TWI497640B - - Google Patents

Info

Publication number
TWI497640B
TWI497640B TW101144196A TW101144196A TWI497640B TW I497640 B TWI497640 B TW I497640B TW 101144196 A TW101144196 A TW 101144196A TW 101144196 A TW101144196 A TW 101144196A TW I497640 B TWI497640 B TW I497640B
Authority
TW
Taiwan
Application number
TW101144196A
Other languages
Chinese (zh)
Other versions
TW201338090A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201338090A publication Critical patent/TW201338090A/en
Application granted granted Critical
Publication of TWI497640B publication Critical patent/TWI497640B/zh

Links

TW101144196A 2012-03-12 2012-11-26 Electrostatic sucking disc TW201338090A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210063136.8A CN102610476B (en) 2012-03-12 2012-03-12 Electrostatic chuck

Publications (2)

Publication Number Publication Date
TW201338090A TW201338090A (en) 2013-09-16
TWI497640B true TWI497640B (en) 2015-08-21

Family

ID=46527771

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101144196A TW201338090A (en) 2012-03-12 2012-11-26 Electrostatic sucking disc

Country Status (2)

Country Link
CN (1) CN102610476B (en)
TW (1) TW201338090A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105789107A (en) * 2014-12-26 2016-07-20 北京北方微电子基地设备工艺研究中心有限责任公司 Base and plasma processing equipment
CN106816354B (en) * 2015-12-02 2019-08-23 北京北方华创微电子装备有限公司 A kind of lower electrode and reaction chamber
CN111052344B (en) * 2018-08-13 2024-04-02 朗姆研究公司 Edge ring assembly

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW334609B (en) * 1996-09-19 1998-06-21 Hitachi Ltd Electrostatic chuck, method and device for processing sanyle use the same
TW200515841A (en) * 2003-10-31 2005-05-01 Tokyo Electron Ltd Electrostatic chuck, plasma processing apparatus, and plasma processing method
TW200721915A (en) * 2005-11-30 2007-06-01 Ips Ltd Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatus having the same, and method for manufacturing the same
TW201021153A (en) * 2008-09-09 2010-06-01 Komico Ltd Electrostatic chuck containing double buffer layer for reducing thermal stress
TW201021154A (en) * 2008-09-09 2010-06-01 Komico Ltd Electrostatic chuck containing buffer layer for reducing thermal stress
TW201120988A (en) * 2009-08-21 2011-06-16 Komico Ltd Electrostatic chuck and method of manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100495654C (en) * 2003-02-03 2009-06-03 日本奥特克株式会社 Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method
US8607731B2 (en) * 2008-06-23 2013-12-17 Applied Materials, Inc. Cathode with inner and outer electrodes at different heights
CN102280342B (en) * 2011-08-19 2013-08-21 中微半导体设备(上海)有限公司 Plasma treatment device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW334609B (en) * 1996-09-19 1998-06-21 Hitachi Ltd Electrostatic chuck, method and device for processing sanyle use the same
TW200515841A (en) * 2003-10-31 2005-05-01 Tokyo Electron Ltd Electrostatic chuck, plasma processing apparatus, and plasma processing method
TW200721915A (en) * 2005-11-30 2007-06-01 Ips Ltd Electrostatic chuck for vacuum processing apparatus, vacuum processing apparatus having the same, and method for manufacturing the same
TW201021153A (en) * 2008-09-09 2010-06-01 Komico Ltd Electrostatic chuck containing double buffer layer for reducing thermal stress
TW201021154A (en) * 2008-09-09 2010-06-01 Komico Ltd Electrostatic chuck containing buffer layer for reducing thermal stress
TW201120988A (en) * 2009-08-21 2011-06-16 Komico Ltd Electrostatic chuck and method of manufacturing the same

Also Published As

Publication number Publication date
TW201338090A (en) 2013-09-16
CN102610476A (en) 2012-07-25
CN102610476B (en) 2015-05-27

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