposed to be lifted and lowered by a hydraulic cylinder 11.
於壓盤12之研磨台車4寬度方向兩側，設置有向上方延伸之導引棒13、13。導引棒13、13滑動自如地嵌合於支持板10之研磨台車4寬度方向兩側所設置之圓筒狀的導引塊14、14。壓盤12在升降時，經由導引棒13而藉由導引塊14引導，使其不向左右傾斜，於壓盤12之下方，經由萬向接頭15而裝設有研磨工具16。Guide bars 13, 13 extending upward are provided on both sides in the width direction of the polishing carriage 4 of the platen 12. The guide bars 13 and 13 are slidably fitted to the cylindrical guide blocks 14 and 14 provided on both sides in the width direction of the polishing carriage 4 of the support plate 10. When the platen 12 is lifted and lowered, it is guided by the guide block 14 via the guide bar 13 so as not to be inclined to the left and right, and the grinding tool 16 is mounted below the platen 12 via the universal joint 15.
設置萬向接頭15係為了對錐狀之玻璃板3或相對於移送方向A而位於前後之玻璃板3之接合處之階差靈活地應對。The universal joint 15 is provided to flexibly cope with the step of the joint of the tapered glass plate 3 or the glass plate 3 located at the front and rear with respect to the transfer direction A.
又，研磨工具16形成為俯視時於研磨台車4之寬度方向上延伸之帶狀，以對玻璃板3之表面均一地進行研磨。此處，研磨工具16之形狀為短條狀(以下亦稱為矩形狀)，研磨工具16沿著研磨台車4之移送方向配置有複數個。又，研磨工具16具有自研磨工具16之質心偏心之偏心軸。研磨工具16包含例如胺基甲酸酯發泡體製之研磨墊。Further, the polishing tool 16 is formed in a strip shape extending in the width direction of the polishing carriage 4 in a plan view to uniformly polish the surface of the glass sheet 3. Here, the shape of the polishing tool 16 is a short strip shape (hereinafter also referred to as a rectangular shape), and the polishing tool 16 is disposed in plural in the transfer direction of the polishing cart 4 . Further, the abrasive tool 16 has an eccentric shaft that is eccentric from the center of mass of the abrasive tool 16. The abrasive tool 16 comprises a polishing pad such as a urethane foaming system.
又，為於圓盤8藉由偏心軸9消除扭矩，較理想為於偏心軸9之相反側安裝平衡器。Further, in order to eliminate the torque of the disk 8 by the eccentric shaft 9, it is preferable to mount the balancer on the opposite side of the eccentric shaft 9.
於各水平樑6之上方設置有伺服馬達18，於其輸出軸19之下端安裝有滑輪20。A servo motor 18 is disposed above each of the horizontal beams 6, and a pulley 20 is attached to a lower end of the output shaft 19.
又，於縱軸7中之接近於架壁面1a之側之縱軸7之上端，外嵌、固定有滑輪21、22，於自架壁面1a背離之側之縱軸7之上端，外嵌、固定有滑輪23。又，於滑輪20、21架設有環狀之皮帶24，於滑輪22、23架設有環狀之皮帶25。Further, on the upper end of the longitudinal axis 7 of the longitudinal axis 7 which is close to the side of the shelf wall surface 1a, the pulleys 21 and 22 are externally fitted and fixed, and are externally fitted to the upper end of the longitudinal axis 7 on the side away from the shelf wall surface 1a. A pulley 23 is fixed. Further, an endless belt 24 is placed on the pulleys 20 and 21, and an endless belt 25 is placed on the pulleys 22 and 23.
此處，藉由驅動伺服馬達18，經由滑輪21而使接近於架壁面1a之側之縱軸7旋轉，進而，經由滑輪23而使自架壁面1a背離之側之縱軸7旋轉。於是，安裝於縱軸7之下端之圓盤8旋轉，藉此偏心軸9繞縱軸7之旋轉軸線公轉(偏心旋轉)。於是，經由導引棒13、13及液壓缸11而使壓盤12亦與支持板10同樣地進行偏心旋轉。藉此，經由萬向接頭15而裝設於壓盤12之研磨工具16一邊將研磨工具保持成使其研磨面與上述玻璃板3之被研磨面平行之姿勢一邊進行公轉(偏心旋轉)。Here, by driving the servo motor 18, the vertical axis 7 close to the side of the shelf wall surface 1a is rotated via the pulley 21, and the vertical axis 7 on the side away from the shelf wall surface 1a is rotated via the pulley 23. Then, the disk 8 attached to the lower end of the longitudinal axis 7 is rotated, whereby the eccentric shaft 9 revolves around the axis of rotation of the longitudinal axis 7 (eccentric rotation). Then, the pressure plate 12 is also eccentrically rotated in the same manner as the support plate 10 via the guide bars 13 and 13 and the hydraulic cylinder 11. Thereby, the polishing tool 16 attached to the platen 12 via the universal joint 15 holds the polishing tool in a revolving (eccentric rotation) while maintaining the polishing surface parallel to the surface to be polished of the glass plate 3.
另一方面，藉由驅動研磨台車移送用馬達，而將貼附有玻璃板3之研磨台車4向移送方向A連續地移送。此時，藉由液壓缸11經由壓盤12而使研磨工具16下降，研磨工具16之下表面與玻璃板3之表面接觸，藉此玻璃板3藉由研磨工具16而連續地被研磨。On the other hand, by driving the polishing carriage transfer motor, the polishing carriage 4 to which the glass plate 3 is attached is continuously transferred in the transfer direction A. At this time, the grinding tool 16 is lowered by the hydraulic cylinder 11 via the platen 12, and the lower surface of the polishing tool 16 is brought into contact with the surface of the glass plate 3, whereby the glass plate 3 is continuously ground by the grinding tool 16.
用以使研磨工具16在姿勢保持固定之狀態下偏心旋轉(公轉)之機構並不限定於如此般使用兩根縱軸7、7者，亦可將用以使研磨工具偏心旋轉之輸出軸設為單軸而構成。The mechanism for eccentrically rotating (revolving) the grinding tool 16 in a state in which the posture is kept fixed is not limited to the use of the two longitudinal axes 7 and 7, and the output shaft for eccentrically rotating the grinding tool may be provided. It is composed of a single axis.
例如，亦可設置旋轉自如地支持於相對於旋轉之主軸之旋轉中心偏心之位置上之輸出軸，進而，包含防止該輸出軸因主軸之旋轉而引起之共同旋轉(自轉)之止轉機構，從而設置於輸出軸之端部之研磨工具不自轉而僅進行偏心旋轉(公轉)，僅以單軸之輸出軸使其進行偏心旋轉。又，作為使其偏心旋轉之機構，除包含如此般與主軸偏心之輸出軸之機構以外，亦可為使用行星齒輪(epicyclic gear)之機構。For example, an output shaft that is rotatably supported at a position eccentric with respect to a rotation center of the rotating main shaft may be provided, and further includes a rotation preventing mechanism that prevents the output shaft from rotating (rotating) due to the rotation of the main shaft. Therefore, the grinding tool provided at the end of the output shaft does not rotate and performs only eccentric rotation (revolution), and the eccentric rotation is performed only by the output shaft of the single shaft. Further, as a mechanism for rotating the eccentricity, a mechanism using an epicyclic gear may be used in addition to the mechanism including the output shaft that is eccentric with the main shaft.
圖2中表示包含用以使研磨工具偏心旋轉之輸出軸為單軸之研磨工具之研磨線的例。Fig. 2 shows an example of a polishing line including a grinding tool in which the output shaft for eccentric rotation of the polishing tool is uniaxial.
圖2中，使研磨工具偏心旋轉之機構以外之構成與圖1相同，圖1中所顯示之基架1、架壁面1a、設置於架壁面1a之水平樑6及返回線等省略顯示。又，圖2中，對與圖1相同之構成要素使用與圖1相同之符號。In Fig. 2, the configuration other than the mechanism for rotating the polishing tool eccentrically is the same as that of Fig. 1, and the base frame 1, the shelf wall surface 1a, the horizontal beam 6 provided on the shelf wall surface 1a, the return line, and the like shown in Fig. 1 are omitted. In FIG. 2, the same components as those in FIG. 1 are denoted by the same reference numerals as those in FIG. 1.
如圖2所示，研磨線中，對玻璃板3進行研磨之研磨工具16係針對每個在此處省略而圖1所示之水平樑6設置，且於研磨線上沿著箭頭A所示之玻璃板3之移送方向而排列配置有複數個。As shown in FIG. 2, in the polishing line, the polishing tool 16 for polishing the glass plate 3 is provided for each horizontal beam 6 shown in FIG. 1 which is omitted here, and is shown along the arrow A on the grinding line. A plurality of the glass sheets 3 are arranged in a direction in which they are arranged.
於省略圖示之水平樑6中設置有偏心旋轉機構30，於其上方設置有驅動偏心旋轉機構30之伺服馬達18。於偏心旋轉機構30之下側延伸出輸出軸31，於輸出軸31之下端設置有研磨工具16。An eccentric rotating mechanism 30 is provided in the horizontal beam 6 (not shown), and a servo motor 18 that drives the eccentric rotating mechanism 30 is provided above the eccentric rotating mechanism 30. An output shaft 31 extends from a lower side of the eccentric rotating mechanism 30, and an abrasive tool 16 is disposed at a lower end of the output shaft 31.
偏心旋轉機構30係經由輸出軸31使研磨工具16不自轉而僅公轉(偏心旋轉)者，其具體機構並未特別限定。又，輸出軸31構成為於藉由研磨工具16對玻璃板3進行研磨時，不僅使研磨工具16進行偏心旋轉，且藉由空氣彈簧等加壓機構而自研磨工具16對玻璃板3負載有適當之研磨壓力。再者，較佳為與圖1之例同樣地經由萬向接頭等而裝設研磨工具16，從而可靈活地應對玻璃板3等之形狀變化。The eccentric rotating mechanism 30 causes the polishing tool 16 to rotate only by the output shaft 31 without being rotated (eccentrically rotating), and the specific mechanism thereof is not particularly limited. Further, when the glass shaft 3 is polished by the polishing tool 16, the output shaft 31 is configured to not only eccentrically rotate the polishing tool 16, but also load the glass plate 3 from the polishing tool 16 by a pressurizing mechanism such as an air spring. Proper grinding pressure. In addition, it is preferable to install the polishing tool 16 via a universal joint or the like in the same manner as the example of FIG. 1, and it is possible to flexibly cope with the shape change of the glass plate 3 or the like.
本發明中，對如上所述般複數個配置於研磨線之各研磨單元之偏心旋轉機構30藉由伺服馬達18個別地控制旋轉相位，藉此抵消自各研磨單元對研磨線產生之反作用力，從而減少裝置之振動。以下，對該偏心旋轉之相位控制之方法進行說明。再者，本說明書中所謂研磨單元，係指研磨工具16、伺服馬達18、偏心旋轉機構30及輸出軸31等用以研磨玻璃板3之裝置構件之整套。In the present invention, as described above, the eccentric rotating mechanism 30 disposed in each of the polishing units of the polishing line individually controls the rotational phase by the servo motor 18, thereby counteracting the reaction force generated by each polishing unit against the polishing line, thereby Reduce the vibration of the device. Hereinafter, a method of phase control of the eccentric rotation will be described. In the present specification, the polishing unit refers to a complete set of device members for polishing the glass sheet 3, such as the polishing tool 16, the servo motor 18, the eccentric rotation mechanism 30, and the output shaft 31.
首先，圖3中表示成為相位控制之基本的使相鄰之兩個研磨單元之旋轉相位偏移180度而進行相位控制之情形的研磨工具16之運動詳情之例。First, FIG. 3 shows an example of the details of the movement of the polishing tool 16 in the case where the phase of the adjacent two polishing units is shifted by 180 degrees and the phase is controlled.
如圖3所示，研磨工具16為n個(n為偶數)，如第1個與第2個、第3個與第4個...般將相鄰之兩個研磨工具16作為1組而進行相位控制。粗的圓弧狀之箭頭40表示研磨工具16之旋轉(公轉)方向。如對於研磨工具16藉由旋轉而移動時之各位置以圖中實線與虛線所示，研磨工具16如P1→P2→P3→P4般沿著箭頭40移動。所有研磨工具16向相同方向旋轉。As shown in FIG. 3, the number of the grinding tools 16 is n (n is an even number), and the two grinding tools 16 adjacent to each other as the first, second, third, and fourth... And phase control is performed. The thick arc-shaped arrow 40 indicates the direction of rotation (revolution) of the grinding tool 16. As indicated by the solid line and the broken line in the figure for the position where the grinding tool 16 is moved by the rotation, the grinding tool 16 moves along the arrow 40 as P1 → P2 → P3 → P4. All of the grinding tools 16 are rotated in the same direction.
此時，相鄰之兩個研磨工具16被控制為旋轉方向相同，但旋轉之相位偏移180度。即，如圖3所示，例如第1個研磨工具16位於P1之位置，第2個研磨工具16位於P3之位置。如此，相鄰之兩個研磨工具16係其質心之旋轉相位各反轉180度。At this time, the two adjacent grinding tools 16 are controlled to have the same rotational direction, but the phase of the rotation is shifted by 180 degrees. That is, as shown in FIG. 3, for example, the first polishing tool 16 is located at the position P1, and the second polishing tool 16 is located at the position of P3. Thus, the adjacent two grinding tools 16 are rotated by 180 degrees each of their centroids.
又，箭頭41表示施加於研磨工具16所研磨之玻璃板3(此處省略圖示)之力的方向。Further, an arrow 41 indicates the direction of the force applied to the glass plate 3 (not shown) polished by the polishing tool 16.
第3個與第4個研磨工具16之組、第5個與第6個研磨工具16之組...亦全部與第1個與第2個研磨工具16之組同樣地進行相位控制。The third and fourth polishing tools 16 and the fifth and sixth polishing tools 16 are all also phase controlled in the same manner as the first and second polishing tools 16 .
如此，藉由以相鄰之研磨工具16之旋轉相位各反轉180度之方式進行控制，而自相鄰之研磨工具16施加於玻璃板3及研磨台車4之力之朝向彼此相反。其結果為，以施加於裝置之負載(反作用力)得以抵消之方式發生作用，從而減少裝置之振動。Thus, by controlling the rotation phases of the adjacent polishing tools 16 to be reversed by 180 degrees, the directions of the forces applied from the adjacent polishing tools 16 to the glass sheet 3 and the polishing carriage 4 are opposite to each other. As a result, it acts in such a manner that the load (reaction force) applied to the device is canceled, thereby reducing the vibration of the device.
其次，對將4個研磨單元作為1組而進行相位控制之情形進行說明。Next, a case where phase control is performed by using four polishing units as one group will be described.
圖4中表示將連續配置之4個研磨單元作為1組，使各研磨單元之旋轉相位偏移90度而進行相位控制之情形之研磨工具16之運動詳情的例。FIG. 4 shows an example of the details of the movement of the polishing tool 16 in the case where the four polishing units arranged in series are used as one set and the rotational phase of each polishing unit is shifted by 90 degrees to perform phase control.
如圖4所示，將n設為4之倍數而排列n個研磨工具16，將如第1個~第4個、第5個~第8個...般連續之每4個研磨工具16設為1組而進行相位控制。粗的圓弧狀之箭頭40表示研磨工具16之旋轉(公轉)方向，箭頭41表示施加於研磨工具16所研磨之玻璃板3(省略圖示)之力的方向。As shown in FIG. 4, n polishing tools 16 are arranged by setting n to a multiple of 4, and each of the four grinding tools 16 is continuous as the first to fourth, the fifth to the eighth ... Phase control is performed by setting one group. The thick circular arc arrow 40 indicates the rotation (revolution) direction of the polishing tool 16, and the arrow 41 indicates the direction of the force applied to the glass plate 3 (not shown) polished by the polishing tool 16.
又，將研磨工具16藉由旋轉而移動時之各位置以圖中實線與虛線如P1、P2、P3、P4般表示。如箭頭40所示，於此情形時，亦為所有研磨工具16向相同方向旋轉。Further, each position when the polishing tool 16 is moved by the rotation is indicated by a solid line and a broken line in the figure as P1, P2, P3, and P4. As indicated by the arrow 40, in this case, all of the grinding tools 16 are also rotated in the same direction.
第1個~第4個研磨工具16之組中，第1個研磨工具16位於P1之位置時，第2個研磨工具16位於P2之位置，第3個研磨工具16位於P3之位置，且第4個研磨工具16位於P4之位置。如此，將每4個研磨工具16作為1組來進行相位控制之情形時，各研磨工具16之旋轉相位各偏移90度。In the group of the first to fourth grinding tools 16, when the first grinding tool 16 is at the position P1, the second grinding tool 16 is at the position P2, and the third grinding tool 16 is at the position P3, and the third Four grinding tools 16 are located at P4. As described above, when the phase control is performed for each of the four polishing tools 16 as one set, the rotational phases of the respective polishing tools 16 are shifted by 90 degrees.
此時，由各位置P1~P4處之研磨工具16所引起之負載之方向41可明白，該等4個負載彼此相抵消，從而抵消反作用力(負載)。其結果為，減少裝置之振動。At this time, it can be understood from the direction 41 of the load caused by the grinding tool 16 at each of the positions P1 to P4 that the four loads cancel each other, thereby canceling the reaction force (load). As a result, the vibration of the device is reduced.
再者，研磨單元之個數n即便不為4之倍數亦具有一定之效果，但於4之倍數之情形時，可藉由研磨工具16之偏心旋轉完全抵消經由玻璃板3而對裝置整體所施加之負載。Further, the number n of the polishing units has a certain effect even if it is not a multiple of 4, but in the case of a multiple of 4, the eccentric rotation of the polishing tool 16 can completely cancel the entire device through the glass plate 3. The load applied.
其次，對將8個研磨單元作為1組而進行相位控制之情形進行說明。Next, a case where phase control is performed by using eight polishing units as one group will be described.
圖5中表示將連續配置之8個研磨單元作為1組，使各研磨單元之旋轉相位偏移45度而進行相位控制之情形之研磨工具16的運動詳情之例。FIG. 5 shows an example of the details of the movement of the polishing tool 16 in the case where eight polishing units arranged in series are used as one set, and the rotational phase of each polishing unit is shifted by 45 degrees to perform phase control.
如圖5所示，排列n個研磨工具16，將第1個~第8個、第9個~第16個、...、第n-8個~第n個之8個研磨工具16作為1組而進行旋轉相位控制。As shown in FIG. 5, n polishing tools 16 are arranged, and 8 grinding tools 16 of the first to eighth, ninth to sixteenth, ..., n-8th to nth are used as One group is rotated for phase control.
與至此為止之例同樣地，箭頭40表示研磨工具16之旋轉(公轉)方向，箭頭41表示施加於研磨工具16所研磨之玻璃板3(省略圖示)之力的方向。Similarly to the example so far, the arrow 40 indicates the direction of rotation (revolution) of the polishing tool 16, and the arrow 41 indicates the direction of the force applied to the glass plate 3 (not shown) polished by the polishing tool 16.
此情形之相位控制係以針對每個相鄰之研磨工具16使旋轉相位偏移45度之方式進行控制。即，控制為該1組之8個研磨工具16中相鄰者彼此之位置處於其質心繞研磨工具16之旋轉(公轉)中心相互成45度之角之位置。因此，表示來自各研磨工具16之負載之方向的箭頭41之方向各偏移45度。The phase control in this case is controlled in such a way that the rotational phase is shifted by 45 degrees for each adjacent grinding tool 16. That is, it is controlled that the positions of the adjacent ones of the eight grinding tools 16 of the one group are at positions where the center of mass is at an angle of 45 degrees to each other around the center of rotation (revolution) of the grinding tool 16. Therefore, the directions of the arrows 41 indicating the directions of the loads from the respective grinding tools 16 are each shifted by 45 degrees.
如此，藉由使8個1組之研磨工具16之旋轉相位偏移45度，而可將該8個研磨工具16所引起之負載彼此相抵消，從而抵消負載。再者，於研磨工具16之個數n為8之倍數之情形時，可於研磨線整體完全抵消負載，從而可減少裝置之振動。Thus, by shifting the rotational phase of the eight sets of the grinding tools 16 by 45 degrees, the loads caused by the eight grinding tools 16 can be canceled each other, thereby canceling the load. Furthermore, when the number n of the grinding tools 16 is a multiple of 8, the load can be completely offset by the entire grinding line, and the vibration of the device can be reduced.
如此，若使研磨工具16之組合數由2個增加至4個、由4個增加至8個，相位亦由偏移180度至90度、進而細微至45度，則振動減少效果更大。Thus, if the number of combinations of the grinding tools 16 is increased from two to four, from four to eight, and the phase is shifted from 180 degrees to 90 degrees, and then to 45 degrees, the vibration reducing effect is greater.
又，若組合數變多則相位控制之設定變困難，但本實施形態中係使用伺服馬達18個別地控制研磨工具16之旋轉相位，因此只要預先設定各伺服馬達18，相位控制之變更亦變得容易。因此，如先前之連續研磨裝置般由基於一個驅動源之驅動軸使所有研磨工具同時進行偏心旋轉者中，旋轉相位被固定，而無法應對研磨工具之各種用途，而本實施形態中，可應對研磨工具之各種用途。Further, if the number of combinations is increased, the setting of the phase control becomes difficult. However, in the present embodiment, the servo motor 18 is used to individually control the rotational phase of the polishing tool 16. Therefore, if the servo motor 18 is set in advance, the phase control is changed. It's easy. Therefore, in the case where all the polishing tools are simultaneously eccentrically rotated by the drive shaft based on one drive source as in the conventional continuous polishing apparatus, the rotation phase is fixed, and the various uses of the polishing tool cannot be handled, but in the present embodiment, it is possible to cope with Various uses of abrasive tools.
至此所說明之例均為將偶數個作為1組者，但本發明並不限定於將偶數個作為1組者，亦可將奇數個作為1組。The examples described so far are all an even number of ones. However, the present invention is not limited to the case where an even number is one group, and an odd number may be used as one group.
例如，於研磨單元之個數n為3之倍數之情形時，亦可將整體如3、3、3、3、...、3般各以3個研磨工具為1組。此時，對於1組內之3個研磨工具，將旋轉相位偏移120度。又，亦可混合存在包含偶數個之研磨工具之組與包含奇數個之研磨工具之組。例如，於n為奇數之情形時，亦可如2、2、2、...、2、2、3般組成一個以3個為1組之組，其餘所有以2個為1組。For example, when the number n of the polishing units is a multiple of 3, the whole of the three grinding tools may be one set as in the three, three, three, three, ..., and three. At this time, the rotation phase was shifted by 120 degrees for the three grinding tools in one set. Further, a group including an even number of grinding tools and a group including an odd number of grinding tools may be mixed. For example, when n is an odd number, a group of three groups may be formed as in 2, 2, 2, ..., 2, 2, and 3, and all of the others are grouped by two.
以下，對相位控制之進而其他例進行說明。Hereinafter, other examples of the phase control will be described.
首先，圖6所示之例中，與圖3所示之例同樣地使n個(n為偶數)研磨工具16每2個作為1組，對各組內之2個研磨工具16將旋轉相位偏移180度，並且進而對各組之相位進行調整。First, in the example shown in Fig. 6, in the same manner as the example shown in Fig. 3, n (n is an even number) polishing tools 16 are used as one set, and the two grinding tools 16 in each group are rotated in phase. The offset is 180 degrees and the phase of each group is adjusted accordingly.
如圖6所示，使n個(n為偶數)之研磨工具16如第1個與第2個、第3個與第4個...般以相鄰之每2個作為1組。而且，各組中將2個研磨工具16之相位偏移180度。即。各個組中，施加於各研磨工具16、16所研磨之玻璃板3(此處省略圖示)之力的方向41、41反轉180度。As shown in FIG. 6, n (n is an even number) of the polishing tool 16 is set to be one set as the first, the second, the third, and the fourth. Moreover, the phase of the two grinding tools 16 is shifted by 180 degrees in each group. which is. In each of the groups, the directions 41 and 41 applied to the force of the glass plate 3 (not shown) polished by the polishing tools 16 and 16 are reversed by 180 degrees.
又，研磨工具16存在n個時，藉由將每2個研磨工具作為1組，可為x=n/2組。此處，將相鄰之組間之相位調整量設為360度/x，而使相鄰之組間之相位偏移。Further, when there are n pieces of the polishing tool 16, the number of each of the two polishing tools can be x=n/2. Here, the phase adjustment amount between adjacent groups is set to 360 degrees/x, and the phase between adjacent groups is shifted.
例如圖6所示，由第1個與第2個研磨工具16構成之第1組、及由第3個與第4個研磨工具16構成之第2組中，第1個研磨工具16與第2個研磨工具16使負載之方向41偏移180度，又，第3個研磨工具16與第4個研磨工具16亦使負載之方向41偏移180度。而且，第1個研磨工具16之負載之方向41與第3個研磨工具16之負載之方向41偏移45度。For example, as shown in FIG. 6, in the first group consisting of the first and second polishing tools 16, and the second group consisting of the third and fourth polishing tools 16, the first polishing tool 16 and the first The two grinding tools 16 offset the load direction 41 by 180 degrees, and the third grinding tool 16 and the fourth grinding tool 16 also shift the load direction 41 by 180 degrees. Further, the direction 41 of the load of the first grinding tool 16 is shifted by 45 degrees from the direction 41 of the load of the third grinding tool 16.
亦可將該等2個研磨工具作為1組，將該組進而成組，且將上述組作為1群，而將組階層化。例如分類成1群至m群之m個組之群。此時，若將各群內之研磨工具16之個數設為n1 、n2 、...、nm ，則n1 +n2 +...+nm =n。此處無需使分割之各群之組數相同。只要分割成任意組數而形成群，根據群內之組數決定旋轉相位差即可。The two polishing tools may be used as one set, and the group may be further grouped, and the group may be grouped as one group to stratify the group. For example, a group classified into m groups of 1 group to m group. At this time, if the number of the polishing tools 16 in each group is n 1 , n 2 , ..., n m , then n 1 + n 2 + ... + n m = n. There is no need to make the number of groups of the divided groups the same here. As long as the group is formed by dividing into an arbitrary number of groups, the rotation phase difference can be determined according to the number of groups in the group.
於研磨工具整體之個數n為奇數之情形時，最初之階層之組如上所述包含1組為3個之組，其餘以每2個成為1組。於該奇數之情形時，最初之階層之組間藉由360度/{(n-1)/2}而進行相位調整。When the number n of the entire polishing tool is an odd number, the group of the first hierarchy includes one group of three as described above, and the other one is one group for each of two. In the case of the odd number, the phase adjustment is performed by the first hierarchical group by 360 degrees / {(n-1)/2}.
再者，研磨工具16之個數或組化、分群之個數並無特別限定，可為任意分類。又，此時之相位調整量以將裝置整體中之負載相抵消為最小限度之方式進行設定。Further, the number of the polishing tools 16 or the number of groupings and groups is not particularly limited, and may be any classification. Further, the phase adjustment amount at this time is set such that the load in the entire device is canceled to the minimum.
圖6所示之例中，以將2個研磨工具作為1組之最初之階層之組內負載之方向偏移180度，並且相鄰之組間相位偏移45度之方式進行相位調整。若具體地應用數字，則例如將研磨工具16之個數n設為16個時，最初之階層之組可為n/2=16/2=8組，此時之相位調整量為360度/8=45度。In the example shown in FIG. 6, the phase adjustment is performed such that the two grinding tools are shifted by 180 degrees in the direction of the load in the first group of the first group, and the phase between the adjacent groups is shifted by 45 degrees. When the number is specifically applied, for example, when the number n of the grinding tools 16 is set to 16, the first hierarchical group can be n/2=16/2=8 sets, and the phase adjustment amount at this time is 360 degrees/ 8 = 45 degrees.
又，藉由如此以組為單位進行相位調整，而即便於例如研磨單元發生故障等而必需停止研磨單元般之情形時，亦存在對該維護、故障應對而言具有自由度之優點。In addition, when the phase adjustment is performed in units of groups, even if it is necessary to stop the polishing unit in the event of a failure of the polishing unit or the like, there is an advantage in that there is a degree of freedom in maintenance and failure response.
以下對如下情形之相位調整進行說明，即，如圖6之例般將2個研磨工具作為1組而於各組間進行相位調整時，偶數個研磨單元停止的情形，例如圖7所示，第5個與第6個之2個研磨單元停止的情形。In the following, the phase adjustment in the case where the two polishing tools are used as one set and the phase adjustment is performed between the groups as in the case of FIG. 6 is performed, for example, as shown in FIG. The case where the fifth and sixth polishing units are stopped.
於此情形時，以在除包含停止之兩個研磨單元之組以外之其餘組間儘可能降低負載之方式進行控制。In this case, control is performed in such a manner that the load is reduced as much as possible among the other groups except the group of the two grinding units that are stopped.
即，於將停止之研磨單元之個數設為nt 時，將相位調整量設為360度/(x-nt /2)，於除停止之研磨單元以外之組間進行相位調整。In other words, when the number of the polishing units to be stopped is n t , the phase adjustment amount is set to 360 degrees/(xn t /2), and phase adjustment is performed between groups other than the stopped polishing unit.
例如，如上述之例般研磨工具16之個數為n=16，停止之研磨工具16如圖7所示為2個時(nt =2)，其餘組間之相位調整量由於組數x為8，x-nt /2=8-1=7，故而根據360度/7成為大致51.4度。再者，亦可以相位調整量為整數值之方式進行調整。For example, as in the above example, the number of the grinding tools 16 is n=16, and the grinding tool 16 that is stopped is two as shown in FIG. 7 (n t = 2), and the phase adjustment amount between the other groups is due to the number of groups x It is 8, xn t /2=8-1=7, so it becomes approximately 51.4 degrees according to 360 degrees/7. Furthermore, the phase adjustment amount can also be adjusted as an integer value.
又，以下對如下情形之相位調整進行說明，即，如圖6之例般將2個作為1組而於各組間進行相位調整時，奇數個研磨單元停止的情形，例如圖8所示，僅第6個研磨單元停止的情形。In the following, the phase adjustment in the case where the odd number of polishing units are stopped when two phases are set as one set and phase adjustment is performed as shown in FIG. Only the sixth grinding unit stops.
於此情形時，如圖8所示，例如第1個與第2個研磨單元仍然為兩個1組，對於該組內之兩個研磨工具16、16以相位偏移180度之方式進行相位控制，但因第6個研磨單元停止，故對於之前與第6個研磨單元成為一組之第5個研磨單元，與第3個與第4個組合而以三個為1組。繼而，於該包含三個研磨單元之組內，以各研磨工具16、16、16所引起之負載之方向41、41、41偏移360度/3=120度之方式進行相位控制。又，對於第7個以後之研磨單元仍然以2個為1組進行偏移180度之相位控制。In this case, as shown in FIG. 8, for example, the first and second polishing units are still two sets, and the two grinding tools 16 and 16 in the group are phase-shifted by 180 degrees. Control, but since the sixth polishing unit is stopped, the fifth polishing unit that has been grouped with the sixth polishing unit is combined with the third and fourth, and three groups are one. Then, in the group including the three polishing units, the phase control is performed such that the directions 41, 41, and 41 of the loads caused by the respective grinding tools 16, 16, 16 are shifted by 360 degrees / 3 = 120 degrees. Further, for the seventh and subsequent polishing units, the phase control is shifted by 180 degrees in two groups.
繼而，以於所驅動之各組間儘可能降低整體上之負載之方式設定相位調整量，以於各組間偏移相位之方式進行相位調整。Then, the phase adjustment amount is set so as to reduce the overall load as much as possible between the groups to be driven, and phase adjustment is performed so as to shift the phase between the groups.
如此，本實施形態中，並非如先前般以一個驅動軸驅動所有研磨單元，而以伺服馬達18分別獨立驅動各個研磨單元，因此即便若干研磨單元停止亦無需停止裝置整體，藉由以相抵消負載之方式對其餘之研磨單元進行相位控制，便可減少裝置整體之振動。As described above, in the present embodiment, not all of the polishing units are driven by one drive shaft as in the prior art, and the respective polishing units are independently driven by the servo motor 18. Therefore, even if a plurality of polishing units are stopped, it is not necessary to stop the entire apparatus, thereby canceling the load by By way of phase control of the remaining grinding units, the overall vibration of the device can be reduced.
於複數個研磨單元相互抵消反作用力(負載)而進行研磨動作時，若在某個研磨單元發生故障之情形時，僅將其拆除而驅動其餘之研磨單元，則於裝置大型化之情形時必需使用其他研磨單元代替該拆除之研磨單元而取得平衡。然而，如上述之例般，即便產生發生故障之研磨單元，亦可藉由將其餘之研磨單元重新以將反作用力相抵消之方式改訂相位控制之方法進行研磨動作，而無需新的平衡零件等，裝置之大型化變得容易。When a plurality of polishing units cancel the reaction force (load) and perform the polishing operation, if a certain polishing unit fails, only the removal of the polishing unit is performed to drive the remaining polishing unit, which is necessary when the apparatus is enlarged. The balance is achieved by using other grinding units instead of the removed grinding unit. However, as in the above-described example, even if the grinding unit that has failed is generated, the grinding operation can be performed by re-routing the remaining grinding unit in such a manner that the reaction force is cancelled, without requiring a new balancing part or the like. The enlargement of the device becomes easy.
再者，至此所說明之例均為使矩形狀之研磨工具16偏心旋轉(公轉)而進行研磨動作者，但本發明之連續研磨裝置並不限定於此。例如，亦可為於使圓形形狀之研磨工具進行偏心旋轉(公轉)之同時，繞該研磨工具之自轉軸進行自轉運動而進行研磨。Further, in the examples described so far, the polishing tool 16 having a rectangular shape is eccentrically rotated (revolved) to perform polishing. However, the continuous polishing device of the present invention is not limited thereto. For example, it is also possible to perform the eccentric rotation (revolution) of the circular shape grinding tool while performing the rotation motion around the rotation axis of the polishing tool.
圖9中表示於使圓形形狀之研磨工具偏心旋轉(公轉)之同時進行自轉而進行研磨之研磨線的例。FIG. 9 shows an example of a polishing line that performs polishing by rotating the polishing tool of a circular shape while rotating eccentrically (revolving).
如圖9所示，研磨線上，研磨玻璃板3之研磨工具116分別針對省略圖示之基架1之架壁面1a所設置之各水平樑6(參照圖1)設置，且於研磨線上沿著由箭頭A所示之玻璃板3移送方向排列配置有複數個。As shown in FIG. 9, on the polishing line, the polishing tool 116 for polishing the glass sheet 3 is provided for each horizontal beam 6 (refer to FIG. 1) provided on the shelf surface 1a of the pedestal 1 (not shown), and is along the grinding line. A plurality of sheets are arranged in the direction in which the glass sheets 3 are indicated by the arrow A.
圖9所示之例中，研磨工具116以圓形形狀安裝於偏心旋轉機構130，藉由偏心旋轉機構130一邊如圖中箭頭B所示般進行自轉，一邊如箭頭C所示般進行偏心旋轉(公轉)。In the example shown in Fig. 9, the polishing tool 116 is attached to the eccentric rotating mechanism 130 in a circular shape, and the eccentric rotating mechanism 130 rotates as shown by an arrow B in the figure, and performs eccentric rotation as indicated by an arrow C. (Revolution).
作為此種使研磨工具116進行自轉及公轉之偏心旋轉機構130並無特別限定，例如可為如上所述之於相對於旋轉之主軸之旋轉中心偏心之位置上旋轉自如地設置有輸出軸者、或使用行星齒輪者等中不設置防止共同旋轉(自轉)之機構而使研磨工具進行自轉及公轉者。The eccentric rotation mechanism 130 that rotates and revolves the polishing tool 116 is not particularly limited. For example, as described above, the output shaft may be rotatably provided at a position eccentric with respect to the rotation center of the main shaft of the rotation. Or the use of a planetary gear or the like does not provide a mechanism for preventing common rotation (rotation), and the grinding tool is rotated and revolved.
關於此種研磨工具116之公轉，如上述之例般，只要將相鄰之若干研磨工具116作為1組，以於其中將施加於玻璃板之負載彼此相抵消之方式偏移相位而進行控制即可。又，進而更佳為針對各組進行相位調整而減少裝置整體上之振動。Regarding the revolution of the grinding tool 116, as in the above-described example, as long as a plurality of adjacent grinding tools 116 are used as one set, the phase is shifted by offsetting the load applied to the glass sheets, that is, can. Further, it is more preferable to perform phase adjustment for each group to reduce the vibration of the entire apparatus.
如以上所說明般，將複數個研磨單元以若干個為1組，且以組為單位進行相位控制，進而對每個組進行相位調整，藉此作為對基於研磨工具之研磨動作之振動的基本對策具有效果，進而由於以伺服馬達個別地對各研磨單元進行驅動，故而於產生故障之情形時亦可順利地應對。As described above, a plurality of polishing units are grouped in groups, and phase control is performed in units of groups, and phase adjustment is performed for each group, thereby serving as a basic vibration for the polishing operation based on the polishing tool. The countermeasure has an effect, and since each of the polishing units is individually driven by the servo motor, it can be smoothly handled in the event of a failure.
再者，以上所說明之玻璃板之連續研磨裝置中，作為研磨工具之驅動方法，對僅公轉之情形及一邊自轉一邊公轉之情形進行了說明，但研磨裝置之驅動方法亦可使用除此以外之方法。Further, in the continuous polishing apparatus for a glass sheet as described above, the method of driving the polishing tool is described in the case of only revolution and the case of revolving while rotating, but the driving method of the polishing apparatus may be used. The method.
例如，亦可使研磨工具一邊自轉一邊公轉，並且搖動研磨台(研磨台車)，或者使研磨工具公轉，並且搖動研磨台(研磨台車)，進而使研磨台旋轉，而進一步提高研磨效率，亦可對該等研磨裝置之驅動方法應用本發明。For example, the polishing tool can be revolved while rotating, and the polishing table (polishing trolley) can be shaken, or the polishing tool can be revolved, and the polishing table (polishing trolley) can be shaken to further rotate the polishing table, thereby further improving the polishing efficiency. The present invention is applied to the driving method of the polishing apparatus.
以上，已對本發明之玻璃板之連續研磨裝置及玻璃板之連續研磨方法進行了詳細說明，但本發明並不限定於以上之例，在不脫離本發明之主旨之範圍內當然亦可進行各種改良或變形。In the above, the continuous polishing apparatus for the glass sheet of the present invention and the continuous polishing method of the glass sheet have been described in detail. However, the present invention is not limited to the above examples, and various kinds of the invention may of course be carried out without departing from the gist of the invention. Improved or deformed.
已詳細地且參照特定之實施態樣對本發明進行了說明，但業者應當明白於不脫離本發明之範圍及精神之範圍內可施加各種修正或變更。The present invention has been described in detail with reference to the specific embodiments thereof, and it is understood that various modifications and changes can be made without departing from the scope and spirit of the invention.
本申請案係基於2010年12月27日申請之日本專利申請2010-290398者，且將其內容作為參照併入本文中。The present application is based on Japanese Patent Application No. 2010-290398, filed on Dec.
1．．．基架1. . . Base frame
1a．．．架壁面1a. . . Wall surface
2．．．軌道2. . . track
3．．．玻璃板3. . . glass plate
4．．．研磨台車4. . . Grinding trolley
5．．．輥式輸送機5. . . Roller conveyor
6．．．水平樑6. . . Horizontal beam
7．．．縱軸7. . . Vertical axis
8．．．圓盤8. . . disc
9．．．偏心軸9. . . Eccentric shaft
10．．．支持板10. . . Support board
11．．．液壓缸11. . . Hydraulic cylinder
12．．．壓盤12. . . Platen
13．．．導引棒13. . . Guide rod
14．．．導引塊14. . . Guide block
15．．．萬向接頭15. . . Universal joint
16．．．研磨工具16. . . Grinding tool
18．．．伺服馬達18. . . Servo motor
19．．．輸出軸19. . . Output shaft
20．．．滑輪20. . . pulley
21．．．滑輪twenty one. . . pulley
22．．．滑輪twenty two. . . pulley
23．．．滑輪twenty three. . . pulley
24．．．皮帶twenty four. . . Belt
25．．．皮帶25. . . Belt
30．．．偏心旋轉機構30. . . Eccentric rotating mechanism
31．．．輸出軸31. . . Output shaft
116．．．研磨工具116. . . Grinding tool
130．．．偏心旋轉機構130. . . Eccentric rotating mechanism
圖1係表示本發明之玻璃板之連續研磨裝置之一實施形態之概略構成之包含一部分剖面之立體圖。Fig. 1 is a perspective view showing a schematic cross-sectional view showing a schematic configuration of an embodiment of a continuous polishing apparatus for a glass sheet according to the present invention.
圖2係表示包含輸出軸為單軸之研磨工具之研磨線之例的概略立體圖。Fig. 2 is a schematic perspective view showing an example of a polishing line including a polishing tool whose output shaft is a single axis.
圖3係表示將相鄰之兩個研磨單元之旋轉相位偏移180度而進行相位控制之情形的研磨工具之運動詳情之例的平面圖。Fig. 3 is a plan view showing an example of details of the movement of the polishing tool in the case where the phase of the two adjacent polishing units is shifted by 180 degrees to perform phase control.
圖4係表示將連續配置之4個研磨單元設為1組，使各研磨單元之旋轉相位偏移90度而進行相位控制之情形的研磨工具之運動詳情之例的平面圖。4 is a plan view showing an example of details of the movement of the polishing tool in the case where the four polishing units arranged in series are one set and the rotation phase of each polishing unit is shifted by 90 degrees to perform phase control.
圖5係表示將連續配置之8個研磨單元設為1組，使各研磨單元之旋轉相位偏移45度而進行相位控制之情形的研磨工具之運動詳情之例的平面圖。5 is a plan view showing an example of details of the movement of the polishing tool in the case where the eight polishing units arranged in series are one set and the rotation phase of each polishing unit is shifted by 45 degrees to perform phase control.
圖6係表示將n個研磨工具以每兩個設為1組，於各組將旋轉相位偏移180度，並且調整各組之相位的研磨工具之運動詳情之例的平面圖。Fig. 6 is a plan view showing an example of the movement details of the polishing tool in which each of the n polishing tools is set to one set, the rotation phase is shifted by 180 degrees in each group, and the phases of the respective groups are adjusted.
圖7係表示如圖6般對研磨工具進行相位控制時偶數個研磨工具停止之情形時之控制例的平面圖。Fig. 7 is a plan view showing an example of control when an even number of polishing tools are stopped when the polishing tool is phase-controlled as shown in Fig. 6.
圖8係表示如圖6般對研磨工具進行相位控制時奇數個研磨工具停止之情形時之控制例的平面圖。Fig. 8 is a plan view showing an example of control when an odd number of polishing tools are stopped when phase control of the polishing tool is performed as shown in Fig. 6.
圖9係表示於使圓形形狀之研磨工具偏心旋轉之同時進行自轉而進行研磨之研磨線之概略的立體圖。Fig. 9 is a perspective view showing an outline of a polishing line that performs polishing by rotating a polishing tool having a circular shape while rotating eccentrically.
16．．．研磨工具16. . . Grinding tool
40．．．箭頭40. . . arrow
41．．．箭頭41. . . arrow
P1．．．位置P1. . . position
P2．．．位置P2. . . position
P3．．．位置P3. . . position
P4．．．位置P4. . . position
Claims (8)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010290398A JP5664904B2 (en) | 2010-12-27 | 2010-12-27 | Glass plate continuous polishing apparatus and continuous polishing method |
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| TW201226107A TW201226107A (en) | 2012-07-01 |
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| CN105619243B (en) * | 2016-01-05 | 2017-08-29 | 京东方科技集团股份有限公司 | Grind cutter head and lapping device |
| JP7051502B2 (en) * | 2018-03-13 | 2022-04-11 | 株式会社ディスコ | Vibration suppression method that suppresses vibration of cutting equipment |
| CN111558865A (en) * | 2020-05-23 | 2020-08-21 | 安徽财经大学 | Surface grinding device and method for large-size TFT-LCD glass substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06246623A (en) * | 1993-02-26 | 1994-09-06 | Asahi Glass Co Ltd | Method and device for continuous polishing of plate-shaped body |
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| JPH0622791B2 (en) * | 1988-09-20 | 1994-03-30 | 旭硝子株式会社 | Continuous polishing equipment for glass plates |
| DE68911504T2 (en) * | 1989-01-30 | 1994-03-31 | Bando Kiko Co | Surface processing machine for glass plates. |
| US6152809A (en) * | 1998-09-03 | 2000-11-28 | Yenawine; Peter W. | Method and apparatus for cold-end processing full-lead crystal |
| JP2001293656A (en) * | 2000-04-17 | 2001-10-23 | Asahi Glass Co Ltd | Continuous-type polishing device of plate-like body, and its method |
| JP2004195601A (en) * | 2002-12-19 | 2004-07-15 | Toppan Printing Co Ltd | Polishing method of color filter for liquid crystal display |
| JP4756709B2 (en) * | 2007-10-16 | 2011-08-24 | Ｓｄフューチャーテクノロジー株式会社 | Polishing equipment |
| KR101800012B1 (en) * | 2009-09-17 | 2017-11-21 | 아사히 가라스 가부시키가이샤 | Apparatus and method for locally polishing glass substrate, and apparatus and method for producing glass product |
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| JPH06246623A (en) * | 1993-02-26 | 1994-09-06 | Asahi Glass Co Ltd | Method and device for continuous polishing of plate-shaped body |
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| TW201226107A (en) | 2012-07-01 |
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| CN102528644A (en) | 2012-07-04 |
| JP2012135841A (en) | 2012-07-19 |
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| CN102528644B (en) | 2016-07-06 |
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