TWI481814B - Three dimensional measuring device - Google Patents
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Description
本發明係關於一種三維測定裝置。The present invention relates to a three-dimensional measuring device.
一般在印刷基板上安裝電子零件時，首先，在配設於印刷基板上的預定電極圖案上印刷糊狀焊料。其次，依據該糊狀焊料的黏性而在印刷基板上暫時焊接電子零件。其後，將前述印刷基板導入回流爐，經過預定的回流步驟，進行焊接。最近，在被導入回流爐的前階段，需要檢查糊狀焊料的印刷狀態，值此檢查之際，有時要使用三維測定裝置。Generally, when an electronic component is mounted on a printed substrate, first, a paste solder is printed on a predetermined electrode pattern disposed on the printed substrate. Next, the electronic component is temporarily soldered on the printed substrate in accordance with the viscosity of the cream solder. Thereafter, the printed substrate is introduced into a reflow furnace and subjected to a predetermined reflow step to perform soldering. Recently, it is necessary to check the printing state of the cream solder before being introduced into the reflow furnace, and when it is checked, a three-dimensional measuring device may be used.
近幾年，被提出各種使用光的所謂非接觸式的三維測定裝置，例如被提出關於使用相位位移法的三維測定裝置之技術。In recent years, various types of so-called non-contact type three-dimensional measuring apparatuses using light have been proposed, and for example, techniques for using a three-dimensional measuring apparatus using a phase shift method have been proposed.
在利用該相位位移法的三維測定裝置方面，係藉由由光源與正弦波圖案的濾光器之組合構成的照射手段，將具有正弦波狀(條紋狀)的光強度分布之圖案光照射於被測定物(此情況為印刷基板)。然後，使用配置於正上方的攝影手段觀測基板上之點。就攝影手段而言，使用由透鏡及攝影元件等構成的CCD攝影機等。此情況，畫面上的測定對象點P之光的強度I係以下式所給予。In the three-dimensional measuring apparatus using the phase shift method, pattern light having a sinusoidal (striped) light intensity distribution is irradiated by an irradiation means composed of a combination of a light source and a filter of a sine wave pattern. The object to be measured (in this case, a printed substrate). Then, the point on the substrate is observed using a photographing means disposed directly above. As the photographing means, a CCD camera or the like composed of a lens, a photographing element, or the like is used. In this case, the intensity I of the light of the measurement target point P on the screen is given by the following equation.
I=B+A．cos ΦI=B+A. Cos Φ
〔其中，B：直流光雜訊(偏移成分)、A：正弦波的對比(反射率)、Φ：由物體的凹凸所給予的相位〕[Where, B: DC optical noise (offset component), A: contrast of sine wave (reflectance), Φ: phase given by the unevenness of the object]
此時，使圖案光移動，使相位變化成例如四階段(Φ+0、Φ+π/2、Φ+π、Φ+3 π/2)，取入具有對應於此等相位的強度分布I1、I2、I3、I4的圖像，依據下述式求出調變分(用於導出高度的位置資訊)θ。At this time, the pattern light is moved to change the phase to, for example, four stages (Φ+0, Φ+π/2, Φ+π, Φ+3π/2), and the intensity distribution I1 having the phase corresponding thereto is taken. For the images of I, I3, and I4, the modulation points (the position information for deriving the height) θ are obtained according to the following equation.
θ=arctan{(I4-I2)/(I1-I3)}θ=arctan{(I4-I2)/(I1-I3)}
使用此調變分θ求出印刷基板上的糊狀焊料等的測定對象點P之三維座標(X、Y、Z)，以測定測定對象的三維形狀，特別是高度。The three-dimensional coordinates (X, Y, and Z) of the measurement target point P such as the cream solder on the printed circuit board are obtained by using the modulation variable θ to measure the three-dimensional shape, particularly the height, of the measurement target.
然而，在印刷基板上的糊狀焊料之印刷部分(焊料印刷區域)與其他部分(背景區域)，由於光的反射率等不同，所以在同一亮度的圖案光下，可能會難以取得各部分更加正確的資料。However, in the printed portion (solder printing region) of the paste solder on the printed substrate and other portions (background regions), since the reflectance of light or the like is different, it may be difficult to obtain each part under the pattern light of the same brightness. The right information.
例如，關於反射率比較高的焊料印刷區域，若圖案光的亮度過高，則在由攝影手段所拍攝的圖像資料中，於對應於該焊料印刷區域的像素會產生亮度飽和狀態(saturation)，可能會難以測定更加正確的高度。另一方面，關於反射率比較低的背景區域，若圖案光的亮度過低，則圖像資料上，圖案光的明暗差(亮度差)會變小，可能會難以測定高度。For example, in the solder printing area where the reflectance is relatively high, if the brightness of the pattern light is too high, in the image data captured by the photographing means, a brightness saturation occurs in the pixel corresponding to the solder print area. It may be difficult to determine a more correct height. On the other hand, in the background region where the reflectance is relatively low, if the brightness of the pattern light is too low, the difference in brightness (brightness difference) of the pattern light becomes small in the image data, and it may be difficult to measure the height.
對此，在近幾年也被提出分別進行適合焊料印刷區域的攝影條件(照射亮度)的攝影、及適合背景區域的攝影條件的攝影，適當地進行高度測定之技術(參照例如專利文獻1)。In this case, in recent years, it has been proposed to perform imaging for photographing conditions (irradiation luminance) suitable for the solder printing region and photographing suitable for the imaging conditions of the background region, and to appropriately measure the height (see, for example, Patent Document 1) .
專利文獻1 特開2006-300539號公報Patent Document 1 JP-A-2006-300539
然而，即使是相同焊料印刷區域內或背景區域內，由於例如攝影機與印刷基板的位置關係、糊狀焊料的表面形狀等，在印刷基板上反射而射入攝影機的圖案光之反射率在印刷基板上的各位置也不相同。However, even in the same solder printing area or in the background area, the reflectance of the pattern light reflected on the printed substrate and incident on the printing substrate is on the printed substrate due to, for example, the positional relationship between the camera and the printed substrate, the surface shape of the cream solder, and the like. The locations on the top are also different.
例如，在預定的糊狀焊料的表面形狀為球面狀時等，即使是對應於該糊狀焊料的同一區域內，也會產生反射率高的部分與低的部分。因此，在以適合反射率高的部分的攝影條件(照射亮度)攝影時，反射率低的部分會變成暗的圖像，有測定精度降低之虞。另一方面，在以適合反射率低的部分的攝影條件攝影時，有反射率高的部分會變成亮度飽和狀態之虞。結果，有測定精度降低之虞。For example, when the surface shape of the predetermined cream solder is spherical, the portion having a high reflectance and the low portion are generated even in the same region corresponding to the cream solder. Therefore, when photographing is performed under the photographing conditions (irradiation luminance) of a portion having a high reflectance, the portion having a low reflectance becomes a dark image, and the measurement accuracy is lowered. On the other hand, when photographing in a photographing condition suitable for a portion having a low reflectance, a portion having a high reflectance becomes a state of brightness saturation. As a result, there is a flaw in the measurement accuracy.
再者，上述課題未必限於進行印刷於印刷基板上的糊狀焊料等的高度測定的情況，在其他三維測定裝置的領域也是存在的。當然，不是限於相位位移法的問題。Furthermore, the above-described problem is not necessarily limited to the case where the height of the paste solder printed on the printed circuit board is measured, and it is also in the field of other three-dimensional measuring apparatuses. Of course, it is not limited to the problem of the phase shift method.
本發明係有鑑於上述情況而完成，其目的在於提供一種當進行三維測定時，可謀求測定精度提高等的三維測定裝置。The present invention has been made in view of the above circumstances, and an object thereof is to provide a three-dimensional measuring apparatus capable of improving measurement accuracy and the like when performing three-dimensional measurement.
以下，就適合解決上述課題的各手段逐項進行說明。再者，於因應需求而對應的手段附注特有的作用效果。Hereinafter, each means suitable for solving the above problems will be described item by item. Furthermore, the means corresponding to the demand are noted to have a unique effect.
手段1.一種三維測定裝置，其特徵在於具備：照射手段，其係可對於所連續搬送的被測定物，沿著該被測定物的搬送方向切換並照射具有條紋狀的光強度分布且亮度不同的複數種圖案光；攝影手段，其係拍攝來自被照射前述各種圖案光的前述被測定物的反射光，輸出至少包含亮度值的圖像資料；圖像資料取得手段，其係每次將前述被測定物搬送預定量，就將在每預定量相位就變化的同一亮度的圖案光下所拍攝的複數種圖像資料作為一組，取得在前述複數種圖案光下所拍攝的複數組圖像資料組；判定手段，其係判定對應於前述被測定物上的各座標位置之前述圖像資料的各像素的亮度值是否包含在預先設定的有效範圍內；抽出手段，其係對前述被測定物的各座標位置，從前述複數組圖像資料組中，抽出前述圖像資料的各像素的亮度值在前述有效範圍內的圖像資料組；及三維測定手段，其係以前述所抽出的圖像資料組為基礎而進行關於前述被測定物的各座標位置的三維測定。1. A three-dimensional measuring apparatus, comprising: an irradiation means for switching a light intensity distribution having a stripe shape and a different brightness in a direction in which the object to be measured is continuously conveyed along the conveyance direction of the object to be measured a plurality of pattern lights; the imaging means for capturing reflected light from the object to be measured irradiated with the various pattern lights, and outputting image data including at least a brightness value; and the image data obtaining means each time When the object to be measured is transported by a predetermined amount, a plurality of types of image data captured under pattern light of the same brightness that changes in a predetermined amount of phase are taken as a group, and a complex array image taken under the plurality of pattern lights is obtained. a data group; a determination means for determining whether a luminance value of each pixel of the image data corresponding to each coordinate position on the object to be measured is included in a predetermined effective range; and extracting means for determining the measured value For each coordinate position of the object, the luminance value of each pixel of the image data extracted from the complex image data group is within the aforementioned effective range The image data set; and the three-dimensional measuring means, which is an image-based data set based on the extracted three-dimensional measurement is performed on each of the coordinate position of the object to be measured.
藉由上述手段1，對於被連續搬送的被測定物照射具有條紋狀的光強度分布的圖案光，被照射該圖案光的被測定物每次被搬送預定量(相當於例如圖案光的相位π /2分的距離)就被攝影手段攝影。藉此，可取得所照射的圖案光的相位每預定量(例如各π /2)就不同的複數種(例如四種)的圖像資料。然後，以此等圖像資料為基礎而進行被測定物的三維測定。By the means 1 described above, pattern light having a stripe-shaped light intensity distribution is applied to the object to be continuously conveyed, and the object to be irradiated with the pattern light is transported by a predetermined amount each time (corresponding to, for example, the phase of the pattern light π) The distance of /2 points is photographed by photography. Thereby, it is possible to obtain a plurality of (for example, four) types of image data in which the phase of the irradiated pattern light differs by a predetermined amount (for example, each π /2). Then, three-dimensional measurement of the object to be measured is performed based on the image data.
再者，在本手段中，在亮度不同的複數種圖案光下取得複數組由上述複數種的圖像資料構成的圖像資料組。然後，判定對應於被測定物上的各座標位置(測定點)之圖像資料的各像素的亮度值是否包含在預先設定的有效範圍內，並且對被測定物的各座標位置，從複數組圖像資料組中抽出圖像資料的各像素的亮度值在有效範圍內的圖像資料組，以該所抽出的圖像資料組為基礎，利用例如相位位移法進行關於被測定物的各座標位置的三維測定。Furthermore, in the present method, an image data group composed of the plurality of types of image data in a complex array is obtained under a plurality of pattern lights having different luminances. Then, it is determined whether or not the luminance value of each pixel corresponding to the image data of each coordinate position (measurement point) on the object to be measured is included in a predetermined effective range, and the coordinate position of the object to be measured is from the complex array. An image data set in which an image data group extracts a luminance value of each pixel of an image data within an effective range, and based on the extracted image data set, coordinates of the object to be measured are performed by, for example, a phase shift method Three-dimensional measurement of position.
結果，可對被測定物的各座標位置，使用更加適當的亮度的圖像資料進行三維測定，可謀求測定精度的提高。As a result, it is possible to perform three-dimensional measurement using image data of more appropriate brightness for each coordinate position of the object to be measured, and it is possible to improve the measurement accuracy.
手段2.如記載於手段1之三維測定裝置，其特徵在於：前述判定手段至少判定前述圖像資料的各像素的亮度值是否比相當於飽和位準的值更小。The apparatus according to claim 1, wherein the determining means determines at least whether a luminance value of each pixel of the image data is smaller than a value corresponding to a saturation level.
藉由上述手段2，將比相當於飽和位準的值更小的值設定於上述有效範圍的上限，藉此可抑制因為上述亮度飽和而導致的測定精度降低。According to the above-described means 2, a value smaller than the value corresponding to the saturation level is set to the upper limit of the effective range, whereby the measurement accuracy due to the saturation of the brightness can be suppressed from being lowered.
手段3.如記載於手段1或2之三維測定裝置，其特徵在於：在前述複數組圖像資料組之中，前述圖像資料的各像素的亮度值在前述有效範圍內的圖像資料組(比相當於飽和位準的值更小的圖像資料組)有複數組時，前述抽出手段抽出在前述複數種圖案光之中照射亮度最高的圖案光下所拍攝的圖像資料組。The three-dimensional measuring apparatus according to the means 1 or 2, wherein the image data set of the luminance value of each pixel of the image data within the effective range is included in the complex array image data set When there is a complex array (the image data set smaller than the value corresponding to the saturation level), the extraction means extracts the image data set captured under the pattern light having the highest illumination among the plurality of pattern lights.
藉由上述手段3，可抽出具有更大的亮度值的圖像資料，可進行更加適當的三維測定。By the above means 3, image data having a larger luminance value can be extracted, and a more appropriate three-dimensional measurement can be performed.
手段4.如記載於手段1或2之三維測定裝置，其特徵在於具備：平均值計算手段，其係在由前述抽出手段所抽出的圖像資料組有複數組時，計算該複數組圖像資料組的平均值；以由前述平均值計算手段所算出之圖像資料組的平均值為基礎，前述三維測定手段進行前述三維測定。The apparatus according to the first aspect or the second aspect of the invention, characterized by comprising: an average value calculating means for calculating the complex array image when the image data set extracted by the extraction means has a complex array The average value of the data set; based on the average value of the image data set calculated by the above-described average value calculating means, the three-dimensional measuring means performs the three-dimensional measurement.
藉由上述手段4，可抽出可進行更加適當的三維測定的圖像資料。By means of the above-described means 4, image data which can be subjected to more appropriate three-dimensional measurement can be extracted.
手段5.如記載於手段1至4中任一手段之三維測定裝置，其特徵在於：設定比可得到前述圖像資料的各像素的亮度值之下限值(例如「0」)更大的值作為前述有效範圍之下限值。A three-dimensional measuring apparatus according to any one of the means 1 to 4, characterized in that the lower limit value (for example, "0") of the luminance value of each pixel in which the image data is obtained is set. The value is the lower limit of the aforementioned effective range.
藉由上述手段5，為了進行更加適當的三維測定，可抽出具有充分亮度的圖像資料。According to the above means 5, in order to perform more appropriate three-dimensional measurement, image data having sufficient brightness can be extracted.
手段6.如記載於手段1至5中任一手段之三維測定裝置，其特徵在於具備：對位手段，其係使在前述被測定物的搬送方向中不同位置上所分別拍攝的前述圖像資料相互間的座標系一致。The three-dimensional measuring apparatus according to any one of the means 1 to 5, characterized by comprising: a positioning means for causing the respective images captured at different positions in the conveying direction of the object to be measured The coordinates of the data are consistent with each other.
藉由上述手段6，不使被測定物的搬送停止，可取得各圖像資料，所以可謀求測定效率的提高等。According to the means 6 described above, since the image data can be obtained without stopping the conveyance of the object to be measured, it is possible to improve the measurement efficiency and the like.
1‧‧‧印刷基板1‧‧‧Printing substrate
4‧‧‧糊狀焊料4‧‧‧ Paste solder
10‧‧‧基板檢查裝置10‧‧‧Substrate inspection device
13‧‧‧輸送帶13‧‧‧Conveyor belt
14‧‧‧照明裝置14‧‧‧Lighting device
15‧‧‧攝影機15‧‧‧ camera
16‧‧‧控制裝置16‧‧‧Control device
P1~P32‧‧‧座標P1~P32‧‧‧ coordinates
G1~G16‧‧‧圖像資料G1~G16‧‧‧ image data
H‧‧‧有效範圍H‧‧‧effective range
W‧‧‧攝影範圍W‧‧‧Photography range
第1圖為概略地顯示一實施形態之基板檢查裝置的概略立體圖。Fig. 1 is a schematic perspective view schematically showing a substrate inspecting apparatus according to an embodiment.
第2圖為印刷基板的剖面圖。Fig. 2 is a cross-sectional view of the printed substrate.
第3圖為顯示基板檢查裝置概略的方塊圖。Fig. 3 is a block diagram showing an outline of a substrate inspection apparatus.
第4圖為用於說明和時間經過共同變化的攝影機的攝影範圍與印刷基板的座標位置之關係的示意圖。Fig. 4 is a schematic view for explaining the relationship between the photographing range of the camera and the coordinate position of the printed substrate which are changed together with the passage of time.
第5圖為用於說明和時間經過共同變化的圖案光種類(照射亮度)及印刷基板的各座標位置的圖案光相位的對應表。Fig. 5 is a correspondence table for explaining the pattern light type (irradiation brightness) which changes with time and the pattern light phase of each coordinate position of the printed circuit board.
第6圖為概略地顯示將複數個圖像資料的座標位置進行對位的狀態的圖表。Fig. 6 is a graph schematically showing a state in which coordinate positions of a plurality of image data are aligned.
第7圖為概略地顯示預先設定有關於印刷基板的各座標位置的各資料的群組經整理並重新排列的狀態的圖表。Fig. 7 is a graph schematically showing a state in which groups of respective materials relating to respective coordinate positions of the printed substrate are arranged and rearranged.
第8圖為顯示關於印刷基板的預定座標位置的十六種資料(亮度值)一具體例的圖表。Fig. 8 is a graph showing a specific example of sixteen kinds of data (luminance values) regarding the predetermined coordinate position of the printed substrate.
第9圖為顯示和第8圖的資料比較，用於說明亮度飽和狀態的理論上的數值的圖表。Fig. 9 is a graph showing the theoretical numerical values of the luminance saturation state, which is compared with the data of Fig. 8.
以下，就一實施形態一面參照圖面一面進行說明。首先，就作為被測定物的印刷基板的構造詳細地進行說明。Hereinafter, an embodiment will be described with reference to the drawings. First, the structure of the printed substrate as the object to be measured will be described in detail.
如第2圖所示，印刷基板1呈平板狀，在由玻璃環氧樹脂等構成的基底基板2上設有由銅箔構成的電極圖案3。再者，在預定的電極圖案3上印刷形成有糊狀焊料4。將印刷有此糊狀焊料4的區域作為「焊料印刷區域」。雖然將焊料印刷區域以外的部分總稱為「背景區域」，但在此背景區域中卻包含電極圖案3露出的區域(記號A)、基底基板2露出的區域(記號B)、於基底基板2上塗布有抗蝕膜5的區域(記號C)、及於電極圖案3上塗布有抗蝕膜5的區域(記號D)。再者，抗蝕膜5係被塗布於印刷基板1的表面使以糊狀焊料4不會在預定配線部分以外之上。As shown in FIG. 2, the printed circuit board 1 has a flat plate shape, and an electrode pattern 3 made of a copper foil is provided on the base substrate 2 made of glass epoxy resin or the like. Further, a paste solder 4 is formed on the predetermined electrode pattern 3. The region where the cream solder 4 is printed is referred to as a "solder printing region". Although the portion other than the solder printing region is collectively referred to as a "background region", the region where the electrode pattern 3 is exposed (symbol A) and the region where the base substrate 2 is exposed (mark B) are provided on the base substrate 2 in this background region. A region (mark C) to which the resist film 5 is applied, and a region (symbol D) on which the resist film 5 is applied on the electrode pattern 3. Further, the resist film 5 is applied to the surface of the printed substrate 1 so that the paste solder 4 does not exist outside the predetermined wiring portion.
其次，就具備本實施形態的三維測定裝置之基板檢查裝置的構造詳細地進行說明。第1圖為概略地顯示基板檢查裝置10的概略構造圖。Next, the structure of the substrate inspection apparatus including the three-dimensional measuring apparatus of the present embodiment will be described in detail. FIG. 1 is a schematic structural view schematically showing the substrate inspection apparatus 10.
基板檢查裝置10具備：作為搬送印刷基板1之搬送手段的輸送帶13；作為對於印刷基板1的表面從斜上方照射預定光之照射手段的照明裝置14；作為拍攝來自被照射該光的印刷基板1的反射光之攝影手段的攝影機15；及用於實施基板檢查裝置10內的各種控制或圖像處理、運算處理的控制裝置16(參照第3圖)。The substrate inspection apparatus 10 includes a conveyance belt 13 as a conveyance means for conveying the printed substrate 1, an illumination device 14 as an irradiation means for irradiating a predetermined light to the surface of the printed substrate 1, and a printing substrate from which the light is irradiated. A camera 15 for detecting light of a reflected light; and a control device 16 for performing various control, image processing, and arithmetic processing in the substrate inspection device 10 (see FIG. 3).
在輸送帶13上設有未圖示的馬達，藉由利用控制裝置16驅動控制該馬達，將載置於輸送帶13上的印刷基板1向預定方向(第1圖右方向)以定速連續搬送。藉此，攝影機15的攝影範圍W就會對於印刷基板1向反方向(第1圖左方向)相對移動下去。A motor (not shown) is provided on the conveyor belt 13, and the motor is driven and controlled by the control device 16, and the printed circuit board 1 placed on the conveyor belt 13 is continuously oriented at a constant speed in a predetermined direction (first right direction). Transfer. Thereby, the imaging range W of the camera 15 relatively moves in the opposite direction (the left direction of the first drawing) of the printed substrate 1.
照明裝置14具備發出預定光的四個照明(光源)。具體而言，具備第一照明14A~第四照明14D。The illumination device 14 is provided with four illuminations (light sources) that emit predetermined light. Specifically, the first illumination 14A to the fourth illumination 14D are provided.
第一照明14A~第四照明14D分別具備眾所周知的液晶光學快門，構成對於印刷基板1為沿著其搬送方向可照射具有條紋狀(正弦波狀)的光強度分布之圖案光。即，可照射條紋的方向和印刷基板1的搬送方向正交的圖案光。Each of the first illumination 14A to the fourth illumination 14D includes a well-known liquid crystal optical shutter, and the printed circuit board 1 is configured to emit pattern light having a stripe-like (sinusoidal) light intensity distribution along the transport direction. In other words, the pattern light in which the direction of the stripe is orthogonal to the transport direction of the printed circuit board 1 can be irradiated.
然而，從第一照明14A~第四照明14D所照射的圖案光之照射亮度分別不同。However, the illumination brightness of the pattern light irradiated from the first illumination 14A to the fourth illumination 14D is different.
如下更詳細地說明：從第一照明14A照射第一亮度的圖案光；從第二照明14B照射第一亮度兩倍的第二亮度的圖案光；從第三照明14C照射第二亮度兩倍的第三亮度的圖案光；從第四照明14D照射第三亮度兩倍的第四亮度的圖案光。The pattern light of the first brightness is illuminated from the first illumination 14A; the pattern light of the second brightness twice the first brightness is illuminated from the second illumination 14B; and the second brightness is doubled from the third illumination 14C as explained in more detail below; Pattern light of the third brightness; pattern light of the fourth brightness twice the third brightness is illuminated from the fourth illumination 14D.
在本實施形態中例如將第一亮度設定為「50(cd/m2)」、將第二亮度設定為為「100(cd/m2)」、將第三亮度設定為「200(cd/m2)」、將第四亮度為設定「400(cd/m2)」。In the present embodiment, for example, the first luminance is set to "50 (cd/m2)", the second luminance is set to "100 (cd/m2)", and the third luminance is set to "200 (cd/m2). The fourth brightness is set to "400 (cd/m2)".
此外，關於本實施形態的攝影機15，採用使用CCD感測器的256階度的單色CCD攝影機作為攝影元件。即，由攝影機15所拍攝的圖像在該攝影機15內部被轉換為數位信號後，作為至少各像素含有從「0」到「255」的任一值之亮度值的圖像資料被輸入到控制裝置16。然後，控制裝置16以該圖像資料為基礎而實施如後述的圖像處理或三維測定處理、檢查處理等。Further, regarding the camera 15 of the present embodiment, a 256-step monochrome CCD camera using a CCD sensor is used as the imaging element. That is, after the image captured by the camera 15 is converted into a digital signal in the inside of the camera 15, image data including luminance values of any value from "0" to "255" for at least each pixel is input to the control. Device 16. Then, the control device 16 performs image processing, three-dimensional measurement processing, inspection processing, and the like, which will be described later, based on the image data.
其次，就控制裝置16的電氣構造，參照第3圖詳細地進行說明。第3圖為顯示基板檢查裝置10概略的方塊圖。Next, the electrical structure of the control device 16 will be described in detail with reference to FIG. FIG. 3 is a block diagram showing the outline of the substrate inspection apparatus 10.
如第3圖所示，控制裝置16具備：掌管整個基板檢查裝置10控制的CPU及輸入輸出介面21；作為以鍵盤或滑鼠或者觸控面板構成的輸入手段的輸入裝置22；作為具有CRT或液晶等顯示畫面的顯示手段的顯示裝置23；用於記憶由攝影機15所拍攝的圖像資料的圖像資料記憶裝置24；用於記憶基於該圖像資料所得到的三維測定結果等各種運算結果的運算結果記憶裝置25等。再者，此等各裝置22~25電性連接於CPU及輸入輸出介面21。As shown in FIG. 3, the control device 16 includes a CPU and an input/output interface 21 that is controlled by the entire substrate inspection device 10, and an input device 22 that is an input means composed of a keyboard or a mouse or a touch panel; a display device 23 for displaying a display screen such as a liquid crystal; an image data storage device 24 for storing image data captured by the camera 15; and various calculation results for storing a three-dimensional measurement result obtained based on the image data The operation result memory device 25 and the like. Furthermore, the devices 22 to 25 are electrically connected to the CPU and the input/output interface 21.
其次，就以基板檢查裝置10所執行的三維測定處理等的各種處理，詳細地進行說明。Next, various processes such as three-dimensional measurement processing executed by the substrate inspection apparatus 10 will be described in detail.
控制裝置16驅動控制輸送帶13而以定速連續搬送印刷基板1。然後，控制裝置16基於來自設於輸送帶13上的未圖示的編碼器的信號，驅動控制照明裝置14及攝影機15。The control device 16 drives and controls the conveyor belt 13 to continuously convey the printed substrate 1 at a constant speed. Then, the control device 16 drives and controls the illumination device 14 and the camera 15 based on a signal from an encoder (not shown) provided on the conveyor belt 13.
如下更詳細地說明每次印刷基板1被搬送預定量△x，即每次經過預定時間△t，就依預定的順序切換從照明裝置14照射的光，並且利用攝影機15拍攝被照射該光的印刷基板1。在本實施形態中，將前述預定量△x設定為相當於從照明裝置14(第一照明14A~第四照明14D)照射的圖案光之相位π /8分(22.5°分)的距離。此外，攝影機15的攝影範圍W被設定為相當於前述圖案光之相位2π 分(360°分)的長度。As described in more detail below, each time the printed substrate 1 is transported by a predetermined amount Δx, that is, each time a predetermined time Δt elapses, the light irradiated from the illumination device 14 is switched in a predetermined order, and the camera 15 is used to photograph the light irradiated with the light. The substrate 1 is printed. In the present embodiment, the predetermined amount Δx is set to a distance corresponding to the phase π / 8 minutes (22.5 ° minutes) of the pattern light irradiated from the illumination device 14 (the first illumination 14A to the fourth illumination 14D). Further, the imaging range W of the camera 15 is set to correspond to the length of the phase of the pattern light by 2 π minutes (360 ° minutes).
此處，就從照明裝置14照射的光與攝影機15的攝影範圍W之關係，舉出具體例，詳細地進行說明。第4圖為用於說明和時間經過一起相對移動的攝影機15的攝影範圍W與印刷基板1的座標位置之關係的示意圖。第5圖為用於說明和時間經過一起變化的圖案光種類(照射亮度)及印刷基板1的各座標位置的圖案光相位的對應表。Here, the relationship between the light irradiated from the illumination device 14 and the imaging range W of the camera 15 will be described in detail with reference to specific examples. Fig. 4 is a schematic view for explaining the relationship between the photographing range W of the camera 15 and the coordinate position of the printed substrate 1 which are relatively moved together with the passage of time. Fig. 5 is a correspondence table for explaining the type of pattern light (irradiation brightness) which changes with the passage of time and the pattern light phase of each coordinate position of the printed circuit board 1.
如第4、5圖所示，在預定的攝影定時t1，從第一照明14A對於印刷基板1照射第一亮度的圖案光。此時，印刷基板1之中相當於其搬送方向(X方向)的座標P1~P17的範圍位於攝影機15的攝影範圍W內。即，在攝影定時t1，取得被照射第一亮度的圖案光之印刷基板1表面的座標P1~P17的範圍的圖像資料G1。再者，關於和搬送方向正交的方向(Y方向)，印刷基板1的Y方向全部範圍包含在攝影機15的攝影範圍內，關於X方向的同一座標位置的Y方向的各座標位置，在圖案光的種類及相位上無不同(以下同樣)。As shown in FIGS. 4 and 5, the pattern light of the first luminance is applied to the printed substrate 1 from the first illumination 14A at a predetermined imaging timing t1. At this time, the range of the coordinates P1 to P17 corresponding to the conveyance direction (X direction) among the printed boards 1 is within the imaging range W of the camera 15. In other words, at the imaging timing t1, the image data G1 in the range of the coordinates P1 to P17 on the surface of the printed substrate 1 on which the pattern light of the first luminance is irradiated is acquired. Further, in the direction (Y direction) orthogonal to the conveyance direction, the entire range of the Y direction of the printed circuit board 1 is included in the imaging range of the camera 15, and the coordinate position in the Y direction of the same coordinate position in the X direction is in the pattern. There is no difference in the type and phase of light (the same applies hereinafter).
如第5圖所示，在攝影定時t1，以被照射於印刷基板1的圖案光的相位在座標P17為「0°」、在座標P16為「22.5°」、在座標P15為「45°」、…、在座標P1為「360°」的方式，取得圖案光的相位在各座標P1~P17各偏移「22.5°」的圖像資料。As shown in FIG. 5, at the photographing timing t1, the phase of the pattern light irradiated onto the printed circuit board 1 is "0°" in the coordinate P17, "22.5°" in the coordinate P16, and "45°" in the coordinate P15. In the method in which the coordinate P1 is "360°", the image data in which the phase of the pattern light is shifted by "22.5°" in each of the coordinates P1 to P17 is obtained.
在從攝影定時t1經過預定時間△t的攝影定時t2，從第二照明14B對於印刷基板1照射第二亮度的圖案光。此時，相當於印刷基板1的座標P2~P18的 範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G2。At the photographing timing t2 at which the predetermined time Δt elapses from the photographing timing t1, the pattern light of the second luminance is irradiated to the printed substrate 1 from the second illumination 14B. At this time, it corresponds to the coordinates P2 to P18 of the printed substrate 1. The range is within the imaging range W of the camera 15, and the image data G2 of the range is acquired.
在從攝影定時t2經過預定時間△t的攝影定時t3，從第三照明14C對於印刷基板1照射第三亮度的圖案光。此時，相當於印刷基板1的座標P3~P19的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G3。At the photographing timing t3 at which the predetermined time Δt elapses from the photographing timing t2, the pattern light of the third luminance is irradiated to the printed substrate 1 from the third illumination 14C. At this time, the range corresponding to the coordinates P3 to P19 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G3 of the range is acquired.
在從攝影定時t3經過預定時間△t的攝影定時t4，從第四照明14D對於印刷基板1照射第四亮度的圖案光。此時，相當於印刷基板1的座標P4~P20的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G4。At the photographing timing t4 at which the predetermined time Δt elapses from the photographing timing t3, the pattern light of the fourth luminance is irradiated to the printed substrate 1 from the fourth illumination 14D. At this time, the range corresponding to the coordinates P4 to P20 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G4 of the range is acquired.
在從攝影定時t4經過預定時間△t的攝影定時t5，從第一照明14A對於印刷基板1照射第一亮度的圖案光。此時，相當於印刷基板1的座標P5~P21的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G5。At the photographing timing t5 at which the predetermined time Δt elapses from the photographing timing t4, the pattern light of the first luminance is irradiated to the printed substrate 1 from the first illumination 14A. At this time, the range corresponding to the coordinates P5 to P21 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G5 of the range is acquired.
在從攝影定時t5經過預定時間△t的攝影定時t6，從第二照明14B對於印刷基板1照射第二亮度的圖案光。此時，相當於印刷基板1的座標P6~P22的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G6。At the photographing timing t6 at which the predetermined time Δt elapses from the photographing timing t5, the pattern light of the second luminance is irradiated to the printed substrate 1 from the second illumination 14B. At this time, the range corresponding to the coordinates P6 to P22 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G6 of the range is acquired.
在從攝影定時t6經過預定時間△t的攝影定時t7，從第三照明14C對於印刷基板1照射第三亮度的圖案光。此時，相當於印刷基板1的座標P7~P23的 範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G7。At the photographing timing t7 at which the predetermined time Δt elapses from the photographing timing t6, the pattern light of the third luminance is irradiated to the printed substrate 1 from the third illumination 14C. At this time, it corresponds to the coordinates P7 to P23 of the printed substrate 1. The range is within the imaging range W of the camera 15, and the image data G7 of the range is acquired.
在從攝影定時t7經過預定時間△t的攝影定時t8，從第四照明14D對於印刷基板1照射第四亮度的圖案光。此時，相當於印刷基板1的座標P8~P24的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G8。At the photographing timing t8 at which the predetermined time Δt elapses from the photographing timing t7, the pattern light of the fourth luminance is irradiated to the printed substrate 1 from the fourth illumination 14D. At this time, the range corresponding to the coordinates P8 to P24 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G8 of the range is acquired.
在從攝影定時t8經過預定時間△t的攝影定時t9，從第一照明14A對於印刷基板1照射第一亮度的圖案光。此時，相當於印刷基板1的座標P9~P25的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G9。At the photographing timing t9 at which the predetermined time Δt elapses from the photographing timing t8, the pattern light of the first luminance is irradiated to the printed substrate 1 from the first illumination 14A. At this time, the range corresponding to the coordinates P9 to P25 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G9 of the range is acquired.
在從攝影定時t9經過預定時間△t的攝影定時t10，從第二照明14B對於印刷基板1照射第二亮度的圖案光。此時，相當於印刷基板1的座標P10~P26的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G10。At the photographing timing t10 at which the predetermined time Δt elapses from the photographing timing t9, the pattern light of the second luminance is irradiated to the printed substrate 1 from the second illumination 14B. At this time, the range corresponding to the coordinates P10 to P26 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G10 of the range is acquired.
在從攝影定時t10經過預定時間△t的攝影定時t11，從第三照明14C對於印刷基板1照射第三亮度的圖案光。此時，相當於印刷基板1的座標P11~P27的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G11。At the photographing timing t11 at which the predetermined time Δt elapses from the photographing timing t10, the pattern light of the third luminance is irradiated to the printed substrate 1 from the third illumination 14C. At this time, the range corresponding to the coordinates P11 to P27 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G11 of the range is acquired.
在從攝影定時t11經過預定時間△t的攝影定時t12，從第四照明14D對於印刷基板1照射第四亮度的圖案光。此時，相當於印刷基板1的座標P12~P28 的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G12。At the photographing timing t12 at which the predetermined time Δt elapses from the photographing timing t11, the pattern light of the fourth luminance is irradiated to the printed substrate 1 from the fourth illumination 14D. At this time, it corresponds to the coordinates P12 to P28 of the printed substrate 1. The range is within the imaging range W of the camera 15, and the image data G12 of the range is acquired.
在從攝影定時t12經過預定時間△t的攝影定時t13，從第一照明14A對於印刷基板1照射第一亮度的圖案光。此時，相當於印刷基板1的座標P13~P29的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G13。At the photographing timing t13 at which the predetermined time Δt elapses from the photographing timing t12, the pattern light of the first luminance is irradiated to the printed substrate 1 from the first illumination 14A. At this time, the range corresponding to the coordinates P13 to P29 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G13 of the range is acquired.
在從攝影定時t13經過預定時間△t的攝影定時t14，從第二照明14B對於印刷基板1照射第二亮度的圖案光。此時，相當於印刷基板1的座標P14~P30的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G14。At the photographing timing t14 at which the predetermined time Δt elapses from the photographing timing t13, the pattern light of the second luminance is irradiated to the printed substrate 1 from the second illumination 14B. At this time, the range corresponding to the coordinates P14 to P30 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G14 of the range is acquired.
在從攝影定時t14經過預定時間△t的攝影定時t15，從第三照明14C對於印刷基板1照射第三亮度的圖案光。此時，相當於印刷基板1的座標P15~P31的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G15。At the photographing timing t15 at which the predetermined time Δt elapses from the photographing timing t14, the pattern light of the third luminance is irradiated to the printed substrate 1 from the third illumination 14C. At this time, the range corresponding to the coordinates P15 to P31 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G15 of the range is acquired.
在從攝影定時t15經過預定時間△t的攝影定時t16，從第四照明14D對於印刷基板1照射第四亮度的圖案光。此時，相當於印刷基板1的座標P16~P32的範圍位於攝影機15的攝影範圍W內，取得該範圍的圖像資料G16。At the photographing timing t16 at which the predetermined time Δt elapses from the photographing timing t15, the pattern light of the fourth luminance is irradiated to the printed substrate 1 from the fourth illumination 14D. At this time, the range corresponding to the coordinates P16 to P32 of the printed circuit board 1 is within the imaging range W of the camera 15, and the image data G16 of the range is acquired.
在從攝影定時t16經過預定時間△t的定時，再次進行和上述攝影定時t1的處理同樣的處理。以後，反覆進行和上述攝影定時t1~t16的處理同樣的處理。At the timing when the predetermined time Δt elapses from the photographing timing t16, the same processing as that of the above-described photographing timing t1 is performed again. Thereafter, the same processing as the processing of the above-described photographing timings t1 to t16 is repeatedly performed.
如此一來，若取得關於印刷基板1的預定座標位置的所有資料，則執行將上述各圖像資料G1~G16的座標位置進行對位的對位處理(參照第6圖)。執行此種處理的功能構成本實施形態的對位手段。第6圖為概略地顯示將在攝影定時t1~t16取得的複數個圖像資料G1~G16的座標位置進行對位的狀態的圖表。In this way, when all the information on the predetermined coordinate position of the printed substrate 1 is acquired, the alignment processing for aligning the coordinate positions of the image data G1 to G16 described above is performed (see FIG. 6). The function of performing such processing constitutes the alignment means of the present embodiment. Fig. 6 is a graph schematically showing a state in which the coordinate positions of the plurality of image data G1 to G16 acquired at the imaging timings t1 to t16 are aligned.
接著，將關於複數個圖像資料G1~G16的同一座標位置的各資料歸納為各座標位置後，整理為預先設定的各群組，記憶於運算結果記憶裝置25(參照第7圖)。第7圖為概略地顯示將關於第6圖所示的印刷基板1的各座標位置的各資料經整理並重新排列為預先設定的各群組的狀態的圖表。然而，在第7圖中，僅例示關於座標P17的部分。Next, each piece of data of the same coordinate position of the plurality of pieces of image data G1 to G16 is classified into respective coordinate positions, and then arranged into a predetermined group and stored in the calculation result memory device 25 (see FIG. 7). Fig. 7 is a graph schematically showing a state in which each piece of data of each coordinate position of the printed circuit board 1 shown in Fig. 6 is arranged and rearranged into a predetermined group. However, in Fig. 7, only the portion regarding the coordinate P17 is exemplified.
在本實施形態中，關於印刷基板1的各座標位置，係分成以下四種群組資料而被記憶：在第一亮度的圖案光下所拍攝，由該圖案光的相位各偏移90°的四種資料(圖像資料G1、G5、G9、G13)構成的第一群組資料；在第二亮度的圖案光下所拍攝，由該圖案光的相位各偏移90°的四種資料(圖像資料G2、G6、G10、G14)構成的第二群組資料；在第三亮度的圖案光下所拍攝，由該圖案光的相位各偏移90°的四種資料(圖像資料G3、G7、G11、G15)構成的第三群組資料；在第四亮度的圖案光下所拍攝，由該圖案光的相位各偏移90°的四種資料(圖像資料G4、G8、G12、G16)構成的第四群組資料。此處，各群組資料分別相當於本實施形態的圖像資料組， 取得此等圖像資料組的處理功能構成圖像資料取得手段。In the present embodiment, the coordinate positions of the printed circuit board 1 are divided into the following four types of group data: they are captured under the pattern light of the first brightness, and the phases of the pattern light are shifted by 90° each. The first group of data composed of four kinds of materials (image data G1, G5, G9, G13); four kinds of data which are captured by the pattern light of the second brightness and shifted by 90° from the phase of the pattern light ( The second group data composed of the image data G2, G6, G10, G14); the four kinds of data (the image data G3) which are captured by the pattern light of the third brightness by 90° each , G7, G11, G15) The third group of data; the four colors of the pattern light are offset by 90° (image data G4, G8, G12) , G16) constitute the fourth group of materials. Here, each group data is equivalent to the image data group of the present embodiment, respectively. The processing function of obtaining these image data sets constitutes an image data obtaining means.
此處，將關於焊料印刷區域中的預定座標位置的十六種資料(亮度值)一具體例顯示於第8圖。在第8圖所示之例中，第三及第四群組資料之中，圖案光從初始相位的位移量對應於〔0°〕及〔90°〕之處的亮度值成為相當於飽和位準的「255」(參照附有散點圖案的部分)。Here, a specific example of sixteen kinds of data (luminance values) regarding a predetermined coordinate position in the solder printing area is shown in FIG. In the example shown in Fig. 8, among the third and fourth group data, the luminance value of the pattern light from the initial phase corresponding to [0°] and [90°] becomes equivalent to the saturation bit. The standard "255" (refer to the part with the scatter pattern attached).
然而，關於亮度值成為飽和位準「255」，即亮度飽和狀態的上述地方，實際射入攝影機15之光的亮度位準與被記憶作為圖像資料的亮度值也有不成比例的可能性。例如，如第9圖所例示，也有入射光的亮度位準為相當於亮度值「255」的位準以上的可能性。再者，關於第9圖所示的上述地方之值為將入射光的亮度位準置換成對應於其他部分的256階度的資料之值的理論上的數值。However, as for the above-mentioned place where the luminance value becomes the saturation level "255", that is, the luminance saturation state, the luminance level of the light actually incident on the camera 15 is also disproportionate to the luminance value memorized as the image data. For example, as exemplified in FIG. 9, there is a possibility that the luminance level of the incident light is equal to or higher than the level of the luminance value "255". Further, the value of the above-described place shown in Fig. 9 is a theoretical value in which the luminance level of the incident light is replaced with the value of the data of 256 gradations corresponding to the other portion.
於是，其次，就印刷基板1的各座標位置，判定包含於上述四個群組的四種資料(總計十六種的圖像資料G1~G16)的亮度值之值是否分別包含於預先設定的有效範圍H內。執行此種判定處理的功能構成本實施形態的判定手段。Then, with respect to each coordinate position of the printed substrate 1, it is determined whether or not the values of the luminance values of the four types of data (the total of sixteen types of image data G1 to G16) included in the above four groups are respectively included in the preset Within the valid range H. The function of executing such determination processing constitutes the determination means of the present embodiment.
在本實施形態中，判定亮度值是否包含於「11」以上「254」以下的範圍(參照第8圖)。In the present embodiment, it is determined whether or not the luminance value is included in the range of "11" or more and "254" or less (see Fig. 8).
接著，對印刷基板1的各座標位置，從四個群組資料之中抽出圖像資料G1~G16的各像素的亮度 值在上述有效範圍H(11≦H≦254)內的群組資料。藉此，從作為進行三維測定的基礎的資料中排除含有成為亮度飽和狀態的圖像資料的群組資料。執行此種抽出處理的功能構成本實施形態的抽出手段。Next, the brightness of each pixel of the image data G1 to G16 is extracted from the four group data for each coordinate position of the printed substrate 1. Group data with values in the above valid range H (11≦H≦254). Thereby, the group data containing the image data in the state of the brightness saturation is excluded from the data which is the basis for the three-dimensional measurement. The function of performing such extraction processing constitutes the extraction means of the present embodiment.
在第8圖所示之例方面，抽出在第二亮度的圖案光下所拍攝的第二群組資料。再者，在圖像資料的各像素的亮度值在有效範圍H內的群組資料有複數個的情況(也包含全部四個群組資料的情況)，抽出在上述複數種的圖案光之中照射亮度最高的圖案光下所拍攝的群組資料。例如，在全部的群組資料滿足上述條件的情況，抽出在第四亮度的圖案光下所拍攝的第四群組資料。In the example shown in Fig. 8, the second group of materials taken under the pattern light of the second brightness is extracted. In addition, when there are a plurality of group data in which the luminance value of each pixel of the image data is within the effective range H (including the case of all four group materials), the pattern light is extracted among the plurality of patterns. The group data taken under the pattern light with the highest brightness. For example, in a case where all the group materials satisfy the above conditions, the fourth group data captured under the pattern light of the fourth brightness is extracted.
其次，控制裝置16基於上述抽出的群組資料，利用在先前技術中也出示的眾所周知的相位位移法進行各座標的高度測定。然後，藉由對各座標反覆進行該處理，計算整個印刷基板1的高度資料記憶於運算結果記憶裝置25作為該印刷基板1的三維資料。此種處理功能構成本實施形態的三維測定手段。Next, the control device 16 performs height measurement of each coordinate based on the extracted group data using a well-known phase shift method also shown in the prior art. Then, by performing the processing on each of the coordinates, the height data of the entire printed substrate 1 is calculated and stored in the three-dimensional data of the operation result memory device 25 as the printed substrate 1. Such a processing function constitutes the three-dimensional measuring means of the present embodiment.
然後，以如上述所得到的測定結果為基礎而進行糊狀焊料4的印刷狀態的好壞判定。具體而言，檢測高度比高度基準面超過預定長度的糊狀焊料4的印刷範圍，計算此範圍內的部位的體積。然後，將該體積和預先設定的基準值比較判定，藉由此比較結果是否在容許範圍內，來判定該糊狀焊料4的印刷狀態的好壞。Then, based on the measurement results obtained as described above, the quality of the printed state of the cream solder 4 is determined. Specifically, the printing range of the cream solder 4 whose height is longer than the height reference plane by a predetermined length is detected, and the volume of the portion within the range is calculated. Then, the volume is compared with a predetermined reference value to determine whether the printed state of the cream solder 4 is good or not because the comparison result is within the allowable range.
如以上詳述，在本實施形態中，對於被連續搬送的印刷基板1照射具有條紋狀的光強度分布的圖 案光，被照射該圖案光的印刷基板1每當被搬送預定量就被攝影機15攝影。藉此，可取得被照射的圖案光的相位各π /2不同的四種圖像資料。然後，以此等圖像資料為基礎而進行印刷基板1的三維測定。As described in detail above, in the present embodiment, the printed circuit board 1 that has been continuously transported is irradiated with pattern light having a stripe-shaped light intensity distribution, and the printed circuit board 1 irradiated with the pattern light is carried by the camera 15 every time a predetermined amount is transported. photography. Thereby, four kinds of image data in which the phase of the irradiated pattern light is different by π /2 can be obtained. Then, three-dimensional measurement of the printed substrate 1 is performed based on the image data.
再者，在本實施形態中，在亮度不同的四種圖案光下取得複數組由四種圖像資料構成的群組資料。然後，判定對應於印刷基板1上的各座標位置之圖像資料的各像素的亮度值是否包含在預先設定的有效範圍H內，並且對印刷基板1的各座標位置，從四個群組資料中抽出圖像資料的各像素的亮度值在有效範圍H內的群組資料，以該所抽出的群組資料為基礎，利用相位位移法進行關於印刷基板1的各座標位置的三維測定。Furthermore, in the present embodiment, group data composed of four kinds of image data in a complex array is obtained under four kinds of pattern lights having different luminances. Then, it is determined whether or not the luminance value of each pixel corresponding to the image data of each coordinate position on the printed substrate 1 is included in the preset effective range H, and the coordinate positions of the printed substrate 1 are from four group data. The group data in which the luminance value of each pixel of the image data is extracted in the effective range H is three-dimensionally measured on the coordinate position of the printed substrate 1 by the phase shift method based on the extracted group data.
結果，可對印刷基板1的各座標位置，使用更加適當的亮度的圖像資料進行三維測定，可謀求測定精度的提高。As a result, three-dimensional measurement can be performed on the coordinate positions of the printed substrate 1 using image data of more appropriate brightness, and the measurement accuracy can be improved.
再者，也可以不受上述實施形態的記載內容限定，而例如如下般地實施。以下不例示的其他應用例、變更例也當然可實施。Further, it is not limited to the description of the above embodiment, and may be implemented, for example, as follows. Other application examples and modifications not illustrated below can of course be implemented.
(a)在上述實施形態方面，係將三維測定裝置具體化成測定印刷形成於印刷基板1上的糊狀焊料4高度的基板檢查裝置10，但不限於此，也可以具體化成例如測定印刷於基板上的焊料凸塊或安裝於基板上的電子零件等其他構件高度的構造。(a) In the above embodiment, the three-dimensional measuring device is embodied as a substrate inspecting device 10 for measuring the height of the cream solder 4 formed on the printed circuit board 1. However, the present invention is not limited thereto, and may be embodied, for example, to be printed on a substrate. The height of the solder bumps or other components such as electronic components mounted on the substrate.
(b)在上述實施形態的相位位移法方面，係成為使圖案光的相位每四分之一間距變化的構造，但不 限於此，也可以形成使圖案光的相位每三分之一間距變化的構造。(b) In the phase shift method of the above embodiment, the phase of the pattern light is changed by a quarter pitch, but In addition to this, it is also possible to form a structure in which the phase of the pattern light is changed every one-third of the pitch.
(c)照明裝置14的構造並不受上述實施形態限定。例如，在上述實施形態方面，係成為具備照射亮度不同的四個照明(光源)的構造，但除此之外，也可以採用具備一個光源，適當變更控制其照射亮度的構造。(c) The configuration of the illumination device 14 is not limited to the above embodiment. For example, in the above-described embodiment, four illuminations (light sources) having different illumination luminances are provided. However, in addition to the above, a configuration may be adopted in which one light source is provided and the illumination luminance is controlled as appropriate.
此外，各照明14A~14D的照射亮度也不受上述實施形態限定，例如亦可將第一亮度設定為「100(cd/m2)」、將第二亮度設定為「200(cd/m2)」、將第三亮度設定為「300(cd/m2)」、將第四亮度設定為「400(cd/m2)」等和上述實施形態不同的設定。Further, the illumination brightness of each of the illuminations 14A to 14D is not limited to the above embodiment, and for example, the first brightness may be set to "100 (cd/m2)" and the second brightness may be set to "200 (cd/m2)" The third brightness is set to "300 (cd/m2)", and the fourth brightness is set to "400 (cd/m2)" and the like, which is different from the above embodiment.
(d)攝影機15的構造並不受上述實施形態限定。例如，也可以採用使用CMOS感測器的攝影機等作為攝影元件。此外，關於攝影機15的輸出階度，也不限於上述實施形態的256階度，也可以是例如1024階度等和上述實施形態不同的設定。(d) The structure of the camera 15 is not limited to the above embodiment. For example, a camera or the like using a CMOS sensor may be employed as the imaging element. Further, the output gradation of the camera 15 is not limited to the 256th degree of the above embodiment, and may be a setting different from the above embodiment, for example, 1024 gradation.
(e)在上述實施形態方面，係成為下述構造：當判定對應於印刷基板1上的各座標位置之圖像資料G1~G16的各像素的亮度值是否包含在預先設定的有效範圍H內時，係判定上限值是否是比相當於飽和位準的值「255」更小的「254」以下。上限值並不受此值限定，也可以設定為不同的值。(e) In the above-described embodiment, it is determined whether or not the luminance value of each pixel corresponding to the image data G1 to G16 of each coordinate position on the printed circuit board 1 is included in the preset effective range H. When it is determined whether or not the upper limit value is "254" or less smaller than the value "255" corresponding to the saturation level. The upper limit value is not limited by this value, and may be set to a different value.
此外，在上述實施形態方面，係設定比可得到圖像資料G1~G16的各像素的亮度值之下限值「0」更大的值即「11」作為有效範圍H之下限值，但此下限 值並不受此值限定，也可以設定為不同的值。再者，關於下限，由於不產生如上限的亮度飽和等的缺點，所以也可以是以有效範圍H之下限值為「0」，即不設定下限值的構造。Further, in the above-described embodiment, "11" which is a value larger than the lower limit value "0" of the luminance value of each pixel of the image data G1 to G16 is set as the lower limit of the effective range H, but This lower limit Values are not limited by this value and can be set to different values. In addition, as for the lower limit, since there is no disadvantage such as luminance saturation such as the upper limit, the lower limit of the effective range H may be "0", that is, the lower limit value may not be set.
(f)在上述實施形態方面，係成為下述構造：當抽出圖像資料G1~G16的各像素的亮度值在有效範圍H內的群組資料時，取得在亮度不同的四種圖案光下拍攝的四個群組資料，但群組資料的數量並不受此數量限定，若有兩個以上即可。(f) In the above-described embodiment, when the group data in which the luminance values of the pixels of the image data G1 to G16 are within the effective range H are extracted, the four patterns of light having different luminances are obtained. The four groups of data are taken, but the number of group data is not limited by this number, if there are more than two.
(g)在上述實施形態方面，係成為下述構造：在圖像資料的各像素的亮度值在有效範圍H內的群組資料有複數個的情況，抽出在四種圖案光之中照射亮度最高的圖案光下所拍攝的群組資料。使用於三維測定的群組資料的抽出方法並不受此方法限定，也可以採用不同的方法。(g) In the above-described embodiment, when there are a plurality of group data in which the luminance value of each pixel of the image data is within the effective range H, the luminance is extracted among the four pattern lights. Group data taken under the highest pattern light. The extraction method of the group data used for the three-dimensional measurement is not limited by this method, and different methods may be employed.
例如，也可以是下述構造：在圖像資料的各像素的亮度值在有效範圍H內的群組資料有複數個的情況，計算該複數個群組資料的平均值，以該群組資料的平均值為基礎而進行三維測定。此處，計算群組資料的平均值的處理功能構成本實施形態的平均值計算手段。For example, the configuration may be such that when there are a plurality of group data in which the luminance value of each pixel of the image data is within the effective range H, the average value of the plurality of group data is calculated, and the group data is used. The three-dimensional measurement is based on the average value. Here, the processing function for calculating the average value of the group data constitutes the average value calculating means of the present embodiment.
(h)在上述實施形態方面，係採用相位位移法作為使用圖案光的三維測定方法，但除此之外，也可以採用空間編碼法或疊紋(moire)法、聚焦法等之類的各種三維測定方法。(h) In the above embodiment, the phase shift method is employed as the three-dimensional measuring method using the pattern light, but other methods such as a space encoding method, a moire method, a focusing method, and the like may be employed. Three-dimensional measurement method.
1‧‧‧印刷基板1‧‧‧Printing substrate
10‧‧‧基板檢查裝置10‧‧‧Substrate inspection device
13‧‧‧輸送帶13‧‧‧Conveyor belt
14‧‧‧照明裝置14‧‧‧Lighting device
14A‧‧‧第一照明14A‧‧‧First lighting
14B‧‧‧第二照明14B‧‧‧second lighting
14C‧‧‧第三照明14C‧‧‧3rd illumination
14D‧‧‧第四照明14D‧‧‧fourth illumination
15‧‧‧攝影機15‧‧‧ camera
W‧‧‧攝影範圍W‧‧‧Photography range
Claims (13)
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| TWI481814B true TWI481814B (en) | 2015-04-21 |
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