TWI580927B - Three - dimensional measuring device and three - dimensional measurement method - Google Patents

Three - dimensional measuring device and three - dimensional measurement method Download PDF

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TWI580927B
TWI580927B TW104139308A TW104139308A TWI580927B TW I580927 B TWI580927 B TW I580927B TW 104139308 A TW104139308 A TW 104139308A TW 104139308 A TW104139308 A TW 104139308A TW I580927 B TWI580927 B TW I580927B
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light
offset
gain
light pattern
relationship
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TW201640076A (en
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Tsuyoshi Ohyama
Norihiko Sakaida
Ikuo Futamura
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Ckd Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object

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  • Length Measuring Devices By Optical Means (AREA)

Description

三維測量裝置及三維測量方法 Three-dimensional measuring device and three-dimensional measuring method

本發明係有關利用相移(phase shift)法進行高度測量的三維測量裝置及三維測量方法。 The present invention relates to a three-dimensional measuring apparatus and a three-dimensional measuring method for performing height measurement using a phase shift method.

一般而言，在將電子零件安裝至印刷基板上時，先是將焊膏(cream solder)印刷至配設在印刷基板上的預定之電極圖案(pattern)上。接著，利用該焊膏的黏性，將電子零件初步固定在印刷基板上。然後，將前述印刷基板送進迴焊(reflow)爐，經預定之迴焊步驟，藉此而進行焊接。最近，有必須在送進迴焊爐前的階段檢查焊膏的印刷狀態而於進行該檢查時使用三維測量裝置。 In general, when an electronic component is mounted on a printed substrate, cream solder is first printed onto a predetermined electrode pattern disposed on the printed substrate. Next, the electronic component is initially fixed on the printed substrate by the adhesiveness of the solder paste. Then, the printed substrate is fed into a reflow furnace and subjected to a predetermined reflow step, whereby welding is performed. Recently, it is necessary to check the printing state of the solder paste at the stage before feeding to the reflow furnace, and to use the three-dimensional measuring device when performing the inspection.

近年來，有提出許多種使用光之所謂非接觸式的三維測量裝置，例如有提出使用相移法的三維測量裝置的相關技術。 In recent years, there have been proposed a variety of so-called non-contact three-dimensional measuring devices using light, for example, a related art that proposes a three-dimensional measuring device using a phase shift method.

在該利用相移法的三維測量裝置中，係由光源與光柵之組合構成照射手段，藉由該照射手段，將光圖案照射至被測量物(在本例中為印刷基板)，該光源係發出預定之光、該光柵係將來自該光源的光轉換成具正弦波狀(條紋狀)光強度分布的光圖案。接著，使用配置在正上方的攝像手段觀測基板上的點。就攝像手段而 言，使用由透鏡(lens)及攝像元件等構成的CCD(Charge Coupled Device；電荷耦合元件)攝像機(camera)等。 In the three-dimensional measuring apparatus using the phase shift method, a combination of a light source and a grating constitutes an irradiation means, and the light pattern is irradiated to the object to be measured (in this example, a printed substrate) by the irradiation means, the light source system The predetermined light is emitted, and the grating converts light from the light source into a light pattern having a sinusoidal (striped) light intensity distribution. Next, the dots on the substrate are observed using an imaging means disposed directly above. As for the camera In other words, a CCD (Charge Coupled Device) camera or the like composed of a lens and an imaging element is used.

在上述構成下，藉由攝像手段拍攝到的圖像資料(data)上的各像素的光的強度(亮度)I係以下式(T1)給定。 In the above configuration, the intensity (brightness) I of the light of each pixel on the image data captured by the imaging means is given by the following formula (T1).

式中，f：增益(gain)，e：偏移(offset)，：於該像素的正弦波的相位角。 Where f: gain, e: offset, : The phase angle of the sine wave at the pixel.

此處，藉由對上述光柵進行切換控制，令光圖案的相位例如以四步(+0、+90°、+180°、+270°)變化，取得具有與該些四步變化對應的強度分布I0、I1、I2、I3之圖像資料，根據下式(T2)而消除f(增益)與e(偏移)，求取相位角。 Here, by switching the grating to control, the phase of the light pattern is, for example, in four steps ( +0, +90°, +180°, +270°) change, obtain image data having intensity distributions I 0 , I 1 , I 2 , I 3 corresponding to the four-step changes, and eliminate f (gain) and e (bias) according to the following formula (T2) Move) to find the phase angle .

接著，使用該相位角，根據三角量測的原理，算出印刷基板(焊膏)上的被測量座標(X,Y)的高度(Z)(參照例如下述之專利文獻1)。 Then, use the phase angle The height (Z) of the measured coordinates (X, Y) on the printed circuit board (solder paste) is calculated based on the principle of the triangular measurement (see, for example, Patent Document 1 below).

被測量座標(X,Y)的相位角係依其高度而變化，例如，當該座標(X,Y)的高度(Z)為「0」時，照射至該座標(X,Y)的圖案光的相位角會成為「0°」，當為具有預定之高度時，相位角會成為「10°」。 Phase angle of the measured coordinate (X, Y) The system varies depending on its height. For example, when the height (Z) of the coordinate (X, Y) is "0", the phase angle of the pattern light that is irradiated to the coordinate (X, Y) Will become "0°", when it has a predetermined height, the phase angle Will become "10 °".

相對於此，近年來亦有人提出令光圖案的相位以三步變化而從三張圖像資料取得相位角之技術(參照例如下述之專利文獻2)。 In contrast, in recent years, it has also been proposed to obtain the phase angle of the phase of the light pattern from three image data in three steps. The technique (see, for example, Patent Document 2 below).

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1 日本國特開平5-280945號公報 Patent Document 1 Japanese Patent Laid-Open No. 5-280945

專利文獻2 日本國特開2002-81924號公報 Patent Document 2 Japanese Patent Laid-Open Publication No. 2002-81924

然而，在習知技術的三維測量裝置中，係必須令相位以四步或三步變化，拍攝四張或三張具有與該些步對應的強度分布之圖像。亦即，針對一個點必須進行四次或三次攝像，故需要花時間在攝像上，而有測量時間拉長之虞。因此，係冀盼測量時間的進一步短縮化。 However, in the conventional three-dimensional measuring apparatus, it is necessary to change the phase in four or three steps to take four or three images having intensity distributions corresponding to the steps. That is, four or three times of imaging must be performed for one point, so it takes time to take a picture, and there is a time for the measurement time to elongate. Therefore, it is expected that the measurement time will be further shortened.

另外，上述課題未必僅會存在於印刷在印刷基板上的焊膏等的高度測量，亦存在於其他三維測量裝置的領域裡。 Further, the above-described problems do not necessarily exist only in the height measurement of solder paste or the like printed on a printed substrate, but also exist in the field of other three-dimensional measuring devices.

本發明乃係鑒於上述情事而研創，目的在於提供能夠在利用相移法進行高度測量時謀求測量時間的短縮化之三維測量裝置及三維測量方法。 The present invention has been made in view of the above circumstances, and an object of the invention is to provide a three-dimensional measuring apparatus and a three-dimensional measuring method capable of reducing the measurement time in height measurement by the phase shift method.

以下，針對解決上述課題的各較佳手段，分項進行說明。另外，視需要，為相對應的手段附註其特有的作用效果。 Hereinafter, each of the preferable means for solving the above problems will be described in detail. In addition, if necessary, note the unique effects of the corresponding means.

手段1.一種三維測量裝置，係具備： 照射手段，係具有發出預定之光的光源及將來自該光源的光轉換成具條紋狀光強度分布的光圖案之光柵，能夠對至少被測量物照射該光圖案；相位控制手段，係控制前述光柵的移送或切換，能夠將從前述照射手段照射的前述光圖案的相位變化複數種；攝像手段，係能夠拍攝來自受到前述光圖案照射的前述被測量物之反射光；及圖像處理手段，係能夠根據藉由前述攝像手段拍攝到的圖像資料而執行前述被測量物的三維測量；前述圖像處理手段係藉由利用：藉由預定之攝像條件而定的前述光圖案的增益及偏移之關係；及根據前述圖像資料上的被測量座標的亮度值而定的該被測量座標的前述光圖案的增益或偏移之值；而能夠根據在變化有兩種相位的前述光圖案下拍攝到的兩張圖像資料，藉由相移法執行前述被測量座標的高度測量。 Means 1. A three-dimensional measuring device having: The irradiation means is a light source that emits predetermined light and a grating that converts light from the light source into a light pattern having a stripe-shaped light intensity distribution, and is capable of irradiating at least the object to be measured with the light pattern; and the phase control means controls the foregoing The transfer or switching of the grating can change a plurality of phases of the light pattern irradiated from the irradiation means; and the imaging means can capture the reflected light from the object to be measured irradiated by the light pattern; and an image processing means. The three-dimensional measurement of the object to be measured can be performed based on the image data captured by the imaging means; the image processing means utilizes the gain and bias of the light pattern by predetermined imaging conditions. And a value of the gain or offset of the light pattern of the measured coordinate according to the brightness value of the measured coordinate on the image data; and the light pattern having two phases according to the change The two image data captured below are subjected to the height measurement of the aforementioned measured coordinates by the phase shift method.

依據上述手段1，係藉由利用：藉由預定之攝像條件而定的光圖案的增益A及偏移B之關係[例如A=K(比例常數)×B]、及根據圖像資料上的被測量座標(x,y)的亮度值V(x,y)而定的該被測量座標(x,y)的光圖案的增益A(x,y)或偏移B(x,y)之值，而能夠根據在變化有兩種相位的光圖案下拍攝到的兩張圖像資料，藉由相移法進行被測量座標的高度測量。 According to the above means 1, the relationship between the gain A and the offset B of the light pattern determined by predetermined imaging conditions [for example, A = K (proportional constant) × B], and based on image data The gain A(x, y) or the offset B(x, y) of the light pattern of the measured coordinate (x, y) determined by the luminance value V(x, y) of the measured coordinate (x, y) The value can be measured by the phase shift method based on the two image data captured under the light pattern having two phases.

如上述，在本手段中，由於能夠根據兩張圖像資料進行被測量物的高度測量，因此相較於針對一個點需要四次或三次攝像的習知技術，能以較少之總攝像次數完成，從而能夠縮短攝像時間。就結果而言，能夠飛躍性地縮短測量時間。 As described above, in the present method, since the height measurement of the object to be measured can be performed based on the two image data, the total number of images can be reduced as compared with the conventional technique that requires four or three times of imaging for one point. Finished, which can shorten the recording time. As a result, the measurement time can be dramatically shortened.

另外，從光源照射的光係首先於通過光柵時衰減，接著於在被測量物反射時再次衰減，最後於在攝像手段進行A/D轉換(類比(analog)-數位(digital)轉換)時再次衰減，然後才獲取作為圖像資料的各像素的亮度值。 Further, the light system irradiated from the light source is first attenuated when passing through the grating, then attenuated again when reflected by the object to be measured, and finally again when performing A/D conversion (analog-digital conversion) at the imaging means. Attenuation, and then the luminance value of each pixel as the image data is acquired.

因此，藉由攝像手段拍攝到的圖像資料的各像素的亮度值係能夠藉由將光源的明亮度、從光源照射的光通過光柵時的衰減率、光在被測量物反射時的反射率、在攝像手段中進行A/D轉換(類比-數位轉換)時的轉換效率等全部相乘來表現。 Therefore, the luminance value of each pixel of the image data captured by the imaging means can be obtained by the brightness of the light source, the attenuation rate when the light irradiated from the light source passes through the grating, and the reflectance when the light is reflected by the object to be measured. The conversion efficiency at the time of performing A/D conversion (analog-digital conversion) in the imaging means is multiplied and expressed.

例如，當設各項目如下：光源(均勻光)的明亮度：L For example, when setting each item as follows: Brightness of light source (uniform light): L

光柵的透射率：G=αsinθ+β Transmittance of the grating: G = αsin θ + β

α、β為任意常數。 α and β are arbitrary constants.

被測量物上的座標(x,y)的反射率：R(x,y) Reflectivity of coordinates (x, y) on the object to be measured: R(x, y)

攝像手段(攝像元件)的各像素的轉換效率：E Conversion efficiency of each pixel of the imaging means (imaging element): E

與被測量物上的座標(x,y)對應的圖像上的像素的亮度值：V(x,y) The brightness value of the pixel on the image corresponding to the coordinate (x, y) on the object to be measured: V(x, y)

被測量物上的座標(x,y)的光圖案的增益：A(x,y) Gain of the light pattern of the coordinates (x, y) on the object to be measured: A(x, y)

被測量物上的座標(x,y)的光圖案的偏移：B(x,y) Offset of the light pattern of the coordinates (x, y) on the object to be measured: B(x, y)

此時，亮度值能夠以下式(F1)表示。 At this time, the luminance value can be expressed by the following formula (F1).

數1 V(x,y)=L×G×R(x,y)×E =A(x,y)sin θ+B(x,y)．．．(F1) The number 1 V(x, y) = L × G × R (x, y) × E = A (x, y) sin θ + B (x, y). . . (F1)

此處，增益A(x,y)係能夠以「sinθ=1」的光產生的亮度值V(x,y)MAX與「sinθ=-1」的光產生的亮度值V(x,y)MIN之差來表示，因此，例如，當設：光柵在θ=0時的透射率(=平均透射率)：Gθ=0 Here, the gain A(x, y) is a luminance value V(x, y) which can be generated by the light value V(x, y) MAX generated by the light of "sin θ = 1" and the light of "sin θ = -1". The difference between MIN is expressed, for example, when: the transmittance of the grating at θ = 0 (= average transmittance): Gθ =0

光柵在θ=π/2時的透射率(=最大透射率)：Gθ=π/2 Transmittance of grating at θ = π/2 (= maximum transmittance): Gθ = π /2

光柵在θ=-π/2時的透射率(=最小透射率)：Gθ=-π/2 Transmittance of grating at θ=-π/2 (=minimum transmittance): Gθ =- π /2

此時，增益A(x,y)能夠以下式(F2)表示。 At this time, the gain A(x, y) can be expressed by the following formula (F2).

數2 A(x,y)={(L×G θ=π/2×R(x,y)×E)-(L×G θ=-π/2×R(x,y)×E)}/2 ={(L×R(x,y)×E)×(G θ=π/2-G θ=-π/2)}/2．．．(F2) Number 2 A(x,y)={(L×G θ =π/2 ×R(x,y)×E)-(L×G θ =−π/2 ×R(x,y)×E) }/2 ={(L×R(x,y)×E)×(G θ =π/2 -G θ =-π/2 )}/2. . . (F2)

此外，偏移B(x,y)乃係「sinθ=0」的光的亮度值V(x,y)，即「sinθ=1」的光產生的亮度值V(x,y)MAX與「sinθ=-1」的光產生的亮度值V(x,y)MIN之平均值，因此能夠以下式(F3)表示。 Further, the offset B(x, y) is the luminance value V(x, y) of the light of "sin θ = 0", that is, the luminance value V(x, y) MAX generated by the light of "sin θ = 1" and " The average value of the luminance value V(x, y) MIN generated by the light of sin θ = -1" can be expressed by the following formula (F3).

數3 B(x,y)=L×G θ=0×R(x,y)×E ={(L×G θ=π/2×R(x,y)×E)+(L×G θ=-π/2×R(x,y)×E)}/2 ={(L×R(x,y)×E)×(G θ=π/2+G θ=-π/2)}/2．．．(F3) Number 3 B(x,y)=L×G θ =0 ×R(x,y)×E ={(L×G θ =π/2 ×R(x,y)×E)+(L×G θ = -π/2 × R(x, y) × E)}/2 = {(L × R(x, y) × E) × (G θ = π/2 + G θ = -π/2 ) }/2. . . (F3)

亦即，亮度值的最大值V(x,y)MAX、最小值V(x,y)MIN、平均值V(x,y)AV係能夠分別以下式(F4)、(F5)、(F6)表示，成為如第3圖的線圖(graph)所示之關係。 That is, the maximum value of the luminance value V(x, y) MAX , the minimum value V(x, y) MIN , and the average value V(x, y) AV can be expressed by the following equations (F4), (F5), (F6, respectively). ) indicates that the relationship is as shown by the graph in Fig. 3.

數4 V(x,y)MAX=(L×G θ=π/2×R(x,y)×E)=B(x,y)+A(x,y)．．．(F4) V(x,y)MIN=(L×G θ=-π/2×R(x,y)×E)=B(x,y)-A(x,y)．．．(F5) V(x,y)AV=(L×R(x,y)×E)×(G θ=π/2+G θ=-π/2)/2=B(x,y)．．．(F6) The number 4 V(x, y) MAX = (L × G θ = π / 2 × R (x, y) × E) = B (x, y) + A (x, y). . . (F4) V(x, y) MIN = (L × G θ = -π/2 × R(x, y) × E) = B(x, y) - A(x, y). . . (F5) V(x, y) AV = (L × R(x, y) × E) × (G θ = π/2 + G θ = -π/2 ) / 2 = B (x, y). . . (F6)

從第3圖可以看出，預定之座標(x,y)的亮度值的最大值V(x,y)MAX與亮度值的最小值V(x,y)MIN之平均值V(x,y)AV成為偏移B(x,y)，該偏移B(x,y)與最大值V(x,y)MAX之差及該偏移B(x,y)與最小值V(x,y)MIN之差分別成為增益A(x,y)。 As can be seen from Fig. 3, the maximum value of the luminance value of the predetermined coordinate (x, y), V(x, y) MAX, and the minimum value of the luminance value V(x, y) MIN, the average value V (x, y) AV becomes the offset B(x, y), the difference between the offset B(x, y) and the maximum value V(x, y) MAX and the offset B(x, y) and the minimum value V(x, y) The difference between MIN becomes the gain A(x, y).

此外，亮度值V(x,y)係與光源的明亮度L或反射率R(x,y)成比例地變化，因此，例如在反射率R成為一半的座標位置上，增益A和偏移B的值亦成為一半。 Further, the luminance value V(x, y) changes in proportion to the brightness L of the light source or the reflectance R(x, y), and therefore, for example, at a coordinate position where the reflectance R becomes half, the gain A and the offset The value of B is also half.

接著，先將上述式(F2)、(F3)調整成下式(F2')、(F3')，再整合兩式，便導出下式(F7)。 Next, the above formulas (F2) and (F3) are first adjusted to the following formulas (F2 ' ) and (F3 ' ), and then the two equations are integrated to derive the following formula (F7).

數5 2 A(x,y)/(G θ=π/2-G θ=-π/2)=(L×R(x,y)×E)．．．(F2′) 2 B(x,y)/(G θ=π/2+G θ=-π/2)=(L×R(x,y)×E)．．．(F3′) 2 A(x,y)/(G θ=π/2-G θ=-π/2)=2 B(x,y)/(G θ=π/2+G θ=-π/2)．．．(F7) The number 5 2 A(x, y) / (G θ = π/2 - G θ = -π/2 ) = (L × R (x, y) × E). . . (F2') 2 B(x,y)/(G θ =π/2 +G θ =-π/2 )=(L×R(x,y)×E). . . (F3') 2 A(x,y)/(G θ =π/2 -G θ =-π/2 )=2 B(x,y)/(G θ =π/2 +G θ =-π /2 ). . . (F7)

接著，針對A(x,y)解上述式(F7)，即成為下式(F8)，能夠表示如第4圖所示的線圖。 Next, the above formula (F7) is solved for A(x, y), that is, the following formula (F8), and the line graph shown in Fig. 4 can be expressed.

數6 A(x,y)=B(x,y)×(G θ=π/2-G θ=-π/2)/(G θ=π/2+G θ=-π/2) =K×B(x,y)．．．(F8) Number 6 A(x,y)=B(x,y)×(G θ =π/2 -G θ =-π/2 )/(G θ =π/2 +G θ =-π/2 ) = K × B (x, y). . . (F8)

式中，比例常數K=(G θ=π/2-G θ=-π/2)/(G θ=π/2+G θ=-π/2) In the formula, the proportional constant K = (G θ = π / 2 - G θ = - π / 2 ) / (G θ = π / 2 + G θ = - π / 2 )

亦即，當將光源的明亮度L和反射率R(x,y)的其中一者固定、令另一者變化時，偏移B(x,y)發生增減，同時增益A(x,y)亦會與該偏移B(x,y)成比例地增減。藉由上式(F8)，只要知道增益A和偏移B的其中一者，便能夠求取另一者。此處，比例常數K係取決於光柵的透射率G，無關於光源的明亮度L和反射率R。亦即，能夠改以如下述的手段2、3的描述來表現。 That is, when one of the brightness L and the reflectance R(x, y) of the light source is fixed and the other is changed, the offset B(x, y) is increased or decreased, and the gain A(x, y) will also increase or decrease in proportion to the offset B(x, y). By the above formula (F8), as long as one of the gain A and the offset B is known, the other can be obtained. Here, the proportionality constant K depends on the transmittance G of the grating, regardless of the brightness L and the reflectance R of the light source. That is, it can be expressed by the description of the means 2 and 3 described below.

手段2.如前述手段1之三維測量裝置，其中前述增益及偏移之關係為前述增益與前述偏移相互為唯一性的關係。 The two-dimensional measuring apparatus according to the above aspect 1, wherein the relationship between the gain and the offset is a relationship in which the gain and the offset are unique to each other.

若增益A與偏移B相互為唯一性的關係，則例如藉由製作表示增益A與偏移B之關係的數值表或表資料(table data)，而能夠以增益A求得偏移B或以偏移B求得增益A。 If the gain A and the offset B are unique to each other, the offset B can be obtained by the gain A, for example, by creating a value table or table data indicating the relationship between the gain A and the offset B. The gain A is obtained by the offset B.

手段3.如前述手段1之三維測量裝置，其中關於前述增益及偏移之關係，前述增益與前述偏移為比例關係。 Means 3. The three-dimensional measuring apparatus according to the above aspect 1, wherein the gain is proportional to the offset with respect to the relationship between the gain and the offset.

若增益與偏移為比例關係，則例如能夠以如A=K×B+C[式中，C：攝像機的暗電流(偏移)]的關係式來表示，而能夠以增益A求得偏移B或以偏移B求得增益A。更甚者，係能夠採用如下述手段4的構成。 If the gain is proportional to the offset, for example, it can be expressed by a relational expression such as A=K×B+C [where C: dark current (offset) of the camera], and the gain A can be used to obtain the bias. Move B or find the gain A with offset B. Furthermore, the configuration of the following means 4 can be employed.

手段4.如前述手段1之三維測量裝置，其中設前述變化有兩種相位的光圖案的相對相位關係分別為0、γ，並設此時的前述兩張圖像資料的各像素的亮度值分別為V0、V1，此時，前述圖像處理手段係求取滿足下式(1)、(2)、(3)之關係的相位角θ，根據該相位角θ進行前述高度測量。 The method of claim 3, wherein the relative phase relationship of the light patterns having the two phases is 0 and γ, respectively, and the brightness values of the pixels of the two image data at the time are set. In the case of V 0 and V 1 , respectively, the image processing means obtains the phase angle θ satisfying the relationship of the following equations (1), (2), and (3), and performs the height measurement based on the phase angle θ.

V0=Asinθ+B…(1) V 0 =Asinθ+B...(1)

V1=Asin(θ+γ)+B…(2) V 1 =Asin(θ+γ)+B...(2)

A=KB…(3) A=KB...(3)

其中，γ≠0，A：增益，B：偏移，K：比例常數。 Where γ ≠ 0, A: gain, B: offset, K: proportional constant.

依據上述手段4，藉由將上述式(3)代入上述式(1)，便能夠導出下式(4)。 According to the above means 4, by substituting the above formula (3) into the above formula (1), the following formula (4) can be derived.

V0=KBsinθ+B…(4) V 0 = KBsin θ + B... (4)

針對偏移B解上述式(4)，即能夠導出下式(5)。 By solving the above equation (4) for the offset B, the following equation (5) can be derived.

B=V0/(Ksinθ+1)…(5) B=V 0 /(Ksinθ+1)...(5)

此外，藉由將上述式(3)代入上述式(2)，便能夠導出下式(6)。 Further, by substituting the above formula (3) into the above formula (2), the following formula (6) can be derived.

V1=KBsin(θ+γ)+B…(6) V 1 =KBsin(θ+γ)+B...(6)

將上述式(6)代入上述式(5)，如下述[數7]整理後，即能夠導出下式(7)。 Substituting the above formula (6) into the above formula (5), and sorting as described in the following [number 7], the following formula (7) can be derived.

數7 V1=K×{V0/(Ksin θ+1)}sin(θ+γ)+{V0/(Ksin θ+1)} V1×(Ksin θ+1)=KV0sin(θ+γ)+V0 =KV0{sin θ cos γ+sin γ cos θ}+V0 -V1Ksin θ+KV0cos γ sin θ+KV0sin γ cos θ+V0-V1=0 K(V0cos γ-V1)sin θ+KV0sin γ cos θ+(V0-V1)=0(V0cos γ-V1)sin θ+V0sin γ cos θ+(V0-V1)/K=0．．．(7) Number 7 V 1 =K×{V 0 /(Ksin θ +1)}sin( θ + γ )+{V 0 /(Ksin θ +1)} V 1 ×(Ksin θ +1)=KV 0 sin( θ + γ )+V 0 =KV 0 {sin θ cos γ +sin γ cos θ }+V 0 -V 1 Ksin θ +KV 0 cos γ sin θ +KV 0 sin γ cos θ +V 0 -V 1 = 0 K(V 0 cos γ -V 1 )sin θ +KV 0 sin γ cos θ +(V 0 -V 1 )=0(V 0 cos γ -V 1 )sin θ +V 0 sin γ cos θ +( V 0 -V 1 )/K=0. . . (7)

此處，令「V0cosγ-V1=a」、「V0sinγ=b」、「(V0-V1)/K=c」，上述式(7)即能夠表示如下式(8)。 Here, "V 0 cos γ - V 1 = a", "V 0 sin γ = b", and "(V 0 - V 1 ) / K = c", the above formula (7) can represent the following formula (8) .

a sinθ+b cosθ+c=0…(8) a sinθ+b cosθ+c=0...(8)

此處，如下述[數8]所示針對相位角θ解上述式(8)，即能夠導出下述[數9]所示的下式(9)。 Here, as shown in the following [Equation 8], the above formula (8) is solved for the phase angle θ, that is, the following formula (9) shown in the following [Number 9] can be derived.

數9 Number 9

式中，a=V0cos γ-V1 Where a = V 0 cos γ -V 1

b=V0sin γ b=V 0 sin γ

c=(V0-V1)/K c=(V 0 -V 1 )/K

因此，上述手段4中的『求取滿足下式(1)、(2)、(3)之關係的相位角θ，根據該相位角θ進行前述高度測量』係能夠改以『根據下式(9)求取相位角θ，根據該相位角θ進行前述高度測量』描述。當然，獲取相位角θ的算則(algorithm)並不限於上述式(9)，只要滿足上述式(1)、式(2)、式(3)之關係，則亦可採用其他構成。 Therefore, in the above-described means 4, "determining the phase angle θ satisfying the relationship of the following formulas (1), (2), and (3), and performing the above-described height measurement based on the phase angle θ" can be changed to "based on the following formula ( 9) Determining the phase angle θ, and performing the aforementioned height measurement according to the phase angle θ. Of course, the algorithm for obtaining the phase angle θ is not limited to the above formula (9), and other configurations may be employed as long as the relationship of the above formulas (1), (2), and (3) is satisfied.

另外，若考慮到上述攝像機的暗電流C等，則能夠謀求測量精度的進一步提升。 Further, in consideration of the dark current C or the like of the above-described camera, it is possible to further improve the measurement accuracy.

手段5.如前述手段4之三維測量裝置，其中設γ=180°。 Means 5. A three-dimensional measuring device according to the aforementioned means 4, wherein γ = 180°.

依據上述手段5，係成為在相位相差180°的兩種光圖案下進行兩次攝像。 According to the above means 5, two imagings are performed under two kinds of light patterns having a phase difference of 180 degrees.

在上述式(2)設γ=180°，導出下式(10)。 In the above formula (2), γ = 180° is set, and the following formula (10) is derived.

V1=Asin(θ+180°)+B=-Asinθ+B…(10) V 1 =Asin(θ+180°)+B=-Asinθ+B...(10)

接著，能夠從上述式(1)、(10)導出下式(11)，再針對偏移B解式(11)，即能夠導出下式(12)。 Next, the following equation (11) can be derived from the above equations (1) and (10), and the equation (11) can be derived for the offset B, that is, the following equation (12) can be derived.

V0+V1=2 B…(11) V 0 +V 1 =2 B...(11)

B=(V0+V1)/2…(12) B=(V 0 +V 1 )/2...(12)

此著，將上述式(12)代入上述式(3)，便能夠導出下式(13)。 By substituting the above formula (12) into the above formula (3), the following formula (13) can be derived.

A=KB=K(V0+V1)/2…(13) A=KB=K(V 0 +V 1 )/2...(13)

此外，針對「sinθ」整理上述式(1)，即成為如下式(1')。 Further, by arranging the above formula (1) for "sin θ", the following formula (1 ' ) is obtained.

sinθ=(V0-B)/A…(1') Sin θ=(V 0 -B)/A...(1 ' )

接著，將上述式(12)、(13)代入上述式(1')，便能夠導出下式(14)。 Next, by substituting the above formulas (12) and (13) into the above formula (1 ' ), the following formula (14) can be derived.

sinθ={V0-(V0+V1)/2}/{K(V0+V1)/2}=(V0-V1)/K(V0+V1)…(14) Sin θ={V 0 -(V 0 +V 1 )/2}/{K(V 0 +V 1 )/2}=(V 0 -V 1 )/K(V 0 +V 1 )...(14)

此處，針對相位角θ解上述式(14)，即能夠導出下式(15)。 Here, the above formula (14) is solved for the phase angle θ, that is, the following formula (15) can be derived.

θ=sin-1[(V0-V1)/K(V0+V1)]…(15) θ=sin -1 [(V 0 -V 1 )/K(V 0 +V 1 )]...(15)

亦即，相位角θ係能夠藉由既知的亮度值V0、V1及常數K來特定出。 That is, the phase angle θ can be specified by the known luminance values V 0 , V 1 and the constant K.

如上述，依據上述手段5，能夠根據較簡單的演算式來求取相位角θ，在進行被測量物的高度測量時，處理能夠更進一步的高速化。 As described above, according to the above-described means 5, the phase angle θ can be obtained from a relatively simple calculation formula, and the processing can be further increased in speed when measuring the height of the object to be measured.

手段6.如前述手段4之三維測量裝置，其中設γ=90°。 Means 6. A three-dimensional measuring device according to the aforementioned means 4, wherein γ = 90°.

依據上述手段6，係成為在相位相差90°的兩種光圖案下進行兩次攝像。 According to the above means 6, the imaging is performed twice under two kinds of light patterns having a phase difference of 90°.

在上述式(2)設γ=90°，導出下式(16)。 In the above formula (2), γ = 90° is set, and the following formula (16) is derived.

V1=Asin(θ+90°)+B=Acosθ+B…(16) V 1 =Asin(θ+90°)+B=Acosθ+B...(16)

針對「cosθ」整理上述式(16)，即成為如下式(17)。 When the above formula (16) is sorted for "cos θ", the following formula (17) is obtained.

cosθ=(V1-B)/A…(17) Cos θ=(V 1 -B)/A...(17)

此外，針對「sinθ」整理上述式(1)，即如上述成為如下式(1')。 Further, the above formula (1) is prepared for "sin θ", that is, the following formula (1 ' ) is obtained as described above.

sinθ=(V0-B)/A…(1') Sin θ=(V 0 -B)/A...(1 ' )

接著，將上述式(1')、(17)代入下式(18)，即成為如下式(19)，再進一步整理式(19)，導出下式(20)。 Then, the above formulas (1 ' ) and (17) are substituted into the following formula (18), that is, the following formula (19), and the formula (19) is further processed to derive the following formula (20).

sin2θ+cos2θ=1…(18) Sin 2 θ+cos 2 θ=1...(18)

{(V0-B)/A}2+{(V1-B)/A}2=1…(19) {(V 0 -B)/A} 2 +{(V 1 -B)/A} 2 =1...(19)

(V0-B)2+(V1-B)2=A2…(20) (V 0 -B) 2 +(V 1 -B) 2 =A 2 (20)

接著，將上述式(3)代入上述式(20)，即成為如下式(21)，再進一步整理式(21)，導出下式(22)。 Next, the above formula (3) is substituted into the above formula (20), that is, the following formula (21), and the formula (21) is further processed to derive the following formula (22).

(V0-B)2+(V1-B)2=K2B2…(21) (V 0 -B) 2 +(V 1 -B) 2 =K 2 B 2 (21)

(2-K2)B2-2(V0+V1)B+V0 2V1 2=0…(22) (2-K 2 )B 2 -2(V 0 +V 1 )B+V 0 2 V 1 2 =0...(22)

此處，針對偏移B解上述式(22)，即能夠導出下式(23)。 Here, the above equation (22) is solved for the offset B, that is, the following equation (23) can be derived.

其中，B>0 Where B>0

亦即，偏移B係能夠藉由既知的亮度值V0、V1及常數K來特定出。 That is, the offset B can be specified by the known luminance values V 0 , V 1 and the constant K.

此外，將上述式(1')、(17)代入下式(24)，即成為如下式(25)，再進一步整理式(25)，導出下式(26)。 Further, by substituting the above formulas (1 ' ) and (17) into the following formula (24), the following formula (25) is obtained, and the formula (25) is further processed to derive the following formula (26).

tanθ=sinθ/cosθ…(24) Tanθ=sinθ/cosθ...(24)

={(V0-B)/A}/{(V1-B)/A}…(25) ={(V 0 -B)/A}/{(V 1 -B)/A}...(25)

=(V0-B)/(V1-B)…(26) =(V 0 -B)/(V 1 -B)...(26)

接著，針對相位角θ解上述式(26)，即能夠導出下式(27)。 Next, the above equation (26) is solved for the phase angle θ, that is, the following equation (27) can be derived.

θ=tan-1{(V0-B)/(V1-B)}…(27) θ=tan -1 {(V 0 -B)/(V 1 -B)}...(27)

亦即，藉由使用上述式(23)，相位角θ便能夠藉由既知的亮度值V0、V1及常數K來特定出。 That is, by using the above formula (23), the phase angle θ can be specified by the known luminance values V 0 , V 1 and the constant K.

如上述，依據上述手段6，係能夠根據使用「tan-1」的演算式求取相位角θ，因此能夠以-180°至180°的360°之範圍進行高度測量，從而能夠更擴大量程(range)。 As described above, according to the above-described means 6, the phase angle θ can be obtained from the calculation formula using "tan -1 ", so that the height measurement can be performed in the range of 360 degrees of -180° to 180°, so that the range can be further expanded ( Range).

手段7.如前述手段1至6中任一手段之三維測量裝置，其中具備：記憶手段，係記憶預先藉由標定(calibration)或以其他方法取得的測量結果而算出的前述光圖案的增益及偏移之關係。 The three-dimensional measuring apparatus according to any one of the above-mentioned means 1 to 6, comprising: a memory means for memorizing a gain of the light pattern calculated by a measurement result obtained by calibration or by another method in advance The relationship of the offset.

例如對基準板照射變化有三種或四種相位的光圖案，根據在該些光圖案下拍攝到的三張或四張圖像資料來特定各像素的增益A及偏移B，再根據上述式(3)決定出常數K。藉此，依據上述手段7，係能夠於各像素進行更高精度的高度測量。 For example, the reference plate is irradiated with a light pattern having three or four phases, and the gain A and the offset B of each pixel are specified according to the three or four image data captured under the light patterns, and then according to the above formula. (3) Determine the constant K. Thereby, according to the above means 7, it is possible to perform height measurement with higher precision for each pixel.

手段8.如前述手段1至6中任一手段之三維測量裝置，其中根據在前述變化有兩種相位的前述光圖案下拍攝到的兩張圖像資料，求取前述光圖案的增益及偏移之關係。 The method of any one of the above-mentioned means 1 to 6, wherein the gain and the deviation of the light pattern are obtained according to two image data captured under the light pattern having two phases in the foregoing change. Move the relationship.

例如使用上述式(12)等針對圖像資料的全部像素求取偏移B，將其中偏移B的值一致的像素的亮度值V提取出來，製作梯級圖(histogram)。接著，從該梯級圖決定亮度值的最大值VMAX與最小值VMIN。 For example, the offset B is obtained for all the pixels of the image data using the above equation (12), and the luminance value V of the pixel in which the values of the offset B are matched is extracted, and a histogram is created. Next, the maximum value V MAX of the luminance value and the minimum value V MIN are determined from the staircase map.

如上述，亮度值的最大值VMAX與最小值VMIN的平均值成為偏移B，最大值VMAX與最小值VMIN之差的一半成為增益A。據此，便能夠以上述式(3)決定常數K。藉此，依據上述手段8，係能夠省略如上述手段7所述的標定的工作，從而能夠謀求測量時間的進一步短縮化。 As described above, the average value of the maximum value V MAX of the luminance value and the minimum value V MIN becomes the offset B, and half of the difference between the maximum value V MAX and the minimum value V MIN becomes the gain A. According to this, the constant K can be determined by the above formula (3). Thereby, according to the above-described means 8, the calibration operation as described in the above-described means 7 can be omitted, and the measurement time can be further shortened.

手段9.一種三維測量方法，係藉由具備下述手段的三維測量裝置進行：照射手段，係具有發出預 定之光的光源及將來自該光源的光轉換成具條紋狀光強度分布的光圖案之光柵，能夠對至少被測量物照射該光圖案；相位控制手段，係控制前述光柵的移送或切換，能夠將從前述照射手段照射的前述光圖案的相位變化複數種；及攝像手段，係能夠拍攝來自受到前述光圖案照射的前述被測量物之反射光；該三維測量方法係含有下述步驟：關係取得步驟，係預先藉由標定或以其他方法取得的測量結果求取藉由預定之攝像條件而定的前述光圖案的增益及偏移之關係；圖像取得步驟，係取得在變化有兩種相位的前述光圖案下拍攝到的兩張圖像資料；及測量步驟，係藉由利用：在前述關係取得步驟中求得的前述光圖案的增益及偏移之關係、及根據前述圖像資料上的被測量座標的亮度值而定的該被測量座標的前述光圖案的增益或偏移之值，而根據前述兩張圖像資料，藉由相移法進行前述被測量座標的高度測量。 Means 9. A three-dimensional measuring method is performed by a three-dimensional measuring device having the following means: an irradiation means a light source for determining the light and a grating for converting the light from the light source into a light pattern having a stripe-shaped light intensity distribution, wherein the light pattern can be irradiated to at least the object to be measured; and the phase control means controls the transfer or switching of the grating. a plurality of phases of the light pattern irradiated from the irradiation means; and an imaging means capable of capturing reflected light from the object to be measured irradiated by the light pattern; the three-dimensional measuring method includes the following steps: In the step, the relationship between the gain and the offset of the light pattern determined by the predetermined imaging condition is obtained by calibration or measurement obtained by other methods; the image acquisition step is to obtain two phases in the change. The two image data captured under the light pattern; and the measuring step are performed by using: the relationship between the gain and the offset of the light pattern obtained in the relationship obtaining step, and based on the image data The value of the gain or offset of the aforementioned light pattern of the measured coordinate, depending on the brightness value of the measured coordinate, according to the foregoing two images Material, by measuring the phase shift method the measured height coordinate.

依據上述手段9，係達到與上述手段1及手段7相同的作用效果。 According to the above means 9, the same effects as those of the above-described means 1 and means 7 are achieved.

1‧‧‧基板檢查裝置 1‧‧‧Substrate inspection device

2‧‧‧印刷基板 2‧‧‧Printing substrate

4‧‧‧照明裝置 4‧‧‧Lighting device

4a‧‧‧光源 4a‧‧‧Light source

4b‧‧‧液晶光柵 4b‧‧‧LCD grating

5‧‧‧攝像機 5‧‧‧Camera

6‧‧‧控制裝置 6‧‧‧Control device

24‧‧‧圖像資料記憶手段 24‧‧‧Image data memory means

25‧‧‧標定資料記憶手段 25‧‧‧ Calibration data memory means

26‧‧‧相位資料記憶手段 26‧‧‧ Phase data memory means

V0、V1、V2、V3‧‧‧亮度值 V 0 , V 1 , V 2 , V 3 ‧‧‧ brightness values

A‧‧‧增益 A‧‧‧ Gain

B‧‧‧偏移 B‧‧‧Offset

K‧‧‧比例常數 K‧‧‧proportional constant

第1圖係示意性顯示基板檢查裝置之概略構成圖。 Fig. 1 is a schematic configuration view showing a substrate inspecting apparatus.

第2圖係顯示基板檢查裝置的電性構成之方塊(blog)圖。 Fig. 2 is a block diagram showing the electrical configuration of the substrate inspection device.

第3圖係顯示光源的明亮度或反射率與亮度值之關係之線圖。 Figure 3 is a line graph showing the relationship between the brightness or reflectance of the light source and the brightness value.

第4圖係顯示增益與偏移之關係之線圖。 Figure 4 is a line graph showing the relationship between gain and offset.

第5圖係顯示各資料區間所含的亮度值的個數的分布之分布表。 Fig. 5 is a distribution table showing the distribution of the number of luminance values included in each data section.

第6圖係顯示各資料區間所含的亮度值的個數的分布之梯級圖。 Fig. 6 is a step chart showing the distribution of the number of luminance values included in each data section.

[第1實施形態] [First Embodiment]

以下，針對一實施形態，參照圖式進行說明。第1圖係示意性顯示具備本實施形態的三維測量裝置之基板檢查裝置1之概略構成圖。如第1圖所示，基板檢查裝置1係具備：載置台3，係用以載置印刷有測量對象即焊膏而成之作為被測量物的印刷基板2；作為照射手段的照明裝置4，係對印刷基板2表面從斜上方照射預定之光圖案；作為攝像手段的攝像機5，係用以對印刷基板2上受到光圖案照射的部分進行攝像；及控制裝置6，係用以實施基板檢查裝置1內的各種控制、圖像處理、演算處理。 Hereinafter, an embodiment will be described with reference to the drawings. Fig. 1 is a schematic configuration diagram showing a substrate inspection apparatus 1 including the three-dimensional measuring apparatus of the present embodiment. As shown in Fig. 1, the substrate inspection apparatus 1 includes a mounting table 3 for mounting a printed circuit board 2 as a workpiece to which a solder paste to be measured is printed, and an illumination device 4 as an irradiation means. The surface of the printed circuit board 2 is irradiated with a predetermined light pattern from obliquely upward; the camera 5 as an imaging means is used to image a portion of the printed circuit board 2 that is irradiated with the light pattern; and the control device 6 is configured to perform substrate inspection Various controls, image processing, and calculation processing in the device 1.

在載置台3係設有馬達(motor)15、16，該馬達15、16由控制裝置6(馬達控制手段23)驅動控制，藉此，驅使載置在載置台3上的印刷基板2往任意方向(X軸方向及Y軸方向)滑移(slide)。 Motors 15 and 16 are provided on the mounting table 3, and the motors 15 and 16 are driven and controlled by a control device 6 (motor control means 23), thereby driving the printed circuit board 2 placed on the mounting table 3 to an arbitrary position. The direction (X-axis direction and Y-axis direction) is slipped.

照明裝置4係具備發出預定之光的光源4a及將來自該光源4a的光轉換成具正弦波狀(條紋狀)光強度分布的光圖案之液晶光柵4b，能夠對印刷基板2從斜上方照射相位變化複數種的條紋狀的光圖案。 The illumination device 4 includes a light source 4a that emits predetermined light, and a liquid crystal grating 4b that converts light from the light source 4a into a light pattern having a sinusoidal (striped) light intensity distribution, and can illuminate the printed substrate 2 from obliquely upward. A plurality of stripe-shaped light patterns of phase change.

更詳言之，在照明裝置4中，從光源4a發出的光係藉由光纖而導往一對集光透鏡(lens)，藉此形成為平行光。該平行光經過液晶光柵4b導往投影透鏡。接著，從投影透鏡對印刷基板2照射條紋狀的光圖案。 More specifically, in the illumination device 4, the light emitted from the light source 4a is guided by a fiber to a pair of collecting lenses, thereby forming parallel light. The parallel light is guided to the projection lens through the liquid crystal grating 4b. Next, the printed circuit board 2 is irradiated with a stripe-shaped light pattern from the projection lens.

關於液晶光柵4b，係在一對透明基板間形成液晶層，並且具備配置在其中一方透明基板上的共同電極及以與該共同電極相對向之方式並列設置在另一方透明基板上的複數個帶狀電極；藉由驅動電路，對分別連接至各帶狀電極的開關(switching)元件(薄膜電晶體等)進行導通/關斷(on/off)控制來控制施加至各帶狀電極的電壓，藉此，形成由光透射率高的「亮部」與光透射率低的「暗部」構成的條紋狀的光柵圖案。接著，經由液晶光柵4b照射至印刷基板2上的光係因繞射作用致生的朦朧化等而成為具正弦波狀光強度分布的光圖案。 The liquid crystal grating 4b is formed by forming a liquid crystal layer between a pair of transparent substrates, and includes a common electrode disposed on one of the transparent substrates and a plurality of strips disposed side by side on the other transparent substrate so as to face the common electrode. And an on/off control of a switching element (thin film transistor or the like) respectively connected to each strip electrode by a driving circuit to control a voltage applied to each strip electrode, Thereby, a stripe-shaped grating pattern composed of a "bright portion" having a high light transmittance and a "dark portion" having a low light transmittance is formed. Then, the light that is incident on the printed circuit board 2 via the liquid crystal grating 4b is a light pattern having a sinusoidal light intensity distribution due to deuteration or the like caused by diffraction.

攝像機5係由透鏡和攝像元件等構成。就攝像元件而言，係採用CMOS(Complementary Metal Oxide Semiconductor；互補式金屬氧化物半導體)感測器。當然，攝像元件並不以此為限，例如亦可採用CCD感測器等。藉由攝像機5拍攝到的圖像資料係在該攝像機5內部轉換成數位信號後，以數位信號的形式輸入至控制裝置6(圖像資料記憶手段24)。接著，控制裝置6 係根據該圖像資料，實施如後述的圖像處理和檢查處理等。從這層意義來看，控制裝置6係構成圖像處理手段。 The camera 5 is composed of a lens, an imaging element, and the like. As the imaging element, a CMOS (Complementary Metal Oxide Semiconductor) sensor is used. Of course, the imaging element is not limited thereto, and for example, a CCD sensor or the like can also be used. The image data captured by the camera 5 is converted into a digital signal inside the camera 5, and then input to the control device 6 (image data memory means 24) in the form of a digital signal. Next, the control device 6 Based on the image data, image processing, inspection processing, and the like, which will be described later, are performed. From this point of view, the control device 6 constitutes an image processing means.

接著，針對控制裝置6的電性構成進行說明。如第2圖所示，控制裝置6係具備：攝像機控制手段21，係控制攝像機5的攝像時序(timing)；照明控制手段22，係控制照明裝置4；馬達控制手段23，係控制馬達15、16；圖像資料記憶手段24，係記憶藉由攝像機5拍攝到的圖像資料(亮度資料)；標定資料記憶手段25，係記憶後述的標定資料；相位資料記憶手段26，係記憶根據前述圖像資料算出的相位資料；三維測量手段29，係根據前述標定資料及相位資料進行三維測量；及判定手段30，係根據該三維測量手段29的測量結果檢測焊膏的印刷狀態。藉由對照明裝置4(液晶光柵4b)進行控制的照明控制手段22，構成本實施形態的相位控制手段。 Next, the electrical configuration of the control device 6 will be described. As shown in FIG. 2, the control device 6 includes a camera control means 21 for controlling the imaging timing of the camera 5, an illumination control means 22 for controlling the illumination device 4, and a motor control means 23 for controlling the motor 15, 16; image data memory means 24, is to store the image data (brightness data) captured by the camera 5; the calibration data memory means 25 is to memorize the calibration data described later; the phase data memory means 26 is based on the above figure The phase data calculated by the image data; the three-dimensional measuring means 29 performs three-dimensional measurement based on the calibration data and the phase data; and the determining means 30 detects the printing state of the solder paste based on the measurement result of the three-dimensional measuring means 29. The phase control means of the present embodiment is constituted by the illumination control means 22 for controlling the illumination device 4 (liquid crystal grating 4b).

另外，雖省略圖示，但基板檢查裝置1係具備以鍵盤(keyboard)和觸控面板(touch panel)構成的輸入手段、具有CRT(Cathode Ray Tube；陰極射線管)或液晶等顯示畫面的顯示手段、供儲存檢查結果等之用的記憶手段、對焊料印刷機等輸出檢查結果等的輸出手段等手段。 In addition, although the illustration is omitted, the substrate inspection apparatus 1 includes an input means including a keyboard and a touch panel, and a display screen having a CRT (Cathode Ray Tube) or a liquid crystal display screen. Means, means for storing memory test results, etc., means for outputting inspection results such as solder printers, and the like.

接著，針對基板檢查裝置1進行的印刷基板2的檢查程序，詳細進行說明。首先，進行用以掌握光圖案之差異(相位分布)的標定。 Next, the inspection procedure of the printed substrate 2 by the substrate inspection apparatus 1 will be described in detail. First, calibration for grasping the difference (phase distribution) of the light patterns is performed.

在液晶光柵4b中，因連接至各帶狀電極的各電晶體的特性(偏移和增益等)之差異，施加至上述各帶狀電極的電壓亦會產生差異，故即使同樣為「亮部」或「暗部」，與各帶狀電極對應的各線(line)的光透射率(亮度級(level))仍然會有差異。結果，照射至被測量物上的光圖案亦無法形成正弦波狀的理想的光強度分布，而有於三維測量結果產生誤差之虞。 In the liquid crystal grating 4b, the voltage applied to each of the strip electrodes differs depending on the characteristics (offset, gain, etc.) of the respective transistors connected to the respective strip electrodes, so that even the same is the "bright portion". Or "dark part", the light transmittance (brightness level) of each line corresponding to each strip electrode still differs. As a result, the light pattern irradiated onto the object to be measured cannot form a sinusoidal ideal light intensity distribution, and there is an error in the three-dimensional measurement result.

因此，預先進行掌握光圖案之差異(相位分布)的所謂之標定等。 Therefore, so-called calibration or the like for grasping the difference (phase distribution) of the light patterns is performed in advance.

就標定的程序而言，首先，準備有別於印刷基板2的高度位置0且呈平面的基準面。基準面係與測量對象即焊膏為相同顏色。亦即，光圖案的反射率與焊膏相等。 For the calibration procedure, first, a reference plane different from the height position 0 of the printed substrate 2 and having a plane is prepared. The reference surface is the same color as the solder paste that is the measurement object. That is, the reflectance of the light pattern is equal to that of the solder paste.

接著，對上述基準面照射光圖案，並且以攝像機5進行拍攝，藉此，獲得含有各座標的亮度值之圖像資料。在本實施形態中，係與後述的實測時不同，在進行標定時，係令光圖案的相位逐次移位90°，取得在各光圖案下拍攝到的四張圖像資料。 Next, the reference surface is irradiated with the light pattern, and imaged by the camera 5, thereby obtaining image data including the luminance values of the respective coordinates. In the present embodiment, unlike the actual measurement described later, the phase of the light pattern is sequentially shifted by 90° during the calibration, and four image data captured under each light pattern are obtained.

接著，控制裝置6係根據上述四張圖像資料算出各座標的光圖案的相位角θ，將該些資料作為標定資料記憶至標定資料記憶手段25。 Next, the control device 6 calculates the phase angle θ of the light pattern of each coordinate based on the four image data, and stores the data as the calibration data in the calibration data memory means 25.

此外，在本實施形態中，係根據上述四張圖像資料特定出各座標的光圖案的增益A及偏移B以及兩者的關係，將該些資料作為標定資料記憶至標定資料記憶手段25。因此，標定資料記憶手段25構成本實施 形態的記憶手段，相關步驟構成本實施形態的關係取得步驟。 Further, in the present embodiment, the gain A and the offset B of the light pattern of each coordinate are specified based on the four image data, and the relationship between the two is stored as the calibration data to the calibration data memory means 25. . Therefore, the calibration data memory means 25 constitutes the implementation The form of memory means and the related steps constitute the relationship obtaining step of the present embodiment.

此處，針對算出增益A及偏移B的程序，進一步詳細進行說明。四張圖像資料的各座標的亮度值(V0,V1,V2,V3)與增益A及偏移B之關係係能夠藉由下式(H1)、(H2)、(H3)、(H4)表示。 Here, the procedure for calculating the gain A and the offset B will be described in further detail. The relationship between the luminance values (V 0 , V 1 , V 2 , V 3 ) of each of the four image data and the gain A and the offset B can be obtained by the following equations (H1), (H2), (H3). , (H4) indicates.

數11 V0=Asin θ+B．．．(H1) V1=Asin(θ+90°)+B=Acos θ+B．．．(H2) V2=Asin(θ+180°)+B=-Asin θ+B．．．(H3) V3=Asin(θ+270°)+B=-Acos θ+B．．．(H4) Number 11 V 0 = Asin θ + B. . . (H1) V 1 =Asin( θ +90°)+B=Acos θ +B. . . (H2) V 2 =Asin( θ +180°)+B=-Asin θ +B. . . (H3) V 3 =Asin( θ +270°)+B=-Acos θ +B. . . (H4)

接著，將四張圖像資料的亮度值(V0,V1,V2,V3)加起來，如下述[數12]整理上述式(H1)、(H2)、(H3)、(H4)，即能夠導出下式(H5)。 Next, the luminance values (V 0 , V 1 , V 2 , V 3 ) of the four image data are added together, and the above equations (H1), (H2), (H3), (H4) are arranged as follows [12]. ), that is, the following formula (H5) can be derived.

數12 V0+V1+V2+V3=(Asin θ+B)-+-(Acos θ+B) +(-Asin θ+B)+(-Acos θ+B)=4 B B=(V0+V1+V2+V3)/4．．．(H5) Number 12 V 0 +V 1 +V 2 +V 3 =(Asin θ +B)-+-(Acos θ +B) +(-Asin θ +B)+(-Acos θ +B)=4 BB=( V 0 +V 1 +V 2 +V 3 )/4. . . (H5)

此外，根據上述式(H1)、(H3)，能夠導出下式(H6)。 Further, according to the above formulas (H1) and (H3), the following formula (H6) can be derived.

數13 V0-V2=2 Asin θ sin θ=(V0-V2)/2 A．．．(H6) Number 13 V 0 -V 2 =2 Asin θ sin θ =(V 0 -V 2 )/2 A. . . (H6)

此外，根據上述式(H2)、(H4)，能夠導出下式(H7)。 Further, according to the above formulas (H2) and (H4), the following formula (H7) can be derived.

數14 V1-V3=2 Acos θ cos θ=(V1-V3)/2 A．．．(H7) Number 14 V 1 -V 3 =2 Acos θ cos θ =(V 1 -V 3 )/2 A. . . (H7)

接著，如下述[數15]所示，將上述式(H6)、(H7)代入下式(H8)，整理後即能夠導出下式(H9)。 Then, as shown in the following [Number 15], the above formulae (H6) and (H7) are substituted into the following formula (H8), and after the finishing, the following formula (H9) can be derived.

其中，A>0 Where A>0

接著，根據從上述式(H5)、(H9)導出的下式(H10)，算出增益A及偏移B的比例常數K。 Next, the proportional constant K of the gain A and the offset B is calculated from the following formula (H10) derived from the above formulas (H5) and (H9).

接著，將如上述算出的各座標的光圖案的增益A、偏移B及比例常數K作為標定資料記憶至標定資料記憶手段25。當然，亦可採用僅記憶比例常數K作為標定資料之構成。 Next, the gain A, the offset B, and the proportional constant K of the light patterns of the respective coordinates calculated as described above are stored as calibration data in the calibration data memory means 25. Of course, it is also possible to use only the memory ratio constant K as the composition of the calibration data.

接著，針對按各檢查區域(area)進行的檢查例常作業(routine)詳細進行說明。此檢查例常作業乃係在控制裝置6執行。 Next, the routine example of the inspection performed for each inspection area (area) will be described in detail. This inspection routine is performed by the control device 6.

控制裝置6(馬達控制手段23)係首先對馬達15、16進行驅動控制，令印刷基板2移動，使攝像機5的視野對準印刷基板2上的預定之檢查區域(測量範圍)。另外，檢查區域乃係以攝像機5的視野大小為一單位而預先分割印刷基板2表面的其中一個區域。 The control device 6 (motor control means 23) first drives and controls the motors 15 and 16, and moves the printed circuit board 2 so that the field of view of the camera 5 is aligned with a predetermined inspection area (measurement range) on the printed circuit board 2. Further, the inspection area is one of the areas on the surface of the printed substrate 2 which is divided in advance by the field of view of the camera 5.

接著，控制裝置6係對照明裝置4的液晶光柵4b進行切換控制，將形成在該液晶光柵4b的光柵的位置設定為預定之基準位置。 Next, the control device 6 performs switching control of the liquid crystal grating 4b of the illumination device 4, and sets the position of the grating formed on the liquid crystal grating 4b to a predetermined reference position.

當液晶光柵4b的切換設定完成，控制裝置6便藉由照明控制手段22令照明裝置4的光源4a發光，開始進行預定之光圖案的照射，並且藉由攝像機控制手段21對攝像機5進行驅動控制，開始進行受該光圖案照射的檢查區域部分的攝像。另外，由攝像機5拍攝到的圖像資料係傳送到圖像資料記憶裝置24予以記憶。 When the switching setting of the liquid crystal grating 4b is completed, the control device 6 causes the light source 4a of the illumination device 4 to emit light by the illumination control means 22, starts the irradiation of the predetermined light pattern, and drives and controls the camera 5 by the camera control means 21. The imaging of the portion of the inspection region illuminated by the light pattern is started. Further, the image data captured by the camera 5 is transmitted to the image data storage device 24 for memorization.

在光圖案的相位例如移位180°而得的光圖案下同樣地進行上述一連串的處理。藉此，針對預定之檢查區域，取得在相移180°而得的兩種光圖案下拍攝到的兩張圖像資料。相關步驟構成本實施形態的圖像取得步驟。 The above-described series of processes are similarly performed under the light pattern obtained by shifting the phase of the light pattern by, for example, 180°. Thereby, two pieces of image data captured under two kinds of light patterns obtained by phase shift by 180° are obtained for a predetermined inspection area. The relevant steps constitute the image acquisition step of the present embodiment.

接著，控制裝置6係藉由相移法，根據上述兩張圖像資料算出各座標的光圖案的相位角θ，將該些相位角θ作為相位資料記憶至相位資料記憶手段26。 具體而言，係根據上述式(15)，參酌上述兩張圖像資料上的各座標的亮度值V0、V1及記憶在標定資料記憶手段25的標定資料(根據標定而得的各座標的比例常數K)，算出各座標的光圖案的相位角θ。 Next, the control device 6 calculates the phase angle θ of the light pattern of each coordinate based on the two image data by the phase shift method, and stores the phase angles θ as phase data in the phase data memory means 26. Specifically, according to the above formula (15), the luminance values V 0 and V 1 of the coordinates on the two pieces of image data and the calibration data stored in the calibration data memory means 25 (the coordinates obtained according to the calibration are determined) The proportional constant K) calculates the phase angle θ of the light pattern of each coordinate.

接著，控制裝置6(三維測量手段29)係比較記憶在標定資料記憶手段25的標定資料(根據標定而得的各座標的相位角)與記憶在相位資料記憶手段26的相位資料(根據實測而得的各座標的相位角)，算出具有相同相位角的座標的偏位量，根據三角量測的原理，取得檢查區域的各座標的高度資料。相關步驟構成本實施形態的測量步驟。 Next, the control device 6 (three-dimensional measuring means 29) compares the calibration data (the phase angle of each coordinate obtained by the calibration) stored in the calibration data memory means 25 with the phase data stored in the phase data memory means 26 (according to the actual measurement The phase angles of the obtained coordinates are calculated, and the offset amount of the coordinates having the same phase angle is calculated, and the height data of each coordinate of the inspection region is obtained according to the principle of the triangular measurement. The relevant steps constitute the measurement steps of the present embodiment.

例如，當被測量座標(x,y)的實測值(相位角)為「10°」時，檢測該「10°」的值位於藉由標定而記憶的資料上的哪個位置。此處，若「10°」存在於被測量座標(x,y)隔鄰3個像素之處，即代表光圖案的條紋偏位3個像素。接著，根據光圖案的照射角度及光圖案的條紋的偏位量，藉由三角量測的原理，而能夠求取被測量座標(x,y)的高度資料(z)。 For example, when the measured value (phase angle) of the measured coordinate (x, y) is "10°", it is detected at which position on the data memorized by the calibration when the value of "10°" is located. Here, if "10°" exists in the vicinity of the measured coordinates (x, y) by three pixels, the stripe representing the light pattern is shifted by three pixels. Then, based on the irradiation angle of the light pattern and the amount of deviation of the stripe of the light pattern, the height data (z) of the measured coordinate (x, y) can be obtained by the principle of the triangular measurement.

此外，控制裝置6(三維測量手段29)係根據所求得的檢查區域的各座標的高度資料，檢測比基準面高之焊膏的印刷範圍，對該範圍內的各部位的高度進行積分，藉此算出所印刷的焊膏之量。 Further, the control device 6 (three-dimensional measuring means 29) detects the printing range of the solder paste higher than the reference surface based on the height data of each coordinate of the obtained inspection region, and integrates the heights of the respective portions in the range. Thereby, the amount of solder paste printed is calculated.

接著，控制裝置6(判定手段30)係將如上述求得的焊膏的位置、面積、高度或量等資料與預先記憶的基準資料進行比較判定，依據該比較結果是否屬於 容許範圍內來判定該檢查區域的焊膏的印刷狀態之良否。 Next, the control device 6 (determination means 30) compares the data such as the position, area, height, or amount of the solder paste obtained as described above with the reference data stored in advance, depending on whether the comparison result belongs to It is judged whether or not the printed state of the solder paste in the inspection region is good or not within the allowable range.

在進行上述處理的期間，控制裝置6係對馬達15、16進行驅動控制而令印刷基板2移動至下一個檢查區域，之後在全部的檢查區域重覆進行上述一連串的處理，據此，整個印刷基板2的檢查便結束。 While the above processing is being performed, the control device 6 drives and controls the motors 15 and 16 to move the printed circuit board 2 to the next inspection area, and then repeats the above-described series of processing in all the inspection areas, whereby the entire printing is performed. The inspection of the substrate 2 is completed.

如以上詳述，依據本實施形態，係藉由利用：藉由預定之攝像條件而定的光圖案的增益A及偏移B之關係[例如A=K(比例常數)×B]、及根據圖像資料上的被測量座標(x,y)的亮度值V(x,y)而定的該被測量座標(x,y)的光圖案的增益A(x,y)或偏移B(x,y)之值，而能夠根據在變化有兩種相位的光圖案下拍攝到的兩張圖像資料，藉由相移法進行被測量座標的高度測量。 As described in detail above, according to the present embodiment, the relationship between the gain A and the offset B of the light pattern determined by predetermined imaging conditions [for example, A=K (proportional constant)×B], and The gain A(x, y) or offset B of the light pattern of the measured coordinate (x, y) depending on the luminance value V(x, y) of the measured coordinate (x, y) on the image data ( The value of x, y) can be measured by the phase shift method based on the two image data captured under the light pattern having two phases.

如上述，由於能夠根據兩張圖像資料進行高度測量，因此相較於針對一個點需要四次或三次攝像的習知技術，能以較少之總攝像次數完成，從而能夠縮短攝像時間。就結果而言，能夠飛躍性地縮短測量時間。 As described above, since the height measurement can be performed based on the two pieces of image data, the conventional technique that requires four or three times of imaging for one point can be completed with a smaller total number of imaging times, so that the imaging time can be shortened. As a result, the measurement time can be dramatically shortened.

[第2實施形態] [Second Embodiment]

以下，針對第2實施形態，參照圖式進行說明。另外，針對與第1實施形態相同的構成部分係標記相同的元件符號並省略其詳細說明。 Hereinafter, the second embodiment will be described with reference to the drawings. The same components as those in the first embodiment are denoted by the same reference numerals, and their detailed description is omitted.

在上述第1實施形態中，係構成為預先藉由標定求取各座標的光圖案的增益A及偏移B之關係(比例常數K)，而在第2實施形態中係改構成為根據實測時 所拍攝到的在前述變化有兩種相位的光圖案下拍攝到的兩張圖像資料來求取光圖案的增益A及偏移B之關係(比例常數K)。 In the first embodiment, the relationship between the gain A and the offset B (proportional constant K) of the light pattern of each coordinate is obtained by calibration in advance, and in the second embodiment, the configuration is changed based on the actual measurement. Time The two image data captured under the light pattern having the two phases described above are captured to obtain the relationship between the gain A and the offset B of the light pattern (proportional constant K).

就其程序而言，首先使用上述式(12)針對圖像資料的全部像素求取偏移B。接著，將其中偏移B的值一致的像素的亮度值V(=Asinθ+B)提取出來，製作梯級圖。第5圖及第6圖的圖表顯示其一例。其中，第5圖、第6圖係例示設增益A為「1」、設偏移B為「0」時的情形。第5圖係顯示將亮度值V劃分為幅距「0.1」的資料區間而各資料區間所含的亮度值的個數之分布表，第6圖係描繪個數分布而成的梯級圖。 For the procedure, the offset B is first obtained for all the pixels of the image data using the above equation (12). Next, the luminance value V (= Asin θ + B) of the pixel in which the values of the offset B are identical is extracted, and a step graph is created. An example of this is shown in the graphs of Figs. 5 and 6. Here, FIG. 5 and FIG. 6 illustrate a case where the gain A is "1" and the offset B is "0". Fig. 5 is a table showing the distribution of the luminance value V into the data interval of the span "0.1" and the number of luminance values included in each data section, and Fig. 6 is a staircase diagram in which the number distribution is drawn.

接著，根據該梯級圖決定亮度值的最大值VMAX與最小值VMIN。藉由利用「sinθ」的特性，便能夠將上述梯級圖中產生的兩個峰值(peak)分別決定為亮度值的最大值VMAX與最小值VMIN。在第5圖、第6圖所示的例子中，落在亮度值V為「-1.0至-0.9」及「0.9至1.0」之資料區間的亮度值V的個數分別為「51」，成為兩峰值。 Next, the maximum value V MAX of the luminance value and the minimum value V MIN are determined according to the ladder diagram. By using the characteristic of "sin θ", the two peaks generated in the above-described step graph can be determined as the maximum value V MAX and the minimum value V MIN of the luminance value, respectively. In the example shown in Fig. 5 and Fig. 6, the number of luminance values V in the data section in which the luminance value V is "-1.0 to -0.9" and "0.9 to 1.0" is "51", respectively. Two peaks.

接著，根據亮度值的最大值VMAX與最小值VMIN，算出增益A及偏移B。如上述，亮度值的最大值VMAX與最小值VMIN的平均值成為偏移B，最大值VMAX與最小值VMIN之差的一半成為增益A。亦即，如第6圖所示，兩峰值的中間值成為偏移B，兩峰值的幅距的一半成為增益A。 Next, the gain A and the offset B are calculated from the maximum value V MAX of the luminance value and the minimum value V MIN . As described above, the average value of the maximum value V MAX of the luminance value and the minimum value V MIN becomes the offset B, and half of the difference between the maximum value V MAX and the minimum value V MIN becomes the gain A. That is, as shown in Fig. 6, the intermediate value of the two peaks becomes the offset B, and half of the amplitude of the two peaks becomes the gain A.

根據如上述獲得的增益A與偏移B的值，便能夠決定比例常數K[參照上述式(3)]。 According to the values of the gain A and the offset B obtained as described above, the proportional constant K can be determined [refer to the above formula (3)].

依據本實施形態，係能夠省略如上述第1實施形態所述的標定的工作，從而能夠謀求測量時間的進一步短縮化。 According to the present embodiment, the calibration operation as described in the first embodiment can be omitted, and the measurement time can be further shortened.

另外，並不限於上述實施形態的記載內容，例如亦可實施如下述。當然，亦能夠為未例示於以下的其他應用例、變更例。 Further, the present invention is not limited to the description of the above embodiment, and may be implemented, for example, as follows. Of course, it can also be another application example and a modification example which are not illustrated below.

(a)在上述實施形態中，係將三維測量裝置具體化為對印刷形成在印刷基板2的焊膏的高度進行測量的基板檢查裝置1，但並不以此為限，例如亦可具體化為對印刷在基板上的焊料凸塊(solder bump)和安裝在基板上的電子零件等其他物品的高度進行測量之構成。 (a) In the above embodiment, the three-dimensional measuring device is embodied as the substrate inspecting device 1 for measuring the height of the solder paste formed on the printed circuit board 2. However, the present invention is not limited thereto, and may be embodied, for example. It is configured to measure the height of solder bumps printed on the substrate and other items such as electronic components mounted on the substrate.

(b)在上述實施形態中，係構成為藉由液晶光柵4b來構成用以將來自光源4a的光轉換成條紋狀的光圖案之光柵，並且藉由對液晶光柵4b進行切換控制來令光圖案的相移。但並不以此為限，例如採用藉由壓電致動器(piezo actuator)等移送手段來移送光柵構件而令光圖案的相移之構成。 (b) In the above embodiment, the liquid crystal grating 4b is configured to form a grating for converting light from the light source 4a into a stripe-shaped light pattern, and the light is controlled by switching the liquid crystal grating 4b. The phase shift of the pattern. However, it is not limited thereto, and for example, a configuration in which a phase shift of a light pattern is performed by transferring a grating member by a transfer means such as a piezoelectric actuator is employed.

(c)在上述實施形態中，係構成為根據實測時在相位相差180°的兩種光圖案下拍攝到的兩張圖像資料來進行高度測量。但例如亦可改為採用根據在相位相差90°的兩種光圖案下拍攝到的兩張圖像資料來進行高度測量之構成。此時，藉由上述式(23)、式(27)，利用兩張圖像資料上的各座標的亮度值V0、V1及既知的比例常數K，便能夠算出各座標的光圖案的相位角θ。 (c) In the above embodiment, the height measurement is performed based on two pieces of image data captured under two kinds of light patterns having a phase difference of 180° at the time of actual measurement. However, for example, it is also possible to adopt a configuration in which height measurement is performed based on two pieces of image data taken under two kinds of light patterns having a phase difference of 90°. In this case, by using the above-described equations (23) and (27), the luminance values V 0 and V 1 of the respective coordinates on the two image data and the known proportional constant K can be used to calculate the light pattern of each coordinate. Phase angle θ.

當然，除此之外，只要滿足上述式(1)、式(2)、式(3)之關係，則亦可採用其他構成。就獲取相位角θ的一般式而言，係可舉上述式(9)為其一例[參照[數9]]。 Of course, in addition to this, as long as the relationship of the above formula (1), formula (2), and formula (3) is satisfied, other configurations may be employed. The general formula for obtaining the phase angle θ is an example of the above formula (9) [refer to [9]].

(d)在上述第1實施形態中，係構成為根據在相位相差90°的四種光圖案下拍攝到的四張圖像資料來進行標定，但並不限於此，例如亦可採用根據在相位相異的三種光圖案下拍攝到的三張圖像資料來進行標定之構成。 (d) In the first embodiment described above, the calibration is performed based on four image data captured under four light patterns having a phase difference of 90°. However, the present invention is not limited thereto, and for example, Three image data captured under three different light patterns of different phases are used for calibration.

此外，亦可採用在進行標定時改變光源的亮度進行複數次標定之構成。若採用此構成，還能夠求得下式(28)所示的攝像機5的暗電流(偏移)C。 In addition, it is also possible to adopt a configuration in which the brightness of the light source is changed to perform a plurality of calibrations at the time of calibration. According to this configuration, the dark current (offset) C of the camera 5 shown by the following equation (28) can be obtained.

A=KB+C…(28) A=KB+C...(28)

式中，A：增益，B：偏移，C：攝像機的暗電流(偏移)，K：比例常數。 Where: A: gain, B: offset, C: dark current (offset) of the camera, K: proportional constant.

或者，亦可構成為增益A與偏移B之關係並不以數學式的形式求取，而是藉由製作表示增益A與偏移B之關係的數值表或表資料而能夠以增益A求得偏移B或以偏移B求得增益A。此外，亦可利用以其他方法取得的測量結果等取代標定來求取增益A與偏移B之關係。 Alternatively, the relationship between the gain A and the offset B may not be obtained in a mathematical form, but the value table or table data indicating the relationship between the gain A and the offset B may be used to obtain the gain A. The offset B is obtained or the offset A is obtained by the offset B. Further, the relationship between the gain A and the offset B may be obtained by using a measurement result obtained by another method or the like instead of the calibration.

(e)在上述第2實施形態中，係構成為根據在相位相差180°的兩種光圖案下拍攝到的兩張圖像資料，針對圖像資料的全部像素求取比例常數K等。 (e) In the second embodiment described above, the two pieces of image data captured under two kinds of light patterns having a phase difference of 180° are obtained, and a proportional constant K or the like is obtained for all the pixels of the image data.

但並不限於此，例如亦可採用根據在相位相差90°的兩種光圖案下拍攝到的兩張圖像資料來求取比例常數K等之構成。此外，亦可採用非針對圖像資料的全部像素而是針對被測量座標周邊等圖像資料的一部分範圍來求取比例常數K等之構成。 However, the present invention is not limited thereto. For example, a configuration in which a proportional constant K or the like is obtained based on two pieces of image data captured under two kinds of light patterns having phase differences of 90° may be employed. Further, it is also possible to adopt a configuration in which a proportional constant K or the like is obtained for a part of the range of image data such as the periphery of the measured coordinates, not for all the pixels of the image data.

1‧‧‧基板檢查裝置 1‧‧‧Substrate inspection device

2‧‧‧印刷基板 2‧‧‧Printing substrate

3‧‧‧載置台 3‧‧‧ mounting table

4‧‧‧照明裝置 4‧‧‧Lighting device

4a‧‧‧光源 4a‧‧‧Light source

4b‧‧‧液晶光柵 4b‧‧‧LCD grating

5‧‧‧攝像機 5‧‧‧Camera

6‧‧‧控制裝置 6‧‧‧Control device

15、16‧‧‧馬達 15, 16‧‧ ‧ motor

Claims (9)

一種三維測量裝置，係具備：照射手段，係具有發出預定之光的光源及將來自該光源的光轉換成具條紋狀光強度分布的光圖案之光柵，能夠對至少被測量物照射該光圖案；相位控制手段，係控制前述光柵的移送或切換，能夠將從前述照射手段照射的前述光圖案的相位變化複數種；攝像手段，係能夠拍攝來自受到前述光圖案照射的前述被測量物之反射光；及圖像處理手段，係能夠根據藉由前述攝像手段拍攝到的圖像資料而執行前述被測量物的三維測量；前述圖像處理手段係藉由利用：藉由預定之攝像條件而定的前述光圖案的增益及偏移之關係；及根據前述圖像資料上的被測量座標的亮度值而定的該被測量座標的前述光圖案的增益或偏移之值；而能夠根據在變化有兩種相位的前述光圖案下拍攝到的兩張圖像資料，藉由相移法執行前述被測量座標的高度測量。 A three-dimensional measuring apparatus includes: a light source that emits a predetermined light, and a grating that converts light from the light source into a light pattern having a stripe-shaped light intensity distribution, and is capable of irradiating at least the object to be measured with the light pattern The phase control means is capable of controlling the transfer or switching of the grating, and is capable of changing a plurality of phases of the light pattern irradiated from the irradiation means; and the imaging means is capable of capturing a reflection from the object to be measured irradiated by the light pattern And an image processing means capable of performing three-dimensional measurement of the object to be measured based on image data captured by the image capturing means; the image processing means utilizing: by predetermined imaging conditions The relationship between the gain and the offset of the light pattern; and the value of the gain or offset of the light pattern of the measured coordinate according to the brightness value of the measured coordinate on the image data; Two image data captured under the aforementioned light pattern having two phases, and the height of the measured coordinates is performed by a phase shift method the amount. 如請求項1之三維測量裝置，其中前述增益及偏移之關係為前述增益與前述偏移相互為唯一性的關係。 The three-dimensional measuring apparatus of claim 1, wherein the relationship between the gain and the offset is a relationship in which the gain and the offset are unique to each other. 如請求項1之三維測量裝置，其中關於前述增益及偏移之關係，前述增益與前述偏移為比例關係。 A three-dimensional measuring apparatus according to claim 1, wherein said gain is proportional to said offset with respect to said relationship of said gain and offset. 如請求項1之三維測量裝置，其中設前述變化有兩種相位的光圖案的相對相位關係分別為0、γ，並設此時的前述兩張圖像資料的各像素的亮度值分別為V0、V1，此時，前述圖像處理手段係求取滿足下式(1)、(2)、(3)之關係的相位角θ，根據該相位角θ進行前述高度測量。V0=Asinθ+B…(1) V1=Asin(θ+γ)+B…(2) A=KB…(3)其中，γ≠0，A：增益，B：偏移，K：比例常數。 The three-dimensional measuring device of claim 1, wherein the relative phase relationship of the light patterns having the two phases is 0 and γ, respectively, and the brightness values of the pixels of the two image data at this time are respectively V. 0 and V 1 In this case, the image processing means obtains the phase angle θ satisfying the relationship of the following equations (1), (2), and (3), and performs the height measurement based on the phase angle θ. V 0 =Asinθ+B...(1) V 1 =Asin(θ+γ)+B...(2) A=KB (3) where γ≠0, A: gain, B: offset, K: ratio constant. 如請求項4之三維測量裝置，其中設γ=180°。 The three-dimensional measuring device of claim 4, wherein γ = 180°. 如請求項4之三維測量裝置，其中設γ=90°。 The three-dimensional measuring device of claim 4, wherein γ = 90°. 如請求項1至6中任一項之三維測量裝置，其中具備：記憶手段，係記憶預先藉由標定或以其他方法取得的測量結果而算出的前述光圖案的增益及偏移之關係。 The three-dimensional measuring apparatus according to any one of claims 1 to 6, further comprising: a memory means for storing a relationship between a gain and an offset of the light pattern calculated in advance by a calibration or a measurement result obtained by another method. 如請求項1至6中任一項之三維測量裝置，其中根據在前述變化有兩種相位的前述光圖案下拍攝到的兩張圖像資料，求取前述光圖案的增益及偏移之關係。 The three-dimensional measuring apparatus according to any one of claims 1 to 6, wherein the relationship between the gain and the offset of the light pattern is obtained based on two image data captured under the light pattern having two phases in the foregoing change. . 一種三維測量方法，係藉由具備下述手段的三維測量裝置進行：照射手段，係具有發出預定之光的光源及將來自該光源的光轉換成具條紋狀光強度分布的光圖案之光柵，能夠對至少被測量物照射該光圖案；相位控制手段，係控制前述光柵的移送或切換，能夠將從前述照射手段照射的前述光圖案的相位變化複數種；及 攝像手段，係能夠拍攝來自受到前述光圖案照射的前述被測量物之反射光；該三維測量方法係含有下述步驟：關係取得步驟，係預先藉由標定或以其他方法取得的測量結果求取藉由預定之攝像條件而定的前述光圖案的增益及偏移之關係；圖像取得步驟，係取得在變化有兩種相位的前述光圖案下拍攝到的兩張圖像資料；及測量步驟，係藉由利用：在前述關係取得步驟中求得的前述光圖案的增益及偏移之關係、及根據前述圖像資料上的被測量座標的亮度值而定的該被測量座標的前述光圖案的增益或偏移之值，而根據前述兩張圖像資料，藉由相移法進行前述被測量座標的高度測量。 A three-dimensional measuring method is performed by a three-dimensional measuring device having a light source that emits a predetermined light and a grating that converts light from the light source into a light pattern having a stripe-shaped light intensity distribution. The light pattern can be irradiated to at least the object to be measured; and the phase control means controls the transfer or switching of the grating, and can change a plurality of phases of the light pattern irradiated from the irradiation means; and The imaging means is capable of capturing reflected light from the object to be measured irradiated by the light pattern; the three-dimensional measuring method includes the following steps: the relationship obtaining step is obtained by calibration or measurement obtained by other methods in advance The relationship between the gain and the offset of the light pattern determined by predetermined imaging conditions; the image acquisition step of obtaining two image data captured under the light pattern in which two phases are changed; and a measuring step By using the relationship between the gain and the offset of the light pattern obtained in the relationship obtaining step, and the light of the measured coordinate based on the luminance value of the measured coordinate on the image data. The value of the gain or offset of the pattern, and the height measurement of the aforementioned measured coordinates is performed by the phase shift method according to the two image data.
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