TWI482245B - Heat sink and method of fabricating the same - Google Patents
Heat sink and method of fabricating the same Download PDFInfo
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- TWI482245B TWI482245B TW100122183A TW100122183A TWI482245B TW I482245 B TWI482245 B TW I482245B TW 100122183 A TW100122183 A TW 100122183A TW 100122183 A TW100122183 A TW 100122183A TW I482245 B TWI482245 B TW I482245B
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本發明係關於一種散熱元件及其製備方法，尤指一種適用於用於半導體晶片散熱之散熱元件及其製備方法。The invention relates to a heat dissipating component and a preparation method thereof, in particular to a heat dissipating component suitable for heat dissipation of a semiconductor wafer and a preparation method thereof.
隨著科技日新月異之進步與發展，資訊半導體業晶片不斷朝向高速/高頻化邁進，近年來例如中央處理器(CPU)等電子裝置之處理速度更是一日千里，然而高速處理下伴隨而來的是高溫產生。而如何有效的將電子裝置熱源所產生之高溫排出，使電子裝置能於適當的工作溫度下運轉，實為各家業者爭相開發的重點。With the rapid development of science and technology, the information semiconductor industry is constantly moving toward high-speed/high-frequency. In recent years, the processing speed of electronic devices such as central processing units (CPUs) is even more rapid, but the high-speed processing is accompanied by High temperature is produced. How to effectively discharge the high temperature generated by the heat source of the electronic device and enable the electronic device to operate at an appropriate working temperature is a key point for various manufacturers to compete for development.
例如，一般個人用電腦中，其散熱器裝設於中央處理器上，用以協助將中央處理器晶片所產生之熱量排出。散熱器大部分係設於中央處理器上並與中央處理器貼合，且散熱器具有適當的散熱葉片形狀。散熱器上設有一風扇，用來產生對流空氣，以將吸收中央處理器熱量之散熱器的熱量對流帶離出散熱器(例如抽風或送風，視電腦內部空間及設計要求)，以降低溫度。For example, in a typical personal computer, a heat sink is mounted on the central processing unit to assist in discharging heat generated by the central processing unit chip. Most of the heat sink is attached to the central processor and is attached to the central processor, and the heat sink has a suitable heat sink blade shape. A heat sink is provided on the heat sink for generating convective air to remove the heat convection current of the heat sink absorbing the heat of the central processor from the heat sink (for example, air or air supply, depending on the internal space of the computer and design requirements) to reduce the temperature.
而設置多組風扇與散熱器之散熱方式，除了會使得整體重量增加外，還會造成流場阻抗的增加，使得散熱風扇所提供的風通過散熱器的流量會降低，反而降低散熱器的散熱效率，因此，必須同時提高散熱風扇轉速來克服流量降低的問題，但提高風扇轉速則會造成噪音的增加。The heat dissipation method of setting multiple sets of fans and heat sinks not only increases the overall weight, but also increases the flow field impedance, so that the flow of the wind provided by the cooling fan through the heat sink is reduced, and the heat dissipation of the heat sink is reduced. Efficiency, therefore, the cooling fan speed must be increased at the same time to overcome the problem of flow reduction, but increasing the fan speed will cause an increase in noise.
此外，習知技術所使用的散熱片雖已用導熱、散熱效果佳的銅、鋁合金製成，但使用鋁質散熱片作為散熱層，並搭配導熱膏或導熱片作為導熱層之習知技術中，當產品的應用條件須符合絕緣特性時，鋁質散熱片可採用常見之陽極處理使其具有絕緣效果，但經實驗證實此方式之絕緣效果並不佳，且若於組裝過程中不小心破壞經陽極處理之表面，則絕緣特性會輕易地遭破壞。In addition, although the heat sink used in the prior art has been made of copper or aluminum alloy with good heat conduction and heat dissipation effect, the use of an aluminum heat sink as a heat dissipation layer and a thermal conductive paste or a heat conductive sheet as a heat conductive layer is known. In the case where the application conditions of the product are to comply with the insulating properties, the aluminum heat sink can be insulated by the common anodizing treatment, but it has been experimentally confirmed that the insulating effect of this method is not good, and if it is not careful during the assembly process When the anodized surface is destroyed, the insulating properties are easily destroyed.
此外，習知技術中，有使用陶瓷材料製作散熱器之技術，但其大部分僅以陶瓷顆粒形式作為塗布層(例如台灣專利第M384406號中揭露有一種奈米陶瓷散熱板)。或是，以沖壓方式製作散熱器，但所製作出之散熱器絕緣效果不佳(市售產品之表面電阻僅約1.2x103 Ω左右)，且除了孔隙性差，沖壓之製備方式對於成品形狀限制很多(例如，僅可製作出片狀散熱器)，且成形尺寸受限於長/寬60mm以內、厚度5mm以內，因此尺寸及形狀無法變化，可應用範圍較狹窄。且受限於傳統陶瓷散熱片之燒結技術，若欲製得尺寸超過25mm之陶瓷散熱片，其厚度必須為2.5mm以上。且此時會同時產生易變形的問題。故目前市面上販售之陶瓷散熱片皆未有長/寬大於50mm，但厚度為2mm以內的產品。Further, in the prior art, there is a technique of manufacturing a heat sink using a ceramic material, but most of them are only used as a coating layer in the form of ceramic particles (for example, a nano ceramic heat sink plate disclosed in Taiwan Patent No. M384406). Or, the heat sink is made by stamping, but the heat sink produced by the heat sink is not good (the surface resistance of the commercially available product is only about 1.2×10 3 Ω), and in addition to the poor porosity, the preparation method of the stamp is limited to the shape of the finished product. Many (for example, only a sheet-like heat sink can be produced), and the forming size is limited to a length/width of 60 mm or less and a thickness of 5 mm or less, so that the size and shape cannot be changed, and the application range is narrow. Moreover, it is limited by the sintering technology of the traditional ceramic heat sink. If a ceramic heat sink having a size of more than 25 mm is to be produced, the thickness must be 2.5 mm or more. At this time, there is a problem of easy deformation at the same time. Therefore, the ceramic heat sinks currently on the market do not have products with a length/width greater than 50 mm but a thickness of less than 2 mm.
因此，本領域亟需一種新的散熱片材料，使可具有高表面電阻之同時，更具有高孔隙性，且可不受形狀限制，達到絕佳的散熱及導熱效果。Therefore, there is a need in the art for a new heat sink material that can have a high surface resistance, a high porosity, and is not limited by shape, thereby achieving excellent heat dissipation and heat conduction.
本發明提供了一種散熱元件，該散熱元件之組成係包括：85-98重量份之陶瓷材料，係包括有100-300目之陶瓷顆粒以及300-600目之陶瓷顆粒；以及5-10重量份之助燒結劑；其中，該散熱元件係具有複數個孔洞，該些孔洞之平均直徑係為20μm-100μm，該孔洞之孔隙率係16%-30%，且該散熱元件之表面電阻係為1x106 Ω至1x108 Ω。The invention provides a heat dissipating component comprising: 85-98 parts by weight of ceramic material, comprising 100-300 mesh ceramic particles and 300-600 mesh ceramic particles; and 5-10 parts by weight The sintering agent has a plurality of holes, the holes have an average diameter of 20 μm-100 μm, the porosity of the holes is 16%-30%, and the surface resistance of the heat dissipating component is 1×10. 6 Ω to 1x10 8 Ω.
本發明採用二種以上不同目數之陶瓷顆粒混合造粉，而形成絕緣效果極佳之散熱元件，且本發明所製得之散熱元件由於係經由射出成型形成，因此可作成各種立體形狀，不限於二維片狀之傳統陶瓷散熱片。例如，本發明之散熱元件可為片狀，且其至少一表面係具有如直條形狀、環形形狀、同心圓形狀、格子形狀等之圖案化溝槽，使加強散熱/排熱效果。或是，本發明之散熱元件可更包括至少一貫穿該散熱元件之固定孔。利用此固定孔，可將散熱元件固定於IC晶片上，例如，透過一組彈簧扣具，使彈簧扣具穿過固定孔而將散熱元件固定於IC晶片上。The invention adopts two or more kinds of ceramic particles mixed with different meshes to form a heat dissipating component with excellent insulating effect, and the heat dissipating component produced by the invention is formed by injection molding, so that various three-dimensional shapes can be formed, Limited to two-dimensional sheet of traditional ceramic heat sink. For example, the heat dissipating member of the present invention may be in the form of a sheet, and at least one surface thereof has a patterned groove such as a straight strip shape, a ring shape, a concentric shape, a lattice shape or the like to enhance the heat dissipation/heat removal effect. Alternatively, the heat dissipating component of the present invention may further include at least one fixing hole extending through the heat dissipating component. The fixing hole can be used to fix the heat dissipating component on the IC chip, for example, through a set of spring fasteners, and the spring clip is passed through the fixing hole to fix the heat dissipating component on the IC chip.
由於陶瓷散熱元件經由燒結成體後其硬度相當高，後加工不易，且加工器具容易毀損，因此具有特殊形狀之陶瓷散熱元件不易製作。相對地，本發明之技術可使陶瓷散熱元件具有任意三維形狀，係大幅突破了習知舊有的陶瓷散熱片技術。Since the ceramic heat dissipating element has a relatively high hardness after being sintered, the post-processing is difficult, and the processing tool is easily damaged. Therefore, the ceramic heat dissipating member having a special shape is difficult to manufacture. In contrast, the technique of the present invention allows the ceramic heat dissipating component to have any three-dimensional shape, which greatly breaks through the conventional ceramic heat sink technology.
此外，由於本發明之散熱元件之材料組合以及製作方式與習知陶瓷散熱片之材料及製作方式不同，因此造成本發明之散熱元件具有優於習知陶瓷散熱片之絕緣特性。且此特性已經由第三驗證機構之檢驗數據而獲得證實。In addition, since the material combination and the manufacturing method of the heat dissipating component of the present invention are different from those of the conventional ceramic heat sink, the heat dissipating component of the present invention has an insulating property superior to that of the conventional ceramic heat sink. And this characteristic has been confirmed by the inspection data of the third verification institution.
本發明之散熱元件之長度較佳可為25mm以上、寬度較佳可為25mm以上、及厚度較佳可為2mm以下。因本發明之獨特技術，所製作之散熱元件可到達1mm厚且長/寬25mm以上之薄型化產品，因此解決了傳統陶瓷無法提升尺寸之問題。The heat dissipating member of the present invention preferably has a length of 25 mm or more, a width of preferably 25 mm or more, and a thickness of preferably 2 mm or less. Due to the unique technology of the present invention, the heat dissipating component produced can reach a thin product having a thickness of 1 mm and a length/width of 25 mm or more, thereby solving the problem that the conventional ceramic cannot be increased in size.
本發明之散熱元件中，該些孔洞之間較佳可互相連接而形成毛細結構，可使熱氣藉由此相通的孔洞對流至外部。詳細地說，本發明之散熱元件之毛細結構之特性所形成之煙囪效應可使熱氣體有效上升，同時讓冷氣體從對流層之側邊毛孔進入，形成一個熱對流的循環，以協助發熱層不再升溫或給予降溫的幫助。In the heat dissipating component of the present invention, the holes are preferably connected to each other to form a capillary structure, and the hot gas can be convected to the outside through the holes through which the heat is communicated. In detail, the chimney effect formed by the characteristics of the capillary structure of the heat dissipating member of the present invention can effectively raise the hot gas while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heat generating layer. Warm up or give help to cool down.
本發明之散熱元件中，該陶瓷顆粒之材質較佳可選自由：碳化矽、氧化鋁、氮化鋁、氮化矽(SiN)、氮化硼、石墨、及其混合所組成之群組。In the heat dissipating component of the present invention, the material of the ceramic particles is preferably selected from the group consisting of niobium carbide, aluminum oxide, aluminum nitride, tantalum nitride (SiN), boron nitride, graphite, and a mixture thereof.
本發明之散熱元件中，該助燒結劑較佳可選自由：鋁矽酸鹽；氧化鋁與二氧化矽之複合材料；石英、長石、硼砂、黏土之混合物(即，釉水之組成)；稀土元素之氧化物；氧化硼(B2 O3 )；氧化磷(P2 O5 )；以及堇青石陶瓷粉末所組成之群組。其中，堇青石陶瓷粉末係以堇青石(2MgO‧2Al2 O3 ‧5SiO2 )為主晶相的陶瓷粉末。In the heat dissipating component of the present invention, the sintering aid is preferably selected from the group consisting of: aluminosilicate; a composite of alumina and ceria; a mixture of quartz, feldspar, borax, clay (ie, composition of glaze water); An oxide of an element; a group consisting of boron oxide (B 2 O 3 ); phosphorus oxide (P 2 O 5 ); and cordierite ceramic powder. Among them, the cordierite ceramic powder is a ceramic powder in which cordierite (2MgO‧2Al 2 O 3 ‧5SiO 2 ) is a main phase.
本發明之散熱元件中，該孔隙率較佳可依照以下[公式1]計算得到，In the heat dissipating member of the present invention, the porosity is preferably calculated according to the following [Formula 1].
[公式1][Formula 1]
孔隙率=(散熱元件吸飽水之重量-散熱元件未吸水之重量)/散熱元件未吸水之重量。Porosity = (weight of the heat sink element to absorb water - weight of the heat sink element not absorbed) / weight of the heat sink element not absorbed.
本發明之散熱元件中，該100-300目之陶瓷顆粒與該300-600目之陶瓷顆粒之重量比較佳可為：In the heat dissipating component of the present invention, the weight of the 100-300 mesh ceramic particles and the 300-600 mesh ceramic particles is preferably:
100-300目之陶瓷顆粒：300-600目之陶瓷顆粒=(40-50):(55-70)。100-300 mesh ceramic particles: 300-600 mesh ceramic particles = (40-50): (55-70).
本發明之散熱元件中，該散熱元件較佳可用於半導體晶片之散熱。In the heat dissipating component of the present invention, the heat dissipating component is preferably used for heat dissipation of a semiconductor wafer.
本發明中，目數(如，100目、300目、600目)係為本領域常用之單位。In the present invention, the number of meshes (e.g., 100 mesh, 300 mesh, 600 mesh) is a unit commonly used in the art.
本發明另提供一種散熱元件之製備方法，包括步驟：(A)將85-98重量份之陶瓷材料、5-10重量份之助燒結劑、以及10-15重量份之溶劑(例如，水)混合形成一起始漿料，其中，該陶瓷材料係包括有100-300目之陶瓷顆粒以及300-600目之陶瓷顆粒；(B)將5-15重量份之黏結塑型劑加入至該步驟(A)所得之起始漿料中，並混合形成一凝膠物；(C)將該步驟(B)所得之凝膠物成形以形成一毛胚；(D)將該步驟(C)所得之毛胚烘烤以形成一硬化毛胚；以及(E)將該步驟(D)所得之該硬化毛胚燒結，以得到一散熱元件，該燒結之溫度係為1100℃-1500℃，該燒結之時間係為3-6小時(亦即，須於1100℃-1500℃之溫度下維持3-6小時。燒結時間依毛胚大小而調整，當厚度或尺寸(dimension)較大時，所需時間較久)；其中，該步驟(B)之該黏結塑型劑係選自由：聚乙烯醇(PVA)、聚乙二醇(PEG)、聚醋酸乙烯(PVAc)、玻璃纖維、糊精(dextrin)、水溶性壓克力樹脂(PMMA)及其混合(即，上述高分子材料之混合)所組成之群組；該散熱元件係具有複數個孔洞，該些孔洞之平均直徑係為20μm-100μm，該孔洞之孔隙率係16%-30%，且該散熱元件之表面電阻係為1x106 Ω至1x108 Ω。The invention further provides a method for preparing a heat dissipating component, comprising the steps of: (A) 85-98 parts by weight of a ceramic material, 5-10 parts by weight of a sintering aid, and 10-15 parts by weight of a solvent (for example, water) Mixing to form a starting slurry, wherein the ceramic material comprises 100-300 mesh ceramic particles and 300-600 mesh ceramic particles; (B) 5-15 parts by weight of a bonding plasticizer is added to the step ( A) the obtained starting slurry is mixed and formed into a gel; (C) the gel obtained in the step (B) is shaped to form a blank; (D) the step (C) is obtained. Embossing the blank to form a hardened blank; and (E) sintering the hardened blank obtained in the step (D) to obtain a heat dissipating component, the sintering temperature being 1100 ° C - 1500 ° C, the sintering The time is 3-6 hours (that is, it must be maintained at a temperature of 1100 ° C - 1500 ° C for 3-6 hours. The sintering time is adjusted according to the size of the blank, when the thickness or dimension is large, the time required Longer; wherein the adhesive molding agent of the step (B) is selected from the group consisting of: polyvinyl alcohol (PVA), polyethylene glycol (PEG), polyvinyl acetate (PVAc), glass a group of dimensions, dextrin, water-soluble acrylic resin (PMMA) and a mixture thereof (ie, a mixture of the above-mentioned polymer materials); the heat dissipating component has a plurality of holes, and the average of the holes The diameter is from 20 μm to 100 μm, the porosity of the hole is 16% to 30%, and the surface resistance of the heat dissipating member is from 1 x 10 6 Ω to 1 x 10 8 Ω.
本發明利用陶瓷粉體與助燒結劑、水、黏結塑型劑等混合後，再以射出成型的方式製作成毛胚，經由高溫爐中進行燒結成體，使其具有不規則類孔狀之毛細結構。使用時，與導熱層之相關材料組合成品後，可固定於發熱層之任何表面上，並利用Tc溫度(發熱體表面溫度)與Ta溫度(環境溫度)之溫度差，藉由本毛細結構之特性所形成之煙囪效應使熱氣體有效上升，同時讓冷氣體從對流層之側邊毛孔進入，形成一個熱對流的循環，以協助發熱層不再升溫或給予降溫的幫助。In the present invention, the ceramic powder is mixed with a sintering aid, water, a binder, and the like, and then formed into a blank by injection molding, and sintered into a body through a high-temperature furnace to have an irregular pore-like capillary. structure. When used, after combining the materials related to the heat conductive layer, it can be fixed on any surface of the heat generating layer, and the temperature difference between the Tc temperature (heating body surface temperature) and the Ta temperature (ambient temperature) is utilized, and the characteristics of the capillary structure are utilized. The chimney effect creates an effective rise of the hot gas while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heating layer from heating up or providing cooling.
本發明之散熱元件之製備方法中，該步驟(C)中之成形較佳可利用一射出成型機將該凝膠物注入至一成形模具中而成形。本發明之散熱元件之製備方法由於利用了射出成型技術，因此可作成各種立體形狀，不限於二維片狀之傳統陶瓷散熱片。In the method for producing a heat dissipating member of the present invention, the forming in the step (C) is preferably carried out by injecting the gel into a forming mold by an injection molding machine. Since the method for producing a heat dissipating member of the present invention utilizes an injection molding technique, it can be formed into various three-dimensional shapes, and is not limited to a two-dimensional sheet-like conventional ceramic fin.
由於陶瓷散熱元件經由燒結成體後其硬度相當高，後加工不易，且加工器具容易毀損，因此具有特殊形狀之陶瓷散熱元件不易製作。相對地，本發明之技術可使陶瓷散熱元件具有任意三維形狀，係大幅突破了習知舊有的陶瓷散熱片技術。且因本發明之獨特技術，所製作之散熱元件可到達1mm厚且長/寬25mm以上之薄型化產品，因此解決了傳統陶瓷無法提升尺寸之問題。Since the ceramic heat dissipating element has a relatively high hardness after being sintered, the post-processing is difficult, and the processing tool is easily damaged. Therefore, the ceramic heat dissipating member having a special shape is difficult to manufacture. In contrast, the technique of the present invention allows the ceramic heat dissipating component to have any three-dimensional shape, which greatly breaks through the conventional ceramic heat sink technology. Moreover, due to the unique technology of the present invention, the heat dissipating component produced can reach a thin product having a thickness of 1 mm and a length/width of 25 mm or more, thereby solving the problem that the conventional ceramic cannot be increased in size.
此外，由於本發明之散熱元件之材料組合以及製作方式與習知陶瓷散熱片之材料及製作方式不同，因此造成本發明之散熱元件具有優於習知陶瓷散熱片之絕緣特性。且此特性已經由第三驗證機構之檢驗數據而獲得證實。In addition, since the material combination and the manufacturing method of the heat dissipating component of the present invention are different from those of the conventional ceramic heat sink, the heat dissipating component of the present invention has an insulating property superior to that of the conventional ceramic heat sink. And this characteristic has been confirmed by the inspection data of the third verification institution.
本發明之散熱元件之製備方法中，該些孔洞之間較佳可互相連接而形成毛細結構，可使熱氣藉由此相通的孔洞對流至外部。詳細地說，本發明之散熱元件之毛細結構之特性所形成之煙囪效應可使熱氣體有效上升，同時讓冷氣體從對流層之側邊毛孔進入，形成一個熱對流的循環，以協助發熱層不再升溫或給予降溫的幫助。In the method for fabricating the heat dissipating component of the present invention, the holes are preferably connected to each other to form a capillary structure, and the hot gas can be convected to the outside by the holes communicating therewith. In detail, the chimney effect formed by the characteristics of the capillary structure of the heat dissipating member of the present invention can effectively raise the hot gas while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heat generating layer. Warm up or give help to cool down.
本發明之散熱元件之製備方法中，該步驟(E)之燒結步驟前，較佳可更包括一步驟(E0)：於5-8小時之間，將該硬化毛胚由一常溫加熱至1100℃-1500℃；以及，該步驟(E)之燒結步驟後，更包括一步驟(E1)：於6-10小時之間，將該燒結後之硬化毛胚冷卻至該常溫。本發明使用了特殊升溫以及降溫曲線，始可製作出具有高表面電阻之散熱元件。In the method for preparing the heat dissipating component of the present invention, before the sintering step of the step (E), it is preferred to further comprise a step (E0): heating the hardened blank from a normal temperature to 1100 between 5 and 8 hours. °C-1500 ° C; and, after the sintering step of the step (E), further comprises a step (E1): between 6 and 10 hours, the sintered hardened blank is cooled to the normal temperature. The present invention uses a special heating and cooling curve to produce a heat dissipating component having a high surface resistance.
本發明之散熱元件之製備方法，其中，該常溫較佳可為0℃-40℃，例如室溫25℃。The method for preparing a heat dissipating component of the present invention, wherein the normal temperature is preferably from 0 ° C to 40 ° C, for example, room temperature of 25 ° C.
本發明之散熱元件之製備方法，其中，該步驟(D)之烘烤溫度較佳可為200-300℃，且烘烤時間較佳可為2.5-3.5小時。其用意係把毛胚裡的水份氣化，形成硬化毛胚。The method for preparing the heat dissipating component of the present invention, wherein the baking temperature of the step (D) is preferably 200-300 ° C, and the baking time is preferably 2.5-3.5 hours. The intention is to vaporize the water in the embryo to form a hardened embryo.
本發明之散熱元件之製備方法，其中，該步驟(A)之溶劑較佳可為水。The method for preparing the heat dissipating component of the present invention, wherein the solvent of the step (A) is preferably water.
本發明之散熱元件之製備方法，其中，該步驟(A)之前更包括一造粉之步驟，其較佳可為將重量比為100-300目之陶瓷顆粒：300-600目之陶瓷顆粒=(40-50):(55-70)之陶瓷顆粒混合以形成該陶瓷材料。The method for preparing a heat dissipating component of the present invention, wherein the step (A) further comprises a step of powdering, which is preferably a ceramic particle having a weight ratio of 100-300 mesh: 300-600 mesh ceramic particles = (40-50): (55-70) ceramic particles are mixed to form the ceramic material.
本發明之散熱元件之製備方法，其中，該步驟(A)之該陶瓷顆粒之材質較佳可選自由：碳化矽、氧化鋁、氮化鋁、氮化矽SiN、氮化硼、石墨、及其混合所組成之群組。The method for preparing the heat dissipating component of the present invention, wherein the material of the ceramic particles in the step (A) is preferably selected from the group consisting of niobium carbide, aluminum oxide, aluminum nitride, tantalum nitride SiN, boron nitride, graphite, and The group of its mix.
本發明之散熱元件之製備方法，其中，該步驟(A)之該助燒結劑較佳可選自由：鋁矽酸鹽；氧化鋁與二氧化矽之複合材料；石英、長石、硼砂、黏土之混合物(即，釉水之組成)；稀土元素之氧化物；氧化硼(B2 O3 )；氧化磷(P2 O5 )；以及堇青石陶瓷粉末所組成之群組。The method for preparing the heat dissipating component of the present invention, wherein the sintering aid of the step (A) is preferably selected from the group consisting of: aluminosilicate; composite material of alumina and ceria; quartz, feldspar, borax, clay a mixture (ie, a composition of glaze water); an oxide of a rare earth element; a group of boron oxide (B 2 O 3 ); phosphorus oxide (P 2 O 5 ); and a cordierite ceramic powder.
本發明之散熱元件之製備方法，其中，該孔隙率較佳可依照以下[公式1]計算得到，The method for preparing a heat dissipating component of the present invention, wherein the porosity is preferably calculated according to the following [Formula 1].
[公式1][Formula 1]
孔隙率=(散熱元件吸飽水之重量-散熱元件未吸水之重量)/散熱元件未吸水之重量。Porosity = (weight of the heat sink element to absorb water - weight of the heat sink element not absorbed) / weight of the heat sink element not absorbed.
本發明之散熱元件之製備方法，其中，該散熱元件較佳可用於半導體晶片(如IC晶片)之散熱。The method for fabricating a heat dissipating component of the present invention, wherein the heat dissipating component is preferably used for heat dissipation of a semiconductor wafer such as an IC wafer.
[實施例1][Example 1]
依照以下步驟製備本實施例之散熱元件。The heat dissipating member of this embodiment was prepared in accordance with the following procedure.
步驟1：造粉Step 1: Pulverizing
將約40~45重量份之100~300目的陶瓷粉體顆粒(例如，43重量份之250目的陶瓷粉體顆粒)與約55~60重量份之300~600目的陶瓷粉體顆粒(例如，55重量份之400目的陶瓷粉體顆粒)混合後投入攪拌機進行粉體乾混。攪拌一定時間使混合均勻。另外，將助燒結劑(5~10重量份之鋁矽酸鹽化合物)與一定比例的水混合，並經由管線倒入上述攪拌機中，使其與陶瓷粉體混合製作成起始粉末。在此，所使用之鋁矽酸鹽化合物例如可為：鋁矽酸鹽；氧化鋁與二氧化矽之複合材料；石英、長石、硼砂、黏土之混合物(即，釉水之組成)；稀土元素之氧化物；氧化硼(B2 O3 )；氧化磷(P2 O5 )；或堇青石陶瓷粉末。About 40 to 45 parts by weight of 100 to 300 mesh ceramic powder particles (for example, 43 parts by weight of 250 mesh ceramic powder particles) and about 55 to 60 parts by weight of 300 to 600 mesh ceramic powder particles (for example, 55) The 400 parts by weight of the ceramic powder particles are mixed and put into a mixer for dry mixing of the powder. Stir for a certain period of time to make the mixing uniform. Further, a sintering aid (5 to 10 parts by weight of the aluminosilicate compound) is mixed with a certain ratio of water, and poured into the above-mentioned mixer through a line to be mixed with the ceramic powder to prepare a starting powder. Here, the aluminosilicate compound used may be, for example, an aluminosilicate; a composite of aluminum oxide and cerium oxide; a mixture of quartz, feldspar, borax, clay (ie, a composition of glaze water); Oxide; boron oxide (B 2 O 3 ); phosphorus oxide (P 2 O 5 ); or cordierite ceramic powder.
步驟2：凝膠化Step 2: Gelation
完成上述步驟1之後，將作為黏結塑型劑之約5-15重量份之高分子塑料(PVA)以加熱器加熱形成液體狀，並經由管線輸入至攪拌機中與上述起始粉末混合，並持續攪拌，而形成凝膠狀之原料。After the above step 1 is completed, about 5-15 parts by weight of the polymer plastic (PVA) as a bonding plasticizer is heated by a heater to form a liquid, and is input into a mixer through a line to be mixed with the above starting powder, and continues. Stir to form a gelatinous material.
步驟3：射出成型Step 3: Injection molding
將步驟2所形成之凝膠狀之原料經由管線送至射出成型機之保溫桶內使其維持液態狀。並由射出成型機之注射壓力把此原料射入成型胚模(此胚模採用鋁合金或鋼材)中，使得到具有如圖1所示之形狀之毛胚。此毛胚之長度係60mm、寬度25mm、且厚度係2mm。此外，成型胚模同時需配備有自動控制系統及冷卻管線，讓原料注入成型胚模後，自動控制系統可加入冷卻水使成型胚模降溫，同時也讓注入成型胚模的原料於模具中由液轉成固態狀，使其定型成為毛胚。The gel-like raw material formed in the step 2 is sent to a holding barrel of an injection molding machine via a line to maintain a liquid state. The raw material is injected into the forming blank mold (this metal mold is made of aluminum alloy or steel) by the injection pressure of the injection molding machine so as to have a blank having the shape shown in Fig. 1. This blank has a length of 60 mm, a width of 25 mm, and a thickness of 2 mm. In addition, the molding die must be equipped with an automatic control system and a cooling pipeline. After the raw material is injected into the forming blank mold, the automatic control system can add cooling water to cool the forming mold, and also feed the raw material into the mold. The liquid turns into a solid shape, which is shaped into a blank.
步驟4：烘乾Step 4: Dry
將步驟3所定型之毛胚送入約250℃之高溫烤箱中，進行約3小時的烘烤，其用意係把毛胚裡的水份氣化，形成硬化毛胚。The blanks set in step 3 are fed into a high temperature oven at about 250 ° C for about 3 hours of baking, which is intended to vaporize the water in the embryos to form a hardened embryo.
步驟5：燒結Step 5: Sintering
把步驟4之硬化毛胚送進專用高溫燒結爐，採用梯形自動控溫方式，使其逐漸加溫到1300℃進行燒結，並於其後降溫。整個燒結及降溫作業過程共須要約18~22小時(依毛胚大小而調整)。燒結之升溫及降溫曲線係如圖2所示，首先於5-8小時之間，將該硬化毛胚由常溫(0℃-40℃，例如約25℃)加熱至1100℃-1500℃(如1300℃)；接著，於此高溫下維持3-6小時(如5小時，燒結時間依照毛胚大小、形狀、體積而調整)；最後，於6-10小時之間，將該燒結後之硬化毛胚冷卻至室溫。在此步驟中，陶瓷粉體藉由此高溫進行結晶，同時高分子塑料會氣化而於陶瓷體之內形成所需要的毛細孔洞，如此則得到本實施例之散熱元件。The hardened blank of step 4 is sent to a special high-temperature sintering furnace, and the trapezoidal automatic temperature control method is adopted, and the temperature is gradually heated to 1300 ° C for sintering, and then the temperature is lowered. The entire sintering and cooling process takes about 18 to 22 hours (adjusted according to the size of the embryo). The temperature rise and temperature drop curves of the sintering are shown in Figure 2. First, between 5-8 hours, the hardened blank is heated from normal temperature (0 ° C - 40 ° C, for example, about 25 ° C) to 1100 ° C - 1500 ° C (such as 1300 ° C); then, at this high temperature for 3-6 hours (such as 5 hours, the sintering time is adjusted according to the size, shape and volume of the blank); finally, between 6-10 hours, the hardening after sintering The embryos were cooled to room temperature. In this step, the ceramic powder is crystallized by the high temperature, and the polymer plastic is vaporized to form the desired capillary pores in the ceramic body, so that the heat dissipating member of the present embodiment is obtained.
步驟6：清洗烘乾Step 6: Clean and dry
選擇性地，可將步驟5已燒結成體之陶瓷散熱元件送至清洗機進行震動清洗，把表面與結構內的塑料殘留物清洗乾淨後，進行品質篩選，經過篩選後之成品送至烘乾機去除水份。Optionally, the ceramic heat dissipating component that has been sintered in step 5 can be sent to a washing machine for vibration cleaning, and the surface and the plastic residue in the structure are cleaned, and then the quality is screened, and the screened product is sent to the drying. The machine removes water.
表面電阻分析Surface resistance analysis
本實施例所製得之散熱元件，經由宜特科技公司(Integrated Service Technology Inc.)檢驗分析結果，測得其表面電阻約為2.74x107 Ω，其係遠大於市售產品之表面電阻值(約1.2x103 Ω)。因此，證實本發明之散熱元件確實提升了散熱元件之絕緣效果。The heat dissipating component obtained in this embodiment was tested and analyzed by Integrated Service Technology Inc., and its surface resistance was measured to be about 2.74 x 10 7 Ω, which is much larger than the surface resistance value of a commercially available product ( About 1.2x10 3 Ω). Therefore, it was confirmed that the heat dissipating member of the present invention does enhance the insulating effect of the heat dissipating member.
孔隙率分析Porosity analysis
另外，將本實施例所製得之散熱元件進行孔隙率測量，並依下述[公式1]計算，In addition, the heat dissipation element obtained in the present embodiment is subjected to porosity measurement, and is calculated according to the following [Formula 1].
[公式1][Formula 1]
孔隙率=(散熱元件吸飽水之重量-散熱元件未吸水之重量)/散熱元件未吸水之重量，Porosity = (the weight of the heat sink to absorb water - the weight of the heat sink is not absorbed) / the weight of the heat sink without water absorption,
其測量結果為，本實施例所製得之散熱元件之孔隙率約為16%-30%。其他測試特性係顯示於下表1中。表1之數據係委託宜特科技公司檢驗分析之結果。As a result of measurement, the heat dissipation member obtained in the present embodiment has a porosity of about 16% to 30%. Other test characteristics are shown in Table 1 below. The data in Table 1 is the result of inspection and analysis by Yi Te Technology.
本發明中，散熱元件之孔隙率可依照燒結時間長短進行調整。例如，燒結時間較長時，所得到之孔隙率較低。相反地，當燒結時間較短時，所得到之孔隙率較高。In the present invention, the porosity of the heat dissipating member can be adjusted in accordance with the length of the sintering time. For example, when the sintering time is long, the porosity obtained is low. Conversely, when the sintering time is short, the resulting porosity is higher.
掃描式電子顯微鏡分析Scanning electron microscopy
如圖3所示，其係本實施例所製得之散熱元件之掃描式電子顯微鏡照片(係委託台灣檢驗科技股份有限公司(SGS Taiwan Limited)測量)。由圖中所示之結果可看出，本實施例之散熱元件孔洞之平均直徑係為約20μm-100μm，且孔洞之間係相通，因此可使熱氣藉由此相通的孔洞對流至外部。As shown in FIG. 3, it is a scanning electron micrograph of the heat dissipating component obtained in the present embodiment (measured by SGS Taiwan Limited). As can be seen from the results shown in the figure, the average diameter of the heat dissipating member holes of the present embodiment is about 20 μm to 100 μm, and the holes are in communication with each other, so that the hot air can be convected to the outside through the holes which are communicated therewith.
本發明之散熱元件之毛細結構之特性所形成之煙囪效應可使熱氣體有效上升，同時讓冷氣體從對流層之側邊毛孔進入，形成一個熱對流的循環，以協助發熱層不再升溫或給予降溫的幫助。The chimney effect formed by the characteristics of the capillary structure of the heat dissipating member of the present invention can effectively raise the hot gas while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heat generating layer from heating up or giving Cooling help.
[實施例2-4][Example 2-4]
以實施例1中所述之相同方法以及材料製備本實施例之散熱元件，然而不同處在於，本實施例中散熱元件之尺寸係如下表2所示，且散熱元件之形狀為不具凸起之薄片狀。The heat dissipating component of the embodiment is prepared by the same method and material as described in the embodiment 1. However, the difference is that the size of the heat dissipating component in the embodiment is as shown in Table 2 below, and the shape of the heat dissipating component is not convex. Flaky.
上述實施例1-4之散熱元件皆已成功作出成品，因此證實本發明之技術確實可做出薄型化產品，而此為習知技術所無法辦到的。The heat dissipating components of the above embodiments 1-4 have all been successfully finished, and it has been confirmed that the technique of the present invention can indeed make a thinned product which cannot be achieved by the prior art.
綜上所述，本發明採用二種以上不同目數之陶瓷顆粒混合造粉，而形成絕緣效果極佳之散熱元件，且本發明所製得之散熱元件由於係經由射出成型形成，因此可作成各種立體形狀，不限於二維片狀之傳統陶瓷散熱片。由於陶瓷散熱元件經由燒結成體後其硬度相當高，後加工不易，且加工器具容易毀損，因此具有特殊形狀之陶瓷散熱元件不易製作。相對地，本發明之技術可使陶瓷散熱元件具有任意三維形狀，係大幅突破了習知舊有的陶瓷散熱片技術。In summary, the present invention uses two or more different sizes of ceramic particles to mix and pulverize, and forms a heat dissipating component having excellent insulation effect, and the heat dissipating component produced by the present invention is formed by injection molding, thereby making it possible Various three-dimensional shapes are not limited to two-dimensional sheet-shaped conventional ceramic heat sinks. Since the ceramic heat dissipating element has a relatively high hardness after being sintered, the post-processing is difficult, and the processing tool is easily damaged. Therefore, the ceramic heat dissipating member having a special shape is difficult to manufacture. In contrast, the technique of the present invention allows the ceramic heat dissipating component to have any three-dimensional shape, which greatly breaks through the conventional ceramic heat sink technology.
本發明之散熱元件使用時，與導熱層之相關材料組合成品後，可固定於發熱層之任何表面上，並利用Tc溫度(發熱體表面溫度)與Ta溫度(環境溫度)之溫度差，藉由本毛細結構之特性所形成之煙囪效應使熱氣體有效上升，同時讓冷氣體從對流層之側邊毛孔進入，形成一個熱對流的循環，以協助發熱層不再升溫或給予降溫的幫助。When the heat dissipating component of the present invention is used, after the finished material of the heat conducting layer is combined, it can be fixed on any surface of the heat generating layer, and the temperature difference between the Tc temperature (heating body surface temperature) and the Ta temperature (ambient temperature) is utilized. The chimney effect formed by the characteristics of the capillary structure causes the hot gas to rise effectively, while allowing cold gas to enter from the side pores of the troposphere to form a cycle of heat convection to assist the heating layer to no longer heat up or to provide cooling.
此外，由於本發明之散熱元件之材料組合以及製作方式與習知陶瓷散熱片之材料及製作方式不同，因此造成本發明之散熱元件具有優於習知陶瓷散熱片之絕緣特性。且此特性已經由第三驗證機構之檢驗數據而獲得證實。In addition, since the material combination and the manufacturing method of the heat dissipating component of the present invention are different from those of the conventional ceramic heat sink, the heat dissipating component of the present invention has an insulating property superior to that of the conventional ceramic heat sink. And this characteristic has been confirmed by the inspection data of the third verification institution.
上述實施例僅係為了方便說明而舉例而已，本發明所主張之權利範圍自應以申請專利範圍所述為準，而非僅限於上述實施例。The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.
圖1係本發明一較佳實施例之毛胚之形狀示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the shape of a blank of a preferred embodiment of the present invention.
圖2係本發明一較佳實施例之燒結之升溫及降溫曲線。2 is a graph showing the temperature rise and fall of sintering of a preferred embodiment of the present invention.
圖3係本發明一較佳實施例之掃描式電子顯微鏡照片。Figure 3 is a scanning electron micrograph of a preferred embodiment of the present invention.
Claims (19)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100122183A TWI482245B (en) | 2011-06-24 | 2011-06-24 | Heat sink and method of fabricating the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100122183A TWI482245B (en) | 2011-06-24 | 2011-06-24 | Heat sink and method of fabricating the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201301455A TW201301455A (en) | 2013-01-01 |
| TWI482245B true TWI482245B (en) | 2015-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100122183A TWI482245B (en) | 2011-06-24 | 2011-06-24 | Heat sink and method of fabricating the same |
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| Country | Link |
|---|---|
| TW (1) | TWI482245B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112655085B (en) * | 2018-09-07 | 2024-05-31 | 积水保力马科技株式会社 | Heat conductive sheet |
| KR102584991B1 (en) * | 2019-06-14 | 2023-10-05 | 삼성전기주식회사 | Semiconductor package |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7164210B2 (en) * | 2004-10-27 | 2007-01-16 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with heat sink and method for fabricating same |
| US7501314B2 (en) * | 2006-05-08 | 2009-03-10 | Inventec Corporation | Heat sink and method for fabricating the same |
-
2011
- 2011-06-24 TW TW100122183A patent/TWI482245B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7164210B2 (en) * | 2004-10-27 | 2007-01-16 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with heat sink and method for fabricating same |
| US7501314B2 (en) * | 2006-05-08 | 2009-03-10 | Inventec Corporation | Heat sink and method for fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201301455A (en) | 2013-01-01 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |