TW202132745A - Manufacturing method of a capillary structure - Google Patents

Abstract

A manufacturing method of a capillary structure includes the steps of providing a cuprous oxide powder, a copper powder and a coating agent, wherein the copper powder has a particle size greater than the particle size of the cuprous oxide powder, and the cuprous oxide powder, the copper powder and the coating agent are uniformly mixed to form a slurry; and printing or coating the slurry onto a carrier and performing a sintering process, so that the cuprous oxide powder and the copper powder form a capillary structure on the carrier and the coating agent is volatilized and exhausted in the sintering process, and the sintering of different copper powder materials can improve the porosity effectively.

Description

毛細結構之製作方法Method of making capillary structure

一種毛細結構之製作方法，尤指利用兩種不同銅粉製作出高孔隙率的毛細結構之技術領域。A method for making capillary structures, especially the technical field of using two different copper powders to make capillary structures with high porosity.

按，現有散熱裝置，例如均溫板、散熱導管等，為能夠傳導熱，故針對毛細結構有各種不同的設計，目前主要有四種常見的毛細結構，分別是溝槽式、網目式(編織)、纖維式及燒結式，其中又以燒結式最為常見。According to the fact that existing heat dissipation devices, such as uniform temperature plates, heat dissipation pipes, etc., are able to conduct heat, so there are various designs for capillary structures. At present, there are mainly four common capillary structures, namely groove type and mesh type (woven ), fiber type and sintered type, among which sintered type is the most common.

續就毛細結構的製作方式，大多使用銅粉，由於銅粉及銀粉的導電性幾乎一樣，但銅粉成本僅為銀粉的1/100。純銅粉有良好的導電和導熱性能，目前已有製備銅粉之奈米/微米化粒子技術，可取代昂貴的銀粉作為多用途之高附加價值導電材料。銅粉燒結而成的多孔隙結構，銅粉的粒徑大小、粒徑分佈、燒結的爐溫和時間，皆會影響燒結層的孔隙率。以燒結銅粉的微熱導管毛細結構為例，是將一中心棒置入銅質管體中心後，於銅質管體內部倒入銅粉後進行高溫燒結處理，燒結完成後予以冷卻，再將銅質管體中拔出，以形成銅質管體壁上的毛細結構。此製作方法要讓銅粉在部分溶解的狀況下燒結成銅質管體，又要避免孔隙率過低和銅質管體變形，實務上燒結的時間與溫度必須精準地控制，對於製作過程過於複雜且具有困難度。再者，利用銅粉製作的毛細結構，微熱導管之工作性能受毛細力與滲透性的因素影響，但現有銅粉的粒徑大約為20—50 nm，毛細孔隙小會使工作液體回流之摩擦力和粘滯力增大，即工作液體回流阻力增大，導致工作液體回流速度慢，易使產品性能不良。As for the production method of capillary structure, copper powder is mostly used. Since the conductivity of copper powder and silver powder is almost the same, the cost of copper powder is only 1/100 of that of silver powder. Pure copper powder has good electrical and thermal conductivity properties. At present, there is a nano/micronized particle technology for preparing copper powder, which can replace expensive silver powder as a multi-purpose high value-added conductive material. The porous structure formed by the sintering of copper powder, the particle size, particle size distribution, sintering furnace temperature and time of the copper powder will all affect the porosity of the sintered layer. Take the capillary structure of the micro heat pipe of sintered copper powder as an example. After a center rod is placed in the center of the copper tube body, the copper powder is poured into the copper tube body and then subjected to high-temperature sintering. After the sintering is completed, it is cooled and then Pull out from the copper tube body to form the capillary structure on the wall of the copper tube body. This production method requires the copper powder to be sintered into a copper tube body in a partially dissolved state, and also to avoid low porosity and deformation of the copper tube body. In practice, the sintering time and temperature must be precisely controlled, which is too complicated for the production process. And with difficulty. Furthermore, with the capillary structure made of copper powder, the working performance of the micro heat pipe is affected by the capillary force and permeability. However, the particle size of the existing copper powder is about 20-50 nm, and the small capillary pores will cause the friction of the working fluid to flow back. The increase of force and viscous force means that the backflow resistance of the working fluid increases, resulting in a slow backflow rate of the working fluid, which easily leads to poor product performance.

是以，要如何解決上述現有技術之問題與缺失，即為相關業者所亟欲研發之課題所在。Therefore, how to solve the above-mentioned problems and deficiencies of the prior art is a subject that the related industry urgently wants to research and develop.

本發明之主要目的乃在於，其藉由不同的銅粉材料製作出具有高孔隙率，可解決現有單一銅粉燒製的毛細結構空隙率低所導致的傳熱效率差之問題。The main purpose of the present invention is to use different copper powder materials to produce high porosity, which can solve the problem of poor heat transfer efficiency caused by the low porosity of the capillary structure fired with a single copper powder.

本發明之次要目的乃在於，適用於電子元件散熱領域之毛細結構製作方法，利用印刷方式可以大量製作或應用於需要大面積毛細結構的散熱結構上，更具方便且有效地生產製作，極具有市場競爭優勢。The secondary purpose of the present invention is to apply a capillary structure manufacturing method in the field of heat dissipation of electronic components, which can be mass-produced by printing or applied to a heat dissipation structure that requires a large-area capillary structure, which is more convenient and effective in production and production. Have a competitive advantage in the market.

為達上述目的，本發明之毛細結構之製作方法，包括提供氧化亞銅粉、銅粉與塗佈劑，銅粉的粒徑大於氧化亞銅粉的粒徑，並均勻混和氧化亞銅粉、銅粉與塗佈劑以形成一漿料。將漿料印刷塗佈於載體上，並進行燒結，使氧化亞銅粉與銅粉於載體上形成一毛細結構，而塗佈劑於燒結過程中揮發殆盡。To achieve the above objective, the method for manufacturing the capillary structure of the present invention includes providing cuprous oxide powder, copper powder and coating agent. The particle size of the copper powder is larger than that of the cuprous oxide powder, and the cuprous oxide powder is uniformly mixed. The copper powder and the coating agent form a slurry. The paste is printed and coated on the carrier and sintered, so that the cuprous oxide powder and the copper powder form a capillary structure on the carrier, and the coating agent is volatilized during the sintering process.

底下藉由具體實施例詳加說明，當更容易瞭解本創作之目的、技術內容、特點及其所達成之功效。The following detailed descriptions are given through specific examples, and it will be easier to understand the purpose, technical content, characteristics and effects of this creation.

為能解決現有毛細結構之孔隙率低的問題，發明人經過多年的研究及開發，利用不同銅粉材料製作出高孔隙率的毛細結構來取代現有製作複雜、難度高且傳導效率差等諸多應用優越性，據以改善現有產品的詬病，後續將詳細介紹本創作如何以一種毛細結構之製作方法來達到最有效率的功能訴求。In order to solve the problem of low porosity of the existing capillary structure, after years of research and development, the inventor used different copper powder materials to make a high-porosity capillary structure to replace the existing complex, difficult and poor conduction efficiency. The superiority is based on improving the criticism of existing products. The follow-up will introduce in detail how this creation uses a capillary structure manufacturing method to achieve the most efficient functional requirements.

請同時參閱第一圖與第二圖，第一圖係為本發明之步驟流程圖；第二圖係為本發明掃描電子顯微鏡(SEM)拍攝毛細結構之示意圖。本發明之毛細結構之製作方法，包括溶液製備，如步驟S10:提供氧化亞銅粉10、銅粉12與塗佈劑。在本實施例中，銅粉(Copper powder)12可使用純銅粉，例如微米級金屬銅粉,粒徑範圍可為1um-100um，在此所使用的銅粉類型不加以侷限。氧化亞銅（Cu2O）粉10的粒徑小於銅粉12的粒徑，並均勻混和氧化亞銅粉10、銅粉12與塗佈劑以形成一漿料。Please refer to the first and second figures at the same time. The first figure is a flow chart of the steps of the present invention; the second figure is a schematic diagram of the capillary structure taken by a scanning electron microscope (SEM) of the present invention. The manufacturing method of the capillary structure of the present invention includes solution preparation, such as step S10: providing cuprous oxide powder 10, copper powder 12 and coating agent. In this embodiment, copper powder 12 may use pure copper powder, such as micron metal copper powder, with a particle size range of 1um-100um, and the type of copper powder used here is not limited. The particle size of the cuprous oxide (Cu2O) powder 10 is smaller than the particle size of the copper powder 12, and the cuprous oxide powder 10, the copper powder 12 and the coating agent are uniformly mixed to form a slurry.

其中，現有氧化亞銅粉10是將銅粉經除雜質後與氧化銅混合，送入煅燒爐內加熱到800～900℃煅燒成氧化亞銅，取出後，用磁鐵吸去機械雜質，再粉碎至325目，製得氧化亞銅粉10。又或者是將硫酸銅溶液與葡萄糖混合後加入氫氧化鈉溶液進行反應，生成氧化亞銅，經過濾、漂洗、烘乾粉碎製得氧化亞銅粉10。當然還有其他的氧化亞銅粉10製作方法，但不論是使用何種方式製作出氧化亞銅粉10，本發明主要是應用現有的氧化亞銅粉10、銅粉12與塗佈劑做為製備漿料的主要材料，故製作氧化亞銅粉10之技術內容在此就不加以贅述。其中，塗佈劑包括樹脂、溶劑、分散劑與印刷助劑。Among them, the existing cuprous oxide powder 10 is made by mixing the copper powder with copper oxide after removing impurities, sending it into a calcining furnace and heating it to 800-900°C to be calcined into cuprous oxide. To 325 mesh, cuprous oxide powder 10 was prepared. Alternatively, the cuprous sulfate solution is mixed with glucose and then added with sodium hydroxide solution to react to generate cuprous oxide, which is filtered, rinsed, dried and crushed to obtain cuprous oxide powder 10. Of course, there are other methods for producing the cuprous oxide powder 10. However, no matter what method is used to produce the cuprous oxide powder 10, the present invention mainly uses the existing cuprous oxide powder 10, copper powder 12 and coating agent as The main material for preparing the slurry, so the technical content of preparing the cuprous oxide powder 10 will not be repeated here. Among them, coating agents include resins, solvents, dispersants and printing aids.

接續，塗佈製備如步驟S12，將漿料印刷塗佈於載體(圖中未示)上。其中，可利用印刷設備將漿料一次或多次印刷佈滿所需產生毛細結構的載體表面上。最後燒結製備如步驟S14，以保護氣氛與還原氣氛進行燒結約1至8小時，可根據漿料印刷塗佈於載體表面上的面積或厚度而適度調整燒結時間，燒結溫度約為650~850度，據以使氧化亞銅粉10與銅粉12在載體上形成一毛細結構，而塗佈劑於燒結過程中揮發殆盡。值得注意的是，氧化亞銅粉10與銅粉12在燒結過程中，銅粉12因粒徑較大而沉入氧化亞銅粉10下方，如第二圖所示。由於氧化亞銅粉10與銅粉12在燒結過程中會相互連結，且銅粉12的粒徑較大，因此粒徑彼此間所產生的孔隙相對較大，氧化亞銅粉10與銅粉12燒結後，氧化亞銅粉10的粒徑鍵結在一起，使氧化亞銅粉10與銅粉12兩者之間會產生較多的空隙，如此一來，整體的孔隙率可大大的提升。Next, the coating preparation is as step S12, and the slurry is printed and coated on the carrier (not shown in the figure). Among them, the printing equipment can be used to print the paste one or more times on the surface of the carrier where the capillary structure needs to be produced. The final sintering preparation is as step S14. The sintering is carried out in protective atmosphere and reducing atmosphere for about 1 to 8 hours. The sintering time can be adjusted appropriately according to the area or thickness of the paste printed and coated on the surface of the carrier. The sintering temperature is about 650~850 degrees. According to this, the cuprous oxide powder 10 and the copper powder 12 form a capillary structure on the carrier, and the coating agent is volatilized during the sintering process. It is worth noting that during the sintering process of the cuprous oxide powder 10 and the copper powder 12, the copper powder 12 sinks under the cuprous oxide powder 10 due to its large particle size, as shown in the second figure. Since the cuprous oxide powder 10 and the copper powder 12 are connected during the sintering process, and the particle size of the copper powder 12 is relatively large, the pores generated between the particle sizes are relatively large. The cuprous oxide powder 10 and the copper powder 12 After sintering, the particle sizes of the cuprous oxide powder 10 are bonded together, so that there will be more voids between the cuprous oxide powder 10 and the copper powder 12, so that the overall porosity can be greatly improved.

綜上所述，本發明藉由氧化亞銅粉10與銅粉12這兩種不同銅粉材料製作出具有高孔隙率，可解決現有單一銅粉燒製的毛細結構空隙率低所導致的傳熱效率差之問題。更進一步而言，本發明適用於電子元件散熱領域之毛細結構製作方法，利用印刷方式可以大量製作或應用於需要大面積毛細結構的散熱結構上，更具方便製作、低成本且應用彈性大等諸多優點，極具有市場競爭優勢。In summary, the present invention uses two different copper powder materials, cuprous oxide powder 10 and copper powder 12, to produce high porosity, which can solve the problem of low porosity caused by the capillary structure fired by a single copper powder. The problem of poor thermal efficiency. Furthermore, the present invention is suitable for manufacturing methods of capillary structures in the field of heat dissipation of electronic components. It can be mass-produced or applied to heat dissipation structures that require large-area capillary structures by printing. It is more convenient to manufacture, low-cost, and flexible in application, etc. Many advantages, extremely competitive advantages in the market.

唯以上所述者，僅為本創作之較佳實施例而已，並非用來限定本創作實施之範圍。故即凡依本創作申請範圍所述之特徵及精神所為之均等變化或修飾，均應包括於本創作之申請專利範圍內。Only the above are only the preferred embodiments of this creation, and they are not used to limit the scope of implementation of this creation. Therefore, all equivalent changes or modifications made in accordance with the characteristics and spirit of the application scope of this creation shall be included in the scope of patent application of this creation.

10:氧化亞銅粉 12:銅粉 S10~S14:步驟10: Cuprous oxide powder 12: Copper powder S10~S14: steps

第一圖係為本發明之步驟流程圖。 第二圖係為本發明掃描電子顯微鏡(SEM)拍攝毛細結構之示意圖。The first figure is a flow chart of the steps of the present invention. The second figure is a schematic diagram of the capillary structure taken by the scanning electron microscope (SEM) of the present invention.

S10~S14:步驟S10~S14: steps

Claims (4)

一種毛細結構之製作方法，包括: 提供氧化亞銅粉、銅粉與塗佈劑，該銅粉的粒徑大於該氧化亞銅粉的粒徑，並均勻混和該氧化亞銅粉、該銅粉與該塗佈劑以形成一漿料； 將該漿料印刷塗佈於載體上；以及 進行燒結，使該氧化亞銅粉與該銅粉於該載體上形成一毛細結構，而該塗佈劑於燒結過程中揮發殆盡。A manufacturing method of capillary structure, including: Provide cuprous oxide powder, copper powder and coating agent, the particle size of the copper powder is larger than that of the cuprous oxide powder, and uniformly mix the cuprous oxide powder, the copper powder and the coating agent to form a slurry material; Printing and coating the paste on the carrier; and Sintering is performed to make the cuprous oxide powder and the copper powder form a capillary structure on the carrier, and the coating agent is volatilized during the sintering process. 如請求項1所述之毛細結構之製作方法，其中該塗佈劑包括樹脂、溶劑、分散劑與印刷助劑。The method for manufacturing a capillary structure according to claim 1, wherein the coating agent includes a resin, a solvent, a dispersant, and a printing aid. 如請求項1所述之毛細結構之製作方法，其中該燒結步驟中係燒結1至8小時。The method for manufacturing a capillary structure according to claim 1, wherein the sintering step is sintering for 1 to 8 hours. 如請求項1所述之毛細結構之製作方法，其中該氧化亞銅粉與該銅粉在燒結過程中，該銅粉因粒徑較大而沉入該氧化亞銅粉下方。The method for manufacturing the capillary structure according to claim 1, wherein during the sintering process of the cuprous oxide powder and the copper powder, the copper powder sinks under the cuprous oxide powder due to its large particle size.

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